CN102074813B - Electronic assembly and production method thereof - Google Patents
Electronic assembly and production method thereof Download PDFInfo
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- CN102074813B CN102074813B CN2011100053522A CN201110005352A CN102074813B CN 102074813 B CN102074813 B CN 102074813B CN 2011100053522 A CN2011100053522 A CN 2011100053522A CN 201110005352 A CN201110005352 A CN 201110005352A CN 102074813 B CN102074813 B CN 102074813B
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- weld part
- circuit board
- section
- strutting
- described weld
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 49
- 239000006071 cream Substances 0.000 claims description 49
- 239000011469 building brick Substances 0.000 claims description 34
- 238000003780 insertion Methods 0.000 claims description 22
- 230000037431 insertion Effects 0.000 claims description 22
- 238000000407 epitaxy Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000003032 molecular docking Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses an electronic assembly, which comprises a circuit board and an electronic element, wherein a block-up part is arranged on one surface of the circuit board; a plurality weld pads are arranged at the block-up part; the electronic element is inserted into and welded to the surface of the circuit board along one end of the circuit board and comprises an insulating body and a plurality of terminals fixed on the insulating body; each terminal respectively corresponds to the weld pad and is provided with a weld part and a shoving part arranged at the rear end of the weld part; relative to the weld part, the shoving part is deflected in the transverse direction and is closer to the circuit board in the height direction, so that the shoving part is positioned between adjacent weld pads and is shoved off by the block-up part to drive the welding parts to offset outwards in the inserting process; and then the shoving part spans over the block-up part and returns to drive the welding parts to return and enables the welding parts to be respectively positioned on the front sides and the outer sides of the weld pads. The invention also provides a production method of the electronic assembly.
Description
[technical field]
The present invention relates to a kind of electronic building brick and manufacture method thereof, refer to especially a kind of electronic building brick and manufacture method thereof that comprises that electronic component inserts along circuit board one end.
[background technology]
In order to reduce the mainboard height, at present in some electronic building bricks, circuit board upper and lower surface as described in electronic component (as electric connector) is inserted and is welded in along circuit board one end.Before assembling, described circuit board surface can be in the terminal cooperation position print solder paste of the described electronic component of correspondence.During assembling, described electronic component and described circuit board insert mutually, at this moment described electronic element terminal can be distinguished the described tin cream on the described circuit board of pushing tow, described tin cream is scraped, pad can be because of the very few failure welding that causes of described tin cream amount, or adjacent described tin cream contact causes short circuit, affect the normal operation of described electronic component.
For addressing the above problem, United States Patent (USP) has disclosed the fit structure of an electric connector and circuit board for No. 4303291, and it is provided with row's pothole in described circuit board upper and lower surface, in described pothole, is coated with tin cream.When the terminal soldering section of described electric connector inserts from its lateral margin, described weld part is first strutted by described circuit board, and when being inserted into certain depth, described weld part is fallen in described pothole and with described tin cream and contacted.Like this, during insertion, described weld part can the described tin cream of pushing tow, therefore can effectively avoid the generation of failure welding and short circuit.
But this mode is more not easy to operate.Because while on circuit board, tin cream being set, common way is the mode that adopts printing, and this mode needs described tin cream higher than described circuit board surface.And, in above-mentioned patent, described tin cream is lower than described circuit board surface, therefore can not adopt mode of printing, and can only adopt other particular form, and can not together arrange with other locational tin cream of circuit board, therefore complicated operation, efficiency is lower, and is difficult for guaranteeing operational quality.
Therefore, be necessary to design a kind of new electronic building brick and manufacture method thereof, to overcome the problems referred to above.
[summary of the invention]
Creation purpose of the present invention is to provide a kind of can avoid failure welding and short circuit and electronic building brick and manufacture method thereof simple to operate.
