CN102301192A - Semiconductor water mist type air conditioner - Google Patents

Abstract

A semiconductor water mist type air conditioner is provided. The air conditioner includes a housing (A3) whose interior is partitioned into a cooling chamber (A), a heat radiating chamber (A1), and an atomizing water tank (A2). In the cooling chamber (A), a semiconductor cooling wafer (4) is arranged, the cold side of the semiconductor cooling wafer (4) is adjacent to the heat sink (1) in order to enlarge the cooling area of the semiconductor cooling wafer (4). Furthermore, a first fan (3) is adjacent to the heat sink (1) to blow the treated air. In the heat dissipation chamber (A1), another heat sink (5) is adjacent to the hot side of the semiconductor cooling wafer (4), and a second fan (31) is used for dissipating heat from the heat sink (5). In the atomizing water tank (a 2), an electronic chip (72) is provided for atomizing water stored in the water tank into a mist, which is guided into the refrigerating compartment (a) to humidify the treated air. The semiconductor water mist type air conditioner can be operated in a cold air, warm air, humidifying or dehumidifying mode.

Description

Semiconductor water mist air conditioner

technical field

The present invention relates to a semiconductor water mist air conditioner, in particular to a device for regulating indoor temperature. Background technique

General air-conditioning equipment mainly refers to air-conditioning equipment, and the operating structure and operation method of air-conditioning is usually to compress the refrigerant into a high-pressure and high-temperature gas refrigerant through a compressor, and then send it to the condenser to cool the refrigerant. After the refrigerant is cooled by high-pressure and high-temperature heat release , become a high-pressure and low-temperature liquid refrigerant, and then store excess refrigerant through the refrigerant storage bottle. Other refrigerants are decompressed at the expansion valve to low-pressure and low-temperature, and then flow to the evaporator. The low-pressure and low-temperature gas refrigerant can absorb the indoor temperature, and After absorbing heat through the low-temperature refrigerant, it is blown to the indoor space by power, resulting in a cold room effect. However, the previous technology has serious disadvantages, mainly because cold coal contains chlorofluorocarbons (CFCs), which are not easy to decompose in nature, and its accumulated content and characteristics will deplete ozone in the stratosphere, making the ozone content increasingly The reduction of the ultraviolet rays will form a gap in the protection of the earth, and the ultraviolet rays will directly irradiate the earth without hindrance. In addition to causing various diseases to humans and organisms, and to the ecological environment, it will also cause serious consequences of climate change and ecological regulation imbalance. . Contents of the invention

In view of the serious problems caused by using refrigerant as the raw material of air conditioners in the prior art, the inventor believes that there should be a structure that can improve the disadvantages. The present invention relates to a semiconductor water mist air conditioner, the main purpose of which is to use semiconductor electronic refrigeration ( The cooling above and below is relatively heating, hereinafter collectively referred to as cooling) or the cold source and heat source generated by the heating of the electric heating tube, and the general cooling area is enlarged through the cooling sheet. Then use the atomized water particles formed by the electronic atomization chip as the medium for conducting cold or heat (the principle is that the thermal conductivity of the atomized water particles of 1 u m ~ 3 m is better than that of ordinary air), and the atomized water particles pass through the first fan Drive through the cooling plate group to achieve the purpose of generating cold or hot air under the action of heat exchange and heat conduction.

In order to achieve the above-mentioned purpose, the technical means used in the present invention are mainly designed and constituted to include a cold room, the inside of which is provided with a cold side of a semiconductor refrigerating plate; The cold side of the sheet is adjacent to each other; an electric heating pipe, and the electric heating pipe is also adjacent to the cooling sheet group; the cooling sheet group can enlarge the cooling area of the semiconductor cooling sheet and the electric heating pipe; an atomized water particle inlet, Plural is preferred, as the atomized water particles enter the cooling chamber entrance; a first fan, adjacent to the cooling plate group, to form the blowing of cold (hot) air; a cooling The condensed water collecting pan is used to collect the condensed water generated in the cooling plate group during the cooling process, and the atomized water particle inlet is installed on the bottom of the condensed water collecting pan; the bright surface of the cooling chamber can be heated Reflective and heat-resistant and insulating composite components are isolated from other components. A semiconductor cooling fin cooling chamber, the semiconductor cooling fin cooling chamber is provided with a cooling fin group, the cooling fin group is adjacent to the hot side of the semiconductor cooling fin; a second fan, and the cooling fin group form heat dissipation. An atomized water tank, the atomized water tank is equipped with an electronic atomization chip, the atomized water particles formed by the electronic atomized chip; an atomized water particle air outlet, plural is better, the atomized water particle air outlet is set in the fog On the water tank, and connected to one end of the atomized water particle tube, the other end of the atomized water particle tube is connected to the atomized water particle air inlet on the condensed water collecting tray in the cooling chamber, and the water is atomized by the electronic atomization chip Water particles, the atomized water particles lead to the cooling chamber through the atomized water particle pipe; one air inlet, plural is better, the air inlet is located on the atomized water tank, as a balance of the air in the atomized water tank pressure; a water inlet, the water inlet is set on the atomization water tank, as the water injection port of the atomization water tank.

