CN102301436A - Electronic component and method of manufacturing same - Google Patents

Abstract

A multilayer electronic component wherein disconnection between a via hole conductor and coil electrodes can be prevented; and a method of manufacturing the same. The via hole conductor (B) is connected to a plurality of coil electrodes (18) and has a shape in which the area of one end part (t1) is larger than the area of the other end part (t2). A coil electrode (18a) is defined as a start electrode, a coil conductor (20) is defined as an end electrode, and coil electrodes (18b to 18e) other than the start electrode and end electrode are defined as intermediate electrodes. The start electrode is connected to the via hole conductor (B4), which is connected to the intermediate electrodes, by the larger end part (t1) of the same.

Description

Electronic component and manufacturing method thereof

technical field

The present invention relates to an electronic component and a manufacturing method thereof, and more particularly to an electronic component formed by laminating an insulating layer and a coil electrode and a manufacturing method thereof.

Background technique

Next, the structure of a conventional electronic component incorporating a coil will be described with reference to the drawings. FIG. 10 is a perspective view of a conventional electronic component 200 . FIG. 11 is an exploded perspective view of a laminated body 202 of a conventional electronic component 200 .

As shown in FIG. 10 , electronic component 200 includes a rectangular parallelepiped laminated body 202 including a coil inside, and two external electrodes 212 a and 212 b formed on opposing side surfaces of laminated body 202 .

The laminated body 202 is formed by laminating a plurality of coil electrodes and a plurality of magnetic layers. Specifically, as follows. As shown in FIG. 11, the laminated body 202 is made of a plurality of magnetic layers 204a to 204f, 206a made of ferrite (for example, Ni-Zn-Cu ferrite or Ni-Zn ferrite, etc.) ~ 206d are stacked to form. Coil electrodes 208a to 208f constituting a coil are formed in the magnetic layers 204a to 204f. In addition, via-hole conductors B51 to B55 are formed in the magnetic layers 204a to 204e. Via-hole conductors B51 to B55 are formed, for example, by irradiating laser light to form via holes, and filling the via holes with conductors. Therefore, as shown in FIG. 10 , via-hole conductors B51 to B55 have a relatively large area at one end and a relatively small area at the other end.

The coil electrodes 208a to 208f are electrodes having a U-shaped shape and a length of 3/4 turn. Via-hole conductors B51 to B55 are respectively provided at one ends of the coil electrodes 208a to 208e, and penetrate through the magnetic layers 204a to 204e in the vertical direction. Coil electrodes 208a to 208f are connected to each other via via-hole conductors B51 to B55 to form a spiral coil. Furthermore, the coil electrodes 208a and 208f formed on the uppermost and lowermost sides in the stacking direction are respectively provided with extraction electrodes 210a and 210b. The lead-out electrodes 210a, 210b realize the function of connecting the coil with the external electrodes 212a, 212b.

In the conventional electronic component 200 configured as described above, there is a problem that disconnection easily occurs between the coil electrode 208f and the via-hole conductor B55.

As shown in FIG. 11, the length of the coil electrode 208f is longer than the length of the coil electrode 208a. Therefore, when a current flows through the coil, the amount of heat generated on the coil electrode 208f is larger than the amount of heat generated on the coil electrode 208a. And the end part of the side with a small area of via-hole conductor B55 is connected to 208 f of coil electrodes. Therefore, heat is generated intensively particularly at the connection portion between the coil electrode 208f and the via-hole conductor B55. As a result, disconnection easily occurs between the coil electrode 208f and the via-hole conductor B55.

In addition, Patent Document 1 describes a multilayer electronic component in which the uppermost coil conductor and the lowermost coil conductor have the same shape. However, in Patent Document 1, there is no mention about the problem of disconnection at the connecting portion of the via conductor and the coil conductor.

Patent Document 1: Japanese Patent Laid-Open No. 2005-167130

Contents of the invention

Therefore, the object of this invention is to provide the electronic component which can prevent the disconnection between a via-hole conductor and a coil electrode, and its manufacturing method.

An electronic component according to an embodiment of the present invention is characterized in that:

have:

a plurality of coil electrodes forming a coil;

a plurality of insulating layers which are laminated together with the plurality of coil electrodes to form a laminate;

two external electrodes, which are arranged on the surface of the above-mentioned laminate;

two connection parts, which connect the above-mentioned coil and the above-mentioned two external electrodes; and

a via-hole conductor which connects the plurality of coil electrodes and has a shape in which one end has a larger area than the other end,

Among the coil electrodes arranged at both ends of the stacking direction, the coil electrode with a relatively large DC resistance value between the connected via-hole conductor and the connecting part is defined as a starting terminal electrode, and the connected via-hole conductor is defined as a starting electrode. The coil electrode having a relatively small DC resistance value between the conductor and the connecting portion is defined as an end electrode, and when the coil electrodes other than the start electrode and the end electrode are defined as intermediate electrodes,

The said start electrode is connected to the said via-hole conductor connected to the said intermediate electrode via the said one end part.

In the electronic component, the terminal electrode may have a length equal to or greater than the number of turns obtained by subtracting the number of turns of the intermediate electrode from one turn, and may be connected to the intermediate electrode via the other end portion and the via hole. conductor connection.

In the above electronic component, the via conductor connecting the terminal electrode and the intermediate electrode may be formed integrally with the terminal electrode in the insulating layer.

In the electronic component described above, the terminal electrode may overlap the via conductor connected to the intermediate electrode when viewed in plan from the stacking direction.

In the above electronic component, the via conductor connecting the start electrode and the intermediate electrode may be formed integrally with the start electrode in the insulating layer.

