CN101817120A - Laser processing method and device for non-through hole - Google Patents
Laser processing method and device for non-through hole Download PDFInfo
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- CN101817120A CN101817120A CN200910300598A CN200910300598A CN101817120A CN 101817120 A CN101817120 A CN 101817120A CN 200910300598 A CN200910300598 A CN 200910300598A CN 200910300598 A CN200910300598 A CN 200910300598A CN 101817120 A CN101817120 A CN 101817120A
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Abstract
The invention discloses a laser processing method and a laser processing device for a non-through hole. The method comprises the following steps of: focusing a pulse laser beam 4 emitted by a pulse laser device 401 on a to-be-perforated position of a workpiece 404 through a perforating optical system 403 to implement perforating; and when the pulse laser device 401 emits laser pulse, trigging a synchronous time delay module 405, trigging a shock wave photographing system 406 after certain time delay, photographing shock wave 407 produced by the interaction of the laser pulse and the workpiece 404, inputting photo data into a control computer 409 through an image acquisition module 408, analyzing and processing a shock wave photo by the control computer 409, obtaining the real-time depth of a processed hole by consulting processing reference data stored in the control computer 409, and judging whether the hole depth meets the requirement so as to control the pulse laser device 401 to continue or terminate perforating. The method and the device perform closed-loop control on the perforated hole depth during laser perforating so as to greatly improve the laser processing precision and efficiency of the non-through hole.
Description
Technical field
The present invention relates to a kind of pulse laser processing method, especially, relate to a kind of laser processing of non-through hole.
Background technology
Material punching technology has a wide range of applications in industry manufacture field.For institute's machining hole, whether penetrate the workpiece that is perforated according to it, can be divided into through hole (claim not only through hole) and non-through hole (but also claiming blind hole) two classes.For the blind hole that requires to process certain depth, traditional machine drilling mode can be set drilling depth easily, thereby is fixed the blind hole of hole depth, but can only realize that usually the aperture is little of about 100 microns, and hole depth/aperture is than the material boring less than 10: 1.
When require the aperture less than 100 microns or hole depth/aperture than greater than 10: 1 the time, adopt electron beam and laser boring mode to punch usually.But when adopting the laser boring mode, be difficult to more accurately set the punching degree of depth.Common way is: carry out technological experiment in formal first being processed, set up the rough punching umber of pulse or the corresponding relation of punching time and hole depth; Use the punching umber of pulse or the punching time of the working depth correspondence that requires to punch then; Because laser boring is repeatable relatively poor, after punching finishes, need the degree of depth in hole is checked.
For bigger hole, aperture, adopt diameter to stretch into inside, hole usually and measure blind hole depth less than the probe in aperture; For less hole, aperture, for example workpiece can only be cut along the bore dia direction usually less than 100 microns hole in the aperture, and the section in hole is measured hole depth, measures because the method belongs to destructive, can only spot-check blind hole depth.No matter above-mentioned any method all need detect hole depth once more after laser boring is finished, and has reduced the production efficiency of punching; And check through the later stage hole depth, can reject a part and not meet the hole that the punching degree of depth requires, increased percent defective.
In order to overcome above laser boring shortcoming, need in laser drilling process, monitor the punching state in real time, thereby improve drilling precision and reduce percent defective.Can only monitor the formation situation of through hole yet technical method in the past is many, introduce a kind of method and system that improves the processing quality of laser micro-machining system as patent 200680031610.1.It writes down the data relevant with machined parameters in process, the energy of formed indivedual through holes monitors and controls during to Laser Micro-Machining.
The present invention proposes a kind of closed-loop control drilling method of in laser drilling process, monitoring hole depth in real time, increase substantially non-through hole laser boring precision and reduce percent defective.
Summary of the invention
For precision and efficient and the minimizing percent defective that improves the processing of laser non-through hole, the invention provides a kind of laser processing and device of non-through hole.
