CN102237494A - A kind of OLED display device and packaging structure and packaging method thereof - Google Patents

Abstract

The invention relates to an OLED display device, a packaging structure and a packaging method thereof. An OLED display device, comprising an encapsulating glass cover plate at the bottom and a glass substrate at the top, the OLED unit is attached to the lower part of the glass substrate, and is characterized in that a circle of sealed UV resin connection is provided outside the peripheral edge of the OLED unit Between the encapsulation glass cover plate and the glass substrate, the OLED unit is sealed in the airtight space formed by the glass cover plate, the glass substrate and the sealing UV resin. Sealed fritted glass around UV resin. The beneficial effects of the invention are: since frit glass has better sealing performance than UV glue, the encapsulation structure and encapsulation method of the OLED display device combined and sealed by frit glass and UV resin have better sealing effect.

Description

A kind of OLED display device and packaging structure and packaging method thereof

technical field

The invention relates to plane display technology, in particular to the packaging technology of an organic light-emitting device (OLED).

Background technique

Encapsulation technology is a core technology of OLED technology, because the OLED unit itself is very sensitive to water vapor and oxygen, and if it comes into contact with water vapor or oxygen, it will cause rapid degradation of the OLED unit. The traditional OLED packaging structure is shown in Figure 1, which uses UV resin 2 to seal the OLED unit 6, but because the UV resin 2 still has a certain degree of air permeability, it is generally packaged inside the glass cover plate 1 and the glass substrate 5. To adhere to the desiccant 7, to enhance the adsorption capacity of water vapor and oxygen.

In the existing industrialized production process, in order to form the OLED display device 3 as shown in Figure 1, several M×N (M, N are natural numbers) matrix arrangements are usually formed on a large packaging glass cover plate 1. OLED display devices, after the packaging of these OLED display devices arranged in a matrix is completed, they are cut into M×N independent OLED display devices.

Before cutting, it is necessary to bond the glass substrate 5, OLED unit 6, and encapsulation glass cover plate 1 of the OLED display together through UV resin 2, and seal the glass substrate 5 and the encapsulation glass cover plate 1. The desiccant 7 is pasted in the cavity. In the packaging process, in order to cure the UV resin 2, it is necessary to use a UV lamp to irradiate the UV resin 2, but the irradiation of the UV lamp will damage the organic light-emitting layer of the OLED unit 6. 2. During curing, the UV light irradiates the organic light-emitting layer 5, and measures need to be taken to prevent the UV light from irradiating the OLED unit 6. In the prior art, a mask is used to solve this problem, and a mask is used to block the places that cannot be irradiated.

Fused glass has good sealing performance, and can maintain sealing performance within 7000 hours at 85°C and 85% relative humidity, which is far greater than the sealing performance of existing UV resins. However, due to some materials inside OLED displays such as organic The light-emitting layer cannot withstand high temperature, so frit glass will affect the performance of other layers when it is fritted and sealed at high temperature. Therefore, in the existing OLED technology field, frit glass has not been used as a sealing material to seal OLED units.

Contents of the invention

The object of the present invention is to improve the sealing performance of the OLED display device, and propose an OLED display device and its packaging structure and packaging method.

The technical solution of the present invention: a packaging structure of an OLED display device, including an uncut packaging glass cover plate at the bottom and an uncut glass substrate at the top, and a plurality of OLED units are arranged in a matrix structure and attached to the glass substrate. In the lower part, there is a ring of sealing UV resin outside the surrounding edge of each OLED unit, which is connected between the encapsulation glass cover and the glass substrate to seal each OLED unit in the airtight structure formed by the glass cover, glass substrate and sealing UV resin. In the space, there is a circle of frit glass surrounding the periphery of the sealing UV resin outside the peripheral edge of each OLED unit, and the peripheral edge of the uncut packaging glass cover plate and the uncut glass substrate is provided with UV resin for All OLED units are sealed in a closed space formed by glass cover, glass substrate and UV resin.

Another technical solution of the present invention is: an OLED display device, comprising an encapsulating glass cover plate at the bottom and a glass substrate at the top, and the OLED unit is attached to the lower part of the glass substrate, wherein the OLED unit is surrounded by There is a ring of sealing UV resin outside the edge, which is connected between the packaging glass cover plate and the glass substrate to seal the OLED unit in the airtight space formed by the glass cover plate, glass substrate and sealing UV resin. Each OLED unit There is a circle of sealing frit glass surrounding the periphery of the sealing UV resin outside the peripheral edge.

