CN102405436B - Duplexer with polaroid, the display device panel being with supporting mass, display device panel, display device and their manufacture method - Google Patents

Abstract

The invention provides the duplexer of band polaroid, the display device panel being with supporting mass, display device panel, display device and their manufacture method.The duplexer (10) of this band polaroid has: device substrate (12), and it has the 1st first type surface (12a) and the 2nd first type surface (12b); Supporting substrates (13), it has the 1st first type surface (13a) and the 2nd first type surface (13b); And resin bed (14), between the 1st first type surface of its existence and said apparatus substrate and the 1st first type surface of above-mentioned supporting substrates; Wherein, the 1st first type surface of said apparatus substrate has reflection type polarizer (11), and the surface of the above-mentioned resin bed contacted with the face having reflection type polarizer of said apparatus substrate has rippability.

Description

Laminate with polarizing plate, panel for display device with support, panel for display device, and methods for producing these

Technical Field

The present invention relates to a laminate including a device substrate with a polarizing plate used for a display device, a panel with a support including the laminate, a panel for a display device formed using the panel with a support, a display device including the panel for a display device, and methods for manufacturing the same.

Background

In the field of image display devices such as liquid crystal display devices (LCDs), rear projection televisions, and front projectors, and particularly portable display devices such as digital cameras and cellular phones, weight reduction and thickness reduction of the display devices are important issues.

In order to cope with this problem, it is desirable to further reduce the thickness of the device substrate itself used in the display device. In the case of a glass substrate, as a general method for reducing the thickness of the glass substrate, there is a method of etching the glass substrate with hydrofluoric acid or the like before or after forming a member for a display device on the surface of the glass substrate, and further physically polishing the glass substrate as necessary to reduce the thickness.

However, when the thickness of the glass substrate is reduced by performing etching treatment or the like before the display device member is formed on the surface of the glass substrate, the strength of the glass substrate is reduced and the amount of deflection is increased. Therefore, there arises a problem that it is difficult to handle the panel using an existing manufacturing line for a display device panel.

In addition, when the thickness of the glass substrate is reduced by performing etching treatment or the like after the display device member is formed on the surface of the glass substrate, there is a problem that fine scratches formed on the surface of the glass substrate become conspicuous, that is, a problem of occurrence of an etch pit (etchpit) in the process of forming the display device member on the surface of the glass substrate.

In order to solve such a problem, a method has been proposed in which a glass substrate having a small plate thickness (hereinafter, also referred to as a "thin glass substrate") is bonded to another supporting glass substrate to form a glass laminate, a predetermined process for manufacturing a display device is performed in this state, and then the supporting glass substrate is peeled from the thin glass substrate.

For example, patent document 1 describes a method for manufacturing a display device using a glass substrate for a product, in which the glass substrate for a product and a glass substrate for reinforcement are bonded and integrated by utilizing electrostatic attraction or vacuum attraction between the glass substrates.

For example, patent document 2 describes a method for manufacturing a liquid crystal display device by bonding an end portion of a substrate and a support of the liquid crystal display device with a frit-based adhesive, and then forming an electrode pattern or the like.

For example, patent document 3 describes a method for manufacturing a substrate for a display device, which includes a step of irradiating laser light onto at least the vicinity of end faces of peripheral portions of two glass substrates to fuse the two glass substrates.

For example, patent document 4 describes a method of manufacturing a liquid crystal display device in which a substrate is attached to a substrate conveying jig having an adhesive material layer provided on a support, the substrate conveying jig is conveyed in a liquid crystal display element manufacturing process, a liquid crystal display element forming process is sequentially performed on the substrate attached to the substrate conveying jig, and the substrate is peeled from the substrate conveying jig after a predetermined process is completed.

For example, patent document 5 describes a method for manufacturing a liquid crystal display element, which comprises bonding an electrode substrate for a liquid crystal display element to a jig having an ultraviolet-curable adhesive provided on a support, performing a predetermined process on the electrode substrate for a liquid crystal display element, irradiating ultraviolet light to the ultraviolet-curable adhesive to reduce the adhesive strength of the ultraviolet-curable adhesive, and peeling the electrode substrate for a liquid crystal display element from the jig.

For example, patent document 6 describes a method for conveying a support plate to which a thin plate is temporarily fixed by an adhesive material, and sealing a peripheral edge portion of the adhesive material with a sealing material.

For example, patent document 7 describes a thin plate glass laminate in which a thin plate glass substrate and a support glass substrate are laminated, wherein the thin plate glass and the support glass substrate are laminated via a silicone resin layer having releasability and non-adhesive properties. Further, it is described that when the support glass substrate is peeled from the thin glass substrate, a force for pulling the thin glass substrate in a vertical direction from the support glass substrate is applied, and a small peeling opening is opened at an end portion by a blade of a razor or the like, and air is injected into a lamination boundary, whereby the peeling can be performed more easily.

In addition to the attempt to further reduce the thickness of the glass substrate itself used in the display device as described above, there is naturally a method of reducing the thickness of the constituent members other than the glass substrate constituting the liquid crystal display substrate. As one of the methods, there is a method of thinning a polarizing plate (also referred to as a polarization separation element) which is indispensable for a liquid crystal display device and exhibits polarization separation ability in a visible light region. In general, the polarizing plate is formed on a film-like substrate after a liquid crystal element is formed. Therefore, the thickness of the substrate film is added. On the other hand, patent document 8 also proposes a method of forming a polarizing plate on a glass substrate.

Patent document 1: japanese patent laid-open No. 2000-241804

Patent document 2: japanese laid-open patent publication No. 58-54316

Patent document 3: japanese laid-open patent publication No. 2003-216068

Patent document 4: japanese laid-open patent publication No. 8-86993

Patent document 5: japanese laid-open patent publication No. 9-105896

Patent document 6: japanese patent laid-open No. 2000-252342

Patent document 7: international publication No. 2007/018028 single file

Patent document 8: japanese patent laid-open publication No. 2005-242080

However, in the method of fixing the glass substrates to each other by electrostatic attraction or vacuum attraction as described in patent document 1, the method of fixing both ends of the glass substrates by using a frit as described in patent document 2, or the method of fusing two glass substrates by irradiating laser light to the vicinity of the end face of the peripheral edge portion as described in patent document 3, since the glass substrates are not laminated and adhered to each other via any intermediate layer, a deformation defect is generated in the glass substrates due to foreign matter such as bubbles or dust mixed between the glass substrates. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

In the methods of disposing an adhesive layer between glass substrates described in patent documents 4 to 6, although the deformation defect caused by air bubbles mixed between the glass substrates as described above can be avoided, it is difficult to separate the two glass substrates, and there is a possibility that the thin glass substrate is broken at the time of separation. Furthermore, adhesive remains on the separated thin glass substrate also becomes a problem.

In contrast, with the thin plate glass laminate described in patent document 7, the above-described deformation defect due to the bubbles mixed between the glass substrates is less likely to occur. In addition, the thin glass substrate and the support glass substrate can be separated from each other. But also solves the problem that the adhesive remains on the separated thin glass substrate. Therefore, the present method is effective as a method for further reducing the thickness of the glass substrate itself used in the display device.

Next, the substrate described in patent document 8, in which a polarizing plate is formed on a glass substrate, is a member which is mainly produced as a polarization separation element of a liquid crystal projector, is provided separately in the middle of an optical path, and it is impossible to flow the substrate in a color filter forming step and a TFT array forming step. This is because, when the substrate is conveyed in the above two steps, the surface on which the polarizing plate is formed is conveyed so as to be in contact with the conveying roller or the metal tray, and therefore the polarizing plate is in contact with the conveying roller or the metal tray, which causes a problem that scratches are generated on the polarizing plate. In addition, when the polarizing element is formed directly on the glass substrate after the liquid crystal element is assembled, organic substances of the color filter or the liquid crystal itself may be deteriorated by the treatment in the polarizing plate forming step.

Disclosure of Invention

The present inventors have conducted extensive studies to solve the above problems, and have completed the present invention.

The present invention relates to the following (1) to (14).

(1) A laminate with a polarizing plate, comprising: a device substrate having a 1 st main surface and a 2 nd main surface; a support substrate having a 1 st main surface and a 2 nd main surface; and a resin layer present between the 1 st main surface of the device substrate and the 1 st main surface of the support substrate; wherein a reflection type polarizing plate is present on the 1 st main surface of the device substrate, and a surface of the resin layer which is in contact with a surface of the device substrate on which the reflection type polarizing plate is present has a strippability.

(2) The laminate with a polarizing plate according to (1), wherein the reflective polarizing plate is a wire grid polarizing plate.

(3) The laminate with a polarizing plate according to (2), wherein a pitch (Pm) of the fine metal wires of the wire grid type polarizing plate is 50 to 200nm, and a ratio (Dm/Pm) of a width (Dm) of the fine metal wires to the pitch (Pm) is 0.1 to 0.6.

(4) The laminate with a polarizing plate according to any one of (1) to (3), wherein the resin forming the resin layer is at least one resin selected from a fluororesin, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin.

(5) The laminate with a polarizing plate according to any one of (1) to (4), wherein the resin layer has a thickness of 5 to 50 μm.

(6) The laminate with a polarizing plate according to any one of (1) to (5), wherein the device substrate and the support substrate are made of the same material, and the difference in linear expansion coefficient between the device substrate and the support substrate is 150 × 10^-7Below/° c.

(7) The laminate with a polarizing plate according to any one of (1) to (5), wherein the device substrate and the support substrate are made of different materials, and the difference in linear expansion coefficient between the device substrate and the support substrate is 700X 10^-7Below/° c.

(8) A display panel with a support, wherein a display member is provided on the 2 nd main surface of the device substrate of the laminate with a polarizing plate according to any one of (1) to (7).

(9) A display panel formed by using the display panel with a support according to (8).

(10) A display device formed using the display device panel of 9.

(11) A method for producing a laminate with a polarizing plate, which is the laminate with a polarizing plate according to any one of (1) to (7), comprising: a polarizing plate forming step of forming a reflection type polarizing plate on the 1 st main surface of the device substrate; a resin layer forming step of forming a resin layer having a releasable surface on the 1 st main surface of the support substrate; and a bonding step of laminating the device substrate with the reflection-type polarizing plate and the support substrate with the resin layer to bond the strippable surface of the resin layer to the surface of the device substrate on which the reflection-type polarizing plate is present.

