CN101813300B - Packaging structure of light-emitting component and manufacturing method thereof - Google Patents
Packaging structure of light-emitting component and manufacturing method thereof Download PDFInfo
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- CN101813300B CN101813300B CN2009101180443A CN200910118044A CN101813300B CN 101813300 B CN101813300 B CN 101813300B CN 2009101180443 A CN2009101180443 A CN 2009101180443A CN 200910118044 A CN200910118044 A CN 200910118044A CN 101813300 B CN101813300 B CN 101813300B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 74
- 238000004519 manufacturing process Methods 0.000 title claims 5
- 238000007789 sealing Methods 0.000 claims abstract description 61
- 239000000084 colloidal system Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract 4
- 238000005538 encapsulation Methods 0.000 claims description 14
- 239000008393 encapsulating agent Substances 0.000 claims 4
- 230000003287 optical effect Effects 0.000 abstract description 13
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000005034 decoration Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000004020 luminiscence type Methods 0.000 description 69
- 238000012856 packing Methods 0.000 description 20
- 238000002360 preparation method Methods 0.000 description 19
- 241000191291 Abies alba Species 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical group C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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Abstract
The invention relates to a light-emitting component packaging structure which comprises a lead frame, a light-emitting component arranged on the lead frame, a plurality of leads electrically connected with the light-emitting component and the lead frame, and packaging colloid coating the light-emitting component, the leads and a part of the lead frame. The packaging colloid is internally provided with a gas cavity which is positioned right above the light-emitting component and contains at least one gas. In the invention, a gas cavity is formed in the packaging structure of the light-emitting component in the glue sealing process, so that light emitted by the light-emitting component can be partially reflected in the gas cavity, and the light penetrating through the gas cavity is focused by the second glue sealing part. Not only increases the light intensity at the center of the optical axis of the light-emitting component packaging structure, but also has enough light intensity in the side direction to emit out, thereby improving the appreciation distance of Christmas lamp decoration.
Description
Technical field
The present invention relates to a kind of light-emitting assembly packaging structure and preparation method thereof, refer to a kind of light-emitting assembly packaging structure and preparation method thereof especially with air chamber.
Background technology
Conventional use is to be made up of many miniature bulbs in the Christmas lights of Christmas tree, and need be evenly arranged on the Christmas tree, to demonstrate the complexion of Christmas tree night.Yet, in recent years along with Development of Packaging Technology, have the light emitting diode of advantages such as volume is little, vibration resistance, power consumption is low, assembly life-span is long, need not warm up the lamp time, reaction speed is fast, replace conventional bulb gradually, become the lamp decoration on the Christmas tree.
Please refer to Fig. 1, Fig. 1 is the light-emitting assembly packaging structure generalized section of known applications in Christmas lamp.Shown in the 1st figure, light-emitting assembly packaging structure 10 comprises a lead frame 12, a luminescence component 14 and a packing colloid 16.Lead frame 12 has two pins 18, and luminescence component 14 is fixed on the lead frame 12, and its positive pole electrically connects with lead 20 and pin 18 respectively with negative pole.Packing colloid 16 is that a semicircle lens arrangement is covered on the luminescence component 14; And the arc surface central authorities that are positioned at the semicircle lens arrangement directly over the luminescence component 14 have the recess 22 of an inverted cone-shaped; The light (shown in Fig. 1 upward arrow) that luminescence component 14 is penetrated can produce reflection through recess 22; The side directions of directive light-emitting assembly packaging structure 10 enlarges lighting angle.
As shown in Figure 2, Fig. 2 is that the luminous intensity and the lighting angle of known luminescence assembly encapsulation structure concerns sketch map.As shown in Figure 2, light-emitting assembly packaging structure all can measure luminous intensity from the lighting angle of positive 90 degree to negative 90 degree, that is the optical axis of light-emitting assembly packaging structure all has light to penetrate towards side directions skew 90 degree.Because the lighting angle that light-emitting assembly packaging structure is spent in positive 90 degree and negative 90 all has certain luminous intensity; Therefore when light-emitting assembly packaging structure was arranged on the Christmas tree, all angles that passerby is positioned under the Christmas tree all can be known the Christmas lamp of watching on the Christmas tree.
Though the known luminescence assembly encapsulation structure has the light ejaculation at the lighting angle of 90 degree; But near the luminous intensity its optical axis then reduces because of the reflection of recess portion; And rough being scattered between positive 20 degree and negative 20 degree; Therefore when using on Christmas tree, because the restriction of the luminous intensity of light-emitting assembly packaging structure, the distance that makes passerby appreciate Christmas tree also is restricted.So, the luminous intensity of increase light-emitting assembly packaging structure optical axis center, and the luminous intensity of not reducing its side directions emitted light, real is the industry problem demanding prompt solution.
