CN102007587A - Substrate bonding device - Google Patents

Abstract

The substrate bonding apparatus of the present invention includes: a base; a top cover disposed on the upper surface side of the base and forming an airtight space between the top cover and the base; an elastic sheet dividing the airtight space into a first airtight space on the base side and a second airtight space on the top cover side; a first bonding clamp mounted on the elastic sheet, the first bonding clamp disengaging a first substrate with double-sided adhesive tape adhered to its upper surface from the elastic sheet and supporting the first substrate while positioning it at a predetermined position on the elastic sheet; a second bonding clamp disposed above the first substrate, the second bonding clamp supporting the second substrate at a position opposite to the first substrate while disengaging it from the first substrate and positioning the second substrate at a predetermined position; and a pressure regulating unit for regulating the internal pressure of the first and second airtight spaces respectively; wherein the pressure regulating unit makes the first airtight space atmospheric pressure and the second airtight space a vacuum pressure, thereby causing the elastic sheet to elastically deform upward, thereby bonding the first substrate and the second substrate via the double-sided adhesive tape.

Description

Substrate bonding device

technical field

The present invention relates to a substrate bonding device, and more particularly, to a substrate bonding device that performs bonding of a wafer and a substrate, etc., using vacuum.

Background technique

In recent years, along with the thinning and miniaturization of electronic equipment such as personal computers, the thinning and miniaturization of semiconductor wafers (hereinafter referred to simply as "wafers" as appropriate) have also progressed. But thinner and smaller semiconductor wafers are not strong enough. Therefore, in the manufacturing process of the wafer, it is necessary to reinforce the wafer by bonding a substrate such as a glass plate to the wafer or bonding two substrates to both surfaces of the wafer.

As a pre-process for performing such reinforcement, for example, Patent Document 1 proposes a vacuum tape sticking device for a wafer that sticks a dicing tape (double-sided adhesive tape) on the surface of a wafer. The vacuum belt pasting device for wafers includes: a base, an upper cover, an elastic sheet, a jig for pasting, and first and second vacuum pumps. The upper cover covers the upper part of the abutment, forming an airtight space between the upper cover and the abutment. The elastic sheet is an elastic body, and divides the airtight space into a first airtight space on the base side and a second airtight space on the upper cover side, and places components for sticking the tape on the second airtight space side. The sticking jig is placed on the elastic sheet to support the wafer away from the elastic sheet. The first and second vacuum pumps adjust the internal air pressure of the first and second airtight spaces, respectively.

Patent Document 2 proposes a substrate bonding method in which reinforcement is performed by bonding a substrate on a wafer. This substrate bonding method includes three steps. The first step is a step of sticking the double-sided adhesive tape to the upper surface of the wafer using the sticking device described in Patent Document 1 or the like. The second step is a step of sticking the substrate on the adhesive surface of the support sheet whose adhesive force is weaker than that of the double-sided adhesive tape, and arranging the substrate at a position facing the wafer with a gap therebetween. The third step is a step of attaching the substrate to the double-sided adhesive tape attached to the wafer while pressing the attaching device against the adhered surface of the support sheet under negative pressure.

Patent Document 1: Japanese Patent Document Laid-Open No. 2006-310338;

Patent Document 2: Japanese Patent Application Laid-Open No. 2006-222267.

Contents of the invention

The problem to be solved by the invention

However, in the substrate bonding method described in Patent Document 2, in the step of arranging the substrate at a position facing the wafer with a gap, it is extremely difficult for the operator to attach the substrate to the fixed position of the support sheet, and cannot The bonding position of the wafer to the substrate is kept constant.

In addition, depending on the tension of the support sheet, the gap between the substrate and the wafer, and the adhesive force of the bonding surface of the support sheet, the bonding position between the substrate and the wafer may change. Also, since the bonding of the substrate and the wafer is performed by pressing with a roller from the upper surface of the support sheet on which the substrate is pasted on the bonding surface, stress is applied to the substrate and the substrate may be damaged.