In order to achieve the above object, electronic building brick of the present invention can comprise a circuit board, and wherein a surface is provided with a padded section, and is provided with a plurality of weld pads in described padded section, an and electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board, make in insertion process, the described section of strutting is positioned between adjacent described weld pad, and first by described padded section, strutted, driving described weld part outwards is offset, then cross described padded and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
Electronic building brick of the present invention also can comprise a circuit board, and wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis, an and electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board, make in insertion process, the described section of strutting is positioned between adjacent described weld pad, and first by described circuit board surface, strutted, driving described weld part outwards is offset, then enter described depression and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
The present invention also provides a kind of electronic assembly manufacturing method, comprises the steps: to provide a circuit board, and wherein a surface is provided with a padded section, and is provided with a plurality of weld pads in described padded section; A plurality of tin creams are provided, are placed in respectively on corresponding described weld pad; One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board; Described electronic component is inserted and is installed on described circuit board along described circuit board one end, during insertion, the described section of strutting is positioned between adjacent described weld pad, in insertion process, the described section of strutting is first strutted by described padded section, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, then the described section of strutting crosses described padded and reply, and drives described weld part and replys and make the corresponding described tin cream of its contact; And heating, make described tin cream fusing form welding material, described weld part is connected with corresponding described weld pad respectively.
The present invention also provides a kind of electronic assembly manufacturing method, comprises the steps: to provide a circuit board, and wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis; A plurality of tin creams are provided, are placed in respectively on corresponding described weld pad; One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board; Described electronic component is inserted and is installed on described circuit board along described circuit board one end, during insertion, the described section of strutting is positioned between adjacent described weld pad, in insertion process, the described section of strutting is first strutted by described circuit board surface, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, then the described section of strutting enters described depression and replys, and drives described weld part reply and makes the corresponding described tin cream of its contact; And heating, make described tin cream fusing form welding material, described weld part is connected with corresponding described weld pad respectively.
Compared with prior art, electronic building brick of the present invention and manufacture method thereof can reduce not even pushing tow tin cream, avoid the generation of failure welding and short circuit, and simple to operate again, efficiency is higher, and can guarantee operational quality.
[accompanying drawing explanation]
The three-dimensional exploded view that Fig. 1 is electronic building brick the first execution mode of the present invention;
Fig. 2 is the stereogram of terminal in electronic building brick shown in Fig. 1;
The front view that Fig. 3 is terminal shown in Fig. 1;
The stereogram that Fig. 4 is another angle of electronic building brick shown in Fig. 3;
Fig. 5 is the cutaway view shown in Fig. 3;
Fig. 6 is the stereogram in electronic component and circuit board insertion process in electronic building brick shown in Fig. 1;
Fig. 7 is the cutaway view shown in Fig. 6;
Fig. 8 is electronic component and the circuit board stereogram after inserting in electronic building brick shown in Fig. 1;
Fig. 9 is the cutaway view shown in Fig. 8;
Figure 10 is electronic component and the circuit board stereogram before inserting in electronic building brick the second execution mode of the present invention;
Figure 11 is the cutaway view shown in Figure 10;
Figure 12 is the stereogram in electronic component and circuit board insertion process in electronic building brick shown in Figure 10;
Figure 13 is the cutaway view shown in Figure 12;
Figure 14 is electronic component and the circuit board stereogram after inserting in electronic building brick shown in Figure 10;
Figure 15 is the cutaway view shown in Figure 14.
The drawing reference numeral explanation of embodiment:
Padded 11 weld pad 13 depressions 15 of circuit board 1
Epitaxy part 335 weld part 337 connecting portions 338 strut section 339
[embodiment]
For ease of better understanding purpose of the present invention, structure, feature and effect etc., now with embodiment, electronic building brick of the present invention and manufacture method thereof are described further by reference to the accompanying drawings.
Fig. 1 with Figure 9 shows that the first execution mode of the present invention.
