CN102136475A - Semiconductor package structure and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a semiconductor packaging structure and a manufacturing method thereof. The semiconductor packaging structure includes a substrate, a first capacitor, a first protective layer, a first metal layer and a second protective layer. The substrate has at least one through-hole structure. The first capacitor is located on a first surface of the substrate. The first protective layer covers the first capacitor. The first metal layer is located on the first protective layer and includes a first inductor. The second protective layer covers the first inductor. Thus, the first inductor, the first capacitor and the through-hole structure can be integrated into the semiconductor packaging structure to reduce the product size.

Description

Semiconductor package structure and manufacturing method thereof

technical field

The present invention relates to a semiconductor packaging structure and a manufacturing method thereof, in particular, to a semiconductor packaging structure integrating passive components and a manufacturing method thereof.

Background technique

Referring to FIG. 1 , a schematic cross-sectional view of a known semiconductor package structure is shown. The known semiconductor package structure 1 includes a substrate 11 , a package unit 12 and an encapsulant 13 . The packaging unit 12 includes several passive components (not shown). The packaging unit 12 is located on the substrate 11 and is electrically connected to the substrate 11 . The encapsulant 13 covers the packaging unit 12 .

The disadvantages of the known semiconductor package structure 1 are as follows. The passive components are first integrated into the packaging unit 12 through a semiconductor process, and then the packaging unit 12 is electrically connected to the substrate 11 by wire bonding or flip-chip (not shown in the figure), resulting in the The process of integrating these passive components into the semiconductor package structure 1 is complicated and increases the cost.

Therefore, it is necessary to provide a semiconductor package structure and its manufacturing method to solve the above problems.

Contents of the invention

The present invention provides a method for manufacturing a semiconductor package structure, which includes the following steps: (a) providing a substrate, the substrate including at least one groove and at least one conductive hole structure, the conductive hole structure is located in the groove; (b) forming a first capacitor on the substrate, the first capacitor includes a first lower electrode, a first dielectric layer and a first upper electrode, the first lower electrode is located on the substrate, the The first dielectric layer is located on the first lower electrode, the first upper electrode is located on the first dielectric layer; (c) forming a first protective layer to cover the first capacitor, the first protective layer Including several first openings, the first openings reveal the conductive hole structure, part of the first lower electrode and part of the first upper electrode; (d) forming a first metal layer on the first protective layer, the The first metal layer includes a first inductor, the first metal layer directly contacts the conductive hole structure, the first lower electrode and the first upper electrode; and (e) forming a second protection layer to cover the first an inductance.

Accordingly, the processes of the first inductor and the first capacitor can be simplified.

The present invention further provides a semiconductor packaging structure, which includes a base material, a first capacitor, a first protection layer, a first metal layer and a second protection layer. The substrate has a first surface, a second surface, at least one groove and at least one through-hole structure, the groove runs through the first surface and the second surface, and the through-hole structure is located in the groove , and exposed on the first surface and the second surface of the substrate. The first capacitor is located on the first surface of the base material, and includes a first lower electrode, a first dielectric layer and a first upper electrode, the first lower electrode is located on the first surface of the base material, and the first lower electrode is located on the first surface of the base material. A dielectric layer is located on the first lower electrode, and the first upper electrode is located on the first dielectric layer. The first protection layer covers the first capacitor, and the first protection layer includes a plurality of first openings, and the first openings expose the through hole structure, part of the first lower electrode and part of the first upper electrode. The first metal layer is located on the first protective layer and includes a first inductor. The first metal layer directly contacts the through hole structure, the first lower electrode and the first upper electrode. The second protection layer covers the first inductor.

Thereby, the first inductor, the first capacitor and the through-via structure can be integrated into the semiconductor package structure to reduce product size.

Description of drawings

1 shows a schematic cross-sectional view of a known semiconductor package structure;

2 to 21 are schematic diagrams showing a first embodiment of the manufacturing method of the semiconductor package structure of the present invention;

22 shows a schematic cross-sectional view of a second embodiment of the semiconductor packaging structure of the present invention;

23 shows a schematic cross-sectional view of a third embodiment of the semiconductor packaging structure of the present invention;

24 to 31 are schematic diagrams showing a second embodiment of the manufacturing method of the semiconductor package structure of the present invention; and

32 to 34 are schematic diagrams showing a third embodiment of the manufacturing method of the semiconductor package structure of the present invention.

