CN102222811A - Filter - Google Patents
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- CN102222811A CN102222811A CN201110075352XA CN201110075352A CN102222811A CN 102222811 A CN102222811 A CN 102222811A CN 201110075352X A CN201110075352X A CN 201110075352XA CN 201110075352 A CN201110075352 A CN 201110075352A CN 102222811 A CN102222811 A CN 102222811A
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- cavity
- dielectric resonator
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- sheet metal
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- 238000003466 welding Methods 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 10
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000012634 fragment Substances 0.000 claims description 3
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 claims description 2
- 229910016525 CuMo Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical group [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 4
- 238000013016 damping Methods 0.000 abstract 1
- 230000005489 elastic deformation Effects 0.000 abstract 1
- 239000011797 cavity material Substances 0.000 description 76
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000005336 cracking Methods 0.000 description 13
- 229910010293 ceramic material Inorganic materials 0.000 description 6
- 238000000465 moulding Methods 0.000 description 3
- 238000004512 die casting Methods 0.000 description 2
- 230000010339 dilation Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
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Abstract
The invention discloses a filter relating to the field of communication equipment. The filter can reduce the possibility that a welding spot of a medium resonator is cracked owning to the difference of thermal expansion coefficient. The filter provided by the embodiment of the invention comprises a medium resonator, a chamber body and a connecting piece, wherein the medium resonator is arranged in the chamber body; the medium resonator is welded on the connecting piece that is connected with the chamber body together; the medium resonator is not directly contacted with the chamber body; the difference of the thermal expansion coefficient of the connecting piece and the thermal expansion coefficient of the medium resonator is less than that of the thermal expansion coefficient of the chamber body and the thermal expansion coefficient of the medium resonator, and/or the connecting piece is a deformation damping structural part with the elastic deformation capability higher than that of the chamber body. The filter is applied to the design concept on a novel filter and is mainly applied to a novel comb-shaped linear medium resonation mode.
Description
Technical field
The present invention relates to communication equipment field, relate in particular to a kind of dielectric filter.
Background technology
Filter is a vitals commonly used in the communication engineering, and it has frequency selectivity to signal, in system by or blocking-up, separately or the signal of synthetic some frequency, and the resonant cavity of dielectric filter mainly is made up of dielectric resonator and cavity; Dielectric resonator is meant the electronic component that produces resonance frequency, it has numerous modes of resonance, the electromagnetic field of medium pectinate line mode of resonance wherein is similar to the electromagnetic field of metal pectinate line mode of resonance, compare other patterns, Q (parameter of inductance component) is worth high, is easy to make high performance filter; And in medium comb line filter resonant cavity, diapire welding in dielectric resonator one end and the cavity, the dielectric resonator other end is unsettled, dielectric resonator and cavity quality of connection are directly connected to the performance (frequency, Insertion Loss, intermodulation) and the reliability of filter, and especially the contact area of dielectric resonator end face and housing surface changes the deterioration that will cause electrical property.
In the prior art, the cavity material of main flow is that cost is low, be easy to less relatively aluminium alloy of moulding and density and magnesium alloy etc., also have in the recent period the application of engineering plastics as cavity material, the general character of this class material is that its thermal coefficient of expansion (CTE) is generally bigger, and the dielectric resonator employing is ceramic material, its thermal coefficient of expansion is less, because the temperature change of communication apparatus receiving and transmitting front end is bigger, along with the power capacity of filter is increasing, the solder joint of dielectric resonator and cavity welding produces cracking owing to the thermal coefficient of expansion gap is bigger, loosening phenomenon, thereby the long-term reliability risk of bringing is increasing, finally brings the failure risk of filter higher.
Summary of the invention
Embodiments of the invention provide a kind of solder joint that reduces dielectric resonator to cause the filter of the probability that ftractures because of the thermal coefficient of expansion gap.
For achieving the above object, embodiments of the invention adopt following technical scheme:
Filter of the present invention comprises dielectric resonator and cavity, and described dielectric resonator is installed in the inside of described cavity, wherein: also comprise connector, described dielectric resonator is welded on connector, and connector and cavity link together, and described dielectric resonator does not directly contact with cavity;
The difference of the thermal coefficient of expansion of described connector and described dielectric resonator thermal coefficient of expansion is less than the difference of the thermal coefficient of expansion and the described dielectric resonator thermal coefficient of expansion of described cavity, and/or
Described connector is higher than the elastic deformability's of described cavity deformation buffer structure spare for the elastic deformability.