A desiccant is also pasted in the sealed space formed by the glass cover plate, the glass substrate and the fritted glass of the above-mentioned OLED display device.

The technical scheme of the packaging method of the packaging structure of the OLED display device of the present invention: a packaging method of the OLED display device, comprising the following steps:

Step a: Using screen printing equipment, coat a circle of fritted glass on the surrounding edges of the corresponding positions of each OLED unit on the uncut packaging glass cover plate. The fritted glass has a thickness of 5-30 μm and a width of 0.3～6mm;

Step b: Bake the uncut glass cover plate that has completed step a by using a hot plate or a vacuum furnace to solidify the fritted glass;

Step c: Load the uncut encapsulation glass cover plate that has completed step b into the encapsulation equipment and transfer it to the UV resin coating chamber, and pass through the UV resin coating equipment on the corresponding OLED unit of the uncut encapsulation glass cover plate A ring of sealing UV resin is applied to the inside of the fritted glass outside the peripheral edge of the position, and then a ring of UV resin is coated in the peripheral edge of the uncut package glass cover plate by UV resin coating equipment, and the sealing UV resin and The thickness of the cured UV resin is 10-100μm, and the width is 0.5-5mm;

Step d: In a pure nitrogen environment, attach the uncut packaging glass cover plate and the uncut glass substrate loaded with OLED units in step c, and then irradiate with UV light to make the outer edges of each OLED unit A circle of sealing UV resin inside the fritted glass and the UV resin located in the surrounding edges of the uncut packaging glass cover are cured and the preliminary packaging process is completed to form a preliminary packaging structure;

Step e: Take out the preliminary packaging structure formed by the uncut packaging glass cover plate and the glass substrate that have completed the preliminary packaging process from the packaging equipment, and melt and weld the frit glass by laser irradiation, so that the OLED unit is packaged. The laser used for laser irradiation is an infrared band laser with a wavelength between 780 and 900 nanometers;

Step f: sending the packaging structure completed in step e into a cutting device to cut to obtain an OLED display device.

In step c of the encapsulation method of the above-mentioned OLED display device, before the uncut encapsulation glass cover plate is transferred to the UV resin coating chamber, it also includes an encapsulation glass cover plate at the corresponding position of each OLED unit. desiccant process.

The beneficial effects of the invention are: since frit glass has better sealing performance than UV glue, the encapsulation structure and encapsulation method of the OLED display device combined and sealed by frit glass and UV resin have better sealing effect. In this structure, the encapsulation effect is further enhanced after adding a desiccant.

Description of drawings

Accompanying drawing 1 is the structure diagram of OLED display device.

Figure 2 is a schematic structural view of the packaging structure of the OLED display device of the present invention.

Fig. 3 is a structural schematic diagram of the encapsulation structure section of the OLED display device of the present invention.

Figure 4 is a schematic structural view of an embodiment of the OLED display device of the present invention.

Fig. 5 is a schematic structural diagram of another embodiment of the OLED display device of the present invention.

Description of reference numerals: encapsulating glass cover plate 1 , UV resin 2 , OLED display device 3 , frit glass 4 , glass substrate 5 , OLED unit 6 , desiccant 7 , sealing UV resin 8 .

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figures 2 and 3, a packaging structure of an OLED display device includes an uncut packaging glass cover plate 1 at the bottom and an uncut glass substrate 5 at the top, and a plurality of OLED units 6 are arranged in a matrix structure Attached to the lower part of the glass substrate 5, the space in the dotted frame in the figure can be regarded as an OLED display device, and there is a circle of sealing UV resin 8 outside the surrounding edge of each OLED unit 6, which is connected to the encapsulating glass cover plate 1 and the glass substrate 5 are used to seal each OLED unit 6 in the airtight space formed by the glass cover plate 1, the glass substrate 5 and the sealing UV resin 8, and there is a circle around the edge of each OLED unit 6 Surrounding the frit glass 4 on the periphery of the sealing UV resin 8, the surrounding edges of the uncut packaging glass cover plate 1 and the uncut glass substrate 5 have UV resin 2 to seal all OLED units 6 on the glass cover plate 1. In the closed space formed by the glass substrate 5 and the UV resin 2.

