CN102346201B - Probe head of vertical probe card and manufacturing method thereof - Google Patents

Abstract

The invention discloses a probe head of a vertical probe card and a manufacturing method of a composite plate of the probe head. The composite board is formed by laminating a first layer board and a second layer board through fixed connection operation, and then drilling to manufacture a plurality of through holes penetrating through the first layer board and the second layer board. Therefore, the friction between the probe and the composite plate can be reduced, and the aim of stabilizing the needle position of the probe can be achieved.

Description

Probe head of vertical probe card and manufacturing method thereof

technical field

The invention relates to a probe card for electrical testing, more specifically, a probe head of a vertical probe card and a method for making the composite board thereof.

Background technique

The vertical probe card is mainly used in the testing of flip-chip packaged chips (Flip Chip), and the parallel testing of multi-chip (Multi-DUT) distributed around the pad (Pad). As shown in Figure 1, the vertical probe card The probe head (Probe Head) is set under the circuit board (not shown in the figure) to electrically conduct the electronic object under test and the circuit board at the upper and lower ends of the probe head. The probe head structure generally includes a The upper guide plate 1, the lower guide plate 2 and a plurality of probes 3 are supported and positioned by passing through the upper guide plate 1 and the lower guide plate 2, and are carefully arranged according to the densely packed electronic objects to be tested. When used in testing, the needle point 3 a of the probe 3 is aligned and contacts the electronic object 4 to be tested to achieve electrical conduction.

It is known that the upper and lower guide plates of the probe head of a vertical probe card are made of plastic material, because its thermal expansion coefficient is much higher than the thermal expansion coefficient of the electronic object 4 to be tested made of silicon as the main material, Therefore, in the process of electrical testing at high temperature or low temperature, due to the different degrees of thermal expansion of the materials, the deformation of the guide plate, especially the lower guide plate, is greater than the deformation of the electronic object 4 to be tested, which indirectly leads to the needle position of the probe 3 Offset occurs, and the situation that the electronic object 4 to be measured is no longer in alignment occurs.

The upper and lower guide plates of the probe head of another kind of vertical probe card are changed to be made of ceramic material, although the thermal expansion coefficient of the ceramic material is close to the thermal expansion coefficient of the electronic object 4 to be measured with silicon as the main material, and the above-mentioned The plastic guide plate is easy to cause the lack of needle position offset of the probe 3 when testing at high and low temperatures. However, the friction coefficient of the ceramic guide plate (especially the lower guide plate) is relatively large. When the probe card is used for the electrical test of the electronic object 4 During the process, the contact friction between the ceramic guide plate and the probe 3 resulted in dust generation, poor probe mobility and needle jamming. Therefore, the guide plate made of ceramic materials still has some imperfections.

Contents of the invention

The main purpose of the present invention is to provide a probe head of a vertical probe card, which has the functions of stabilizing the position of the probe, ensuring the mobility of the probe and avoiding needle jamming.

Another object of the present invention is to provide a composite board manufacturing method for the probe head of the vertical probe card, which is easy to process and easy to install.

For reaching above-mentioned purpose, technical solution of the present invention is:

A probe head for a vertical probe card, comprising:

a guide plate;

A composite plate is arranged under the guide plate, and includes a first laminate and a second laminate, and at least one perforation runs through the first laminate and the second laminate, wherein the first laminate the coefficient of friction of the plates is less than the coefficient of friction of the second ply, and the coefficient of thermal expansion of the second ply is less than the coefficient of thermal expansion of the first ply; and

At least one probe, one end is supported by the guide plate, the other end passes through the perforation of the composite plate, and the outer diameter of the probe is smaller than the perforation diameter of the composite plate.

In the probe head of the vertical probe card, the area of the first layer of the composite board is smaller than the area of the second layer.

In the probe head of the vertical probe card, a shallow groove area is formed on the surface of the second layer board of the composite board that is not covered by the first layer board.

In the probe head of the vertical probe card, the thickness of the first layer of the composite board is not greater than the thickness of the second layer.

In the probe head of the vertical probe card, the first layer of the composite board is made of plastic, and the second layer of the composite board is made of ceramic material.

A method for manufacturing a composite board of a probe head of a vertical probe card, comprising the following steps:

providing a first layer board;

providing a second ply, the coefficient of friction of the first ply is smaller than the coefficient of friction of the second ply, and the coefficient of thermal expansion of the second ply is smaller than the coefficient of thermal expansion of the first ply;

applying a fastening operation to cause the first ply and the second ply to be laminated to each other; and

A drilling operation is performed to make at least one perforation through the first layer and the second layer.