(12) A method for producing a display panel with a support, comprising the step of (11) and the step of forming a display member on the 2 nd main surface of the device substrate of the obtained laminate with a polarizing plate.

(13) A method for producing a panel for a display device, comprising the step of (12) and a peeling step of peeling a surface of the device substrate on which a reflective polarizing plate is present from a peelable surface of the resin layer in the obtained panel for a display device with a support.

(14) A method for manufacturing a display device, comprising the step of (13) and a step of obtaining a display device using the obtained panel for a display device. The laminate obtained by the present invention can provide a laminate with a polarizing plate that can produce a display device thinner than conventional display devices.

Further, it is possible to provide a method for easily and economically manufacturing the above-described laminate with a polarizing plate without any foreign matter such as air bubbles or dust between the device substrate and the support substrate.

Further, an object is to provide a display device panel with a support comprising such a laminate with a polarizing plate.

Further, a display device panel and a display device formed using the display device panel with the support body can be provided.

Further, a method for manufacturing such a display device panel with a support, a display device panel, and a display device can be provided.

Drawings

Fig. 1 is a schematic cross-sectional view showing an embodiment of a laminate with a polarizing plate of the present invention.

Fig. 2 is a schematic front view showing the embodiment of fig. 1.

Fig. 3 is a schematic perspective view showing an embodiment of an apparatus substrate with a polarizing plate.

Fig. 4 is a schematic perspective view showing another embodiment of the device substrate with a polarizing plate.

Fig. 5 is a schematic cross-sectional view for explaining a process of forming a convex line on a substrate of a roll device.

Fig. 6 is a schematic front view for explaining an embodiment of a device substrate with a ridge line in example 2.

Fig. 7 is a schematic cross-sectional view for explaining vapor deposition conditions in example 2.

Detailed Description

An embodiment of a laminate with a polarizing plate according to the present invention will be described with reference to the drawings.

Fig. 1 is a schematic cross-sectional view showing an embodiment of a laminate with a polarizing plate (hereinafter, also simply referred to as "laminate") of the present invention.

Fig. 2 is a schematic front view of the device substrate of the present embodiment as viewed from the 2 nd main surface side. However, for ease of understanding, fig. 2 only marks the 1 st major surface of the device substrate, the 1 st major surface of the support substrate, and the reflective polarizer.

The laminate 10 of the present embodiment includes a device substrate 12, a support substrate 13, and a resin layer 14, and the resin layer 14 is present between the 1 st main surface 12a of the device substrate 12 and the 1 st main surface 13a of the support substrate 13. In addition, a reflection type polarizing plate 11 is present on the 1 st main surface 12a of the device substrate 12.

The resin layer 14 is fixed to the 1 st main surface 13a of the support substrate 13 and is closely bonded to the surface of the device substrate 12 on which the reflection-type polarizing plate 11 is present. The resin layer 14 is peelable from the surface of the device substrate 12 on which the reflective polarizer 11 is present. Here, of the two main surfaces of the device substrate 12, the main surface on the support substrate 13 side (resin layer 14 side) is the 1 st main surface 12a, and the main surface on the opposite side is the 2 nd main surface 12 b. Of the two main surfaces of the support substrate 13, the main surface on the device substrate 12 side (the side where the resin layer 14 is present) is the 1 st main surface 13a, and the main surface on the opposite side is the 2 nd main surface 13 b.

Next, the device substrate, the support substrate, the resin layer, and the reflective polarizing plate present on the 1 st main surface of the device substrate included in the laminate of the present invention will be described.

The device substrate of the present invention is explained.

The thickness, shape, size, physical properties (heat shrinkage, surface shape, chemical resistance, etc.), composition, and the like of the device substrate are not particularly limited, and may be, for example, the same as those of a conventional glass substrate for a display device. Further, a resin substrate may be used.

The thickness of the device substrate is not particularly limited, but is preferably less than 0.7mm, more preferably 0.5mm or less, and further preferably 0.4mm or less. Further, it is preferably 0.05mm or more, more preferably 0.07mm or more, and further preferably 0.1mm or more.

The shape of the device substrate is not particularly limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle, and includes a shape in which corners (cut corners) of the peripheral portion are cut off.

The size of the device substrate is not particularly limited, but may be, for example, 100mm to 2000mm × 100mm to 2000mm, and preferably 500mm to 1000mm × 500mm to 1000mm in the case of a rectangular shape.

Even with such a preferable thickness and a preferable size, the laminate of the present invention can easily separate the device substrate with a polarizing plate from the support substrate.

The characteristics of the device substrate, such as heat shrinkage rate, surface shape, and chemical resistance, are not particularly limited, and vary depending on the type of display device to be manufactured.

However, the device substrate preferably has a small thermal shrinkage rate. Specifically, if the device substrate is made of glass, it is preferable to use a glass having a coefficient of linear expansion of 150 × 10 as an index of thermal shrinkage^-7Substrate of 100X 10 or less is more preferable^-7A linear expansion coefficient of 45X 10 or less is more preferably not more than/° C^-7Below/° c. If the device substrate is a synthetic resin, 700 × 10 is preferably used^-7Substrate of not more than 650X 10/deg.C, more preferably 650X 10^-7/° C or less, more preferably 500X 10^-7Below/° c. This is because it is difficult to manufacture a high-definition display device when the heat shrinkage rate is large. In both the case where the device substrate is made of glass and the case where the device substrate is made of synthetic resin, the device substrate preferably has a linear expansion coefficient of 5 × 10^-7Above/° c.

In the present invention, the linear expansion coefficient is defined in japanese industrial standard JISR3102 (1995).

When the device substrate is made of glass, the composition thereof may be the same as that of conventionally known glass containing an alkali metal oxide or alkali-free glass, for example. Among them, alkali-free glass is preferable because of its low heat shrinkage.

On the other hand, in the case of a resin substrate, the resin substrate is not particularly limited as long as it is a resin having transparency. However, the application of the laminate to which the present invention is preferably applied is a liquid crystal display device. Therefore, it is preferable to use a resin which is composed of a thermoplastic resin such as polyester, polycarbonate, polyarylate, polyethersulfone, poly (cyclo) olefin, or a thermosetting resin such as epoxy, transparent polyimide, acrylic, and which has optical isotropy.

Next, the support substrate of the present invention will be described.

The support substrate supports the device substrate via the resin layer, thereby enhancing the strength of the device substrate.

The thickness, shape, size, physical properties (heat shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the supporting substrate are not particularly limited.

The thickness of the supporting substrate is not particularly limited, but must be a thickness that enables the laminate of the present invention to be processed by a conventional manufacturing line for a panel for a display device.

For example, the thickness is preferably 0.1mm to 1.1mm, more preferably 0.3mm to 0.8mm, and still more preferably 0.4mm to 0.7 mm.

For example, when a current manufacturing line is designed to be able to handle a substrate having a thickness of 0.5mm, the sum of the thickness of the support substrate and the thickness of the resin layer is set to 0.4mm when the thickness of the device substrate is 0.1 mm. In addition, it is most common to design the existing manufacturing line so as to be able to handle a glass substrate having a thickness of 0.7mm, and for example, if the thickness of the device substrate is 0.4mm, the sum of the thickness of the support substrate and the thickness of the resin layer is 0.3 mm.

The thickness of the support substrate is preferably larger than the thickness of the device substrate.

The shape of the support substrate is not particularly limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle, and includes a shape in which corners (cut corners) of the peripheral portion are cut off.

The size of the support substrate is not particularly limited, but is preferably about the same as the size of the device substrate, and is preferably slightly larger (about 0.05mm to 10mm larger in the vertical or horizontal direction, respectively) than the device substrate. The reason is that damage to the end of the device substrate due to contact between the positioning device such as a positioning pin for manufacturing a display panel and the device substrate can be easily prevented, and separation between the device substrate and the support substrate can be more easily performed.

Here, the vertical direction refers to the short side direction of the device substrate in fig. 2 and the direction of arrow Xa, and the horizontal direction refers to the long side direction of the device substrate in fig. 2 and the direction of arrow Xb.

The linear expansion coefficient of the support substrate may be substantially the same as or different from that of the device substrate. When the thickness is substantially the same, it is preferable that the laminated body of the present embodiment is subjected to a heat treatment, in that warpage is less likely to occur in the device substrate or the support substrate.

The device substrate and the support substrate are made of the same material, and preferably, the difference in linear expansion coefficient between the device substrate and the support substrate is 150 × 10^-7Lower than/° C, more preferably 100X 10^-7Below/° cMore preferably 50X 10^-7Below/° c.

The device substrate and the support substrate are made of different materials, and preferably, the difference between the linear expansion coefficients of the device substrate and the support substrate is 700X 10^-7/. degree.C.or less, more preferably 650X 10^-7/° C or less, more preferably 500X 10^-7Below/° c.

The material of the support substrate is not particularly limited, and may be glass, synthetic resin, metal, or the like, and is not limited as long as it is a rigid material capable of supporting the device substrate.

When glass is used as a material for the support substrate, the composition thereof may be the same as, for example, glass containing an alkali metal oxide or alkali-free glass. Among them, alkali-free glass is preferable because of its low heat shrinkage.

When a plastic (synthetic resin) is used as a material of the support substrate, the kind thereof is not particularly limited, and examples thereof include polyethylene terephthalate resins, poly (cyclo) olefin resins, polycarbonate resins, polyimide resins, fluorine resins, polyamide resins, polyaramide resins, polyether sulfone resins, polyether ketone resins, polyether ether ketone resins, polyethylene naphthalate resins, polyepoxy resins, polyacrylic resins, various liquid crystal polymer resins, and silicone resins.

When a metal is used as a material of the support substrate, the kind thereof is not particularly limited, and examples thereof include stainless steel and copper.

Next, the resin layer of the present invention is explained.

