CN102164006B - Dual-channel compact small from-factor pluggable circuit - Google Patents

Abstract

The invention discloses a dual-channel compact and small pluggable optical module circuit, which relates to optical communication technology, in particular to an optical module circuit for realizing photoelectric signal conversion in optical communication. The key points of the design of the present invention are: including an interface circuit, a microcontroller, a first optical transceiver module assembly and a second optical transceiver module assembly, a first transceiver integrated chip and a second transceiver integrated chip, and a power starting circuit; the first optical transceiver module The assembly and the first transceiver integrated chip form the first optical channel; the second optical transceiver module assembly and the second transceiver integrated chip form the second optical channel; The signal receiving end is connected; the interface circuit is used to realize the communication between the four circuit modules of the microcontroller, the signal interface of the two sets of transceiver integrated chips, and the power starting circuit and the upper computer. The invention has the advantages of low cost, simple circuit structure and small size.

Description

A dual-channel compact and pluggable optical module circuit

technical field

The invention relates to optical communication technology, in particular to a compact and small pluggable optical transceiver module circuit structure.

Background technique

Acronym definitions:

BOSA: (Bi-directional Optical Sub-Assembly) optical transceiver module interface assembly;

CSFP: (Compact Small From-Factor Pluggable) compact small pluggable optical module;

SFP: (Small From-Factor Pluggable) small pluggable optical module;

MSA: (Multi-Source Agreement) multi-source agreement;

PLC: (Planar optical waveguide) planar optical waveguide;

PCB: (Printed Circuit Board) printed circuit board;

TO38/TO56/TO46: Packaging forms of optical device chips with different mechanical sizes, among which TO38 is smaller in size and more expensive and not commonly used, while TO56 and TO46 are commonly used mechanical size structures;

DDM: (Digital Diagnostic Monitor) digital diagnostic monitoring.

With the development of optical fiber communication, the optical transmission system puts forward higher requirements for optical modules. Optical transceivers are gradually developing in the direction of low cost, small size, and large capacity. In order to meet the requirements of large capacity and small size, the CSFP MSA (Multi Source Agreement) international alliance proposed the requirement of adopting the CSFP optical module with the traditional SFP industry standard size and single-channel SFP MSA mechanical structure to achieve dual-channel data transmission, so that The original SFP panel space is doubled to improve port utilization.

To place a dual-channel CSFP in a single-channel SFP module, higher requirements are placed on the size and integration of the dual-channel CSFP. For the selection of dual-channel CSFP optical devices, the industry adopts the PLC process or the small-sized package BOSA, such as the BOSA with a package specification of TO38.

However, the currently used PLC technology optical transceiver components have the disadvantages of high packaging technology requirements, high cost and poor design flexibility. At the same time, the production and sales of the optical transceiver components are monopolized by foreign companies. In addition, with the PLC process, both the laser and the optical signal receiving end chip need to be installed in a fixed position on the optical waveguide. If the chip model needs to be changed, the entire optical transceiver module interface component needs to be newly developed, which cannot meet customer customization requirements.

Although the TO38-packaged free-space coupling optical transceiver module interface components are small in size, TO38-sized optical chips are generally not used in conventional SFP optical modules, which also leads to its high price and immature packaging technology. At the same time, the BOSA structure packaged with this TO38 size is also an unconventional structure, which further increases the cost of the optical module.

In terms of optical device drive and optical signal amplification, the traditional practice of optical module manufacturers in the industry is to adopt a dual-chip solution in which the laser drive unit and the limiting amplifier unit are separated. However, due to the limitation of mechanical size, the dual-channel CSFP puts forward higher requirements on the size and function of the selected chip, and the dual-chip solution can no longer meet the needs of CSFP design. For the digital diagnostic monitoring module, the industry usually uses a microcontroller to perform analog-to-digital conversion on all analog quantities that need to be monitored, and convert the results to the upper computer. The analog-to-digital conversion in this method needs to increase a large number of external components and increase the difficulty of the algorithm, thereby increasing the cost of the optical module.

Contents of the invention

The purpose of the present invention is to provide a dual-channel CSFP protocol standard, low cost, high integration, simple circuit structure, small size, large receiving end power monitoring dynamic range, and high sensitivity for the deficiencies in the prior art. Dual-channel compact small pluggable optical module (hereinafter referred to as optical module) circuit.