The laser processing of a kind of non-through hole of the present invention is: the pulse laser beam that pulse laser sends is implemented punching via the punch position for the treatment of that the punching optical system focuses on workpiece.When pulse laser sends the punching laser pulse, the triggering synchronous time delay module, after it postpones through certain hour, triggering the shock wave photographic system takes pictures to the shock wave of punching laser pulse and workpiece interaction generation, picture data is via image capture module input control computer, control computer shock wave photo carries out analyzing and processing, obtain the real-time deep of machining hole with reference to the processing reference data of storing in the control computer, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
The time-delay of synchronizing relay module triggers the shock wave photographic system shock wave of punching laser pulse and workpiece interaction generation is taken pictures, and the selection of its trigger delay time will make the shock wave photographic system when taking pictures, and shock wave forms, and dissipates as yet.The shock wave photographic system can adopt high speed shadowgraph method or Mach-Zehnder optical interdferometer photographic process that the shock wave of punching laser pulse and workpiece interaction generation is taken pictures.Auxiliary exposure light source in the shock wave photographic system can adopt independently the auxiliary exposure laser instrument or from the pulse laser that described punching pulse laser sends beam split obtain.
Implementation step is: the first step, and at workpiece to be punched, set up the reference database of laser blast wave wavefront expansion radius and hole depth relation, and it is stored in the control computer; Second step, in pulse laser punching process, take the shock wave photo that punching laser pulse and workpiece interact and produce in real time, picture data is via image capture module input control computer, the control computer adopts special image recognition algorithm, identify the laser blast wave wavefront profile, obtain with the hole inlet is the laser blast wave wavefront expansion radius at center, and with reference to the processing reference data of storing in the control computer, obtain the real-time deep of machining hole, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
When setting up the reference database of laser blast wave wavefront expansion radius and hole depth relation, different depth hole pairing laser blast wave wavefront expansion radius should be got the repeatedly mean value of experiment.
The laser processing device of a kind of non-through hole of the present invention comprises: pulse laser, punching optical system, synchronizing relay module, shock wave photographic system, image capture module, control computer; The pulse laser beam that pulse laser sends is implemented punching via the punch position for the treatment of that the punching optical system focuses on workpiece; When pulse laser sends laser pulse, the triggering synchronous time delay module, it triggers the shock wave photographic system after postponing through certain hour; The shock wave photographic system is taken pictures to the shock wave of laser pulse and workpiece interaction generation, and picture data is via image capture module input control computer; Control computer shock wave photo carries out analyzing and processing, and with reference to the processing reference data of storing in the control computer, obtains the real-time deep of machining hole; The control computer judges whether hole depth reaches requirement, and the control laser instrument continues or the termination punching.
Can adopt high speed shadowgraph method or Mach-Zehnder optical interdferometer photographic process to make up the shock wave photographic system.Auxiliary exposure light source in the shock wave photographic system can adopt independently the auxiliary exposure laser instrument or from the pulse laser that described punching pulse laser sends beam split obtain.
Description of drawings
Fig. 1 adopts the captured laser blast wave photo of high speed shadowgraph method among the embodiment of the laser processing of a kind of non-through hole of the present invention and device.
Fig. 2 is the laser blast wave wavefront expansion radius related to the present invention and the schematic diagram of expansion time relation.
Fig. 3 is the cross sectional photograph and the pairing laser blast wave photo thereof in the different depth hole that measures among the embodiment of the laser processing of a kind of non-through hole of the present invention and device.
Fig. 4 is the laser processing of a kind of non-through hole of the present invention and a processing unit (plant) schematic diagram that embodiment adopted of device.
Fig. 5 is the laser processing of a kind of non-through hole of the present invention and the perforating device schematic diagram that another embodiment adopted of device.
Fig. 6 is the laser processing of a kind of non-through hole of the present invention and the perforating device schematic diagram that another embodiment adopted of device.
Fig. 7 adopts the captured laser blast wave photo of Mach-Zehnder optical interdferometer photographic process among the embodiment of the laser processing of a kind of non-through hole of the present invention and device.
