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CN102236445A - Composite sheet structure and cover mirror lamination structure for touch panel - Google Patents

Composite sheet structure and cover mirror lamination structure for touch panel Download PDF

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Publication number
CN102236445A
CN102236445A CN2010101676070A CN201010167607A CN102236445A CN 102236445 A CN102236445 A CN 102236445A CN 2010101676070 A CN2010101676070 A CN 2010101676070A CN 201010167607 A CN201010167607 A CN 201010167607A CN 102236445 A CN102236445 A CN 102236445A
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layer
microstructure
substrate
composite
structure according
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许福明
陈金良
黄炳文
林明传
王士诚
叶嘉浤
卢承劭
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Wintek Corp
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Wintek Corp
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Abstract

The invention provides a composite board structure and a cover mirror laminated structure for a touch panel. The composite board structure comprises a substrate, a microstructure layer and a shielding layer. The microstructure layer is formed on the substrate and is provided with a first side and a second side which are opposite, the microstructure layer comprises a plurality of prism microstructures, and the substrate is attached to the first side of the microstructure layer. The shielding layer is covered on the second side of the microstructure layer and comprises a low light transmission material.

Description

复合板材结构及用于触控面板的罩盖镜迭层结构Composite sheet structure and cover mirror lamination structure for touch panel

技术领域 technical field

本发明关于一种复合板材结构,及包括该复合板材结构的一种用于触控面板的罩盖镜迭层结构。The invention relates to a composite plate structure and a cover mirror lamination structure for a touch panel including the composite plate structure.

背景技术 Background technique

将一板材加工产生特殊材质视觉效果的方式,通常包括油墨印刷、CNC加工、刻蚀工艺、及紫外光模铸(UV molding)。油墨印刷方式可展现平面纹路效果但缺乏立体感,虽然可以利用导电真空金属镀膜(VM)或不导电真空金属镀膜(NCVM)取代油墨而提升表面质感并展现金属光泽,但仍然无法获得立体视觉效果。CNC加工方式是利用金属铸块进行加工作业,于板材上铣出金属纹路,但CNC加工作业成本昂贵且无法在玻璃或硅结晶材质上进行,同时容易因刀具磨耗而降低产品的一致性。再者,刻蚀方式是利用刻蚀药水与曝光技术在指定材质上进行刻蚀以产生纹路效果,刻蚀方式虽然可达到精密度与一致性的要求,但是作业中环境风险相对提高且作业成本昂贵。另外,紫外光模铸是采用压花方式作业,利用滚轮或平沾版模进行压纹处理以产生纹路效果,但目前此技术仅能在可塑性压克力或复合塑料上成形,而无法在玻璃或硅结晶材质上实施。The method of processing a plate to produce a special material visual effect usually includes ink printing, CNC processing, etching process, and UV molding (UV molding). Ink printing method can show flat texture effect but lacks three-dimensional effect. Although conductive vacuum metal coating (VM) or non-conductive vacuum metal coating (NCVM) can be used to replace ink to improve surface texture and show metallic luster, it still cannot obtain three-dimensional visual effect . The CNC machining method is to use metal ingots for processing operations, and mill out metal lines on the plate, but CNC processing is expensive and cannot be performed on glass or silicon crystal materials, and it is easy to reduce the consistency of the product due to tool wear. Furthermore, the etching method is to use etching potion and exposure technology to etch the specified material to produce a texture effect. Although the etching method can meet the requirements of precision and consistency, the environmental risk in the operation is relatively high and the operating cost is relatively high. expensive. In addition, UV molding is operated by embossing, using rollers or flat-dipping molds for embossing to produce texture effects, but currently this technology can only be formed on plastic acrylic or composite plastics, and cannot be formed on glass. Or implemented on silicon crystal material.

发明内容 Contents of the invention

本发明提供一种复合板材结构,其能提供良好的金属光泽及纹路效果且可避免上述已知设计的缺点,且可整合于一触控面板的罩盖镜上。The present invention provides a composite plate structure, which can provide good metallic luster and texture effects and can avoid the disadvantages of the above known designs, and can be integrated on a cover mirror of a touch panel.

依本发明一实施例的设计,一种复合板材结构包括一基板、一微结构层及一屏蔽层。微结构层形成于基板上,且具有相对的一第一侧及一第二侧,微结构层包括多个棱镜微结构且基板贴附于微结构层的第一侧。屏蔽层披覆于微结构层的第二侧,且屏蔽层包括一低透光材料。According to the design of an embodiment of the present invention, a composite board structure includes a substrate, a microstructure layer and a shielding layer. The microstructure layer is formed on the substrate and has a first side and a second side opposite to each other. The microstructure layer includes a plurality of prism microstructures and the substrate is attached to the first side of the microstructure layer. The shielding layer covers the second side of the microstructure layer, and the shielding layer includes a low light transmission material.