When the water in the atomized water tank passes through the electronic atomization chip to generate atomized water particles, the atomized water particles are inhaled and driven by the first fan, and enter the cooling chamber through the atomized water particle tube, and the semiconductor cooling chip in the cooling chamber Or the electric heating pipe generates cold or heat, and the general cooling area is enlarged through the cooling plate group, and the atomized water particles are sucked by the first fan and driven through the cooling plate group, and the purpose of generating cold or hot air is achieved under the action of heat exchange.

The heat generated by the semiconductor cooling fins in the cooling process needs to be discharged from the semiconductor water mist air conditioner, so a heat sink group and a second fan are installed on the hot side of the semiconductor cooling fins to form heat dissipation and discharge the heat generated by the semiconductor cooling fins. Foggy air conditioning unit.

The second purpose of the present invention is to control the humidity of the environment, that is, to have the function of humidifying and dehumidifying the air. Since the present invention uses atomized water particles as the medium for conducting cold and heat sources instead of ordinary air in the process of generating cold air or hot air, and Atomized water particles will increase the humidity of the air, so the present invention is also an air humidifier in the process of generating cold air or hot air. This part is different from the disadvantages of the traditional air conditioner that will cause the ambient humidity to be too low when it is working; The electronic atomization chip is not activated during the cold process, that is, ordinary air is used as the conduction cooling source medium, and dry and cold air and condensed water will be generated at this time, that is, when cooling in this mode, the hot and humid air in the environment in the process is first The fan is driven to inhale into the refrigerating chamber, and the hot and humid air will not only reduce the temperature of the air but also produce condensed water on the refrigerating sheet group under the action of heat exchange when it contacts the refrigerating sheet group, which will be generated under the blowing of the first fan The cold air will also reduce the humidity in the ambient air, and the condensed water produced by ^ ¹ can be concentrated by the condensed water collecting pan on the device, and then flow into the atomized water tank through the atomized water particle air inlet, so the present invention is here The mode of operation is not only a cold air conditioner but also a dehumidifier; the present invention can control the humidity in the environment by switching between the two operation modes.

Another purpose of the present invention is to use the control circuit to control the level of temperature and humidity and the size of the wind, and to adjust the cooling temperature or electric heating of the semiconductor refrigerator by controlling the chip through the circuit control board to adjust the current. The heating temperature of the tube is related to the wind power of the first fan, the opening and closing of the second fan, and the activation or deactivation of the electronic atomization chip. The activation and deactivation of the air conditioner can also be set through the control chip and the temperature and humidity sensing component.

Another object of the present invention is the mechanism design of the refrigerating sheet group, which is used to enlarge the cooling (area) of the semiconductor refrigerating sheet and the electric heating tube to increase the heat exchange efficiency with the atomized water particles or air, and its mechanism is composed of two sets of cooling fins group and connected by several solid or hollow threaded cooling fins made of aluminum rods or red copper rods; two sets of cooling fins, one group is a plurality of mountain-shaped fin-type heat sinks, the mountain-shaped fins The heat sink is adjacent to the cold side of the semiconductor cooling fin, and its material is aluminum or aluminum alloy or copper. The thickness of the heat sink on each type of fin type heat sink is 1 minute to 2 legs, and the two heat sinks are spaced apart from the heat sink. For 2M! ~ 4 legs; one group is a plurality of flat heat sinks, the material of which is aluminum or aluminum alloy or copper, each of the flat heat sinks uses an aluminum frame as a supporting frame, and dozens of rectangular strip heat sinks are welded in parallel in the middle of the supporting frame , the heat sinks are made of aluminum sheet or aluminum alloy sheet or copper sheet, the thickness of the rectangular strip-shaped heat sink is 0.5 to 1 mm, and the parallel interval between the two heat sinks is 2 to 4 legs.

Another object of the present invention is the mechanism design of the heat sink group. The heat sink group is used to discharge the heat generated by the cooling process of the semiconductor cooler. Its mechanism is composed of a heat sink made of aluminum or aluminum alloy or copper and a flat plate The heat sink group, the two are connected by several solid or hollow threaded heat sink group heat pipes, made of aluminum rods, copper rods or red copper rods, and the heat sink block is adjacent to the hot side of the semiconductor cooling fin; flat plate The flat heat sink group is made of aluminum or aluminum alloy or copper. The flat heat sink group uses an aluminum frame as a supporting frame, and dozens of strip-shaped heat sinks are welded in parallel in the middle of the supporting aluminum frame. The heat sink material is aluminum sheet or aluminum Alloy sheet or copper sheet, the thickness of the strip-shaped heat sink is 0.5 ~ 1 leg, and the parallel interval of the heat sink is 2 mm! ~4 Wake up.

