CN102226000B - 硼硅炔杂化耐高温树脂及其制备方法 - Google Patents
硼硅炔杂化耐高温树脂及其制备方法 Download PDFInfo
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- CN102226000B CN102226000B CN2011101012746A CN201110101274A CN102226000B CN 102226000 B CN102226000 B CN 102226000B CN 2011101012746 A CN2011101012746 A CN 2011101012746A CN 201110101274 A CN201110101274 A CN 201110101274A CN 102226000 B CN102226000 B CN 102226000B
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- diethynylbenzene
- preparation
- dichlorosilane
- bromide
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- 239000011347 resin Substances 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- -1 boron silicon alkyne Chemical class 0.000 title claims description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 39
- CBYDUPRWILCUIC-UHFFFAOYSA-N 1,2-diethynylbenzene Chemical compound C#CC1=CC=CC=C1C#C CBYDUPRWILCUIC-UHFFFAOYSA-N 0.000 claims abstract description 21
- NCQDQONETMHUMY-UHFFFAOYSA-N dichloro(phenyl)borane Chemical compound ClB(Cl)C1=CC=CC=C1 NCQDQONETMHUMY-UHFFFAOYSA-N 0.000 claims abstract description 19
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 16
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011261 inert gas Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- FRIJBUGBVQZNTB-UHFFFAOYSA-M magnesium;ethane;bromide Chemical compound [Mg+2].[Br-].[CH2-]C FRIJBUGBVQZNTB-UHFFFAOYSA-M 0.000 claims abstract description 7
- SKZPVVNYWYOWCM-UHFFFAOYSA-M C(#C)C=1C(=C(C=CC=1)[Mg]Br)C#C Chemical compound C(#C)C=1C(=C(C=CC=1)[Mg]Br)C#C SKZPVVNYWYOWCM-UHFFFAOYSA-M 0.000 claims abstract description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 239000011777 magnesium Substances 0.000 claims abstract description 6
- 239000012467 final product Substances 0.000 claims abstract description 3
- 238000012805 post-processing Methods 0.000 claims abstract 2
- 238000010992 reflux Methods 0.000 claims description 15
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 5
- 230000035484 reaction time Effects 0.000 claims description 5
- PNXLPYYXCOXPBM-UHFFFAOYSA-N 1,3-diethynylbenzene Chemical group C#CC1=CC=CC(C#C)=C1 PNXLPYYXCOXPBM-UHFFFAOYSA-N 0.000 claims description 4
- MVLGANVFCMOJHR-UHFFFAOYSA-N 1,4-diethynylbenzene Chemical compound C#CC1=CC=C(C#C)C=C1 MVLGANVFCMOJHR-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 abstract description 30
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 abstract description 15
- 229920000642 polymer Polymers 0.000 abstract description 14
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052796 boron Inorganic materials 0.000 abstract description 8
- 239000012700 ceramic precursor Substances 0.000 abstract description 6
- 239000002131 composite material Substances 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 5
- 230000007123 defense Effects 0.000 abstract description 3
- 239000011159 matrix material Substances 0.000 abstract description 3
- 239000003960 organic solvent Substances 0.000 abstract description 3
- 239000007818 Grignard reagent Substances 0.000 abstract description 2
- 150000004795 grignard reagents Chemical class 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000000376 reactant Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000003921 oil Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- 229910018540 Si C Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 2
- SRNLFSKWPCUYHC-UHFFFAOYSA-N ethynylsilane Chemical compound [SiH3]C#C SRNLFSKWPCUYHC-UHFFFAOYSA-N 0.000 description 2
- 239000005048 methyldichlorosilane Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- ROGBPNDEFHPGSY-UHFFFAOYSA-N 2-phenylethynylsilicon Chemical class [Si]C#CC1=CC=CC=C1 ROGBPNDEFHPGSY-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920003257 polycarbosilane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101012746A CN102226000B (zh) | 2011-04-21 | 2011-04-21 | 硼硅炔杂化耐高温树脂及其制备方法 |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011101012746A CN102226000B (zh) | 2011-04-21 | 2011-04-21 | 硼硅炔杂化耐高温树脂及其制备方法 |
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| Publication Number | Publication Date |
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| CN102226000A CN102226000A (zh) | 2011-10-26 |
| CN102226000B true CN102226000B (zh) | 2012-11-14 |
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| CN2011101012746A Active CN102226000B (zh) | 2011-04-21 | 2011-04-21 | 硼硅炔杂化耐高温树脂及其制备方法 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102585239B (zh) * | 2012-01-06 | 2013-10-09 | 华东理工大学 | 耐高温苯硼酸-硅氧烷-亚氨基线型聚合物及其制备方法 |
| CN103333341A (zh) * | 2013-06-25 | 2013-10-02 | 华东理工大学 | 一种耐高温杂化硅氮烷树脂及其制备方法 |
| CN104072780A (zh) * | 2014-07-21 | 2014-10-01 | 华东理工大学 | 一种硼硅炔树脂及其制备方法 |
| CN113336951B (zh) * | 2021-06-03 | 2022-08-26 | 华东理工大学 | 硼硅乙炔杂化共聚树脂、固化物及其制备方法和应用 |
| CN119978385A (zh) * | 2025-03-14 | 2025-05-13 | 华东理工大学 | 一种碳硼烷封端硼硅炔树脂聚合物及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1763053A (zh) * | 2005-11-09 | 2006-04-26 | 华东理工大学 | 二苯乙炔基硅烷的新型合成方法 |
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- 2011-04-21 CN CN2011101012746A patent/CN102226000B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1763053A (zh) * | 2005-11-09 | 2006-04-26 | 华东理工大学 | 二苯乙炔基硅烷的新型合成方法 |
Non-Patent Citations (2)
| Title |
|---|
| Rui Cheng et al.Synthesis and thermal property of boron-silicon-acetylene hybrid polymer.《Journal of applied polymer science》.2010,第11卷(第1期),47-52. * |
| 陈麟等.甲基二苯乙炔基硅烷及其网络聚合物的合成与表征.《化学学报》.2005,第63卷(第3期),254-258. * |
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| Publication number | Publication date |
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| CN102226000A (zh) | 2011-10-26 |
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Effective date of registration: 20170215 Address after: 201507 Shanghai city Jinshan District Caojing town industry Road No. 88 building 3 Patentee after: SHANGHAI MAIPU NEW MATERIALS TECHNOLOGY CO., LTD. Patentee after: East China University of Science and Technology Address before: 200237 Meilong Road, Shanghai, No. 130, No. Patentee before: East China University of Science and Technology |
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| CP01 | Change in the name or title of a patent holder |
Address after: 201507 Shanghai city Jinshan District Caojing town industry Road No. 88 building 3 Co-patentee after: EAST CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY Patentee after: Shanghai Mahou New Material Technology Co., Ltd Address before: 201507 Shanghai city Jinshan District Caojing town industry Road No. 88 building 3 Co-patentee before: EAST CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY Patentee before: SHANGHAI MAIPU NEW MATERIAL TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |