CN102082142B - Packaging structure - Google Patents

Abstract

The present invention provides a packaging structure, including a transparent substrate, a plurality of light emitting diodes and at least one control chip. The transparent substrate has a carrying surface. Each light emitting diode has a light emitting side and a bonding side opposite to each other, and each light emitting diode is arranged on the carrying surface with the light emitting side facing the transparent substrate. The control chip is arranged on the bonding side of the light emitting diode, and the control chip is electrically connected to the light emitting diode.

Description

Package structure

technical field

The present invention relates to a semiconductor structure, and in particular to a packaging structure.

Background technique

Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various equipment. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have been extended to large outdoor billboards, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions.

The existing packages of multiple light emitting diodes can be roughly divided into two types: wire-bonded package and flip-chip package. The formed package body has better heat dissipation effect. Generally speaking, the packaging of a plurality of light emitting diodes is to arrange a plurality of light emitting diode chips on a circuit board for packaging, wherein a control chip can be selectively arranged on the circuit board. When a control chip is configured on the circuit board, the control chip and the LED chip are packaged separately; when there is no control chip configured on the circuit board, an external control chip can be used to control the LED chip on the circuit board. In other words, the LED chip and the control chip are packaged separately, so the number of packages cannot be reduced, which easily increases the process steps and production cost, and is not suitable for mass production.

In addition, when disposing the LED chip on the circuit board in a flip-chip manner, the circuit board must have a large area of flip-chip contacts corresponding to the LED chip. In particular, in order to maintain the stability of the flip-chip LED chip, the LED chip will have more than three flip-chip contacts. This is not conducive to the packaging of small-sized LED chips, and because LED chips use one-sided light emission, and the surface of the circuit board used for flip chip is usually used as a reflector, so when the LED passes through the conductive bump and the circuit When the flip-chip contacts on the board are electrically connected, part of the light emitted by it must undergo multiple reflections and refractions, and pass through the P-N junction of the light-emitting diode many times before it can be emitted. As a result, the light path is longer and the light loss is also higher. In other words, the large-area flip-chip contacts on the circuit board will affect the luminous efficiency of the LED.

In addition, the substrate or conductive bumps used in the flip-chip package may also be uneven or have different sizes due to the influence of manufacturing process tolerances. That is to say, when the LED chip is arranged on the circuit board, the light-emitting surface of the LED chip will be different due to the different heights of the substrate used in the flip-chip package or the different size of the conductive bumps connected between the LED chip and the circuit board. And there is a height difference, which means that the light emitting surfaces of the light emitting diodes are not located on the same plane. In this way, it will also lead to loss of packaging yield and poor light mixing uniformity of the light emitted by the LED chips, thereby affecting the light output effect of the multi-chip packaging of the LEDs. In addition, the heat dissipation effect of the general encapsulant is poor and its refractive index cannot match that of the light-emitting diode, resulting in a low heat dissipation effect and light extraction efficiency of the encapsulated light-emitting diode.

Contents of the invention

The invention provides a packaging structure, wherein a plurality of light emitting diodes are arranged on the carrying surface of the light-transmitting substrate with the light-emitting side facing the light-transmitting substrate. That is, a plurality of light emitting diodes can be arranged evenly on the transparent substrate. In this way, the light emitted by the light-emitting diodes can pass through the light-transmitting substrate from the same plane, which has a better light-emitting effect.

The present invention provides a packaging structure, the control chip is arranged on the light emitting diodes arranged flatly on the light-transmitting substrate in a flip-chip manner, which is suitable for the packaging of small-sized light-emitting diodes with multiple crystal grains, and is conducive to mass production and reduce production costs.

The invention provides a packaging structure, the control chip of which is directly packaged together with the light emitting diode, which can effectively reduce the volume of the overall packaging structure and reduce the production cost.

The invention provides a packaging structure, the light-transmitting substrate has a refractive index matched with the light-emitting diode, which helps to increase the overall light-extraction efficiency. At the same time, the light-transmitting substrate can also provide a good heat dissipation effect for the light-emitting diodes.

The invention provides a packaging structure, which includes a light-transmitting substrate, a plurality of light-emitting diodes and at least one control chip. The transparent substrate has a bearing surface. Each light-emitting diode has a light-emitting side and a bonding side opposite to each other, and each light-emitting diode is arranged on the carrying surface with the light-emitting side facing the light-transmitting substrate. The control chip is arranged on the joint side of the light emitting diode, and the control chip is electrically connected with the light emitting diode.

