CN102131357A - Hand-held device shell - Google Patents

Abstract

The present invention discloses an electronic device housing. The housing includes an outer peripheral member that forms an outer surface of the device, and an inner platform connected to the outer peripheral member. Electronic device components can be mounted to one or both surfaces of the inner platform. The housing includes a front cover assembly and a rear cover assembly that are mounted to opposite surfaces of the outer peripheral member to retain the electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Description

Handheld Device Housing

Due to the theft of an Apple iPhone 4 prototype by an Apple engineer on March 25, 2010 (as far as Apple knows), the inventions to be disclosed and protected in this application were disclosed to the public prematurely and without authorization from Apple . The U.S. priority application on which this application is based was filed after the theft, which is known to Apple.

field

The present invention generally relates to electronic device housings.

Background technique

Portable electronic devices may be constructed in any suitable manner. For example, a "bucket" type of approach may be used where the first housing part is used as a bucket in which the electronic device parts are placed, and the second housing part is used as a lid for the bucket. This arrangement secures the electronic device components between the first and second housings. As a variation on this, some or all of the electronic device components may be fitted into the bucket lid, and the lid may then be rotated into the bucket to close the device.

Other known portable electronic devices may be constructed by inserting components into a hollow housing element. For example, electronic devices may be constructed using tubular structures (eg, flat tubes or hollow rectangular tubes) into which components of the electronic device may be inserted. Electronic device components can be inserted into the tubular structure from one or both ends and connected within the structure. For example, one or more circuits inserted from opposite ends of the tubular structure may be connected through an opening in the structure for the window. The structure may cover one or both ends to ensure that components remain fixed within the tubular structure and to provide interface components (eg, connectors, buttons or ports) to the device.

Contents of the invention

The present invention discloses an electronic device including an outer peripheral member forming a side of the electronic device. The outer peripheral member can define a volume within which electronic device components can be placed. To retain the components within the device, a front cover assembly and a rear cover assembly may be placed over the front and rear surfaces of the outer peripheral member.

Electronic device housings may include several components. In some embodiments, the housing may include several elements including angled segments. These elements are connected to form a closed component (eg, a loop) such that the component defines an internal volume capable of holding electronic device components. In some embodiments, internal structures, such as internal platforms, may be placed within the component to increase the structural integration of the component.

In some embodiments, an electronic device housing can include an outer peripheral member having an exterior surface, a front surface, a rear surface, and an interior surface. The inner platform can be attached to the inner surface and placed within the volume enclosed by the outer peripheral member (eg, between the front and rear surfaces of the outer peripheral member). The inner platform can define first and second pockets into which electronic device components can be inserted, for example from the front surface of the outer peripheral member or from the rear surface.

In some embodiments, an electronic device housing can include an outer peripheral member defined as a ring into which an inner platform can be placed. The inner platform may be offset from the front and rear surfaces of the outer peripheral member. To prevent components placed within the volume defined by the outer peripheral member from being removed from the housing, the housing may include a front cover assembly and a rear cover assembly. The cover assembly may be placed adjacent the front and rear surfaces of the outer perimeter member to cover the inner platform.

In some embodiments, an electronic device housing can be constructed by providing an outer peripheral member and an inner platform. The inner platform may be connected to the outer perimeter member such that at least a portion of the inner platform is within the height of the outer perimeter member. The electronic device components can be fitted into the electronic device housing from two opposing surfaces of the inner planar surface. In some embodiments, one or more cover assemblies may fit over two opposing surfaces of an interior planar or exterior peripheral member to accommodate electronic device components.

Description of drawings

The above and other features of the present invention, its natural characteristics and various advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic diagram of an exemplary electronic device that may be provided with mechanical and electronic features in accordance with one embodiment of the present invention;

2A is a cross-sectional view of an exemplary electronic device structure along the device width direction according to one embodiment of the present invention;

Figure 2B is an exploded cross-sectional view of an exemplary electronic device along the length of the device in accordance with one embodiment of the present invention;

Figure 2C is a top view of an exemplary electronic device according to one embodiment of the present invention;

Figure 2D is a bottom view of an exemplary electronic device according to one embodiment of the present invention;

Figure 3A is a schematic perspective view of an exemplary electronic device according to one embodiment of the present invention;

Figure 3B is an exploded view of the electronic device of Figure 3A according to one embodiment of the present invention;

3C is a cross-sectional view of the electronic device of FIG. 3A according to one embodiment of the present invention;

Figure 4A is a schematic diagram of an exemplary internal platform coupled to an external peripheral member according to one embodiment of the present invention;

Figure 4B is a top view of an exemplary internal platform coupled to an external peripheral member according to one embodiment of the present invention;

4C is a cross-sectional view of an exemplary internal platform assembled to an external peripheral member in accordance with one embodiment of the present invention;

5 is a cross-sectional view of an exemplary electronic device component according to one embodiment of the present invention;

Figure 6 is a cross-sectional view of an exemplary electronic device component according to one embodiment of the present invention;

7 is a flowchart of an exemplary process for assembling an electronic device according to one embodiment of the invention.

specific embodiment

Cross References to Related Applications

This application claims U.S. Provisional Patent Application No. 61/300,780 filed February 2, 2010, U.S. Provisional Patent Application No. 61/325,625 filed April 19, 2010, and Priority to US Provisional Patent Application No. 61/325,786, all of which are hereby incorporated by reference in their entirety.

Electronic devices may be provided with mechanical and electronic components for providing different functions to the user. In some cases, components of an electronic device may be configured to provide mechanical features that improve the performance, aesthetics, robustness, and size of the electronic device.

Electronic devices that may be provided with these components may include desktop computers, computer monitors, computer monitors including embedded computers, wireless computer cards, wireless adapters, televisions, set-top boxes, game consoles, routers, portable electronic devices such as laptop laptops and tablet computers), handheld devices such as cellular phones and media players, and small devices such as wristwatch devices, pendant devices, earphone and earpiece devices, and other wearable miniature devices. Portable devices such as cellular phones, media players, and other handheld electronic devices are sometimes described herein as examples.

FIG. 1 illustrates an exemplary electronic device provided with mechanical and electrical features to improve performance, aesthetics, robustness, and size. As shown in FIG. 1, device 10 may include storage and processing circuitry 12, which may include one or more different types of memory, such as hard drive storage, non-volatile memory (e.g., flash memory, or other electronically Programmable read only memory), volatile memory (eg, static or dynamic random access memory), or a combination of these. Storage and processing circuitry 12 may be used to control the operation of device 10 . The processing circuitry in circuitry 12 may be based on a processor, such as a microprocessor, microcontroller, digital signal processor, special purpose processor circuitry, power management circuitry, audio and video chips, and other suitable integrated circuits.