通过本实施例的设计,棱镜微结构可反射或折射入射光,使具有平滑触感的基板产生立体视觉效果的棱镜纹路及金属的质感与光泽。因为微结构层成型后再贴合至基板,如此可大幅减少对基板直接加工的风险,有效提高成品良率,且当贴合过程出现错误可撕除微结构层重新作业,如此可重复利用基板而具有良好的重工特性。再者,微结构层可同时提供类似增亮膜(BEF)的光收敛效果,且通过调整各个棱镜微结构的高度、间距、排列方式可提供不同的纹路并产生不同的金属光泽效果。Through the design of this embodiment, the prism microstructure can reflect or refract incident light, so that the substrate with a smooth touch can produce prism lines with stereoscopic visual effect and metal texture and luster. Because the microstructure layer is formed and then bonded to the substrate, this can greatly reduce the risk of direct processing of the substrate, effectively improving the yield of the finished product, and when there is an error in the bonding process, the microstructure layer can be torn off and reworked, so that the substrate can be reused And has good heavy industry characteristics. Furthermore, the microstructure layer can simultaneously provide a light converging effect similar to Brightness Enhancement Film (BEF), and by adjusting the height, spacing, and arrangement of each prism microstructure, different textures can be provided and different metallic luster effects can be produced.

于一实施例中,微结构层是由光硬化或热硬化材料所构成,且棱镜微结构是由压纹处理所形成。In one embodiment, the microstructure layer is made of photohardening or thermosetting material, and the prismatic microstructures are formed by embossing.

于一实施例中,微结构层是由金属材料所构成,且棱镜微结构是由全像激光处理所形成。通过本实施例的设计,当光线照射于微结构层的全像激光微结构时,可产生折射、散射、反射等现象,且当光线通过全像激光微结构同时因绕射现象而产生丰富的色彩变化,如此可产生与金属质感相同的光泽或是多彩炫光,使一透明基板能提供亮丽醒目的光泽、质感及特殊的视觉效果。In one embodiment, the microstructure layer is made of metal material, and the prism microstructure is formed by holographic laser processing. Through the design of this embodiment, when light is irradiated on the holographic laser microstructure of the microstructure layer, phenomena such as refraction, scattering, and reflection can occur, and when the light passes through the holographic laser microstructure, abundant Color changes, so that it can produce the same luster as the metal texture or colorful glare, so that a transparent substrate can provide bright and eye-catching luster, texture and special visual effects.

依本发明另一实施例的设计,一种用于触控面板的罩盖镜迭层结构包括一透明基板、及形成于透明基板上且彼此相邻的一可视区迭层结构及非显示区迭层结构。可视区迭层结构包括一感应层、一绝缘桥接层一桥接电导线、及一保护层。感应层布设于透明基板上,感应层包括多个沿X轴方向等距分布且彼此平行排列的X轴线迹、及多个沿Y轴方向等距分布且彼此平行排列的Y轴线迹。绝缘桥接层覆盖感应层的X轴线迹与Y轴线迹且设有多个贯穿孔以暴露部分Y轴线迹。桥接电导线的二端分别经由贯穿孔电连接Y轴线迹。保护层覆盖感应层、绝缘桥接层、及桥接电导线。非显示区迭层结构包括一微结构层及一屏蔽层,微结构层具有相对的一第一侧及一第二侧,微结构层包括多个棱镜微结构且其第一侧贴附于透明基板的一侧,屏蔽层,披覆于微结构层的第二侧且屏蔽层包括低透光材料。According to the design of another embodiment of the present invention, a cover mirror laminated structure for a touch panel includes a transparent substrate, and a visible area laminated structure and a non-display laminated structure formed on the transparent substrate and adjacent to each other Region stacked structure. The layered structure of the visible area includes a sensing layer, an insulating bridge layer, a bridge wire, and a protective layer. The sensing layer is arranged on the transparent substrate, and the sensing layer includes a plurality of X-axis traces equidistantly distributed along the X-axis direction and arranged parallel to each other, and a plurality of Y-axis traces distributed equidistantly along the Y-axis direction and arranged parallel to each other. The insulating bridging layer covers the X-axis trace and the Y-axis trace of the sensing layer and has a plurality of through holes to expose part of the Y-axis trace. The two ends of the bridging electrical wire are respectively electrically connected to the Y-axis trace through the through hole. The protective layer covers the sensing layer, the insulating bridging layer, and the bridging electrical wires. The laminated structure of the non-display area includes a microstructure layer and a shielding layer. The microstructure layer has a first side and a second side opposite to each other. The microstructure layer includes a plurality of prism microstructures and its first side is attached to a transparent One side of the substrate, the shielding layer, covers the second side of the microstructure layer, and the shielding layer includes low light transmission material.