In addition, since the height of the support tape is set in advance, there is a problem that the number of bonded wafers and substrates is limited, and there is room for improvement. In addition, when the wafer is bonded to a substrate smaller in size than the wafer, the double-sided adhesive tape that is not bonded to the substrate remains on the wafer, so there is also a problem of deterioration in product quality.

The present invention has been made in view of the above-mentioned problems in the related art, and an object of the present invention is to provide a substrate bonding apparatus capable of maintaining a constant bonding position between a wafer and a substrate, etc., without damaging the substrate, and having high work efficiency.

means of solving problems

In order to achieve the above object, the substrate bonding device of the present invention includes: a base; The airtight space is divided into a first airtight space on the side of the base and a second airtight space on the side of the upper cover; the first jig for bonding is placed on the elastic sheet, and the first A bonding jig separates the first substrate on which the double-sided adhesive tape is pasted on the upper surface from the elastic sheet, and supports the first substrate while positioning the first substrate at a predetermined position of the elastic sheet. a first substrate; a second bonding jig disposed above the first substrate, and the second bonding jig separates the second substrate from the first substrate; supported at a position opposite to the first substrate, and positioning the second substrate at a predetermined position; and an air pressure adjustment unit that adjusts the respective internal air pressures of the first and second airtight spaces; wherein, by The air pressure adjusting unit makes the first airtight space atmospheric pressure and the second airtight space a vacuum pressure, thereby elastically deforming the elastic sheet upward, thereby holding the first substrate and the first airtight space together. The second substrate is bonded via the double-sided adhesive tape.

According to the above structure, the first substrate and the second substrate can be bonded by positioning the first substrate at a predetermined position with the first bonding jig and positioning the second substrate at a predetermined position with the second bonding jig. . Thereby, the adhesion position of the 1st board|substrate and the 2nd board|substrate can be kept constant. in addition. Also, since the substrates can be bonded without using rollers for pressing, there is also no danger of the substrates being damaged by stress.

In the substrate bonding apparatus according to the present invention, the first bonding jig may include: a plate placed on the elastic sheet; and positioning pins arranged on the plate to hold the first A substrate is positioned at a predetermined position on the board.

With the above structure, the first substrate can be easily positioned at a predetermined position of the elastic sheet.

In the substrate bonding apparatus of the present invention, the second bonding jig may have a through hole formed in the same shape as the second substrate and position the second substrate at a predetermined position. and a support member fixed on the lower surface of the second bonding jig for supporting the second substrate inserted into the through hole; the first bonding jig may also have a A hole having the same shape as that of the support member, and the substrate bonding device of the present invention may also include a pallet placed on the elastic sheet, the pallet having: a through hole penetratingly arranged to be connected to the elastic sheet. the same shape as the first bonding jig for positioning the first bonding jig at a predetermined position of the elastic sheet; and a positioning unit for positioning the second bonding jig to The second substrate is brought into a predetermined positional relationship with respect to the first substrate.

With the above-mentioned structure, it is possible to support the second substrate at a position opposite to the first substrate while separating the second substrate from the first substrate and positioning the second substrate at a predetermined position without support by the support piece in the related art. relative to the substrate. Therefore, the bonding position of the substrate does not change. In addition, the second bonding jig can be supported while positioning the second substrate so as to have a predetermined positional relationship with respect to the first substrate. Therefore, it is possible to more reliably keep the bonding position of the substrate constant. Furthermore, by adjusting the distance between the first bonding jig and the second bonding jig, a desired number of substrates can be bonded.

In the substrate bonding apparatus of the present invention, an area of an upper surface of the first substrate may be smaller than an area of a lower surface of the second substrate.

With the above structure, after the first substrate and the second substrate are bonded, the double-sided adhesive tape is cut off along the upper surface of the first substrate, thereby enabling the double-sided adhesive tape to exist only on the first substrate and the second substrate. The bonding surface will not deteriorate the product quality.