In an embodiment of the present invention, the package structure further includes at least one external component disposed on the carrying surface of the transparent substrate or the control chip, wherein the control chip is electrically connected to an external circuit through the external component.

In an embodiment of the present invention, the external components are electrically connected to the control chip through flip chip bonding, wire bonding, soldering or conductive glue.

In an embodiment of the present invention, the external component includes a lead frame, a metal block or a printed circuit board.

In an embodiment of the present invention, the above-mentioned external component is disposed on the carrying surface of the light-transmitting substrate, and the external component and the light emitting diode have substantially the same height.

In an embodiment of the present invention, the at least one control chip includes a first control chip and a second control chip, each LED has a first pin and a second pin, and the first control chip and the second control chip The two control chips are respectively connected to the first pin and the second pin of the same LED.

In an embodiment of the present invention, the above-mentioned package structure further includes at least one bridge component disposed on the carrying surface of the light-transmitting substrate or on the control chip, the at least one control chip includes a first control chip and a second control chip, and the bridge component The component is electrically connected to the first control chip and the second control chip.

In an embodiment of the present invention, the bridge component is electrically connected to the first control chip and the second control chip by means of flip chip bonding, wire bonding, welding or conductive glue.

In an embodiment of the present invention, the above-mentioned packaging structure further includes a light-adjusting substance disposed on the surface or inside of the light-transmitting substrate.

In an embodiment of the present invention, the above-mentioned light adjustment substance includes fluorescent substance, scattering substance or reflective substance.

In an embodiment of the present invention, the above-mentioned light-adjusting substance is a continuous layer of light-adjusting substance or a plurality of patterns of light-adjusting substance.

In an embodiment of the present invention, the pattern of the light-adjusting substance is arranged corresponding to the light-emitting diodes.

In an embodiment of the present invention, the above-mentioned light-transmitting substrate is a multi-layer board structure, and the light-adjusting substance is located on the surface or inside of each layer board structure.

In an embodiment of the present invention, the package structure further includes a plurality of conductive components disposed between the bonding side of each LED and the control chip, and the control chip is electrically connected to the corresponding LED through the conductive components.

In an embodiment of the present invention, each light-emitting diode has a first joint portion and a second joint portion on the joint side, and the conductive component includes a plurality of first conductive components and a plurality of second conductive components, and the first conductive component respectively disposed on the first junction of each light emitting diode, and the second conductive component is respectively disposed on the second junction of each light emitting diode, the first junction and the second junction have a height difference, and the height difference is h1, The height of each first conductive element is h2, the height of each second conductive element is h3, and h1+h2=h3.

In an embodiment of the present invention, each of the above-mentioned first conductive components or each of the second conductive components is formed by a conductive bump or stacked by a plurality of conductive bumps.

In an embodiment of the present invention, the above-mentioned packaging structure further includes an encapsulant disposed on the carrying surface of the light-transmitting substrate and covering at least the light-emitting diodes.

In an embodiment of the present invention, the package structure further includes a heat dissipation component disposed on a side of the control chip relatively away from the light-transmitting substrate.

In an embodiment of the present invention, the above packaging structure further includes a light-transmitting adhesive layer disposed between the light-emitting side of each LED and the carrying surface of the light-transmitting substrate.

In an embodiment of the present invention, the above packaging structure further includes an optical path adjustment structure disposed on a bottom surface of the transparent substrate opposite to the carrying surface.

In an embodiment of the present invention, the light path adjustment structure includes a plurality of lenses or a plurality of surface microstructures.

In an embodiment of the present invention, the light path adjustment structure and the light-transmitting substrate are integrally formed.

Based on the above, the light-emitting diodes of the present invention are arranged on the carrying surface of the light-transmitting substrate with the light-emitting side facing the light-transmitting substrate, and the control chip is arranged on the light-emitting diodes arranged on the light-transmitting substrate in a flip-chip manner. Therefore, the present invention is suitable for the packaging of small-sized light-emitting diodes, and is beneficial to mass production and lowers manufacturing costs. In addition, since the control chip of the present invention can be directly packaged with the light-emitting diodes, the volume of the overall packaging structure can be effectively reduced and the production cost can be reduced. In addition, the light-transmitting substrate of the present invention can have a refractive index matching that of the light-emitting diode, which helps to increase the light extraction efficiency of the overall packaging structure. At the same time, the light-transmitting substrate can also provide a good heat dissipation effect for the light-emitting diodes.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a packaging structure according to an embodiment of the present invention;

2 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

3 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

4 is a schematic cross-sectional view of a package structure according to another embodiment of the present invention;

5 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

6 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

7 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

8 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

9 is a schematic diagram of the corresponding relationship between light-emitting diodes and light-adjusting substances according to an embodiment of the present invention;

10 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

11 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

12 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

13 is a schematic cross-sectional view of a package structure according to another embodiment of the present invention;

14 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

15 is a schematic cross-sectional view of a package structure according to another embodiment of the present invention;

16 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention;

FIG. 17 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention.