根据本发明提供的技术方案,可大幅减少对基板直接加工的风险,有效提高成品良率;另外,微结构层可同时提供类似增亮膜的光收敛效果,且通过调整各个棱镜微结构的高度、间距、排列方式可提供不同的纹路并产生不同的金属光泽效果。According to the technical solution provided by the present invention, the risk of direct processing of the substrate can be greatly reduced, and the yield rate of finished products can be effectively improved; in addition, the microstructure layer can simultaneously provide a light convergence effect similar to that of a brightness enhancement film, and by adjusting the height of each prism microstructure , spacing, and arrangement can provide different textures and produce different metallic luster effects.

附图说明 Description of drawings

图1为本发明各个实施例运用于例如手机的一载体的示意图。FIG. 1 is a schematic diagram of various embodiments of the present invention applied to a carrier such as a mobile phone.

图2为沿图1的A-A’线切割,显示依本发明一实施例的复合板材结构的剖面示意图。Fig. 2 is a schematic cross-sectional view of a composite plate structure according to an embodiment of the present invention, cut along the line A-A' of Fig. 1 .

图3A-图3C为复合板材结构的一制造程序实例的流程图。3A-3C are flowcharts of an example manufacturing process of a composite panel structure.

图4为本发明另一实施例的复合板材结构的剖面示意图。Fig. 4 is a schematic cross-sectional view of a composite plate structure according to another embodiment of the present invention.

图5A显示本发明复合板材结构的另一实施例的剖面示意图。FIG. 5A shows a schematic cross-sectional view of another embodiment of the composite sheet structure of the present invention.

图5B显示本发明复合板材结构的另一实施例的剖面示意图。FIG. 5B shows a schematic cross-sectional view of another embodiment of the composite sheet structure of the present invention.

图6A-图6D为说明可视区迭层结构的不同实施例的剖面示意图。6A-6D are schematic cross-sectional views illustrating different embodiments of the stacked structure of the visible area.

附图标号Reference number

10、30 复合板材结构        38   屏蔽层10, 30 Composite sheet structure 38 Shielding layer

12   基板                  42   全像激光微结构12 Substrates 42 Holographic laser microstructures

14   粘着层                50a、50b、50c、50d 可视区迭层结构14 Adhesive layer 50a, 50b, 50c, 50d Laminated structure of visible area

16   微结构层              52   透明基板16 microstructure layer 52 transparent substrate

16a  微结构层第一侧        54   感应层16a The first side of the microstructure layer 54 Induction layer

16b  微结构层第二侧        54a  X轴线迹16b The second side of the microstructure layer 54a X-axis trace

18   屏蔽层                54b  Y轴线迹18 shielding layer 54b Y-axis trace

20   金属层                56   绝缘桥接层20 metal layer 56 insulating bridge layer

22   基材                  58   桥接电导线22 Substrate 58 Bridging wire

24   聚合物                62   保护层24 polymer 62 protective layer

24a  棱镜微结构            64   金属线24a Prism microstructure 64 Metal wire

32   基板                  66   软性电路板32 Substrate 66 Flexible circuit board

34   表面处理薄膜层        100  手机34 surface treatment film layer 100 mobile phone

36   微结构层              P    间距36 microstructure layer P pitch

36a  微结构层第一侧        T    贯穿孔36a First side of microstructured layer T T Penetrating hole

36b  微结构层第二侧        ΔH  高度差36b Height difference on the second side of the microstructure layer ΔH

具体实施方式 Detailed ways

本发明的其他目的和优点可以从本发明所揭露的技术特征中得到进一步的了解。为让本发明的上述和其他目的、特征和优点能更明显易懂,下文特举实施例并配合所附附图,做详细说明如下。Other purposes and advantages of the present invention can be further understood from the technical features disclosed in the present invention. In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

有关本发明的前述及其他技术内容、特点与功效,在以下配合参考附图的实施例的详细说明中,将可清楚的呈现。以下实施例中所提到的方向用语,例如:上、下、左、右、前或后等,仅是参考附加附图的方向。因此,使用的方向用语是用来说明并非用来限制本发明。The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Accordingly, the directional terms are used to illustrate and not to limit the invention.

