CN101819887A - Surface processing solution for manufacturing solid electrolytic capacitor - Google Patents
Surface processing solution for manufacturing solid electrolytic capacitor Download PDFInfo
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- CN101819887A CN101819887A CN 201010136352 CN201010136352A CN101819887A CN 101819887 A CN101819887 A CN 101819887A CN 201010136352 CN201010136352 CN 201010136352 CN 201010136352 A CN201010136352 A CN 201010136352A CN 101819887 A CN101819887 A CN 101819887A
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- Prior art keywords
- coupling agent
- electrolytic capacitor
- solid electrolytic
- processing solution
- surface processing
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- 239000003990 capacitor Substances 0.000 title claims abstract description 41
- 239000007787 solid Substances 0.000 title claims abstract description 30
- 238000012545 processing Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000007822 coupling agent Substances 0.000 claims abstract description 44
- 239000007784 solid electrolyte Substances 0.000 claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000004645 aluminates Chemical class 0.000 claims abstract description 5
- 229920005610 lignin Polymers 0.000 claims abstract description 5
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 2
- 150000007513 acids Chemical class 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 238000012797 qualification Methods 0.000 abstract description 5
- 238000010301 surface-oxidation reaction Methods 0.000 abstract 3
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 19
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 229920000128 polypyrrole Polymers 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 241001149900 Fusconaia subrotunda Species 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- BFRGSJVXBIWTCF-UHFFFAOYSA-N niobium monoxide Inorganic materials [Nb]=O BFRGSJVXBIWTCF-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium(IV) ethoxide Substances [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XGCTUKUCGUNZDN-UHFFFAOYSA-N [B].O=O Chemical compound [B].O=O XGCTUKUCGUNZDN-UHFFFAOYSA-N 0.000 description 1
- AFCIMSXHQSIHQW-UHFFFAOYSA-N [O].[P] Chemical compound [O].[P] AFCIMSXHQSIHQW-UHFFFAOYSA-N 0.000 description 1
- XOCUXOWLYLLJLV-UHFFFAOYSA-N [O].[S] Chemical compound [O].[S] XOCUXOWLYLLJLV-UHFFFAOYSA-N 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides surface processing solution for manufacturing a solid electrolytic capacitor. The surface processing solution at least comprises a coupling agent, wherein the coupling agent is used for connecting an anode surface oxidation film medium and a solid electrolyte in the solid electrolytic capacitor; the coupling agent is at least one of or combination of more of a titanate coupling agent, an aluminate coupling agent, a duplex metal coupling agent, a lignin coupling agent and a tin coupling agent; and the mass concentration of the coupling agent is 0.001 to 50 percent. Through the surface processing solution, the adhesion between the anode surface oxidation film medium and the solid electrolyte is more uniform and the adhering area and the adhering strength are larger, so that the capacity of the solid electrolytic capacitor is increased and the equivalent series resistance of the solid electrolytic capacitor is reduced; and at the same time, the protective effect on the anode surface oxidation film medium is better and the creepage qualification rate of the solid electrolytic capacitor is higher.
Description
[technical field]
The present invention relates to a kind of solid electrolytic capacitor, particularly be used to make the surface processing solution of solid electrolytic capacitor.
[background technology]
Along with the continuous development of science and technology, market needs more and more that volume is little, capacity is big, loss is low, ESR is low, the capacitor that reliability is high, and one of performance approach that improves capacitor is conductivity, regularity, a stability of improving solid electrolyte, planarization.In process of production, general normal use chemical oxidation or electrolytic oxidation polymerization method make pyrroles, aniline, thiophene or derivatives thereof monomer polymerization reaction take place, and then form the solid electrolyte of electrolytic capacitor.Because anode body surface oxide film dielectric and solid electrolyte are the materials of two kinds of different attributes; therefore the monomer of solid electrolyte is difficult attached on the anode body surface oxide film dielectric surface; the partly long solid electrolyte of going up of anode body surface oxide film dielectric can appear usually, the not long solid electrolyte of going up of part.Can cause the solid electrolyte layer skewness like this, compactness is inhomogeneous, and is in uneven thickness, and conductivity is inhomogeneous or the like, thereby finally have influence on the capacity extraction rate and the equivalent series resistance of electrolytic capacitor.