Main reference signs:

100a～100p: packaging structure; 110a～110c: light-transmitting substrate;

112: bearing surface; 114: bottom surface;

116～118: laminate structure; 120a～120f, 120a1～120e1, 121: light emitting diodes;

122a～122e: light output side; 124a～124e, 124c1: joint side;

124c2: the first junction; 124c3: the second junction;

126a: the first pin; 126b: the second pin;

130: control chip; 132: first control chip;

134: second control chip; 140a, 140b: external components;

150a, 150b: bridge components; 160a～160f, 162: light adjustment substances;

170: conductive component; 170a: first conductive component;

170b: the second conductive component; 172: conductive glue;

180: Encapsulation gel; 185: Heat dissipation component;

190: transparent adhesive layer; 195a, 195b: light path adjustment structure;

h1: height difference; h2, h3: height.

Detailed ways

FIG. 1 is a schematic cross-sectional view of a packaging structure according to an embodiment of the present invention. Please refer to FIG. 1 , in this embodiment, the packaging structure 100a includes a light-transmitting substrate 110a , a plurality of LEDs 120a - 120e and at least one control chip 130 . The transparent substrate 110 a has a carrying surface 112 , wherein the transparent substrate 110 a is, for example, a glass substrate, a ceramic substrate, or a transparent plastic substrate. Each light-emitting diode 120a (or light-emitting diode 120b, 120c, 120d, 120e) has a light-emitting side 122a (or light-emitting side 122b, 122c, 122d, 122e) and a light-emitting side 122a (or light-emitting side 122b, 122c, 122d) , 122e) of the junction side 124a (or junction side 124b, 124c, 124d, 124e), and each light emitting diode 120a (or light emitting diode 120b, 120c, 120d, 120e) is based on the light exit side 122a (or light exit side 122b, 122c , 122d, 122e) facing the light-transmitting substrate 110a and disposed on the carrying surface 112 of the light-transmitting substrate 110a. The control chip 130 is disposed on the bonding sides 124a-124e of the LEDs 120a-120e, and the control chip 130 is electrically connected to the LEDs 120a-120e.

Specifically, the control chip 130 of this embodiment includes a first control chip 132 and a second control chip 134, wherein the first control chip 132 is electrically connected to the LEDs 120a-120c through a plurality of conductive components 170, and the second The second control chip 134 is also electrically connected to the LEDs 120d-120e through the conductive component 170. The conductive component 170 here may be a conductive bump. In other unillustrated embodiments, the conductive component 170 may also be conductive glue, and the number of the control chips 130 may be only one or more than three, which is not limited herein.

Since the light-emitting diodes 120a-120e are disposed on the carrying surface 112 with the light-emitting sides 122a-122e facing the light-transmitting substrate 110a, when the first control chip 132 and the second control chip 134 respectively drive the light-emitting diodes 120a-120c and the light-emitting diode 120d ∼120e, the light emitted by the light-emitting diodes 120a-120e can pass through the light-transmitting substrate 110a from the same plane and be transmitted to the outside, which can make the light output ratio of the light-emitting diodes 120a-120e consistent, and can improve the overall efficiency of the light-emitting diodes 120a-120e. The light mixing effect of light means that the light mixing uniformity is better. In other words, the packaging structure 100a of this embodiment has a better light extraction effect. In addition, the control chip 130 is disposed on the light-emitting diodes 120 a - 120 e that have been arranged flat on the transparent substrate 110 a in a flip-chip manner. In this way, the number of flip-chip packages of the light emitting diodes 120 a - 120 e completed in a single flip-chip manufacturing process can be increased, which can effectively reduce costs and is suitable for mass production. At the same time, since the flip-chip method adopted in this embodiment is similar to the flip-chip structure of the existing chip, the existing flip-chip process and process equipment can be used, which can improve the mass production of the package structure 100a and the quality of the product. Rate. In addition, since the control chip 130 is directly packaged with the light emitting diodes 120a-120e, the volume of the overall package structure 100a can be effectively reduced and the production cost can be reduced.