In the above electronic component, when the direction from the terminal electrode toward the start electrode is defined as the first direction, in each of the via-hole conductors, the one end portion may be located closer to the other end portion. First direction to one side.

In the electronic component described above, the terminal electrode may be configured to be connectable to the via-hole conductor at a plurality of places.

In the electronic component described above, the terminal electrode may have a shape in which a portion connectable to the via-hole conductor is wider than other portions.

In the above electronic component, the via conductor connecting the terminal electrode and the intermediate electrode may be connected to a portion other than both ends of the terminal electrode.

In the above electronic component, the connection portion may be a via conductor.

In the above-mentioned electronic component, the connection portion may be a lead-out electrode provided on the insulator and connected to the start electrode or the end electrode, respectively.

The manufacturing method of the above-mentioned electronic component is characterized by comprising:

A step of forming the above-mentioned via-hole conductor on the above-mentioned insulating layer;

A step of forming the connecting portion on the insulating layer;

A step of forming the above-mentioned starting terminal electrode and the above-mentioned intermediate electrode on the above-mentioned insulating layer;

A step of forming the terminal electrode on the insulating layer; and

The insulating layer formed with the start electrode, the insulating layer formed with the terminal electrode, and the insulating layer formed with the intermediate electrode are laminated to form a laminate such that the intermediate electrode is positioned between the start electrode and the terminal. process between electrodes.

In the manufacturing method of the said electronic component, the process of forming the said via-hole conductor and the process of forming the said start electrode and the said intermediate electrode may be performed simultaneously.

Invention effect

According to the present invention, disconnection between via-hole conductors and coil electrodes can be prevented.

Description of drawings

FIG. 1 is an external perspective view of an electronic component according to one embodiment of the present invention.

Fig. 2 is an exploded perspective view of the laminated body of the electronic component in Fig. 1 .

3 is an exploded perspective view of a laminated body of electronic components when the number of turns of the coil is changed.

FIG. 4 is a perspective view of the electronic component in FIG. 1 viewed from the y-axis direction.

Fig. 5 is an exploded perspective view of a conventional electronic component laminate.

Fig. 6 is an exploded perspective view of a conventional electronic component laminate.

Fig. 7 is a perspective view of a conventional electronic component seen from the y-axis direction.

Fig. 8 is a diagram showing a coil electrode fabricated on a ceramic green sheet in an experiment.

FIG. 9 is a diagram showing a modified example of a coil electrode.

Fig. 10 is a perspective view of a conventional electronic component.

Fig. 11 is an exploded perspective view of a conventional electronic component laminate.

Detailed ways

Next, an electronic component and its manufacturing method according to one embodiment of the present invention will be described. This electronic component is applied to, for example, inductors, resistors, LC filters, and LC filter arrays.

(Structure of Electronic Components)

First, the configuration of an electronic component according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of an electronic component 10 according to one embodiment of the present invention. FIG. 2 is an exploded perspective view of the laminated body 12 of the electronic component 10 in FIG. 1 . Hereinafter, the stacking direction of the laminated body 12 is defined as the z-axis direction, and the directions perpendicular to the z-axis direction are defined as the x-axis direction and the y-axis direction. The x-axis direction and the y-axis direction are parallel to the sides of the laminated body 12 .

As shown in FIG. 1 , the electronic component 10 includes a laminated body 12 and external electrodes 14a and 14b. The laminated body 12 has a rectangular parallelepiped shape and includes a coil L inside. The external electrodes 14a and 14b are provided on both ends of the laminated body 12 in the z-axis direction, and are connected to the coil L. As shown in FIG.

The laminated body 12 is formed by laminating together a plurality of coil electrodes and a plurality of insulating layers. Specifically, as follows. As shown in FIG. 2, the laminated body 12 is formed by a plurality of magnetic layers 16a to 16l made of ferromagnetic ferrite (for example, Ni-Zn-Cu ferrite or Ni-Zn ferrite, etc.) The positive direction to the negative direction of the z-axis direction are stacked so as to be arranged sequentially. The plurality of magnetic layers 16 a to 16 l are insulating layers each having substantially the same area and the same rectangular shape. Coil electrodes 18a to 18e and 20 constituting the coil L are provided on the main surfaces of the magnetic layers 16d to 16i, respectively. And the via-hole conductors B1-B12 are provided in the magnetic body layers 16a-16l, respectively. In addition, a dielectric or an insulator may be used instead of the magnetic layers 16 a to 16 l made of ferrite. Hereinafter, when referring to individual magnetic layers 16a to 16l and coil electrodes 18a to 18e, letters are appended after the reference symbols, and when collectively referring to the magnetic layers 16a to 16l and coil electrodes 18a to 18e, the letters after the reference symbols are omitted. . In addition, when showing individual via-hole conductors B1-B12, the number after B is attached, and when referring to via-hole conductors B1-B12 collectively, the number after B is abbreviate|omitted.

Each of the coil electrodes 18 and 20 is a conductive material made of Ag, and has a shape in which a ring is partially cut away. In this embodiment, the coil electrodes 18 and 20 have a U-shape. Accordingly, each of the coil electrodes 18 and 20 constitutes an electrode having a length of 3/4 turn. In addition, the coil electrodes 18 and 20 may be made of a conductive material such as a noble metal mainly composed of Pd, Au, Pt, or an alloy of these metals. In addition, the coil electrodes 18 and 20 may have a shape obtained by cutting out a part of a circle or an ellipse. Next, the respective configurations of the coil electrodes 18a to 18e and 20 will be described.

