CN102237079A - Unit with sound insulation and shock isolation structure, array structure and manufacturing method of unit and array structure - Google Patents

Abstract

The invention discloses a unit with a sound insulation and shock isolation structure, an array structure comprising the unit and a manufacturing method of the array structure. This unit with sound insulation shock insulation structure contains: a hollow outer frame, the hollow outer frame having an inner space; a film, which is configured in the inner space and is vertical to the inner wall of the hollow outer frame; and a first mass body disposed on an upper surface of the film, wherein a cross-sectional area of the inner space is larger than an area of the upper surface of the film.

Description

Cell with sound- and vibration-insulating structure, array structure, and manufacturing method for both

technical field

The invention relates to a unit with a sound-proof and shock-proof structure, in particular to a unit with a negative-mass sound-proof and shock-proof structure. the

Background technique

The energy dissipation structure with the function of blocking noise or vibration is widely used. The traditional sound insulation/seismic isolation and energy dissipation technology uses the nature of the material, that is, uses the damping generated by the deformation of the material to dissipate energy. the

Traditional damping energy dissipation systems, such as U.S. patents 6012543, 6082489, 5854453, and 5543198, mostly use compressed air or structural deformation to achieve energy dissipation effects, but this type of damping system has many inherently insurmountable shortcomings, including energy insufficiency Recycling, frequency and bandwidth cannot be selected, large buffer space is required, and there is no transparency. the

Therefore, the development of a novel sound-insulation/seismic-isolation structure to replace the traditional damping energy dissipation system is an urgent research focus. the

Contents of the invention

Based on the above, the present invention provides a unit with a sound-proof and shock-proof structure, which can completely block the transmission of sound waves or shock waves under the designed frequency and bandwidth. The purpose of effectively blocking noise and vibration is achieved by adjusting and selecting the material, quality, and elastic modulus of each component of the unit with the sound-proof and shock-proof structure. the

According to an embodiment of the present invention, the unit with a sound and shock insulation structure includes: a hollow outer frame, the hollow outer frame has an inner space; a film is arranged in the inner space, and is connected to the inner wall of the hollow outer frame vertically; and, a first mass body is disposed on an upper surface of the film, wherein the cross-sectional area of the inner space is larger than that of the upper surface of the film. the

According to another embodiment of the present invention, the present invention also provides an array structure, including: a load-bearing substrate; and a plurality of units with a sound-proof and shock-isolation structure embedded in and through the load-bearing substrate, each of which has a sound-proof and shock-isolation structure The unit includes: a hollow outer frame, the hollow outer frame has an inner space; a film is arranged in the inner space and is perpendicular to the inner wall of the hollow outer frame; and a first mass body is arranged on the thin film On an upper surface, the hollow outer frames of any two adjacent units with a sound-proof and shock-proof structure are separated by a specific distance. the

In addition, according to other embodiments of the present invention, the present invention also provides a method for manufacturing the unit with a sound-insulating and shock-insulating structure, including: providing a hollow outer frame, the hollow outer frame having an inner space; arranging a film in the inner space , and make the film perpendicular to the inner wall of the hollow frame; and, a first mass body is arranged on an upper surface of the film, wherein the cross-sectional area of the inner space is larger than the area of the upper surface of the film. the

In order to make the above-mentioned and other purposes, features, and advantages of the present invention more obvious and understandable, the preferred embodiments are specially cited below, and in conjunction with the accompanying drawings, they are described in detail as follows:

Description of drawings

Fig. 1 is a schematic diagram showing a sound-proof and shock-proof structural unit described in a preferred embodiment of the present invention;

Fig. 2 is the upper view of the structural unit with sound and shock insulation shown in Fig. 1;

Fig. 3 is a schematic cross-sectional structure diagram of the sound-proof and shock-proof structural unit shown in Fig. 1 along the tangent line 3-3';

Fig. 4-Fig. 6 is the top view that shows some preferred embodiments of the present invention have sound-proof and earthquake-proof structure unit;

Fig. 7-Fig. 8 is the sectional structure schematic diagram showing the structural unit with sound insulation and earthquake isolation described in some preferred embodiments of the present invention;

Figure 9a-Figure 9b is a series of cross-sectional schematic diagrams, used to show the flow of the present invention to form a structural unit with sound insulation and vibration isolation by means of embossing;

Figure 10-Figure 11 is a schematic diagram showing a preferred embodiment of the present invention comprising a plurality of array structures with sound-proof and shock-proof structural units;