It is worth mentioning that the light-transmitting substrate 110a of this embodiment can choose a refractive index matching that of the light-emitting diodes 120a-120e, so that the overall light extraction efficiency of the packaging structure 100a can be effectively increased. At the same time, the light-transmitting substrate 110a can also be used as a heat dissipation plate for the light-emitting diodes 120a-120e, which means that the light-emitting diodes 120a-120e can transfer heat to the outside through the light-transmitting substrate 110a, which can effectively reduce the temperature of the overall packaging structure 100a. In order to make the package structure 100a have better reliability. In addition, generally speaking, the material of the control chip 130 is usually a silicon substrate, wherein the silicon substrate is a good heat conductor, so the control chip 130 can also help to improve the heat dissipation efficiency of the overall package structure 100a.

The package structure 100a of this embodiment may further include two external components 140a, 140b, wherein the external components 140a, 140b are, for example, a metal block. In detail, the external component 140a is disposed on the carrying surface 112 of the transparent substrate 110a, and the external component 140a has substantially the same height as the light emitting diodes 120a-120e, and the external component 140b is disposed relatively away from the first control chip 132. On one side of the optical substrate 110a, the first control chip 132 can be electrically connected to an external circuit (not shown) through the external components 140a, 140b, which can increase the applicability of the package structure 100a. The external component 140a can be electrically connected to the first control chip 132 through a conductive component 170 (such as a conductive bump) in a flip-chip bonding manner, and the external component 140b can be electrically connected to the first control chip 132 through a conductive glue 172 . Certainly, in other unillustrated embodiments, the external components 140a, 140b may also be electrically connected to the first control chip 132 by wire bonding, welding or other appropriate methods, and the present is not limited thereto. .

It is worth mentioning that the present invention does not limit the number, position and type of the external components 140a, 140b, although the external components 140a, 140b mentioned here are embodied as two metal blocks, and are respectively located in the transparent On the carrying surface 112 of the optical substrate 110a and on the surface of the first control chip 132 relatively away from the light-transmitting substrate 110a, but in other unillustrated embodiments, the external components 140a, 140b can also be a circuit board or a lead frame; only one of the external components 140a or 140b can be used to electrically connect the control chip 130; the external component 140a or 140b can also be only configured on the light-transmitting substrate 110a, and the first control chip 132 is far away from the light-transmitting substrate 110a The side surface of the second control chip 134 or the side surface of the second control chip 134 away from the light-transmitting substrate 110a still belongs to the applicable technical solution of the present invention, without departing from the protection scope of the present invention.

The design of the packaging structures 100 b - 100 p will be described respectively below using a plurality of different embodiments. It must be noted here that the following embodiments use the component numbers and partial content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 2 is a schematic cross-sectional view of a package structure according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 2 at the same time. The package structure 100b of FIG. 2 is similar to the package structure 100a of FIG. Two pins 126b, and the first control chip 132 and the second control chip 134 are respectively connected to the first pin 126a and the second pin 126b of the LED 120f through the conductive component 170 . That is to say, the LED 120f is electrically connected to the first control chip 132 and the second control chip 134 through the conductive component 170 on the first pin 126a and the second pin 126b. In other words, the LEDs 120a, 120b, 120d, 120e, and 120f can be driven by a single control chip or multiple control chips, that is, the LEDs 120a, 120b can be driven by the first control chip 132, and the LEDs 120d, 120e can be driven by the second control chip. chip 134 to drive, and the LED 120f can be jointly driven by the first control chip 132 and the second control chip 134 .

FIG. 3 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 3 at the same time. The package structure 100c of FIG. 3 is similar to the package structure 100a of FIG. 1, the difference is that the package structure 100c of FIG. On the carrying surface 112 of the transparent substrate 110a, and the bridge component 150a is electrically connected to the first control chip 132 and the second control chip 134 through the conductive component 170 in a flip-chip bonding manner, and the bridge component 150b is configured on the control chip 130 , and the bridge component 150b is electrically connected to the first control chip 132 and the second control chip 134 through the conductive glue 172 . The bridging components 150a, 150b can be, for example, a lead frame, a metal block or a printed circuit board.

It must be noted here that the present invention does not limit the number and type of the bridging components 150a, 150b, although the bridging components 150a, 150b mentioned here are embodied in two, and are located on the transparent substrate 110a respectively. The carrying surface 112 of the control chip 130 and the surface of the control chip 130 relatively away from the light-transmitting substrate 110a are electrically connected to the first control chip 132 and the second control chip 134 through flip-chip bonding and conductive glue 172 respectively, but on other In an embodiment not shown, only one of the bridge components 150a or 150b can be selected to bridge the control chip 130; the bridge component 150a or 150b can also be disposed on the transparent substrate 110a or the control chip 130 is far away from the transparent substrate 110a. On one side surface; the bridge component 150a or 150b can also be electrically connected to the first control chip 132 and the second control chip 134 through other methods, such as wire bonding, welding or other suitable methods, which still belong to the scope of the present invention. The adopted technical scheme does not deviate from the intended protection scope of the present invention.