Fig. 8 is the laser blast wave wavefront expansion radius that measures among the embodiment of the laser processing of a kind of non-through hole of the present invention and device and the datagram of its pairing hole depth.
Fig. 9 is that different-energy laser pulse generation shock wave wavefront pressure related to the present invention is attenuated to the curve map that equates required time with pressure of ambient gas.
The specific embodiment
Reach the method and apparatus that predetermined goal of the invention is adopted for further illustrating the present invention, below in conjunction with accompanying drawing and preferred embodiment, laser boring method that the present invention is proposed and device and specific implementation method, step and feature are elaborated.
High intensity laser pulse is radiated on the material surface, when power density greater than about 2 * 10
8W/cm
2The time, make the gasification of blasting property of material list surface layer, thereby produce detonation wave (LSDW) phenomenon that laser is supported.The material gas plasma of HTHP and air plasma form laser blast wave 101 from the outside rapid expanding in laser action district, and as shown in Figure 1, hemispherical laser blast wave wavefront 102 is that the center is expanded to ambient atmosphere with the laser action point.High temperature, high pressure, the high density of shock wave wavefront position have caused the discontinuous of air condition distribution, make the shock wave wavefront that ambient atmosphere and shock wave inside are separated.
The shock wave that laser produces can be described with the point source explosion ripple theory of Sedov-Taylor, and this theory is impacted the preceding propagation of wave-wave after can describing strong point source explosion.For the blast wave in the air ambient, because pressure of ambient gas p
1Be significantly smaller than the pressure p at shock wave wavefront place
2(p
1＜＜p
2), therefore can ignore pressure of ambient gas p
1Influence.Like this, can use the environmental gas density p
1, the blast wave ENERGY E
0The expansion of shock wave is described.Shock wave wavefront expansion radius r can be represented as the function of time t:
Wherein, t is for beginning to act as the time delay of start time with laser pulse; λ is the integral constant relevant with blast process, and for air, its numerical value is close to 1; E
0The energy of representing shock wave to comprise, it is less than pulsed laser energy; ρ
1Be environmental gas density (ρ
Air=1.2929kg/m
3); V is the dimension (value 3 when shock wave is expanded by sphere, value 2 when pressing the cylindrical channel expansion, value 1 during by planar expanded) of shock motion.Coefficient 2 in the molecule represents that shock wave is expanded by hemispherical herein, and therefore complete equivalent spherical ripple should comprise 2 times of energy to the hemispherical shock wave.
In an experiment related to the present invention, when having measured laser pulse and acting on the steel surface of the work, shock wave is through after the different expansion times, the expansion radius of its wavefront, as shown in Figure 2.Data relationship shown in Figure 2 is consistent with point source explosion ripple theory, with (1) formula data shown in Figure 2 is carried out match, obtains E
0=(380 ± 9) μ J.Experiment uses laser parameter to be: laser pulse width 5ps, optical maser wavelength 800nm, pulsed laser energy 650 μ J.
When using the pulse laser punching, at initial period, laser directly acts on surface of the work, and shock wave is that the center is expanded by sphere to ambient atmosphere with the laser action point; Along with the formation in laser ablation hole, laser transfers the bottom that directly acts on the ablation hole to, and at this moment, shock wave is at first pressed cylindrical channel at the hole intramedullary expansion, and behind the arrival surface of the work, transferring to the aperture is that the center is expanded by sphere.It is long more that Kong Yueshen, laser blast wave arrive the surface of the work required time in the hole; Laser blast wave is that the center is expanded by sphere with the aperture after arriving surface of the work in the hole, and according to (1) formula, shock wave wavefront expansion this moment radius r can be represented as:
Wherein, the v value is 3; t
1For laser blast wave arrives the surface of the work required time in the hole, according to (1) formula, getting the v value is 2, obtains:
Wherein, D is the degree of depth in hole;
By (2) (3) formula as seen, in the laser drilling process, a certain moment after the laser pulse effect is the degree of depth that the shock wave wavefront expansion radius at center depends on the hole with the aperture.