The coil electrode 18a is provided on the magnetic body layer 16d which is arrange|positioned on the side of the most positive direction in the z-axis direction among the magnetic body layers 16d-16i, and is called a start-end electrode. Coil electrode 18a has the same number of turns as coil electrodes 18b to 18e. One end of the coil electrode 18a is provided with a contact portion C1 and the other end of the coil electrode 18a is provided with a contact portion C2. The contact part C1 is electrically connected to the external electrode 14a via via-hole conductors B1-B3. Therefore, the contact part C1 is provided in the position overlapped with the via-hole conductors B1-B3 when it planarly views in z axial direction. Moreover, in order to connect contact part C1 and via-hole conductor B3 easily, contact part C1 is formed wider than the other part of coil electrode 18a. In order to facilitate connection of the contact part C2 and the via-hole conductor B4, the contact part C2 is formed wider than the other part of the coil electrode 18a, and is integrally formed with the via-hole conductor B4.

The coil electrode 18b is provided on the magnetic layer 16e, and is called an intermediate electrode. A contact portion C3 is provided at one end of the coil electrode 18b, and a contact portion C4 is provided at the other end of the coil electrode 18b. In order to facilitate connection between the contact portion C3 and the via-hole conductor B4 when the magnetic layer 16d and the magnetic layer 16e are laminated, the contact portion C3 is formed wider than the other portions of the coil electrode 18b. Moreover, in order to facilitate connection of contact part C4 and via-hole conductor B5, contact part C4 is formed wider than the other part of coil electrode 18b, and is integrally formed with via-hole conductor B5.

The coil electrode 18c is provided on the magnetic layer 16f and is called an intermediate electrode. A contact portion C5 is provided at one end of the coil electrode 18c, and a contact portion C6 is provided at the other end of the coil electrode 18c. In order to facilitate connection between the contact portion C5 and the via-hole conductor B5 when the magnetic layer 16e and the magnetic layer 16f are laminated, the contact portion C5 is formed wider than the other portions of the coil electrode 18c. Moreover, in order to facilitate connection of the contact part C6 and the via-hole conductor B6, the contact part C6 is formed wider than the other part of the coil electrode 18c, and is integrally formed with the via-hole conductor B6.

The coil electrode 18d is provided on the magnetic layer 16g, and is called an intermediate electrode. A contact portion C7 is provided at one end of the coil electrode 18d, and a contact portion C8 is provided at the other end of the coil electrode 18d. In order to facilitate connection between the contact portion C7 and the via-hole conductor B6 when the magnetic layer 16f and the magnetic layer 16g are laminated, the contact portion C7 is formed wider than the other portions of the coil electrode 18d. Moreover, in order to facilitate connection of the contact part C8 and the via-hole conductor B7, the contact part C8 is formed wider than the other part of 18 d of coil electrodes, and is integrally formed with the via-hole conductor B7.

The coil electrode 18e is provided on the magnetic layer 16h, and is called an intermediate electrode. A contact portion C9 is provided at one end of the coil electrode 18e, and a contact portion C10 is provided at the other end of the coil electrode 18e. In order to facilitate connection between the contact portion C9 and the via-hole conductor B7 when the magnetic layer 16g and the magnetic layer 16h are laminated, the contact portion C9 is formed wider than the other portions of the coil electrode 18e. Moreover, in order to facilitate connection of the contact part C10 and the via-hole conductor B8, the contact part C10 is formed wider than the other part of the coil electrode 18e, and is integrally formed with the via-hole conductor B8.

The coil electrode 20 is provided on the magnetic body layer 16i arrange|positioned on the side of the most negative direction in the z-axis direction among the magnetic body layers 16d-16i, and is called an end electrode. The coil electrode 20 has a length equal to or greater than the number of turns obtained by subtracting the number of turns of the intermediate electrodes, that is, the coil electrodes 18b to 18e from one turn (herein, in this embodiment, the number of turns of the coil electrode 20 is the same as that of the coil electrodes 18b to 18e). 18e has the same number of turns). One end of the coil electrode 20 is provided with a contact portion C11 and the other end of the coil electrode 20 is provided with a contact portion C14. Furthermore, the coil electrode 20 has contact part C12, C13 in order to be able to connect with via-hole conductor B at several places. More specifically, the coil electrode 18 is U-shaped, and can be connected to the via-hole conductor B at the four corners. Thereby, the coil electrode 20 has contact part C11-C14 in four corner parts, and can be connected with the via-hole conductor B provided in these four corner parts.

In order to facilitate connection between the contact portion C13 and the via-hole conductor B8 when the magnetic layer 16h and the magnetic layer 16i are laminated, the contact portion C13 is formed wider than the other portions of the coil electrode 20 . The contact part C14 is electrically connected to the external electrode 14b via the via-hole conductors B9-B12. Therefore, the contact part C14 is provided in the position overlapped with the via-hole conductors B9-B12 when it planarly views in z axial direction. Moreover, in order to facilitate connection of the contact part C14 and the via-hole conductor B9, the contact part C14 is formed wider than the other part of the coil electrode 20, and is integrally formed with the via-hole conductor B9. In addition, in order to facilitate connection between the contact portions C11 and C12 and the via-hole conductor B, the contact portions C11 and C12 are formed wider than the other portions of the coil electrode 20 . Hereinafter, when referring to individual contacts C1 to C14 , numerals are appended after C, and when collectively referring to the contacts C1 to C14 , numerals following C are omitted.

As described above, in the electronic component 10, the coil L is formed of the following electrodes, that is, the start end electrode (coil electrode 18a) located at one end on the positive side in the z-axis direction, and the electrode located at the negative side in the z-axis direction. An end electrode (coil electrode 20 ) at one end, and four types of intermediate electrodes (coil electrodes 18 b to 18 e ) other than the start end electrode and the end electrode. In addition, when the number of turns of the coil L is to be adjusted, an appropriate coil electrode 18 among the coil electrodes 18b to 18e that is the intermediate electrode may be inserted between the coil electrode 20 that is the end electrode and the coil electrode 18e that is the intermediate electrode. . Specifically, as follows. FIG. 3 is an exploded perspective view of the laminated body 12 of the electronic component 10 when the number of turns of the coil L is changed.