FIG. 4 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 4 at the same time. The package structure 100d of FIG. 4 is similar to the package structure 100a of FIG. 1, the difference is that the package structure 100d of FIG. On the carrying surface 112 of the light-transmitting substrate 110a, the light-adjusting material 160a is a continuous light-adjusting material layer. In addition, the light-adjusting substance 160a may be, for example, a fluorescent substance or a color-dispersing substance. When the light emitted by the light-emitting diodes 120a-120e enters the light-transmitting substrate 110a from the same plane, the light-adjusting substance 160a can change the wavelength of the light and adjust the light path, so that the light emitted from the light-transmitting substrate 110a has better uniformity, and then The light emitting effect of the encapsulation structure 100d can be improved.

It is worth mentioning that the present invention does not limit the position of the light-adjusting substance 160a. For example, in other embodiments, please refer to FIG. 5, the light-adjusting substance 160b of the packaging structure 100e can be embedded in the light-transmitting substrate 110a, or, please refer to FIG. 6, the light-adjusting substance 160c of the packaging structure 100f can be configured On the side of the light-transmitting substrate 110 a , or, referring to FIG. 7 , the light-adjusting substance 160 d of the package structure 100 g may be disposed on a bottom surface 114 of the light-transmitting substrate 110 a opposite to the carrying surface 112 . In short, the light-adjusting substances 160a-160d can be arbitrarily arranged on the surface of the light-transmitting substrate 110a or embedded in the light-transmitting substrate 110a according to the needs of users. Of course, they can also be arranged on the surface of the light-transmitting substrate 110a and both Embedded in the light-transmitting substrate 110a, it is not limited thereto.

Of course, the present invention does not limit the form of the light adjustment structure 160a. For example, in other embodiments, please refer to FIG. 8 , the light-adjusting substance 160e of the encapsulation structure 100h can be a plurality of light-adjusting substance patterns, for example, a plurality of discontinuous sheet patterns with uniform density distribution, and the light-adjusting The substance 160e may be, for example, a fluorescent substance, a scattering substance or a reflective substance. The light-adjusting substance 160e here is distributed on the surface of the light-transmitting substrate 110a and embedded in the light-transmitting substrate 110a. In addition to adjusting the distribution of light energy (ie, light shape), it is arranged on the carrying surface 112 of the light-transmitting substrate 110a. The light-adjusting substance 160e can also be used as a marker for alignment when arranging the light-emitting diodes 120a-120e.

On the other hand, the present invention can also use the light-adjusting substance 162 on or in the transparent substrate 110a as an alignment pattern for disposing the light emitting diodes 121 . Specifically, please refer to FIG. 9 , in this embodiment, the light-adjusting substance 162 is provided on the light-transmitting substrate 110a, and the light-emitting diodes 121 can be aligned on the light-transmitting substrate 110a through the light-adjusting substance 162 . That is to say, the light-adjusting substance 162 and the LED 121 are correspondingly disposed on the transparent substrate 110a. In this way, the difficulty of aligning the light emitting diodes 121 during the manufacturing process can be reduced, the manufacturing error can be reduced, and the manufacturing yield can be improved.

In addition, please refer to FIG. 10 , the light-adjusting substance 160f of the encapsulation structure 100i can also be, for example, a plurality of discontinuous block patterns with uniform density distribution, and the light-adjusting substance 160f here can also be distributed on the surface of the transparent substrate 110a and Embedded in the transparent substrate 110a. The light-adjusting substance 160f here can also be used as a three-dimensional marker for alignment when installing the light emitting diodes 120a-120e. If when the light-adjusting substance 160f is disposed on the carrying surface 112 of the light-transmitting substrate 110a, there is a height difference between the light-emitting diode 120d and the light-emitting diode 120e, at this time, the conductive component 170 can be stacked on the bonding side 124d of the light-emitting diode 120d. , so that the second control chip 134 can be horizontally disposed on the light emitting diodes 120d, 120e. Furthermore, please refer to FIG. 11 , the light-transmitting substrate 110b of the packaging structure 100j can also be a multi-layer board structure, which means that the light-transmitting substrate 110b can be composed of layer structures 116, 117, 118, wherein the light-adjusting substance 160f can be located The surface or interior of the laminate structures 116, 117, 118, and each laminate structure 116 (or laminate structures 117, 118) has a light adjustment substance 160f. That is to say, the packaging structure 100j of this embodiment can be designed to perform different light conversions in different blocks or layers (for example, blue light is converted to red light in the layer structure 116; blue light is converted in the layer structure 117). yellow light; turn blue light into green light in the laminate structure 118) to improve the overall conversion efficiency, or adjust the chromaticity of different light exit angles.