In another experiment related to the present invention, use pulse laser at Al
2O
3Punch on the ceramic workpiece, covering power is in the expansion situation of the shock wave that laser pulse produced after laser pulse begins to act on 500ns in different depth hole, as shown in Figure 3.Among Fig. 3, four photos in top are the shock wave photo, and four of belows are the cross sectional photograph in corresponding with it different depth hole.High-visible among the figure, along with the increase of hole depth, after laser pulse began to act on 500ns, the expansion radius of shock wave wavefront progressively reduced; After the hole connects workpiece, do not observe the shock wave image, shown in the figure of Fig. 3 upper right side.This experiment operation parameter is: laser pulse width 5ps, optical maser wavelength 800nm, pulsed laser energy 650 μ J, thickness of workpiece 400 μ m, camera exposure time 3ns.
Above-mentioned experiment explanation further directly perceived, in laser drilling process, a certain moment after the laser pulse effect is that the shock wave wavefront expansion radius at center depends on the degree of depth of being punched with the aperture.Thus, can set up the corresponding relation that the shock wave wavefront that uses different laser boring parameters that different materials is punched is expanded radius and hole depth by experiment; Then, in the punching process, measure the expansion radius that laser pulse produces the shock wave wavefront in real time, just can obtain pairing hole depth information, thereby the air exercise hole depth carries out real-time closed-loop control.
In order to realize the closed-loop control of the above-mentioned punching degree of depth, use following method and apparatus in some embodiments of the invention.As shown in Figure 4, the pulse laser beam 402 that sends of pulse laser 401 is implemented punching via the punch position for the treatment of that punching optical system 403 focuses on workpiece 404.When pulse laser 401 sends laser pulse, triggering synchronous time delay module 405, after it postpones through certain hour, trigger shock wave photographic system 406, shock wave 407 to laser pulse and workpiece 404 interaction generations is taken pictures, the selection of trigger delay time will make shock wave photographic system 406 when taking pictures, and shock wave 407 has formed, and does not dissipate as yet.Shock wave photographic system 406 captured picture datas are controlled computers 409 via image capture module 408 inputs, control computer 409 shock wave photos carry out analyzing and processing, and be stored in the process data of control in the computer 409 in advance and compare, obtain the real-time deep of machining hole with reference to the processing reference data of storing in the control computer, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.4011 is auxiliary exposure light beam or the measuring light of using in the shock wave photographic system 406 among Fig. 4.
The pattern in laser blast wave and internal plasma zone thereof and physical property can use multiple physical method and device to measure, as high-speed photography method, shadowing method, schlieren method, interferometric method, holographic interferometry, schlieren machine method etc.These methods are obtained and contained much information, and are highly sensitive, and because these methods are non-cpntact measurement, the shock wave effect that laser is produced is little, so the expansion process and the relevant parameter of measuring shock waves and internal plasma thereof played an important role.Wherein, shadowing method and schlieren method all are the character that plasma is studied in the variation of waveform after utilizing light wave by plasma, and promptly plasma exerts an influence to the phase place of incident light wave.Holography method can reflect the variation of transmitted light wave amplitude and phase place simultaneously, and can overcome the shortcoming of certainty of measurement to the high request of test macro element quality.Laser interferance method mainly is by measuring the character that variation of plasma refraction rate and plasma absorbing state reflect plasma.
In one embodiment of the invention, adopt the high speed shadowgraph method to make up shock wave photographic system 406, its device is shown in frame of broken lines among Fig. 5, comprise: false impulse laser instrument 501, collimation lens set 502, optical attenuator 503, imaging len 504, bandpass filter 505, diaphragm 506 and high-speed CCD camera 507.