Coupling agent is the material with particular functional group, and it can connect the interface of two kinds of different in kinds by chemical bond or intermolecular force, improves adhesive strength.Surfactant is meant to add seldom measures the medicament that just can make two articles interfacial property (as surface tension) that marked change takes place.Can dissociating and dissociate afterwards in the aqueous solution according to surfactant, electrically charged type be divided into nonionic surface active agent, anionic surfactant, cationic surface active agent and amphoteric ionic surfactant.
When prior art is made solid electrolytic capacitor, on oxide film dielectric, directly adopt chemical polymerization or chemical polymerization and electrochemical polymerization method to prepare conductive layer, the condenser capacity extraction rate of making like this is often less, and ESR is bigger, can not satisfy high performance requirements.
Chinese patent application in disclosed CN1761007 number and CN1761006 number of on April 19th, 2006, a kind of technical scheme that adopts coupling agent treatment to make solid electrolytic capacitor is disclosed, its capacity is improved significantly, but its coupling agent only limits to silane coupler.In addition, on 09 13rd, 2006 disclosed CN1832073 number Chinese patent applications, also disclose a kind of technical scheme that adopts coupling agent treatment to make solid electrolytic capacitor, this bond of coupled layer that it forms with coupling agent and oxide dielectric layer is silicon oxygen bond, phosphorus oxygen key, the oxygen key of consulting, sulphur oxygen key or boron oxygen key.Above-mentioned open source information does not show the coupling agent that other is feasible.
[summary of the invention]
The technical problem to be solved in the present invention, be to provide a kind of surface processing solution that is used to make solid electrolytic capacitor, it contains and is different from coupling agent of the prior art, handle by this oxide film dielectric surface, surface processing solution antianode surface, on the oxide film dielectric outer surface, form solid electrolyte again, thereby make bonding more even between anode body surface oxide film dielectric and the solid electrolyte, improve bond area and adhesive strength.
The present invention is achieved in that a kind of surface processing solution that is used to make solid electrolytic capacitor, at least include and be used for connecting the anode body surface oxide film dielectric of described solid electrolytic capacitor and the coupling agent of solid electrolyte, it is characterized in that: described coupling agent is selected from least a or several combinations in titanate coupling agent, aluminate coupling agent, bimetallic coupling agent, lignin coupling agent, the tin coupling agent, and the mass concentration of described coupling agent is 0.001%～50%.
Described surface processing solution also further comprises at least a of organic solvent, deionized water.Described organic solvent is selected from least a in varsol, ketones solvent, esters solvent, alcohols solvent, acids solvent, dimethyl formamide, dimethyl sulfoxide (DMSO) and the substituent thereof.
It is that surface coverage has the valve metal of dielectric layer or the solid electrolytic capacitor of oxide that surface processing solution of the present invention can be used for its capacitor chip, and its valve metal can be aluminium, tantalum, niobium or titanium etc., and oxide is a columbium monoxide etc.; The solid electrolyte of this solid electrolytic capacitor can be electric conductive polymer or oxide, and described conducting polymer can also be polypyrrole, polythiophene, and polyaniline or derivatives thereof, oxide are manganese dioxide.
The present invention has following advantage: prepare solid electrolyte on the anode body surface oxide film dielectric after handling through this surface processing solution, make bonding more even between anode body surface oxide film dielectric surface and the solid electrolyte, bond area and adhesive strength are bigger, thereby improved the capacity of solid electrolytic capacitor, reduced the equivalent series resistance (ESR) of solid electrolytic capacitor.Simultaneously, because solid electrolyte covers anode body surface oxide film dielectric surface more equably, so the protection effect of antianode surface oxide film dielectric is also better, and the electric leakage qualification rate of the solid electrolytic capacitor of preparing is also higher.And the raw material of surface processing solution of the present invention is easy to get, and is fit to extensive technology popularization, improvement, has remarkable economic efficiency and social benefit.And surface processing solution of the present invention can adopt dipping, or spraying, or brushes, or roller coating, or method of printing covers the anode body surface oxide film dielectric surface of described solid electrolytic capacitor, and the scope of application is wider.
[embodiment]
Below be embodiments of the invention, but the invention is not restricted to this.The goal standard of capacitor is 6.3V in following examples and the comparative example, and 150 μ F, lamination number are 6 layers.
Embodiment 1
With the solid aluminum electrolytic capacitor is example, forms the oxide film dielectric alundum (Al at anode bodies aluminium wicking surface, forms processing layer at alundum (Al surface impregnation surface processing solution.Form the solid electrolyte layer polypyrrole on the processing layer surface afterwards, form first cathode layer at the solid electrolyte layer outer surface; Form second cathode layer at the first cathode layer outer surface, make the monolithic capacitor element, with capacitor element assembling and encapsulation, make solid aluminum electrolytic capacitor again, down together.