The technical solution adopted by the present invention is as follows: a dual-channel compact and small pluggable optical module circuit, including an interface circuit, a microcontroller, a first optical transceiver module assembly and a second optical transceiver module assembly, characterized in that It includes a first transceiver integrated chip, a second transceiver integrated chip, and a power startup circuit; the power startup circuit is used to supply power to the microcontroller and two groups of transceiver integrated chips; the electrical signal output terminal of the first optical transceiver module component is connected to the first The electrical signal receiving end of the transceiver integrated chip is connected, and the laser driving signal output end of the first transceiver integrated chip is connected with the laser driving signal receiving end of the first optical transceiver module assembly; the electrical signal output end of the second optical transceiver module assembly is connected with the second optical transceiver module assembly. The electrical signal receiving end of the integrated transceiver chip is connected, and the laser driving signal output end of the second integrated transceiver chip is connected with the receiving end of the laser driving signal of the second optical transceiver module assembly; The two integrated transceiver chips are connected with signal lines; the interface circuit is used to realize the communication between the microcontroller, the signal interfaces of two groups of integrated transceiver chips, and the upper computer.

Preferably, the power starting circuit is a power slow starting circuit; the host computer provides input power to the power slow starting circuit through the interface circuit.

Preferably, the first or second optical transceiver module assembly further includes a received signal strength indication output terminal and a laser output optical power monitoring signal output terminal;

The first or second transceiver integrated chip includes: chip configuration and signal acquisition unit, limiting amplifier unit and laser drive unit, sending end signal failure indication signal output end; the first or second transceiver integrated chip also passes through the interface circuit Output the receiving end signal loss indication signal to the upper computer;

There is a signal connection between the microcontroller and the chip configuration and acquisition unit of the two sets of integrated transceiver chips;

In each group of transceiver integrated chips, the chip configuration and acquisition unit are also respectively connected to the limiting amplifier unit and the laser drive unit for signals;

The chip configuration and signal acquisition unit of the first transceiver integrated chip receives the received signal strength indication output by the first optical transceiver module assembly and the laser output optical power monitoring signal, and the signal input terminal of the limiting amplifier unit of the first transceiver integrated chip is connected to the second The electrical signal output end of an optical transceiver module assembly is connected, and the electrical signal output end of the limiting amplifier unit of the first transceiver integrated chip is connected with the host computer through an interface circuit; the signal output end of the laser drive unit of the first transceiver integrated chip is connected to the first optical The receiving end of the laser drive signal of the transceiver module assembly is connected, and the electrical signal input end of the laser drive unit of the first transceiver integrated chip is connected to the host computer through the interface circuit;

The chip configuration and signal acquisition unit of the second transceiver integrated chip receives the received signal strength indication output by the second optical transceiver module assembly and the laser output optical power monitoring signal; The electrical signal output end of the two optical transceiver module components is connected, and the electrical signal output end of the limiting amplifying unit of the second transceiver integrated chip is connected with the host computer through the interface circuit; the signal output end of the laser drive unit of the second optical transceiver integrated chip is connected to the second optical The receiving end of the laser driving signal of the transceiver module assembly is connected, and the electrical signal input end of the laser driving unit of the second transceiver integrated chip is connected with the host computer through the interface circuit.

Preferably, it also includes a module failure judging unit; the module failure judging unit is used to receive the sending end signal failure indication signal output by the first transceiver integrated chip and the second transceiver integrated chip, and the output of the module failure judging unit is the first The result of an OR operation between the integrated transceiver chip and the failure indication signal of the sending end signal output by the second integrated transceiver chip; and the output signal of the module failure judgment unit is transmitted to the host computer through the interface circuit.

Preferably, a first filter and a second filter are also included;

The first and second optical transceiver module components include a laser diode, a photodetector diode and a transimpedance amplifier; wherein, the laser diode is used to convert the electrical signal transmitted from the transceiver integrated chip into an optical signal and output it; the photodetector The diode is used to convert the input optical signal into a weak current signal; the transimpedance amplifier is used to convert the current signal output by the photodetection diode into a voltage signal, and output the voltage signal;

A first filter is connected between the output end of the transimpedance amplifier of the first optical transceiver module assembly and the input end of the limiting amplifier in the first transceiver integrated chip;

A second filter is connected between the output end of the transimpedance amplifier of the second optical transceiver module assembly and the input end of the limiting amplifier in the second integrated transceiver chip.