For example, in order to increase the number of turns of the coil L of the laminated body 12 shown in FIG. 2 by only one turn, as shown in FIG. What is necessary is just to provide the magnetic body layer 16m provided with the via-hole conductor B13. Magnetic body layer 16m, coil electrode 18f, and via-hole conductor B13 have the same structure as magnetic body layer 16e, coil electrode 18b, and via-hole conductor B5. Thus, the number of turns of the coil can be changed.

When the magnetic body layer 16m is not inserted as shown in FIG. 2, the contact part C13 is used for connection with the via-hole conductor B8. When inserting the magnetic body layer 16m as shown in FIG. 3, the contact part C12 is used for the connection with the via-hole conductor B13. In this way, the coil electrode 20 overlaps the via-hole conductors B connected to the coil electrodes 18e and 18f which are intermediate electrodes in a planar view in the z-axis direction, so that the coil electrode 20 has a configuration that can be connected to either of the coil electrodes 18e and 18f. Furthermore, the coil electrode 20 overlaps the via-hole conductor B connected to the coil electrode 18c which is an intermediate electrode in a planar view in the z-axis direction, and the coil electrode 20 also has a configuration that can be connected to the coil electrode 18c.

Next, the via-hole conductor B will be described. FIG. 4 is a perspective view of the electronic component 10 seen from the y-axis direction. As shown in FIG. 2 , the via-hole conductor B is arranged to penetrate the magnetic layer 16 in the z-axis direction. As shown in FIG. 4 , when viewed from the y-axis direction, the via-hole conductor B has an area ratio The other end t2 has a large area. More specifically, the area of the end portion t1 located on the positive side in the z-axis direction is larger than the area of the end portion t2 located on the negative side in the z-axis direction. The connection relationship of each via-hole conductor B is demonstrated below.

Via-hole conductors B1 to B3 are connected so as to be aligned on a straight line in the z-axis direction. The end part t2 of the via-hole conductor B3 is connected to the coil electrode 18a. The end part t1 of the via-hole conductor B4 is connected to the coil electrode 18a, and the end part t2 of the via-hole conductor B4 is connected to the coil electrode 18b. The end part t1 of the via-hole conductor B5 is connected to the coil electrode 18b, and the end part t2 of the via-hole conductor B5 is connected to the coil electrode 18c. The end part t1 of the via-hole conductor B6 is connected to the coil electrode 18c, and the end part t2 of the via-hole conductor B6 is connected to the coil electrode 18d. The end part t1 of the via-hole conductor B7 is connected to the coil electrode 18d, and the end part t2 of the via-hole conductor B7 is connected to the coil electrode 18e. The end part t1 of the via-hole conductor B8 is connected to the coil electrode 18e, and the end part t2 of the via-hole conductor B8 is connected to the coil electrode 20. Via-hole conductors B9 to B12 are connected so as to be aligned on a straight line in the z-axis direction. End portion t1 of via-hole conductor B9 is connected to coil electrode 20 . Thereby, end part t1 among all via-hole conductors B1-B12 is located in the positive direction side of z axial direction rather than end part t2.

In the electronic component 10 having the above-mentioned configuration, as shown in FIGS. 2 and 3 , the coil electrode 20 is connected to each of the intermediate electrodes, that is, the coil electrodes 18e, 18f through the different contact portions C12, C13, via-hole conductors B8, B8, B13 connection. Therefore, when the number of turns of the coil L changes, the distance between the two via-hole conductors B connected to the coil electrode 20 also changes. More specifically, in the state shown in FIG. 2, the distance between the two via conductors B8 and B9 connected to the coil electrode 20 is relatively short, and in the state shown in FIG. The distance between the two via-hole conductors B8 and B9 connected to the coil electrode 20 is relatively long. And, because the coil electrode 18a and the coil electrode 20 all have the length of 3/4 turn, so the DC resistance value between the two via hole conductors B connected with the end electrode, that is, the coil electrode 20 is relatively small. The DC resistance value between the electrodes, that is, the two via-hole conductors B connected to the coil electrode 18 a is relatively large.

(Manufacturing method of electronic components)

Next, a method of manufacturing the electronic component 10 will be described with reference to FIGS. 1 and 2 . The manufacturing method described below is to manufacture one electronic component 10 by a sheet lamination method. However, in this manufacturing method, a large ceramic green sheet may be used to manufacture a mother laminate and then divided into individual laminates 12 .

First, a ceramic green sheet to be the magnetic layer 16 is produced as follows. Various _materials weighed according to the ratio of iron oxide ( _Fe2O3 ) 48.0mol%, zinc oxide (ZnO) 25.0mol%, nickel oxide (NiO) 18.0mol%, copper oxide (CuO) 9.0mol% are input as raw materials Wet blending in a ball mill. The obtained mixture was dried and pulverized, and the obtained powder was preliminarily calcined at 750° C. for 1 hour. The obtained calcined powder was wet pulverized in a ball mill, dried and then pulverized to obtain ferrite ceramic powder.

A binder (vinyl acetate resin, water-soluble propylene, etc.), a plasticizer, a wetting agent, and a dispersant are added to the ferrite ceramic powder, and mixed in a ball mill, followed by degassing under reduced pressure. The obtained ceramic slurry is formed into a sheet by doctor-blading and dried to produce a ceramic green sheet having a desired film thickness (for example, 35 μm).