Summary of the invention
Main purpose of the present invention be to provide a kind of light-emitting assembly packaging structure with and preparation method thereof, to promote the appreciation distance of Christmas lights.
For reaching above-mentioned purpose, the present invention discloses a kind of light-emitting assembly packaging structure.It comprises lead frame, luminescence component, plural wires and packing colloid.Luminescence component is arranged on the lead frame, and luminescence component has light-emitting area.Lead electrically connects luminescence component and lead frame, and packing colloid coats the part of luminescence component, lead and lead frame.And the inside of packing colloid has air chamber, said air chamber be positioned at luminescence component light-emitting area directly over, and comprise at least a gas in this air chamber.
The present invention also discloses a kind of preparation method of light-emitting assembly packaging structure.At first, the luminescence component structure is provided, wherein the luminescence component structure comprises the first sealing portion, and the upper surface of the first sealing portion has recess.Then, colloid is injected dies with epoxy compound.Then, the luminescence component structure is inserted in the dies with epoxy compound,, and made colloid coat the first sealing portion with air chamber of formation between the colloid and the first sealing portion.Then, carry out bake process, make colloid be shaped to the structure of the second sealing portion in the first sealing portion, to form said light-emitting assembly packaging structure.
Among the present invention; Because the recess of luminescence component structure; In the sealing process, in light-emitting assembly packaging structure, form an air chamber, the light that luminescence component is penetrated can produce partial reflection in air chamber, and by the second sealing portion light of sweep gas body cavity is focused on.Therefore, not only increase the luminous intensity of light-emitting assembly packaging structure optical axis center, and its side directions also there is the light of enough luminous intensities to penetrate.
Description of drawings
Fig. 1 is the light-emitting assembly packaging structure generalized section of known applications in Christmas lamp;
Fig. 2 is that the luminous intensity and the lighting angle of known luminescence assembly encapsulation structure concerns sketch map;
Fig. 3 is the generalized section of light-emitting assembly packaging structure in the first embodiment of the invention;
Fig. 4 is the generalized section of light-emitting assembly packaging structure in the second embodiment of the invention;
Fig. 5 is that the luminous intensity and the lighting angle of light-emitting assembly packaging structure in the first embodiment of the invention concerns sketch map;
Fig. 6 is the preparation method schematic flow sheet of light-emitting assembly packaging structure of the present invention;
Fig. 7 to Figure 10 is the preparation method sketch map of light-emitting assembly packaging structure in the first embodiment of the invention;
Figure 11 is the preparation method sketch map of light-emitting assembly packaging structure in the second embodiment of the invention.
The primary clustering symbol description
The specific embodiment
Please refer to Fig. 3, Fig. 3 is the generalized section of light-emitting assembly packaging structure in the first embodiment of the invention.As shown in Figure 3, light-emitting assembly packaging structure 100 comprises lead frame 102, luminescence component 104, plural wires 106, and packing colloid 108.The lead frame 102 of present embodiment comprises two pins 110, but lead frame of the present invention is not limited to only have two pins, can increase pin number according to actual demand.Said luminescence component 104 is arranged on one of them pin 110, and said luminescence component 104 has a main light-emitting area 112 and is positioned at its upper surface.Wherein, said luminescence component 104 for example can be: the assembly that various types such as light-emitting diode chip for backlight unit, light-emitting diode component or Organic Light Emitting Diode assembly have the characteristics of luminescence, and present embodiment is example with the light-emitting diode chip for backlight unit, but not as limit.And each lead 106 electrically connects said luminescence component 104 and said each pin 110 respectively, makes said luminescence component 104 obtain power supply through each pin 110 and supplies with, and then produce light.In addition, said packing colloid 108 coats the part of said luminescence component 104, lead 106 and lead frame 102, protects said luminescence component 104 and lead 106 to avoid external object touching or dust with this and adheres to and cause damage.Said packing colloid 108 is the printing opacity solid; Tool is not mobile; It comprises at least a encapsulating material, for example: glass, quartz, high light transmittance resin, silica gel or above-mentioned combination, or other suitable material; Wherein the high light transmittance resin comprises epoxy resin (epoxy resin), polystyrene (polystyrene; PS), the acrylonitrile-butadiene-phenylethylene polymer (acrylonitrile-butadene-styrene, ABS), polymethyl methacrylate (polymethyl methacrylate, PMMA), acryl (acrylic resin) or above-mentioned combination in any etc.