Fig. 12 shows the measurement results of the sound insulation/seismic insulation of the laminated structural unit with sound insulation and earthquake isolation described in Embodiment 1 of the present invention;

Fig. 13 shows the measurement results of the sound insulation/seismic insulation of the stacked sound insulation/seismic isolation structure unit described in Embodiment 2 of the present invention;

Fig. 14 is an image diagram of the laminated structural unit with sound and shock insulation according to Embodiment 1 of the present invention. the

Description of main component symbols

Units with sound-proof and shock-proof structures ~ 10;

Hollow frame ~ 12;

interior space ~ 13;

Film ~ 14;

Inner wall ~ 15;

The first mass body ~ 16;

Surface ~ 17;

Hollow area ~ 18;

lower surface ~ 19;

The second mass body ~ 20;

outer edge ~ 21;

Mold ~ 22;

Substrate 24;

array structure ~ 100;

interior space ~ 101;

Carrying substrate ~ 102;

Unit ～104 with sound-proof and shock-proof structure;

Hollow frame ~ 106;

Film ~ 108;

Mass body ~ 110;

Specific distance ~ D. the

Detailed ways

According to an embodiment of the present invention, the unit 10 with a sound-proof and shock-proof structure, please refer to FIG. 1 , includes a hollow outer frame 12, wherein the hollow outer frame 12 has an inner space 13; a film 14 is disposed in the inner space 13 Inside, the film is perpendicular to the inner wall 15 of the hollow outer frame 12; a first mass body 16 (such as a high-quality, high-density material) is disposed on an upper surface 17 of the film 14 . The horizontal cross-sectional shape of the inner space 13 can be circular, polygonal, or a combination thereof, and the shape of the outer edge 21 of the hollow frame 12 can be circular, polygonal, or a combination thereof. Wherein, the hollow outer frame 12 is connected with the first mass body 16 through the film 14 (please refer to FIG. 2 , which is the upper view of FIG. 1 ), and the function of the unit 10 with the sound and shock insulation structure is just like a vertical The spring in the direction can make the first mass body 16 reciprocate and vibrate up and down on the membrane 14 (please refer to FIG. 3 , which is a cross-sectional view of FIG. 1 along the tangent line 3-3'). The present invention is not limited to the materials of the hollow outer frame 12 , the film 14 , and the first mass body 16 , which may be, for example, polymers, metals, organic or inorganic compounds. In a preferred embodiment of the present invention, the Young's number of the suitable material for the film is preferably between 0.1Mpa and 100GPa, and the thickness of the film can be between 10nm and 10mm. the

One of the technical characteristics of the present invention is that the mass size of the hollow frame 12 and the first mass body 16 and the elastic coefficient and geometric shape (or size) of the film 14 can be adjusted, that is, for a specific frequency Sound or shock waves are isolated. The unit 10 with sound and shock insulation structure of the present invention can isolate specific frequency sound waves or shock waves from ω0 to ω0', within the specific frequency range (ω0 to ω0'), the unit with sound and shock insulation structure Unit 10 possesses negative mass properties. Among them, the definition of ω0 and ω0' satisfies the description of the following formula:

${\mathrm{<span\; class="notranslate">\; \&omega;</span>}}_{\mathrm{<span\; class="notranslate">\; 0</span>}}<span\; class="notranslate">\; =</span>\sqrt{\mathrm{<span\; class="notranslate">\; k</span>}<span\; class="notranslate">\; /</span>\mathrm{<span\; class="notranslate">\; m</span>}}$

${{\mathrm{<span\; class="notranslate">\; \&omega;</span>}}_{\mathrm{<span\; class="notranslate">\; 0</span>}}}^{<span\; class="notranslate">\; \&prime;</span>}<span\; class="notranslate">\; =</span>{\mathrm{<span\; class="notranslate">\; \&omega;</span>}}_{\mathrm{<span\; class="notranslate">\; 0</span>}}\sqrt{\mathrm{<span\; class="notranslate">\; m</span>}<span\; class="notranslate">\; +</span>\mathrm{<span\; class="notranslate">\; m</span>}<span\; class="notranslate">\; /</span>\mathrm{<span\; class="notranslate">\; m</span>}}$

M represents the mass of the outer frame, m represents the mass of the first mass body, k represents the equivalent elastic coefficient in the vertical direction of the film, and the value of k is determined by the Young's modulus and geometric parameters of the film. According to an embodiment of the present invention, the mass of the hollow outer frame may range from 0.1 mg to 1000 kg, the mass of the first mass body may range from 0.1 mg to 1000 kg, and the equivalent elastic coefficient of the film in the vertical direction is between 0.01 (N /mm) to 1000 (N/mm). In addition, the sound wave or shock wave frequency isolated by the unit with the sound and shock insulation structure of the present invention can be between 0.1 Hz and 100 kHz. the