Detailed ways

Referring to FIG. 2 to FIG. 21 , schematic diagrams of the first embodiment of the manufacturing method of the semiconductor package structure of the present invention are shown. Referring to FIG. 2 , a substrate 21 is provided. In this embodiment, the substrate 21 includes a first surface 211 , a lower surface 212 , at least one groove 213 and at least one conductive hole structure 217 . The groove 213 is opened on the first surface 211 of the substrate 21 . The conductive hole structure 217 is located in the groove 213 and exposed on the first surface 211 of the substrate 21 .

In this embodiment, the material of the substrate 21 is a non-insulating material, such as silicon or silicon oxide. The conductive hole structure 217 includes an outer insulating layer 2141 , a conductor 2142 and an inner insulating layer 2143 . The outer insulating layer 2141 is located on the sidewall of the groove 213 and defines a second central groove 2144. The conductor 2142 is located on the sidewall of the second central groove 2144 and defines a first central groove 2145. The inner insulating layer 2143 fills up the first central groove 2145. Since the material of the substrate 21 is a non-insulating material, the outer insulating layer 2141 is used to isolate the substrate 21 and the conductor 2142, so as to prevent the current passing through the conductive hole structure 217 from shunting to the substrate 21, thereby reducing the conductivity. The electrical effect of the hole structure 217.

However, in other applications, as shown in FIG. 3 , the conductive hole structure 217 may only include an outer insulating layer 2141 and a conductor 2142 without including the inner insulating layer 2143 ( FIG. 2 ), and the outer insulating layer 2141 is located at The sidewall of the groove 213 defines a second central groove 2144 , and the conductor 2142 fills up the second central groove 2144 . Furthermore, the material of the substrate 21 can be an insulating material, such as glass, and the conductive hole structure 217 may not include the outer insulating layer 2141 ( FIG. 2 ). Therefore, as shown in FIG. 4, the conduction hole structure 217 may only include a conductor 2142 and an inner insulating layer 2143, and the conductor 2142 is located on the sidewall and bottom of the trench 213 to define a first central trench 2145. The inner insulating layer 2143 fills up the first central groove 2145 . Alternatively, as shown in FIG. 5 , the conductive hole structure 217 only includes a conductor 2142 , and the conductor 2142 fills up the trench 213 . Referring to FIG. 6 , a first insulating layer 22 is formed on the substrate 21 . In this embodiment, the first insulating bottom layer 22 is located on the first surface 211 of the substrate 21 and has a first through hole 221 , and the first through hole 221 exposes the conductive hole structure 217 . However, in other applications, the first insulating bottom layer 22 may not be formed.

Then, form a first capacitor 23 (FIG. 10) on the substrate 21, the first capacitor 23 includes a first lower electrode 231, a first dielectric layer 232 and a first upper electrode 233, the first The lower electrode 231 is located on the substrate 21 , the first dielectric layer 232 is located on the first lower electrode 231 , and the first upper electrode 233 is located on the first dielectric layer 232 . In this embodiment, the first capacitor 23 is located on the first insulating bottom layer 22 . In this embodiment, the steps of forming the first capacitor 23 are as follows. Referring to FIG. 7 , firstly, a second metal layer 234 is formed (eg, sputtered) on the substrate 21 . The second metal layer 234 is made of aluminum copper (AlCu). Next, a third metal layer is formed (eg, sputtered) on the second metal layer 234 , and anodic oxidation is performed on the third metal layer to form a first oxide layer 235 . The material of the third metal layer is Tantalum (Tantalum, Ta), and the material of the first oxide layer 235 is Tantalum Pentoxide (Tantalum Pentoxide, Ta ₂ O ₅ ). Next, a fourth metal layer 236 is formed (eg, sputtered) on the first oxide layer 235 . The material of the fourth metal layer 236 is aluminum copper (AlCu). Finally, a first photoresist 237 is formed on the fourth metal layer 236 . Referring to FIG. 8, remove part of the first oxide layer 235 (FIG. 7) and part of the fourth metal layer 236 (FIG. 7) to form the first dielectric layer 232 and the first upper electrode 233 respectively, and move The first photoresist 237 (FIG. 7) is removed. Referring to FIG. 9 , a second photoresist 238 is formed on the second metal layer 234 and covers the first dielectric layer 232 and the first upper electrode 233 . Referring to FIG. 10 , part of the second metal layer 234 ( FIG. 9 ) is removed to form the first bottom electrode 231 , and the second photoresist 238 ( FIG. 9 ) is removed to form the first capacitor 23 . Referring to FIG. 11 , a first protective layer 24 is formed to cover the first capacitor 23 . The first protection layer 24 includes a plurality of first openings 241 , and the first openings 241 expose the conductive hole structure 217 , part of the first lower electrode 231 and part of the first upper electrode 233 .

