CN102115885B - Oil-free self-lubricating plating technique of aluminum alloy parts - Google Patents
Oil-free self-lubricating plating technique of aluminum alloy parts Download PDFInfo
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- CN102115885B CN102115885B CN2009102475803A CN200910247580A CN102115885B CN 102115885 B CN102115885 B CN 102115885B CN 2009102475803 A CN2009102475803 A CN 2009102475803A CN 200910247580 A CN200910247580 A CN 200910247580A CN 102115885 B CN102115885 B CN 102115885B
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- 238000007747 plating Methods 0.000 title claims abstract description 50
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 14
- 239000008139 complexing agent Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 150000002815 nickel Chemical class 0.000 claims abstract description 9
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 7
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005238 degreasing Methods 0.000 claims abstract description 4
- 238000004321 preservation Methods 0.000 claims abstract description 4
- 239000001488 sodium phosphate Substances 0.000 claims abstract description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910001868 water Inorganic materials 0.000 claims abstract description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical group [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- 239000011734 sodium Substances 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 6
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- 239000000872 buffer Substances 0.000 claims description 5
- 239000013543 active substance Substances 0.000 claims description 4
- 239000001509 sodium citrate Substances 0.000 claims description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical group NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 4
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical group [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 4
- 229940038773 trisodium citrate Drugs 0.000 claims description 4
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical group [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 3
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 3
- 235000019260 propionic acid Nutrition 0.000 claims description 3
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical group O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- 239000011775 sodium fluoride Substances 0.000 claims description 2
- 235000013024 sodium fluoride Nutrition 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 claims 2
- 239000003153 chemical reaction reagent Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 235000019353 potassium silicate Nutrition 0.000 claims 2
- 238000002203 pretreatment Methods 0.000 claims 2
- 230000002829 reductive effect Effects 0.000 claims 2
- 235000017550 sodium carbonate Nutrition 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000005461 lubrication Methods 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 229910000162 sodium phosphate Inorganic materials 0.000 claims 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000001035 drying Methods 0.000 abstract description 6
- 239000004115 Sodium Silicate Substances 0.000 abstract description 5
- 239000006172 buffering agent Substances 0.000 abstract description 5
- 229910052911 sodium silicate Inorganic materials 0.000 abstract description 5
- 239000003381 stabilizer Substances 0.000 abstract description 5
- 239000004094 surface-active agent Substances 0.000 abstract description 5
- 229910000365 copper sulfate Inorganic materials 0.000 abstract description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 abstract description 3
- 235000019801 trisodium phosphate Nutrition 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 4
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 4
- 229910001453 nickel ion Inorganic materials 0.000 description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- PHJJWPXKTFKKPD-UHFFFAOYSA-N [Ni+3].[O-]P([O-])[O-] Chemical compound [Ni+3].[O-]P([O-])[O-] PHJJWPXKTFKKPD-UHFFFAOYSA-N 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052961 molybdenite Inorganic materials 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000009958 sewing Methods 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- 239000004471 Glycine Substances 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Abstract
一种对铝合金零件进行无油自润滑镀层处理的工艺,包括镀前工件预处理、镀铜中间处理、自润滑耐磨镀层处理和镀后热处理,其特征在于:所述的镀前工件预处理,是将工件在由磷酸三钠、碳酸钠、硅酸钠和水配成的除油液中进行除油处理,所述的镀铜中间处理,是将工件在硫酸铜溶液中进行镀铜处理;所述的自润滑耐磨镀层处理,是将经工件,在包括镍盐、还原剂、络合剂、缓冲剂、稳定剂、减摩相材料MoS2、加速剂和表面活性剂等组成的化学复合液中进行沉积型涂覆处理;所述的镀后热处理,是指将镀后工件在干燥箱进行180℃温度下的6小时保温干燥处理。
A process for oil-free self-lubricating coating treatment of aluminum alloy parts, including pre-plating workpiece pretreatment, copper plating intermediate treatment, self-lubricating wear-resistant coating treatment and post-plating heat treatment, characterized in that: the pre-plating workpiece pretreatment The treatment is to degrease the workpiece in a degreasing solution composed of trisodium phosphate, sodium carbonate, sodium silicate and water. The copper plating intermediate treatment is to perform copper plating on the workpiece in a copper sulfate solution. treatment; the self-lubricating wear-resistant coating treatment is to pass the workpiece, in the composition including nickel salt, reducing agent, complexing agent, buffering agent, stabilizer, friction-reducing phase material MoS 2 , accelerator and surfactant, etc. The deposition-type coating treatment is carried out in the chemical composite solution; the post-plating heat treatment refers to the 6-hour heat preservation and drying treatment of the plated workpiece in a drying oven at a temperature of 180 ° C.