In the laminate of the present invention, the resin layer is fixed to the 1 st main surface of the support substrate. The resin layer is closely bonded to the surface of the device substrate on which the reflection-type polarizing plate is present, but the resin layer can be easily peeled off. That is, the resin layer is bonded to the surface having the reflection-type polarizing plate with a certain degree of bonding force, but bonded with a bonding force of a degree that the resin layer can be easily peeled without exerting an adverse effect on the reflection-type polarizing plate at the time of peeling. For example, in the case of peeling, peeling can be performed without damaging the structure of the reflective polarizer and without causing resin residue on the surface of the reflective polarizer. In the present invention, the property of the resin layer surface that can be easily peeled off is referred to as peelability.

In the laminate of the present invention, the surface of the device substrate on which the reflective polarizer is present and the resin layer are preferably bonded to each other not by the adhesive force of the adhesive, but by the force due to the van der waals force between the solid molecules, that is, the adhesive force.

On the other hand, the bonding force between the resin layer and the 1 st main surface of the support substrate is relatively higher than the bonding force between the resin layer and the surface on which the reflection-type polarizing plate is present. In the present invention, the bonding of the resin layer to the surface of the device substrate on which the reflective polarizing plate is present is referred to as adhesion, and the bonding of the resin layer to the 1 st main surface of the support substrate is referred to as fixation. Hereinafter, the surface of the device substrate on which the reflective polarizer is present is also simply referred to as the device substrate surface or the 1 st main surface of the device substrate.

The thickness of the resin layer is not particularly limited, but is preferably 5 to 50 μm, more preferably 5 to 30 μm, and still more preferably 7 to 20 μm. This is because, when the thickness of the resin layer is in such a range, the adhesion between the device substrate surface and the resin layer is sufficient. This is because even if air bubbles or foreign matter are interposed, the occurrence of deformation defects in the device substrate can be suppressed. In addition, when the thickness of the resin layer is too thick, time and materials are required in forming the resin layer, and thus it is uneconomical.

The resin layer may be formed of two or more layers. In this case, the "thickness of the resin layer" means the total thickness of all layers.

In the case where the resin layer is composed of two or more layers, the types of resins forming the respective layers may be different.

The surface tension of the releasable surface of the resin layer is preferably 30mN/m or less, more preferably 25mN/m or less, and still more preferably 22mN/m or less. The surface tension of the releasable surface of the resin layer is preferably 15mN/m or more. This is because, when the surface tension is such as described above, the resin layer can be more easily peeled off from the device substrate surface, and the adhesion between the resin layer and the device substrate surface is also sufficient.

Further, the resin layer is preferably made of a material having a glass transition point lower than room temperature (about 25 ℃) or having no glass transition point. This is because the non-adhesive resin layer has higher releasability, the resin layer can be more easily peeled from the surface of the device substrate, and adhesion between the resin layer and the surface of the device substrate is sufficient.

In addition, the resin layer preferably has heat resistance. This is because, for example, when the display device member is formed on the 2 nd main surface of the device substrate, the laminate of the present invention can be supplied to a heat treatment.

When the elastic modulus of the resin layer is too high, adhesion between the resin layer and the surface of the device substrate tends to be lowered, which is not preferable. In addition, when the elastic modulus is too low, the peelability is reduced.

The kind of the resin forming the resin layer is not particularly limited. Examples of the resin include fluorine resins, acrylic resins, polyolefin resins, polyurethane resins, and silicone resins. It is also possible to use a mixture of several resins. Among them, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and also excellent in releasability from a device substrate. This is because, when the curable silicone resin is cured on the surface of the support substrate to form the silicone resin layer, the resin layer is easily fixed on the support substrate by a condensation reaction with silanol on the surface of the support substrate. The silicone resin layer is preferably not substantially deteriorated in releasability even when treated at, for example, about 300 to 400 ℃ for about 1 hour.

Among the silicone resins, the resin layer is preferably a cured product of curable silicone for release paper. The silicone for release paper contains a silicone containing a linear dimethylpolysiloxane in the molecule as a main component. A resin layer formed by curing a composition containing the main agent and the crosslinking agent on the surface (1 st main surface) of the support substrate using a catalyst, a photopolymerization initiator, or the like is preferable because it has excellent releasability. Further, since the device substrate has high flexibility, even if foreign matter such as air bubbles or dust is mixed between the device substrate and the resin layer, the occurrence of deformation defects in the device substrate can be suppressed.

Such a silicone for release paper is classified into a condensation reaction type silicone, an addition reaction type silicone, an ultraviolet ray curing type silicone, and an electron beam curing type silicone according to the curing mechanism thereof, and any one of the silicones can be used. Among these, addition reaction type silicones are preferred. This is because the curing reaction is easily performed, the degree of releasability when forming a resin layer is good, and the heat resistance is high.

The silicone for release paper is in the form of a solvent type, an emulsion type, or a solvent-free type, and any type of silicone can be used. Among these silicones, the solventless type is preferable. This is because the resin composition is excellent in productivity, safety and environmental protection properties. This is because the resin layer does not contain a solvent that generates bubbles during a curing step performed when forming the resin layer, that is, during heat curing, ultraviolet curing, or electron beam curing, and therefore bubbles are less likely to remain in the resin layer.

Further, as the silicone for release paper, concretely, trade names and models sold on the market include KNS-320A, KS-847 (both manufactured by shin-Etsu silicone corporation), TPR6700 (manufactured by GE toshiba silicone corporation), a combination of vinyl silicone "8500" (manufactured by seikagawa chemical industries, Ltd.) and methylhydrogenpolysiloxane "12031" (manufactured by seikagawa chemical industries, Ltd.), a combination of vinyl silicone "11364" (manufactured by seikagawa chemical industries, Ltd.) and methylhydrogenpolysiloxane "12031" (manufactured by seikagawa chemical industries, Ltd.), a combination of vinyl silicone "11365" (manufactured by seikagawa chemical industries, Ltd.) and methylhydrogenpolysiloxane "12031" (manufactured by seikagawa chemical industries, Ltd.), and the like.

KNS-320A, KS-847 and TPR6700 are silicones containing a base compound and a crosslinking agent in advance.

Further, the silicone resin forming the resin layer preferably has a property that components in the silicone resin layer are less likely to migrate to the device substrate, i.e., low silicone migration.

Next, the reflection type polarizing plate of the present invention will be described.

A polarizing plate is an element which is used in an image display device such as a liquid crystal display device, a rear projection television, or a front projector and which exhibits a polarization separation capability in a visible light region. Examples of the polarizing plate (also referred to as a polarization separation element) include an absorption polarizing plate and a reflection polarizing plate.

The absorption-type polarizing plate is a polarizing plate in which a dichroic dye such as iodine is oriented in a resin film, and has low heat resistance.

On the other hand, the reflection-type polarizing plate has a characteristic that light reflected without being incident on the polarizing plate is incident again on the polarizing plate, and thus the light use efficiency can be improved. Therefore, the demand for a reflective polarizing plate is increasing for the purpose of increasing the brightness of LCDs and the like.

Examples of the reflective polarizer include a linear polarizer made of a birefringent resin laminate, a circular polarizer made of cholesteric liquid crystal, and a wire grid polarizer. Among them, for the purpose of the present invention, such as thinning of the display device, the wire grid type polarizing plate is particularly preferable.

The wire grid polarizer has a structure in which a plurality of thin metal wires are arranged in parallel with each other at a constant pitch on a light-transmitting substrate. When the pitch of the thin metal wires is sufficiently shorter than the wavelength of the incident light, a component having an electric field vector orthogonal to the longitudinal direction of the thin metal wires (i.e., p-polarized light) in the incident light is transmitted, and a component having an electric field vector parallel to the longitudinal direction of the thin metal wires (i.e., s-polarized light) is reflected.

Fig. 3 and 4 are schematic perspective views of a device substrate with a polarizing plate as a part of a laminate of the present invention having a wire grid type polarizing plate formed on the 1 st main surface of the device substrate.

Examples of the wire grid polarizer exhibiting polarization separation capability in the visible light region include a wire grid polarizer in which fine metal wires 35 are formed on the 1 st main surface 32a of the device substrate 32 at predetermined widths, pitches, and lengths as shown in fig. 3; a wire grid polarizer in which the upper portions of a plurality of convex strips 46 formed on the 1 st main surface 42a of the device substrate 42 at predetermined width, pitch, height, and length are covered with a film 47 made of a metal material to form fine metal wires, as shown in fig. 4; and a thin metal wire and a low-reflectivity member (SiO) formed on the 1 st main surface of the substrate device at a predetermined width, pitch and height₂Etc.) of a wire grid type polarizing plate.

Next, the shape of the thin metal wire of the wire grid type polarizing plate will be described. The height Hm of the thin metal wire is preferably 30nm to 200nm, more preferably 40nm to 150 nm. With such a height, s-polarized light transmission can be suppressed particularly in a short wavelength region, and the wire grid polarizer can exhibit sufficiently high polarized light separation ability. In addition, since the occurrence of diffraction phenomenon due to the thin metal wire is suppressed, the decrease in transmittance of the polarizing plate can be suppressed.

The basic function of the wire grid polarizer is determined by the width Dm and the pitch Pm of the fine metal wires. As shown in fig. 3 and 4, the width Dm of the thin metal wires is a distance in a direction perpendicular to the direction of the length Lm of the thin metal wires, and the pitch Pm of the thin metal wires is a repetition distance in the width direction of the thin metal wires. The ratio of the width Dm of the fine metal wire to the pitch Pm (Dm/Pm) is preferably 0.1 to 0.6, more preferably 0.2 to 0.5. When the ratio Dm/Pm is 0.1 or more, the wire grid polarizer exhibits a further high degree of polarization with respect to light incident from the front surface (surface on which the fine metal wires are formed). By setting the ratio of Dm/Pm to 0.6 or less, the p-polarization light transmittance is further improved.

The pitch Pm of the fine metal wires is preferably 300nm or less, more preferably 50nm to 200nm or less. The wire grid type polarizing plate exhibits sufficiently high reflectance and sufficiently high polarization separation capability even in a short wavelength region near 400nm by setting the pitch Pm of the fine metal wires to 300nm or less. In addition, coloring phenomenon due to diffraction is suppressed.

