CN102240976A - Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device - Google Patents
Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device Download PDFInfo
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- CN102240976A CN102240976A CN2011101319364A CN201110131936A CN102240976A CN 102240976 A CN102240976 A CN 102240976A CN 2011101319364 A CN2011101319364 A CN 2011101319364A CN 201110131936 A CN201110131936 A CN 201110131936A CN 102240976 A CN102240976 A CN 102240976A
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Abstract
本发明公开一种化学机械抛光研磨液输送系统及化学机械抛光研磨设备，化学机械抛光研磨液输送系统包括：第一至第五容器、磨粒搅拌装置、混合装置、第一至第四输送泵、流量和压力调节装置、研磨液输送泵和溢流阀，第一至第五容器分别用于提供氧化剂、络合剂、缓蚀剂、磨粒和去离子水；流量和压力调节装置与混合装置相连，用于混合装置内的研磨液输送给化学机械研磨台；研磨液输送泵串联在混合装置与流量和压力调节装置之间；溢流阀连接在混合装置与流量和压力调节装置之间且与研磨液输送泵并联。根据本发明的化学机械抛光研磨液输送系统在整个输送过程中，磨粒一直被搅拌，可以有效防止颗粒沉淀、絮凝造成的表面划伤。
The invention discloses a chemical mechanical polishing slurry delivery system and chemical mechanical polishing grinding equipment. The chemical mechanical polishing slurry delivery system includes: first to fifth containers, an abrasive stirring device, a mixing device, and first to fourth delivery pumps , flow and pressure regulating device, grinding fluid delivery pump and overflow valve, the first to fifth containers are used to provide oxidant, complexing agent, corrosion inhibitor, abrasive grains and deionized water respectively; flow and pressure regulating device and mixing The device is connected to transport the grinding liquid in the mixing device to the chemical mechanical grinding table; the grinding liquid delivery pump is connected in series between the mixing device and the flow and pressure regulating device; the overflow valve is connected between the mixing device and the flow and pressure regulating device And it is connected in parallel with the grinding liquid delivery pump. According to the chemical mechanical polishing slurry delivery system of the present invention, the abrasive particles are constantly stirred during the whole delivery process, which can effectively prevent surface scratches caused by particle precipitation and flocculation.
Description
Technical field
The present invention relates to a kind of chemical mechanical polishing liquid induction system, particularly a kind of chemically mechanical polishing milling apparatus that uses this system.
Background technology
Chemically mechanical polishing (CMP) technology is the focus technology in the present semiconductor machining industry, and he mainly mutually promotes by mechanism and chemical action and reaches the effect of overall planarization.Along with the wafer wiring number of plies is more and more, live width is more and more littler, and irreplaceable effect is being brought into play in chemically mechanical polishing, is known that the prescription of lapping liquid and technological parameter have very big influence for the effect of chemically mechanical polishing.
Summary of the invention
The present inventor discovers, the flow of the flocculation of abrasive particle, precipitation and polishing fluid in the lapping liquid, and pressure etc. all can influence polishing effect.Whether polishing fluid mixes even, and whether stable the grade all can exert an influence to polish results the pressure of lapping liquid supply.Therefore, the applicant's inventor finds, by avoiding the precipitation of abrasive material in the lapping liquid, makes lapping liquid fully mix, and guarantees that effectively the flow of lapping liquid supply and pressure stability can improve grinding effect.
For this reason, one object of the present invention is to propose a kind of chemical mechanical polishing liquid induction system that the lapping liquid of carrying is had flow, pressure stability.
Another object of the present invention is to propose a kind of chemically mechanical polishing milling apparatus with above-mentioned chemical mechanical polishing liquid induction system.
For achieving the above object, chemical mechanical polishing liquid induction system that provides according to a first aspect of the invention and chemically mechanical polishing milling apparatus, the chemical mechanical polishing liquid induction system comprises: first to the 5th container, abrasive particle agitating device, mixing arrangement, first to fourth delivery pump, flow and pressure-regulating device, lapping liquid delivery pump and overflow valve; First to the 5th container is respectively applied for provides oxidant, complexing agent, corrosion inhibiter, abrasive particle and deionized water; The abrasive particle agitating device is located at the abrasive particle that is used in the 4th container stir in the 4th container; First to the 5th container mixing arrangement respectively links to each other and is connected in parallel to each other, and mixing arrangement is used for from first to the 5th container transport respectively is mixed into lapping liquid to oxidant, complexing agent, corrosion inhibiter, abrasive particle and deionized water in it; First to fourth delivery pump is located between first to fourth container and the mixer correspondingly; Flow links to each other with mixing arrangement with pressure-regulating device, and the lapping liquid that is used in the mixing arrangement flows to chemical machinery break-in platform; The lapping liquid delivery pump is connected between mixing arrangement and flow and the pressure-regulating device; Overflow valve is connected between mixing arrangement and flow and the pressure-regulating device and is in parallel with the lapping liquid delivery pump.