It is worth noting that, in order to adjust the range of specific frequency sound waves or shock waves that can be isolated, please refer to FIG. 4, the present invention can make the inner space 13 of the hollow outer frame 12 The horizontal cross-sectional area ^A1 is greater than the area ^A2 of the upper surface of the film (the area ^A2 of the upper surface of the film is equal to the horizontal cross-sectional area ^A1 minus the area of the hollow area 18), changing the geometric parameters of the film, and then changing the vertical direction of the film. The equivalent elastic coefficient k of the direction. When the ratio of A ² /A ¹ is smaller, the equivalent elastic coefficient k in the vertical direction of the film is smaller. The shape of the film can be not only a sheet shape, but also a strip shape or a cross shape, please refer to Figure 5 and Figure 6, and the hollow area 18 can be circular, polygonal, fan-shaped, irregular, or a combination thereof .

In another embodiment of the present invention, please refer to FIG. 7 , the unit 10 with a sound-proof and shock-proof structure may further include a second mass body 20 disposed on the lower surface 19 of the film 14 . In addition, the first mass body 16 of the unit 10 with the sound and vibration isolation structure can penetrate the membrane 12 and be in direct contact with the second mass body 20 , please refer to FIG. 8 . the

The manufacturing method of the unit with the sound-proof and shock-proof structure of the present invention includes the following steps. Firstly, a hollow outer frame is provided, and the hollow outer frame has an inner space. Next, a thin film is arranged in the internal space, and the thin film is perpendicular to the inner wall of the hollow frame; and a first mass body is arranged on an upper surface of the thin film. It should be noted that the cross-sectional area A ¹ of the inner space may be larger than the area A ² of the upper surface of the film, so that the equivalent elastic coefficient in the vertical direction of the film is reduced, which is suitable for lower frequency noise or vibration sources. In a preferred embodiment of the present invention, the first mass body, the thin film, and the hollow outer frame are formed by rolling, photolithography, electroforming, embossing, mechanical processing, or laser processing. In addition, in a preferred embodiment of the present invention, the first mass body, the thin film, and the hollow outer frame can be completed through the same manufacturing process. For example, please refer to FIG. 9 a and FIG. 9 b , a mold 22 can be used to emboss a base material 24 to obtain an integrally formed unit 10 with a sound-proof and shock-proof structure. In addition, the first mass body can also be formed by inkjet, glue dispensing, electroplating, electroforming, or self-assembly. The manufacturing method of the unit with the sound and vibration isolation structure may further include: setting a second mass body on the lower surface of the film, and the first mass body can penetrate the film and directly contact with the second mass body .

According to other embodiments of the present invention, the present invention also provides an array structure 100, please refer to FIG. 10, which may include a carrier substrate 102; Each unit 104 with a sound and shock insulation structure includes: a hollow outer frame 106, the hollow outer frame has an inner space 101; a film 108 is arranged in the inner space 101; and a mass body 110 is arranged in the film 108 on. It is worth noting that the hollow outer frames 106 of any two adjacent units 104 with sound and vibration isolation structures must be separated by a specific distance D, and this distance D can be adjusted according to actual needs to control the density of the structural units on the carrier substrate , but to ensure that adjacent units 104 do not affect each other through their outer frame contact, wherein the specified distance is between 100 nm and 100 cm. The arrangement of the plurality of units 104 with sound and vibration isolation structures on the carrier substrate 102 can be ordered or random, and the array structure can be single-layer or multi-layer, please refer to FIG. 11 . the

The following examples and comparative examples are used to illustrate the unit with the sound-proof and shock-proof structure of the present invention, so as to further clarify the technical features of the present invention. the

Example 1: Low-frequency resonance structure design

First, take several acrylic tubes (tube thickness = 2mm, tube length = 2.5cm, diameter = 5cm, weight = 10.5g) as a hollow outer frame, and take several rubber films (film thickness is 80μm, equivalent K value = 50.6kg/m), and copper (mass = 3.7g) is used as the mass body, and assembled into a unit with a sound-proof and shock-proof structure as shown in Figure 14. The frequency of the suitable noise or vibration source is calculated to be less than 100Hz. Then, a low-frequency vibration is provided by a piezoelectric vibration source, and the frequency response of the system is measured by a fiber-optic interferometer combined with a frequency sweep. While increasing the stimulus frequency during measurement, measure the response at this frequency, measure the input amplitude at the same time, and normalize the amplitude to obtain the decibel value of attenuation. The results are shown in Figure 12. the