In addition; The light-emitting assembly packaging structure 100 of present embodiment comprises a transparent shell 114 in addition; Be arranged at the inside of said packing colloid 108; That is said packing colloid 108 coats whole said transparent shell 114, and transparent shell 114 be positioned at luminescence component 104 main light-emitting area 112 directly over.And the inside of said transparent shell 114 has an air chamber 116, and comprises at least a gas in the said air chamber 116, for example: air.It should be noted that; Because said air chamber 116; The light that luminescence component 104 is sent can produce partial reflection and part refraction because of the difference of the gas refracting index of the refractive index of transparent shell 114 and air chamber 116, makes side directions and the upper surface of said light-emitting assembly packaging structure 100 all have light and penetrates.And the upper surface of said packing colloid is a convex surface, and for example: parabola that recess is downward or sphere etc., the light focusing that can the upper surface from said light-emitting assembly packaging structure 100 be penetrated, with effective not enough problem of optical axis center luminous intensity of improving.The curvature of said convex surface is not limited to parabola or sphere, and can do corresponding adjustment according to actual required focusing situation.
In addition, said transparent shell 114 is to be made up of transparent material, for example: glass, plastics, quartz, high light transmittance resin, silica gel or above-mentioned combination etc.Said transparent shell 114 more can be made up of identical materials with said packing colloid 108; To have identical refractive index; Make light look said transparent shell 114 and be same medium, but transparent shell of the present invention 114 also can be according to the required light type of reality and be made up of material different with said packing colloid 108 with packing colloid 108.It should be noted that; Said transparent shell 114 needs greater than the gas refracting index in the said air chamber 116 with the refractive index of said packing colloid 108; Make light can produce the phenomenon of total reflection, so that enough reflection rays to be provided at said transparent shell 114 interface said with the interface of said packing colloid 108 or transparent shell 114 and said air chamber 116.In the present embodiment, said transparent shell 114 is a ball housing, that is the air chamber 116 that is positioned at said transparent shell 114 is a ball shape.When light runs into said transparent shell 114; Part light can reflect towards the side directions of said light-emitting assembly packaging structure 100 and penetrate; And then make said light-emitting assembly packaging structure 100 have side direction light; And during the said transparent shell 114 of part light penetration, can pass through the upper surface of said packing colloid 108, and focused on.Therefore, said light-emitting assembly packaging structure 100 luminous intensity that is positioned at optical axis is able to promote.But said transparent shell 114 of the present invention is not limited to the ball shelly, and the surface that said transparent shell 114 is faced said luminescence component 104 also can be coniform or is a convex surface.
In addition; The said packing colloid 108 of present embodiment can comprise the first sealing portion 118 and the second sealing portion 120; A part, luminescence component 104 and the lead 106 of the wherein said first sealing portion 118 coated wire framves 102; And the said second sealing portion 120 coats the partly first sealing portion 118, and said transparent shell 114 is between said first sealing portion 118 and the said second sealing portion 120.Be worth mentioning, the said first sealing portion 118 has a recess 122, and said recess 122 is in the face of the air chamber 116 of said transparent shell 114, and the shape of said recess 122 can be inverted cone-shaped, but is not limited thereto shape.In addition; The said first sealing portion 118 can be made up of identical materials with the said second sealing portion 120, having identical refractive index, but is not limited thereto; Also can be made up of material different, the refractive index that only need meet both is all greater than the refractive index of gases in the air chamber 116.
Light-emitting assembly packaging structure of the present invention is not limited to the structure of the foregoing description, and also can not have transparent shell.The difference of following embodiment and the foregoing description is described for ease, and same components will be used same numeral, and the part of same components structure will repeat no more.Please refer to Fig. 4, Fig. 4 is the generalized section of the light-emitting assembly packaging structure in the second embodiment of the invention.As shown in Figure 4; Compared to first embodiment; The light-emitting assembly packaging structure 200 of present embodiment does not have transparent shell; And to be a bubble formed by recess 122 and 120 coatings of second encapsulation part of first encapsulation part 118 of packing colloid 108 air chamber 116 of present embodiment, and said air chamber 116 be positioned at said packing colloid 108 inner and be positioned at said luminescence component 104 directly over.In addition, said air chamber 116 is identical with the recess shape of first encapsulation part 118 in the face of the shape of first encapsulation part, 118 1 sides, and the shape that said air chamber 116 is faced second encapsulation part, 120 1 sides then is an arc surface.