Chemical mechanical polishing liquid induction system according to the present invention is with the full and uniform mixing of lapping liquid each component, to cmp platform supply lapping liquid.In whole transportation process, abrasive particle in whipping process, can effectively prevent the surface tear that solids precipitation, flocculation cause always; Overflow valve is between mixing arrangement and flow and pressure-regulating device, when the loine pressure of flow and pressure-regulating device during greater than setting value, carrying back-mixing to attach together unnecessary lapping liquid by overflow valve puts, effectively guarantee the flow of lapping liquid supply and stablizing of pressure, thereby improved the processing quality of chemically mechanical polishing.
In addition, the chemical mechanical polishing liquid induction system according to first aspect present invention can also have following additional technical characterictic:
According to some embodiments of the present invention, be provided with the lapping liquid agitator in the described mixing arrangement and be used for mixing equably described lapping liquid.
According to a concrete example of the present invention, described abrasive particle is a Ludox.
According to one embodiment of present invention, described first to the 5th container is the perfluoro alkoxy material.
According to concrete examples more of the present invention, be provided with switch valve between described the 5th container and the described mixing arrangement.
Second aspect present invention proposes a kind of chemically mechanical polishing milling apparatus, comprising: the chemically mechanical polishing grinding table; With the chemical mechanical polishing liquid induction system, described chemical mechanical polishing liquid induction system is according to the described chemical mechanical polishing liquid induction system of first aspect present invention, and the flow of described chemical mechanical polishing liquid induction system links to each other with described chemically mechanical polishing grinding table with pressure-regulating device.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the chemical mechanical polishing liquid induction system that provides according to the embodiment of the invention and the schematic diagram of chemically mechanical polishing milling apparatus.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical from start to finish or similar label is represented identical or similar elements or the element with identical or similar functions.Below by the embodiment that is described with reference to the drawings is exemplary, only is used to explain the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center "; " vertically "; " laterally "; " on "; D score; " preceding ", " back ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", close the orientation of indications such as " outward " or position is based on orientation shown in the drawings or position relation, only be that the present invention for convenience of description and simplification are described, rather than the device or the element of indication or hint indication must have specific orientation, therefore orientation structure and operation with specific can not be interpreted as limitation of the present invention.In addition, term " first ", " second " only are used to describe purpose, and can not be interpreted as indication or hint relative importance.
In description of the invention, need to prove that unless clear and definite regulation and qualification are arranged in addition, term " installation ", " linking to each other ", " connection " should be done broad understanding, for example, can be fixedly connected, also can be to removably connect, or connect integratedly; Can be mechanical connection, also can be to be electrically connected; Can be directly to link to each other, also can link to each other indirectly by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can concrete condition understand above-mentioned term concrete implication in the present invention.
Below with reference to the chemical mechanical polishing liquid induction system of accompanying drawing description according to the embodiment of the invention.
Referring to Fig. 1, according to the chemical mechanical polishing liquid induction system and the chemically mechanical polishing milling apparatus of the embodiment of the invention, the chemical mechanical polishing liquid induction system comprises: first container 101, second container 102, the 3rd container 103, the 4th container 104, the 5th container 105, abrasive particle agitating device 205, mixing arrangement 106, first delivery pump 201, second delivery pump 202, the 3rd delivery pump 203, the 4th delivery pump 204, flow and pressure-regulating device 107, lapping liquid delivery pump 207 and overflow valve 208.
Particularly, first container 101, second container 102, the 3rd container 103, the 4th container 104, the 5th container 105 is respectively applied for that oxidant, complexing agent, corrosion inhibiter, abrasive particle and deionized water are provided, and link to each other with mixing arrangement 106 respectively and be connected in parallel to each other, mixing arrangement 106 is used for from first to the 5th container transport respectively is mixed into lapping liquid to oxidant, complexing agent, corrosion inhibiter, abrasive particle and deionized water in it.Make the full and uniform mixing of each component in the lapping liquid by the mixing in mixing arrangement 106, in whole transportation process, abrasive particle in whipping process, can effectively prevent the surface tear that solids precipitation, flocculation cause always.