The width Dm of the thin metal wires is more preferably 10nm to 120nm, and particularly preferably 30nm to 100nm in consideration of easiness in forming a metal layer on the upper portions of the ridges by vapor deposition.

The material of the thin metal wire may be any metal material having sufficient conductivity, and is preferably a material considering characteristics such as corrosion resistance in addition to conductivity. Examples of the metal material include a metal simple substance, an alloy, and a metal containing a dopant or a predetermined amount or less of impurities. Examples thereof include aluminum, silver, chromium, magnesium, aluminum alloys, and silver alloys. In addition, a metal containing a nonmetallic element such as carbon as a dopant or the like can also be used. Aluminum, an aluminum alloy, silver, chromium, and magnesium are preferable because of high reflectance with respect to visible light, low absorption of visible light, and high conductivity, and aluminum or an aluminum alloy is particularly preferable.

The fine metal wires may be formed directly on the 1 st main surface of the device substrate, or may be formed with a foundation layer of metal oxide or the like interposed therebetween. As described above, the convex portion may be formed on the convex portion surface of the convex portion forming layer formed on the 1 st main surface of the device substrate and made of a material such as a resin.

By forming a member for a display device on the 2 nd main surface of the device substrate with a polarizing plate in the laminate of the present invention, a panel for a display device with a support can be obtained.

The display device member is a protective layer provided on the surface of a conventional device substrate for a liquid crystal display device, a TFT array (hereinafter simply referred to as an "array"), a color filter, a liquid crystal, a transparent electrode made of Indium Tin Oxide (ITO), zinc oxide, or the like, various circuit patterns, or the like.

The panel for a display device with a support according to the present invention also includes a configuration in which, for example, an array formation surface of the panel for a display device with a support according to the present invention in which an array is formed on the 2 nd main surface of a device substrate and a color filter formation surface of another panel for a display device with a support according to the present invention in which a color filter is formed on the 2 nd main surface of a device substrate are bonded to each other with a sealing material or the like.

Further, according to the display device panel with the support, a display device panel can be obtained. A device substrate of a display device panel with a support is peeled from a resin layer fixed on a support substrate, and a display device panel and a display device can be obtained. As the display device, a liquid crystal display device can be cited. Examples of the liquid crystal display device include TN type, STN type, FE type, TFT type, and MIM type.

Next, a method for producing the laminate of the present invention will be described.

The method for producing the laminate of the present invention is not particularly limited, and it is preferable to produce the laminate by a method for producing a laminate including a polarizing plate forming step of forming a reflective polarizing plate on the 1 st main surface of the device substrate, a resin layer forming step of forming a resin layer having a releasable surface on the 1 st main surface of the support substrate, and a bonding step of laminating the device substrate with a reflective polarizing plate and the support substrate with a resin layer to tightly bond the releasable surface of the resin layer to the surface of the device substrate on which the reflective polarizing plate is present. Hereinafter, such a production method is also referred to as "the production method of the present invention".

The method for manufacturing the device substrate and the support substrate itself in the manufacturing method of the present invention is not particularly limited. The resin composition can be produced by a conventionally known method. For example, when the substrate is made of glass, the substrate can be formed into a plate shape by, for example, a float method, a melting method, a down draw (down) method, a slot down (slot down) method, a redraw (redraw) method, or the like after melting a conventionally known glass raw material as molten glass.

The polarizing plate forming step in the manufacturing method of the present invention will be described.

The method of forming the wire grid polarizer on the device substrate is not particularly limited. For example, 2 methods listed below can be employed. One is a method of forming a thin metal wire by photolithography after a thin metal film is formed on a device substrate. In addition, another method is a method of forming a resin layer having ridges on a device substrate, forming a metal layer on the ridges by a method such as vapor deposition or CVD, and forming fine metal wires.

As a method of forming a resin layer having ridges on a device substrate, an imprint method (photo-imprint method, thermal imprint method) can be cited, and the photo-imprint method is particularly preferable in that ridges can be formed with good productivity and grooves of a mold can be transferred with high accuracy.

The photo-embossing method is a method of forming a resin layer having ridges by, for example, preparing a mold in which a plurality of grooves are formed at predetermined intervals in parallel with each other by a combination of electron beam drawing and etching, transferring the grooves of the mold to a photocurable composition applied to the surface of an arbitrary substrate, and simultaneously photocuring the photocurable composition.

Specifically, the ridges are produced by the photo-embossing method through the following steps (a) to (D).

(A) And a step of applying the photocurable composition to the 1 st main surface of the device substrate.

(B) And pressing a mold having a plurality of grooves formed in parallel at predetermined intervals against the photocurable composition so that the grooves are in contact with the photocurable composition.

(C) And a step of irradiating the photocurable composition with radiation (ultraviolet rays, electron beams, or the like) while pressing the mold against the photocurable composition to cure the photocurable composition, thereby producing a resin layer having a plurality of ridges corresponding to the grooves of the mold.

(D) And a step of peeling the mold from the resin layer having the plurality of ridges.

Specifically, the ridges are produced by the hot stamping method through the following steps (E) to (G).

(E) A step of forming a transfer target film of a thermoplastic resin on the first main surface 1 of the device substrate, or a step of producing a transfer target film of a thermoplastic resin.

(F) And a step of pressing a mold, in which a plurality of grooves are formed at a predetermined interval in parallel with each other, against a film to be transferred or a film to be transferred, which is heated to a temperature higher than the glass transition temperature (Tg) or the melting point (Tm) of the thermoplastic resin, so that the grooves are in contact with the film to be transferred, thereby producing a resin layer having a plurality of ridges corresponding to the grooves of the mold.

(G) And a step of cooling the resin layer having the plurality of ridges to a temperature lower than Tg or Tm to peel the base material from the mold.

After the ridges are formed by the imprinting method, a metal material is evaporated from obliquely above the ridges to form a thin metal wire. Examples of the vapor deposition method include physical vapor deposition methods such as a vacuum vapor deposition method, a sputtering method, and an ion plating method.

In addition, when the thickness of the apparatus substrate is extremely thin, for example, 0.1mm or less, the apparatus substrate itself can be wound in a roll shape. Therefore, the device substrate wound in a roll shape is set on a feeding roller, the device substrate is continuously fed, and the resin layer for polarizing plate is formed on the 1 st main surface of the device substrate using the resin coating member for polarizing plate. Then, the resin layer for polarizing plate is brought into close contact with a cylindrical roller having concave stripes on a curved surface, and the convex stripes are transferred onto the resin layer for polarizing plate, thereby forming a resin layer for polarizing plate having convex stripes. In this case, if an active energy ray-curable resin or the like is used for the resin layer for polarizing plates having ridges, it is preferable that the shape of the ridges to be imparted can be fixed more reliably by irradiating ultraviolet rays or the like from the opposite side of the device substrate (the opposite side of the surface of the resin layer for polarizing plates on which the ridges are formed) at the stage of the contact with the cylindrical roller. After the convex stripes are provided, the device substrate provided with the resin layer for polarizing plates having the convex stripes is wound on a winding roll.

Then, the winding roll is set in the feeding section of the continuous vapor deposition device, the device substrate is continuously fed, and the metal material is deposited on the upper portions of the ridges. By the above-described steps, the wire grid type polarizing plate was continuously formed on the 1 st main surface of the device substrate. Finally, the device substrate on which the wire grid polarizer is continuously formed is appropriately cut into a single sheet, so that the device substrate with the wire grid polarizer can be manufactured with very high productivity.

As a method for forming a wire grid polarizer on a device substrate in a roll form, an optical imprint method is particularly preferable in terms of the high degree of productivity. Fig. 5 is a schematic view showing a method of forming a resin layer for a polarizing plate having ridges on a rolled device substrate by a photo-imprint method. The manufacturing method includes an apparatus substrate supply unit 51, a resin (the photocurable composition described above, and the same applies hereinafter) coating unit 52 for polarizing plates, a nip roller 53, a gravure roller 54 for sticking a flat plate-like mold having ridges on a curved surface of the roller, a resin curing unit 55 for polarizing plates, a peeling roller 56, and a winding unit 57 for apparatus substrates.

The device substrate supply unit 51 feeds a rolled device substrate to the resin coating unit 52 for polarizing plate, and is composed of a device substrate feed roller 51a, a peeling roller 51b for peeling the protective film of the device substrate, and a winding roller 51c for winding the peeled protective film.

The resin coating member 52 for polarizing plate is a device for forming a resin layer for polarizing plate by coating a resin for polarizing plate on the 1 st main surface of the device substrate, and is composed of a resin supply source 52a for polarizing plate for supplying the resin for polarizing plate, a coating head 52b, a coating roller 52c for winding and supporting the device substrate at the time of coating, a pipe 52d for supplying the resin for polarizing plate from the resin supply source 52a for polarizing plate to the coating head 52b, and a pump 52 e.

The gravure roll 54 is a device for forming convex stripes on the polarizing plate resin layer coated on the first main surface 1 of the device substrate, and the gravure roll 54 has a cylindrical shape, and a regular fine concave-convex pattern in which the shape of the convex stripes formed on the polarizing plate resin layer is inverted is formed on the curved surface of the gravure roll 54. The fine uneven pattern is required to have shape accuracy, mechanical strength, flatness, and the like. The shape of the fine uneven pattern is desirably a rectangle.

The material of the gravure roll 54 is preferably made of metal or resin.

As a method for forming the regular fine uneven pattern on the curved surface of the gravure roll 54, a method of forming by cutting with a diamond tool, a method of forming by photolithography, electron beam drawing, laser processing, or the like can be used. Further, a method of forming a fine uneven pattern on the surface of a metal plate-like body having a thin plate thickness by photolithography, electron beam lithography, laser processing, photolithography, or the like, and winding and fixing the plate-like body around the curved surface of a cylindrical roller serving as the base material of the gravure roller 54 to form the gravure roller 54 can also be employed. Further, a method of forming the gravure roll 54 by forming a fine uneven pattern on the surface of a metal plate-like body made of a material which is easier to process than metal by using a reverse die which forms a fine uneven pattern by photolithography, electron beam lithography, laser processing, photolithography, or the like, forming a fine uneven pattern on the surface of a metal plate-like body having a small plate thickness by electroforming, and winding and fixing the plate-like body around the curved surface of the base material of the gravure roll 54 can also be employed.