In short, the user can adjust the wavelength and light path of the light emitted by the light-emitting diodes 120a-120e by selecting the shape and location of the light-adjusting substances 160a-160f and the shape of the light-transmitting substrates 110a-110b. or a light shape, so that the packaging structures 100d-100j have a better light-extracting effect. In addition, in the above-mentioned embodiments, the light-adjusting substances 160a-160f are distributed on the light-transmitting substrates 110a, 110b, and the thickness of the light-adjusting substances 160e-160f may also be uneven. When the light emitted by the light-emitting diodes 120a-120e penetrates the light-transmitting substrates 110a, 110b, part of the light will directly pass through the light-transmitting substrates 110a, 110b to present the color light emitted by the original light-emitting diodes 120a-120e, such as blue light. , and the other part of the light will excite the light-adjusting substances 160a-160f to generate a color light different from that emitted by the original light-emitting diodes 120a-120e, such as green light. In this way, the packaging structures 100d-100j can change the light intensity, chromaticity, and color temperature of the light-emitting diodes 120a-120e through the light-adjusting substances 160e-160f, as well as the mixed light effect of different tones emitted by different light-emitting diodes 120a-120e, and The light output effect of the overall packaging structures 100d - 100j is adjusted by the control chip 130 . In other words, the light-adjusting substances 160a-160f are dissatisfied with the arrangement on the light-transmitting substrates 110a, 110b, which can effectively improve the overall light extraction efficiency of the packaging structures 100d-100j. In addition, the above-mentioned embodiments are only for illustration, and those skilled in the art may refer to the description of the above-mentioned embodiments, and select or combine the above-mentioned components according to actual needs, so as to achieve the desired technical effect.

FIG. 12 is a schematic cross-sectional view of a package structure according to another embodiment of the present invention. Please refer to FIG. 12 and FIG. 1 at the same time. The package structure 100k in FIG. 12 is similar to the package structure 100a in FIG. The types of the diodes 120a-120e are different. In detail, taking the LED 120c1 in FIG. 12 as an example, the bonding side 124c1 of the LED 120c1 has a first bonding portion 124c2 and a second bonding portion 124c3. component 170b, and the first conductive component 170a is disposed on the first joint portion 124c2 of the light emitting diode 120c1, and the second conductive component 170b is disposed on the second joint portion 124c3 of the light emitting diode 120c1, wherein the first joint portion 124c2 and the second joint portion 124c3 There is a height difference h1, the height of the first conductive element 170a is h2, and the height of the second conductive element 170b is h3, then preferably h1+h2=h3.

Since the first joint portion 124c2 and the second joint portion 124c3 of the LED 120c1 have a height difference h1, the height difference h1 can be adjusted by the first conductive component 170a and the second conductive component 170b having different heights, which can effectively improve the The yield rate of the flip-chip bonding of the chip 130 is controlled. Here, the first conductive component 170a or the second conductive component 170b can be formed by one conductive bump or stacked by multiple conductive bumps, depending on the height difference between the first joint part 124c2 and the second joint part 124c3 Depends, and is not limited here. Similarly, the LEDs 120a1 , 120b1 , 120d1 , and 120e1 have the same type as the LED 120c1 , please refer to the above description, and will not repeat them here. In addition, the conductive bumps described here are metal balls or metal blocks that are bonded on the first bonding portion 124c2 and the second bonding portion 124c3 by a wire bonding machine, wherein the metal is gold or aluminum, for example.

FIG. 13 is a schematic cross-sectional view of a package structure according to another embodiment of the present invention. Please refer to FIG. 13 and FIG. 1 at the same time. The packaging structure 100l in FIG. 13 is similar to the packaging structure 100a in FIG. The carrying surface 112 of the optical substrate 110a covers at least the LEDs 120a-120e, so as to prevent the LEDs 120a-120e from being affected by external substances. Specifically, in this embodiment, the encapsulant 180 is filled between the light-emitting diodes 120a-120e and the first control chip 132 and the second control chip 134, that is, the encapsulant 180 covers the light-emitting diodes 120a-120e and The conductive component 170 covers part of the carrying surface 112 of the transparent substrate 110a, the surfaces of the first control chip 132 and the second control chip 134 adjacent to the LEDs 120a-120e, and part of the surface of the external component 140a. In addition, the encapsulant 180 here not only has the function of protecting the light emitting diodes 120a-120e, but also has the functions of guiding light and dissipating heat.