图1为本发明各个实施例运用于例如手机的一载体的示意图,如图1所示,手机100具有一可视区(viewing area)及一非显示区。依本发明各个实施例的复合板材结构可设置于非显示区,以提供特殊的材质效果,例如可提供金属质感、色彩、纹路或光泽的视觉效果。FIG. 1 is a schematic diagram of various embodiments of the present invention applied to a carrier such as a mobile phone. As shown in FIG. 1 , the mobile phone 100 has a viewing area and a non-display area. The composite plate structure according to various embodiments of the present invention can be disposed in the non-display area to provide special material effects, such as visual effects of metal texture, color, texture or luster.

图2为沿图1的A-A’线切割,显示依本发明一实施例的复合板材结构10的剖面示意图。图3A-图3C为复合板材结构10的一制造程序实例的流程图。如图2所示,复合结构10包括一基板12、形成于基板12上的一粘着层14、一微结构层16及一屏蔽层18。微结构层16具有相对的一第一侧16a及一第二侧16b,微结构层16的第一侧16a经由粘着层14贴附于基板12的一侧,且屏蔽层18披覆于微结构层16的第二侧16b。如下说明复合板材结构10的一制造程序实例。Fig. 2 is a schematic cross-sectional view of a composite plate structure 10 according to an embodiment of the present invention, cut along the line A-A' of Fig. 1 . 3A-3C are flowcharts of an example manufacturing process of the composite panel structure 10 . As shown in FIG. 2 , the composite structure 10 includes a substrate 12 , an adhesive layer 14 formed on the substrate 12 , a microstructure layer 16 and a shielding layer 18 . The microstructure layer 16 has an opposite first side 16a and a second side 16b, the first side 16a of the microstructure layer 16 is attached to one side of the substrate 12 through the adhesive layer 14, and the shielding layer 18 is covered on the microstructure The second side 16b of the layer 16 . An example of a manufacturing process for the composite panel structure 10 is described as follows.

如图3A所示,首先提供一基材22,基材22的材料例如可为聚对苯二甲酸乙二醇酯(PET)或其它可塑型材料,且基材22上被覆一层可紫外光固化或热固化的聚合物24,再如图3B所示利用压印成形方式形成所需要的棱镜微结构24a,并照射紫外光或加热固化。多个微结构24a的外形及排列方式可构成不同的纹路及提供不同的光反射、折射效果。如图3C所示,具有棱镜微结构24a纹路的基材22可经由粘着层14粘贴于基板12上,粘着层14例如包括一光学高穿透粘着化合物(optically clear adhesive;OCA)。基板12可为一触控面板的一罩盖镜(cover lens)。基板12的材料可为玻璃、塑胶或硅结晶等等,且塑胶材料例如可为聚对苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、或聚甲基丙烯酸甲酯(PMMA)等。例如黑色油墨或镀膜金属的低透光材料构成的一屏蔽层18,可利用镀膜方式附着于基材22并包覆微结构24a。通过本实施例的设计,棱镜微结构24a可反射或折射入射光,使具有平滑触感的基板12产生立体视觉效果的棱镜纹路及金属的质感与光泽。因为微结构层16成型后再贴合至基板12,如此可大幅减少对基板12直接加工的风险,有效提高成品良率,且当贴合过程出现错误可撕除微结构层16重新作业,如此可重复利用基板12而具有良好的重工特性。再者,微结构层16可同时提供类似增亮膜(BEF)的光收敛效果,且通过调整各个棱镜微结构24a的高度、间距、排列方式可提供不同的纹路并产生不同的金属光泽效果。因此,各个棱镜微结构24a的高度、间距、排列方式完全不限定,例如每两相邻棱镜微结构24a的棱镜峰可具有相同的间距P(图2),或者具有不同的间距亦可,且两相邻棱镜微结构24a可具有不同的高度(产生图2所示的高度差ΔH),或者具有相同的高度(图4)均可。再者,如图4所示,于一实施例中,一金属层20可设置于粘着层14与微结构层16之间以进一步提高金属质感,且金属层20材料例如可为导电真空金属镀膜(VM)或不导电真空金属镀膜(NCVM)。As shown in Figure 3A, a substrate 22 is firstly provided, the material of the substrate 22 can be polyethylene terephthalate (PET) or other plastic materials, and the substrate 22 is coated with a layer of ultraviolet light The cured or thermally cured polymer 24 is then formed into the desired prism microstructure 24a by embossing as shown in FIG. 3B , and then irradiated with ultraviolet light or heated for curing. The shape and arrangement of the multiple microstructures 24a can form different textures and provide different light reflection and refraction effects. As shown in FIG. 3C , the substrate 22 having the pattern of prism microstructures 24 a can be pasted on the substrate 12 through the adhesive layer 14 , and the adhesive layer 14 includes, for example, an optically clear adhesive (OCA). The substrate 12 can be a cover lens of a touch panel. The material of the substrate 12 can be glass, plastic or silicon crystal, etc., and the plastic material can be, for example, polyethylene terephthalate (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA). wait. A shielding layer 18 made of a low-transmittance material such as black ink or coated metal can be attached to the substrate 22 and cover the microstructure 24a by means of coating. Through the design of this embodiment, the prism microstructure 24 a can reflect or refract incident light, so that the substrate 12 with a smooth touch can produce a prism texture with a stereoscopic effect and a metallic texture and luster. Because the microstructure layer 16 is molded and then bonded to the substrate 12, the risk of direct processing of the substrate 12 can be greatly reduced, and the yield rate of the finished product can be effectively improved, and the microstructure layer 16 can be torn off and reworked when an error occurs in the bonding process, so The substrate 12 can be reused and has good rework characteristics. Moreover, the microstructure layer 16 can simultaneously provide a light converging effect similar to a Brightness Enhancement Film (BEF), and by adjusting the height, spacing, and arrangement of each prism microstructure 24a, different textures can be provided and different metallic luster effects can be produced. Therefore, the height, pitch, and arrangement of each prism microstructure 24a are not limited at all, for example, the prism peaks of every two adjacent prism microstructures 24a can have the same pitch P ( FIG. 2 ), or have different pitches, and Two adjacent prism microstructures 24a may have different heights (produce the height difference ΔH shown in FIG. 2 ), or have the same height ( FIG. 4 ). Moreover, as shown in FIG. 4 , in one embodiment, a metal layer 20 can be disposed between the adhesive layer 14 and the microstructure layer 16 to further enhance the metallic texture, and the material of the metal layer 20 can be, for example, a conductive vacuum metal coating (VM) or non-conductive vacuum metallization (NCVM).