用于其它短程无线通信链路的协议比如

协议、用于处理蜂窝电话通信服务的协议或其它类似的通信协议。With a suitable configuration, storage and processing circuitry 12 may be used to run software on device 10, such as Internet browsing applications, Voice over Internet Protocol (VOIP) phone calling applications, e-mail applications, media playback applications, operating system functions, antenna and Wireless circuit control functions or a combination of these. Storage and processing circuitry 12 may be used to implement suitable communication protocols. Communication protocols that may be implemented using storage and processing circuitry 12 may include Internet protocols, wireless local area network protocols (such as the IEEE 802.11 protocol, sometimes referred to as

Protocols for other short-range wireless communication links such as

protocol, a protocol for handling cellular telephone communication services, or other similar communication protocols.

Input output devices 14 may be used to allow data to be provided to device 10 and to allow data to be provided from device 10 to external devices. Examples of input and output devices 14 that may be used in device 10 include: displays such as touch screens (e.g., liquid crystal displays or OLED displays), buttons, joysticks, click wheels, scroll wheels, trackpads, keypads, keyboards, microphones , speakers and other devices used to create sound, cameras, sensors, or a combination of these. The user can control the operation of device 10 by providing commands via device 14, or by providing commands via an accessory that communicates with device 10 via a wireless or wired communication link. Device 14 or an accessory that communicates with device 10 through a wireless or wired connection may be used to communicate visual or audible information to a user of device 10 . Device 10 may include connectors for forming data ports (eg, for attaching external devices such as computers, accessories, etc.).

Various components of the electronic device may be enclosed by housing 16 . The housing can protect the internal components and can help keep the internal components in their assembled position within the device 10 . Housing 16 may also help form part of the exterior peripheral look and feel of device 10 (eg, a decorative appearance). The housing can vary widely. For example, the housing may include various exterior components using various different materials. In one example, at least a portion of the housing can include a translucent/transparent portion through which internal components can optically communicate with the outside world.

According to one embodiment of the present invention, device 10 may include optical system 18 . Optical system 18 may, for example, include optical components that operate through a window or opening 22 in housing 16 . The optical component may, for example, correspond to one or more camera modules. Even though located inside housing 16 , camera module may be configured to capture image data outside device 10 via window 22 with a line of sight through window 22 . The optics can be positioned along an axis 24 that aligns with the window 22 to provide the best possible image capture. As an example, window 22 may be associated with a translucent or transparent portion of the housing. In one embodiment, device 10 may include one or more alignment features to ensure proper installation and operation of optical system 18 relative to housing 16 .

Housing components for electronic devices may provide various properties to the electronic device, such as structural properties, functional properties, decorative properties, or combinations of these. In some cases, a housing member may constitute an external component of an electronic device, thereby providing a mechanical structure for the device. The housing member can be provided in any suitable form. In some embodiments, the housing member may include an outer peripheral member. 2A is a cross-sectional view along the width of the device of an exemplary electronic device structure having external peripheral components according to one embodiment of the present invention. 2B is an exploded cross-sectional view of an exemplary electronic device with external peripheral components along the length of the device in accordance with one embodiment of the present invention. 2C is a top view of an exemplary electronic device with external peripheral components according to one embodiment of the present invention. 2D is a bottom view of an exemplary electronic device with external peripheral components according to one embodiment of the present invention. Electronic device 200 may comprise any suitable type of electronic device, including, for example, one or more of the types of electronic devices described above in connection with device 10 (FIG. 1).

The electronic device 200 may have any suitable shape, including, for example, a front surface 210, a rear surface 212, a left surface 214, a right surface 216, an upper surface 218, and a lower surface 219 (not shown in cross-section in FIGS. 2A and 2B ). Delimited shape. Each surface may be substantially planar, curved, or a combination thereof. The surface may include one or more bevels, detents, openings, dips, extensions, or other features that modify the smoothness of the surface.

Electronic device 200 may be constructed using any suitable structure, including, for example, using external peripheral members 220 . The outer peripheral member 220 may form a loop surrounding or wrapping some or all of the electronic device. The loop formed by the outer peripheral member 220 can define an inner volume 222 in which electronic device components can be placed. For example, the outer peripheral member 220 may wrap the device such that the outer surface of the outer peripheral member 220 defines some or all of the left surface 214, right surface 216, upper surface 218, and lower surface 219 of the device. In order to provide a user with desired functionality, an electronic device may include several components that are placed within the device (eg, within volume 222).

The outer peripheral member may have a particular height (eg, device height h) for defining volume 222 volume. More specifically, volume 222 or an independently measurable measure (eg, height, thickness, length, or width) of outer peripheral member 220 may be selected to provide at least the minimum amount of volume needed to accommodate and secure electronic device components. In some embodiments, other conditions may instead or additionally control the measurability of the outer peripheral member 220 . For example, the thickness (e.g., thickness t of the outer peripheral member), length (e.g., device length l), height (e.g., device height h), and profile of the outer peripheral member can be based on structural requirements (e.g., rigidity and resistance in a particular direction). Flexibility, compression resistance, tensile resistance, torsion resistance) to choose. As another example, the measurability of the outer peripheral member 220 may be selected based on the desired device size or shape, such as driven by industrial design considerations.

In some embodiments, the outer peripheral member may serve as a structural member upon which other electronic device components may be assembled. More specifically, it may be desirable to secure individual electronic device components placed within the device to ensure that the components do not move or break, which could adversely affect the functionality of the device. Outer peripheral member 220 may include any suitable feature of a securing device component. For example, an outer peripheral member may include one or more depressions, recesses, channels, protrusions or openings for receiving or engaging electronic device components. In some embodiments, the outer peripheral components may instead or additionally include features for holding internal structural equipment components capable of securing other components. For example, an internal structure such as an internal platform (described in more detail below) can be coupled to the internal surface of the outer peripheral member so that other electronic components can be mounted to the internal platform. In some embodiments, the outer peripheral member may include one or more openings to provide access to one or more internal components held within volume 222 .

Outer peripheral member 220 (or device 200) may have any suitable profile. For example, the outer peripheral member 220 may have a generally rectangular cross-section. In some embodiments, the outer peripheral member 220 may alternatively or additionally have a differently shaped cross-section including, for example, a circular, oval, polygonal, or curved cross-section. In some embodiments, the shape or size of the profile may vary along the length or width of the device (eg, an hourglass-shaped profile).

The outer peripheral member 220 may be constructed in any suitable manner. In some embodiments, outer peripheral member 220 may be constructed by joining together several different elements. For example, the outer peripheral member 220 may be constructed by joining together 3 different elements. The elements may be formed from any suitable material including, for example, metal. More specifically, elements may be included within one or more circuits (eg, as part of an antenna assembly or as a heart rate monitor). The individual elements may be formed in any suitable manner. In some embodiments, cold work may be used to form the elements. In some embodiments, the elements may alternatively or additionally be formed using a forging process, an annealing process, a machining process, or any other suitable process or combination of these processes. In some embodiments, various elements may be connected to each other or to other electronic device components using a braising process (eg, bonding ceramic material to a single component used as part of an antenna).