In the substrate bonding device, the substrate bonding device may be capable of installing a sticking jig that supports the substrate while leaving the elastic piece, instead of the first bonding jig. the substrate, and supports the substrate while positioning the substrate at a predetermined position of the elastic sheet, and can install a support member instead of the second bonding jig, the support member being When the double-sided adhesive tape is separated from the substrate, the double-sided adhesive tape is supported at a position opposite to the substrate, and the sticking jig and the supporting member can be installed in a state , through the air pressure adjustment unit, the first airtight space is brought to atmospheric pressure, and the second airtight space is made to be at vacuum pressure, thereby elastically deforming the elastic sheet upward, and sealing the double-sided adhesive A knot tape is glued on the substrate.

According to the above configuration, one substrate bonding device can also function as a tape bonding device in the related art, and there is no need to provide a separate tape bonding device, so that equipment cost can be reduced.

Invention effect

As described above, according to the present invention, it is possible to provide a substrate bonding apparatus capable of maintaining a constant bonding position of a wafer, a substrate, etc., without damaging the substrate, and having high work efficiency.

Description of drawings

1 is a sectional view showing a tape bonding apparatus according to a first embodiment of the present invention;

Fig. 2 is the upper surface view showing the pallet with bonding device shown in Fig. 1;

3A is a top view showing the wafer jig with the bonding device shown in FIG. 1;

Fig. 3B is the A-A line sectional view of Fig. 3A;

4 is a top view showing a state in which the pallet and the wafer jig shown in FIGS. 2 , 3A, and 3B are assembled;

Fig. 5 is a lower surface view showing the tape with the bonding device shown in Fig. 1 and the clip for the tape;

Fig. 6 is a sectional view showing the action of the tape bonding device shown in Fig. 1;

Fig. 7 is a sectional view showing the action of the tape bonding device shown in Fig. 1;

Fig. 8 is a sectional view showing the action of the tape bonding device shown in Fig. 1;

9 is a sectional view showing a tape bonding device according to a second embodiment of the present invention;

Fig. 10 is a top view showing the wafer jig with bonding device shown in Fig. 9;

FIG. 11 is a top view showing a state in which the pallet and the wafer jig shown in FIGS. 2 and 10 are assembled;

Fig. 12A is a top view showing the substrate jig with the bonding device shown in Fig. 9;

Fig. 12B is a B-B line sectional view of Fig. 12A;

13 is a top view showing a state in which the pallet, the wafer jig, and the substrate jig shown in FIGS. 2, 10, 12A, and 12B are assembled;

14 is a sectional view showing a tape bonding device according to a third embodiment of the present invention;

Fig. 15 is a top view showing the substrate jig with bonding device shown in Fig. 14;

Fig. 16 is a sectional view showing the action of the tape bonding device shown in Fig. 14;

Fig. 17 is a sectional view showing a product made by the tape bonding device shown in Fig. 14;

Fig. 18 is a top view showing a wafer jig used when bonding wafers of other shapes.

Label description

1 substrate bonding device

2 abutments

2a, 2b piping opening

3 cover

4O ring

5 pieces of rubber

6 pallets

6a opening

6b support pin

6c positioning block

7 wafer jig

7a board

7b positioning pin

8 with supporting parts

8a opening

9 The first airtight space

10Second airtight space

11 Substrate Bonding Device

12 wafer jig

12a board

12b positioning pin

12c recess

13 Jigs for Substrates

13a opening

13b Recess for mounting

13c supporting parts

21 substrate bonding device

22 Jigs for Substrates

22a board

22b positioning pin

30 products

41 wafer jig

41a positioning pin

42 pallets

42a opening

42b support pin

42c positioning block

Detailed ways

Embodiments of the present invention will be described with reference to the drawings. The substrate bonding device according to the embodiment of the present invention can also function as a tape bonding device. The substrate bonding apparatus according to the first embodiment of the present invention is used in the step of bonding a double-sided adhesive tape (hereinafter referred to as "tape") to a wafer. The substrate bonding apparatus of the second embodiment is used in the step of bonding a wafer and a substrate. The substrate bonding apparatus of the third embodiment is used in a process of manufacturing a product by bonding another substrate to a wafer to which the substrate has been bonded by the substrate bonding apparatus of the second embodiment. The board|substrate bonding apparatus of said embodiment is demonstrated individually.