Filter of the present invention comprises dielectric resonator and cavity, and described dielectric resonator and described cavity weld together, and wherein: described cavity is a sheet metal component.
Filter of the present invention, comprise dielectric resonator and cavity, described dielectric resonator and described cavity weld together, wherein: the commissure between described dielectric resonator and the described cavity is provided with column girth member and scolder, the two ends of described girth member respectively with the welding of dielectric resonator and cavity, and described scolder is filled in the zone that described commissure is not provided with girth member.
The filter that the embodiment of the invention provides, by connector is set, and dielectric resonator is welded on connector, connector and cavity link together, dielectric resonator does not directly contact with cavity, like this, form dielectric resonator being connected by connector and cavity, on this basis, the difference of the thermal coefficient of expansion of connector and dielectric resonator thermal coefficient of expansion is less than the difference of the thermal coefficient of expansion and the dielectric resonator thermal coefficient of expansion of cavity, like this, can reduce the thermal dilation difference of dielectric resonator solder joint, thereby reduce dielectric resonator and cavity produce cracking phenomena because of the thermal coefficient of expansion gap probability; Or
Connector is higher than the elastic deformability's of cavity deformation buffer structure spare for the elastic deformability, like this, when dielectric resonator with after deformation buffer structure spare is connected, the ess-strain that affacts on the solder joint can obtain efficient buffer after the distortion at the soldered position that variations in temperature causes and the distortion, thereby reduces dielectric resonator and cavity produce the solder joint cracking phenomena because of the thermal coefficient of expansion gap probability.
The filter that the embodiment of the invention provides, by cavity is arranged to sheet metal component, be not used in the cavity material of conventional die casting moulding because of the sheet metal component material, the thermal coefficient of expansion of sheet metal component is generally less, approaching with the ceramic material of dielectric resonator, like this, can ensure the reliability of dielectric resonator solder joint, finally reduce dielectric resonator and cavity produce cracking phenomena because of the thermal coefficient of expansion gap probability.
The filter that the embodiment of the invention provides, be provided with column girth member and scolder by the commissure between dielectric resonator and cavity, and weld with dielectric resonator and cavity respectively at the two ends of girth member, and the commissure is not provided with the zone of girth member and fills above-mentioned scolder; Like this, can increase throat depth by girth member is set, thereby can improve solder joint lifetimes to a certain extent, finally reduce dielectric resonator and cavity produce cracking phenomena because of the thermal coefficient of expansion gap probability.
Description of drawings
Fig. 1 is the structural representation under first kind of embodiment of filter of the present invention;
Fig. 2 is the structural representation under first kind of embodiment of filter of the present invention;
Fig. 3 is the structural representation under first kind of embodiment of filter of the present invention;
Fig. 4 is the structural representation under first kind of embodiment of filter of the present invention;
Fig. 5 is the structural representation under second kind of embodiment of filter of the present invention;
Fig. 6 is the structural representation of connector in the filter of the present invention and cavity connected mode;
Fig. 7 is the structural representation of connector in the filter of the present invention and cavity connected mode;
Fig. 8 is the structural representation of connector in the filter of the present invention and cavity connected mode;
Fig. 9 is the structural representation of connector in the filter of the present invention and cavity connected mode;
Figure 10 is the structural representation under the third embodiment of filter of the present invention.
Embodiment
Be described in detail below in conjunction with the filter of accompanying drawing the embodiment of the invention.
Embodiment one
Referring to Fig. 1, the filter of the embodiment of the invention, comprise dielectric resonator 1, cavity 2 and connector 3, dielectric resonator 1 is installed in the inside of cavity 2, dielectric resonator 1 wherein is welded on the connector 3, and connector 3 links together with cavity 2, and dielectric resonator 1 does not directly contact with cavity 2; Like this, form dielectric resonator 1, can adopt in the following scheme one or both about the design of connector 3 by being connected of connector 3 and cavity 2:
The first, the difference of the thermal coefficient of expansion of connector 3 and dielectric resonator thermal coefficient of expansion is less than the difference of the thermal coefficient of expansion and the dielectric resonator thermal coefficient of expansion of cavity 2.
The second, connector 3 is higher than the elastic deformability's of cavity 2 deformation buffer structure spare for the elastic deformability.
Design about above-mentioned connector 3, when adopting first kind of situation separately, can reduce the thermal dilation difference of dielectric resonator solder joint, produce the probability of cracking phenomena thereby reduce dielectric resonator 1 and cavity 2 because of the thermal coefficient of expansion gap, the material that can adopt under first kind of situation includes but not limited to following several: Cu or CuW alloy or CuMo alloy or steel and alloy or metallized Al
2O
3Pottery or AlSi or AlCSi etc., like this, cavity 2 can adopt the material that thermal coefficient of expansion is bigger, cost is lower, as engineering plastics etc.; When adopting second kind of situation separately, the ess-strain that affacts on the solder joint after the distortion at the soldered position that variations in temperature causes and the distortion can obtain efficient buffer, thereby reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability, the material of deformation buffer structure spare can be the metal/non-metal material, it is good to require as far as possible the strong and machining of elastic deformability to add performance, and the material of Cai Yonging includes but not limited to following several in the case: beryllium copper or 65Mn; Certainly, adopt two kinds of situations and be the optimal design of the embodiment of the invention when depositing, can further reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability.
About the design of above-mentioned deformation buffer structure spare, adopt following scheme:
Referring to Fig. 2, the deformation buffer structure spare in the filter of the embodiment of the invention comprises fixed head 5 that links together with cavity 2 and the connecting plate 4 that is connected with fixed head 5 by spring 6, and dielectric resonator 1 is welded on connecting plate 4; The connected mode of fixed head 5 and cavity 2 can be the mechanical connection of common mode, gluing, welding or riveted joint, and in an embodiment of the present invention, what provide is the mode that is spirally connected; Sometimes in order to reinforce screw thread, also will consider the application screw thread fastening glue; This design, when dielectric resonator 1 is heated when deforming, the deformation buffer structure spare that connecting plate 4, fixed head 5 and spring 6 are formed can effectively support and remove strain stress, thereby has effectively ensured the reliability of dielectric resonator solder joint.
Certainly, in the filter of the embodiment of the invention, referring to Fig. 4, deformation buffer structure spare can also be designed to shell fragment 9, and shell fragment 9 also can reach to the purpose of removing dielectric resonator 1 strain stress, and then effectively ensures the reliability of dielectric resonator solder joint.
In the above-described embodiment, about the connected mode of connector 3 and cavity 2, adopt but be not limited to be spirally connected or welding or gluing or riveted joint in any.
In the filter of the present invention, about the specific design of cavity 2 and connector 3, can adopt but be not limited to following scheme: referring to Fig. 3, cavity 2 also comprises cover plate 21, cavity 2 open tops, and above-mentioned cover plate 21 is set, seal chamber 2 openings at cavity 2 top open parts; Connector 3 is welded in the one side of cover plate 21 towards cavity 2 inside;
Certainly, connector 3 also can be directly installed on the inwall of cavity 2.
More than in the design, what all adopt is the difference of the difference of the thermal coefficient of expansion of connector 3 and dielectric resonator thermal coefficient of expansion less than the thermal coefficient of expansion and the dielectric resonator thermal coefficient of expansion of cavity 2, thus reliability that can more effective guarantee dielectric resonator solder joint; Connector 3 wherein is directly installed under the mode on the inwall of cavity 2, referring to Fig. 6 to Fig. 9, provides 4 kinds of embodiments, and the annexation of connector 3 and cavity 2 is described, what Fig. 6 adopted is the mode that is spirally connected; What Fig. 7 adopted is riveted way; What Fig. 8 adopted is the mode of screw; What Fig. 9 adopted is gluing mode, no matter adopts any mode, can adapt to the annexation of connector 3 and cavity 2.