Preferably, a first filter and a second filter are also included;

The first filter is connected to the signal path between the first optical transceiver module assembly and the first transceiver integrated chip, and is used to filter out the noise in the electrical signal output by the first optical transceiver module assembly to the first transceiver integrated chip;

The second filter is connected to the signal path between the second optical transceiver module assembly and the second integrated transceiver chip, and is used for filtering noise in the electrical signal output from the second optical transceiver module assembly to the second integrated transceiver chip.

Preferably, the first or second filter is a Bessel filter.

Preferably, a temperature acquisition unit is also included, the temperature acquisition unit is used to convert the temperature signal into an electrical signal, and transmit the electrical signal to the microcontroller.

Preferably, the microcontroller, interface circuit, two sets of integrated transceiver chips, temperature acquisition circuit, low-pass filter and module failure judgment unit are arranged on one PCB.

Preferably, the two groups of optical transceiver module components communicate with the integrated transceiver chip and filter on the PCB through the impedance matching transmission line provided on the flexible board.

In summary, owing to adopting above-mentioned technical scheme, the beneficial effect of the present invention is:

The transceiver integrated chip adopted in the present invention integrates a limiting amplifier unit and a laser drive unit, and has the advantages of simple circuit structure and high integration;

This design uses a microcontroller to configure a transceiver integrated chip to set the intensity of the input optical power when the signal at the receiving end is lost, which is more convenient for production and debugging.

The present invention increases the sensitivity of the optical module by 1-3dB by adding a Bessel low-pass filter to the signal path between each group of optical transceiver module components and the integrated transceiver chip to filter out the high-frequency noise interference outside the signal bandwidth. The anti-jamming performance of the optical receiver is improved.

The transceiver integrated chip adopted in the present invention uses a transimpedance amplifier to convert the current signal indicated by the received signal strength output by the interface component of the optical transceiver module into a voltage signal, and converts the voltage analog signal into a digital signal through the built-in analog-to-digital conversion circuit of the transceiver integrated chip. The signal is stored in the internal register of the chip to realize the collection of optical power at the receiving end. In a similar way, the transceiver integrated chip uses the integrated analog-to-digital converter inside the chip to collect the laser bias current, laser output optical power and chip voltage, and store the conversion results into the corresponding registers inside the chip. The microcontroller unit reads the conversion result stored inside the chip through the I2C bus between the transceiver and the integrated chip. At the same time, the microcontroller will obtain the conversion result for simple conversion and store it in the corresponding register according to the CSFP MSA. The host computer accesses the microcontroller through the I2C bus of the 20PIN electrical interface to obtain the digital diagnosis result of the CSFP optical module.

In the present invention, the microcontroller unit realizes the A0H, B0H, A2H, B2H register mapping defined by the CSFP MSA through software. For the design of digital diagnostic monitoring (DDM), the existing general method is to directly obtain information such as the transmitted optical power, received optical power, module temperature, module voltage and bias current of the optical module through the acquisition of the microcontroller and the digital-to-analog conversion unit . For a single-channel SFP, this design method can basically meet the requirements, but for a dual-channel CSFP, if the common method used in the industry is adopted, the acquisition and conversion burden of the microcontroller will be doubled, and the performance and program complexity of the microcontroller will be raised. higher requirements. In the present invention, all analog signals except temperature information are collected by an integrated transceiver chip, thereby greatly reducing the complexity of program design and peripheral devices.

Compared with the traditional optical module, all the indicators of the CSFP in the present invention that need to be debugged (including power indicators, extinction ratio indicators, signal loss range settings, etc.) The cost improves the reliability of the module.

Description of drawings

The invention will be illustrated by way of example with reference to the accompanying drawings, in which:

Fig. 1 is a schematic block diagram of the circuit of the present invention.

Fig. 2 is a schematic diagram of an optical channel structure and signal transmission in the present invention.

Fig. 3 is the front of the 20PIN electrical interface circuit board of the present invention.

Fig. 4 is the reverse side of the 20PIN electrical interface circuit board of the present invention.

Detailed ways

All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and/or steps.

Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

As shown in Figure 1, the dual-channel compact optical module of the present invention includes an interface circuit that meets the definition of CSFP MSA, a power supply start-up circuit, a microcontroller, two sets of integrated transceiver chips, two general-purpose optical transceiver module components, and a module failure judgment unit , Temperature acquisition unit.