Next, a first metal layer 25 ( FIG. 14 ) is formed on the first passivation layer 24 . The first metal layer 25 includes a first inductor 251. Preferably, the first metal layer 25 fills the first openings 241 to form a first interconnection metal 255, a second interconnection metal 256 and A third interconnection metal 257 . The first interconnection metal 255 directly contacts the conductive hole structure 217 , the second interconnection metal 256 directly contacts the first lower electrode 231 , and the third interconnection metal 257 directly contacts the first upper electrode 233 . In this embodiment, the steps of forming the first metal layer 25 are as follows. Referring to FIG. 12 , a first seed layer 252 is formed on the first passivation layer 24 . Referring to FIG. 13, a third photoresist 253 is formed on the first seed layer 252 to cover part of the first seed layer 252, and expose part of the first seed layer 252, and form a first electroplating layer 254 on the exposed portion of the first seed layer 252 . Referring to FIG. 14, remove the third photoresist 253 (FIG. 13) and the covered part of the first seed layer 252, the first plating layer 254 and part of the first seed layer 252 form the first metal Layer 25. Referring to FIG. 15 , a second protection layer 26 is formed to cover the first inductor 251 . The second protection layer 26 includes at least one second opening 261 , and the second opening 261 exposes a portion of the first metal layer 25 .

Next, at least one first bump 27 ( FIG. 18 ) is formed in the second opening 261 of the second protection layer 26 . In this embodiment, the steps of forming the first bump 27 are as follows. Referring to FIG. 16 , a second seed layer 271 is formed on the second passivation layer 26 . 17, first form a fourth photoresist 272 on the second seed layer 271 to cover part of the second seed layer 271, and expose part of the second seed layer 271, and then form a second electroplating Layer 273 is on the exposed portion of the second seed layer 271 . Referring to FIG. 18 , the fourth photoresist 272 ( FIG. 17 ) and the covered portion of the second seed layer 271 are removed to form the first bump 27 .

Referring to FIG. 19, the substrate 21 is set on a carrier 28, wherein the first surface 211 of the substrate 21 faces the carrier 28, and part of the substrate is removed from the lower surface 212 (FIG. 18) of the substrate 21. material 21 to form a second surface 215 , and expose the conductor 2142 of the conductive via structure 217 ( FIG. 18 ) on the second surface 215 to form a through via structure 214 . However, in other applications, more parts of the substrate 21 can be removed, so that the inner insulating layer 2143 of the conductive hole structure 217 ( FIG. 18 ) is also exposed on the second surface 215 to ensure that the conductor 2142 is exposed on the second surface 215. The second surface 215 .

Referring to FIG. 20 , at least one electrical component is formed on the second surface 215 of the substrate 21 . In this embodiment, the electrical component is a second bump 31 , and the manufacturing method of the second bump 31 is the same as the manufacturing method of the first bump 27 , so it will not be repeated here. Referring to FIG. 21 , the carrier 28 ( FIG. 20 ) is removed to form the first embodiment of the semiconductor package structure 2 of the present invention. However, the electrical component can be a second inductor 32 and a second capacitor 33, as shown in FIG. 22 . The manufacturing method of the second inductor 32 and the second capacitor 33 is the same as the manufacturing method of the first inductor 251 and the first capacitor 23, that is, the process carried out on the second surface 215 of the substrate 21 can be compared with that of the first capacitor 23. The process performed on the first surface 211 of the base material 21 is the same, so it will not be repeated here.