图5A显示本发明复合板材结构的另一实施例的剖面示意图。如图5A所示,复合板材结构30包括一基板32、一表面处理薄膜层34、一微结构层36、及一屏蔽层38。微结构层36具有相对的一第一侧36a及一第二侧36b,微结构层36例如可由金属材料所构成且包括多个全像激光微结构42,且微结构层36的第一侧36a经由表面处理薄膜层34贴附于基板32的一侧。屏蔽层38披覆于微结构层36的第二侧36b,且屏蔽层38包括例如黑色油墨的低透光材料。微结构层36例如可利用涂布、网印或转印方式形成于表面处理薄膜层34上,且屏蔽层38可利用涂布、网印或转印方式披覆于微结构层36的第二侧36b。全像激光微结构42是利用全像激光成型方式形成。举例而言,可提供一图形进行美工制版,再将通过图形的激光光投射至一涂布光阻剂的玻璃片上,再电铸形成微结构模仁,之后利用该微结构模仁模制全像激光微结构42。表面处理薄膜层34例如可利用电晕处理方式形成,利用电极在基板32上的间隙产生电晕,将表面极性化而增加粘着力与表面张力,提高微结构层36与基板32的结合稳定度及气密性。依本实施例的设计,当光线照射于微结构层36的全像激光微结构42时,可产生折射、散射、反射等现象,且当光线通过全像激光微结构42同时因绕射现象而产生丰富的色彩变化,如此可产生与金属质感相同的光泽或是多彩炫光,使一透明基板能提供亮丽醒目的光泽、质感及特殊的视觉效果。基板32例如可为一触控面板的一罩盖镜(cover lens),基板32的材料可为玻璃、塑胶或硅结晶等透光材质,且塑胶材料例如可为聚对苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、或聚甲基丙烯酸甲酯(PMMA)等。于一实施例中,如图5B所示,亦可不形成表面处理薄膜层34而直接将微结构层36以滚压或贴合方式贴附于基板32的一侧。FIG. 5A shows a schematic cross-sectional view of another embodiment of the composite sheet structure of the present invention. As shown in FIG. 5A , the composite plate structure 30 includes a substrate 32 , a surface treatment film layer 34 , a microstructure layer 36 , and a shielding layer 38 . The microstructure layer 36 has an opposite first side 36a and a second side 36b. The microstructure layer 36 can be made of a metal material and includes a plurality of holographic laser microstructures 42, and the first side 36a of the microstructure layer 36 The surface treatment film layer 34 is attached to one side of the substrate 32 . The shielding layer 38 covers the second side 36 b of the microstructure layer 36 , and the shielding layer 38 includes a low-transmittance material such as black ink. For example, the microstructure layer 36 can be formed on the surface treatment film layer 34 by coating, screen printing or transfer printing, and the shielding layer 38 can be coated on the second surface of the microstructure layer 36 by coating, screen printing or transfer printing. side 36b. The holographic laser microstructure 42 is formed by holographic laser molding. For example, a pattern can be provided for art plate making, and then the laser light passing through the pattern is projected onto a glass sheet coated with photoresist, and then electroformed to form a microstructure mold core, and then use the microstructure mold core to mold the whole Like laser microstructure42. The surface treatment film layer 34 can be formed, for example, by corona treatment, using the gap between the electrodes on the substrate 32 to generate corona, polarizing the surface to increase adhesion and surface tension, and improving the bonding stability of the microstructure layer 36 and the substrate 32 degree and airtightness. According to the design of this embodiment, when light is irradiated on the holographic laser microstructure 42 of the microstructure layer 36, phenomena such as refraction, scattering, and reflection can occur, and when the light passes through the holographic laser microstructure 42, it will be It produces rich color changes, which can produce the same luster or colorful glare as the metal texture, so that a transparent substrate can provide bright and eye-catching luster, texture and special visual effects. The substrate 32 can be, for example, a cover lens of a touch panel, and the material of the substrate 32 can be light-transmitting materials such as glass, plastic or silicon crystal, and the plastic material can be polyethylene terephthalate, for example. (PET), polycarbonate (PC), or polymethyl methacrylate (PMMA), etc. In one embodiment, as shown in FIG. 5B , the microstructure layer 36 may be directly attached to one side of the substrate 32 by rolling or pasting without forming the surface treatment film layer 34 .