In the manufacturing method of the composite board of the probe head of the vertical probe card, the fixing operation is performed by locking.

The manufacturing method of the composite board of the probe head of the vertical probe card, the fixing operation is carried out by bonding.

A method for manufacturing a composite board of a probe head of a vertical probe card, comprising the following steps:

providing a ceramic substrate;

Coating a liquid plastic on the ceramic substrate, the liquid plastic solidifies to form a plastic layer, the plastic layer constitutes a first layer, and the ceramic substrate constitutes a second layer;

A drilling operation is performed to make at least one perforation through the first layer and the second layer.

The method for manufacturing the composite board of the probe head of the vertical probe card, the friction coefficient of the first layer board is smaller than the friction coefficient of the second layer board, and the thermal expansion coefficient of the second layer board is smaller than the thermal expansion coefficient of the first layer board .

The probe head of the vertical probe card and the manufacturing method thereof of the composite board of the present invention have a stable probe position and good mobility, and the composite board structure overcomes the defects of the prior art, and is easy to process, Easy to install.

Description of drawings

FIG. 1 is a schematic diagram of an existing vertical probe card;

Fig. 2 is the schematic diagram of vertical probe card of the present invention;

Figure 3 is similar to Figure 2, revealing that the first layer board and the second layer board are fastened in a locking manner;

Fig. 4 is similar to Fig. 2, revealing that the first layer board and the second layer board are fixed by bonding;

5 is a top view of another vertical probe card of the present invention;

Fig. 6 is a sectional view taken along line 6-6 in Fig. 5 .

Explanation of main component symbols

Probe Heads for 100 Probe Cards

10 guide plate

12 perforations

20 composite board

22 first layer board 23 first layer board 23a block

24 second layer board 24a shallow groove area 26 perforation

27 Locking parts 28 Viscose

30 probes

32 needle tip

A electronic object to be tested

Detailed ways

In order to illustrate the present invention more clearly, preferred embodiments are given and described in detail with accompanying drawings as follows. 2 is a schematic diagram of a probe head 100 of a vertical probe card according to a preferred embodiment of the present invention. The probe head 100 of the probe card includes a guide plate 10, a composite board 20 and a plurality of probes 30; wherein:

The guide plate 10 has a plurality of perforations 12 .

The composite plate 20 is arranged below the guide plate 10 in a fixed distance, and it includes a first layer plate 22 and a second layer plate 24 stacked, and the first layer plate 22 faces the guide plate 10, and the other , the composite board 20 further has a plurality of perforations 26 , and these perforations 26 pass through the first laminate 22 and the second laminate 24 . The manufacturing method of the above-mentioned composite board 20, in this embodiment, is to stack the first laminate 22 and the second laminate 24 on each other, and then undergo a fixing operation to promote the first laminate 22 and the second laminate 24 The firm bond is then followed by a drilling operation to make the perforations 26 . The aforesaid fastening operation as shown in FIG. 3 uses the locking member 27 to extend into the first laminate 22 and the second laminate 24 for fastening; and as shown in FIG. 4 by using glue 28 for bonding; Alternatively, the liquid plastic is coated on the ceramic substrate, and after being solidified to form an engineering plastic layer, the plastic layer is then flattened, and the plastic layer is the first layer of board; limit.

One end of the probe 30 passes through the through hole 12 of the guide plate 10, and is electrically connected to the circuit board (not shown) of the probe card, and the other end, that is, the needle point 32 passes through the through hole 26 of the composite board 20, and is used for alignment. and contact the electronic object A to be tested mainly made of silicon. It must be noted that the outer diameter of the probe 30 in this embodiment is slightly smaller than the diameter of the through hole 26 .

The above is the description of the basic structure of the probe head 100 of the probe card of this embodiment. Then, the structure for achieving stable probes to ensure the accuracy of electrical testing is described in detail as follows:

In this embodiment, the first laminate 22 is made of plastic, and the second laminate 24 is made of ceramic material. Each laminate has physical differences due to different material properties, for example, plastic The first layer plate 22, its coefficient of friction will be less than the friction coefficient of the second layer plate 24 made of ceramic material; another example, ceramic material is made of the second layer plate 24, its coefficient of thermal expansion will be smaller than that of plastics made of the first layer The coefficient of thermal expansion of the plate 22. In addition, it is preferable that the thickness of the first laminate 22 is less than or equal to the thickness of the second laminate 24 .