The power start circuit is a power slow start circuit composed of capacitors and gate circuits. The input power of the power slow start circuit is provided by the host computer, and its power output is connected to two sets of transceiver integrated chips and microcontroller chips respectively. When the optical module is connected to the system, the power supply slow start unit delays the power-on of the subsequent transceiver integrated chip and the microcontroller chip to reduce the impact of the capacitive load on the power supply of the upper computer at the moment of power-on.

The optical transceiver module assembly adopts the traditional TO56/TO46 packaged BOSA. It contains a laser diode, a photodetector diode and a transimpedance amplifier inside. Among them, the laser diode converts the electrical signal transmitted from the transceiver integrated chip into an optical signal and outputs it to an external optical fiber; the photodetector diode converts the optical signal input from the optical fiber into a weak current signal, and then the subsequent transimpedance amplifier Convert the current signal into a voltage signal and output the voltage signal.

The temperature acquisition unit converts the collected temperature signal into an electrical signal and then transmits it to the microcontroller; the main function of the microcontroller is to communicate with the host computer through the I2C bus and to monitor the two sets of integrated chips according to the configuration information of the host computer through the I2C bus. 1. Configure the temperature acquisition circuit, and transmit the state information and temperature information of these three parts to the host computer at the same time.

As shown in Figure 2, it is the composition of one of the channels of the dual-channel CSFP. The transceiver integrated chip includes a chip configuration and a signal acquisition unit, a limiting amplifier unit and a laser driver unit, and a signal failure indication signal output terminal at the sending end; the chip configuration and acquisition unit are respectively signally connected to the limiting amplifier unit and the laser driver unit; The chip configuration and acquisition unit is used to configure the limiter amplifier unit and laser drive unit inside the chip to maintain their normal work according to the configuration information of the controller; the chip configuration and acquisition unit also receives the output from the optical transceiver module components Signal strength indicator and laser output optical power monitoring signal.

The limiting amplifier unit in the transceiver integrated chip further amplifies the received electrical signal and transmits the amplified signal to the host computer. The laser driver unit converts the voltage signal transmitted from the host computer into a modulated current signal for driving the laser and transmits the modulated current signal to the laser diode in the optical transceiver module assembly to generate an optical signal output.

The transceiver integrated chip also outputs the receiver signal loss indication signal to the upper computer; the transceiver integrated chip has a transmitter signal failure indication signal output terminal for outputting the transmitter signal failure indication signal.

The transceiver integrated chip uses a transimpedance amplifier to convert the current signal indicated by the received signal strength output by the interface component of the optical transceiver module into a voltage signal, and converts the voltage analog signal into a digital signal through the built-in analog-to-digital conversion circuit of the transceiver integrated chip and stores it in the The internal register of the chip is used to realize the collection of the optical power of the receiving end. In a similar way, the transceiver integrated chip uses the integrated analog-to-digital converter inside the chip to collect the laser bias current, laser output optical power and chip voltage, and store the conversion results into the corresponding registers inside the chip. The microcontroller unit reads the conversion result stored inside the chip through the I2C bus between the transceiver and the integrated chip. At the same time, the microcontroller will obtain the conversion result for simple conversion and store it in the corresponding register according to the CSFP MSA, that is, the microcontroller implements the A0H, B0H, A2H, and B2H register mapping defined by the CSFP MSA through software. The host computer accesses the microcontroller through the I2C bus of the 20PIN electrical interface to obtain the digital diagnosis result of the CSFP optical module.

The dual-channel compact and pluggable optical module circuit disclosed by the present invention is provided with a first transceiver integrated chip, a second transceiver integrated chip, a first optical transceiver module assembly, and a second optical transceiver module assembly. The first optical channel is composed of a first transceiver integrated chip and a first optical transceiver module assembly; the second optical channel is composed of a second transceiver integrated chip and a second optical transceiver module assembly.