The emergent light of false impulse laser instrument 501 is through collimation lens set 502, optical attenuator 503, shock wave 407 zones, be on the same optical axis with high-speed CCD camera 507, false impulse laser instrument 501 act as the flash lamp light source, sends auxiliary exposure light beam 5011 when 507 exposures of high-speed CCD camera.Shock wave 407 zones are by imaging len 504 imagings, through bandpass filter 505, behind the diaphragm 506, by high-speed CCD camera 507 records.The punching laser of bandpass filter 505 wiping out background light, scattering and the veiling glares such as luminescence of plasma that produce by laser action, diaphragm 506 is in the focal plane of imaging len 504, shock wave 407 regional locations become the object-image conjugate relation with high-speed CCD camera 507 positions with respect to imaging len, to overcome the error that diffraction effect is brought.
When pulse laser 401 sent laser pulse, triggering synchronous time delay module 405 was after it postpones through certain hour, triggering high-speed CCD camera 507 takes pictures, the selection of trigger delay time will make high-speed CCD camera 507 when taking pictures, and shock wave 407 has formed, and does not dissipate as yet; Synchronizing relay module 405 is after postponing through certain hour, produce another road triggering signal C1, trigger false impulse laser instrument 501 and send auxiliary exposure light beam 5011, the generation time of auxiliary exposure light beam 5011 was within the time for exposure of high-speed CCD camera 507.
Use laser blast wave image that the described device of present embodiment takes as shown in Figure 1, the expanded position of laser blast wave wavefront 102 is high-visible.
In other embodiment of the present invention, use shock wave photographic system 406 shown in the frame of broken lines among Fig. 5, but auxiliary exposure light beam 5011 is obtained by plane beam splitter beam split from punching pulsed laser beam 402.
In another embodiment of the present invention, adopt Mach-Zehnder optical interdferometer photographic process to make up shock wave photographic system 406, it installs shown in frame of broken lines among Fig. 6.This method requires lower to the probe source coherence, and is convenient to regulate.The Mach-Zehnder interferometer is made up of two plane beam splitters 604,606 and two plane mirrors 605,607, and the reflecting surface of above quaternary part is arranged to intimate parallel usually, and their center lays respectively on four angles of a parallelogram.Measured transparent substance is positioned in element 604,607 and 606 light paths of forming, and this moment, element 604,607 and 606 was called gage beam, and the light that transmits through gage beam is called measuring light 6011; By element 604,605,606 light paths of forming are called reference arm in addition, and the light that transmits through reference arm is called reference light 6010.If do not measure object, reference light 6010 and measuring light 6011 are called reference stripe owing to spectroscope 606 causes the interference fringe that an optical path difference that is caused by angle produces, and reference stripe is equidistant light and dark parallel stripes.When measured transparent substance was present in the measurement light path, optical path difference changed between measuring light 6011 and the reference light 6010, made the image of the interference fringe that produces change, and its change amount is relevant with the physical characteristic of testee.
When pulse laser 401 sends laser pulse, triggering synchronous time delay module 405, after it postpones through certain hour, triggering 507 pairs of interference figures of high-speed CCD camera takes pictures, the selection of trigger delay time will make high-speed CCD camera 507 when taking pictures, shock wave 407 has formed, and does not dissipate as yet.The optical time delay that optical time delay module 603 is produced will make when the interferometry pulse in the interferometric beams 608 enters the Mach-Zehnder optical interdferometer, shock wave 407 has formed, and do not dissipate, and be within the time for exposure of high-speed CCD camera 507 action time of interferometry pulse as yet.
Use laser blast wave image that the described device of present embodiment takes as shown in Figure 7, as seen from Figure 7, measuring light through shock wave 407 zones after, interference fringe is distorted, and can the clear expanded position of observing laser blast wave wavefront 102.The experiment parameter condition that Fig. 7 takes is: optical maser wavelength 1064nm, and laser pulse width 15ns, pulse energy 5mJ triggers photograph time 50ns, and the material that is perforated is an epoxy resin.
In other embodiment of the present invention, use shock wave photographic system 406 shown in the frame of broken lines among Fig. 6, but among blocking-up Fig. 6 in the Mach-Zehnder optical interdferometer by element 604,605, the 606 reference arm light paths of forming, for example on the light path of 604,605 of elements, place anti-dazzling screen, promptly can be used as the shadowgraph device and use.