When the probe head 100 of the probe card of the present embodiment is used to electrically detect the electronic object A to be tested, since the coefficient of friction of the first laminate 22 made of plastic is less than that of the second laminate 24 made of ceramics, it can be improved. The probe 30 contacts and rubs against the dust on the first layer 22 to avoid poor probe mobility and needle jamming. Also, the influence of thermal expansion and contraction caused by temperature changes during the detection process, that is, the thermal expansion of the probe head 100 of the probe card and the electronic object A to be tested, although the first layer board 22 made of plastic may cause the probe However, the probe 30 will eventually be restrained by the ceramic second layer 24 having a thermal expansion coefficient close to that of the electronic object A to be tested, so that the needle position can be maintained and the needle tip 32 can be aligned The electronic object A to be tested, in other words, the deflection range of the probe 30 is limited by the aperture of the through hole 26 . Therefore, the probe head 100 of the probe card of this embodiment not only has no dust problem, but also ensures the accuracy of electrical testing.

In addition, in order to reduce the influence of the first layer made of plastic caused by heat on the ceramic second layer, the present invention can choose to make the area of the first layer smaller than the area of the second layer, as shown in the figure In the embodiment shown in 5 and 6, the first laminate 23 is divided into several blocks 23a that are fixed on the surface of the second laminate 24, and the second laminate 24 is on the surface that is not covered by these blocks 23a. Then, a shallow groove area 24a is formed, thereby reducing the influence of pulling deformation on the second laminate 24 when the plastic is deformed.

The above description is only the preferred feasible embodiment of the present invention, and any equivalent structure and manufacturing method changes made by applying the description of the present invention and the scope of the patent application should be included in the protection scope of the claims of the present invention.

Claims (9)

1. A probe head for a vertical probe card, characterized in that it comprises: a guide plate having at least one perforation; A composite plate is arranged under the guide plate, and includes a first laminate and a second laminate, and at least one perforation runs through the first laminate and the second laminate, wherein the first laminate The coefficient of friction of the plate is less than that of the second layer, and the coefficient of thermal expansion of the second layer is smaller than that of the first layer, the first layer faces the guide plate, and the second layer of the composite plate is ceramic material, the thickness of the first ply is not greater than the thickness of the second ply, and the composite ply laminates the first ply and the second ply firmly together; and At least one probe, one end of which passes through at least one through hole of the guide plate and is electrically connected to the circuit board of the probe card, and the other end passes through at least one through hole of the composite board for aiming at and contacting an electronic object to be tested , the outer diameter of the probe is smaller than the perforation diameter of the composite plate. 2 . The probe head of a vertical probe card according to claim 1 , wherein the area of the first layer of the composite board is smaller than the area of the second layer. 3 . 3 . The probe head of a vertical probe card according to claim 2 , wherein a shallow groove is formed on a surface of the second layer of the composite board that is not covered by the first layer. 4 . 4. The probe head of a vertical probe card according to claim 1, wherein the first layer of the composite board is made of plastic. 5. a composite board manufacturing method of the probe head of the vertical probe card as claimed in claim 1, is characterized in that, comprises the following steps: providing a first layer board; providing a second ply, the coefficient of friction of the first ply is smaller than the coefficient of friction of the second ply, and the coefficient of thermal expansion of the second ply is smaller than the coefficient of thermal expansion of the first ply; applying a fastening operation to cause the first ply and the second ply to be laminated to each other; and A drilling operation is performed to make at least one perforation through the first layer and the second layer. 6 . The method for manufacturing the composite board of the probe head of the vertical probe card according to claim 5 , wherein the fastening operation is performed by locking. 6 . 7 . The method for manufacturing the composite board of the probe head of the vertical probe card according to claim 5 , wherein the fixing operation is performed by bonding. 8 . 8. A composite board manufacturing method of the probe head of the vertical probe card as claimed in claim 1, characterized in that, comprising the following steps: providing a ceramic substrate; Coating a liquid plastic on the ceramic substrate, the liquid plastic solidifies to form a plastic layer, the plastic layer constitutes a first layer, and the ceramic substrate constitutes a second layer; A drilling operation is performed to make at least one perforation through the first layer and the second layer. 9. as claimed in claim 8, the composite board manufacturing method of the probe head of the vertical probe card is characterized in that, the coefficient of friction of the first laminate is less than the coefficient of friction of the second laminate, and the thermal expansion of the second laminate The coefficient is less than the coefficient of thermal expansion of the first ply.