The releasing treatment is preferably performed on the curved surface of the gravure roll 54. In this way, by performing the release treatment on the curved surface of the gravure roll 54, the shape of the fine uneven pattern can be maintained well. As the mold release treatment, various known methods, for example, a coating treatment of a fluororesin, can be employed. Further, the gravure roll 54 is preferably provided with a driving means.

The roll 53 is a device that performs roll forming while pressing the device substrate in a pair with the gravure roll 54, and is required to have predetermined mechanical strength, roundness, and the like. If the longitudinal elastic modulus (young's modulus) of the surface of the roll 53 is too small, the roll forming process is insufficient, and if it is too large, it is sensitive to the rolling of foreign matter such as dust, and a defect is likely to occur, so that it is preferable to have an appropriate value, for example, 4MPa to 100 MPa. Further, the roll 53 is preferably provided with a driving member. The nip roller 53 rotates in the opposite direction to the gravure roller 54. Preferably, the gravure roll 54 is synchronized with the rotational speed of the nip roll 53.

In order to apply a predetermined pressing force between the gravure roll 54 and the nip roll 53, it is preferable to provide a pressing member on either the gravure roll 54 or the nip roll 53. It is preferable that a fine adjustment member capable of accurately controlling a gap (clearance) between the gravure roll 54 and the nip roll 53 be provided in either one of the gravure roll 54 and the nip roll 53.

The polarizing plate resin curing member 55 is a light irradiation member provided on the downstream side of the nip roller 53 so as to face the gravure roller 54. The polarizing plate resin curing member 55 cures the polarizing plate resin layer formed on the 1 st main surface of the device substrate by light irradiation. Preferably, the polarizing plate is capable of irradiating light of a wavelength corresponding to the curing characteristics of the resin layer for polarizing plate, and capable of irradiating light of a light amount corresponding to the transport speed of the device substrate. As the resin curing member 55 for polarizing plate, a columnar lamp having a length substantially equal to the width of the device substrate can be used. Further, a plurality of the columnar lamps may be provided in parallel, and a reflecting plate may be provided on the rear surface of the columnar lamp.

In the case where the temperature of the polarizing plate resin layer is increased by the polarizing plate resin curing member 55, a cooling member may be provided on the gravure roll 54.

The peeling roller 56 is a device for peeling the device substrate provided with the resin layer having ridges from the gravure roller 54 in a pair with the gravure roller 54, and is required to have predetermined mechanical strength, roundness, and the like. At the peeling position, the device substrate wound around the curved surface of the gravure roll 54 is sandwiched between the rotating gravure roll 54 and the peeling roll 56, and the device substrate is peeled from the gravure roll 54 and wound around the peeling roll 56. In order to reliably perform this operation, it is preferable to provide the peeling roller 56 with a driving member. The peeling roller 56 rotates in the opposite direction to the gravure roller 54.

The device substrate winding member 57 is a device for winding the peeled device substrate and accommodating the peeled device substrate in a roll shape, and is constituted by a device substrate winding roll and the like. In the winding member 57 of the device substrate, the protective film may be supplied to the 1 st main surface side of the device substrate, and the device substrate and the protective film may be accommodated in the winding member 57 of the device substrate in a state of being overlapped.

In the above-described polarizing plate manufacturing method, a guide roller or the like forming a transport path of the device substrate may be provided between the resin coating member 52 for polarizing plate and the gravure roller 54, between the peeling roller 56 and the winding member 57 of the device substrate, or a tension roller or the like may be provided in order to absorb slack of the device substrate during transport as necessary.

The method of forming the fine uneven pattern includes not only a method using a gravure roll in which a fine uneven pattern is formed on a curved surface of a cylindrical roll but also a method using a member in which a fine uneven pattern is formed on a surface of a strip such as an endless belt. Even in the method of forming the band-shaped body, the same operation and effect as those of the method of forming the cylindrical gravure roll can be obtained.

After the ridges are formed by the photo-imprint method, a metal layer is formed on the ridges by vapor deposition to form fine metal wires, thereby producing a reflective polarizing plate.

Next, a resin layer forming step in the manufacturing method of the present invention will be described.

The method of forming the resin layer on the surface (1 st main surface) of the support substrate is also not particularly limited. For example, a method of bonding a film-like resin to the surface of the support substrate can be cited. Specifically, a method of applying a surface modification treatment (priming) to the surface of the support substrate to apply a high adhesive force to the surface of the film and bonding the resin layer to the 1 st main surface of the support substrate can be cited. Examples thereof include a chemical method (primer treatment) such as an organic silane coupling agent which chemically improves adhesion, a physical method such as flame (frame) treatment which increases surface active groups, and a mechanical treatment method which increases surface roughness such as blast treatment to enhance contact.

For example, a method of applying a resin composition as a resin layer to the 1 st main surface of the support substrate by a known method can be mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. These methods can be appropriately selected depending on the kind of the resin composition.

For example, when a solvent-free silicone for release paper is used as the resin composition, a die coating method, a spin coating method, or a screen printing method is preferable.

In addition, when the resin composition is coated on the 1 st main surface of the support substrate, the coating amount is preferably 1g/m²～100g/m²More preferably 5g/m²～20g/m²。

For example, when the resin layer is formed from an addition reaction type silicone, a resin composition containing silicone (main agent) containing a linear dimethylpolysiloxane in the molecule, a crosslinking agent, and a catalyst is applied to the 1 st main surface of the support substrate by a known method such as the above-mentioned spray coating method, and then heated and cured. The heat curing conditions vary depending on the amount of the catalyst to be mixed, but for example, when 2 parts by mass of a platinum-based catalyst is mixed with respect to 100 parts by mass of the total amount of the main agent and the crosslinking agent, the reaction is carried out at 50 to 250 ℃ in the air, preferably at 100 to 200 ℃. The reaction time in this case is 5 to 60 minutes, preferably 10 to 30 minutes. In order to provide a silicone resin layer having low silicone migration, it is preferable to perform the curing reaction as much as possible so that no unreacted silicone component remains in the silicone resin layer.

In the case of the reaction temperature and the reaction time as described above, it is preferable that unreacted silicone components do not remain in the silicone resin layer. If the reaction time is too long or the reaction temperature is too high, oxidative decomposition of the silicone resin occurs and a low molecular weight silicone component is formed, and the silicone migration may be improved. In order to improve the releasability after the heat treatment, it is also preferable to perform the curing reaction as much as possible so that no unreacted silicone component remains in the silicone resin layer.

In addition, for example, when the resin layer is produced using silicone for release paper, the silicone for release paper applied on the 1 st main surface of the support substrate is heated and cured to form a silicone resin layer, and then the device substrate is laminated on the silicone resin formation surface of the support substrate in the adhesion step. By heat-curing the silicone for release paper, the silicone resin cured product is chemically bonded to the support substrate. In addition, the silicone resin layer is bonded to the support substrate by the anchor effect. Under these actions, the silicone resin layer is firmly fixed to the support substrate.

The adhesion step in the production method of the present invention will be described.

The adhesion step is a step of laminating the device substrate with the reflective polarizer and the support substrate with the resin layer, and bonding the releasable surface of the resin layer to the surface of the device substrate on which the reflective polarizer is present. Preferably, the face of the device substrate on which the reflective polarizer is present and the releasable surface of the resin layer are bonded by means of a force caused by van der waals forces between the opposed, very close, solid molecules, i.e. an adhesive force. In this case, the support substrate and the device substrate can be held in a state of being laminated with the resin layer interposed therebetween. Further, since the height of the ridges of the polarizing plate is less than 100nm and the thickness of the resin layer is 5 μm or more, the ridges can be sufficiently formed to follow the shape of the ridges by deformation of the resin layer.

The method of laminating the device substrate with a reflective polarizer and the support substrate with a resin layer is not particularly limited. For example, the method can be performed by a known method. For example, a method of stacking the device substrate on the surface of the resin layer in an atmospheric pressure environment and then pressing the resin layer and the device substrate by using a roller or a press can be cited. By performing the press bonding with a roller or a press, the resin layer is more closely bonded to the device substrate, and thus is preferable. Further, by pressure bonding with a roller or a press, air bubbles mixed between the resin layer and the device substrate can be removed relatively easily. When pressure bonding is performed by a vacuum lamination method or a vacuum pressure method, mixing of air bubbles is more preferably suppressed, and good adhesion is ensured, which is more preferable. By performing the pressure bonding under vacuum, even when minute bubbles remain, the bubbles can be prevented from growing by heating, and there is an advantage that a defect of deformation of the device substrate is not easily caused.

In the adhesion step, it is preferable that the device substrate with the reflection-type polarizing plate and the support substrate with the resin layer be laminated in an environment with high cleanliness by sufficiently cleaning the surfaces of the device substrates. Even if foreign matter is mixed between the resin layer and the device substrate, the resin layer is deformed and does not affect the flatness of the surface of the device substrate, but the higher the degree of cleanliness, the better the flatness is, which is preferable.

The laminate of the present invention can be produced by the production method of the present invention.

In the manufacturing method of the present invention, the panel for a display device with a support can be manufactured by a manufacturing method including a step of forming a member for a display device on the 2 nd main surface of the device substrate in the obtained laminate of the present invention.

Here, the member for the display device is not particularly limited. Examples of the color filter include an array provided in a liquid crystal display device.

The method of forming such a display device member is not particularly limited, and may be the same as a conventionally known method.

For example, in the case of manufacturing a TFT-LCD as a display device, various processes such as a process of forming an array on a glass substrate, a process of forming a color filter, and a process of attaching a glass substrate on which an array is formed and a glass substrate on which a color filter is formed via a sealing material or the like (array and color filter attaching process) are known. More specifically, examples of the treatment performed in these steps include rinsing with water, drying, film formation, resist coating, exposure, development, etching, and resist removal. The steps performed after the array and color filter pasting step include a liquid crystal injection step and a step of sealing the injection port performed after the liquid crystal injection step, and the processes performed in these steps can be mentioned.