As Fig. 1, electronic building brick comprises a circuit board 1 and an electronic component 3.Described circuit board 1 is respectively equipped with padded 11 of a predetermined altitude in the upper and lower surface of its contiguous ora terminalis, and is provided with a plurality of weld pads 13 at described padded 11.The described weld pad 13 of upper and lower surface is staggered and arranges.When assembling, on each described weld pad 13, a tin cream 5 (as Fig. 4) will be set.
Described electronic component 3 is electric connector, and an end is welded in described circuit board 1, and the other end is connected with docking electronic component (not shown).Certainly, described electronic component also is not limited to described electric connector, also can be chip module, LED (light-emitting diode) etc. other assembly.Described electronic component 3 forms electronic building brick with described circuit board 1.Described electric connector 3 comprises an insulating body 31, is fixed in a plurality of terminals 33 of described insulating body 31, and the shielding casing 35 that is coated on described insulating body 31.
Described insulating body 31 comprises a base portion 311 and the hyoplastron 313 extended to form forward by described base portion 311, and is provided with two rows and is extended to respectively forward the terminal containing slot 315 of described hyoplastron 313 upper and lower surfaces by described base portion 311 rear ends.
As Fig. 2 and Fig. 3, described terminal 33 is arranged in two rows, is contained in respectively described terminal containing slot 315, and the corresponding described weld pad 13 of difference.As Fig. 2, each described terminal 33 comprises the fixed part 331 fixing with described base portion 311, the docking section 333 extended to form forward by described fixed part 331 front ends, the epitaxy part 335 that stretches out and form by described fixed part 331 rear ends, the weld part 337 extended to form backwards by described epitaxy part 335 ends, by the oblique connecting portion extended to form 338 in described weld part 337 rear ends, and by described connecting portion 338 ends backwards and the section that struts 339 extended to form towards described circuit board 1 direction.With respect to described weld part 337, described half that struts that section 339 deviation in the horizontal distance equals distance between described weld part 337 and adjacent described weld part 337 (also can equal 1.5 times, 2.5 times, 3.5 times of distance between described weld part 337 and adjacent described weld part 337 ...).
According to said structure, described weld part 337 is parallel to described fixed part 331 and, away from described circuit board 1, makes the position of described fixed part 331 not need to be subject to the restriction of described circuit board 1 thickness on short transverse, thereby can flexible design.With respect to described weld part 337, described section 339 deviation in the horizontal that struts, vertically upper parallel, on short transverse closer to described circuit board 337 (as Fig. 4 and Fig. 5), make in insertion process, the described section 339 that struts is between adjacent described weld pad 13, and first by described padded 11, strutted, drive described weld part 337 and outwards be offset (as Fig. 6 and Fig. 7), then cross described padded 11 and reply, drive described weld part 337 and reply and lay respectively at the described weld pad 13 positive outsides (as Fig. 8 and Fig. 9).Like this, can make described weld part 337 first outwards be offset and avoid the described tin cream 5 arranged on described weld pad 13, then reply to contact described tin cream 5, thereby can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.
Described electronic assembly manufacturing method comprises five steps, now is described below respectively.
The first step, provide circuit board 1 mentioned above (as Fig. 4 and Fig. 5).
Second step, provide a plurality of described tin creams 5, is placed in respectively (as Fig. 4 and Fig. 5) on corresponding described weld pad 13.
The 3rd step, provide above-mentioned electric connector 3 (as Fig. 4 and Fig. 5).