FIG. 1 shows a substrate bonding apparatus according to a first embodiment of the present invention. This substrate bonding apparatus 1 is used in the step of attaching the tape T on the wafer W. As shown in FIG. This substrate bonding apparatus 1 roughly includes a base 2 , an upper cover 3 , a rubber sheet (elastic sheet) 5 , a pallet 6 , a wafer jig 7 , and a belt support member 8 . An airtight space is formed between the upper cover 3 and the base 2 . The rubber sheet 5 divides the airtight space into a first airtight space 9 on the side of the base 2 and a second airtight space 10 on the side of the upper cover. The pallet 6 fixes the rubber sheet 5 at the central portion of the base 2 . The wafer jig 7 is positioned at the center of the rubber sheet 5 by the pallet 6 to place the wafer W thereon. The tape support member 8 supports the tape T at a position facing the wafer W and keeps it away from the wafer W. As shown in FIG.

The base 2 and the upper cover 3 are airtightly fixed via an O-ring 4 . The base 2 is provided with piping openings 2a, 2b for converting the first airtight space 9 and the second airtight space 10 into atmospheric pressure or vacuum pressure via a vacuum pump and a vacuum valve (not shown). . In Fig. 1, Fig. 6 ~ Fig. 9, Fig. 14 and Fig. 16, the arrow direction of arrow A represents the discharge of the atmosphere from these spaces in order to make the first airtight space 9 or the second airtight space 10 a vacuum pressure. air direction. On the other hand, the arrow direction of the arrow B indicates the suction direction of the atmosphere sucked into the first airtight space 9 or the second airtight space 10 to make the first airtight space 9 or the second airtight space 10 atmospheric pressure.

As shown in FIGS. 1 and 2 , the rubber sheet 5 is fixed on the lower surface of the pallet 6 . The pallet 6 is provided with an opening (through hole) 6a, a plurality of support pins 6b for supporting the belt support member 8, and a positioning block 6c for positioning the belt support member 8 at the center. Although not shown in FIG. 1 , the pallet 6 is screwed and fixed on the base 2 while the rubber sheet 5 is clamped, so that the rubber sheet 5 and the pallet 6 are fixed on the central part of the base 2 .

As shown in FIGS. 1 , 3A, and 3B , the wafer jig 7 includes a plate 7 a and positioning pins 7 b. The plate 7 a is formed in the same shape as the opening 6 a of the pallet 6 . The positioning pin 7b is formed of an elastic body, the upper surface of which is subjected to TOSICAL treatment as a non-bonding treatment, and positions the wafer (substrate) W at the center portion of the plate 7a. As shown in FIG. 4, the plate 7a is positioned at the central portion of the rubber sheet 5 by the pallet 6, and is positioned so that the centers of the wafer W, the plate 7a, and the rubber sheet 5 coincide.

As shown in FIGS. 1 and 5 , the tape support member 8 includes an opening 8 a having a surface (opening) larger than the upper surface of the wafer W. As shown in FIG. The belt support member 8 is fitted to the positioning block 6c of the pallet 6 shown in FIGS. 1 , 2 and 4 , and is placed on the support pin 6b.

Next, the operation of the substrate bonding apparatus 1 having the above configuration will be described with reference to the drawings.

As shown in FIG. 6, the atmosphere is sucked from the pipe openings 2a and 2b to the vacuum pump side via a vacuum pump and a vacuum valve (not shown), thereby converting the first airtight space 9 and the second airtight space 10 from atmospheric pressure to vacuum pressure. .