In other embodiment of the present invention, use shock wave photographic system 406 shown in the frame of broken lines among Fig. 6, but use the pulse laser of another platform independent to produce interferometric beams 408.
In one embodiment of the invention, use device shown in Figure 5 on the steel workpiece, to process non-through hole.The pulse laser beam 402 that pulse laser 401 sends is via collimation lens set 508 collimation back incident polarization sheets 509, the attenuation that the anglec of rotation of adjusting polarizer 509 can be regulated laser beam 402 energy, the laser beam 402 after the energy attenuation is implemented punching by the punch position for the treatment of that condenser lens 5010 focuses on the workpiece.
False impulse laser instrument 501, collimation lens set 502, optical attenuator 503, imaging len 504, bandpass filter 505, diaphragm 506 and high-speed CCD camera 507 are formed the shock wave photographic system 406 that adopts the high speed shadowgraph method to make up.
When pulse laser 401 sends laser pulse, triggering synchronous time delay module 405, after it postpones through certain hour, triggering the shock wave 407 of 507 pairs of laser pulses of high-speed CCD camera and workpiece 404 interaction generations takes pictures, in addition, after synchronizing relay module 405 postpones through certain hour, produce another triggering signal C1, trigger false impulse laser instrument 501 and send auxiliary exposure light beam 5011, control computers 409 by the picture data that high-speed CCD camera 507 is taken via image capture module 408 inputs, control computer 409 adopts special image recognition algorithm, image outline extraction algorithm for example, identify the laser blast wave wavefront profile, obtain with the hole inlet is the laser blast wave wavefront expansion radius at center, processing reference data with reference to 409 storages in the control computer obtains the real-time deep of machining hole, and judges whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
In some embodiments of the invention, it is the dye laser of 633nm that auxiliary exposure laser instrument 501 adopts centre wavelength, the about 500ps of pulsewidth, and the centre wavelength of bandpass filter 505 is 633nm.It is the Nd:YAG laser instrument of 1064nm or 532nm that punching pulse laser 401 adopts centre wavelengths, or centre wavelength is the Nd:YLF laser instrument of 1047nm, or centre wavelength is the CO of 10.6mm
2Industrial laser commonly used such as laser instrument, preferably, selected optical maser wavelength should satisfy the material that is perforated has higher absorptivity to this wavelength condition.
In another embodiment, use device shown in Figure 6 on workpiece, to process non-through hole.The pulse laser beam 402 that pulse laser 401 sends is via collimation lens set 508 collimations, spectroscope 601 is told the interferometry laser beam 608 vertical with laser beam 402 from laser beam 402, see through the laser beam 402 incident polarization sheets 509 of spectroscope 601, the attenuation that the anglec of rotation of adjusting polarizer 509 can be regulated laser beam 402 energy, the laser beam 402 after the energy attenuation are focused on by condenser lens 5010 and treat punch position enforcement punching on the workpiece.
Plane mirror 602,605,607, plane beam splitter 604,606, optical time delay module 603, imaging len 504, bandpass filter 505, diaphragm 506 and high-speed CCD camera 507 are formed the shock wave photographic system 406 that adopts Mach-Zehnder optical interdferometer photographic process to make up.Optical time delay module 603 makes the pulsion phase in the interferometry laser beam 608 postpone certain hour than corresponding with it punching laser pulse.Shock wave 407 zones to be measured are arranged on the light path between the gage beam element 604,607, produce the interference figure that carries laser blast wave information through the measuring light 6011 and the reference light 6010 in shock wave 407 zones at the reflecting surface of plane beam splitter 606.