Thus, a display panel with a support can be manufactured.

Further, after obtaining such a panel with a support for a display device, the panel with a support for a display device can be obtained by a manufacturing method including a peeling step of peeling a surface of the obtained panel with a support for a display device, on which the reflection type polarizing plate is present, from a releasable surface of the resin layer. The peeling method is not particularly limited. Specifically, for example, a sharp blade-like member can be pierced into the boundary between the device substrate and the resin layer, or a mixed fluid of water and compressed air can be injected to perform peeling. Preferably, the support substrate side of the support-attached panel for display device is set to the upper side and the panel side is set to the lower side on the base plate, the panel-side substrate is vacuum-sucked on the base plate (sequentially performed when the support substrates are laminated on both sides), and in this state, a mixed fluid of water and compressed air is injected to the boundary between the device substrate and the resin layer of the support-attached panel for display device, and the end of the support substrate is pulled vertically upward. In this way, an air layer is formed in order at the boundary, and the air layer spreads over the entire boundary, and the support substrate can be easily peeled off (when the support substrates are laminated on both main surfaces of the display device panel with the support body, the peeling step is repeated on a one-to-one basis).

Further, the display device can be manufactured by a manufacturing method including a step of obtaining a display device by using the obtained panel for a display device. Here, the method of manufacturing the display device is not particularly limited, and the display device can be manufactured by a conventionally known manufacturing method, for example.

Examples

Example 1

First, a sheet having a length of 170mm, a width of 100mm, a sheet thickness of 0.3mm and a linear expansion coefficient of 38X 10 was prepared^-7A substrate for a glass device (Asahi glass Co., Ltd., AN100, alkali-free glass substrate) was subjected to water washing and UV washing to wash the surface.

Then, the thickness of the substrate was set to 0.9X 10 on the 1 st main surface of the device substrate^-5torr、Aluminum (Al) was evaporated to prepare an Al layer having a thickness of 200 nm. Subsequently, a resist having a thickness of 100nm (ZEP 520A, manufactured by ZEON, Japan) was coated on the Al layer by a spin coating method. Resist films in which a plurality of grooves (width: 100nm) were formed in parallel at a predetermined pitch (200nm) were formed by EB exposure and development using an electron beam lithography apparatus (HL 800D (50keV) manufactured by hitachi high technologies).

Next, the resultant was subjected to plasma etching using a plasma etching apparatus (RIE-140 iPC, manufactured by SAMCO K., Ltd.)SF₆Etching was performed to remove excess Al, and a wire grid polarizer of fine Al metal wires was formed on the 1 st main surface of the device substrate (pitch Pm: 200nm, width Dm: 100nm, height Hm: 200nm), to obtain a device substrate with a wire grid polarizer.

Next, a sheet having a length of 180mm, a width of 110mm, a sheet thickness of 0.4mm and a linear expansion coefficient of 38X 10 was prepared^-7A glass support substrate (manufactured by Asahi glass company, Inc., AN100, alkali-free glass substrate) was subjected to water cleaning and UV cleaning to clean the surface.

Thereafter, a mixture of 100 parts by mass of a silicone for a solventless addition reaction type release paper and 2 parts by mass of a platinum group catalyst (coating amount 30 g/m) was coated on the 1 st main surface of the support substrate in a size of 178mm in length and 108mm in width by a screen printer²). Then, the cured product was heated at 180 ℃ for 30 minutes in the air to obtain a silicone resin layer having a thickness of 20 μm.

Next, the polarizing plate-forming surface of the device substrate with the wire grid polarizing plate and the surface of the silicone resin layer fixed to the 1 st main surface of the support substrate were bonded to each other at room temperature by a vacuum press, and the centers of gravity of both substrates were superposed to obtain a laminate a (laminate of the present invention).

In the laminate a of example 1, the device substrate with the wire grid polarizer and the support substrate were tightly bonded to the silicone resin layer without generating air bubbles, and the laminate was good in smoothness without having a convex defect.

Example 2

A1000 mL 4-neck flask equipped with a stirrer and a condenser was charged with 60g of monomer 1 (NK ESTER A-DPH, dipentaerythritol hexaacrylate, manufactured by Newzhongcun chemical industries Co., Ltd.), 40g of monomer 2 (NK ESTer A-NPG, neopentyl glycol diacrylate, manufactured by Newzhongcun chemical industries Co., Ltd.), 4.0g of photopolymerization initiator (CIBA SPECIALTY CHEMICALS INC, manufactured by IRGACURE907), and a fluorosurfactant(Asahi Nitro Co., Ltd., fluorinated acrylate (CH)₂＝CHCOO(CH₂)₂(CF₂)₈F) Co-oligomer with butyl acrylate, fluorine content: about 30 mass%, mass average molecular weight: about 3000)0.1g, 1.0g of a polymerization inhibitor (Q1301, manufactured by Wako pure chemical industries, Ltd.), and 65.0g of cyclohexanone.

The flask was placed at room temperature and protected from light, and stirred for 1 hour to homogenize the mixture. Then, 100g (solid content: 30g) of colloidal silica was gradually added to the flask while stirring the flask, and the mixture was further stirred for 1 hour while keeping the flask at room temperature and in the dark to homogenize the mixture. Then, 340g of cyclohexanone was added thereto, and the mixture was stirred for 1 hour in a state where the flask was placed at room temperature and protected from light, thereby obtaining a solution of a photocurable composition.

Next, the thickness was set to 500mm in length, 400mm in width, 0.3mm in plate thickness and 38X 10 in linear expansion coefficient^-7A1 st main surface of a glass substrate (Asahi glass company, AN100, alkali-free glass substrate) was coated with a photocurable composition by a spin coating method to form a resin layer for a polarizing plate comprising a photocurable composition having a thickness of 1 μm.

A mold made of quartz (mold area: 150mm in length. times. 130mm in width, fine uneven pattern area: 140mm in length. times.120 mm in width, groove pitch: 150nm, groove width: 50nm, groove depth: 100nm, groove length: 140mm, groove cross-sectional shape: rectangular) in which a plurality of grooves parallel to each other as a fine uneven pattern were formed at a predetermined pitch was pressed against a resin layer for a polarizing plate formed on the first main surface of the device substrate 1 at 25 ℃ and 0.5MPa (gauge pressure).

While keeping this state, a high-pressure mercury lamp (frequency: 1.5 kHz-2.0 kHz, main wavelength light: 255nm, 315nm and 365nm irradiation energy: 1000 mJ/cm) was irradiated from the back side of the quartz mold (the side opposite to the fine uneven pattern forming surface)²) The resin layer for polarizing plate was cured for 15 seconds, and a resin layer for polarizing plate having a plurality of ridges corresponding to the grooves of the quartz mold was produced (ridge pitch: 150nm, ridge width: 50nm, ridge height:100 nm). Then, the quartz mold was gradually peeled from the device substrate.

A series of steps consisting of pressing a quartz mold, light irradiation, and peeling the quartz mold are repeatedly performed on one device substrate. Fig. 6 is a schematic front view of a device substrate with a convex strip, in which a plurality of convex strips are formed on the 1 st main surface of one device substrate. The convex strips 61 are formed at 3 positions in the longitudinal direction and 3 positions in the transverse direction of the 1 st main surface 62a of the device substrate for a total of 9 positions. The gap Wp without the convex line 61 was 10 mm.

Thereafter, Al was deposited on the upper portions of the ridges formed on the 1 st main surface of the device substrate using a vacuum deposition apparatus (SEC-16 CM, manufactured by showa vacuum co.) capable of changing the inclination angle of the device substrate with respect to the deposition source, and thin metal wires were formed on the 1 st main surface of the device substrate, thereby obtaining a device substrate with a wire grid polarizer. Fig. 7 shows a schematic view of the vapor deposition method. An Al layer having a thickness of 25nm was formed on the upper portions of the ridges, and an Al layer having a width of 50nm and a thickness of 50nm was formed on the upper portions of the ridges, by vapor deposition from each of a direction V1 substantially orthogonal to the longitudinal direction of the ridges and having an angle of 30 degrees with respect to the height direction of the ridges on the 1 st side surface 76a side of the ridges, and a direction V2 substantially orthogonal to the longitudinal direction of the ridges and having an angle of 30 degrees with respect to the height direction of the ridges on the 2 nd side surface 76b side of the ridges.

Next, the steel sheet was measured for the length of 500mm, the width of 400mm, the sheet thickness of 0.4mm, and the linear expansion coefficient of 38X 10^-7On the 1 st main surface of a support substrate (manufactured by Asahi glass company, AN100), linear polyorganosiloxane having vinyl groups at both ends and methylhydrogenpolysiloxane having hydrosilyl groups in the molecule were mixed, and then mixed with a platinum-based catalyst to prepare a mixture, which was coated with a die coater in AN area of 498mm in length and 398mm in width (coating weight 20 g/m)²) And cured by heating at 180 ℃ for 30 minutes in the air to form a silicone resin layer having a thickness of 20 μm. Here, the mixing ratio of the linear polyorganosiloxane to the methylhydrogenpolysiloxane is adjusted so that the hydrogenated silyl groupThe molar ratio of alkyl groups to vinyl groups was 1/1. 5 parts by mass of a platinum-based catalyst was added to 100 parts by mass of the total of the linear polyorganosiloxane and the methylhydrogenpolysiloxane.

Next, the polarizing plate-forming surface of the device substrate with the wire grid polarizing plate and the surface of the silicone resin layer on the 1 st main surface of the support substrate were bonded to each other at room temperature by a vacuum press to obtain a laminate B (laminate of the present invention).

In the laminate B of example 2, the device substrate with a polarizing plate and the support substrate were tightly bonded to the silicone resin layer without causing air bubbles, and the laminate was smooth and free from a convex defect.