On the basis of the above, connector 3 in the filter of the present invention is a sheet metal component, be not used in the cavity material of conventional die casting moulding because of the sheet metal component material, the CTE of sheet metal component is generally less, approaching with the ceramic material of dielectric resonator 1, like this, can ensure the reliability of dielectric resonator solder joint, reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability.
In above-mentioned all modes, filter of the present invention is set to sheet metal component with cavity 2, and its operation principle and connector 3 are that the design of sheet metal component is identical.
In order to provide a kind of sheet metal component specific design that can specifically implement, sheet metal component in the filter of the present invention is designed to the ferroalloy sheet metal component, the thermal coefficient of expansion of ferroalloy is generally less, approaching with the ceramic material of dielectric resonator 1, like this, can ensure the reliability of dielectric resonator solder joint, finally reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability.
Embodiment two
The filter of the embodiment of the invention can also adopt another design, and is as follows:
Referring to Fig. 5, the filter of the embodiment of the invention comprises dielectric resonator 1 and cavity 2, and dielectric resonator 1 welds together with chamber 2 bodies, cavity 2 is a sheet metal component, directly the material of cavity 2 is replaced, replaced with the littler sheet metal component of thermal coefficient of expansion, the CTE of sheet metal component is generally less, approaching with the ceramic material of dielectric resonator 1, like this, can ensure the reliability of dielectric resonator solder joint, reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability.
In above-mentioned design, in order to provide a kind of sheet metal component specific design that can specifically implement, sheet metal component in the filter of the present invention is designed to the ferroalloy sheet metal component, the thermal coefficient of expansion of ferroalloy is generally less, approaching with the ceramic material of dielectric resonator 1, like this, can ensure the reliability of dielectric resonator solder joint, reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability.
Embodiment three
Referring to Figure 10, the filter of the embodiment of the invention, comprise dielectric resonator 1 and cavity 2, dielectric resonator 1 welds together with cavity 2, weld seam 10 places between dielectric resonator 1 and the cavity 2 are provided with column girth member 11 and scolder 12, weld with dielectric resonator 1 and cavity 2 respectively at the two ends of girth member 11, and weld seam 10 places are not provided with the zone of girth member 11 and fill above-mentioned scolder 12, like this, can increase weld seam 10 thickness by girth member 11 is set, thereby can improve solder joint lifetimes to a certain extent, finally reduce dielectric resonator 1 and cavity 2 produce cracking phenomena because of the thermal coefficient of expansion gap probability.
The filter of the embodiment of the invention, column girth member 11 is provided with a plurality of holes, has formed network structure on the basis of column girth member 11 again; She Ji purpose is that cancellated girth member 11 not only can effectively be controlled weld seam 10 height like this, and its network structure also can effectively slow down the expansion of crackle, and then further prolongs solder joint lifetimes.
The filter of the embodiment of the invention, above-mentioned girth member 11 is a plurality of, like this, can make 2 of dielectric resonator 1 and cavitys more firm.
The embodiment of the invention is applied to a kind of new Design of Filter thought, is mainly used in a kind of new medium pectinate line mode of resonance.
The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion by described protection range with claim.
Claims (15)
1. filter, comprise dielectric resonator and cavity, described dielectric resonator is installed in the inside of described cavity, it is characterized in that: also comprise connector, described dielectric resonator is welded on connector, and connector and cavity link together, and described dielectric resonator does not directly contact with cavity;
The difference of the thermal coefficient of expansion of described connector and described dielectric resonator thermal coefficient of expansion is less than the difference of the thermal coefficient of expansion and the described dielectric resonator thermal coefficient of expansion of described cavity, and/or
Described connector is higher than the elastic deformability's of described cavity deformation buffer structure spare for the elastic deformability.
2. filter according to claim 1 is characterized in that: the preparation material of described connector is Cu or CuW alloy or CuMo alloy or steel and alloy or metallized Al
2O
3Pottery or AlSi or AlCSi.
3. filter according to claim 1 is characterized in that: the preparation material of described deformation buffer structure spare is beryllium copper or 65Mn.
4. filter according to claim 1, it is characterized in that: described deformation buffer structure spare comprises fixed head that links together with described cavity and the connecting plate that is connected with described fixed head by spring, and described dielectric resonator is welded on described connecting plate.
5. filter according to claim 1 is characterized in that: described deformation buffer structure spare is a shell fragment.