Thereby, the process of the first inductor 251 and the first capacitor 23 can be simplified, and the first inductor 251, the first capacitor 23 and the through-via structure 214 can be integrated into the semiconductor package structure 2 , to reduce the product size.

Referring to FIG. 21 again, it shows a schematic cross-sectional view of the first embodiment of the semiconductor package structure of the present invention. The semiconductor packaging structure 2 includes a substrate 21, a first insulating bottom layer 22, a second insulating bottom layer 34, a first capacitor 23, a first protective layer 24, a first metal layer 25, and a second protective layer 26. At least one first bump 27 and at least one electrical component.

The substrate 21 has a first surface 211 , a second surface 215 , at least one groove 213 and at least one through hole structure 214 . The groove 213 runs through the first surface 211 and the second surface 215 , and the through hole structure 214 is located in the groove 213 and exposed on the first surface 211 and the second surface 215 .

In this embodiment, the material of the substrate 21 is a non-insulating material, such as silicon or silicon oxide. The through via structure 214 includes an outer insulating layer 2141, a conductor 2142 and an inner insulating layer 2143. The outer insulating layer 2141 is located on the sidewall of the trench 213 to define a second central slot 2144. The conductor 2142 is located on the sidewall of the trench 213. The sidewall of the second central groove 2144 defines a first central groove 2145 , and the inner insulating layer 2143 fills up the first central groove 2145 . Since the material of the base material 21 is a non-insulating material, the outer insulating layer 2141 is used to isolate the base material 21 and the conductor 2142, so as to prevent the current passing through the via structure 214 from shunting to the base material 21, thereby reducing the The electrical effects of the TSV structure 214 .

However, in other applications, the through via structure 214 may only include an outer insulating layer 2141 and a conductor 2142 without including the inner insulating layer 2143, and the outer insulating layer 2141 is located on the sidewall of the trench 213, defining A second central slot 2144 is formed, and the conductor 2142 fills up the second central slot 2144 . Moreover, the material of the substrate 21 can be an insulating material, such as glass, and the through-via structure 214 may not include the outer insulating layer 2141. Therefore, the through-via structure 214 may only include a conductor 2142 and an inner layer. The insulating layer 2143, the conductor 2142 is located on the sidewall of the trench 213, defines a first central groove 2145, the inner insulating layer 2143 fills the first central groove 2145, or, the through via structure 214 only includes a The conductor 2142 fills up the trench 213 .

The first insulating bottom layer 22 is located on the first surface 211 of the substrate 21 and has a first through hole 221 exposing the through hole structure 214 . The second insulating bottom layer 34 is located on the second surface 215 of the substrate 21 and has a second through hole 341 exposing the through hole structure 214 . The first capacitor 23 is located on the first insulating bottom layer 22, and includes a first lower electrode 231, a first dielectric layer 232 and a first upper electrode 233, and the first lower electrode 231 is located on the first insulating bottom layer Above, the first dielectric layer 232 is located on the first lower electrode 231 , and the first upper electrode 233 is located on the first dielectric layer 232 . In this embodiment, the first lower electrode 231 and the first upper electrode 233 are made of aluminum copper (AlCu), and the first dielectric layer 232 is made of tantalum pentoxide (Tantalum Pentoxide, Ta ₂ O ₅ ). .

The first protection layer 24 covers the first capacitor 23 . In this embodiment, the first protection layer 24 includes a plurality of first openings 241 , and the first openings 241 expose the through hole structure 214 , part of the first lower electrode 231 and part of the first upper electrode 233 . The first metal layer 25 is located on the first protection layer 24 and includes a first inductor 251. Preferably, the first metal layer 25 located in the first openings 241 forms a first interconnection metal 255. , a second interconnection metal 256 and a third interconnection metal 257 . The first interconnection metal 255 directly contacts the through via structure 214 , the second interconnection metal 256 directly contacts the first lower electrode 231 , and the third interconnection metal 257 directly contacts the first upper electrode 233 . The second protection layer 26 covers the first inductor 251 . In this embodiment, the second protection layer 26 includes at least one second opening 261 , and the second opening 261 exposes a portion of the first metal layer 25 . The first bump 27 is located in the second opening 261 of the second protection layer 26 . The electrical component is located on the second surface 215 of the substrate 21 . The electrical component is a second bump 31 .