The various elements of the outer perimeter member may be connected together using any suitable means. In some embodiments, fasteners or adhesives may be used to connect the individual elements. In some embodiments, intermediate elements may alternatively or additionally be placed between adjacent individual elements to securely connect the individual elements together. For example, an intermediate element may be formed from a material capable of changing from a first state to a second state. In the first state, the material of the intermediate element can flow into the gap between adjacent individual elements. In the second state, the material may bond to adjacent individual elements and provide a structural bond between the individual elements such that the individual elements and intermediate elements form a complete component. For example, the intermediate element may be constructed from plastic material.

In some embodiments, individual elements may be formed from conductive materials, while intermediate elements may be formed from insulating or dielectric materials. This ensures that different circuits comprising individual components do not interfere with each other. Also, the dielectric material in the gap between individual components can help control capacitance, radio frequency energy, and other electrical transfers across the gap.

The use of intermediate elements to join the individual elements together may create artifacts or other imperfections along the interface between the individual elements and the intermediate elements. For example, excess material from an intermediate element may flow or overflow beyond the boundaries of the interface onto the outer surface of one of the separate elements. To ensure that the resulting part is aesthetically pleasing and meets industrial design requirements, the part may be machined to remove excess material from one or more of the individual and intermediate elements. For example, a single process or tool can be used to polish different elements. This single process may be applied in a single setup, for example including a setup corresponding to the softest material of the individual elements and intermediate elements used to form the part. In some cases, the process may instead or additionally dynamically adjust the manner in which the process is applied based on the component or material being processed. For example, the force, speed, or type of tool used may vary based on the element being processed. The resulting part may include a continuous surface bridging the interface between separate elements and intermediate elements. For example, the resulting part may include a smooth surface that bridges a seam between two elements.

Electronic device components may be placed within volume 222 using any suitable manner. For example, electronic device 200 may include components 230 and 232 inserted into volume 222 . Each of components 230 and 232 may comprise individual elements or several components assembled together as component layers or stacks, or several layers of components for insertion into volume 222 . In some embodiments, components 230 and 232 each represent several components stacked along the height of the device. The component layers can be electrically coupled to each other to enable data and power transfer, as required for proper operation of electronic device 200 . For example, PCB, flex, solder, SMT, wires, connectors, or a combination of these may be used to electrically couple the component layers. The component layers may be inserted into the outer peripheral member 220 using any suitable means. For example, both components 230 and 232 may be inserted from front surface 210 or from rear surface 212 (eg, back to front, front to back, or middle to front). Optionally, components may be inserted from both the front surface 210 and the rear surface 212 .

In some embodiments, one or more components may be used as structural elements. Alternatively, electronic device 200 may include different structural elements disposed within volume 222 and coupled to external peripheral member 220 . For example, electronic device 200 may include one or more internal components or platforms 240, which may serve as mounting points or areas to help secure, hold, or compress one or more component layers (e.g., attach component 230 to the interior rear surface of platform 240, attaching component 232 to the front surface of inner platform 240). Inner platform 240 may be coupled to outer peripheral member 220 using any suitable means, including, for example, using snaps, fasteners, flexures, welding, gluing, or combinations of these. Optionally, the inner platform 240 may even be part of the outer peripheral member (eg, machined, molded, cast, or integrally formed as a single unit). The inner platform may have any suitable dimensions, including, for example, dimensions that are smaller than the inner volume of the outer peripheral member 220 .

The inner platform 240 may be positioned at any suitable height within the outer peripheral member 220 , including, for example, at substantially half the height of the outer peripheral member 220 . The resulting structure (eg, outer peripheral member 220 and inner platform 240 ) can compose an H-shaped structure that provides sufficient rigidity and resistance to tension, compression, torsion, and bending.

The inner platform, the inner surface of the outer peripheral member, or both, may include one or more protrusions, recesses, shelves, recesses, channels, or other features for receiving and retaining electronic device components. In some cases, the inner platform, the outer peripheral member, or both, may include one or more openings for coupling components located in the front and rear regions of the inner platform 240 . The size of each region may be selected based on any suitable criteria, including, for example, the operational needs of the system, the number and type of electronic components in the device, manufacturing constraints of the internal platform, or a combination of these. The internal platform may be constructed as distinct components from any suitable material (eg, plastic, metal, or both), or alternatively be defined from existing electronic device components placed within the volume defined by the external peripheral components. For example, the internal platform may be formed by a printed circuit board or chip used by the device.

In some embodiments, internal platform 240 may include one or more conductive elements for providing electrical connections between components. For example, internal platform 240 may include one or more PCBs, flex wires, wires, solder plates, cables, connectors, or other conductive mechanisms for connecting components within the device.

The electronic device 200 may include a front cover assembly 250 and a rear cover assembly 260 defining front and rear surfaces of the device 200, respectively. The front and rear cover assemblies may include one or more components, or may include at least front and rear members that form some or all of the exterior front and rear surfaces of the device. The front cover assembly 250 and the rear cover assembly 260 may be flush, concave, or protruding with respect to the front and rear surfaces of the outer peripheral member 220 . In the example of FIGS. 2A and 2B , the front cover assembly 250 and the rear cover assembly 260 may overflow or protrude from the front and rear edges of the outer peripheral member 220 (e.g., such that the inner surface of the cover assembly is aligned with the front edge of the outer peripheral member 220). surface or rear surface flush).

Optionally, one or both of the cover assembly may be flush or sub-flush relative to the outer peripheral member, such as to prevent the edges from engaging other surfaces (e.g., at least a portion of the cover assembly may be contained within volume 222) . In some embodiments, one or both of the front cover assembly 150 and the rear cover assembly 160 may include one or more windows. Any suitable information or content may pass through this window. For example, the cover assembly can include a window through which a camera can capture an image. As another example, the cover assembly can include a window through which content provided by the display is available or through which light (eg, from a flashlight) can be provided.

In some embodiments, various components of an electronic device may be fabricated substantially from glass. For example, some portions of the housing of the electronic device may be at least 75% glass on the outside. In one implementation, one or both of the cover assemblies may include a glass element that provides a substantial portion of the cover assembly. More specifically, the front and rear surfaces of the device may include a large amount of glass, while the left, right, top, and bottom surfaces of the device may include a large amount of metal (eg, steel).

In some embodiments, the housing of a portable electronic device may strike or rub against various surfaces. When using plastic or softer metal housing surfaces, the surface may be prone to scratches. On the other hand, glass housing surfaces (eg, glass cover assembly) can be more scratch resistant. Also, glass housing surfaces may provide radio transparency, whereas metal housing surfaces may interfere or prevent wireless communications. In one embodiment, the electronic device housing may utilize glass housing components (eg, glass cover assemblies) on the front and rear surfaces of the electronic device housing. For example, the front surface formed by the glass housing member may be transparent to provide visual access to a display device located behind the glass housing member of the front surface, while the rear surface formed by the glass housing member may be transparent or opaque of. If desired, the opacity can hide any internal components within the housing of the electronic device. In one embodiment, a surface coating or film may be applied to the glass housing member to provide opacity or at least partial translucency. Such a surface coating or film may be provided on the inner or outer surface of the glass housing member.