The 4th step, described electric connector 3 is inserted and is installed on described circuit board 1 along described circuit board 1 one ends, during insertion, the described section 339 that struts is between adjacent described weld pad 13 (as Fig. 4 and Fig. 5), in insertion process, the described section 339 that struts is first strutted by described padded 11, driving described weld part 337 outwards is offset and is located at corresponding described tin cream 5 outsides (as Fig. 6 and Fig. 7), then the described section 339 that struts crosses described padded 11 and reply, and drives described weld part 337 and replys and make its contact corresponding described tin cream 5 (as Fig. 8 and Fig. 9).Like this, can make described weld part 337 first outwards be offset and avoid described tin cream 5, then reply to contact described tin cream 5, thereby can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.This specification indication " reply " comprises that part is replied and reply fully, that is to say, in end-state, can be that described to strut section 339 unsettled, and described weld part 337 is connected on described tin cream 5, at this moment the described section 339 that struts is for replying fully, and described weld part 337 be the part reply; Can be also that the described section 339 that struts is connected to described circuit board 1 surface, at this moment the described section 339 that struts be the part reply with described weld part 337; Can also be that the described section 339 that struts all replys (being this kind of mode shown in the present embodiment, as Fig. 9) fully with described weld part 337.
The 5th step, heating (being generally that they are put in heating furnace), make 5 fusings of described tin cream form welding materials 5 ', by described weld part 337 be connected with corresponding described weld pad 13 respectively (as Fig. 7).
Above step not necessarily will sequentially be carried out, and such as the 3rd step can first be carried out, and then carries out other step.This part of those skilled in the art, because learning by above description, just repeats no more at this.
In the present embodiment, because described weld pad 13 is arranged at described padded 11, but not in pothole, therefore can adopt the mode of printing setting, and can together arrange with other locational tin cream of circuit board, therefore simple to operate, efficiency is higher, and can guarantee operational quality.
Certainly, persons skilled in the art can be done some design alterations according to above description.For example, described connecting portion 338 also can be by described weld part 337 sides oblique extending to form backward, or do not adopt oblique mode, but first laterally extend back again.The described section 339 that struts also can can't help described connecting portion 338 ends and extends to form backwards, but is extended by described connecting portion 338 sides, also can be not parallel to described weld part 337.In a word, terminal structure can be done larger change, as long as in described terminal 33, with respect to described weld part 337, described section 339 deviation in the horizontal that struts, on short transverse closer to described circuit board 1, make in insertion process, the described section 339 that struts is between adjacent described weld pad 13, and first by described padded 11, strutted, driving described weld part 337 outwards is offset, then cross described padded 11 and reply, drive described weld part 337 and reply and lay respectively at the positive outside of described weld pad 13, just can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.
In addition, the above electric connector comprises that the described terminal 33 of described terminal 33, two row of two rows is welded in respectively relative two surfaces of described circuit board 1, in actual applications, also can only establish the described terminal 33 of a row, this is arranged described terminal 33 and is welded in described circuit board 1 one surfaces.
Figure 10 is to Figure 15 shows that the second execution mode of the present invention.
As Figure 10 and Figure 11, in the present embodiment, described circuit board 1 lower surface thereon is respectively equipped with the depression 15 of a desired depth, and is provided with a plurality of described weld pads 13 in described depression 15.
Described electric connector 3 and the described electric connector structure of the first execution mode are basic identical, difference is, in described terminal 33, with respect to described weld part 337, described section 339 deviation in the horizontal that struts, on short transverse closer to described circuit board 1, make in insertion process, the described section 339 that struts is between adjacent described weld pad 13, and first by described circuit board 1 surface, strutted, drive described weld part 337 and outwards be offset, then enter described depression 15 and reply, drive described weld part 337 and reply and lay respectively at the positive outside of described weld pad 13.
The 4th step of described electronic assembly manufacturing method is: described electric connector 3 is inserted and is installed on described circuit board 1 along described circuit board 1 one ends, during insertion, the described section 339 that struts is between adjacent described weld pad 11 (as Figure 10 and Figure 11), in insertion process, the described section 339 that struts is first strutted by described circuit board 1 surface, driving described weld part 337 outwards is offset and is located at corresponding described tin cream 5 outsides (as Figure 12 and Figure 13), then the described section 339 that struts enters described depression 15 and replys, drive described weld part 337 replies and make its contact corresponding described tin cream 5 (as Figure 14 and Figure 15).Like this, can make described weld part 337 first outwards be offset and avoid described tin cream 5, then reply to contact described tin cream 5, thereby can reduce the not even described tin cream 5 of pushing tow, avoid the generation of failure welding and short circuit.
