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CN101986203A - Heat pipe heat radiating system of digital light processing (DLP) projector - Google Patents

Heat pipe heat radiating system of digital light processing (DLP) projector Download PDF

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Publication number
CN101986203A
CN101986203A CN 201010230794 CN201010230794A CN101986203A CN 101986203 A CN101986203 A CN 101986203A CN 201010230794 CN201010230794 CN 201010230794 CN 201010230794 A CN201010230794 A CN 201010230794A CN 101986203 A CN101986203 A CN 101986203A
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China
Prior art keywords
heat
heat pipe
projector
dlp
conducting plate
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Granted
Application number
CN 201010230794
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Chinese (zh)
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CN101986203B (en
Inventor
崔凯
曾万军
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Shenzhen Acto Digital Video Technology Co Ltd
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Shenzhen Acto Digital Video Technology Co Ltd
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Priority to CN 201010230794 priority Critical patent/CN101986203B/en
Publication of CN101986203A publication Critical patent/CN101986203A/en
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Publication of CN101986203B publication Critical patent/CN101986203B/en
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Abstract

The invention relates to a heat pipe heat radiating system of a digital light processing (DLP) projector. The system comprises an optical main body, a cover body for sealing the optical main body and a cooling device for conducting and radiating the heat generated by the optical main body, wherein the cooling device comprises a heat radiator, a heat conductive board and a heat pipe for connecting the heat radiator and the heat conductive board; the heat conductive board is tightly jointed with the heat source of the optical main body; the heat conductive board is arranged in the cover body; the heat radiator is arranged outside the cover body; and the heat pipe is connected with the heat conductive board and the heat radiator. The heat pipe heat radiating system of the DLP projector reduces the temperature of the optical main body so as to reach the optimal working temperature of the DLP projector, avoids the pollutions of dirt and dust on the optical main body so as to reach the effect of preventing the dust and reducing the temperature, and has good mute effect.