In order to clearly demonstrate the effect of light-emitting assembly packaging structure of the present invention, below be that example describes with first embodiment.Please refer to Fig. 5, and compare with Fig. 2, Fig. 5 is that the luminous intensity and the lighting angle of the light-emitting assembly packaging structure of first embodiment of the invention concerns sketch map.As shown in Figure 5; Light-emitting assembly packaging structure of the present invention is in the luminous intensity of zero degree; Promptly be positioned at the about slightly 4 watts/surface of sphere (W/sr) of luminous intensity of optical axis center; In comparison, the known luminescence assembly encapsulation structure is at the about slightly 1.1 watts/surface of sphere of the luminous intensity of zero degree, so the luminous intensity that light-emitting assembly packaging structure of the present invention is positioned at optical axis center is greater than the known luminescence assembly encapsulation structure.In addition; Light-emitting assembly packaging structure of the present invention at positive 75 degree of lighting angle to 90 degree and negative 75 degree when 90 spend; The luminous intensity that measured is 0.15 watt/surface of sphere approximately slightly, and the rough lighting angle that is same as the known luminescence assembly encapsulation structure is in positive 75 degree to 90 degree and the negative 75 degree luminous intensity (approximately slightly 0.15 watt/surface of sphere) when 90 spend.Hence one can see that, and light-emitting assembly packaging structure of the present invention not only increases the luminous intensity of optical axis center, also keeps the luminous intensity of side directions emitted light, will help to promote the distance that passerby watches Christmas lamp on the Christmas tree.
In addition, the present invention also discloses the preparation method of above-mentioned light-emitting assembly packaging structure.Please refer to Fig. 6, Fig. 6 is the preparation method schematic flow sheet of light-emitting assembly packaging structure of the present invention.As shown in Figure 6, the preparation method flow process of light-emitting assembly packaging structure comprises the following step:
Step S10: the luminescence component structure is provided, and wherein the luminescence component structure comprises the first sealing portion, and the upper surface of the first sealing portion has recess;
Step S20: colloid is injected dies with epoxy compound;
Step S30: the luminescence component structure is inserted in the dies with epoxy compound,, and made colloid coat the first sealing portion with air chamber of formation between the colloid and the first sealing portion; And
Step S40: carry out bake process, make colloid be shaped to the structure of the second sealing portion in the first sealing portion, and take off dies with epoxy compound, to form light-emitting assembly packaging structure.
Wherein, in step S10, provide the step of luminescence component structure to comprise the following step:
Step S102: luminescence component is engaged on the lead frame;
Step S104: plural wires is connected luminescence component and lead frame; And
Step S106: carry out the sealing process, to form the part that the first sealing portion coats luminescence component, lead and lead frame.
For the clear preparation method of describing the light-emitting assembly packaging structure of first embodiment of the invention, please refer to Fig. 7 to Figure 10, and in the lump with reference to figure 3, and the flow chart of cooperation Fig. 6.Fig. 7 to Figure 10 is the preparation method sketch map of the light-emitting assembly packaging structure of first embodiment of the invention.As shown in Figure 7, luminescence component 104 and lead frame 102 are provided in step S102, carry out solid brilliant engaging process (die bonding process) then, said luminescence component 104 is engaged on the said lead frame 102.Then, in step S104, carry out bonding wire process (wire bonding process), plural wires 106 is electrically connected said luminescence component 104 and said lead frame 102.
Afterwards; As shown in Figure 8; In step S106, carry out the sealing process; To form the part that the first sealing portion 118 coats said luminescence component 104, lead 106 and lead frame 102, so far promptly accomplish luminescence component structure 150, the upper surface of the wherein said first sealing portion 118 has at least one recess 122.It should be noted that; The luminescence component structure 150 of present embodiment is the structure with single luminescence component 104 and first sealing portion 118; Have a plurality of luminescence components that coated by the first sealing portion respectively but the luminescence component structure also can be, and each luminescence component is the semi-finished product structure that is arranged on the lead frame.In addition, luminescence component structure 150 can be a Quartering shot type light emitting diode.
Then, as shown in Figure 9, a transparent shell 114 is engaged on the recess 122 of luminescence component structure 150, wherein air chamber 116 is arranged in transparent shell 114, and be positioned at luminescence component 104 main light-emitting area 112 directly over.
Then; Shown in figure 10, in step S20, carry out another sealing process, colloid 152 is injected dies with epoxy compound 154; And the luminescence component structure 150 that in step S30, will have transparent shell 114 is stood upside down; And insertion has in the dies with epoxy compound 154 of colloid 152, with air chamber 116 of formation between colloid 152 and luminescence component structure 150, and makes colloid 152 coat the first sealing portion 118 of transparent shells 114 and luminescence component structure 150.It should be noted that; Present embodiment makes the air chamber 116 in transparent shell 114 be able to be formed between colloid 152 and the luminescence component structure 150 earlier transparent shell 114 being engaged on the recess 122 of luminescence component structure 150 between step S10 and the step S20.