Figure 3A is a schematic perspective view of an exemplary electronic device according to one embodiment of the present invention. Figure 3B is an exploded view of the electronic device of Figure 3A according to one embodiment of the present invention. 3C is a cross-sectional view of the electronic device of FIG. 3A according to one embodiment of the present invention. The electronic device of Figures 3A-3C may include some or all of the features of the electronic device of Figures 2A-2D. More specifically, parts with similar components may share some or all features. The outer peripheral member 320 may surround the periphery of the electronic device 300 to form part or all of the outermost, upper, and lower surfaces of the electronic device (e.g., front surface 310, rear surface 312, left surface 314, right surface 316, upper surface 318 and lower surface 319). Outer peripheral member 320 may have any suitable shape, for example comprising one or more elements that may be combined to form a ring. The annular shape of the outer peripheral member 320 may enclose a volume 322 in which electronic device components may be assembled and retained. The shape of external peripherals 320 may define the boundaries of volume 322 and thus can be determined based on the size and type of components placed within volume 322 . The boundaries of volume 322 (e.g., determined by the shape of outer peripheral member 320) may have any suitable shape, including, for example, substantially rectangular shapes (e.g., with straight or rounded edges or corners), circles, ellipses, polygons Or any other closed shape capable of defining a volume.

The outer peripheral member 320 can have any suitable dimensions, which can be determined based on any suitable criteria (eg, aesthetic or industrial design, structural considerations, component requirements for desired functionality, or product design). For example, the outer peripheral member 320 may have a length (e.g., along the axis 101) in the range of 70mm-150mm, such as 80mm-140mm, 90mm-130mm, 100mm-120mm, or 105mm-115mm, or any length within the range of 70mm-150mm. other subranges. As another example, outer peripheral member 320 may have a width (eg, along axis 102 ) in the range of 40mm-85mm, such as 50mm-75mm, 55mm-65mm, or any other subrange within the range of 40mm-85mm. As another example, outer peripheral member 320 may have a height (e.g., along axis 103) in the range of 4mm-15mm, such as 5mm-14mm, 6mm-13mm, 7mm-12mm, 8mm-11mm, 9mm-10mm, or between 4mm-15mm. Any other subrange within the range.

The outer peripheral member may have any suitable profile including, for example, a variable profile or a constant profile. In some embodiments, the cross-section of the ring can be selected based on the desired structural properties for the outer perimeter member. For example, the outer peripheral member 320 may be substantially rectangular in cross-section such that the height of the outer peripheral member is substantially greater than the width of the outer peripheral member. This can provide structural robustness in compression and tension as well as bending. In some embodiments, the outer peripheral member profile may be sized relative to the size of the inner platform profile. For example, the outer peripheral member height may be in the range of 5-15 times the height of the inner platform, such as 8-12 times, 9-11 times, or about 10 times the height of the inner platform. In one implementation, the height of the outer peripheral member may be about 9 mm and the height of the inner platform may be about 0.9 mm.

As another example, the width of the outer peripheral member may be in the range of 8-25 times the width of the inner platform, such as 12-20 times, 15-18 times, or about 16 times the width of the inner platform. For example, the outer peripheral member may have a width of 50 mm and the inner member may have a width of 3 mm. In some embodiments, the height of the inner platform may be related to the width of the outer perimeter member. For example, the width of the outer peripheral member may be 1-8 times the height of the inner platform, such as 2-6 times or about 4 times the height of the inner platform. In one implementation, the height of the inner platform may be about 0.7 mm and the width of the outer peripheral member may be about 2.5 mm. In some embodiments, the height of the outer perimeter member may be related to the width of the inner platform. For example, the width of the inner platform may be 3-10 times the height of the outer peripheral member, such as 4-8 times, 5-7 times, or about 6 times the height of the outer peripheral member. For example, the width of the inner platform may be about 5.5mm and the height of the outer peripheral member may be about 0.9mm.

In some embodiments, outer peripheral member 320 may include one or more openings, knobs, extensions, flanges, ramps, or other features for receiving components or elements of the device. Features of the outer perimeter member may extend from any surface of the outer perimeter member, including, for example, from an interior surface (eg, to hold an interior component or component layer), or from an exterior surface. More specifically, the outer peripheral member 320 may include a slot or opening 324 for receiving a card or tray within the device. Opening 324 may be aligned with one or more internal components for receiving and connecting an inserted component (eg, an inserted SIM card). As another example, the outer peripheral member 320 may include a connector opening 325 (eg, for a 30-pin connector) through which the connector may engage with one or more conductive pins of the electronic device 300 . Outer peripheral member 320 may include openings 326 and 327 for providing audio to a user (eg, an opening adjacent a speaker) or receiving audio from a user (eg, an opening adjacent a microphone). The outer peripheral member 320 can alternatively or additionally include an opening for an audio connector or power supply, such as opening 328 , or a feature 329 for holding and activating a button such as a volume control or mute switch.

The various features of outer peripheral member 320 may be configured in any suitable manner at any suitable time. In some embodiments, features may be configured as part of the process of creating outer peripheral member 320 from a single sheet of material that is fabricated into the final shape of outer peripheral member 320 (eg, using a machining process). In some embodiments, several pieces of material can alternatively or additionally be shaped individually or combined into outer peripheral member 320 . For example, several angled elements (e.g., two elements with segments having substantially 90-degree angles, and one element with two segments each having 90-degree angles) can be joined together to form a closed component (e.g. , loop). Various features can then be created as part of each individual piece, or once the entire exterior perimeter member has been assembled. The outer perimeter member 320 may be constructed of any suitable material including, for example, metal (eg, steel or aluminum), plastic (eg, polyurethane, polyethylene, or polycarbonate), composite material, or any combination thereof. In some embodiments, outer peripheral member 320 may be constructed from a combination of several materials.

In some embodiments, the outer perimeter member 320 may have a functional use or purpose in addition to serving as a decorative component or as a structural component. For example, the outer peripheral member 320 may be used as part of an antenna for capturing electromagnetic waves emitted by or within a communication network. In some cases, outer peripheral member 320 may serve as part of more than one antenna.

In some embodiments, one or more portions of the outer perimeter member 320 may be treated to provide an aesthetically pleasing component. More specifically, left surface 314, right surface 316, upper surface 318, and lower surface 319 may be treated using decorative surface treatments such as, for example, polishing, coatings (e.g., using dyes or colored materials, or materials that provide optical effects) , glazing, film deposition, grinding, superfinishing or any other suitable process. In some embodiments, the front and rear surfaces of the outer peripheral member 320 may instead or additionally be provided with a decorative treatment (eg, for areas of the outer peripheral member that may not be covered by the front and rear cover assemblies 350 and 360 ).