Description

DLP projector heat pipe cooling system
[technical field]
The present invention relates to a kind of projection imaging equipment, relate in particular to a kind of DLP projector heat pipe cooling system.
[background technology]
The full name of DLP is " Digital Light Procession ", is digital light and handles, and promptly wants elder generation the digital processing of signal of video signal process by this technology, and then optical projection is come out.DLP projector has adopted digital micro-mirror wafer (DMD) to be used as main crucial treatment element to realize the digit optical processing procedure.Its principle is that the cold light source that will go out by the UHP lamps emission is by the condensation lens, by Rod with light uniformization, light after treatment is by a colour wheel (Color Wheel), light is divided into RGB three looks (perhaps RGBW etc. more polychrome), again with color by lens projects on dmd chip, reflection is through projection lens imaging on projection screen at last.
The imaging system of projector is the core of projector, if dust, oil smoke and dust etc. occur in optical element wherein or the image-forming component, can cause the pollution of parts, thereby influence contrast, color and the serviceable life of projector.And projector also can produce a large amount of heats in when work, and the gathering of heat makes projector produce hot deterioration, has seriously reduced the image quality of projected image.
[summary of the invention]
Based on this, be necessary to provide a kind of DLP projector heat pipe cooling system that promptly can prevent dust and can reduce temperature.
A kind of DLP projector heat pipe cooling system, comprise optical bodies, also comprise lid and the conduction that seals described optical bodies and distribute the cooling device of the heat that described optical bodies produces, described cooling device comprises heating radiator, heat-conducting plate and the heat pipe that connects heating radiator and heat-conducting plate, the thermal source of described heat-conducting plate and optical bodies is close to setting, described heat-conducting plate is arranged in the lid, and described heating radiator is arranged on outside the lid, and described heat pipe connects heat-conducting plate and heating radiator.
Preferably, described heat-conducting plate is square, and the centre is provided with boss, the suitable and applying of described boss and described digital micro-mirror wafer.
Preferably, described heating radiator comprises at least one fin-shaped heat radiator.
Preferably, described heat pipe is silver, copper or aluminium.
Preferably, described optical bodies comprises camera lens, and optical module is arranged on the digital micro-mirror wafer and the fixed head at the described optical module back side.
Preferably, be provided with square hole in the middle of the described fixed head, and suitable with described digital micro-mirror wafer.
DLP projector heat pipe cooling system makes the temperature of optical bodies reduce by the cooperation of the heat pipe of heating radiator, heat-conducting plate and connection heating radiator and heat-conducting plate, reaches the working temperature of DLP projector the best; The lid of sealing is accommodated optical bodies, and better seal is arranged, and makes extraneous dust or dust can't enter the inside of sealing box body; Avoided the pollution of dust, dust, reached the effect that promptly can prevent dust and can reduce temperature optical bodies.
In addition, DLP projector adopts heat pipe radiating system, can omit mechanical fans and dispel the heat, and has good quiet effect.
Heating radiator by the heat radiator of at least one dish shape constitutes has increased area of dissipation, has better radiating effect.
Heat pipe adopts silver, copper or aluminium, has better heat-conducting effect.
[description of drawings]
Fig. 1 is the synoptic diagram of DLP projector heat pipe cooling system among the embodiment;
Fig. 2 is the cut-away view of DLP projector heat pipe cooling system among the embodiment;
Fig. 3 is the explosive view of DLP projector heat pipe cooling system among the embodiment;
Fig. 4 is the cooling device scheme of installation of DLP projector heat pipe cooling system among the embodiment;
Fig. 5 is the cooling device one angle scheme of installation of DLP projector heat pipe cooling system among the embodiment;
Fig. 6 is another angle scheme of installation of cooling device of DLP projector heat pipe cooling system among the embodiment;
Fig. 7 is the cooling device structural drawing of DLP projector heat pipe cooling system among the embodiment.
[embodiment]
Referring to Fig. 1~7, a kind of DLP projector heat pipe cooling system comprises lid 100, cooling device 200 and optical bodies 300.Lid 100 is accommodated optical bodies 300 and by cooling device 200 conduction and distribute the heat that optical bodies 300 is produced.
Lid 100 is interior hollow, is used to accommodate and seals optical bodies 300, comprises top cover 110 and bottom 120.Top cover 110 and corresponding respectively circular arc cutaway 130 and the square breach 140 of being provided with of bottom 120.Top cover 110 tops are provided with screw 111, bottom and the screw 111 corresponding fixed legs 121 that are provided with.Screw passes screw 111 and is fixed in fixed leg 121, makes top cover 110 and bottom 120 closures.Arc notch 130 in top cover 110 and the bottom 120 merges, and forms circumferential notch, and is suitable with camera lens 310 shapes, makes camera lens 310 pass circumferential notch as for lid 100 outsides.
Optical bodies 300 comprises camera lens 310, optical module 320, is arranged on the dmd chip at optical module 320 back sides (digital micro-mirror wafer) 330 and fixed head 340.This fixed head 340 is fixed in the back side of optical module 320, and dmd chip 330 is installed on the fixed head 340, is provided with square hole in the middle of the fixed head 340, and is suitable with dmd chip 330, makes dmd chip 330 be exposed at fixed head 340 outsides.
Cooling device 200 comprises heating radiator 210, heat-conducting plate 230, and the heat pipe 220 that connects heating radiator 210 and heat-conducting plate 230.This cooling device adopts hot pipe technique, and particularly, heating radiator 210 is made up of at least one fin-shaped heat radiator; Heat-conducting plate 230 is square, and the centre is provided with boss 231, and this boss 231 and dmd chip 310 suitable and applyings can make dmd chip in time conduct heat; Heat pipe 220 connects heating radiator 210 and heat-conducting plate 230, and this heat pipe 220 is preferably silver, copper or aluminium.Heat-conducting plate 230 is arranged in the lid 100, and heating radiator 210 is arranged on outside the lid, and heat pipe 220 connects heat-conducting plate 230 and heating radiator 210.When projector worked, optical bodies 300 produced big calorimetric, and especially dmd chip 330.The heat-conducting plate 230 of cooling device 200 is close to setting with the thermal source of optical bodies 300, producing adstante febre heat-conducting plate 230 in optical bodies 300 is heated, heat pipe 220 conducts to heating radiator 210 to the heat of heat-conducting plate 230, this heating radiator 210 heat transferred to lid 100 outsides.
In addition, the colour wheel 400 that is connected with optical bodies 300 in addition, this colour wheel 400 is arranged in the metal guiding element 410, and heat pipe 220 passes this metal guiding element 410.Colour wheel 400 operations also produce heat, and pass to metal guiding element 410, and metal guiding element 410 passes to heat to heat pipe 220, and heat pipe 220 passes to heat to heating radiator 210, reaches in time to pass to the heat that colour wheel 400 is produced.
By heat pipe radiating system the heat that optical bodies 300 is produced is conducted, assurance DLP projector can work normally.The lid 100 sealing optical bodies 300 of sealing, and closed, make extraneous dust or dust can't enter the inside of lid 100, reach well dustproof effect, guaranteed that optical bodies 300 can projection go out high image quality.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (6)