FIG. 14 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention. Please refer to FIG. 14 and FIG. 1 at the same time. The package structure 100m of FIG. 14 is similar to the package structure 100a of FIG. 1, the difference is that the package structure 100m of FIG. The side of the chip 130 far away from the light-transmitting substrate 110a can effectively conduct the energy generated during the operation of the first control chip 132 and the second control chip 134 to the outside, so that the package structure 100m has a better heat dissipation effect.

FIG. 15 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention. Please refer to FIG. 15 and FIG. 1 at the same time. The package structure 100n in FIG. 15 is similar to the package structure 100a in FIG. 1, the difference is that the package structure 100n in FIG. 190 is arranged between the light-emitting sides 122a-122e of the light-emitting diodes 120a-120e and the carrying surface 112 of the light-transmitting substrate 110a and between the external component 140a and the carrying surface 112 of the light-transmitting substrate 110a, which means that the light-emitting diodes 120a-120e can pass through The transparent adhesive layer 190 is fixed on the transparent substrate 110 a, and the external component 140 a can be fixed on the transparent substrate 110 a through the transparent adhesive layer 190 . The light-transmitting adhesive layer 190 here can effectively increase the adhesion between the LEDs 120a-120e and the light-transmitting substrate 110a and the adhesion between the external component 140a and the light-transmitting substrate 110a, thereby improving the reliability of the packaging structure 100n.

FIG. 16 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention. Please refer to FIG. 16 and FIG. 1 at the same time. The package structure 100o in FIG. 16 is similar to the package structure 100a in FIG. 1, the difference is that the package structure 100o in FIG. 195 a is disposed on a bottom surface 114 of the transparent substrate 110 a opposite to the carrying surface 112 . The light path adjustment structure 195a here is, for example, a plurality of lenses, which are used to affect the light emitted by the LEDs 120a-120e to adjust the light path and improve the light output efficiency and light output uniformity of the packaging structure 100o.

FIG. 17 is a schematic cross-sectional view of a packaging structure according to another embodiment of the present invention. Please refer to FIG. 17 and FIG. 16 at the same time. The package structure 100p in FIG. 17 is similar to the package structure 100o in FIG. The light path adjusting structure 195b is integrally formed with the light-transmitting substrate 110c, wherein the light-path adjusting structure 195b is formed by surface treatment of the bottom surface 114 of the light-transmitting substrate 110c, for example.

In summary, the present invention has at least the following effects:

1. Since the light-emitting diode of the present invention is arranged on the carrying surface of the light-transmitting substrate with the light-emitting side facing the light-transmitting substrate, the light emitted by the light-emitting diode can pass through the light-transmitting substrate from the same plane and be transmitted to the outside, which can effectively improve The light uniformity of the overall LED.

2. The packaging structure of the present invention is to package the light-emitting diode and the control chip in a one-time flip-chip manner, which can effectively reduce the number of packaging times, and the manufacturing process is relatively simple and the process efficiency is good, thereby improving the mass production of the packaging structure.

3. The control chip proposed in the present invention is arranged on the light-emitting diodes that have been arranged flat on the light-transmitting substrate in a flip-chip manner, so the present invention is suitable for the packaging of small-sized light-emitting diodes, and is conducive to mass production and reduced production costs .

4. Since the flip-chip method adopted in the present invention is similar to the flip-chip structure of the existing chip, the existing flip-chip process and process equipment can be used, which can improve the mass production of the packaging structure and the yield of the product.

5. Since the control chip is directly packaged with the light-emitting diode, it can effectively reduce the volume of the overall package structure and reduce the production cost.

6. Since the packaging structure of the present invention has external components, the control chip can be electrically connected to an external circuit through the external components, which can increase the applicability of the packaging structure.

7. The packaging structure of the present invention may also include a light-adjusting substance or a light path adjusting structure to adjust the wavelength, light path or light shape of the light emitted by the light-emitting diode, so that the packaging structure has a better light output effect.

8. The package structure of the present invention may also include a heat dissipation component, which can effectively conduct the heat energy generated by the control chip to the outside, so that the package structure has a better heat dissipation effect.

9. The light-transmitting substrate of the present invention can be selected to match the refractive index of the light-emitting diode, so as to increase the overall light extraction efficiency of the packaging structure.