Another object of the present invention is to design a waterproof mechanism for the cooling plate group and the cold side of the semiconductor cooling plate to be adjacent to each other. As the heat conduction medium atomizes water particles, it will cause damage to the semiconductor cooling plate, so it is designed for use. The mountain-shaped fin radiator is larger than the area of the semiconductor refrigerator, and a waterproof rubber strip is installed on the bottom of the mountain-shaped fin radiator and adjacent to the refrigeration chamber to form a waterproof and airtight contact without loss of the cooling efficiency of the semiconductor refrigerator. noodle.

Another object of the present invention lies in the design of the material covered by the inner layer of the refrigeration chamber. Since the refrigeration chamber needs to avoid heat consumption and heat radiation concentration and heat resistance and heat insulation problems during the cooling and heating process, the inner layer of the refrigeration chamber The bright surface can reflect heat and is composed of heat-resistant and heat-insulating materials. The bright surface can reflect heat and be heat-resistant. The material can be aluminum foil or aluminum sheet, and the heat-insulating material can be low-temperature insulation such as PUR foam or PE foam. material.

Another object of the present invention is that the selection and design of the first fan and the second fan can be a straight fan or a straight fan, and the selection and design of the fans in different forms can make the semiconductor water mist air conditioner have different appearances, so that it can be applied in Different occasions and spaces.

Another object of the present invention is that the semiconductor water mist air-conditioning device can be designed in a vertical and a horizontal type, by The combination of the cooling chamber and semiconductor cooling fins for heat dissipation and the different positions of the atomizing water tank can make the semiconductor water mist air-conditioning device produce different appearances, so that it can be applied to different occasions and spaces.

Another object of the present invention is to design the mechanism design of the atomized water particle air outlet and the air inlet of the device atomized water tank to prevent water from overflowing. The overflow damages other electrical components, so a one-way design is adopted, that is, only atomized water particles and air can enter and exit, and the water in the atomized water tank cannot overflow from the atomized water particle air outlet and air inlet.

Another object of the present invention is to design the water inlet mechanism installed in the atomized water tank. In order to prevent the water in the atomized water tank from overflowing through the water inlet and damage other electrical mechanism components, a one-way design is adopted, that is, only water is allowed to enter. The water in the atomized water tank cannot overflow from the water inlet; in addition, when the electronic atomization chip converts water into atomized water particles, air and space need to be reserved for water to be converted into atomized water particles, so the atomized water tank The water cannot be filled during the water injection process. In the water inlet design of the present invention, the installation position of the water inlet is used to reserve the space for the transformation of atomized water particles, and the design of the full water stop valve of the floating ball in the water inlet is used to avoid fog. A problem with the water tank being overfilled with no room to convert the water into atomized water particles.

Another object of the present invention is to automatically stop the action of the electronic atomization chip when the water level in the atomization water tank is low. Since the electronic atomization chip continues to operate in the absence of water, there is a risk of burning, so the design of the atomization refrigerator is When the water level is low, the electronic atomization chip will stop automatically to avoid the risk of the electronic atomization chip being burned.

Another purpose of the present invention is to add plant essential oils into the atomized water tank to turn the semiconductor water mist air conditioner into an air purifier and an air fragrance machine. Because the electronic atomization chip uses 1.6 million vibrations to convert water into atomized water Particles, a large amount of negative ions will be generated during the conversion process, and the water particles carrying negative ions can absorb dust in the air to achieve the purpose of purifying the air; if plant essential oils are added to the water tank and the electronic atomization chip is in action, plant essential oils will also be released It is transformed into fine particles that can float in the air, and with the blowing of the first fan, the indoor air can achieve the purpose of fragrance. Description of drawings

Fig. 1 is a schematic diagram of the planar structure of the present invention;

Fig. 2 is a three-view diagram of the cooling/heating sheet group of the present invention;

Fig. 3 is the refrigeration/heating sheet group and the first fan straight fan of the present invention;

Fig. 4 is the cooling/heating sheet group and the first straight fan of the present invention;

Fig. 5 is a three-dimensional view and a three-dimensional view of the water collecting tray of the present invention;

Fig. 6 is a sectional view of the frame wall of the cooling/heating chamber of the present invention;

Figure 7 is a diagram of the installation position of the waterproof rubber strip of the present invention; Fig. 8 is a cross-sectional view of the atomized water particle tube of the present invention;

Fig. 9 is a three-view view of the heat sink group of the present invention;

Figure 10 is a three-view view of the heat sink group and the second straight fan of the present invention;

Fig. 11 is the heat sink group and the second straight fan of the present invention;

Figure 12 is a three-view and perspective view of the water tank of the present invention;

Fig. 13 is a circuit diagram of the electronic atomization chip and the water level switch of the present invention;