6. filter according to claim 1 is characterized in that: described connector is by being spirally connected or welding or gluing or riveted way are fixed on the described cavity.
7. filter according to claim 1 is characterized in that: described cavity also comprises cover plate, described cavity open top, and described cover plate is set at described cavity top open part, seal described cavity hatch; Described connector is welded in the one side of described cover plate towards described inside cavity.
8. filter according to claim 7 is characterized in that: described connector is a sheet metal component.
9. according to any described filter in the claim 1 to 8, it is characterized in that: described cavity is a sheet metal component.
10. filter according to claim 9 is characterized in that: described sheet metal component is the ferroalloy sheet metal component.
11. a filter comprises dielectric resonator and cavity, described dielectric resonator and described cavity weld together, and it is characterized in that: described cavity is a sheet metal component.
12. filter according to claim 11 is characterized in that: described sheet metal component is the ferroalloy sheet metal component.
13. filter, comprise dielectric resonator and cavity, described dielectric resonator and described cavity weld together, it is characterized in that: the commissure between described dielectric resonator and the described cavity is provided with column girth member and scolder, the two ends of described girth member respectively with the welding of dielectric resonator and cavity, and described scolder is filled in the zone that described commissure is not provided with girth member.
14. filter according to claim 13 is characterized in that: described column girth member is provided with a plurality of holes.
15. according to claim 13 or 14 described filters, it is characterized in that: described girth member is a plurality of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110075352XA CN102222811A (en) | 2011-03-28 | 2011-03-28 | Filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110075352XA CN102222811A (en) | 2011-03-28 | 2011-03-28 | Filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102222811A true CN102222811A (en) | 2011-10-19 |
Family
ID=44779287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110075352XA Pending CN102222811A (en) | 2011-03-28 | 2011-03-28 | Filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102222811A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709628A (en) * | 2012-02-03 | 2012-10-03 | 苏州天擎电子通讯有限公司 | Cavity filter |
| GB2499724A (en) * | 2012-02-24 | 2013-08-28 | Radio Design Ltd | Cavity filter comprising dielectric rod and flexible lid to compensate for mechanical tolerances |
| CN103944558A (en) * | 2014-04-29 | 2014-07-23 | 上海鸿晔电子科技有限公司 | Multi-spring shock absorption type anti-seismic constant temperature crystal oscillator |
| CN103972618A (en) * | 2014-03-28 | 2014-08-06 | 华为机器有限公司 | TM mode dielectric filter |
| CN104319451B (en) * | 2014-10-17 | 2017-04-12 | 张家港保税区灿勤科技有限公司 | High-Q-value C-band dielectric resonator |
| WO2018132985A1 (en) * | 2017-01-18 | 2018-07-26 | 华为技术有限公司 | Transverse magnetic mode dielectric resonator, filter, and communication device |
| CN111293387A (en) * | 2020-03-27 | 2020-06-16 | 深圳顺络电子股份有限公司 | Ceramic filter with CTE compensation |
| WO2020133181A1 (en) * | 2018-12-28 | 2020-07-02 | 华为技术有限公司 | Tm mode filter and manufacturing method therefor |
| CN111725592A (en) * | 2019-03-20 | 2020-09-29 | 华为技术有限公司 | Phase shifters, antennas and base stations |
| WO2022036700A1 (en) * | 2020-08-21 | 2022-02-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Filter unit and radio node |
| CN114665246A (en) * | 2022-04-15 | 2022-06-24 | 武汉凡谷电子技术股份有限公司 | Dielectric resonator, filter, communication equipment and installation method |
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| JPS5963802A (en) * | 1982-10-01 | 1984-04-11 | Murata Mfg Co Ltd | Dielectric resonator |