In order to reduce the overall weight, size, or both of electronic device 300, the thickness of outer peripheral member 320 may be selected such that outer peripheral member 320 resists only minimally one of bending, twisting, pulling, compressing, or other deformation of the strap. or more. For example, outer peripheral member 320 may be more resistant to tension and compression, but less resistant to bending or torsion. To provide sufficient resistance to all types of deformation, electronic device 300 may include structural components placed within volume 322 . In some embodiments, one or more internal components of an electronic device may be connected to an external peripheral member and used as a structural component. For example, a circuit board (with or without a separate rigid element) may be attached to opposing portions of the outer peripheral member 320 . Alternatively, different or dedicated structural components may be coupled to outer peripheral member 320 . In the example of FIGS. 3A-3C , electronic device 300 may include an internal platform 340 that makes up the various structural components of the electronic device. The inner platform 340 may comprise any suitable shape, including, for example, a substantially planar shape. In some embodiments, the inner platform 340 may include several distinct regions, such as a main region and step regions extending from the main region, for engaging one or more features of the outer peripheral member 320 . Internal platforms, such as internal platform 340, are described in greater detail in conjunction with FIGS. 4A-4B.

Figure 4A is a schematic illustration of an exemplary internal platform coupled to an external peripheral member according to one embodiment of the invention. Figure 4B is a top view of an exemplary internal platform coupled to an external peripheral member according to one embodiment of the present invention. Figure 4C is a cross-sectional view of an exemplary internal platform coupled to an external peripheral member according to one embodiment of the present invention. Device housing 400 may include an outer peripheral member 420 coupled with an inner platform 440 . The outer peripheral members and inner platform may include some or all of the features described above with respect to the devices of Figures 2A-2D and 3A-3C. More specifically, internal platform 440 may include some or all of the features described above in association with internal platform 340 .

Internal platform 440 may be constructed in any suitable manner. In some embodiments, internal platform 440 may be constructed from a single element or a combination of several elements. Internal platform 440 may be placed within the electronic device to support or hold electronic components. Internal platform 440 may include several different conductive plates (eg, metal plates), including base plate 441 , upper rung 442 and lower rung 444 . The plates and steps may be of any suitable size, for example including large plates to cover a majority of the area (eg 40%, 50%, 60%, 70%, 80%, 90%) enclosed by the outer perimeter member. Alternatively, the entire inner platform 440 may only cover a portion of the area (eg, 60%, 70%, 80%, 90% or more) surrounded by the outer peripheral member. The rung may be substantially smaller than the plate, for example including a portion that acts as a tab to ground the inner platform 440 .

Each plate and rung may be constructed of the same or different materials, including, for example, the same conductive material (eg, metal). In some embodiments, one or more rungs may be incorporated into the same sheet of material used to make up the panel. For example, rung 446 may comprise a raised area of plate 441 . Alternatively, the steps may be constructed from a sheet other than the board. For example, rung 442 may be constructed from a sheet material that is not used for plate 441 . Plate 441 and steps 442 and 444 may be placed in the same or different planes. In one implementation, base plate 441 may be placed on a first level, and steps 442 and 444 may be offset relative to base plate 441 (eg, raised toward the front surface of the device). Steps 442 and 444 may be elevated by any suitable amount, including, for example, substantially the same amount (eg, steps 442 and 444 are substantially in the same plane). For example, the steps 442 and 444 may be placed such that the front surface of the rung is flush or slightly sub-flush relative to the front surface of the outer peripheral member 420 to which it is attached. Discontinuities in the internal platform 440 for distinguishing the plate 441 and the steps 442 and 444 may be provided at any suitable location. For example, the discontinuity may be located as part of a raised surface, as a step or on a plate. In some embodiments, the distinction between a plate and a rung may be arbitrary since the rung and plate are constructed from a single piece of material.

Plate 441 and steps 442 and 444 may be at least partially electrically isolated to ensure that elements of the outer peripheral components remain electrically isolated (eg, to ensure antenna performance). For example, rung 442 may be connected to plate 441 , or to a raised portion of plate 441 using connection element 450 . Connection element 450 may be constructed from any suitable material, including for example a suitable insulating material (eg plastic injection molded between rung 442 and plate 441 ). As another example, the rung 444 may be incorporated as part of the sheet material used to make up the board 441 and can thus be electrically connected to the board. The rung 444 may include a connecting element 452 , such as a mirror image connecting element 450 , disposed on the front face of the rung. More specifically, the connection elements 450 and 452 may be placed at positions extending forward from the front surface of the outer peripheral member 420 . The connection elements 450 and 452 may be provided in any suitable manner, including, for example, through molding material (eg, plastic) between the plate and the rung, or on the surface of one or more of the plate and the rung. Connection elements 450 and 452 may have any suitable shape, including, for example, planar shapes or three-dimensional shapes (eg, including steps to connect plate 441 to one or more steps 442 and 444 in different planes). Elements 450 and 452 may form different elements, or alternatively may be different parts of a continuous element. In some embodiments, connection elements 450 and 452 may be connected to external peripheral components (eg, as shown in FIG. 4B ) in a manner that is electrically isolated from different portions of board 441 . Optionally, connecting elements 450 and 452 are provided in a manner that is electrically insulated from different sections of outer peripheral member 420 (eg, insulating elements 424 and 426, but only in the vicinity of step 444, as required for antenna performance).

The inner platform 440 may be coupled to the outer peripheral member 420 using any suitable manner. In some embodiments, portions of the plate 441 and rungs 442 and 444 may extend beyond the edges of the connecting elements 450 and 452 so that the internal platform may be coupled to external peripheral components (e.g., metal elements of the internal platform) via the plate and rungs. Can be coupled to metal external peripheral components for grounding or antenna performance). For example, the exposed metal surfaces of plate 441 and steps 442 and 444 may be coupled to outer peripheral member 420 using welding, soldering, or any other joining process that maintains electrical conductivity. Optionally, one or more hot melts, adhesives, tapes, fasteners, or other non-conductive connection processes may be used. When using a conductive process such as solder joints 460 (eg, laser solder joints), the solder joints may be distributed such that the outer peripheral component elements used to maintain electrical isolation remain insulated. More specifically, solder joints 460 along board 441 may be placed such that small L-shaped element 426 is electrically isolated from large L-shaped element 424 and U-shaped element 428 . Alternatively, if it is important for the small component 426 and the large component 424 to be electrically isolated only near the interface between the components, then the solder joints 460 may be distributed such that a conductive path exists through the plate 441 rather than through the steps 444 Between elements 424 and 426.

The inner platform 440 may be coupled to any suitable portion of the outer peripheral member 420 . For example, the inner platform 440 may fit within the height of the outer peripheral member 420 (eg, based on the location of contact points or areas of the outer peripheral member). The distribution of connection points may be selected based on structural considerations, including, for example, based on desired resistance to torsion, bending, or other mechanical forces. More specifically, the electronic device may include at least 4 contact points or regions distributed within the outer peripheral member 420 (eg, near corners of the outer peripheral member). As another example, the inner platform 440 may include a contact area along a linear portion of the outer peripheral member 420 (eg, along the edge of the plate 441 ). As another example, the step regions (e.g., steps 442 and 444) of the inner platform 440 may be coupled to or proximate to the front or rear surface of the outer peripheral member 420 (e.g., on opposite portions of the front or rear surface), such that the steps 442 and Portions of 444 (eg, connection elements 450 and 452 ) extend beyond the front surface of outer peripheral member 420 , whereas plate 441 does not. In some embodiments, the outer peripheral member 420 may include one or more tabs or extensions that support the inner platform 440 (eg, tabs to which the platform is brazed or welded). For example, the outer peripheral member 420 may include tabs 422 that support the inner platform 440 when the inner platform 440 is inserted into the outer peripheral member.