Example 3

Continuously molding a material having a linear expansion coefficient of 38X 10 by a melting method^-7A glass device substrate (manufactured by Asahi glass Co., Ltd., AN100, alkali-free glass substrate) having a thickness of 0.1mm and a width of 400mm was gradually cooled, and then a polyethylene film having a thickness of 30 μm was heat-sealed to both main surfaces of the device substrate. Then, the device substrate having a length of 50m was wound on a reel having a core diameter of 200mm, and formed into a roll shape. Next, the roll-shaped device substrate was set on a device substrate feeding section of a continuous WEB coater manufactured by toshiba mechanical corporation, and then the polyethylene film on the side to become the 1 st main surface was reheated by a heat roll, while continuously peeling the 1 st main surface and the surface of the polyethylene film, and then a resin for a polarizing plate composed of the photocurable composition was coated on the 1 st main surface (the surface on which the polyethylene film is not present) of the device substrate by a resin coating member for a polarizing plate.

A chrome-plated metal roller (450 mm in width and 250mm in diameter) was coated with 3 nickel molds (150 mm. times.400 mm in mold area, 120 mm. times.170 mm in pattern area, two patterns, 20mm in pattern area interval, 150nm in groove pitch, 50nm in groove width, 100nm in groove depth, 120mm in groove length, and rectangular in groove cross-sectional shape) having a plurality of grooves parallel to each other formed at predetermined intervals on the curved surface of the metal roller at intervals of 61mm, and a gravure roller was manufactured. The device substrate is pressed in the direction of the gravure roll by using a nip roll so that the grooves on the curved surface of the gravure roll are in contact with the resin layer for polarizing plates formed on the 1 st main surface of the device substrate. The ambient temperature during pressing was 25 ℃.

While keeping this pressed state, a high-pressure mercury lamp (frequency: 1.5 kHz-2.0 kHz, main wavelength light: 255nm, 315nm and 365nm irradiation energy: 1000 mJ/cm) was continuously irradiated from the polyethylene film side (the 2 nd main surface side of the device substrate)²) The resin layer for polarizing plate was cured to produce a resin layer for polarizing plate having ridges corresponding to the grooves of the nickel mold (ridge pitch: 150nm, ridge width: 50nm, ridge height: 100 nm). After the nickel mold was peeled off from the device substrate using a peeling roller, the device substrate was taken up on a take-up roller. On the 1 st main surface of the rolled device substrate, convex strips were formed at two positions in the width direction of the device substrate at intervals of 30mm, and convex strips were continuously formed in the longitudinal direction at intervals of 30 mm.

The rolled device substrate was set in the feeding section of a continuous vapor deposition device, and Al was continuously vapor deposited at a vapor deposition angle of 25 degrees to 30 degrees, thereby forming an Al layer 50nm wide and 50nm thick on the upper portions of the ridges. Through the above steps, the wire grid type polarizing plate was continuously formed on the 1 st main surface of the thin plate glass substrate.

The device substrate on which the wire grid type polarizing plate was continuously formed was cut at intervals of 750mm in length to obtain a sheet-like device substrate with a wire grid type polarizing plate having a length of 750mm, a width of 400mm, and a thickness of 0.1 mm.

Then, the thickness was set to 760mm in length, 405mm in width, 0.6mm in plate thickness, and 38X 10 in linear expansion coefficient^-7A linear polyorganosiloxane having vinyl groups at both ends and a methylhydrogenpolysiloxane having hydrosilyl groups in the molecule were mixed with the first main surface 1 of a glass support substrate (manufactured by Asahi glass Co., Ltd., AN100, alkali-free glass substrate)/° C, and then mixed with a platinum-based catalystTo prepare a mixture, which was coated on an area of 757mm in length and 402mm in width by means of a die coater (coating amount: 20 g/m)²) And cured by heating at 180 ℃ for 30 minutes in the air to form a silicone resin layer having a thickness of 20 μm. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogenpolysiloxane was adjusted so that the molar ratio of the hydrosilyl group to the vinyl group was 1/1. 5 parts by mass of a platinum-based catalyst was added to 100 parts by mass of the total of the linear polyorganosiloxane and the methylhydrogenpolysiloxane.

Next, the polarizing plate-forming surface of the device substrate with the wire grid polarizing plate and the surface of the silicone resin layer on the 1 st main surface of the support substrate were bonded to each other at room temperature by a vacuum press to obtain a laminate C (laminate of the present invention).

In the laminate C of example 3, the device substrate with a polarizing plate and the support substrate were tightly bonded to the silicone resin layer without causing air bubbles, and the laminate was smooth and free from a convex defect.

Example 4

In the same manner as in example 2 except that the photocurable composition was replaced with a heat-resistant silicone resin (FX-V550 manufactured by ADEKA corporation), ridges were formed on the 1 st main surface of the device substrate at 3 positions in the vertical direction and 3 positions in the horizontal direction at intervals of 10mm, with no ridges formed therebetween.

Then, the device substrate and the support substrate were bonded to each other in the same manner as in example 2, to obtain a laminate D (laminate of the present invention).

In the laminate D of example 4, the device substrate with a polarizing plate and the support substrate were tightly bonded to the silicone resin layer without causing air bubbles, and the laminate was smooth and free from a convex defect.

Example 5

In this example, a liquid crystal display device was manufactured using the laminate B, D obtained in examples 2 and 4.

The laminate D is prepared and supplied to the array formation step to form an array on the 2 nd main surface of the device substrate. On the other hand, the laminate B is supplied to the color filter formation step to form a color filter on the 2 nd main surface of the device substrate. The laminate D having the array formed thereon and the laminate B having the color filter formed thereon are bonded together with a sealing material to obtain a display panel with a support. The polarizing axes of the polarizing plates of the laminate D and the laminate B are designed in advance to be an appropriate combination. Then, the support bodies (support substrates) fixed to both main surfaces of the display device panel with the support bodies are peeled off. The peeling method is a method of peeling the support substrate while spraying a mixed fluid of compressed air and water to the boundary between the resin layer and the thin plate laminate on each of the two main surfaces. No scratch which causes a decrease in strength was observed on the surface of the device substrate after peeling. Further, scratches that cause a reduction in display performance are not visible on the polarizer.

Next, the device substrate from which the support substrate was peeled was cut into 54 elements each having a length of 51mm × 38mm, and then a liquid crystal injection step and an injection port sealing step were performed to form a liquid crystal element. Then, a module forming process is performed to obtain a liquid crystal display device. No problem in characteristics occurs in the liquid crystal display device thus obtained.

Example 6

In this example, an extremely thin liquid crystal display device was manufactured using the laminate C obtained in example 3.

Two laminates C are prepared, and supplied one by one to the array forming step to form an array on the 2 nd main surface of the device substrate. The remaining one is supplied to the color filter forming process to form a color filter on the 2 nd main surface of the device substrate. The laminate having the array formed thereon and the laminate having the color filter formed thereon are bonded together with a sealing material while aligning the polarization axes of the polarizing plates, thereby obtaining a panel for a display device with a support. Thereafter, the support members (support substrates) adhered to both main surfaces of the display device panel with the support members are peeled off. The peeling method is a method of peeling the support substrate while spraying a mixed fluid of compressed air and water to the boundary between the resin layer and the thin plate laminate on each of the two main surfaces. No scratch which causes a decrease in strength was observed on the surface of the device substrate after peeling. Further, scratches that cause a reduction in display performance are not visible on the polarizer.

After that, the device substrate from which the support substrate was peeled was cut into 64 elements each having a length of 51mm × 38mm, and then a liquid crystal injection step and an injection port sealing step were performed to form a liquid crystal element. Then, a module forming process is performed to obtain an extremely thin liquid crystal display device. The extremely thin liquid crystal display device thus obtained does not have a problem in characteristics.

Example 7

In this example, a liquid crystal display device was manufactured using the laminate a obtained in example 1.

Two laminates a are prepared, and supplied one by one to the array forming step to form an array on the 2 nd main surface of the device substrate. On the other hand, the other laminate a is supplied to the color filter forming process to form a color filter on the 2 nd main surface of the device substrate. The laminate having the array formed thereon and the laminate having the color filter formed thereon are bonded together with a sealing material while aligning the polarization axes of the polarizing plates, thereby obtaining a panel for a display device with a support. Thereafter, the support members (support substrates) adhered to both main surfaces of the display device panel with the support members are peeled off. The peeling method is a method of peeling the support substrate while spraying a mixed fluid of compressed air and water to the boundary between the resin layer and the thin plate laminate on each of the two main surfaces. No scratch which causes a decrease in strength was observed on the surface of the device substrate after peeling. Further, scratches that cause a reduction in display performance are not visible on the polarizer.

After that, the device substrate from which the support substrate was peeled was divided into 6 elements each having a vertical dimension of 51mm × a horizontal dimension of 38mm, and then a liquid crystal injection step and an injection port sealing step were performed to form a liquid crystal element. Then, a module forming process is performed to obtain a liquid crystal display device. No problem in characteristics occurs in the liquid crystal display device thus obtained.

Example 8

The linear expansion coefficient used as the substrate of the device is 700 x 10^-7A film base material of cycloolefin polymer (ZEONORFilm ZF14, manufactured by ZEON corporation, japan) having a thickness of 0.1mm and a width of 400mm, a roll of the film base material was set on a device substrate delivery part of a continuous WEB coater manufactured by toyoko mechanical corporation, and a resin for polarizing plate composed of the above-mentioned photocurable composition was coated on the 1 st main surface of a sheet glass substrate by a resin coating member for polarizing plate.

A chrome-plated metal roller (450 mm in width and 250mm in diameter) was coated with 3 nickel molds (150 mm. times.400 mm in mold area, 120 mm. times.170 mm in pattern area, two patterns, 20mm in pattern area interval, 150nm in groove pitch, 50nm in groove width, 100nm in groove depth, 120mm in groove length, and rectangular in groove cross-sectional shape) having a plurality of grooves parallel to each other formed at predetermined intervals on the curved surface of the metal roller at intervals of 61mm, and a gravure roller was manufactured. The film base was pressed in the direction of the gravure roll by using a nip roll so that the grooves on the curved surface of the gravure roll were in contact with the resin layer for polarizing plate formed on the 1 st major surface of the film base. The ambient temperature during pressing was 25 ℃.