| CN101546857A (en) * | 2009-04-21 | 2009-09-30 | 华为技术有限公司 | A medium resonator and its assembling method, medium filter |
| CN201611679U (en) * | 2010-02-10 | 2010-10-20 | 武汉凡谷电子技术股份有限公司 | Installation structure of a dielectric resonator |
| CN201749919U (en) * | 2010-08-20 | 2011-02-16 | 深圳市大富科技股份有限公司 | Cavity filter |
-
2011
- 2011-03-28 CN CN201110075352XA patent/CN102222811A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5963802A (en) * | 1982-10-01 | 1984-04-11 | Murata Mfg Co Ltd | Dielectric resonator |
| CN101546857A (en) * | 2009-04-21 | 2009-09-30 | 华为技术有限公司 | A medium resonator and its assembling method, medium filter |
| CN201611679U (en) * | 2010-02-10 | 2010-10-20 | 武汉凡谷电子技术股份有限公司 | Installation structure of a dielectric resonator |
| CN201749919U (en) * | 2010-08-20 | 2011-02-16 | 深圳市大富科技股份有限公司 | Cavity filter |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709628A (en) * | 2012-02-03 | 2012-10-03 | 苏州天擎电子通讯有限公司 | Cavity filter |
| GB2499724A (en) * | 2012-02-24 | 2013-08-28 | Radio Design Ltd | Cavity filter comprising dielectric rod and flexible lid to compensate for mechanical tolerances |
| GB2499724B (en) * | 2012-02-24 | 2019-11-13 | Radio Design Ltd | Filter apparatus and method of manufacture thereof |
| CN103972618A (en) * | 2014-03-28 | 2014-08-06 | 华为机器有限公司 | TM mode dielectric filter |
| CN103944558A (en) * | 2014-04-29 | 2014-07-23 | 上海鸿晔电子科技有限公司 | Multi-spring shock absorption type anti-seismic constant temperature crystal oscillator |
| CN104319451B (en) * | 2014-10-17 | 2017-04-12 | 张家港保税区灿勤科技有限公司 | High-Q-value C-band dielectric resonator |
| WO2018132985A1 (en) * | 2017-01-18 | 2018-07-26 | 华为技术有限公司 | Transverse magnetic mode dielectric resonator, filter, and communication device |
| US11108122B2 (en) | 2017-01-18 | 2021-08-31 | Huawei Technologies Co., Ltd. | TM mode dielectric resonator including a resonant dielectric rod soldered to a fixing base within a housing baseplate, for forming a filter and a communications device |
| WO2020133181A1 (en) * | 2018-12-28 | 2020-07-02 | 华为技术有限公司 | Tm mode filter and manufacturing method therefor |
| EP3893325A4 (en) * | 2018-12-28 | 2021-12-22 | Huawei Technologies Co., Ltd. | FILTER IN TM MODE AND ITS MANUFACTURING PROCESS |
| US11990661B2 (en) | 2018-12-28 | 2024-05-21 | Huawei Technologies Co., Ltd. | TM mode filter and method for manufacturing TM mode filter |
| CN111725592A (en) * | 2019-03-20 | 2020-09-29 | 华为技术有限公司 | Phase shifters, antennas and base stations |
| US12069801B2 (en) | 2019-03-20 | 2024-08-20 | Huawei Technologies Co., Ltd. | Phase shifter, antenna, and base station |
| CN111293387A (en) * | 2020-03-27 | 2020-06-16 | 深圳顺络电子股份有限公司 | Ceramic filter with CTE compensation |
| WO2022036700A1 (en) * | 2020-08-21 | 2022-02-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Filter unit and radio node |
| CN114665246A (en) * | 2022-04-15 | 2022-06-24 | 武汉凡谷电子技术股份有限公司 | Dielectric resonator, filter, communication equipment and installation method |
| CN114665246B (en) * | 2022-04-15 | 2024-04-05 | 武汉凡谷电子技术股份有限公司 | Dielectric resonator, filter, communication equipment and installation method |
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| PB01 | Publication | ||
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| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: No. 2 Metro Avenue Songshan Lake Science and Technology Industrial Park 523808 Guangdong city of Dongguan Province Applicant after: Huawei Machine Co.,Ltd. Address before: No. 2 Metro Avenue Songshan Lake Science and Technology Industrial Park 523808 Guangdong city of Dongguan Province Applicant before: Juxin Technology Co., Ltd. |
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| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: JUXIN TECHNOLOGY CO., LTD. TO: HUAWEI MACHINE CO., LTD. |
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| C12 | Rejection of a patent application after its publication | ||
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Application publication date: 20111019 |