Description
技术领域 technical field
本发明涉及一种表层涂镀技术,尤其是一种对铝合金零件进行无油自润滑镀层处理的工艺 The invention relates to a surface coating technology, especially a process for oil-free self-lubricating coating treatment of aluminum alloy parts
背景技术 Background technique
铝制零件的可靠性及使用寿命受到磨损率的显著影响,譬如缝纫机中的一些铝合金零件:针杆及其针杆套两者处于长期、比较高速的摩擦运动中,由于材料本性决定连着的耐磨性具有一定的局限性。鉴于通过已有技术,可以采用对铝制零件进行表面处理或表面镀覆层,以此来提高表面区域的耐磨性对减少摩擦系统表面的磨损是特别有效的。 The reliability and service life of aluminum parts are significantly affected by the wear rate. For example, some aluminum alloy parts in sewing machines: the needle bar and the needle bar sleeve are in long-term, relatively high-speed frictional motion, and the nature of the material determines the connection. The wear resistance has certain limitations. In view of the existing technology, surface treatment or surface coating of aluminum parts can be used to improve the wear resistance of the surface area, which is particularly effective in reducing the wear of the friction system surface. the
目前,大多都是通过化学镀来实现表面镀层的。但是化学镀所用的溶液稳定性较差,且溶液的维护、调整和再生都比较麻烦,材料成本费较高。 At present, most of the surface coatings are realized by electroless plating. However, the stability of the solution used in electroless plating is poor, and the maintenance, adjustment and regeneration of the solution are troublesome, and the material cost is relatively high. the
发明内容 Contents of the invention
本发明的目的:旨在提出一种在进行相对摩擦运动的铝合金零件表面涂覆耐磨涂层的技术,并希望两者可在自润滑状态下实现较长时间的工作状态。 The purpose of the present invention is to propose a technology for coating wear-resistant coatings on the surface of aluminum alloy parts undergoing relative frictional motion, and it is hoped that both of them can achieve a long-term working state under self-lubricating state. the
这种对铝合金零件进行无油自润滑镀层处理的工艺,包括镀前工件预处理、镀铜中间处理、自润滑耐磨镀层处理和镀后热处理,其特征在于: This oil-free self-lubricating coating treatment process for aluminum alloy parts includes pre-plating workpiece pretreatment, copper-plating intermediate treatment, self-lubricating wear-resistant coating treatment and post-plating heat treatment, and is characterized in that:
A、所述的镀前工件预处理,是将工件在由磷酸三钠、碳酸钠、硅酸钠和水配成的除油液中进行除油处理,其中Na3PO4:30g/L;碳酸钠Na2CO3:25g/L;硅酸钠Na2SiO3:8g/L,处理温度:70~75℃,时间:2~ 5min; A, the workpiece pretreatment before plating is that the workpiece is degreased in a degreasing solution made of trisodium phosphate, sodium carbonate, sodium silicate and water, wherein Na 3 PO 4 : 30g/L; Sodium carbonate Na 2 CO 3 : 25g/L; Sodium silicate Na 2 SiO 3 : 8g/L, treatment temperature: 70~75℃, time: 2~5min;
B、所述的镀铜中间处理,是将经A工序处理的工件在0.9~1.0mol/L的H2SO4、0.75~0.85mol/L的CuSO4·5H2O配制的硫酸铜溶液中进行镀铜处理,工艺条件为:氧化温度20~25℃,电流密度1.0~2.5A/dm2,氧化时间30min,用纯铜作电极; B. The copper plating intermediate treatment is to place the workpiece treated in the A process in a copper sulfate solution prepared by 0.9-1.0mol/L H 2 SO 4 and 0.75-0.85mol/L CuSO 4 ·5H 2 O Copper plating treatment, the process conditions are: oxidation temperature 20 ~ 25 ℃, current density 1.0 ~ 2.5A/dm 2 , oxidation time 30min, use pure copper as the electrode;
C、所述的自润滑耐磨镀层处理,是将经B工序处理的工件,在包括镍盐、还原剂、络合剂、缓冲剂、稳定剂、减摩相材料MoS2、加速剂和表面活性剂等组成的化学复合液中进行沉积型涂覆处理;其中镍盐控制在40~50g/L,还原剂次亚磷酸钠控制在9~11g/L,络合剂柠檬酸三钠控制在90~110g/L,缓冲剂氯化铵控制在40~60g/L,减摩相材料MoS2控制在1.5~3g/L,所述的表面活性剂为十六烷基三甲基溴化铵或吐温-60,加入的控制量各为6-7mg/L或者0.40-0.5g/L;进行沉积涂镀时的溶液温度控制在90~95℃,溶液PH值控制在8.5~10; C. The self-lubricating wear-resistant coating treatment is to process the workpiece through the B process, including nickel salt, reducing agent, complexing agent, buffering agent, stabilizer, friction-reducing phase material MoS 2 , accelerator and surface Deposition-type coating treatment is carried out in a chemical compound solution composed of active agents, among which nickel salt is controlled at 40-50g/L, reducing agent sodium hypophosphite is controlled at 9-11g/L, and complexing agent trisodium citrate is controlled at 90-110g/L, the buffer ammonium chloride is controlled at 40-60g/L, the friction-reducing phase material MoS2 is controlled at 1.5-3g/L, and the surfactant is cetyltrimethylammonium bromide Or Tween-60, the control amount added is 6-7mg/L or 0.40-0.5g/L; the solution temperature during deposition and coating is controlled at 90-95°C, and the pH value of the solution is controlled at 8.5-10;