As shown in FIG. 4, another technical solution of the present invention is: an OLED display device, comprising an encapsulating glass cover plate 1 at the bottom and a glass substrate 5 at the top, an OLED unit 6 is attached to the lower part of the glass substrate 5, It is characterized in that there is a ring of sealing UV resin 8 outside the peripheral edge of the OLED unit 6, which is connected between the packaging glass cover plate 1 and the glass substrate 5 to seal the OLED unit 6 between the glass cover plate 1 and the glass substrate 5. In the airtight space formed by the sealing UV resin 8 , each OLED unit 6 has a circle of sealing frit glass 4 surrounding the periphery of the sealing UV resin 8 .

As shown in FIG. 5 , on the basis of the scheme shown in FIG. 4 , a desiccant 7 is attached in the enclosed space formed by the packaging glass cover 1 , the glass substrate 5 and the frit glass 4 of the OLED display device. In this embodiment, the desiccant 7 is pasted on the packaging glass cover plate 1 .

The technical solution for the packaging method of the OLED display device as shown in Figure 4 is: a packaging method of the OLED display device, comprising the following steps:

Step a: Using screen printing equipment, coat a circle of frit glass 4 on the periphery of the corresponding position of each OLED unit 6 on the uncut packaging glass cover plate 1, the thickness of the frit glass 4 is 5-5 30μm, width 0.3~6mm;

Step b: Bake the uncut glass cover plate 1 that has completed step a by using a hot plate or a vacuum furnace to solidify the frit glass 4;

Step c: Load the uncut encapsulation glass cover plate 1 that has completed step b into the encapsulation equipment and transfer it to the UV resin 2 coating chamber, and pass through the UV resin coating equipment on each OLED of the uncut encapsulation glass cover plate 1 A ring of sealing UV resin 8 is coated on the inside of the frit glass 4 outside the peripheral edge of the corresponding position of the unit 6, and then a ring is coated on the peripheral edge of the uncut packaging glass cover plate 1 by the UV resin coating equipment UV resin 2, sealing UV resin 8 and UV resin 2 have a thickness of 10-100 μm and a width of 0.5-5 mm after curing;

Step d: In a pure nitrogen environment, attach the uncut encapsulating glass cover plate 1 completed in step c to the uncut glass substrate 5 loaded with OLED units 6 , and then irradiate each OLED unit 6 with UV light. A circle of sealing UV resin 8 inside the frit glass 4 outside the peripheral edge and the UV resin 2 located in the peripheral edge of the uncut packaging glass cover plate 1 are cured and the preliminary packaging process is completed to form a preliminary packaging structure;

Step e: Take out the preliminary packaging structure composed of the uncut packaging glass cover plate 1 and the glass substrate 5 that has completed the preliminary packaging process from the packaging equipment, and melt and weld the frit glass 4 by laser irradiation, so that the OLED unit 6 is completed In packaging, the laser used for the laser irradiation is an infrared laser with a wavelength between 780 and 900 nanometers.

Step f: sending the packaging structure completed in step e into a cutting device to cut to obtain an OLED display device.

Through the above steps, an OLED display device as shown in FIG. 4 is obtained.

The technical solution for the packaging method of an OLED display device as shown in Figure 5 is: a packaging method for an OLED display device, comprising the following steps:

Step a: Using screen printing equipment, coat a circle of frit glass 4 on the periphery of the corresponding position of each OLED unit 6 on the uncut packaging glass cover plate 1, the thickness of the frit glass 4 is 5-5 30μm, width 0.3~6mm;

Step b: Bake the uncut glass cover plate 1 that has completed step a by using a hot plate or a vacuum furnace to solidify the frit glass 4;

Step c: Load the uncut packaging glass cover plate 1 that has completed step b into the packaging equipment, attach a desiccant to the corresponding position of each OLED unit, and transfer the uncut packaging glass cover plate 1 with the desiccant attached to the In the UV resin 2 coating cavity, a circle of sealing UV resin 8 is coated on the periphery of the frit glass 4 outside the periphery of each OLED unit 6 of the uncut packaging glass cover plate 1 by the UV resin coating equipment, and then Coat a circle of UV resin 2 on the surrounding edge of the uncut packaging glass cover plate 1 by UV resin coating equipment, the thickness of UV resin 2 after curing is 10-100 μm, and the width is 0.5-5 mm

Step d: In a pure nitrogen environment, attach the uncut packaging glass cover plate 1 completed in step c to the uncut glass substrate 5 loaded with the OLED unit 6, and then irradiate the uncut packaging glass with UV light The UV resin 2 in the peripheral edge of the cover plate 1 is cured and the preliminary packaging process is completed to form a preliminary packaging structure;

Step e: Take out the preliminary packaging structure composed of the uncut packaging glass cover plate 1 and the glass substrate 5 that has completed the preliminary packaging process from the packaging equipment, and melt and weld the frit glass 4 by laser irradiation, so that the OLED unit 6 is completed Packaging, the laser used for the laser irradiation is an infrared band laser with a wavelength between 780 and 900 nanometers;

Step f: sending the packaging structure completed in step e into a cutting device to cut to obtain an OLED display device.