Thereafter, as shown in FIG. 7 , the first airtight space is changed from vacuum pressure to atmospheric pressure by supplying air from the pipe opening 2 a via a vacuum pump or the like. As a result, the rubber sheet 5 is expanded upward, the wafer chuck 7 is moved upward, the positioning pin 7b is brought into contact with the tape T, and the positioning pin 7b is elastically deformed. As a result, the tape T is evenly pasted on the wafer W. Since the second airtight space 10 is under vacuum pressure, the wafer W and the tape T can be bonded without air remaining between them.

After the pasting of the tape T is completed, as shown in FIG. 8, the air is sucked from the piping opening 2a via a vacuum pump or the like, the first airtight space 9 is changed from atmospheric pressure to vacuum pressure, and the air is supplied from the piping opening 2b to release the second air. The closed space 10 is changed from vacuum pressure to atmospheric pressure. Thereby, expansion of the rubber sheet 5 is suppressed, and the belt support member 8 and the wafer chuck 7 are returned to their original positions. Take off the upper cover 3, take the wafer W pasted on the tape T together with the tape supporting member 8 outside the apparatus 1, cut off the excess tape T pasted on the upper surface of the wafer W, and thus the pasting process of the tape T is completed. .

FIG. 9 shows a substrate bonding apparatus according to a second embodiment of the present invention. This substrate bonding apparatus 11 is used in the step of bonding the wafer W and the substrate S with the tape T bonded on the upper surface. This substrate bonding apparatus 11 has a wafer jig 12 instead of the wafer jig 7 of the substrate bonding apparatus 1 in the above-described first embodiment, and has a substrate jig 13 instead of the tape support member 8 . The same reference numerals are assigned to the same constituent elements as those of the substrate bonding apparatus 1, and detailed description thereof will be omitted.

As shown in FIG. 10, the wafer jig 12 has a plate 12a, positioning pins 12b, and recesses 12c. The plate 12a is formed in the same shape as the opening 6a of the pallet 6 shown in FIG. 2 . The positioning pin 12b positions the wafer W bonded with the tape T at the central portion of the upper surface of the plate 12a. The concave portion 12c is formed in the same shape as a supporting member 13c (see FIGS. 12A and 12B ) of the substrate jig 13 described later. The wafer jig 12 has an opening (hole) 12d penetratingly provided in the same shape as the supporting member 13c. As shown in FIG. 11 , the plate 12a is positioned at the center of the rubber sheet 5 (see FIG. 9 ) by the pallet 6, and is positioned so that the centers of the wafer W bonded with the tape T, the plate 12a, and the rubber sheet 5 coincide.

As shown in FIGS. 12A and 12B , the substrate jig 13 has an opening portion (through hole) 13 a, a mounting recess 13 b, and a support member 13 c. The opening 13a is formed in substantially the same shape as that of the substrate S (see FIG. 9 ). The mounting recess 13b facilitates insertion of the substrate S into the opening 13a. The support member 13c is fixed to the lower surface of the substrate jig 13, and supports the substrate S inserted into the opening 13a. As shown in FIG. 13, by placing the substrate jig 13 on the support pin 6b of the pallet 6 on which the wafer jig 12 shown in FIG. The center of the wafer W is shown to coincide with the center of the substrate S. As shown in FIG.

Next, the operation of the substrate bonding apparatus 11 having the above configuration will be described with reference to the drawings.

As shown in FIG. 9 , in the state where the components are positioned, the internal air pressures of the first airtight space 9 and the second airtight space 10 are changed through a vacuum pump and a vacuum valve not shown in the same manner as in the first embodiment. . As a result, the rubber sheet 5 is expanded upward, the wafer jig 12 is moved upward, and the wafer W placed on the wafer jig 12 and the substrate S supported by the substrate jig 13 are bonded together. As a result, the bonding position of the wafer W and the substrate S positioned as described above can be bonded without changing. Since the wafer W and the substrate S can be bonded without being pressed by the rollers disclosed in the related art, there is no need to consider the damage of the substrate S due to stress.