While keeping this pressed state, a high-pressure mercury lamp (frequency: 1.5 kHz-2.0 kHz, main wavelength light: 255nm, 315nm and 365nm irradiation energy: 1000 mJ/cm) was continuously irradiated from the 2 nd main surface side of the film base material²) Using a resin for polarizing plateThe layer was cured to prepare a resin layer for polarizing plate having ridges corresponding to the grooves of the nickel mold (ridge pitch: 150nm, ridge width: 50nm, ridge height: 100 nm). After the nickel mold was peeled from the film base material using a peeling roll, the film base material was wound around a winding roll. On the 1 st main surface of the film base material wound in a roll shape, ridges are formed at two positions in the width direction of the film base material at intervals of 30mm, and ridges are continuously formed in the longitudinal direction at intervals of 30 mm.

The rolled film substrate was mounted on a feeding section of a continuous vapor deposition apparatus, and Al was continuously vapor deposited at a vapor deposition angle of 25 to 35 degrees, thereby forming an Al layer 50nm wide and 50nm thick on the ridges. Through the above steps, a wire grid type polarizing plate was continuously formed on the 1 st main surface of the film substrate.

The film base material on which the wire grid type polarizing plate was continuously formed was cut at intervals of 750mm in length to obtain a sheet-like device substrate with a wire grid type polarizing plate having a length of 750mm, a width of 400mm and a thickness of 0.1 mm.

Then, the thickness was set to 760mm in length, 405mm in width, 0.6mm in plate thickness, and 700X 10 in linear expansion coefficient^-7On the 1 st main surface of a support substrate (zeonorsleet 1020R, manufactured by ZEON corporation, japan), linear polyorganosiloxane having vinyl groups at both ends and methylhydrogenpolysiloxane having hydrosilyl groups in the molecule were mixed, and then mixed with a platinum-based catalyst to prepare a mixture, which was coated with a die coater in an area of 757mm in length and 402mm in width (coating amount 20 g/m)²) And heat-cured at 120 ℃ for 60 minutes in the atmosphere to form a silicone resin layer having a thickness of 20 μm. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogenpolysiloxane was adjusted so that the molar ratio of the hydrosilyl group to the vinyl group was 1/1. 5 parts by mass of a platinum-based catalyst was added to 100 parts by mass of the total of the linear polyorganosiloxane and the methylhydrogenpolysiloxane.

Next, the polarizing plate-forming surface of the device substrate with the wire grid polarizing plate and the surface of the silicone resin layer on the 1 st main surface of the support substrate were bonded to each other at room temperature by a vacuum press to obtain a laminate E (laminate of the present invention).

In the laminate E of example 8, the device substrate with a polarizing plate and the support substrate were tightly bonded to the silicone resin layer without causing air bubbles, and the laminate was smooth and free from a convex defect.

Example 9

In this example, an extremely thin liquid crystal display device was manufactured using the laminate E obtained in example 8.

Two laminates E are prepared, and supplied one by one to the array forming step to form an array on the 2 nd main surface of the device substrate. The remaining one is supplied to the color filter forming process to form a color filter on the 2 nd main surface of the device substrate. The laminate having the array formed thereon and the laminate having the color filter formed thereon are bonded together with a sealing material while aligning the polarization axes of the polarizing plates, thereby obtaining a panel for a display device with a support. Thereafter, the support members (support substrates) adhered to both main surfaces of the display device panel with the support members are peeled off. The peeling method is a method of peeling the support substrate while spraying a mixed fluid of compressed air and water to the boundary between the resin layer and the thin plate laminate on each of the two main surfaces. No scratch which causes a decrease in strength was observed on the surface of the device substrate after peeling. In addition, scratches that cause a reduction in display performance are not visible on the polarizer.

After that, the device substrate from which the support substrate was peeled was cut into 64 elements each having a length of 51mm × 38mm, and then a liquid crystal injection step and an injection port sealing step were performed to form a liquid crystal element. Then, a module forming process is performed to obtain an extremely thin liquid crystal display device. The extremely thin liquid crystal display device thus obtained does not have a problem in characteristics.

Comparative example

The steel sheet had a length of 170mm, a width of 100mm, a sheet thickness of 0.7mm and a linear expansion coefficient of 38X 10^-7A device substrate having a wire grid type polarizing plate on which fine Al metal wires were formed (pitch Pm: 200nm, width Dm: 100nm, height Hm: 200nm) was obtained in the same manner as in example 1 for a glass device substrate of/° C (Asahi glass company, AN100, alkali-free glass substrate).

Two device substrates each having a thickness of 0.7mm and formed with the wire grid type polarizing plate were used, and supplied one by one to the array forming step, and an array was formed on the main surface of the device substrate on which no wire grid was formed. The remaining one is supplied to the color filter forming process, and a color filter is also formed on the main surface of the device substrate on which the wire grid is not formed. The device substrate on which the array is formed and the device substrate on which the color filter is formed are bonded via a sealing material while aligning the orientation of the polarization axis of the polarizing plate, thereby obtaining a panel for a display device with a support. On the surface of the panel, the rise position of the haze value (fogging) due to contact with the conveying roller or the metal tray in the array forming step and the color filter forming step is seen scattered. This is a phenomenon caused by scratches on the wire grid type polarizer, and when used in a display device, it is a disadvantage that a significant display defect is caused.

The present invention has been described in detail with reference to specific embodiments, but it will be apparent to those skilled in the art that various changes or modifications can be made without departing from the spirit and scope of the invention.

The present application is based on japanese patent application 2009-025025, filed on 2/5/2009, and the contents thereof are incorporated herein by reference.

Industrial applicability

The laminate obtained by the present invention can provide a laminate with a polarizing plate that can produce a display device thinner than conventional display devices.

Description of the reference numerals

10. A laminate with a polarizing plate (laminate of the present invention); 11. a reflective polarizer; 12. 32, 42, 72, a device substrate; 12a, 32a, 42a, 62a, the device substrate 1 st major surface; 12b, the 2 nd main surface of the device substrate; 13. a support substrate; 13a supporting substrate 1 st main surface; 13b, a main surface of the support substrate 2; 14. a resin layer; 35. a thin metal wire; 46. 61, 76, ribs; 47. a film composed of a metal material; 51. a device substrate supply unit; 51a, a device substrate delivery roller; 51b, protective film peeling roller; 51c, a protective film take-up roll; 52. a resin coating member for polarizing plate; 52a, a polarizing plate resin supply source; 52b, a coating head; 52c, coating roller; 52d, a pipe; 52e, a pump; 53. rolling; 54. a gravure roll; 55. a resin-cured member for polarizing plates; 56. a peeling roller; 57. a winding member; 76a, the 1 st side of the convex strip; 76b, the 2 nd side of the convex strip; dm, width of the metallic thin wire; pm, the spacing of the metal thin wires; hm, height of the metal thin wire; lm, length of the metallic thin wire; v1, V2, evaporation direction; wp, gap; xa, longitudinal arrow; xb, transverse arrow.

Claims (12)

1. A laminated body with a polarizer, the laminated body has: a device substrate having a first major surface and a second major surface; a support substrate having a first major surface and a second major surface; and A resin layer present between the first main surface of the device substrate and the first main surface of the support substrate; wherein, A reflective polarizer is present on the first main surface of the device substrate, and the surface of the device substrate on which the reflective polarizer is present is bonded to the resin layer by an adhesive force caused by van der Waals force between solid molecules, so that the above-mentioned The surface of the resin layer has peelability, The bonding force between the first main surface of the support substrate and the resin layer is relatively higher than the adhesion force. 2. The laminated body with a polarizing plate according to claim 1, wherein, The reflective polarizer described above is a wire grid polarizer. 3. The laminated body with a polarizing plate according to claim 2, wherein, The pitch Pm of the thin metal wires of the wire grid polarizer is 50-200 nm, and the ratio Dm/Pm of the width Dm of the thin metal wires to the pitch Pm is 0.1-0.6. 4. The laminated body with a polarizing plate according to any one of claims 1 to 3, wherein: The resin forming the resin layer is at least one resin selected from fluororesins, acrylic resins, polyolefin resins, polyurethane resins, and silicone resins. 5. The laminate with a polarizing plate according to any one of claims 1 to 3, wherein: The above-mentioned resin layer has a thickness of 5 to 50 μm. 6. The laminated body with a polarizing plate according to any one of claims 1 to 3, wherein: The device substrate and the support substrate are made of the same material, and a difference in coefficient of linear expansion between the device substrate and the support substrate is 150×10 ⁻⁷ /°C or less. 7. The laminated body with a polarizing plate according to any one of claims 1 to 3, wherein: The device substrate and the support substrate are made of different materials, and a difference in coefficient of linear expansion between the device substrate and the support substrate is 700×10 ⁻⁷ /°C or less. 8. A panel for a display device with a supporting substrate, wherein The panel for a display device with a support substrate includes the laminate with a polarizing plate according to any one of claims 1 to 7, wherein the laminate with a polarizing plate has a display device on the second main surface of the device substrate of the laminate with a polarizing plate. Use components. 9. A method for producing a laminate with a polarizing plate, which is the laminate with a polarizing plate according to any one of claims 1 to 7, wherein the laminate with a polarizing plate The manufacturing method has the following steps: A polarizer forming step of forming a reflective polarizer on the first main surface of the device substrate; A resin layer forming step of forming a resin layer having a peelable surface on the first main surface of the support substrate; a bonding step of laminating and press-bonding the above-mentioned device substrate with a reflective polarizer and the above-mentioned support substrate with a resin layer, and bonding the peelable surface of the above-mentioned resin layer to the surface of the device substrate on which the reflective polarizer is present. Surface close. 10. A method of manufacturing a panel for a display device with a support, wherein This method of manufacturing a panel for a display device with a support includes the steps of the manufacturing method according to claim 9 and forming a member for a display device on the second main surface of the device substrate of the obtained laminate with a polarizing plate. process. 11. A method of manufacturing a panel for a display device, wherein, This method of manufacturing a panel for a display device includes the steps of the manufacturing method according to claim 10 , and combining the surface of the device substrate on which the reflective polarizer is present in the obtained panel for a display device with a support with the resin. Peelable peelable surface peeling process of the layer. 12. A method of manufacturing a display device, wherein, This method of manufacturing a display device includes the steps of the manufacturing method described in claim 11 and the step of obtaining a display device using the obtained panel for a display device.