1. DLP projector heat pipe cooling system, comprise optical bodies, it is characterized in that, also comprise lid and the conduction that seals described optical bodies and distribute the cooling device of the heat that described optical bodies produces, described cooling device comprises heating radiator, heat-conducting plate and the heat pipe that connects heating radiator and heat-conducting plate, and the thermal source of described heat-conducting plate and optical bodies is close to setting, and described heat-conducting plate is arranged in the lid, described heating radiator is arranged on outside the lid, and described heat pipe connects heat-conducting plate and heating radiator.
2. DLP according to claim 1 projector heat pipe cooling system is characterized in that described heat-conducting plate is square, and the centre is provided with boss, and described boss and digital micro-mirror wafer are suitable and fit.
3. DLP according to claim 1 projector heat pipe cooling system is characterized in that described heating radiator comprises at least one fin-shaped heat radiator.
4. DLP according to claim 1 projector heat pipe cooling system is characterized in that, described heat pipe is silver, copper or aluminium.
5. DLP according to claim 1 projector heat pipe cooling system is characterized in that described optical bodies comprises camera lens, and optical module is arranged on the digital micro-mirror wafer and the fixed head at the described optical module back side.
6. DLP according to claim 5 projector heat pipe cooling system is characterized in that, is provided with square hole in the middle of the described fixed head, and suitable with described digital micro-mirror wafer.
CN 201010230794 2010-07-19 2010-07-19 Heat pipe heat radiating system of digital light processing (DLP) projector Expired - Fee Related CN101986203B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010230794 CN101986203B (en) 2010-07-19 2010-07-19 Heat pipe heat radiating system of digital light processing (DLP) projector

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Application Number Priority Date Filing Date Title
CN 201010230794 CN101986203B (en) 2010-07-19 2010-07-19 Heat pipe heat radiating system of digital light processing (DLP) projector

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CN101986203A true CN101986203A (en) 2011-03-16
CN101986203B CN101986203B (en) 2013-05-29

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103337261A (en) * 2013-05-24 2013-10-02 中山市众盈光学有限公司 Optical engine box structure
CN107390464A (en) * 2017-09-01 2017-11-24 毅丰显示科技(深圳)有限公司 Interior circulation radiating type projector
CN107479308A (en) * 2017-09-26 2017-12-15 中国科学院理化技术研究所 DMD heat abstractor
WO2018028262A1 (en) * 2016-08-10 2018-02-15 深圳市绎立锐光科技开发有限公司 Colour wheel module, light source module and projection system
TWI635352B (en) * 2017-01-12 2018-09-11 中強光電股份有限公司 Projector, heat dissipation module, and heat dissipation fins set
CN108681120A (en) * 2018-04-04 2018-10-19 深圳市光谷基业科技有限公司 A kind of optics module equipment of LCD
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
CN109324461A (en) * 2018-11-23 2019-02-12 意诺科技有限公司 A kind of radiator of night vision cam, method and night vision cam
US10620516B2 (en) 2018-07-23 2020-04-14 Coretronic Corporation Projector, heat dissipation module and heat dissipation fin
CN111396827A (en) * 2020-04-28 2020-07-10 一汽奔腾轿车有限公司 Automobile projection control device