Need to prove, abrasive particle can be colloidal silica abrasive grain, can be provided with abrasive particle agitating device 206 in the 4th container 104, before abrasive particle enters mixer 106, abrasive particle is established 206 through the abrasive particle agitating device and fully is admitted in the mixing arrangement 106 after the stirring again in the 4th container 104, abrasive particle is continued to stir in the 4th container 104 like this, can effectively avoid the precipitation and the flocculation of colloidal silica abrasive grain, prevents the scraping to polished surface.
Flow links to each other with mixing arrangement 106 with pressure-regulating device 107, and the lapping liquid that is used in the mixing arrangement 106 flows to cmp platform 108; Lapping liquid delivery pump 207 is connected between mixing arrangement 106 and flow and the pressure-regulating device 107; Overflow valve 208 is connected between mixing arrangement 106 and flow and the pressure-regulating device 107 and is in parallel with lapping liquid delivery pump 207.
Referring to Fig. 1, according to some embodiments of the present invention, be provided with lapping liquid agitator 206 in the mixing arrangement 106 and be used for mixed grinding liquid equably, lapping liquid agitator 206 is set after, can make more even that various additives mix, guarantee the stability of polishing fluid.
According to one embodiment of present invention, first container 101, second container 102, the 3rd container 103, the 4th container 104 and the 5th container 105 can be the perfluoro alkoxy material, and the transfer pipeline 401 that they are connected with mixing arrangement 106 is also made by the perfluoro alkoxy material.
According to concrete examples more of the present invention, be provided with switch valve 209 between the 5th container 105 and the mixing arrangement 106, the deionized water in the 5th container 105 be injected in the mixing arrangement 106 by the aequum of transfer pipeline 401 according to proportioning by gauge tap valve 209.
Chemically mechanical polishing milling apparatus according to an embodiment of the invention is described below.
Chemically mechanical polishing milling apparatus according to the embodiment of the invention provides comprises: chemically mechanical polishing grinding table 108; With the chemical mechanical polishing liquid induction system, the chemical mechanical polishing liquid induction system is a chemical mechanical polishing liquid induction system according to the above embodiment of the present invention, and the flow of chemical mechanical polishing liquid induction system links to each other with chemically mechanical polishing grinding table 108 with pressure-regulating device 107.
Below with reference to the simple course of work of describing according to embodiment of the invention chemical mechanical polishing liquid induction system of Fig. 1.
Respectively that lapping liquid is required oxidant, complexing agent, corrosion inhibiter and the abrasive particle of first delivery pump 201, second delivery pump 202, the 3rd delivery pump 203 and the 4th delivery pump 204 is drawn into mixing arrangement 106 according to the required amount of proportioning from first container 101, second container 102, the 3rd container 103 and the 4th container 104, by gauge tap valve 209 deionized water in the 5th container 105 is injected in the mixing arrangement 106 according to the required amount of proportioning, mixes by the lapping liquid agitator 206 in the mixing arrangement 106; Through after fully stirring, the lapping liquid of mixing being finished by lapping liquid delivery pump 207 is fed to flow and pressure-regulating device 107 to lapping liquid in mixing arrangement 106; When mixing arrangement 106 to first pipeline, 405 pressure of flow and pressure-regulating device 107 during greater than setting value, by overflow valve 208 with unnecessary lapping liquid via second pipeline 403, overflow valve 208, pipeline 404 is carried back the lapping liquid mixing arrangement; The lapping liquid of regulating in the conveying loops by control flow and pressure-regulating device 107, and the lapping liquid that will be adjusted to required flow of glossing and pressure is transported to cmp platform 108.