Via-hole conductors B are formed in the ceramic green sheet constituting the magnetic layer 16 . Specifically, through-holes are formed in ceramic green sheets using laser beams. Here, the laser beam passes through the interior of the ceramic green sheet while being attenuated. Therefore, the through hole has a tapered shape in which the area of the opening on the side irradiated with the laser beam is large and the area of the opening on the opposite side is small. Then, a conductive paste such as Ag, Pd, Cu, Au, or these alloys is filled into the through holes by a method such as printing application. Thereby, as shown in FIG. 4 , the via-hole conductor B having a shape in which the area of one end t1 is larger than the area of the other end t2 is formed when viewed from the y-axis direction.

Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or these alloys is applied on the ceramic green sheets constituting the magnetic layers 16d to 16h by screen printing, photolithography, etc. The start electrode and the intermediate electrode are the coil electrodes 18 a to 18 e. Specifically, the coil electrode 18 is formed on the main surface of the via-hole conductor B on the end t1 side of the ceramic green sheets constituting the magnetic layers 16d to 16h such that the contact portion C overlaps the via-hole conductor B. In addition, the coil electrodes 18 and the via-hole conductors B may be simultaneously formed on the ceramic green sheet.

Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or these alloys is applied on the ceramic green sheet constituting the magnetic layer 16i by screen printing or photolithography to form terminal electrodes. That is, the coil electrode 20 . Specifically, in the ceramic green sheet constituting the magnetic layer 16i, the coil electrode 20 is formed on the main surface on the end t1 side of the via-hole conductor B9 such that the contact portion C14 overlaps the via-hole conductor B9. In addition, the coil electrode 20 and the via-hole conductor B9 may be formed simultaneously on a ceramic green sheet.

Then, the respective ceramic green sheets are laminated to form an unfired laminated body 12 . At this time, the laminated body 12 is formed such that the coil electrodes 18b to 18e (intermediate electrodes) are located between the coil electrode 18a (start electrode) and the coil electrode 20 (end electrode), and the coil electrode 20 is connected to the coil through the end t2. The via-hole conductor B8 of the electrode 18e is connected, and the DC resistance value between the via-hole conductors B3 and B4 connected to the coil electrode 18a is larger than the DC resistance value between the via-hole conductors B8 and B9 connected to the coil electrode 20 . Specifically, the ceramic green sheets constituting the magnetic layer 16l are arranged first. Next, the ceramic green sheets constituting the magnetic layer 16k are arranged and temporarily pressure-bonded on the ceramic green sheets constituting the magnetic layer 16l. Thereafter, the ceramic green sheets constituting the magnetic layers 16j, 16i, 16h, 16g, 16f, 16e, 16d, 16c, 16b, and 16a are temporarily pressure-bonded in the same order. Thus, an unfired laminated body 12 is formed. This unbaked laminated body 12 is subjected to main pressure bonding by an isostatic press or the like.

Next, the laminate 12 is subjected to binder removal treatment and firing. For example, the firing temperature is 900°C. Thereby, the laminated body 12 after firing can be obtained. For example, an electrode paste whose main component is silver is applied to the surface of the laminate 12 by dipping or the like, and fired to form silver electrodes as the external electrodes 14a and 14b.

Finally, nickel/zinc plating is performed on the surface of the silver electrodes as the external electrodes 14a, 14b. Through the above steps, the electronic component 10 shown in FIG. 1 is completed.

(Effect)

According to the electronic component 10, the disconnection between the via-hole conductor B4 and the coil electrode 18a can be prevented. Specifically, in the electronic component 10 , since the coil electrode 18 a is formed longer than the coil electrode 20 , when a current flows through the coil L, the coil electrode 18 a generates heat more strongly than the coil electrode 20 . In particular, heat is generated intensively at the connection portion between the coil electrode 18a and the via-hole conductor B4.

Therefore, as shown in FIG. 4, in the electronic component 10, the end part t1 of the via-hole conductor B4 is connected to the coil electrode 18a. The end portion t1 has a larger area than the end portion t2. Therefore, in the electronic component 10, the direct-current resistance value of the connection part of the coil electrode 18a and the via-hole conductor B4 becomes small, and the concentrated heat generation in this connection part is suppressed. As a result, occurrence of disconnection at the boundary portion between the coil electrode 18a and the via-hole electrode B4 is suppressed.

In order to clarify the above effect, the inventors of the present application conducted the following electrostatic gas discharge test to evaluate the occurrence rate of disconnection. In the test, the first test product and the second test product were used. The first test product corresponds to the electronic component 10 according to the present embodiment. Specifically, the electronic component 10 shown in FIG. 2 and FIG. 3 is used. In addition, the 2nd test product used what reversed the direction of the via-hole conductor B in the z-axis direction in the electronic component 10 shown in FIG.2 and FIG.3. In addition, the details of the first test sample and the second test sample are as follows.

Size: 1.00mm×0.50mm×0.50mm

Material of the magnetic layer: Ni-Cu-Zn ferrite

Material of external electrodes: Ni-Sn plated on silver electrodes

Coil electrode material: silver

Coil electrode length: 3/4 turn

The number of turns of the coil: 10 turns

Manufacturing method: sheet lamination method

Make a plurality of first test items and second test items respectively, and among them satisfy the condition of Rdc≥average+3σ (wherein, the so-called average is the average value of a plurality of Rdc) respectively extract 10, for the 100th test items respectively For the first test product and the second test product, a voltage of 30 kV was applied 30 times at intervals of 0.1 seconds in the positive and negative directions. The results thus obtained are shown in Table 1.

[Table 1]

1st test product 2nd test product Disconnection rate 0% (0/200) 11% (22/200)

As described above, a part of the second test product was disconnected, but no disconnection occurred in the first test product. From this, it can be understood that the occurrence of disconnection can be suppressed in the electronic component 10 according to the present embodiment.