The supporting member 13c (see FIGS. 12A and 12B ) of the substrate jig 13 and the wafer jig 12 are formed so as to be able to cooperate with each other. Therefore, there is no hindrance to the bonding of the wafer W and the substrate S, and there is no fear of changes in the bonding position of the wafer W and the substrate S. The area of the upper surface of the wafer W is smaller than the area of the lower surface of the substrate S, so the lower surface of the substrate S is not pasted with excess tape, thereby not deteriorating product quality.

FIG. 14 shows a substrate bonding apparatus according to a third embodiment of the present invention. This substrate bonding apparatus 21 is used in the process of manufacturing a product by bonding one more substrate S to the wafer W to which the substrate S was bonded in the second embodiment. This substrate bonding apparatus 21 has a substrate jig 22 instead of the wafer jig 7 of the substrate bonding apparatus 1 in the first embodiment described above (see FIG. 1 , FIG. 3A , and FIG. 3B ). The same reference numerals are assigned to other components that are the same as those of the substrate bonding apparatus 1 described above, and detailed description thereof will be omitted.

As shown in FIG. 15 , the substrate jig 22 has the same function as the wafer jig 7 described above, and includes a plate 22 a and positioning pins 22 b. The plate 22a is formed in the same shape as the opening 6a of the pallet 6 shown in FIG. 2 . The positioning pins 22b position the substrate S on which the wafer W is bonded via the tape T on the upper surface side. 4 and 11, the plate 22a is positioned at the central portion of the rubber sheet 5 by the pallet 6, and is positioned such that the centers of the base plate S, the plate 22a, and the rubber sheet 5 coincide.

Next, the operation of the substrate bonding apparatus 21 having the above-mentioned configuration will be described with reference to the drawings.

As shown in FIG. 14 , in the state where each component is positioned, the first airtight space 9 and the second airtight space 10 are regulated through a vacuum pump and a vacuum valve (not shown) as in the first and second embodiments described above. internal air pressure. As a result, the rubber sheet 5 is expanded upward, the substrate jig 22 is moved upward, and the tape T is attached to the upper surface of the wafer W bonded to the substrate S. As shown in FIG.

After the tape T is pasted, the upper cover 3 is opened, and the tape T, the tape supporting member 8, and the wafer W and the substrate S bonded to the tape T are taken out. Next, as shown in FIG. 16 , these are placed on the support pins 6 b of the pallet 6 again after being turned upside down. A new substrate S is placed on the substrate jig 22 . As described above, the rubber sheet 5 is expanded upward, the substrate jig 22 is moved upward, the substrate S is attached to the tape T, and the excess tape T other than the bonding surface of the substrate S and the wafer W is removed. Thus, the product 30 shown in FIG. 17 is produced.

In the present embodiment, the bonding between the circular wafer W and the substrate S in plan view has been described, but the present invention is not limited thereto. Various modifications that can be understood by those skilled in the art can be made within the scope of the present invention regarding the structure and details of the present invention.

As described below, by changing the substrate bonding apparatus according to the embodiment of the present invention, it is also possible to similarly bond a wafer W and a substrate having a chamfered square shape in plan view. As shown in FIG. 18, a wafer jig 41 is provided instead of the above-mentioned wafer jig 7 (see FIGS. 1, 3A and 3B), etc., and a pallet 42 is provided instead of the above-mentioned pallet 6 (see FIGS. 1 and 2). . The wafer jig 41 is formed in a chamfered square shape in plan view, and has positioning pins 41 a for centering the wafer W on which the tape T is bonded on the upper surface. The pallet 42 has an opening 42 a formed in the same shape as the wafer jig 41 . And, instead of the above-mentioned substrate jig 13 (see FIGS. 9 , 12A, and 12B ), a substrate jig (not shown) that is positioned and supported by the positioning block 42c of the above-mentioned plate 42 is provided. The pins 42b support and can center the substrate. With this configuration, it is also possible to bond the wafer W and the substrate that are chamfered squares in plan view.