D、所述的镀后热处理,是指将镀后工件在干燥箱进行180℃温度下的6小时保温干燥处理。 D. The post-plating heat treatment refers to that the post-plating workpiece is subjected to heat preservation and drying treatment at a temperature of 180° C. for 6 hours in a drying oven. the
根据以上技术方案提出的这种对铝合金零件进行无油自润滑镀层处理的工艺,其经处理后的铝合金工件,不仅使铝基体的硬度值达到Ni-PHV0.025151-206 HV0.0251002;Ni-P-MoS2 HV0.025297-441 HV0.0251072。 According to the above technical scheme, the oil-free self-lubricating coating treatment process for aluminum alloy parts, the treated aluminum alloy workpiece not only makes the hardness value of the aluminum substrate reach Ni-PHV 0.025 151-206 HV 0.025 1002; Ni-P-MoS 2 HV 0.025 297-441 HV 0.025 1072.
附图说明 Description of drawings
图1实施本发明Ni-P涂层后的工件电子图像; Fig. 1 implements the electronic image of workpiece after Ni-P coating of the present invention;
图2为图1中谱图1处的成份分析图表示意图;
Fig. 2 is the schematic diagram of the component analysis chart at
图3为图1中谱图2处的成份分析图表示意图;
Fig. 3 is the schematic diagram of the component analysis chart at
图4为图1中谱图3处的成份分析图表示意图;
Fig. 4 is the schematic diagram of the component analysis chart at
图5为实施本发明Ni-P-MoS2涂层后的工件电子图像; Fig. 5 implements the Ni-P-MoS of the present invention 2 workpiece electron image after coating;
图6为图5中谱图1处的成份分析图表示意图;
Fig. 6 is the schematic diagram of the component analysis chart at
图7为图5中谱图2处的成份分析图表示意图;
Fig. 7 is the schematic diagram of the component analysis chart at
图8~11经Ni-P、Ni-P-MoS2涂层处理、干燥后的涂层结合力测试曲线图。 Figures 8 to 11 are the test curves of coating adhesion after Ni-P, Ni-P-MoS 2 coating treatment and drying.
具体实施方式 Detailed ways
以下给出本发明的实施例,并结合实施例进一步阐述本发明。 Embodiments of the present invention are given below, and the present invention is further described in conjunction with the embodiments. the
本发明提出的这种对铝合金零件进行无油自润滑镀层处理的工艺,利用表面沉积改性技术,使铝合金工件,特别使缝纫机中的铝合金针杆及其针杆套构件,不仅具有理想的表面硬度,而且也可使针杆和针杆套保持长时间自润滑工作状态。 The process of carrying out oil-free self-lubricating coating treatment on aluminum alloy parts proposed by the present invention uses surface deposition modification technology to make aluminum alloy workpieces, especially aluminum alloy needle bars and needle bar cover components in sewing machines, not only have Ideal surface hardness, but also can keep the needle bar and needle bar sleeve in self-lubricating working condition for a long time. the
这种对铝合金零件进行无油自润滑镀层处理的工艺,包括镀前工件预处理、镀铜中间处理、自润滑耐磨镀层处理和镀后热处理诸工序。其中 This process of oil-free self-lubricating coating treatment on aluminum alloy parts includes pre-plating workpiece pretreatment, copper-plating intermediate treatment, self-lubricating wear-resistant coating treatment and post-plating heat treatment. in
A、所述的镀前工件预处理,是将工件在由磷酸三钠、碳酸钠、硅酸钠和水配成的除油液中进行除油处理,其中Na3PO4:30g/L;碳酸钠Na2CO3:25g/L;硅酸钠Na2SiO3:8g/L,处理温度:70~75℃,时间:2~5min; A, the workpiece pretreatment before plating is that the workpiece is degreased in a degreasing solution made of trisodium phosphate, sodium carbonate, sodium silicate and water, wherein Na 3 PO 4 : 30g/L; Sodium carbonate Na 2 CO 3 : 25g/L; Sodium silicate Na 2 SiO 3 : 8g/L, treatment temperature: 70~75℃, time: 2~5min;
预处理后,采用HNO3(d=1.42g/cm3):352mL/L进行出光工艺处理,处理在室温条件下进行;时间:1~3min。 After pretreatment, use HNO 3 (d=1.42g/cm 3 ): 352mL/L to carry out light-emitting process treatment, and the treatment is carried out at room temperature; time: 1-3min.