In addition, in the electronic component 10, the via conductor B4 connecting the coil electrode 18a, which is the start electrode, and the coil electrode 18b, which is the intermediate electrode, is formed simultaneously with the coil electrode 18a in the manufacturing process, so that it is integrally formed with the coil electrode 18a. form. Therefore, the connection of the coil electrode 18a and the via-hole conductor B4 is made firm, and disconnection does not generate|occur|produce easily in the connection part of the coil electrode 18a and the via-hole conductor B4.

In addition, according to the electronic component 10 and its manufacturing method, the number of turns of the coil L can be changed without redesigning the position of the via-hole conductor B as described below. 5 and 6 are exploded perspective views of a laminated body 112 of a conventional electronic component 110 . FIG. 7 is a perspective view of the electronic component 110 seen through in the y-axis direction. Hereinafter, the stacking direction of the laminated body 112 is defined as the z-axis, and the directions perpendicular to the z-axis direction are defined as the x-axis direction and the y-axis direction. The x-axis direction and the y-axis direction are parallel to the sides of the laminated body 112 .

As shown in FIG. 1 , electronic component 110 includes a rectangular parallelepiped laminated body 112 including a coil inside, and two external electrodes 114 a and 114 b provided on both end surfaces of laminated body 112 in the z-axis direction.

The laminated body 112 is formed by laminating a plurality of coil electrodes and a plurality of magnetic layers. Specifically, it is as follows. As shown in FIG. 5, the laminated body 112 is formed by a plurality of magnetic layers 116a to 116l made of ferrite (for example, Ni-Zn-Cu ferrite or Ni-Zn ferrite, etc.) The negative direction to the positive direction of the z-axis direction are stacked and formed sequentially. Coil electrodes 118a to 118e and 120 constituting a coil are provided on the magnetic layers 116d to 116i. In addition, via-hole conductors b1 to b12 are provided on the magnetic layers 116a to 116l.

The coil electrodes 118a to 118e, 120 are U-shaped and are linear electrodes having a length of 3/4 turn. Via-hole conductors b5 to b8 are respectively provided at one ends of the respective coil electrodes 118b to 118e, so as to penetrate through the magnetic layers 116e to 116h in the z-axis direction. Moreover, the via-hole conductor b9 is provided in the corner part located in the lower left of the coil electrode 120, and penetrates the magnetic body layer 116i in the z-axis direction. Thereby, coil electrodes 118a-118e, 120 are mutually connected by via-hole conductors b5-b9, and the spiral coil is comprised.

And the via-hole conductors b1-b4 are respectively provided so that the magnetic body layers 116a-116d may be penetrated in the z-axis direction, and the coil electrode 118a and the external electrode 114a are electrically connected. In addition, via-hole conductors b10 to b12 are respectively provided so as to penetrate through the magnetic layers 116j to 116l in the z-axis direction, and electrically connect the coil electrode 120 and the external electrode 114b.

In the conventional electronic component 110 configured as described above, the number of turns of the coil can be changed as follows. FIG. 6 is an exploded perspective view of the laminated body 112 when the number of turns of the coil is changed.

In the case where the number of turns of the coil of the laminated body 112 shown in FIG. 5 is to be increased by one, as shown in FIG. The magnetic layer 116m of b13 is enough. The coil electrode 118f and the via-hole conductor b13 have the same structure as the coil electrode 118b and the via-hole conductor b5. Thus, the number of turns of the coil can be changed. In addition, when it is desired to increase the number of turns of the coil of the laminated body 112 by one more turn from the state of FIG. Layer 116 is sufficient.

However, as shown in FIGS. 5 and 6 , in electronic component 110 , when the number of turns of the coil is changed, the position of the end of coil electrode 118 located on the negative side in the z-axis direction of coil electrode 120 changes. Therefore, in order to connect coil electrode 118 and coil electrode 120 located on the negative side in the z-axis direction of coil electrode 120 , it is necessary to change the position of via-hole conductor b9 . That is, when the number of turns of the coil is changed in the electronic component 110, it is necessary to redesign the position of the via-hole conductor b9.

On the other hand, in the electronic component 10 shown in FIG. 2, the coil electrode 20 which is an end electrode is provided in the lowermost side in a lamination direction. The coil electrode 18 provided directly above the coil electrode 20 changes according to the number of turns of the coil L. As shown in FIG. Therefore, when the number of turns of the coil L changes, the position of the end of the coil electrode 18 changes.

However, the coil electrode 18 and the coil electrode 20 are connected by the via-hole conductor B integrally formed with the coil electrode 18 . Therefore, when the number of turns of the coil L is changed to change the position of the end of the coil electrode 18 , the position of the via-hole conductor B also changes together with the position of the end of the coil electrode 18 . However, the coil electrode 18 provided directly above the coil electrode 20 has the same structure as the coil electrodes 18b-18e. Therefore, in the electronic component 10, even if the position of the end part of the coil electrode 18 and the position of the via-hole conductor B change, it is not necessary to redesign the position of the via-hole conductor B. In addition, forming the via-hole conductor B and the coil electrode 18 integrally means the state in which the via-hole conductor B8 and the coil electrode 18e are formed simultaneously in a manufacturing process.

Furthermore, in the electronic component 10 , the coil electrode 20 which is an end electrode overlaps the via-hole conductor B connected to the coil electrodes 18b-18e which is an intermediate electrode, when it planarly views in z axial direction. Therefore, even if the position of the via-hole conductor B connected to the coil electrode 20 changes due to the change in the number of turns of the coil L, the coil electrode 20 and the via-hole conductor B can be connected using any one of the contact portions C11 to C14. As a result, in the electronic component 10, when changing the number of turns of the coil L, it is not necessary to redesign the coil electrode 20. That is, in the electronic component 10, only one type of the coil electrode 20 that is the terminal electrode may be prepared.