In addition, in the substrate bonding apparatus 21 shown in FIG. 16, by increasing the interval between the substrate jig 22 and the top of the positioning block 6c, the second tape T is bonded on the wafer W, and then the tape T is bonded along the wafer W. The tape T is cut in shape, and then by bonding the second substrate S, the product 30 shown in FIG. 17 can also be manufactured.

This application claims the priority based on Japanese application Japanese Patent Application No. 2008-108759 for which it applied on April 18, 2008, The whole disclosure content is taken in here.

Industrial availability

The present invention can be applied to a substrate bonding device. According to this substrate bonding apparatus, the bonding position of the wafer and the substrate etc. can be kept constant without damaging the substrate, so that the working efficiency can be improved.

Claims (6)

1. a base plate bonding device is characterized in that, comprising:

Base station;

Loam cake is set at the upper surface side of described base station, and and described base station between form airtight space;

Flexure strip is separated into first airtight space of described base station side and second airtight space of described loam cake side with described airtight space;

The first bonding anchor clamps of using, be positioned on the described flexure strip, described first bondingly makes first substrate that is pasted with double-sided adhesive tape at upper surface leave described flexure strip with anchor clamps, and with described first substrate orientation at described first substrate of the situation lower support of the pre-position of described flexure strip;

The second bonding anchor clamps of using, be set at the top of described first substrate, described second bonding with anchor clamps make second substrate leave under the situation of described first substrate with described second substrate supporting with the relative position of described first substrate, and with described second substrate orientation in the pre-position; And

Described first and second airtight spaces air pressure inside is separately regulated in the air pressure adjustment unit;

Wherein, make described first airtight space become atmospheric pressure by described air pressure adjustment unit, and make described second airtight space become the vacuum pressure, and make described flexure strip strain upward thus, thus described first substrate and described second substrate is bonding via described double-sided adhesive tape.

2. base plate bonding device as claimed in claim 1 is characterized in that,

Described first bondingly has with anchor clamps: plate is positioned on the described flexure strip; And alignment pin, be configured on the described plate, with the pre-position of described first substrate orientation at described plate.

3. base plate bonding device as claimed in claim 1 or 2 is characterized in that,

Described second bondingly has with anchor clamps: through hole, run through and be arranged to and the identical shape of described second substrate, and with described second substrate orientation in the pre-position; And support unit, be fixed on the described second bonding lower surface with anchor clamps, be used for supporting second substrate that is inserted into described through hole;

Described first bonding have with anchor clamps run through the hole of being arranged to the shape identical with described support unit,

Described base plate bonding device comprises the pallet that is positioned on the described flexure strip, described pallet has: through hole, run through and be arranged to and the identical shape of the described first bonding usefulness anchor clamps, and with the described first bonding pre-position that is positioned at described flexure strip with anchor clamps; And positioning unit, bondingly position described second, so that described second substrate becomes the preposition relation with respect to described first substrate with anchor clamps.

4. base plate bonding device as claimed in claim 1 or 2 is characterized in that,

The area of the upper surface of described first substrate is less than the area of the lower surface of described second substrate.

5. base plate bonding device as claimed in claim 3 is characterized in that,

The area of the upper surface of described first substrate is less than the area of the lower surface of described second substrate.

6. base plate bonding device as claimed in claim 1 is characterized in that,

Described base plate bonding device can be installed and paste with anchor clamps to replace the described first bonding anchor clamps of using, described stickup makes substrate leave the described substrate of situation lower support of described flexure strip with anchor clamps, and with the situation lower support described substrate of described substrate orientation at the preposition place of described flexure strip

Described base plate bonding device can the mounting support parts replacing the described second bonding anchor clamps of using, described support unit is bearing in the position relative with described substrate with described double-sided adhesive tape in that double-sided adhesive tape is left under the situation of described substrate,

Installing under the state of described stickup with anchor clamps and described support unit, by described air pressure adjustment unit, make described first airtight space become atmospheric pressure, and make described second airtight space become the vacuum pressure, make described flexure strip strain upward thus, described double-sided adhesive tape is sticked on the described substrate.

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