Then, in step S40, carry out bake process, make colloid be shaped to the second sealing portion 120 on the luminescence component structure.At last, take off sealing film tool, with the light-emitting assembly packaging structure 100 that forms first embodiment, as shown in Figure 3.The preparation method of the light-emitting assembly packaging structure that this is bright is not limited to only make single light-emitting assembly packaging structure; A plurality of light-emitting assembly packaging structures of also can producing once; And if make a plurality of light-emitting assembly packaging structures; Then must in addition after taking off encapsulating mould, carry out cutting process (cutting process) again, to form single light-emitting assembly packaging structure.
The present invention also discloses the preparation method of the light-emitting assembly packaging structure of second embodiment, please refer to Figure 11, and please in the lump with reference to figure 7 and Fig. 4, Figure 11 is the preparation method sketch map of the light-emitting assembly packaging structure of second embodiment of the invention.Like Fig. 6 and shown in Figure 7, compared to the preparation method of first embodiment, the step that forms the luminescence component structure in the preparation method of present embodiment is identical with the step S10 of the preparation method of first embodiment, therefore repeats no more in this.Then, shown in figure 10, in step S20, carry out the sealing process, colloid 152 is injected dies with epoxy compound 154, the luminescence component structure 150 handstand insertions that in step S30, directly will have recess 122 then have in the sealing film tool 154 of colloid 152.It should be noted that; Be different from the method that first embodiment forms air chamber 116; Recess 122 owing to the first sealing portion 118 in the present embodiment can retain air in recess 122; Make luminescence component structure 150 when inserting colloid 152, can between colloid 152 and luminescence component structure 150, form an air chamber 116, wherein this air chamber 116 is a bubble that comprises air.At last, in step S40, carry out bake process, make colloid be shaped to the second sealing portion 120 in the structural structure of luminescence component.Take off sealing film tool 154, with the light-emitting assembly packaging structure 200 that forms second embodiment, as shown in Figure 4.
In sum; The present invention makes the light that luminescence component penetrated that is positioned at the air chamber below can pass through air chamber because the sealing process of two-stage forms an air chamber in light-emitting assembly packaging structure; And have part light to produce reflection, penetrate to have the light that departs from rough 90 degree of optical axis.And the present invention is made into convex surface with the upper surface of encapsulating structure, can be together with the light focusing of sweep gas body cavity, and light-emitting assembly packaging structure is positioned at the luminous intensity thereby the lifting of optical axis center.Therefore, the present invention not only increases the luminous intensity of light-emitting assembly packaging structure optical axis center, and its side directions also has the light of enough luminous intensities to penetrate, thereby can improve the not enough problem of known luminescence assembly encapsulation structure luminous intensity.
The above is merely the present invention's preferred embodiment, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to the present invention's covering scope.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2009101180443A CN101813300B (en) | 2009-02-19 | 2009-02-19 | Packaging structure of light-emitting component and manufacturing method thereof |
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| CN2009101180443A CN101813300B (en) | 2009-02-19 | 2009-02-19 | Packaging structure of light-emitting component and manufacturing method thereof |
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| CN101813300A CN101813300A (en) | 2010-08-25 |
| CN101813300B true CN101813300B (en) | 2012-05-23 |
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| CN103353072A (en) * | 2013-07-17 | 2013-10-16 | 中山市格林曼光电科技有限公司 | Method for preparing all-weather-used LED lamp string and LED lamp unit of LED lamp string |
| CN108281536A (en) * | 2017-12-27 | 2018-07-13 | 张红 | A kind of astigmatism type paster LED lamp bead |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251875A (en) * | 2004-03-02 | 2005-09-15 | Toshiba Corp | Semiconductor light emitting device |
| CN1885571A (en) * | 2005-06-20 | 2006-12-27 | 王文峰 | LED packaging structure and packaging method |
| CN101047217A (en) * | 2006-04-03 | 2007-10-03 | 鹤山丽得电子实业有限公司 | LED with color package casing |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251875A (en) * | 2004-03-02 | 2005-09-15 | Toshiba Corp | Semiconductor light emitting device |
| CN1885571A (en) * | 2005-06-20 | 2006-12-27 | 王文峰 | LED packaging structure and packaging method |
| CN101047217A (en) * | 2006-04-03 | 2007-10-03 | 鹤山丽得电子实业有限公司 | LED with color package casing |
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