Surface processing solution consists of the tetraethyl titanate coupling agent, methyl alcohol organic solvent, deionized water.Wherein the mass concentration of tetraethyl titanate coupling agent is 0.001%, and the mass concentration of deionized water is 10.000%, and all the other are methyl alcohol.
Get 120 solid aluminum electrolytic capacitor samples that make by present embodiment and test its leakage current qualification rate, criterion is K≤0.04, tests its capacity, loss and ESR value simultaneously, and calculates its mean value, down together.
Embodiment 2
This embodiment 2 and the difference of embodiment 1 only are the composition of surface processing solution, these embodiment 2 surface processing solutions consist of aluminate coupling agent, acetone organic solvent, deionized water.Wherein the mass concentration of aluminate coupling agent is 50%, and the mass concentration of deionized water is 10.0%, and all the other are acetone.
Embodiment 3
This embodiment 3 and the difference of embodiment 1 only are the composition of surface processing solution, these embodiment 3 surface processing solutions consist of bimetallic coupling agent coupling agent, ether organic solvent, deionized water.Wherein the mass concentration of bimetallic coupling agent coupling agent is 20%, and the mass concentration of deionized water is 20.0%, and all the other are ether.
Embodiment 4
This embodiment 4 and the difference of embodiment 1 only are the composition of surface processing solution, these embodiment 4 surface processing solutions consist of lignin coupling agent, tin coupling agent, chloroform organic solvent, deionized water.Wherein the mass concentration of lignin coupling agent is 5%, and the mass concentration of tin coupling agent is 5%, and the mass concentration of deionized water is 35%, and all the other are chloroform.
Comparative Examples
Anode bodies aluminium wicking surface at solid aluminum electrolytic capacitor forms the oxide film dielectric alundum (Al, forms the solid electrolyte layer polypyrrole on the alundum (Al surface, forms first cathode layer at the solid electrolyte layer outer surface; Form second cathode layer at the first cathode layer outer surface, make the monolithic capacitor element, with capacitor element assembling and encapsulation, make solid electrolytic capacitor again.
The result:
Below be the result data of this patent, the ratio of product quantity wherein and output aggregate number; Capacity, loss and ESR value are the mean value of 120 samples of test.
| Scheme number | Electric leakage qualification rate/% | Capacity/μ F | Loss ‰ | ??ESR/mΩ |
| Embodiment 1 | ??92 | ??153.7 | ??12 | ??11 |
| Embodiment 2 | ??89 | ??155.9 | ??15 | ??13 |
| Embodiment 3 | ??90 | ??150.6 | ??11 | ??12 |
| Embodiment 4 | ??87 | ??153.5 | ??14 | ??14 |
| Comparative Examples | ??56 | ??125.9 | ??21 | ??29 |
Valve metal is aluminium among the above embodiment, but the invention is not restricted to aluminium, and other valve metals (as tantalum, niobium or titanium) or oxide (as columbium monoxide) adopt above-mentioned surface processing solution also to have same effect.In addition, above embodiment solid electrolyte is polypyrrole, but the invention is not restricted to this, and other electric conductive polymers (as polypyrrole, polythiophene, polyaniline or derivatives thereof) have above-mentioned effect too.
Can be found that by above data the embodiment of this patent is with respect to Comparative Examples, the electric leakage qualification rate has obtained bigger raising, and capacity is drawn also and obviously improved, and the ESR value obviously reduces.This explanation is after this patent handles by oxide film dielectric surface, antianode surface, improved being connected between anode body surface oxide film dielectric and the solid electrolyte, makes the performance of capacitor obtain bigger improvement.
Claims (3)
1. surface processing solution that is used to make solid electrolytic capacitor, at least include and be used for connecting the anode body surface oxide film dielectric of described solid electrolytic capacitor and the coupling agent of solid electrolyte, it is characterized in that: described coupling agent is selected from least a or several combinations in titanate coupling agent, aluminate coupling agent, bimetallic coupling agent, lignin coupling agent, the tin coupling agent, and the mass concentration of described coupling agent is 0.001%～50%.
2. the surface processing solution that is used to make solid electrolytic capacitor according to claim 1 is characterized in that: this Treatment Solution also further comprises at least a of organic solvent, deionized water.