Figure 14 is a sectional view of the water inlet of the present invention;

Figure 15 is a sectional view of the air inlet of the present invention;

FIG. 16 is a schematic plan view of the structure of the control circuit of the present invention;

Figure 17 is a diagram of various structural combinations of the present invention;

Figure 18 is the second illustration of various structural combinations of the present invention;

Figure 19 is the third illustration of various structural combinations of the present invention.

in

A. Cooling chamber A1. Semiconductor cooling fin cooling chamber

A2. Atomized water tank A3. Frame wall

A4. Waterproof rubber strip A5. The bright surface can reflect heat and is made of heat-resistant and heat-insulating material

A5A. Glossy heat reflective material A5B. Thermal insulation material

1. Cooling sheet group 11. Mountain-shaped finned heat sink

12. Flat heat sink 12A. Supporting aluminum frame

12B. Strip-shaped heat sink 13. Cooling fin group heat pipe

2. Electric heat pipe 3. The first fan

3A. The first fan (straight fan) 31. The second fan

31A. Second fan (straight fan) 4. Semiconductor cooler

5. Heat sink group 51. Heat sink block

52. Heat pipe of heat sink group 53. Flat heat sink group

54. Support aluminum frame 55. Strip heat sink

6. Condensate water collecting tray 7. Circuit control board

71. Water level switch 72. Electronic atomization chip

73. Control Chip 74. Temperature Sensing Components

75. Humidity Sensing Component 76. Power Supply

8. Atomized water particle inlet 81. Air inlet 81 A. Hollow base 81B. Solid rubber ball

82. Atomized water particle tube 83. Atomized water particle air outlet

84. Solid rubber ball 9. Water inlet

91. Hollow rubber ball 92. Hollow base

93. Water inlet cover Specific implementation

The structure, features and embodiments of the present invention are described below with the help of drawings, so that your examiners can have a further understanding of the present invention.

Please refer to Fig. 1 and Fig. 16, the present invention mainly relates to a semiconductor water mist air-conditioning device, which is surrounded by a frame wall A3 as an outer rough frame, and separated by frame wall A3 into a cold room A and a semiconductor The cooling fin cooling chamber A1 and an atomizing water tank A2.

The interior of the refrigerating chamber A includes a cold side of a semiconductor cooling plate 4, a consistent cooling plate group 1, an electric heating tube 2, a plurality of atomized water particle inlets 8, a first fan 3, and a condensed water collecting tray 6.

The semiconductor cooling fin cooling chamber A1 then includes a cooling fin group 5, a second fan 31, and a hot side of the semiconductor cooling fin 4.

The atomized water tank A2 includes an electronic atomized chip 72, a plurality of atomized water particle outlets 83, a plurality of air inlets 81, and a water inlet 9. In addition, the atomized water particle air outlet 83 is connected to the atomized water particle pipe 82 and connected to the atomized water particle inlet 8 on the condensed water collecting tray 6 in the cooling chamber A.

In addition, the inner layer of the cooling chamber A is paved with a bright surface that can reflect heat and is a heat-resistant and heat-insulating material A5, so as to block the heat generated by the hot side of the semiconductor cooling chip 4, and avoid reducing the cooling effect of the cooling chamber A.

As for the basic components inside the refrigeration chamber A include:

The cold side of a semiconductor cooler 4: ,

Please refer to FIG. 16, the cold side of the semiconductor cooling plate 4 is electrically connected to the power supply 76, and the power supply 76 is powered to drive cooling.

Consistent cold sheet group 1 :

Please cooperate as shown in Figure 2, adjacent to the cold side of the semiconductor cooling plate 4 and the electric heating tube 2, the cooling/heating area of the semiconductor cooling plate 4 and the electric heating tube 2 can be enlarged; the mechanism of the cooling plate group 1 is composed of two A heat sink group is connected with several solid or hollow threaded cooling fin group heat pipes 13 made of aluminum rods or red copper rods; two groups of heat sink groups, one group is a plurality of mountain-shaped fin-type heat sinks 11, each The bottom of the mountain-shaped fin-type heat sink 11 is adjacent to the cold side of the semiconductor cooling fin 4, and its material is aluminum or aluminum alloy or copper. The heat dissipation on each mountain-shaped fin-type heat sink 11 The sheet thickness is 1 side to 2 legs, and the distance between the two heat sinks and the heat sink is 2 sides to 4 legs; one group is a plurality of flat heat sinks 12, the plurality of flat heat sinks are adjacent to the electric heating tube 2, and the material Aluminum or aluminum alloy or copper, the flat heat sinks 12 use aluminum frames as supporting frames, and dozens of strip-shaped cooling fins 12B are welded in parallel in the middle of the supporting frames 12A. The heat sinks are made of aluminum sheets or aluminum alloy sheets or Copper sheet, strip heat sink 12B thickness is 0.5 ~ 1 mm, the parallel interval of heat sink is 2 ran! ~ 4 ππη.