In the present embodiment, because described weld pad 13 is arranged at described circuit board 1 surface, but not in pothole, therefore can adopt the mode of printing setting, and can together arrange with other locational tin cream of circuit board, therefore simple to operate, efficiency is higher, and can guarantee operational quality.
Above detailed description is only the explanation of the present invention's preferred embodiment, non-so limit to the scope of the claims of the present invention, so the equivalence techniques variation that all this creation of utilization specifications and diagramatic content are done, all be contained in the scope of the claims of the present invention.
Claims (20)
1. an electronic building brick, is characterized in that, comprising:
One circuit board, wherein a surface is provided with a padded section, and is provided with a plurality of weld pads in described padded section; And
One electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board, make in insertion process, the described section of strutting is positioned between adjacent described weld pad, and first by described padded section, strutted, driving described weld part outwards is offset, then cross described padded and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
2. electronic building brick as claimed in claim 1, it is characterized in that: described circuit board upper and lower surface is equipped with described padded section, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
3. electronic building brick as claimed in claim 1, it is characterized in that: the described section of strutting is parallel with described weld part in the vertical.
4. electronic building brick as claimed in claim 3, it is characterized in that: described weld part rear end oblique extension backwards is provided with connecting portion, and the described section that struts is extended to form backwards by described connecting portion end.
5. electronic building brick as claimed in claim 1, it is characterized in that: each described terminal also comprises that one is fixed in the fixed part of described insulating body, described weld part is parallel to described fixed part and away from described circuit board on short transverse.
6. electronic building brick as claimed in claim 5, it is characterized in that: described fixed part rear end extends outwardly and is provided with an epitaxy part, and described weld part is extended to form backwards by described epitaxy part end.
7. as arbitrary described electronic building brick in claim 1 to 6, it is characterized in that: with respect to described weld part, the described section of strutting deviation in the horizontal distance equals half of distance between described weld part and adjacent described weld part.
8. an electronic assembly manufacturing method, is characterized in that, comprises the steps:
One circuit board is provided, and wherein a surface is provided with a padded section, and is provided with a plurality of weld pads in described padded section;
A plurality of tin creams are provided, are placed in respectively on corresponding described weld pad;
One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board;
Described electronic component is inserted and is installed on described circuit board along described circuit board one end, during insertion, the described section of strutting is positioned between adjacent described weld pad, in insertion process, the described section of strutting is first strutted by described padded section, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, then the described section of strutting crosses described padded and reply, and drives described weld part and replys and make the corresponding described tin cream of its contact; And
Heating, make described tin cream fusing form welding material, and described weld part is connected with corresponding described weld pad respectively.
9. electronic assembly manufacturing method as claimed in claim 8, it is characterized in that: described circuit board upper and lower surface is equipped with described padded section, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
10. electronic assembly manufacturing method as claimed in claim 8 or 9 is characterized in that: with respect to described weld part, the described section of strutting deviation distance in the horizontal equals half of distance between described weld part and adjacent described weld part.
11. an electronic building brick, is characterized in that, comprising:
One circuit board, wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis; And
One electronic component, insert and be welded in described circuit board surface along described circuit board one end, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board, make in insertion process, the described section of strutting is positioned between adjacent described weld pad, and first by described circuit board surface, strutted, driving described weld part outwards is offset, then enter described depression and reply, drive described weld part and reply and lay respectively at the positive outside of described weld pad.
12. electronic building brick as claimed in claim 11 is characterized in that: described circuit board upper and lower surface is equipped with described depression, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
13. electronic building brick as claimed in claim 11 is characterized in that: the described section of strutting is parallel with described weld part in the vertical.
14. electronic building brick as claimed in claim 13 is characterized in that: described weld part rear end oblique extension backwards is provided with connecting portion, and the described section that struts is extended to form backwards by described connecting portion end.