因上述各个实施例可于玻璃或硅结晶材质上实施,故可运用于一触控面板,将该复合板材结构直接整合于触控面板的一罩盖镜上。如下说明一种用于触控面板的罩盖镜迭层结构,罩盖镜迭层结构包括位于图2的可视区的一可视区迭层结构及位于非显示区的一非显示区迭层结构,可视区迭层结构与非显示区迭层结构彼此相邻并形成于一触控面板的罩盖镜上,非显示区迭层结构可为前述各个实施例所揭露的复合板材结构,于此不再赘述,故如下以图6A-图6D的剖面示意图说明可视区迭层结构的不同实施例。如图6A所示,可视区迭层结构50a至少包括一透明基板52、一感应层54、一绝缘桥接层56、及一桥接电导线58。感应层54布设于该透明基板52的一表面上,且感应层54包括多个沿X轴方向等距分布且彼此平行排列的X轴线迹54a、及多个沿Y轴方向等距分布且彼此平行排列的Y轴线迹54b。绝缘桥接层56为具透光性的绝缘薄层,绝缘桥接层56覆盖感应层54的X轴线迹54a与Y轴线迹54b且设有多个贯穿孔T以暴露部分Y轴线迹区域,桥接电导线58二端经由该些贯穿孔T分别电连接不同的Y轴线迹54b。一保护层62覆盖感应层54、绝缘桥接层56、及桥接电导线58,且可视区迭层结构50a经由一金属线64电连接至一软性电路板66。如图6B所示,于另一可视区迭层结构50b中,亦可将保护层62范围向下延伸而缩小绝缘桥接层56的范围,且贯穿孔T设置于保护层62与绝缘桥接层56之间。如图6C所示,于另一可视区迭层结构50c中,感应层54可形成于绝缘桥接层56的上方且桥接电导线58形成于绝缘桥接层56的下方,且绝缘桥接层56设有多个贯穿孔T。或者,如图6D所示,于另一可视区迭层结构50d中,感应层54可形成于绝缘桥接层56的上方且桥接电导线58形成于绝缘桥接层56的下方,且桥接电导线58的两端分别连接一Y轴线迹54b。Since the above-mentioned embodiments can be implemented on glass or silicon crystal materials, they can be applied to a touch panel, and the composite plate structure can be directly integrated on a cover mirror of the touch panel. A cover mirror lamination structure for a touch panel is described as follows, the cover mirror lamination structure includes a visible area lamination structure located in the visible area of FIG. 2 and a non-display area lamination located in the non-display area Layer structure, the layered structure of the visible area and the layered structure of the non-display area are adjacent to each other and formed on the cover mirror of a touch panel, and the layered structure of the non-display area can be the composite plate structure disclosed in the foregoing embodiments , which will not be described in detail here, so different embodiments of the stacked structure of the visible area are described below with the cross-sectional schematic diagrams of FIGS. 6A-6D . As shown in FIG. 6A , the stacked structure 50 a in the visible area at least includes a transparent substrate 52 , a sensing layer 54 , an insulating bridge layer 56 , and a bridge wire 58 . The sensing layer 54 is arranged on a surface of the transparent substrate 52, and the sensing layer 54 includes a plurality of X-axis traces 54a distributed equidistantly along the X-axis direction and arranged parallel to each other, and a plurality of traces 54a equidistantly distributed along the Y-axis direction and arranged parallel to each other. Parallel aligned Y-axis traces 54b. The insulating bridging layer 56 is a light-transmitting insulating thin layer. The insulating bridging layer 56 covers the X-axis trace 54a and the Y-axis trace 54b of the sensing layer 54 and is provided with a plurality of through holes T to expose part of the Y-axis trace area, bridging the electrical Two ends of the wire 58 are electrically connected to different Y-axis traces 54 b through the through holes T respectively. A protective layer 62 covers the sensing layer 54 , the insulating bridge layer 56 , and the bridge electrical wire 58 , and the stacked structure 50 a of the visible area is electrically connected to a flexible circuit board 66 via a metal wire 64 . As shown in FIG. 6B, in another stacked structure 50b in the visible region, the range of the protective layer 62 can also be extended downward to reduce the range of the insulating bridge layer 56, and the through hole T is provided between the protective layer 62 and the insulating bridge layer. Between 56. As shown in FIG. 6C , in another visible region stacked structure 50c, the sensing layer 54 can be formed above the insulating bridge layer 56 and the bridge electrical wire 58 is formed below the insulating bridge layer 56, and the insulating bridge layer 56 is set. There are a plurality of through holes T. Alternatively, as shown in FIG. 6D , in another visible region stacked structure 50d, the sensing layer 54 can be formed above the insulating bridge layer 56 and the bridge electrical wire 58 is formed below the insulating bridge layer 56, and the bridge electrical wire Both ends of 58 are respectively connected to a Y-axis trace 54b.