A first fan 3 :

. Please refer to Fig. 3 and Fig. 4, the flat fin group 13 adjacent to the cooling fin group 1, and the cooling fin group 1 form air blowing, which can be a straight first fan 3 or a Straight-type first fan 3Α; By using different types of fans to choose and design, the semiconductor water mist air-conditioning device can have different appearances so that it can be applied to different occasions and spaces.

One heating tube 2:

The flat heat sink group 13 adjacent to the cooling fin group 1 is electrically connected to the power supply 76, and powered by the power supply 76 to generate heat.

- Condensate drain pan 6:

Please refer to Fig. 1 and Fig. 5, its position is installed at the bottom of the refrigerating chamber A to collect the condensed water generated in the refrigerating plate group 1 during the cooling process; A plurality of atomized water particle air inlets 8; the condensed water produced by the cooling plate group 1 will be collected at the bottom of the condensed water collecting pan 6 due to the inclined surface design of the condensed water collecting pan 6, and borrowed The atomized water particles flow into the atomized water tank A2 from the air inlet 8 of the atomized water particles.

Please refer to Figure 1 and Figure 6 at the same time, the inner lighting surface of the frame wall A3 of the refrigerating chamber A can reflect heat and is composed of heat-resistant and heat-insulating material A5, which is isolated from other components; heat-resistant and heat-insulating The composite composition of material A5 is composed of the bright surface heat reflective material A5A on the outer layer and the heat insulating material A5B on the inner layer. The bright surface is heat reflective and heat-resistant material A6 can be aluminum foil or aluminum sheet. A7 can be low-temperature insulation materials such as PUR foam or PE foam. The inner lighting surface of the frame wall A3 of the refrigerating chamber A is heat-reflective and designed with heat-resistant and heat-insulating materials. Alternatively, the electric heating tube 2 can concentrate heat radiation during the heating process to increase the heating effect.

Please refer to Fig. 7, in addition, the area of the bottom of each mountain-shaped fin radiator 11 in the configuration of the cooling fin group 1 needs to be larger than the area of the cooling surface of the semiconductor refrigerator 4, and the area of the bottom of each mountain-shaped fin radiator The bottom of 11 is adjacent to the refrigerating chamber A with a waterproof rubber strip A4, so as to form a waterproof and airtight contact surface that does not lose the cooling efficiency of the semiconductor refrigerating sheet; its purpose is to prevent the heat-conducting medium from atomizing water particles, causing semiconductor The cooler is damaged.

Please refer to Figure 1, Figure 5 and Figure 8 at the same time, the condensed water collection tray 6 device at the bottom of the refrigeration chamber A A plurality of atomized water particle air inlets 8 are used as the entrance for the atomized water particles to enter the refrigeration chamber A; the atomized water particle air inlets 8 are connected to the atomized water particle pipe 82, and the atomized water particle pipe 82 is connected to the atomized water particle pipe 82. The atomized water particle air outlet 83 on the water tank A2; its mechanism of the atomized water particle pipe 82 is formed by connecting a long small-diameter pipe with a short large-diameter pipe, and the small-diameter pipe is connected to the atomized water particle inlet. Air port 8, the large-diameter pipe is connected to the atomized water particle air outlet 83, and there is a solid rubber ball 84 in the large-diameter pipe; the diameter of the solid rubber ball 84 is larger than the small-diameter pipe on the mechanism, but smaller than the atomized water particle air outlet 83 , to prevent the solid rubber ball 84 from falling off; in general, the atomized water particles can normally lead to the refrigeration chamber A, and the solid rubber ball 84 will feed the atomized water particles into the air inlet 8 when the semiconductor water mist air conditioner is toppled over. Blocking prevents the water in the atomized water tank A2 from overflowing from the water particle air inlet 8 and damaging other electrical components of the semiconductor water mist air conditioner.

The basic components inside the semiconductor cooling fin cooling chamber A1 include:

A heat sink group 5 :

Please refer to FIG. 9, adjacent to the hot side of the semiconductor cooling fin 4, it forms heat dissipation with the second fan 31; its mechanism consists of a heat sink block 51 and a flat plate heat sink group 53, wherein the heat sink block 51 is made of aluminum or aluminum alloy or copper, and the two are connected by several solid or hollow thread heat sink heat pipes 52, made of aluminum rods, copper rods or red copper rods; the flat heat sink group 53 is made of aluminum or aluminum Alloy or copper, the flat-plate heat sink group 53 uses an aluminum frame as a support frame, and dozens of strip-shaped heat sinks are welded in parallel in the middle of the support aluminum frame 54: 55, and the material of the heat sink is aluminum sheet or aluminum alloy sheet or copper sheet, The elongated heat sink 55 has a thickness of 0.5 mm! ~ 1 dish, fins spaced 2 mm ~ 4 mm apart in parallel.