From the measurement results shown in Figure 12, it can be known that the negative mass effect occurs after 59Hz, and the energy resonates on the film to form a standing wave, and the phase is opposite to that of the outer frame, causing the vibration of the system to attenuate rapidly, and the blocking bandwidth (negative decibel (dB) value area) about 30Hz (59Hz ~ 88Hz), the maximum attenuation can reach nearly 40 decibels (dB). the

Example 2: Multi-frequency domain simulation

In order to verify the barrier effect of the material, we use the finite element analysis software (ANSYS) to model the designed film quality structure, in which the substrate selected is PET (Young's modulus is about 3Gpa). A circular outer frame embedded in the base material is made on the top, and the PET film structure is arranged in the inner area of the outer frame. In addition, a high-quality material was filled in the center of the film structure to form a mass (copper, density 8.92 g/cm ³ ). In addition, if the resulting units with sound and shock insulation structures are stacked, a material that is 1000 times softer than PET can be added between two adjacent units. Here we choose PDMS with a Young's modulus approximately equal to 800kPa. The purpose of adding this soft intermediary layer is mainly to prevent stress waves from being transmitted through the outer frame structure.

In the design of geometric parameters, the required blocking frequency needs to be considered. This example analyzes the sound insulation characteristics of the three frequencies of 19.23Hz, 655Hz, and 10866Hz and the frequencies near them. The unit size of the designed sound and vibration isolation structure Please refer to Table 1 for definitions and values:

Sound insulation and vibration isolation Structural unit 1 2 3 For frequency: 10866Hz 655Hz 19.23Hz unit size 1.6mm×1.6mm ×0.96mm (thickness) 25mm×25mm× 15mm (thickness) 450mm×450mm×270mm(thickness) Film outer diameter 1.44mm 22.5mm 405mm membrane thickness 20um 300um 3.5mm Central mass diameter 1.12mm 17.5mm 315mm center mass thickness 0.64mm 15mm 180mm

Table 1

Next, five units of the same type of sound-insulation and shock-isolation structures are stacked for testing, and vibration waves are input to the first unit. Figure 13 shows the measurement results of the above-mentioned three kinds of sound- and seismic-isolation structural units, and the analysis is as follows:

Sound-proof and shock-proof structural unit 1 (6kHz～30kHz): The best barrier efficiency in this range is about 15000Hz, and the barrier capacity can reach about 37dB. the

Sound-proof and shock-proof structural unit 2 (350Hz-2500Hz): The best barrier efficiency in this range is about 1250Hz, and the barrier capacity can reach about 36dB. the

Sound-proof and shock-proof structural unit 3 (15Hz～100Hz): The best barrier efficiency in this range is about 60Hz, and the barrier capacity can reach about 25dB. the

Based on the above, the present invention provides a unit with a sound-proof and shock-proof structure and an array structure containing it, which belongs to the application of a negative mass energy dissipation system. By changing the mass of the hollow frame and the mass body and the vertical direction of the film, The coefficient of elasticity (Young's modulus and geometric parameters) can be used to isolate sound waves or shock waves of a specific frequency. The unit with the sound-proof and shock-proof structure described in the present invention can be further formed by integral molding, such as embossing. the

The unit with the sound-proof and vibration-isolation structure and the array structure including it, because the center of the film can be equipped with high-quality materials, the film structure replaces the spring in the vertical direction so that the central mass body can vibrate back and forth on the film. This periodic multilayer structure is designed so that elastic waves in a certain frequency range cannot be transmitted or can only be transmitted in a fixed direction. The unit with the sound-proof and shock-proof structure of the present invention can be further combined with piezoelectric materials to recover energy. In addition, compared with the traditional damping energy dissipation method, the advantages of the sound-insulation and shock-isolation structural unit described in the present invention are shown in Table 2:

the mechanism energy recovery Frequency/Bandwidth thickness Reliability Damping system (Damping) energy dissipation into heat or permanently deformed Not optional A larger buffer thickness is required Often cause permanent damage to vibration isolation systems Negative mass system (Neg. Mass) isolate energy Turn into kinetic energy and can be reused optional Can be made into sheet or film All sound and vibration isolation systems are within the elastic limit

Table 2

Although the present invention has been disclosed in conjunction with the above preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be defined by the appended claims. the

Claims (27)

1. unit with sound insulation isolation structure comprises:

Hollow outer frame, this hollow outer frame has an inner space;

Film is disposed in this inner space, and vertical with the inwall of this hollow outer frame; And

First mass is disposed on the upper surface of this film,

Wherein, the sectional area of this inner space is greater than the area of this upper surface of this film.