虽然本发明已以较佳实施例揭露如上,然其并非用以限定本发明,任何本领域的技术人员,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,因此本发明的保护范围当以权利要求所界定范围为准。另外,本发明的任一实施例或权利要求不须达成本发明所揭露的全部目的或优点或特点。此外,摘要部分和标题仅是用来辅助专利文件搜寻之用,并非用来限制本发明的权利范围。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore The protection scope of the present invention shall be determined by the scope defined in the claims. In addition, any embodiment or claim of the present invention does not necessarily achieve all the objects or advantages or features disclosed in the present invention. In addition, the abstract and the title are only used to assist in the search of patent documents, and are not used to limit the scope of rights of the present invention.

Claims (15)

1.一种复合板材结构,其特征在于,所述复合板材结构包括:1. A composite plate structure, characterized in that, the composite plate structure comprises: 一基板;a substrate; 一微结构层,形成于所述基板上,且具有相对的一第一侧及一第二侧,所述微结构层包括多个棱镜微结构,其中所述基板贴附于所述第一侧;及A microstructure layer, formed on the substrate, and has a first side and a second side opposite, the microstructure layer includes a plurality of prism microstructures, wherein the substrate is attached to the first side ;and 一屏蔽层,披覆于所述微结构层的所述第二侧且包括一低透光材料。A shielding layer covers the second side of the microstructure layer and includes a low light transmission material. 2.如权利要求1所述的复合板材结构,其特征在于,所述复合板材结构还包括一粘着层设置于所述基板与所述微结构层之间。2. The composite sheet structure according to claim 1, further comprising an adhesive layer disposed between the substrate and the microstructure layer. 3.如权利要求2所述的复合板材结构,其特征在于,所述复合板材结构还包括一金属层设置于所述粘着层与所述微结构层之间。3. The composite sheet structure according to claim 2, further comprising a metal layer disposed between the adhesive layer and the microstructure layer. 4.如权利要求2所述的复合板材结构,其特征在于,所述粘着层包括光学高穿透粘着化合物。4. The composite panel structure of claim 2, wherein the adhesive layer comprises an optically high penetration adhesive compound. 5.如权利要求1所述的复合板材结构,其特征在于,所述微结构层是由光硬化或热硬化材料所构成。5. The composite sheet structure according to claim 1, wherein the microstructure layer is made of light hardening or heat hardening material. 6.如权利要求5所述的复合板材结构,其特征在于,所述棱镜微结构是由压纹处理所形成。6. The composite sheet structure of claim 5, wherein the prismatic microstructure is formed by an embossing process. 7.如权利要求6所述的复合板材结构,其特征在于,所述低透光材料为一黑色油墨或金属材料。7. The composite board structure according to claim 6, wherein the low light transmission material is a black ink or a metal material. 8.如权利要求1所述的复合板材结构,其特征在于,所述复合板材结构还包括一表面处理薄膜层设置于所述基板与所述微结构层之间。8. The composite sheet structure according to claim 1, further comprising a surface treatment film layer disposed between the substrate and the microstructure layer. 9.如权利要求8所述的复合板材结构,其特征在于,所述微结构层是由金属材料所构成。9. The composite plate structure according to claim 8, wherein the microstructure layer is made of metal material. 10.如权利要求9所述的复合板材结构,其特征在于,所述棱镜微结构是由全像激光处理所形成。10. The composite sheet structure of claim 9, wherein the prismatic microstructures are formed by holographic laser processing. 