A second fan 31:

10 and 11, the second fan 31 is adjacent to the flat heat sink group 53 in the heat sink group 5, and forms heat dissipation with the heat sink group 5. It can be a straight second fan 31 or a straight cylinder. The type of second fan 31A; using different types of fan selection design, can make the semiconductor water mist air conditioning device produce different appearances so that it can be applied to different occasions and spaces.

The basic components inside the atomizing water tank A2 include:

An electronically atomized chip 72:

1 and 12, the electronic atomization chip 72 is installed at the bottom of the atomization water tank A2, is electrically connected to the water level switch 71, and is powered by a power supply 76; when the water level inside the atomization water tank A2 exceeds When the temperature is low, the electronic atomization chip 72 can automatically stop to prevent the electronic atomization chip 72 from being burned. Please refer to FIG. 13 for the circuit diagram of the electronic atomization chip 72 and the water level switch 71 .

A water inlet 9:

Please refer to Figure 12 and Figure 14, the water inlet 9 is installed on the atomized water tank A2, which is the atomized water tank A2 water injection inlet; since the electronic atomization chip 72 needs to reserve air and space for converting water into atomized water particles during the process of converting water into atomized water particles, the atomized water tank A2 cannot inject water into the atomized water particles. Filling, in the design of the water inlet 9 of the present invention, the atomized "water" particle conversion space is reserved by the installation position of the water inlet 9; the mechanism of the water inlet 9 is composed of two sections of hollow pipes with large and small diameters. Hollow rubber ball 91, there is a hollow base 92 at the bottom of the large-diameter tube to prevent the hollow rubber ball 91 from falling off, the diameter of the hollow rubber ball 91 is larger than the small-diameter hollow tube but smaller than the large-diameter hollow tube, and a water inlet is provided at the end of the small-diameter hollow tube Cover 93; when the water is injected to the expected water level, the hollow rubber ball 91 will float up due to water buoyancy and block the water inlet 9 so that excess water can no longer be injected, so as to prevent the atomizing water tank A2 from being overfilled with no space The problem of water conversion into atomized water particles.

Please refer to Figure 12 and Figure 15. In addition, there are multiple air inlets 81 on the atomizing water tank A2 to balance the air pressure in the atomizing water tank A2; There is a solid rubber ball 81B inside the diameter tube, and there is a hollow base 81A at the bottom of the large-diameter tube to prevent the solid rubber ball 81B from falling off. The diameter of the solid rubber ball 81B is larger than the small-diameter hollow tube but smaller than the large-diameter hollow tube; in general, the air can be normal Leading to the atomized water tank A2, when the semiconductor water mist air conditioner is dumped, the solid rubber ball 81B will block the air inlet 81, preventing the water in the atomized water tank A2 from overflowing from the air inlet 81 and damaging the semiconductor water mist air conditioner. Other electrical components of the air conditioner.

Referring to Figure 8, the atomized water tank A2 is provided with a plurality of atomized water particle air outlets 83, and the atomized water particle air outlet 83 is connected to the atomized water particle pipe 82, so that the atomized water particles lead to the refrigeration chamber A entrance.

When the water in the atomized water tank A2 passes through the electronic atomization chip 72 to generate atomized particles, the atomized water particles are inhaled and driven by the first fan 3, and enter the cooling chamber A through the atomized "water" particle tube 82. The semiconductor cooling plate 4 or the electric heating tube 2 in A produces cold or heat, and the general cooling area is enlarged through the cooling plate group 1, and the atomized water particles are sucked by the first fan 3 and driven through the cooling plate group 1, in the heat exchange Under the action of the system, the purpose of generating cold air or hot air is achieved. And the heat produced by the semiconductor cooling fin 4 in the cooling process needs to be discharged from the semiconductor water mist air conditioner, so a heat sink group 5 and a second fan 31 are installed on the hot side of the semiconductor cooling fin 4 to form a heat dissipation that will generate The heat discharge semiconductor water mist air conditioning device.

The present invention can control the ambient humidity by activating and deactivating two working modes of the electronic atomized chip 72; the present invention generally uses atomized water particles as the medium for conducting cold and heat sources in the process of generating cold air or hot air. The atomized chip 72 is activated, and the atomized water particles will increase the air humidity, so the present invention is also an air humidifier during the general process of generating cold air or hot air; As a conduction cooling source medium, dry and cold air and condensed water will be generated at this time, that is, when cooling in this mode, the hot and humid air in the environment in the process will be driven by the first fan 3 and sucked into the cooling room A, and the hot and humid air will When touching the refrigerating plate group 1, under the effect of heat exchange, in addition to reducing the air temperature and generating condensed water on the refrigerating plate group 1, the cold air generated under the blowing of the first fan 3 will also reduce the air temperature in the ambient air. Humidity, and the condensed water produced can be concentrated by the condensed water collecting tray 6 on the device, and then flow into the atomized water tank A2 through the atomized water particle inlet 81, so the present invention operates in this mode and is divided into a cold air The air conditioner is also a dehumidifier; the present invention can control the humidity in the environment by switching between two operating modes.