However, as shown in FIG. 2, the coil electrode 20 does not necessarily have to have the length (3/4 turn) overlapped with the via-hole conductor B connected to the coil electrodes 18b-18e. The coil electrode 20 should just have the length equal to or more than the number of turns obtained by subtracting the number of turns of the coil electrodes 18a-18e which are intermediate electrodes from 1 turn. Thereby, the coil electrode 20 can be connected to the via-hole conductor B at least two places. More specifically, when the coil electrode 20 has a 1/4 turn length, as shown in FIG. 2, the coil electrode 20 can be connected to via-hole conductor B8, B9. Moreover, when the coil electrode 20 has 1/2 turn length, as shown in FIG. 3, the coil electrode 20 can be connected to via-hole conductor B9, B13. However, in this case, if the length of the coil L is changed, the coil electrode 20 needs to be redesigned.

Moreover, according to the electronic component 10 which concerns on this invention, generation|occurrence|production of the formation defect of the via-hole conductor B9 connected to the coil electrode 20 can be suppressed as follows. More specifically, in the conventional electronic component 110 shown in FIGS. 5 and 6 , the via-hole conductor b9 is provided in the middle of the coil electrode 120 .

However, in the coil conductor 120 in which the via-hole conductor b9 is provided in the middle of the coil electrode 120 as shown in FIG.5 and FIG.6, the formation defect of the via-hole conductor b9 may arise. Specifically, in the coil conductor 120 shown in FIGS. 5 and 6 , since the via-hole conductor b9 is formed in the middle of the coil electrode 120 , the wiring of the coil electrode 120 extends in two directions from the via-hole conductor b9 . Therefore, when the coil conductor 120 is formed by the screen printing method, conductive paste is used for wiring formation of the coil electrode 120, and sufficient conductive paste cannot be supplied to the via-hole conductor b9. As a result, in the coil conductor 120 shown in FIG. 5 and FIG. 6 , there is a possibility that the via-hole conductor b9 may be poorly formed.

In contrast, in the electronic component 10 according to the present embodiment, as shown in FIG. 2 , since the via-hole conductor B9 is formed at the end of the coil electrode 20, the wiring of the coil electrode 20 extends from the via-hole conductor B9 in only one direction. . Therefore, when forming the coil electrode 20 by the screen printing method, electroconductive paste is used for the formation of the wiring of the coil electrode 20, and is also used for the formation of the via-hole conductor B9. As a result, in the electronic component 10, the problem of the formation defect of the via-hole conductor B9 is hard to generate|occur|produce.

The inventors of the present application conducted the following experiment to evaluate the formation defect rate of via-hole conductors in order to clarify the above effects. FIG. 8 is a view showing a coil electrode 20 produced on a ceramic green sheet under test.

As shown in FIG. 8 , in the experiment, 19,044 coil electrodes were formed by screen printing on a 90 mm×90 mm ceramic green sheet having through holes at the positions of via conductors Ba to Bd respectively. Furthermore, if one of the 19044 coil electrodes had a via-hole conductor formation failure, it was considered that the via-hole conductor formation failure occurred on the ceramic green sheet. This operation was performed on 200 ceramic green sheets. The experimental results are shown in Table 2.

[Table 2]

As shown in Table 2, the formation defect rate of the via-hole conductors Ba and Bd positioned at the ends of the coil electrodes 20 was 0%. The formation defect rates of the via-hole conductors Bb and Bc located in the middle of the coil electrode 20 were 15% and 17%. Therefore, it can be understood that the formation defective rate of the via-hole conductor can be reduced when the via-hole conductor is provided at the end of the coil electrode than when it is provided at the middle of the coil electrode. That is, in the electronic component 10, since the via-hole conductor B9 is provided in the edge part of the coil electrode 20, it can be understood that the formation defect of the via-hole conductor B9 is hard to generate|occur|produce.

(other embodiments)

In addition, the electronic component which concerns on this invention is not limited to each said embodiment, It can change within the range of the summary. For example, in FIG. 2 , the contact portion C is formed wider than other portions of the coil electrodes 18 , 20 , but the contact portion C does not necessarily have to be wider. For example, when the line width of the coil electrodes 18 and 20 is sufficiently wide, the contact part C may be formed not wider than other parts of the coil electrodes 18 and 20 .

Here, the case of using the coil electrode 20 of FIG. 9 is demonstrated. The coil electrode 20 of FIG. 9 is different from the coil electrode 20 of FIG. 2 in that there is no clear contact portion C. As shown in FIG. Therefore, it is difficult to judge that the coil electrode 20 is configured so as to be connectable to the via-hole conductor B8 at a plurality of places by only looking at the coil electrode 20 alone.

However, it can be said that when the via-hole conductor B8 is connected to the part (for example, point M, N in FIG. 9 ) other than the end portion on the opposite side to the end portion connected to the via-hole conductor B9 of the coil electrode 20, the The via-hole conductor B8 can be connected between the point of the via-hole conductor B8 and the edge part of the side to which the via-hole conductor B9 is not connected. Therefore, when connecting the via-hole conductor B8 to the coil electrode 20 leaving the end portion not connected to the via-hole conductor B9 , it is considered that the coil electrode 20 is configured to be connectable to the via-hole conductor B8 at multiple places.

In addition, in the electronic component 10, although the coil electrode 18 of 3/4 turn is used, the coil electrode 18 of 5/6 turn or the coil electrode 18 of 7/8 turn may be used, for example.