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CN1398357A (en) * 2000-12-08 2003-02-19 索尼株式会社 Liquid crystal display device and liquid crystal projector device
CN2735399Y (en) * 2004-09-24 2005-10-19 江西鸿源数显科技有限公司 Color separation-combination system heat sink for LCOS liquid crystal panel optical engine
US20060203206A1 (en) * 2005-03-08 2006-09-14 Samsung Electronics Co., Ltd. Cooling apparatus and a projector having the same
CN1854885A (en) * 2005-04-21 2006-11-01 三星电子株式会社 Image projection apparatus and method of cooling an image projection apparatus
JP2007114657A (en) * 2005-10-24 2007-05-10 Seiko Epson Corp projector
CN101008773A (en) * 2006-01-26 2007-08-01 中强光电股份有限公司 Projector and its cooling device
CN101135837A (en) * 2006-08-31 2008-03-05 精工爱普生株式会社 Projector
CN101203803A (en) * 2005-11-22 2008-06-18 卡西欧计算机株式会社 Projector system with cooling fan
EP2124101A1 (en) * 2008-05-20 2009-11-25 Samsung Electronics Co., Ltd. Image projecting apparatus
CN100562798C (en) * 2006-08-29 2009-11-25 台达电子工业股份有限公司 Cooling module for projection device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398357A (en) * 2000-12-08 2003-02-19 索尼株式会社 Liquid crystal display device and liquid crystal projector device
CN2735399Y (en) * 2004-09-24 2005-10-19 江西鸿源数显科技有限公司 Color separation-combination system heat sink for LCOS liquid crystal panel optical engine
US20060203206A1 (en) * 2005-03-08 2006-09-14 Samsung Electronics Co., Ltd. Cooling apparatus and a projector having the same
CN1854885A (en) * 2005-04-21 2006-11-01 三星电子株式会社 Image projection apparatus and method of cooling an image projection apparatus
JP2007114657A (en) * 2005-10-24 2007-05-10 Seiko Epson Corp projector
CN101203803A (en) * 2005-11-22 2008-06-18 卡西欧计算机株式会社 Projector system with cooling fan
CN101008773A (en) * 2006-01-26 2007-08-01 中强光电股份有限公司 Projector and its cooling device
CN100562798C (en) * 2006-08-29 2009-11-25 台达电子工业股份有限公司 Cooling module for projection device
CN101135837A (en) * 2006-08-31 2008-03-05 精工爱普生株式会社 Projector
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103337261A (en) * 2013-05-24 2013-10-02 中山市众盈光学有限公司 Optical engine box structure
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
WO2018028262A1 (en) * 2016-08-10 2018-02-15 深圳市绎立锐光科技开发有限公司 Colour wheel module, light source module and projection system
TWI635352B (en) * 2017-01-12 2018-09-11 中強光電股份有限公司 Projector, heat dissipation module, and heat dissipation fins set
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set
CN107390464A (en) * 2017-09-01 2017-11-24 毅丰显示科技(深圳)有限公司 Interior circulation radiating type projector
CN107390464B (en) * 2017-09-01 2019-10-18 毅丰显示科技(深圳)有限公司 Interior circulation radiating type projector
CN107479308A (en) * 2017-09-26 2017-12-15 中国科学院理化技术研究所 DMD heat abstractor
CN108681120A (en) * 2018-04-04 2018-10-19 深圳市光谷基业科技有限公司 A kind of optics module equipment of LCD
US10620516B2 (en) 2018-07-23 2020-04-14 Coretronic Corporation Projector, heat dissipation module and heat dissipation fin
CN109324461A (en) * 2018-11-23 2019-02-12 意诺科技有限公司 A kind of radiator of night vision cam, method and night vision cam
CN111396827A (en) * 2020-04-28 2020-07-10 一汽奔腾轿车有限公司 Automobile projection control device
CN111396827B (en) * 2020-04-28 2025-03-14 一汽奔腾汽车股份有限公司 Automobile projection control device

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