Please refer to Fig. 1 and Fig. 16, the present invention can use the circuit control board 7 to set and control the level of temperature and humidity and the size of the wind force, that is, the current can be adjusted through the control chip 73 in the circuit control board 7 Adjust the cooling temperature of the semiconductor refrigerating sheet 4 or the heating temperature of the electric heating tube 2, and the wind power of the first fan 3 and the opening and closing of the second fan 31, and the activation or closing of the electronic atomization chip 72 can also be controlled through the control chip 73 and The temperature sensing component 74 and the humidity sensing component 75 set the activation and deactivation of the air conditioner.

Please refer to Fig. 17, Fig. 18 and Fig. 19, the semiconductor water mist air-conditioning device of the present invention can be of vertical and horizontal design, through the cooling chamber A, the semiconductor cooling fin cooling chamber A1 and the atomized water tank A2 Different combinations of positions can make the semiconductor water mist air-conditioning device produce different appearances, so that it can be applied to various occasions and spaces.

In addition, plant essential oils can be added to the atomized water tank A2 of the present invention to make the semi-conductor water mist air conditioner into an air purifier and an air fragrance machine. Since the electronic atomization chip 72 utilizes 1.6 million vibrations to convert water into atomized water Particles, a large amount of negative ions will be generated during the conversion process, and the water particles carrying negative ions can absorb dust in the air to achieve the purpose of purifying the air; if plant essential oils are added to the atomization water tank A2 when the electronic atomization chip 72 is in action, it will also The plant essential oil is converted into fine particles that can float in the air, and the purpose of achieving aroma in the indoor air is achieved with the blowing of the first fan 3 .

Effect of the present invention can reach:

1. The present invention adopts the semiconductor cooling plate and the electric heat pipe as the cold source and heat source, and uses the atomized water particles generated by the electronic atomized chip as the heat transfer medium, thereby generating cold air and warm air; The atomizing chip is turned on and off to control the high and low humidity of the environment. In addition to being a new invention of an environmentally friendly air-conditioning device that does not use traditional cold coal, the present invention is also a four-in-one all-in-one air-conditioning device for air conditioning, heating, dehumidification, and humidification.

2. The present invention can use artificial intelligence to control the chip to achieve the purpose of controlling temperature and humidity. When the temperature reaches a set value (such as a set temperature of 30 degrees Celsius), the power switch of the controller circuit board is automatically activated, and the semiconductor water mist type is activated. air conditioning unit. When the temperature drops to a set value (such as a set temperature of 20 degrees Celsius), the semiconductor water mist air conditioner will be automatically turned off.

Three, the present invention can adjust temperature.

Four, the present invention can adjust wind size. Five, the present invention can adjust the high and low humidity.

6. The present invention can make the semiconductor water mist air conditioner have different appearances by using different types of fans and by combining the different positions of the refrigerating chamber, the semiconductor cooling fin cooling chamber and the atomizing water tank, so that it can be applied in different occasion and space.

Seven, the present invention can add plant essential oil to make the semi-conductor water mist air-conditioning device change into air purifier and air fragrance machine.

To sum up, the present invention has practical effects, has not been seen in publications or public use, and meets the patent requirements, and a patent application is filed according to law. The above statement is an industrially preferred embodiment of the present invention, and all equivalent changes made according to the scope of the patent application of the present invention fall within the scope of the patent application of this case.

Claims (12)