In addition, although the electronic component 10 is produced by the sheet lamination method in the manufacturing method of the electronic component 10, the manufacturing method of the electronic component 10 is not limited to this. For example, the electronic component 10 can also be produced by a printing method.

In addition, as shown in FIG. 2, in the electronic component 10, by forming the coil electrode 18a longer than the coil electrode 20, the first DC resistance from the via-hole conductor B3 to the via-hole conductor B4 is higher than that from the via-hole conductor B8. The second DC resistance to the via-hole conductor B9 is large. However, the method of making the first DC resistance larger than the second DC resistance is not limited to this. For example, it can also be realized by adjusting the line width or thickness of the coil electrode 18 a and the coil electrode 20 .

In addition, in the electronic component 10 , both ends of the coil L are connected to the external electrodes 14 a and 14 b through the via-hole conductors B, respectively. However, either end portion of the coil L may be connected to the external electrode 14 a or the external electrode 14 b via a lead portion connected to the coil conductor 18 on the magnetic layer 16 .

Possibility of industrial application

The present invention is applicable to an electronic component and its manufacturing method, and is particularly excellent in preventing disconnection between via-hole conductors and coil electrodes.

Symbol Description:

B1～B3...via conductor

C1～C16...contact part

L...coil

t1, t2... ends

10...Electronic components

12...Laminated body

14a, 14b...External electrodes

16a～16m...Magnetic layer

18a～18f, 20...coil electrodes

Claims (13)

1. electronic unit is characterized in that:

Possess:

Constitute a plurality of coil electrodes of coil;

A plurality of insulating barriers, it is stacked and constitute duplexer with above-mentioned a plurality of coil electrodes;

Two outer electrodes, it is set at the surface of above-mentioned duplexer;

Two connecting portions, it connects above-mentioned coil and above-mentioned two outer electrodes; And

The via hole conductor, it connects above-mentioned a plurality of coil electrode, and has the area shape bigger than the area of the other end of an end,

In the above-mentioned coil electrode at the two ends that are arranged at stacked direction, the above-mentioned via hole conductor that connected is defined as the initiating terminal electrode with the relative big above-mentioned coil electrode of dc resistance between the above-mentioned connecting portion, the above-mentioned via hole conductor that connected is defined as end electrodes with the relative little above-mentioned coil electrode of dc resistance between the above-mentioned connecting portion, when the above-mentioned coil electrode beyond above-mentioned initiating terminal electrode and the above-mentioned end electrode is defined as target

Above-mentioned initiating terminal electrode is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by an above-mentioned end.

2. electronic unit according to claim 1 is characterized in that:

The above-mentioned end electrode has the length more than the number of turns that deducts the number of turns of above-mentioned target and obtain from a circle, and is connected with the above-mentioned via hole conductor that is connected in above-mentioned target by above-mentioned the other end.

3. electronic unit according to claim 1 and 2 is characterized in that:

The above-mentioned via hole conductor that connects above-mentioned end electrode and above-mentioned target forms at above-mentioned insulating barrier and above-mentioned end electrode.

4. according to any described electronic unit in the claim 1 to 3, it is characterized in that:

When stacked direction was overlooked, the above-mentioned end electrode was overlapping with the above-mentioned via hole conductor that is connected in above-mentioned target.

5. according to any described electronic unit in the claim 1 to 4, it is characterized in that:

The above-mentioned via hole conductor that connects above-mentioned initiating terminal electrode and above-mentioned target forms at above-mentioned insulating barrier and this initiating terminal electrode.

6. according to any described electronic unit in the claim 1 to 5, it is characterized in that:

Being defined as under the situation of first direction from the direction of above-mentioned end electrode towards above-mentioned initiating terminal electrode, in above-mentioned each via hole conductor, an above-mentioned end is positioned at than more close first direction one side in above-mentioned the other end.

7. according to any described electronic unit in the claim 1 to 6, it is characterized in that:

The above-mentioned end electrode constitutes and can be connected with above-mentioned via hole conductor in many places.

8. electronic unit according to claim 7 is characterized in that:

The above-mentioned end electrode have can be wideer than other parts with the part that above-mentioned via hole conductor is connected shape.

9. according to claim 7 or 8 described electronic units, it is characterized in that:

Connecting the above-mentioned end electrode is connected with the two ends part in addition of this end electrodes with the via hole conductor of above-mentioned target.

10. according to any described electronic unit in the claim 1 to 9, it is characterized in that:

Above-mentioned connecting portion is the via hole conductor.

11., it is characterized in that according to any described electronic unit in the claim 1 to 9:

Above-mentioned connecting portion is the extraction electrode that is set on the above-mentioned insulating barrier and is connected with above-mentioned initiating terminal electrode or above-mentioned end electrode respectively.

12. the manufacture method of an electronic unit is the manufacture method of the described electronic unit of claim 1, it is characterized in that:

Comprise:

On above-mentioned insulating barrier, form the operation of above-mentioned via hole conductor;

On above-mentioned insulating barrier, form the operation of above-mentioned connecting portion;

On above-mentioned insulating barrier, form the operation of above-mentioned initiating terminal electrode and above-mentioned target;

On above-mentioned insulating barrier, form the operation of above-mentioned end electrode; And

To be formed with above-mentioned initiating terminal electrode above-mentioned insulating barrier, be formed with the above-mentioned insulating barrier of above-mentioned end electrode and be formed with the above-mentioned insulating barrier of above-mentioned target stacked and form duplexer so that the operation of above-mentioned target between above-mentioned initiating terminal electrode and above-mentioned end electrode.

13. the manufacture method of electronic unit according to claim 12 is characterized in that:

The operation that forms above-mentioned via hole conductor is carried out simultaneously with the operation that forms above-mentioned initiating terminal electrode and above-mentioned target.

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