In some embodiments, the inner platform 440 can be placed within the height of the outer peripheral member 420 so that components can be placed on both the front and rear surfaces of the inner platform 440 . For example, some components can be inserted from the rear surface, while some components can be inserted from the front surface. Components may be coupled to the inner platform for safety and may alternatively or additionally be electrically connected to each other through openings in or around the periphery of the inner platform. In some embodiments, some components may first be coupled to the back cover assembly and Front cover assembly. In effect, the internal platform 440 may define by its location a front chamber or region or a rear chamber or region within the volume in which electronics components may be placed. The dimensions of each chamber or region may be determined based on any suitable criteria, including, for example, the number and size of components to be placed in each region, the required location of the internal platform 440 relative to the external peripheral components (e.g., if due to structural requirements, available location is limited), or a combination thereof. For example, the front chamber can be used for display circuitry and touch interface, while the back chamber can be used for processing circuitry, battery, connector interface, and input interface.

Components may be coupled to internal platform 440 for safety and can alternatively or additionally be electrically connected to each other through openings of internal platform 440 . Internal platform 440 may include any suitable features for securing and connecting electronic device components, such as one or more snaps, prongs, ramps, extensions, openings, access points, doors, or combinations thereof. In some cases, internal platform 440 may include one or more dedicated features for housing or securing specific electronic components, such as microphones, speakers, audio jacks, cameras, light sources, chips, or combinations thereof. Furthermore, internal platform 440 may include one or more electronic components, including, for example, connectors and conductive paths for electrically connecting to electronic device components, or transferring data or power, or both, between electronic device components.

Returning to FIGS. 3A-3C , to retain components within volume 332 , electronic device 300 may include rear cover assembly 360 and front cover assembly 350 that provide rear and front surfaces of the electronic device, respectively. Each cover assembly may be coupled to outer peripheral member 320 using any suitable means, including, for example, using adhesives, tape, mechanical fasteners, hooks, tabs, extensions, or combinations thereof. In some embodiments, one or both of cover assemblies 350 and 360 may be removable, such as for use or replacement of electronic device components (eg, batteries). In some embodiments, the front cover assembly 350 and the rear cover assembly 360 may include several distinct parts, for example including fixed parts and movable parts. The interior surfaces of the front cover assembly 350 and the rear cover assembly 360 may include any suitable features, including, for example, one or more ridges for retaining the covers or ensuring proper alignment of the covers on the outer peripheral member 320 , hooks, tabs, extensions, or combinations thereof. Features of the front cover assembly 350 and rear cover assembly 360 may interact with corresponding features of the outer peripheral member 320 or other components of the electronic device to ensure proper placement of the covers.

Rear cover assembly 360 and front cover assembly 350 may be positioned relative to outer perimeter member 330 in any suitable manner. 5 is a cross-sectional view of an exemplary electronic device component according to one embodiment of the present invention. Electronic device 500 may include outer peripheral member 520 having some or all of the features of outer peripheral member 220 ( FIGS. 2A-2D ). More specifically, outer peripheral member 520 may include one or more features (eg, component 530 ) for retaining internal components of the device. The front and rear surfaces of the electronic device 500 may be provided in part by the front cover assembly 550 and the rear cover assembly 560 , and in part by the exposed front and rear surfaces of the outer peripheral member 520 . More specifically, the front cover assembly 550 and the rear cover assembly 560 may be recessed within the outer peripheral member 520, for example, to protect components of the cover assembly from damage due to impact along the front or rear surfaces. Front cover assembly 550 and rear cover assembly 560 may include some or all of the features of rear cover assembly 260 and front cover assembly 250 ( FIGS. 2A-2D ).

Front cover assembly 550 and rear cover assembly 560 may be coupled to any suitable portion of outer peripheral member 520 . In some embodiments, the front cover assembly 550 and the rear cover assembly 560 may be connected with respect to the outer peripheral member 520 in the same or different manner. In the example of electronic device 500 , both front cover assembly 550 and rear cover assembly 560 may be recessed into the front and rear surfaces of outer peripheral member 520 , respectively. More specifically, the front cover assembly 550 may not cover the front surface 522 of the outer peripheral member 520 or cover only a portion of the front surface 522 such that both the outer peripheral member 520 and the front cover assembly 550 define the front surface of the electronic device 500 510. Similarly, the rear cover assembly 560 may not cover the rear surface 524 of the outer peripheral member 520 or cover only a portion of the rear surface 524 such that the rear cover assembly 560 defines part or all of the rear surface 512 of the electronic device 500 . The resulting height of the electronic device 500 can then be limited to the height of the outer peripheral member 520 (e.g., compare the embodiment described in connection with FIGS. the sum of the heights of the cover assembly 250).

In some embodiments (not shown), one or both of the front cover assembly 550 and the rear cover assembly 560 may partially cover the front surface 522 and the rear surface 524, respectively, such that the entirety of the cover assembly relative to the outer periphery Member 520 is not concave. In some cases, the cover plate assembly can include an inner lip such that the lip can extend into the volume enclosed by the outer peripheral member 520, and a raised portion of the assembly offset from the lip can extend to the front surface of the outer peripheral member or above the rear surface.

In some embodiments, one or both of the cover plate assemblies may instead be partially or fully recessed from the outer peripheral member. 6 is a cross-sectional view of an exemplary electronic device component according to one embodiment of the present invention. Electronic device 600 may include outer peripheral member 620 having some or all of the features of outer peripheral member 220 ( FIGS. 2A-2D ). More specifically, outer peripheral member 620 may include one or more features (eg, component 630 ) for retaining electronic components within the device. The front and rear surfaces of the electronic device 600 may be provided in part by a front cover assembly 650 and a rear cover assembly 660, which in turn may include the front cover assembly 250 and the rear cover Some or all of the features of the plate assembly 260 (FIGS. 2A-2D).

In contrast to electronic device 500 ( FIG. 5 ), one or both of front cover assembly 650 and rear cover assembly 660 may be placed within the periphery of outer peripheral member 630 (eg, recessed into the outer peripheral member). In the particular example of FIG. 6 , rear cover assembly 660 may be recessed from outer perimeter member 620 , and front cover assembly 650 may be placed over (eg, overflowing) the front surface of front cover assembly 620 . The rear cover assembly 660 may be sized such that some or all of the rear cover assembly may fit within the volume 621 defined by the outer peripheral assembly 620 . More specifically, the rear cover assembly 660 may be positioned such that the rear surface 622 of the outer peripheral assembly 620 remains exposed to the user. The rear cover assembly 660 may be recessed within the outer peripheral member 620 by any suitable amount. For example, the entirety of the rear cover assembly 660 may be recessed within the outer peripheral member 620 such that the rear surface of the rear cover assembly 660 may be flush with or behind the rear surface 622 of the outer peripheral member 620 . The resulting height of the electronic device 600 may then be the sum of the heights of the outer peripheral member 620 and the front cover assembly 650 (or only the height of the outer peripheral member if both cover assemblies are recessed, as shown in FIG. 5 ). Optionally, a portion of rear cover assembly 660 may extend behind rear surface 622 while still remaining within the perimeter defined by outer peripheral member 620 . In such cases, the amount by which rear cover assembly 660 extends behind rear surface 622 may be included in the overall height of device 600 .