15. electronic building brick as claimed in claim 11 is characterized in that: each described terminal also comprises that one is fixed in the fixed part of described insulating body, and described weld part is parallel to described fixed part and away from described circuit board on short transverse.
16. electronic building brick as claimed in claim 15 is characterized in that: described fixed part rear end extends outwardly and is provided with an epitaxy part, and described weld part is extended to form backwards by described epitaxy part end.
17., as arbitrary described electronic building brick in claim 11 to 16, it is characterized in that: with respect to described weld part, the described section of strutting deviation in the horizontal distance equals half of distance between described weld part and adjacent described weld part.
18. an electronic assembly manufacturing method, is characterized in that, comprises the steps:
One circuit board is provided, and wherein a surface is provided with a depression, and is provided with a plurality of weld pads between described depression and corresponding ora terminalis;
A plurality of tin creams are provided, are placed in respectively on corresponding described weld pad;
One electronic component is provided, it comprises an insulating body and a plurality of terminal that is fixed in described insulating body, each described terminal is corresponding described weld pad respectively, and there is a weld part and be located at the section that struts of described weld part rear end, with respect to described weld part, the described section of strutting is deviation in the horizontal, on short transverse closer to described circuit board;
Described electronic component is inserted and is installed on described circuit board along described circuit board one end, during insertion, the described section of strutting is positioned between adjacent described weld pad, in insertion process, the described section of strutting is first strutted by described circuit board surface, drive the outside skew of described weld part and be located at the corresponding described tin cream outside, then the described section of strutting enters described depression and replys, and drives described weld part reply and makes the corresponding described tin cream of its contact; And
Heating, make described tin cream fusing form welding material, and described weld part is connected with corresponding described weld pad respectively.
19. electronic assembly manufacturing method as claimed in claim 18 is characterized in that: described circuit board upper and lower surface is equipped with described depression, and correspondingly, described terminal is arranged in two rows, respectively the described weld pad of corresponding upper and lower surface.
20. electronic assembly manufacturing method as described as claim 18 or 19 is characterized in that: with respect to described weld part, the described section of strutting deviation in the horizontal distance equals half of distance between described weld part and adjacent described weld part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100053522A CN102074813B (en) | 2011-01-10 | 2011-01-10 | Electronic assembly and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100053522A CN102074813B (en) | 2011-01-10 | 2011-01-10 | Electronic assembly and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102074813A CN102074813A (en) | 2011-05-25 |
| CN102074813B true CN102074813B (en) | 2013-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100053522A Expired - Fee Related CN102074813B (en) | 2011-01-10 | 2011-01-10 | Electronic assembly and production method thereof |
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| CN (1) | CN102074813B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4303291A (en) * | 1980-11-24 | 1981-12-01 | Western Electric Company, Inc. | Method of seating connector terminals on circuit board contact pads |
| CN2424543Y (en) * | 2000-04-29 | 2001-03-21 | 州邑企业有限公司 | Electrical connector |
| US6623302B2 (en) * | 2000-12-21 | 2003-09-23 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector having printed substrates therein electrically contacting conductive contacts thereof by solderless |
| JP2006236657A (en) * | 2005-02-23 | 2006-09-07 | Nec Corp | Connector device |
| CN101257158A (en) * | 2008-04-01 | 2008-09-03 | 东莞捷仕美电子有限公司 | Card connector terminal and manufacturing method thereof |
| CN201336406Y (en) * | 2008-12-05 | 2009-10-28 | 富港电子（东莞）有限公司 | Electrical connector |
| CN201438550U (en) * | 2009-06-09 | 2010-04-14 | 富士康(昆山)电脑接插件有限公司 | electrical connector terminal |
| CN101867106B (en) * | 2010-05-21 | 2013-01-23 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
-
2011
- 2011-01-10 CN CN2011100053522A patent/CN102074813B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN102074813A (en) | 2011-05-25 |
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