2. the unit with sound insulation isolation structure as claimed in claim 1, wherein the thickness of this film is between between the 10nm to 10mm.

3. the unit with sound insulation isolation structure as claimed in claim 1, wherein the Young film number of this film is between between the 0.1Mpa to 100Gpa.

4. the unit with sound insulation isolation structure as claimed in claim 1, wherein this film is shaped as strip, crosswise or sheet.

5. the unit with sound insulation isolation structure as claimed in claim 1, wherein this film has at least one hollow region.

6. the unit with sound insulation isolation structure as claimed in claim 5, wherein this hollow region is circle, polygon, fan-shaped, irregular shape or its combination.

7. the unit with sound insulation isolation structure as claimed in claim 1, wherein the horizontal cross sectional geometry of this inner space is circle, polygon or its combination.

8. the unit with sound insulation isolation structure as claimed in claim 1, wherein the outer rim of this hollow outer frame is shaped as circle, polygon or its combination.

9. the unit with sound insulation isolation structure as claimed in claim 1, wherein the quality of this hollow outer frame is between 0.1mg to 1000kg.

10. the unit with sound insulation isolation structure as claimed in claim 1, wherein the quality of this first mass is between 0.1mg to 1000kg.

11. the unit with sound insulation isolation structure as claimed in claim 1, wherein this film vertical direction equivalent elastic coefficient between 0.01 (N/mm) between 1000 (N/mm).

12. the unit with sound insulation isolation structure as claimed in claim 1, wherein sound wave that this unit completely cut off or seismic wave frequency are between 0.1Hz～100kHz.

13. the unit with sound insulation isolation structure as claimed in claim 1 also comprises:

Second mass is disposed on a lower surface of this film.

14. the unit with sound insulation isolation structure as claimed in claim 1 also comprises:

Second mass is disposed on a lower surface of this film.

15. the unit with sound insulation isolation structure as claimed in claim 14, wherein this first mass runs through this film, and directly contacts with this second mass.

16. the unit with sound insulation isolation structure as claimed in claim 1, wherein this first mass, this film, and this hollow outer frame be formed in one.

17. an array structure comprises:

Bearing substrate; And

A plurality of unit with sound insulation isolation structure embed and run through this bearing substrate, and wherein each has the unit of sound insulation isolation structure, comprises:

Hollow outer frame, this hollow outer frame has an inner space;

Film is disposed in this inner space, and vertical with the inwall of this hollow outer frame; And

First mass is disposed on the upper surface of this film,

The hollow outer frame of the wherein wantonly two adjacent unit specific range of being separated by with sound insulation isolation structure.

18. array structure as claimed in claim 17, wherein this specific range is between between the 100nm to 100cm.

19. array structure as claimed in claim 17, wherein these a plurality of unit arrangement modes on this bearing substrate with sound insulation isolation structure are arranged or random arrangement for orderly.

20. array structure as claimed in claim 17, wherein this array structure is a single or multiple lift.

21. the manufacture method with unit of sound insulation isolation structure comprises:

One hollow outer frame is provided, and this hollow outer frame has an inner space;

One film is set in this inner space, and makes this film vertical with the inwall of this hollow outer frame; And

Be provided with on the upper surface that one first mass is disposed at this film,

Wherein, the sectional area of this inner space is greater than the area of this upper surface of this film.

22. the manufacture method with unit of sound insulation isolation structure as claimed in claim 21, wherein this first mass, this film, and this hollow outer frame use and finish with manufacture craft.

23. the manufacture method with unit of sound insulation isolation structure as claimed in claim 21, wherein this first mass, this film, and this hollow outer frame formed by roll extrusion, photoetching etching, electroforming, machining or Laser Processing.

24. the manufacture method with unit of sound insulation isolation structure as claimed in claim 21, wherein this first mass, this film, and this hollow outer frame formed by impression.

25. the manufacture method with unit of sound insulation isolation structure as claimed in claim 21, wherein the production method of this first mass is formed by ink-jet, some glue, plating, electroforming or self assembly mode.

26. the manufacture method with unit of sound insulation isolation structure as claimed in claim 21 also comprises:

One second mass is set on a lower surface of this film.

27. the manufacture method with unit of sound insulation isolation structure as claimed in claim 21, wherein this first mass runs through this film, and directly contacts with this second mass.

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