Accordingly, the first inductor 251 , the first capacitor 23 and the through-via structure 214 can be integrated into the semiconductor package structure 2 to reduce product size.

Referring to FIG. 22 , it shows a schematic cross-sectional view of the second embodiment of the semiconductor package structure of the present invention. The semiconductor package structure 3 of this embodiment is substantially the same as the semiconductor package structure 2 ( FIG. 21 ) of the first embodiment, wherein the same components are assigned the same numbers. The difference between this embodiment and the first embodiment is that, in this embodiment, the second surface 215 of the semiconductor package structure 3 includes several electrical components (such as a second inductor 32, a second capacitor 33 and a second bump 31).

Referring to FIG. 23 , it shows a schematic cross-sectional view of a third embodiment of the semiconductor package structure of the present invention. The semiconductor package structure 4 of this embodiment is substantially the same as the semiconductor package structure 2 ( FIG. 21 ) of the first embodiment, wherein the same components are assigned the same numbers. The difference between this embodiment and the first embodiment is that, in this embodiment, the semiconductor package structure 3 does not include the first insulating bottom layer 22 and the second insulating bottom layer 34, preferably, the first capacitor 23 is located The first surface 211 of the substrate 21 .

Referring to FIG. 24 to FIG. 31 , schematic diagrams of a second embodiment of the manufacturing method of the semiconductor package structure of the present invention are shown. Referring to FIG. 24, a substrate 21 is provided. In this embodiment, the substrate 21 has an upper surface 216 and a second surface 215, the groove 213 opens on the second surface 215 of the substrate 21, and the conductive hole structure 217 is exposed on the substrate 21. The second surface 215 of . Referring to FIG. 25 , a second insulating layer 34 is formed on the substrate 21 . In this embodiment, the second insulating bottom layer 34 is located on the second surface 215 of the substrate 21 and has a second through hole 341 , and the second through hole 341 exposes the conductive hole structure 217 . Next, at least one electrical component is formed on the second surface 215 of the substrate 21 , preferably on the second insulating bottom layer 34 . In this embodiment, the electrical component is a second bump 31 . Referring to FIG. 26, the substrate 21 is set on a carrier 28, wherein the second surface 215 of the substrate 21 faces the carrier 28, and part of the substrate is removed from the upper surface 216 (FIG. 25) of the substrate 21. material 21 to form a first surface 211 , and expose the conductive hole structure 217 ( FIG. 25 ) on the first surface 211 to form a through hole structure 217 .

Referring to FIG. 27, a first capacitor 23 is formed on the substrate 21. The first capacitor 23 includes a first lower electrode 231, a first dielectric layer 232 and a first upper electrode 233. The first lower electrode 231 is located on the substrate 21 , the first dielectric layer 232 is located on the first lower electrode 231 , and the first upper electrode 233 is located on the first dielectric layer 232 . In this embodiment, the first capacitor 23 is located on the first insulating bottom layer 22 . Referring to FIG. 28 , a first protective layer 24 is formed to cover the first capacitor 23 . The first passivation layer 24 includes a plurality of first openings 241 , and the first openings 241 expose a portion of the first upper electrode 233 . Referring to FIG. 29 , a first metal layer 25 is formed on the first passivation layer 24 . A first electroplating layer 254 and a first seed layer 252 form the first metal layer 25 . The first metal layer 25 includes a first inductor 251. Preferably, the first metal layer 25 fills the first openings 241 to form a first interconnection metal 255, a second interconnection metal 256 and A third interconnection metal 257 . The first interconnection metal 255 directly contacts the through via structure 214 , the second interconnection metal 256 directly contacts the first lower electrode 231 , and the third interconnection metal 257 directly contacts the first upper electrode 233 . Referring to FIG. 30 , a second protection layer 26 is formed to cover the first inductor 251 . The second protection layer 26 includes at least one second opening 261 , and the second opening 261 exposes a portion of the first metal layer 25 . Referring to FIG. 31 , at least one first bump 27 is formed in the second opening 261 of the second protection layer 26 , and a second plating layer 273 and a second seed layer 271 form the first bump 27 . Next, the carrier 28 is removed to form the first embodiment of the semiconductor package structure 2 of the present invention.