B、所述的镀铜中间处理,是将经A工序处理的工件在0.9~1.0mol/L的H2SO4;0.75~0.85mol/L的CuSO4·5H2O配制的硫酸铜溶液中进行镀铜的阳极氧化工艺处理,工艺条件为:基氧化温度20~25℃,电流密度1.0~2.5A/dm2,氧化时间30min,用纯铜作电极;采用电镀铜液处理时所用溶液 与阳极氧化处理所用溶液相同,电镀铜的电流密度为0.2~1.0A/dm2,镀铜时间为40min。 B. The copper plating intermediate treatment is to put the workpiece processed by the A process in the copper sulfate solution prepared by 0.9~1.0mol/L H 2 SO 4 ; 0.75~0.85mol/L CuSO 4 5H 2 O The anodic oxidation process of copper plating is carried out. The process conditions are as follows: base oxidation temperature 20-25°C, current density 1.0-2.5A/dm 2 , oxidation time 30min, pure copper as the electrode; The solution used for the anodic oxidation treatment is the same, the current density of the copper electroplating is 0.2-1.0A/dm 2 , and the copper plating time is 40 minutes.
上述镀铜中间处理可以用电镀铜镀液进行,此时电镀铜的电流密度为0.2~1.0A/dm2,镀铜时间为40min。 The above-mentioned copper plating intermediate treatment can be carried out with an electroplating copper plating solution. At this time, the current density of the electroplating copper is 0.2-1.0 A/dm 2 , and the copper plating time is 40 minutes.
C、所述的自润滑耐磨镀层处理,是将经B工序处理的工件,在包括镍盐、还原剂、络合剂、缓冲剂、稳定剂、减摩相材料MoS2、加速剂和表面活性剂等组成的化学复合液中进行沉积型涂覆处理;其中镍盐控制在40~50g/L,还原剂次亚磷酸钠控制在9~11g/L,络合剂柠檬酸三钠控制在90~110g/L,缓冲剂氯化铵控制在40~60g/L,减摩相材料MoS2控制在1.5~3g/L,所述的表面活性剂为十六烷基三甲基溴化铵或吐温-60,加入的控制量各为6-7mg/L或者0.40-0.5g/L。进行沉积涂镀时的溶液温度控制在90~95℃,溶液pH值控制在8.5~10; C. The self-lubricating wear-resistant coating treatment is to process the workpiece through the B process, including nickel salt, reducing agent, complexing agent, buffering agent, stabilizer, friction-reducing phase material MoS 2 , accelerator and surface Deposition-type coating treatment is carried out in a chemical compound solution composed of active agents, among which nickel salt is controlled at 40-50g/L, reducing agent sodium hypophosphite is controlled at 9-11g/L, and complexing agent trisodium citrate is controlled at 90-110g/L, the buffer ammonium chloride is controlled at 40-60g/L, the friction-reducing phase material MoS2 is controlled at 1.5-3g/L, and the surfactant is cetyltrimethylammonium bromide Or Tween-60, the added control amount is 6-7mg/L or 0.40-0.5g/L. The temperature of the solution during deposition and coating is controlled at 90-95°C, and the pH value of the solution is controlled at 8.5-10;
所用的镍盐是镀液中的主盐,用于提供镍离子,采用氯化镍或硫酸镍。提高镍盐的浓度,沉积速度会加快,但镀液稳定性下降,一般情况下,控制在40~50g/L。 The nickel salt used is the main salt in the plating solution to provide nickel ions, and nickel chloride or nickel sulfate is used. Increasing the concentration of nickel salt will increase the deposition rate, but the stability of the plating solution will decrease. Generally, it should be controlled at 40-50g/L. the
所用的还原剂用次亚磷酸钠做还原剂,次亚磷酸钠因价格低廉、镀液稳定性好。还原剂的含量取决于主盐的浓度,含量增加,沉积速度也会加快,但镀液稳定性下降,容易产生沉淀,使镀层质量受到影响,控制在9~11g/L。 The reducing agent used is sodium hypophosphite as the reducing agent, and sodium hypophosphite is low in price and good in stability of the plating solution. The content of the reducing agent depends on the concentration of the main salt. As the content increases, the deposition rate will also increase, but the stability of the plating solution will decrease, and precipitation will easily occur, which will affect the quality of the coating, which should be controlled at 9-11g/L. the