The chip configuration and signal acquisition unit of the first transceiver integrated chip receives the received signal strength indication output by the first optical transceiver module assembly and the laser output optical power monitoring signal, and the signal input terminal of the limiting amplifier unit of the first transceiver integrated chip is connected to the second The electrical signal output end of an optical transceiver module assembly is connected, and the limiting amplification unit of the first transceiver integrated chip outputs an amplified electrical signal to the host computer through the interface circuit; the signal output terminal of the laser drive unit of the first transceiver integrated chip is connected to the first The receiving end of the laser driving signal of the optical transceiver module assembly is connected; the signal of the laser driving unit of the first transceiver integrated chip receives the electrical signal to be sent output by the host computer through the interface circuit.

The connection relationship between the second transceiver integrated chip and the second optical transceiver module assembly in the second optical channel is the same as that of the first channel, and will not be described again here.

The module failure judging unit is used to receive the sending end signal failure indication signal output by the first transceiver integrated chip and the second transceiver integrated chip, and the output of the module failure judgment unit is the output of the first transceiver integrated chip and the second transceiver integrated chip. The terminal signal failure indication signal is the result of the OR operation; and the output signal of the module failure judgment unit is transmitted to the host computer.

All the interfaces that need to establish communication or electrical connection with the host computer in the four parts of the microcontroller, two sets of transceiver integrated chips, the power supply slow start unit and the module failure judgment unit are connected to the host computer through the interface circuit. As shown in Figure 4, the interface circuit is a 20PIN electrical interface unit defined by CSFP MSA. The 20PIN electrical interface unit used in the present invention is compatible with traditional SFP pins, so that the dual-channel CSFP optical module of the present invention can be replaced with a conventional single-channel SFP module without any problem.

In the design of optical modules, one of the main factors affecting the sensitivity of optical modules is crosstalk. The present invention can add a low-pass filter between the electrical signal output end of the optical transceiver module assembly of each group of optical channels and the electrical signal receiving end of the integrated transceiver chip, specifically, between the transimpedance amplifier of the optical transceiver module assembly A Bessel low-pass filter is added between the output and the input stage of the limiting amplifier in the transceiver integrated chip to filter out high-frequency noise interference beyond the signal bandwidth.

As an embodiment of the optical module circuit of the present invention, the interface circuit, microprocessor, two sets of integrated transceiver chips, temperature acquisition circuit, low-pass filter and module failure judgment unit can be arranged on one PCB. The reception of the optical transceiver module components in each group of optical channels communicates with the transceiver integrated chip and filter on the PCB through the impedance matching transmission line set on the flexible board. Compared with the prior art, the present invention only retains necessary soldering pins during the design process of the flexible board, further reducing the space occupied by the soldering of the flexible board.

The present invention is not limited to the foregoing specific embodiments. The present invention extends to any new feature or any new combination disclosed in this specification, and any new method or process step or any new combination disclosed.

Claims (9)