Referring to FIG. 32 to FIG. 34 , schematic diagrams of a third embodiment of the manufacturing method of the semiconductor package structure of the present invention are shown. The manufacturing method of the semiconductor package structure of this embodiment is substantially the same as the manufacturing method of the semiconductor package structure of the first embodiment ( FIGS. 2 to 21 ), wherein the same components are assigned the same numbers. This embodiment differs from the first embodiment in that, referring to FIG. 32 , when a substrate 21 is provided, the substrate 21 has a first surface 211, a second surface 215, at least one groove 213 and at least one conductive Hole structure, the groove 213 runs through the first surface 211 and the second surface 215, the conductive hole structure is located in the groove 213, and exposed on the first surface 211 and the second surface 215, to form a through Guide hole structure 214 . Next, referring to FIG. 33 , a first inductor 251 and a first capacitor 23 are formed on the first surface 211 of the substrate 21 . Referring to FIG. 34 , at least one electrical component is formed on the second surface 215 of the substrate 21 , and at the same time, the first embodiment of the semiconductor package structure of the present invention is formed. However, in other applications, the electrical component can also be formed on the second surface 215 of the substrate 21 first, and then the first inductor 251 and the first capacitor 23 are formed on the first surface 211 of the substrate 21 .

However, the above-mentioned embodiments are only to illustrate the principles and effects of the present invention, not to limit the present invention. Therefore, those skilled in the art can modify and change the above embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the claims.

Claims (22)