claims 1. A semiconductor water mist air-conditioning device, which is surrounded by a frame wall, and the internal partition is: 'Unanimous cold room: There is a cold side of a semiconductor refrigerating sheet inside, and a cooling sheet group: the refrigerating sheet group is adjacent to the cold side of the semiconductor refrigerating sheet, and an electric heating pipe is provided, and the electric heating pipe is connected to the cooling sheet group adjoining, so as to enlarge the cooling area of the semiconductor cooling plate and the electric heating tube; a first fan is set, adjacent to the cooling plate group, to form the blowing of cold/hot air; the bottom of the cooling chamber is provided with a condensation A water collecting tray; and the bottom of the condensed water collecting tray is provided with an air inlet for atomized water particles; A semiconductor cooling fin heat dissipation chamber: A heat sink set is provided inside, and the heat sink set is adjacent to the hot side of the semiconductor cooler; and a second fan is provided to dissipate heat from the heat sink set; One atomizing water tank: An electronic atomization chip is provided inside for water to form atomized water particles; and an atomized water particle gas outlet is provided, and the atomized water particle gas outlet is connected to an atomized water particle tube, and the atomized water particle tube is connected to the The atomized water particle air inlet, the atomized water particle leads to the refrigeration chamber through the atomized water air outlet; and an air inlet for balancing the air pressure in the atomized water tank; and a water inlet for water injection. 2. The semiconductor water mist air-conditioning device as claimed in claim 1, wherein the lighting surface of the refrigerating interior layer is heat-reflective and composed of heat-resistant and heat-insulating materials, and is isolated from other components. 3. The semiconductor water-mist air-conditioning device as claimed in claim 1, wherein a control circuit is further provided to control the level of temperature and humidity and the magnitude of the wind force, which can be adjusted by controlling the chip through the circuit control board to adjust the current. The cooling temperature of the semiconductor cooler or the heating temperature of the electric heating tube, and the wind power of the first fan, the opening and closing of the second fan, and the activation or closing of the electronic atomization chip can also be set through the control chip and the temperature and humidity sensing component Activation and deactivation of air conditioning. 4. The semiconductor water mist air-conditioning device as claimed in claim 1, wherein the refrigerating fin group is two groups of radiating fins, and several solid or hollow threaded refrigerating fin groups are made of aluminum rods or red copper rods connected to the heat pipe. 5. The semiconductor water-mist air-conditioning device as claimed in claim 4, wherein the two groups of cooling fins, one group is a plurality of mountain-shaped fin-type heat sinks, and each of the mountain-shaped fin-type heat sinks and the semiconductor cooling fins The cold side is adjacent, and its material is aluminum or aluminum alloy or copper, and the thickness of the heat sinks on the mountain-shaped fin-type heat sinks is 1mm~2ππη, and the distance between the two heat sinks is 2mm~4mm; A plurality of flat heat sinks are made of aluminum or aluminum alloy or copper. Each flat heat sink uses an aluminum frame as a support frame, and dozens of rectangular strip heat sinks are welded in parallel in the middle of the support frame. The material of each heat sink is Aluminum sheet or aluminum alloy sheet or copper sheet, the thickness of the rectangular strip-shaped heat sink is 0.5 to 1 mm, and the parallel interval between the two heat sinks is 2 to 4 mm. 6. The semiconductor water mist air-conditioning device as claimed in claim 1, wherein the heat sink group is a heat sink block made of aluminum or aluminum alloy or copper and a flat heat sink group, both of which are composed of several solid or hollow The threaded heat sink group is connected to the heat pipe, and the material is aluminum rod or copper rod or red copper rod, and the heat sink block is adjacent to the hot side of the semiconductor cooling fin; the material of the flat heat sink group is aluminum, aluminum alloy or copper , the flat heat sink group uses an aluminum frame as a supporting frame, and dozens of strip-shaped heat sinks are welded in parallel in the middle of the supporting aluminum frame. The material of the heat sink is aluminum, aluminum alloy, or copper. The thickness of the strip heat sink is 0.5 πιπ! ~ 1 Sa, heatsink parallel spacing is 2M! ~ 4 7. The semiconductor water mist air-conditioning device according to claim 1, wherein a waterproof mechanism is provided adjacent to the cold side of the refrigerating plate group and the semiconductor refrigerating plate, and the waterproof mechanism uses a mountain shape larger than the area of the semiconductor refrigerating plate Fin-type heat sink, and a waterproof rubber strip is installed at the bottom of the mountain-shaped fin-type heat sink adjacent to the refrigeration chamber to form a waterproof and airtight contact surface that does not lose the cooling efficiency of the semiconductor refrigerator. 8. The semiconductor water mist air conditioner as claimed in claim 2, wherein the inner layer of the cooling chamber is made of aluminum foil or aluminum sheet, and the heat insulation material can be a low temperature heat preservation material such as PUR foam or PE foam. 9. The semiconductor water-mist air-conditioning device as claimed in claim 1, wherein the first fan and the second fan can be designed as a straight fan or a straight fan. 10. The semiconductor water mist air-conditioning device as claimed in claim 1, wherein the frame wall is of vertical or horizontal design. 11. The semiconductor water mist air conditioner as claimed in claim 1, wherein the atomized water particle air outlet and the air inlet of the atomized water tank are designed to prevent water from overflowing, and the design adopts a one-way design, that is, only The atomized water particles and air are allowed to enter and exit, and the water in the atomized water tank cannot overflow from the atomized water particle air outlet and the air inlet. 12. The semiconductor water mist air-conditioning device as claimed in claim 1, wherein the water inlet mechanism of the atomized water tank is designed so that only water is allowed to enter, and the water in the atomized water tank cannot overflow from the water inlet; The installation position of the water inlet is reserved for the transformation of atomized water particles, and the design of the full water level water stop of the floating ball in the water inlet is used to avoid the problem that the atomized water tank is too full and there is no space to convert water into atomized water particles. 13. The semiconductor water mist air conditioner as claimed in claim 1, wherein the electronic atomized chip can be controlled by the water level in the atomized water tank. 14. The semiconductor water mist air conditioner as claimed in claim 1, wherein plant essential oils can be added into the atomized water tank.