所用的络合剂为除主盐和还原剂外,镀液中最重要的成分,为避免镀液分解,镀液中必须加入络合剂。络合剂在镀液中的作用是与镍离子形成稳定的络合物,控制参加反应的镍离子的浓度,防止镀液析出沉淀,增加镀液稳定性并延长使用寿命;同时还可以起抑制亚磷酸镍沉淀、稳定镀液、控制沉 积速度的作用;本技术方案使用的络合剂为柠檬酸三钠,用量90~110g/L。 The complexing agent used is the most important component in the plating solution except the main salt and the reducing agent. In order to avoid the decomposition of the plating solution, a complexing agent must be added to the plating solution. The role of the complexing agent in the plating solution is to form a stable complex with nickel ions, control the concentration of nickel ions participating in the reaction, prevent the precipitation of the plating solution, increase the stability of the plating solution and prolong the service life; at the same time, it can also inhibit Nickel phosphite precipitates, stabilizes the plating solution, and controls the deposition rate; the complexing agent used in this technical solution is trisodium citrate, and the dosage is 90-110g/L. the
所用的缓冲剂为氯化铵,缓冲剂的加入可以使镀液具备缓冲能力,有效地控制镀液的pH,当pH值小于4时,沉积速度低,当pH值大于6.5时,易产生微溶的亚磷酸镍沉;缓冲剂除氯化铵外,还可用醋酸或丙酸。 The buffering agent used is ammonium chloride. The addition of the buffering agent can make the plating solution have buffering capacity and effectively control the pH of the plating solution. When the pH value is less than 4, the deposition rate is low. When the pH value is greater than 6.5, it is easy to produce micro Dissolved nickel phosphite; the buffer can be acetic acid or propionic acid in addition to ammonium chloride. the
所用的稳定剂主要是用来抑制镀液中一些活性微粒的催化活性,使镍离子的还原反应只在被镀基体表面进行,防止镀液自发分解,使镀液稳定,获得高质量的镀层。稳定剂采用硫脲或硫代硫酸盐,其加入的量为5~10g/L。 The stabilizer used is mainly used to inhibit the catalytic activity of some active particles in the plating solution, so that the reduction reaction of nickel ions is only carried out on the surface of the substrate to be plated, so as to prevent the spontaneous decomposition of the plating solution, stabilize the plating solution, and obtain a high-quality coating. The stabilizer is thiourea or thiosulfate, and the amount added is 5-10g/L. the
在实施化学镀的工艺中,有时还会加入适量的加速剂、表面活性剂、稀土元素等,用来提高沉积速度、改善镀层质量。常用的加速剂有丙酸、丁二酸、氨基乙酸、氟化钠等,常用的表面活性剂有十二烷基硫酸钠、十二烷基磺酸钠等。 In the process of implementing electroless plating, sometimes an appropriate amount of accelerators, surfactants, rare earth elements, etc. are added to increase the deposition rate and improve the quality of the coating. Commonly used accelerators include propionic acid, succinic acid, glycine, sodium fluoride, etc., and commonly used surfactants include sodium lauryl sulfate, sodium dodecyl sulfate, etc. the
C、所述的镀后热处理是指将镀后工件在干燥箱进行180℃温度下的6小时保温处理。 C. The post-plating heat treatment refers to that the post-plating workpiece is subjected to heat preservation treatment at a temperature of 180° C. for 6 hours in a drying oven. the
镀层结合力测试结果 Coating adhesion test results
从图8~11中可以看到,热处理后的镀层,在比较前面就出现了一些小峰值,但是这些峰并不代表镀层的破裂,这只是由于基体表面粗糙度所导致的结果。真正的镀层破裂的峰值为较为连续而且相对较高的声发射信号。 It can be seen from Figures 8 to 11 that some small peaks appeared in the coating after heat treatment, but these peaks do not represent the cracking of the coating, which is only the result of the roughness of the substrate surface. The real peak of coating cracking is relatively continuous and relatively high AE signal. the
从表中和图中可也看出热处理后镀层的结合力值有所提高。 It can also be seen from the table and the figure that the bonding force value of the coating after heat treatment has increased. the
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