Returning to electronic device 300 (FIGS. 3A-3C), front cover assembly 350 and rear cover assembly 360 may be constructed from any suitable material or combination of materials. In some embodiments, each of cover plate assemblies 350 and 360 may be constructed by combining several different elements. For example, one or both of the cover plate assemblies may comprise a transparent or translucent plate (eg, a rectangular plate of glass). As another example, one or both of the cover assemblies may include a base or support structure constructed of one or more metals or plastics (eg, aluminum) onto which the transparent element may fit. The transparent element may be mounted in any suitable manner, including, for example, such that one or more electronic device components are visible through the transparent element (eg, display circuitry or a flash for image capture). As another example, the transparent element may be provided to receive signals or detect the user's environment through the transparent element (eg, using a sensor or camera). Optionally, one or more portions of the transparent element may be rendered opaque (eg, using ink, or by placing a support structure behind the transparent element), so that the transparent element may serve primarily as a decorative component. The various components of each cover assembly may be assembled using any suitable means, including, for example, using one or more adhesives, fasteners, taping, interlocking, overmolding, or machining processes, or any combination.

In the example of FIGS. 3A-3C , the bezel assembly 350 may include a support structure 352 on which a glass plate 354 is mounted. Support structure 352 may include one or more openings, including an opening through which display 355 can be provided. In some embodiments, one or both of support structure 352 and glass plate 354 may include openings for device components, such as button openings 356 and receiver openings 357, as well as openings for a camera, flash, or other device sensor or input interface. Other openings. The size and shape of the opening may be selected in any suitable manner, including, for example, based on the size and shape of device components placed in or under the opening (e.g., opening 356 may be determined by the size of a button, while opening 357 may be determined by the size of a receiver). size and acoustical considerations for providing adequate audio to the user).

In some embodiments, the glass plate 354 may include a decorative finish for hiding the internal components of the electronic device from view. For example, the opaque layer may be an applied area 359 surrounding the display 355 for hiding the non-display portion of the display circuitry from view. Because one or more sensors may receive signals through the glass plate 354, the opaque layer may be selectively removed, or chosen to allow signals to pass through the glass plate to sensors behind the plate. For example, glass pane 354 may include regions 359a and 359b through which sensors (eg, cameras, infrared sensors, proximity sensors, or ambient light sensors) may receive signals.

In some embodiments, bezel assembly 350 may support or enable one or more interfaces through which a user may use an electronic device. For example, glass plate 354 may support a touch interface (eg, a touchpad or touchscreen) for controlling electronic device processes and operations. As another example, bezel assembly 350 may include one or more buttons or sensors (described above) for interacting with the device. In some cases, buttons, switches, or other interface elements may instead or additionally be incorporated into outer peripheral member 320 or rear bezel member 360 . Electronic device 300 may include any other suitable interface for interacting with a user, including, for example, display circuitry, a projector, audio output circuitry (e.g., speakers or audio ports), tactile interfaces (e.g., motors for creating vibrations, or providing power supply for electrical stimulation), or a combination thereof.

To enhance the decorative or aesthetic appeal of electronic device 300, one or all of outer peripheral member 320, front cover assembly 350, and rear cover assembly 360 may be polished using a suitable process. For example, one or more of polishing, coating (e.g., using a dye or colored material, or a material that provides an optical effect), glazing, thin film deposition, grinding, superfinishing, or any other suitable process may be applied to the electronic device component. kind. In some embodiments, one or more glass surfaces (e.g., of front cover assembly 350 or of back cover assembly 360) may be polished to provide an aesthetically pleasing appearance, such as using one or more masks ( mask), coating (e.g., a color photographic or dichroic coating), ink layer, or combinations thereof. The particular finish applied to the glass surfaces of front cover assembly 350 and rear cover assembly 360 may be selected such that front surface 310 and rear surface 312 have the same or different appearances. In some embodiments, the glass surface may be treated to resist abrasion or impact (eg, scratch resistance), oil from contact, or any other external force applied to the device.

7 is a flowchart of an exemplary process of assembling an electronic device according to one embodiment of the invention. Process 700 may begin at step 702 . At step 704, an outer peripheral member is provided. For example, housing parts configured in the shape of a loop may be provided. The outer peripheral member may be constructed in any suitable manner, including for example by connecting several different elements through the use of intermediate elements. The outer peripheral member may be constructed of any suitable material or combination of materials including, for example, conductive and insulating materials, where elements forming part of the electronic circuit are provided with conductive material. At step 706, an internal platform can be provided. For example, a component may be provided having at least one planar region, wherein the component is sized to fit at least partially within the volume enclosed by the outer peripheral member. An internal platform may be constructed from one or more elements, including, for example, by combining several elements. In some embodiments, different construction elements may be combined in such a way as to electrically insulate the conductive elements of the inner platform.

At step 708, the inner platform may be connected to the outer perimeter member. For example, the inner platform may be inserted into the volume defined by the outer peripheral member and retained by the outer peripheral member. Any suitable means may be used to secure the internal platform including, for example, press fit, mechanical fasteners, adhesives, forming processes (eg, using intermediate materials), welding, brazing, or combinations thereof. In some embodiments, the process used may be selected based on the conductive properties of the process. In some embodiments, the inner platform may be connected to the strap in a manner that increases the structural integration of the outer peripheral member (eg, increases resistance to certain types of external forces). The inner platform may divide the volume enclosed by the outer peripheral member into two regions or chambers, each of which is accessible from opposite sides or surfaces of the outer peripheral member (eg, from the front or rear of the outer peripheral member). At step 710, an electronic device component may be inserted into the volume enclosed by the outer peripheral member. For example, an assembly may be inserted from one or both of the surfaces of the outer peripheral member into one or both chambers defined by the inner platform. The components may be inserted individually and subsequently interconnected within the outer peripheral member, or may alternatively be at least partially connected outside the chamber and inserted into the outer peripheral member as a component assembly. Individual components or component assemblies may be connected to the internal platform or may be connected via the internal platform to components placed in other chambers.

At step 712, a cover assembly may be placed over the open surface of the outer perimeter member. For example, a front cover assembly can be placed on the front surface of the outer peripheral member and a rear cover assembly can be placed on the rear surface of the outer peripheral member. The cover assembly may be connected or coupled to the outer peripheral member using any suitable means, including, for example, using one or more hooks, recesses, protrusions, interlocks, mechanical fasteners, springs, or other retention features. The cover plate assembly can serve as the exterior surface of the device such that components inserted into the volume of the exterior peripheral member (eg, at step 710 ) can be retained and constrained within the device. In some embodiments, one or both of the front and rear cover assemblies may be aligned relative to the internal components of the device to ensure proper operation of the internal components. For example, the window of the cover assembly can be aligned with a sensor, light source or display of the device. Process 700 then ends at step 714 .