1. A method for manufacturing a semiconductor package structure, comprising: (a) providing a substrate, the substrate includes at least one groove and at least one conductive hole structure, and the conductive hole structure is located in the groove; (b) forming a first capacitor on the substrate, the first capacitor includes a first lower electrode, a first dielectric layer and a first upper electrode, the first lower electrode is located on the substrate, the a first dielectric layer is located on the first lower electrode, and the first upper electrode is located on the first dielectric layer; (c) forming a first protective layer to cover the first capacitor, the first protective layer includes a plurality of first openings, and the first openings reveal the conductive hole structure, part of the first lower electrode and part of the first upper electrode; (d) forming a first metal layer on the first protective layer, the first metal layer includes a first inductor, and directly contacts the conductive hole structure, the first lower electrode and the first upper electrode; and (e) forming a second protection layer to cover the first inductor. 2. The method according to claim 1, wherein in the step (a), the substrate has a first surface and a second surface, the groove runs through the first surface and the second surface of the substrate, and the conductive The hole structure is exposed on the first surface and the second surface of the substrate to form a through hole structure. In the step (b), the first capacitor is located on the first surface of the substrate. 3. The method according to claim 1, wherein in the step (a), the substrate has a first surface and a lower surface, the groove is opened on the first surface of the substrate, and the conductive hole structure is exposed on the substrate. The first surface of the substrate, in the step (b), the first capacitor is located on the first surface of the substrate. 4. The method of claim 3, wherein after the step (e), further comprising: (f) disposing the substrate on a carrier, wherein the first surface of the substrate faces the carrier; (g) removing part of the substrate from the lower surface of the substrate to form a second surface, and exposing the conductive hole structure on the second surface to form a through hole structure; (h) forming at least one electrical component on the second surface of the substrate; and (i) Remove the carrier. 5. The method according to claim 1, wherein in the step (a), the substrate has an upper surface and a second surface, the groove is opened on the second surface of the substrate, and the conductive hole structure is exposed on the second surface of the substrate. 6. The method of claim 5, wherein after the step (a), further comprising: (a1) forming at least one electrical component on the second surface of the substrate; (a2) disposing the substrate on a carrier, wherein the second surface of the substrate faces the carrier; and (a3) removing part of the substrate from the upper surface of the substrate to form a first surface, and exposing the conductive hole structure on the first surface to form a through hole structure. 7. The method of claim 6, wherein in the step (b), the first capacitor is located on the first surface of the substrate. 8. The method of claim 6, further comprising a step of removing the carrier after the step (e). 9. The method of claim 1, wherein the step (b) comprises: (b1) forming a second metal layer on the substrate; (b2) forming a third metal layer on the second metal layer, and anodizing the third metal layer to form a first oxide layer; (b3) forming a fourth metal layer on the first oxide layer; (b4) forming a first photoresist on the fourth metal layer; (b5) removing part of the first oxide layer and part of the fourth metal layer to form the first dielectric layer and the first upper electrode respectively; (b6) removing the first photoresist; (b7) forming a second photoresist on the second metal layer and covering the first dielectric layer and the first upper electrode; (b8) removing part of the second metal layer to form the first bottom electrode; and (b9) removing the second photoresist. 10. The method of claim 1, wherein the step (d) comprises: (d1) forming a first seed layer on the first protection layer; (d2) forming a third photoresist on the first seed layer to cover part of the first seed layer and expose part of the first seed layer; (d3) forming a first electroplating layer on the exposed portion of the first seed layer; and (d4) removing the third photoresist and the covered part of the first seed layer, the first electroplating layer and part of the first seed layer forming the first metal layer. 11. A semiconductor packaging structure, comprising: A substrate having a first surface, a second surface, at least one groove and at least one through-hole structure, the groove runs through the first surface and the second surface, and the through-hole structure is located in the groove within, and exposed on the first surface and the second surface of the substrate; A first capacitor is located on the first surface of the base material, and includes a first lower electrode, a first dielectric layer and a first upper electrode, the first lower electrode is located on the first surface of the base material, the a first dielectric layer is located on the first lower electrode, and the first upper electrode is located on the first dielectric layer; A first protective layer covering the first capacitor, the first protective layer includes a plurality of first openings, and the first openings expose the through hole structure, part of the first lower electrode and part of the first upper electrode ; a first metal layer, located on the first protective layer, and including a first inductor, the first metal layer directly contacts the through-via structure, the first lower electrode, and the first upper electrode; and A second protection layer covers the first inductor. 12. The package structure according to claim 11, wherein the material of the substrate is glass, silicon or silicon oxide. 13. The package structure of claim 11, wherein the through via structure comprises a conductor, and the conductor fills up the trench. 14. The packaging structure according to claim 11, wherein the through via structure comprises a conductor and an inner insulating layer, the conductor is located on the sidewall of the trench, defines a first central groove, and the inner insulating layer fills up the First center slot. 15. The packaging structure according to claim 11, wherein the TSV structure comprises an outer insulating layer and a conductor, the outer insulating layer is located on the sidewall of the trench, defines a second central slot, and the conductor fills the Second center slot. 16. The package structure according to claim 11, wherein the through via structure comprises an outer insulating layer, a conductor and an inner insulating layer, the outer insulating layer is located on the sidewall of the trench to define a second central slot, The conductor is located on the sidewall of the second central groove, defines a first central groove, and the inner insulating layer fills up the first central groove. 17. The package structure of claim 11, wherein the first bottom electrode directly contacts the first surface of the substrate. 18. The packaging structure according to claim 11, further comprising a first insulating bottom layer located on the first surface of the substrate and having a first through hole, the first through hole reveals the conductive hole structure, the first capacitor is located on the first surface of the substrate On the first insulating bottom layer, the first lower electrode is located on the first insulating bottom layer. 19. The package structure of claim 11, wherein the first metal layer further comprises a first interconnection metal, a second interconnection metal and a third interconnection metal, the first interconnection metal directly contacts the via hole structure, the second interconnection metal directly contacts the first lower electrode, and the third interconnection metal directly contacts the first upper electrode. 20. The package structure of claim 11, wherein the second passivation layer comprises at least one second opening exposing a portion of the first metal layer. 21. The package structure of claim 20, further comprising at least one first bump located in the second opening of the second passivation layer. 22. The package structure of claim 11, further comprising at least one electrical component located on the second surface of the substrate, wherein the electrical component is a second inductor, a second capacitor or a second bump.

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