3. the surface processing solution that is used to make solid electrolytic capacitor according to claim 2 is characterized in that: described organic solvent is selected from least a in varsol, ketones solvent, esters solvent, alcohols solvent, acids solvent, dimethyl formamide, dimethyl sulfoxide (DMSO) and the substituent thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010136352 CN101819887A (en) | 2010-03-30 | 2010-03-30 | Surface processing solution for manufacturing solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010136352 CN101819887A (en) | 2010-03-30 | 2010-03-30 | Surface processing solution for manufacturing solid electrolytic capacitor |
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| Publication Number | Publication Date |
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| CN101819887A true CN101819887A (en) | 2010-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010136352 Pending CN101819887A (en) | 2010-03-30 | 2010-03-30 | Surface processing solution for manufacturing solid electrolytic capacitor |
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| Country | Link |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103390500A (en) * | 2013-07-30 | 2013-11-13 | 中国振华（集团）新云电子元器件有限责任公司 | Manufacturing method for solid electrolytic condenser with high puncture voltage |
| CN105374565A (en) * | 2015-12-04 | 2016-03-02 | 福建国光电子科技股份有限公司 | Preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
| CN105374563A (en) * | 2015-12-04 | 2016-03-02 | 福建国光电子科技股份有限公司 | Preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
| CN105513808A (en) * | 2015-12-04 | 2016-04-20 | 福建国光电子科技股份有限公司 | Method for manufacturing multi-layer chip type solid-state polymer aluminum electrolytic capacitor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5729428A (en) * | 1995-04-25 | 1998-03-17 | Nec Corporation | Solid electrolytic capacitor with conductive polymer as solid electrolyte and method for fabricating the same |
| CN1761006A (en) * | 2004-10-15 | 2006-04-19 | 三洋电机株式会社 | Solid electrolytic capacitor and method of manufacturing the same |
| CN1832073A (en) * | 2005-03-08 | 2006-09-13 | 财团法人工业技术研究院 | Solid electrolytic capacitor, its manufacturing method and coupling agent used therefor |
| CN101494119A (en) * | 2008-01-22 | 2009-07-29 | 阿维科斯公司 | Electrolytic capacitor anode treated with an organometallic compound |
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2010
- 2010-03-30 CN CN 201010136352 patent/CN101819887A/en active Pending
Patent Citations (4)
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|---|---|---|---|---|
| US5729428A (en) * | 1995-04-25 | 1998-03-17 | Nec Corporation | Solid electrolytic capacitor with conductive polymer as solid electrolyte and method for fabricating the same |
| CN1761006A (en) * | 2004-10-15 | 2006-04-19 | 三洋电机株式会社 | Solid electrolytic capacitor and method of manufacturing the same |
| CN1832073A (en) * | 2005-03-08 | 2006-09-13 | 财团法人工业技术研究院 | Solid electrolytic capacitor, its manufacturing method and coupling agent used therefor |
| CN101494119A (en) * | 2008-01-22 | 2009-07-29 | 阿维科斯公司 | Electrolytic capacitor anode treated with an organometallic compound |
Non-Patent Citations (2)
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103390500A (en) * | 2013-07-30 | 2013-11-13 | 中国振华（集团）新云电子元器件有限责任公司 | Manufacturing method for solid electrolytic condenser with high puncture voltage |
| CN103390500B (en) * | 2013-07-30 | 2016-01-06 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of manufacture for solid electrolytic capacitor with high-breakdown-voltage |
| CN105374565A (en) * | 2015-12-04 | 2016-03-02 | 福建国光电子科技股份有限公司 | Preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
| CN105374563A (en) * | 2015-12-04 | 2016-03-02 | 福建国光电子科技股份有限公司 | Preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
| CN105513808A (en) * | 2015-12-04 | 2016-04-20 | 福建国光电子科技股份有限公司 | Method for manufacturing multi-layer chip type solid-state polymer aluminum electrolytic capacitor |
| CN105374565B (en) * | 2015-12-04 | 2018-02-06 | 福建国光电子科技股份有限公司 | A kind of preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
| CN105374563B (en) * | 2015-12-04 | 2018-03-27 | 福建国光电子科技股份有限公司 | A kind of preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
| CN105513808B (en) * | 2015-12-04 | 2018-06-29 | 福建国光电子科技股份有限公司 | The preparation method of lamination sheet type polymer solid aluminum electrolytic capacitor |
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Open date: 20100901 |