According to an embodiment, there is provided a method of constructing an electronic device, wherein two opposing surfaces of the inner platform and two opposing surfaces of the outer peripheral member are coplanar.

According to an embodiment, there is provided an electronic device housing wherein a front surface defines a single plane; at least one rung is connected to the front surface.

According to an embodiment, there is provided an electronic device housing wherein at least two regions have the same volume.

According to an embodiment, there is provided an electronic device housing wherein the ring defines a rectangle.

According to an embodiment, there is provided an electronic device housing component comprising: a first element having a segment at a first angle and including an inner surface and an outer surface; a second element having a segment at a second angle and including an inner surface and an outer surface surface; a third element having a third angled segment and a fourth angled segment and comprising an inner surface and an outer surface, wherein: said first element, said second element, and said third element are joined together to form a closure components; when the first component, the second component and the third component are connected together, the inner surfaces of the first component, the second component and the third component are the components forming a continuous inner surface; when the first element, the second element and the third element are connected together, the outer surfaces of the first element, the second element and the third element are The components form a continuous exterior surface; and the components define an interior volume within which electronic device components may be housed.

According to an embodiment, there is provided an electronic device housing component, wherein the first angle, the second angle, the third angle and the fourth angle are 90 degree angles.

According to an embodiment, an electronic device housing component is provided wherein a continuous interior surface of the component includes at least one feature for securing an electronic device component.

According to an embodiment, there is provided an electronic device housing component, wherein the at least one feature is configured to accommodate within an interior volume an internal platform coupled to the component.

The above-described embodiments are presented for purposes of illustration and not limitation. It will be appreciated that one or more features of an embodiment may be combined with one or more features of another embodiment to provide a system and/or method without departing from the spirit and scope of the invention.

Claims (25)

1. An electronic device housing, comprising: an outer peripheral member defining a ring and having a front surface and a rear surface; an inner platform disposed at least partially within the outer peripheral member and connected to at least two distinct regions of the outer peripheral member, the inner platform being offset from the front surface and the rear surface; a front cover assembly positioned adjacent the front surface and covering the interior platform; and A rear cover assembly is positioned adjacent to the rear surface and covers the inner platform. 2. The electronic device housing of claim 1, wherein the outer peripheral member and inner platform combine to provide rigidity to the device. 3. The electronic device housing of claim 1, wherein: The inner platform includes a main plate positioned completely within the height of the outer peripheral member. 4. The electronic device housing of claim 3, wherein: The inner platform includes at least one rung connected to the outer peripheral member, the at least one rung extending from the main board. 5. The electronic device housing of claim 4, wherein: the front surface defines a single plane; and The at least one rung is connected to the front surface. 6. The electronic device housing of claim 1, wherein: the inner platform separates a first region of the outer peripheral member from a second region of the outer peripheral member, wherein the first region is reached from the front surface and the second region is reached from the rear surface; as well as At least one electronic device component is positioned within each of the first and second regions. 7. The electronic device housing of claim 6, wherein said at least two regions have the same volume. 8. The electronic device housing of claim 1, wherein: The ring defines a rectangle. 9. The electronic device housing of claim 1, wherein: The outer peripheral component includes at least one of the following: ports for connectors; an opening for a removable card; and Holes to accommodate buttons. 10. A method of constructing an electronic device, comprising: providing an outer peripheral member defined as a loop and comprising two opposing surfaces; providing an interior platform comprising two opposing surfaces; connecting the inner platform to the outer peripheral member, wherein at least a portion of the inner platform is within the height of the outer peripheral member; mounting electronic components to each of the two opposing surfaces of the internal platform; and A cover plate assembly is coupled to each of the two opposing surfaces of the outer perimeter member. 11. The method of claim 10, wherein: The two opposing surfaces of the inner platform and the two opposing surfaces of the outer peripheral member are coplanar. 12. The method of claim 10, further comprising: A window is incorporated into one of the cover assemblies. 13. The method of claim 10, further comprising: The inner platform is connected to at least two distinct regions of the outer peripheral member to provide structural rigidity. 14. The method of claim 10, further comprising: forming a number of outer peripheral component elements; and The plurality of outer peripheral component elements are configured to form the loop. 15. The method of claim 14, further comprising: forming the outer peripheral component element from metal; and The outer peripheral component element is constructed using a molding process. 16. An electronic device housing component comprising: a first element having a first angled segment and including an inner surface and an outer surface; a second element having a length of a second angle and comprising an inner surface and an outer surface; A third element having a third angled segment and a fourth angled segment and including an inner surface and an outer surface, wherein: said first element, said second element and said third element are connected together to form a closed part; When the first element, the second element and the third element are connected together, the inner surfaces of the first element, the second element and the third element form a continuous inner surface of the part surface; When the first element, the second element and the third element are connected together, the outer surfaces of the first element, the second element and the third element form a continuous outer surface of the part surface; and The components define an interior volume in which electronic device components may be housed. 17. The electronic device housing component of claim 16, further comprising: a first intermediate element connecting the first element to the second element; a second intermediate element connecting the second element to the third element; and a third intermediate element connecting the third element to the first element. 18. The electronic device housing component of claim 16, wherein: The first angle, the second angle, the third angle and the fourth angle are 90 degree angles. 19. The electronic device housing component of claim 16, wherein: The continuous inner surface of the component includes at least one feature for securing an electronic device component. 20. The electronic device housing component of claim 19, wherein: The at least one feature is configured to accommodate within the interior volume an internal platform coupled to the component, wherein the internal platform increases structural integration of the component. 21. An electronic device housing comprising: an outer peripheral member comprising an outer side surface defining an exposed surface of the electronic device housing, a front planar surface, a rear planar surface, and an inner surface defining an inner surface of the electronic device housing; and an inner platform secured to the inner surface, wherein the inner platform is located at least partially between the front planar surface and the rear planar surface so as to be defined within the interior within a volume enclosed by the outer peripheral member a front chamber between the platform and the front planar surface, and a rear chamber between the inner platform and the rear planar surface. 22. The electronic device housing of claim 21, wherein: The inner platform further comprises a panel comprising at least two opposing edges, wherein the panel is adapted to be secured to the outer peripheral member on each of the at least two opposing edges, and wherein the panel is located on the front between the flat surface and the rear flat surface. 23. The electronic device housing of claim 21, wherein: the antechamber for housing a first set of electronic equipment components; and The rear compartment is used to accommodate a second set of electronic equipment components. 24. The electronic device housing of claim 23, wherein: the first set of electronics components to extend between the interior platform and the front planar surface; and The second set of electronics components is adapted to extend between the interior platform and the rear planar surface. 25. The electronic device housing of claim 21, wherein: said internal platform includes at least one guide step; and The at least one conductive step is for electrical connection to the outer peripheral member.

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