After the above steps are completed, an OLED display device as shown in FIG. 5 is obtained.

Those skilled in the art will appreciate that the embodiments described here are to help readers understand the principles of the present invention, and it should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the technical revelations disclosed in the present invention without departing from the essence of the present invention, and these modifications and combinations are still within the protection scope of the present invention.

Claims (5)

1. A packaging structure for an OLED display device, comprising an uncut encapsulation glass cover plate positioned at the bottom and an uncut glass substrate positioned at the top, a plurality of OLED units are arranged in a matrix structure and attached to the lower part of the glass substrate, each There is a ring of sealing UV resin outside the periphery of the OLED unit, which is connected between the encapsulating glass cover and the glass substrate to seal each OLED unit in the airtight space formed by the glass cover, glass substrate and sealing UV resin. The surrounding edges of each OLED unit have a circle of frit glass surrounding the periphery of the sealing UV resin, and the surrounding edges of the uncut encapsulating glass cover plate and the uncut glass substrate have UV resin to seal all the OLED units. It is sealed in a closed space formed by glass cover, glass substrate and UV resin. 2. An OLED display device, comprising an encapsulation glass cover plate positioned at the bottom and a glass substrate positioned at the top, the OLED unit is attached to the bottom of the glass substrate, it is characterized in that a circle of sealed UV The resin is connected between the encapsulating glass cover plate and the glass substrate to seal the OLED unit in the airtight space formed by the glass cover plate, the glass substrate and the sealing UV resin, and there is a circle around the edge of each OLED unit Sealed fritted glass at the periphery of the sealed UV resin. 3 . The OLED display device according to claim 2 , wherein a desiccant is attached to the enclosed space formed by the glass cover plate, the glass substrate and the fritted glass of the OLED display device. 4 . 4. A packaging method for an OLED display device, comprising the steps of: Step a: Using screen printing equipment, coat a circle of fritted glass on the surrounding edges of the corresponding positions of each OLED unit on the uncut packaging glass cover plate. The fritted glass has a thickness of 5-30 μm and a width of 0.3～6mm; Step b: Bake the uncut glass cover plate that has completed step a by using a hot plate or a vacuum furnace to solidify the fritted glass; Step c: Load the uncut encapsulation glass cover plate that has completed step b into the encapsulation equipment and transfer it to the UV resin coating chamber, and pass through the UV resin coating equipment on the corresponding OLED unit of the uncut encapsulation glass cover plate A ring of sealing UV resin is applied to the inside of the fritted glass outside the peripheral edge of the position, and then a ring of UV resin is coated in the peripheral edge of the uncut package glass cover plate by UV resin coating equipment, and the sealing UV resin and The thickness of the cured UV resin is 10-100μm, and the width is 0.5-5mm; Step d: In a pure nitrogen environment, attach the uncut packaging glass cover plate and the uncut glass substrate loaded with OLED units in step c, and then irradiate with UV light to make the outer edges of each OLED unit A circle of sealing UV resin inside the fritted glass and the UV resin located in the surrounding edges of the uncut packaging glass cover are cured and the preliminary packaging process is completed to form a preliminary packaging structure; Step e: Take out the preliminary packaging structure formed by the uncut packaging glass cover plate and the glass substrate that have completed the preliminary packaging process from the packaging equipment, and melt and weld the frit glass by laser irradiation, so that the OLED unit is packaged. The laser used for laser irradiation is an infrared band laser with a wavelength between 780 and 900 nanometers; Step f: sending the packaging structure completed in step e into a cutting device to cut to obtain an OLED display device. 5. The encapsulation method of an OLED display device according to claim 4, characterized in that, before the uncut encapsulation glass cover plate is delivered to the UV resin coating cavity in the above step c, further comprising a The process of attaching a desiccant to the encapsulation glass cover plate at the corresponding position of each OLED unit.

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