11.如权利要求10所述的复合板材结构,其特征在于,所述低透光材料为一黑色油墨。11. The composite plate structure according to claim 10, wherein the low light transmission material is a black ink. 12.如权利要求1所述的复合板材结构,其特征在于,所述棱镜微结构的棱镜峰为等高或非等高。12. The composite sheet structure according to claim 1, characterized in that, the prism peaks of the prism microstructures are of equal height or non-equal height. 13.如权利要求1所述的复合板材结构,其特征在于,所述棱镜微结构的间距为等距或非等距。13. The composite plate structure according to claim 1, characterized in that, the pitch of the prism microstructures is equidistant or non-equidistant. 14.如权利要求1所述的复合板材结构,其特征在于,所述基板为一触控面板的一罩盖镜。14. The composite board structure of claim 1, wherein the substrate is a cover mirror of a touch panel. 15.一种用于触控面板的罩盖镜迭层结构,其特征在于,所述罩盖镜迭层结构包括:15. A cover mirror lamination structure for a touch panel, characterized in that the cover mirror lamination structure comprises: 一透明基板;a transparent substrate; 一可视区迭层结构,形成于所述透明基板上且包括:A visible zone stacked structure formed on the transparent substrate and comprising: 一感应层,布设于所述透明基板上,所述感应层包括多个沿X轴方向等距分布且彼此平行排列的X轴线迹、及多个沿Y轴方向等距分布且彼此平行排列的Y轴线迹;A sensing layer arranged on the transparent substrate, the sensing layer includes a plurality of X-axis traces equidistantly distributed along the X-axis direction and arranged parallel to each other, and a plurality of X-axis traces equidistantly distributed along the Y-axis direction and arranged parallel to each other Y-axis trace; 一绝缘桥接层,覆盖所述感应层的所述X轴线迹与所述Y轴线迹且设有多个贯穿孔以暴露部分所述Y轴线迹;An insulating bridging layer covering the X-axis trace and the Y-axis trace of the sensing layer and having a plurality of through holes to expose part of the Y-axis trace; 一桥接电导线,所述桥接电导线的二端分别经由所述贯穿孔电连接所述Y轴线迹;及a bridging electrical wire, the two ends of the bridging electrical wire are respectively electrically connected to the Y-axis trace through the through hole; and 一保护层,覆盖所述感应层、所述绝缘桥接层、及所述桥接电导线;以及a protective layer covering the sensing layer, the insulating bridging layer, and the bridging electrical wires; and 一非显示区迭层结构,形成于所述透明基板上且邻接所述可视区迭层结构,所述非显示区迭层结构包括:A non-display area stack structure formed on the transparent substrate and adjacent to the visible area stack structure, the non-display area stack structure comprising: 一微结构层,具有相对的一第一侧及一第二侧,所述微结构层包括多个棱镜微结构,其中所述透明基板贴附于所述第一侧;及a microstructured layer having opposing first and second sides, the microstructured layer comprising a plurality of prismatic microstructures, wherein the transparent substrate is attached to the first side; and 一屏蔽层,披覆于所述微结构层的所述第二侧且所述屏蔽层包括一低透光材料。A shielding layer covers the second side of the microstructure layer, and the shielding layer includes a low light transmission material.
CN2010101676070A 2010-04-26 2010-04-26 Composite sheet structure and cover mirror lamination structure for touch panel Pending CN102236445A (en)

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Application publication date: 20111109