According to the chemical mechanical polishing liquid induction system of the embodiment of the invention with the full and uniform mixing of lapping liquid each component, to cmp platform 108 supply lapping liquids.In whole transportation process, abrasive particle is stirred always, can effectively prevent the surface tear that solids precipitation, flocculation cause; Overflow valve 208 is between mixing arrangement 106 and flow and pressure-regulating device 107, when first pipeline, 405 pressure of flow and pressure-regulating device 107 during greater than setting value, carry back-mixing to attach together unnecessary lapping liquid by overflow valve 208 and put 106, effectively guarantee the flow of lapping liquid supply and stablizing of pressure, thereby improved the processing quality of chemically mechanical polishing.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011101319364A CN102240976A (en) | 2011-05-20 | 2011-05-20 | Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device |
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| CN2011101319364A CN102240976A (en) | 2011-05-20 | 2011-05-20 | Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device |
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| CN2011101319364A Pending CN102240976A (en) | 2011-05-20 | 2011-05-20 | Chemically mechanical polishing grinding fluid conveying system and chemically mechanical polishing grinding device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104972381A (en) * | 2015-02-03 | 2015-10-14 | 浙江工业大学 | Ultra-smooth surface fluid polishing device based on gas-liquid-solid-phase abrasive grain flow |
| CN105773399A (en) * | 2016-03-29 | 2016-07-20 | 清华大学 | Polishing solution, polishing machine and polishing method |
| CN105856074A (en) * | 2016-05-30 | 2016-08-17 | 深圳汇准科技有限公司 | Intelligent grinding fluid feeding system |
| CN106475897A (en) * | 2016-10-11 | 2017-03-08 | 京东方科技集团股份有限公司 | Substrate grinding device and substrate cleaning equipment |
| CN111604807A (en) * | 2019-02-22 | 2020-09-01 | 亚泰半导体设备股份有限公司 | Grinding liquid mixing supply system |
| CN115533734A (en) * | 2022-11-30 | 2022-12-30 | 唐山国芯晶源电子有限公司 | Grinding fluid flow control device and method for grinding machine |
| CN115890493A (en) * | 2022-11-23 | 2023-04-04 | 骏一(苏州)半导体科技有限公司 | Semiconductor 12-inch process below 20nm polishing liquid supply system and method |
| CN117086779A (en) * | 2022-05-12 | 2023-11-21 | 成都高真科技有限公司 | Grinding liquid supply device and chemical mechanical grinding equipment |
| TWI865931B (en) * | 2022-06-30 | 2024-12-11 | 大陸商西安奕斯偉材料科技股份有限公司 | A polishing liquid storage and mixing device |
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| CN1356369A (en) * | 2000-11-17 | 2002-07-03 | 理音株式会社 | Apparatus for preparing grinding liquid |
| US6769960B2 (en) * | 2002-05-31 | 2004-08-03 | Renesas Technology Corp. | System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
| CN1833821A (en) * | 2005-03-15 | 2006-09-20 | 联华电子股份有限公司 | Polishing liquid supply equipment and polishing liquid mixing method for chemical mechanical polishing machine |
| CN101573425A (en) * | 2006-12-29 | 2009-11-04 | 株式会社Lg化学 | CMP slurry composition for forming metal wire |
| US20090298393A1 (en) * | 2008-05-30 | 2009-12-03 | Sumco Techxiv Corporation | Slurry supplying apparatus and method of polishing semiconductor wafer utilizing same |
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2011
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1356369A (en) * | 2000-11-17 | 2002-07-03 | 理音株式会社 | Apparatus for preparing grinding liquid |
| US6769960B2 (en) * | 2002-05-31 | 2004-08-03 | Renesas Technology Corp. | System for manufacturing a semiconductor device, polishing slurry feeder and method for manufacturing a semiconductor device |
| CN1833821A (en) * | 2005-03-15 | 2006-09-20 | 联华电子股份有限公司 | Polishing liquid supply equipment and polishing liquid mixing method for chemical mechanical polishing machine |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104972381A (en) * | 2015-02-03 | 2015-10-14 | 浙江工业大学 | Ultra-smooth surface fluid polishing device based on gas-liquid-solid-phase abrasive grain flow |
| CN105773399A (en) * | 2016-03-29 | 2016-07-20 | 清华大学 | Polishing solution, polishing machine and polishing method |
| CN105856074A (en) * | 2016-05-30 | 2016-08-17 | 深圳汇准科技有限公司 | Intelligent grinding fluid feeding system |
| CN106475897A (en) * | 2016-10-11 | 2017-03-08 | 京东方科技集团股份有限公司 | Substrate grinding device and substrate cleaning equipment |
| CN111604807A (en) * | 2019-02-22 | 2020-09-01 | 亚泰半导体设备股份有限公司 | Grinding liquid mixing supply system |
| CN111604807B (en) * | 2019-02-22 | 2021-11-09 | 亚泰半导体设备股份有限公司 | Grinding fluid mixing and supplying system |
| CN117086779A (en) * | 2022-05-12 | 2023-11-21 | 成都高真科技有限公司 | Grinding liquid supply device and chemical mechanical grinding equipment |
| TWI865931B (en) * | 2022-06-30 | 2024-12-11 | 大陸商西安奕斯偉材料科技股份有限公司 | A polishing liquid storage and mixing device |
| CN115890493A (en) * | 2022-11-23 | 2023-04-04 | 骏一(苏州)半导体科技有限公司 | Semiconductor 12-inch process below 20nm polishing liquid supply system and method |
| CN115533734A (en) * | 2022-11-30 | 2022-12-30 | 唐山国芯晶源电子有限公司 | Grinding fluid flow control device and method for grinding machine |
| CN115533734B (en) * | 2022-11-30 | 2023-02-14 | 唐山国芯晶源电子有限公司 | Grinding fluid flow control device and method for grinding machine |
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Application publication date: 20111116 |