1. A dual-channel compact and small pluggable optical module circuit, comprising an interface circuit, a microcontroller, a first optical transceiver module assembly and a second optical transceiver module assembly, is characterized in that it also includes a first transceiver integrated chip and a second optical transceiver module assembly Two transceiver integrated chips, power start-up circuit; the power start-up circuit is used to supply power to the microcontroller and two groups of transceiver integrated chips; the electrical signal output end of the first optical transceiver module assembly is connected to the electrical signal receiving end of the first transceiver integrated chip Connect, the laser drive signal output end of the first transceiver integrated chip is connected to the laser drive signal receiving end of the first optical transceiver module assembly; the electrical signal output end of the second optical transceiver module assembly is connected to the electrical signal receiving end of the second transceiver integrated chip Connected, the laser drive signal output end of the second transceiver integrated chip is connected to the laser drive signal receiving end of the second optical transceiver module assembly; the microcontroller is respectively connected to the first transceiver integrated chip and the second transceiver integrated chip with signal lines ; The interface circuit is used to realize the communication between the three circuit modules of the microcontroller, the signal interface of two groups of transceiver integrated chips and the upper computer; The first or second transceiver integrated chip includes: a limiting amplifier unit and a laser driving unit; The signal input end of the limiting amplifying unit of the first integrated transceiver chip is connected to the electrical signal output end of the first optical transceiver module assembly, and the electrical signal output end of the limiting amplifying unit of the first integrated transceiver chip is connected with the host computer through an interface circuit; The signal output end of the laser drive unit of a transceiver integrated chip is connected to the laser drive signal receiving end of the first optical transceiver module assembly, and the electrical signal input end of the laser drive unit of the first transceiver integrated chip is connected to the host computer through an interface circuit; The signal input end of the limiting amplification unit of the second transceiver integrated chip is connected with the electrical signal output end of the second optical transceiver module assembly, and the electrical signal output terminal of the limiting amplification unit of the second transceiver integrated chip is connected with the host computer through the interface circuit; The signal output end of the laser drive unit of the second transceiver integrated chip is connected to the laser drive signal receiving end of the second optical transceiver module assembly, and the electrical signal input end of the laser drive unit of the second transceiver integrated chip is connected to the host computer through the interface circuit; The power starting circuit is a power slow starting circuit; the host computer provides input power to the power slow starting circuit through the interface circuit. 2. A kind of dual-channel compact and small-sized pluggable optical module circuit according to claim 1, wherein the first or second optical transceiver module assembly also includes a received signal strength indicating output port, a laser output optical power Monitoring signal output terminal; The first or second transceiver integrated chip also includes: a chip configuration and signal acquisition unit, a signal failure indication signal output terminal of the sending end; the first or second transceiver integrated chip also outputs the signal loss of the receiving end to the host computer through the interface circuit indication signal; There is a signal connection between the microcontroller and the chip configuration and signal acquisition unit of the two sets of integrated transceiver chips; In each group of integrated transceiver chips, the chip configuration and signal acquisition unit are also respectively connected to the limiting amplifier unit and the laser drive unit; The chip configuration and signal acquisition unit of the first transceiver integrated chip receives the received signal strength indication output by the first optical transceiver module component and the laser output optical power monitoring signal; The chip configuration and signal acquisition unit of the second transceiver integrated chip receives the received signal strength indication output by the second optical transceiver module assembly and the laser output optical power monitoring signal. 3. A dual-channel compact and small pluggable optical module circuit according to claim 2, further comprising a module failure judging unit; the module failure judging unit is used to receive the first transceiver integrated chip and the second The sending terminal signal failure indication signal output by the integrated transceiver chip, the output of the module failure judgment unit is the result of the OR operation of the sending terminal signal failure indication signal output by the first transceiver integrated chip and the second transceiver integrated chip; and the module failure judgment The output signal of the unit is transmitted to the host computer through the interface circuit. 4. A dual-channel compact pluggable optical module circuit according to claim 3, further comprising a first filter and a second filter; The first and second optical transceiver module components include a laser diode, a photodetector diode and a transimpedance amplifier; wherein, the laser diode is used to convert the electrical signal transmitted from the transceiver integrated chip into an optical signal and output it; the photodetector The diode is used to convert the input optical signal into a weak current signal; the transimpedance amplifier is used to convert the current signal output by the photodetection diode into a voltage signal, and output the voltage signal; A first filter is connected between the output end of the transimpedance amplifier of the first optical transceiver module assembly and the input end of the limiting amplifier in the first transceiver integrated chip; A second filter is connected between the output end of the transimpedance amplifier of the second optical transceiver module assembly and the input end of the limiting amplifier in the second integrated transceiver chip. 5. A dual-channel compact pluggable optical module circuit according to claim 1, further comprising a first filter and a second filter; The first filter is connected to the signal path between the first optical transceiver module assembly and the first transceiver integrated chip, and is used to filter out the noise in the electrical signal output by the first optical transceiver module assembly to the first transceiver integrated chip; The second filter is connected to the signal path between the second optical transceiver module assembly and the second integrated transceiver chip, and is used for filtering noise in the electrical signal output from the second optical transceiver module assembly to the second integrated transceiver chip. 6. A dual-channel compact pluggable optical module circuit according to claim 4 or 5, wherein the first or second filter is a Bessel filter. 7. A kind of two-channel compact small-sized pluggable optical module circuit according to claim 6, is characterized in that, also comprises temperature acquisition unit, and described temperature acquisition unit is used for converting temperature signal into electric signal, and this The electrical signal is transmitted to the microcontroller. 8. A kind of dual-channel compact and small-sized pluggable optical module circuit according to claim 7, characterized in that, the microcontroller, interface circuit, two groups of integrated transceiver chips, temperature acquisition circuit, low-pass filter and The module failure judging unit is set on a PCB board. 9. A dual-channel compact and small-sized pluggable optical module circuit according to claim 8, wherein the two groups of optical transceiver module components are integrated with the transceiver on the PCB through the impedance matching transmission line provided on the soft board Chips and filters communicate.