10. The light-transmitting substrate and the control chip of the present invention are conducive to the heat dissipation of the light-emitting diodes, and can improve the heat dissipation efficiency of the overall packaging structure.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims (22)

1. encapsulating structure comprises:

One transparent substrates has a load-bearing surface;

A plurality of light-emitting diodes; Each light-emitting diode has relative a bright dipping side and an engage side; And each light-emitting diode with said bright dipping side to said transparent substrates and each light-emitting diode fits on the said load-bearing surface with said bright dipping side; Wherein each light-emitting diode has one first pin and one second pin, and said first pin and said second pin are positioned at said engage side; And

At least one control chip is disposed at the said engage side of said light-emitting diode, and said control chip and said light-emitting diode electrically connect.

2. encapsulating structure according to claim 1 also comprises at least one external module, is disposed on the said load-bearing surface or said control chip of said transparent substrates, and wherein said control chip electrically connects through a said external module and an external circuit.

3. encapsulating structure according to claim 2, wherein said external module electrically connects through chip bonding mode, routing juncture, welding manner or conducting resinl and said control chip.

4. encapsulating structure according to claim 2, wherein said external module comprise a lead frame, a metal derby or a printed circuit board (PCB).

5. encapsulating structure according to claim 2, wherein said external module are disposed on the said load-bearing surface of said transparent substrates, and said external module has identical height with said light-emitting diode.

6. encapsulating structure according to claim 1, wherein said at least one control chip comprise that one first control chip and one second control chip and said first control chip and said second control chip distinctly are connected to said first pin and said second pin of same light-emitting diode.

7. encapsulating structure according to claim 1; Also comprise at least one bridge assembly; Be disposed on the said load-bearing surface or said control chip of said transparent substrates; Said at least one control chip comprises one first control chip and one second control chip, and said bridge assembly electrically connects said first control chip and said second control chip.

8. encapsulating structure according to claim 7, wherein said bridge assembly electrically connects said first control chip and said second control chip through chip bonding mode, routing juncture, welding manner or conducting resinl.

9. encapsulating structure according to claim 1 also comprises light adjustment material, is disposed at the surperficial or inner of said transparent substrates.

10. encapsulating structure according to claim 9, wherein said light adjustment material comprises fluorescent material, scatterer or reflecting material.

11. being a continuous light adjustment material layer or an a plurality of light, encapsulating structure according to claim 9, wherein said light adjustment material adjust the material pattern.

12. encapsulating structure according to claim 11, the corresponding setting of wherein said light adjustment material pattern with said light-emitting diode.

13. encapsulating structure according to claim 9, wherein said transparent substrates are the multi-layer sheet structure, and said light adjustment material is positioned at the surperficial or inner of each veneer structure.

14. encapsulating structure according to claim 1 also comprises a plurality of conductive components, be disposed between the engage side and said control chip of each light-emitting diode, and said control chip is electrically connected to pairing light-emitting diode through said conductive component.

15. encapsulating structure according to claim 14; Wherein the said engage side of each light-emitting diode has one first junction surface and one second junction surface, and said conductive component comprises a plurality of first conductive components and a plurality of second conductive component, and said first conductive component is disposed at said first junction surface of each light-emitting diode respectively; Said second conductive component is disposed at said second junction surface of each light-emitting diode respectively; Said first junction surface and said second junction surface have a difference in height, and said difference in height is h1, and the height of each first conductive component is h2; The height of each second conductive component is h3, and h1+h2=h3.

16. encapsulating structure according to claim 15, each first conductive component or each second conductive component system are made up of a conductive projection or are formed by a plurality of conductive projection storehouses.

17. encapsulating structure according to claim 1 also comprises a packing colloid, is disposed on the said load-bearing surface of said transparent substrates, and coats said light-emitting diode at least.

18. encapsulating structure according to claim 1 also comprises a radiating subassembly, is disposed at said control chip relatively away from a side of said transparent substrates.

19. encapsulating structure according to claim 1 also comprises a printing opacity glue-line, is disposed between the said load-bearing surface of said bright dipping side and said transparent substrates of each light-emitting diode.

20. encapsulating structure according to claim 1 also comprises light path adjustment structure, is disposed on the bottom surface with respect to said load-bearing surface of said transparent substrates.

21. encapsulating structure according to claim 20, wherein said light path adjustment structure comprises a plurality of lens or a plurality of surface micro-structure.

22. encapsulating structure according to claim 20, wherein said light path adjustment structure and said transparent substrates are formed in one.

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