When pulse laser 401 sends laser pulse, triggering synchronous time delay module 405, it triggers 507 pairs of interference figures that are positioned at the reflecting surface of plane beam splitter 606 of high-speed CCD camera and takes pictures after postponing through certain hour.Control computers 409 by the picture data that high-speed CCD camera 507 is taken via image capture module 408 inputs, control computer 409 adopts special image recognition algorithm, image outline extraction algorithm for example, identify the laser blast wave wavefront profile, obtain with the hole inlet is the laser blast wave wavefront expansion radius at center, obtain the real-time deep of machining hole with reference to the processing reference data of 409 storages in the control computer, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
In one embodiment of the invention, the step of non-through hole Laser Processing is:
The first step at workpiece to be punched, is set up the reference database of laser blast wave wavefront expansion radius and hole depth relation, and it is stored in the control computer.
Use different laser pulse numbers or different laser action time, diverse location on workpiece to be processed punches, and obtains the non-through hole of a series of different depths, and the later stage is carried out micrometering to hole depth for convenience, preferably, the hole is centered close on same the straight line.
For the hole of using different laser pulse numbers or different laser action time on workpiece, to be processed, use the shock wave photographic system to take the shock wave image that acts on the laser pulse generation in this hole by last, obtain the pairing shock wave image in a series of different depths hole.
Cut workpiece along the bore dia direction, use optical microphotograph equipment that the section in hole is observed and obtain hole depth.Can use the section in observation by light microscope hole and measure hole depth, or use the microscope of band CCD or the cross sectional photograph that Electronic Speculum is taken the hole, and then the degree of depth of measured hole.
After the shock wave image was controlled computer via the image capture module input, the control computer adopted special image recognition algorithm, identifies the shock wave wavefront profile, and obtaining with the hole inlet is the laser blast wave wavefront expansion radius at center.
The depth data in the hole that laser pulse number that use is different or different laser action time are processed on workpiece laser blast wave wavefront expansion pairing with it radius data associates, set up the reference database of laser blast wave wavefront expansion radius and hole depth relation, and it is stored in the control computer.
Micro-the showing up of section in the different depth hole that obtains as stated above, and pairing shock wave photo is shown among Fig. 3 for example.The degree of depth in the hole that measures as stated above, and different depth hole pairing laser blast wave wavefront expansion radius is shown among Fig. 8.As can be seen from Figure 8, along with the increase of hole depth, laser blast wave wavefront expansion radius dullness reduces, and after hole depth reached 400 μ m, promptly forms through hole, laser blast wave wavefront expansion radius was reduced to zero.The punching parameter condition that obtains data shown in Figure 8 is: laser pulse width 5ps, optical maser wavelength 800nm, pulsed laser energy 650 μ J, camera exposure time 3ns, workpiece are that thickness is the Al of 400 μ m
2O
3Pottery.
The reference data that experiment is obtained is many more, be beneficial to more to improve the laser boring quality, but workload and processing cost also can increase thereupon.In order to improve precision, preferably, different depth hole pairing laser blast wave wavefront expansion radius should be got the repeatedly mean value of experiment.
Second step, in pulse laser punching process, take the shock wave photo that punching laser pulse and workpiece interact and produce in real time, the control computer obtains the real-time deep of machining hole by the described method of the first step, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
Wherein, in the first step, when setting up punching that database carries out and taking pictures operation, the emission of punching pulse laser with take pictures between time-delay with in second goes on foot actual add the pulse laser that punches man-hour launch and take pictures between time-delay identical.
In the punching process,, can measure the expansion radius that each laser boring pulse produces the laser blast wave wavefront if the control computer obtains the laser blast wave wavefront expansion needed time of radius less than punching laser pulse blanking time.Usually, incipient stage in punching does not measure the expansion radius of laser blast wave wavefront, when the punching degree of depth just begins to measure during near the desired punching degree of depth, the time that begins to measure by the previous experiments experience obtain, for example, learn that according to previous experiments the hole of the processing request degree of depth needs about about 1000 laser pulse, then can measure the expansion radius of laser blast wave wavefront since the 900th laser pulse.Satisfying under the prerequisite that drilling precision requires, the laser pulse of some is measured laser blast wave wavefront expansion radius one time at interval, the laser pulse number at institute interval can by the previous experiments experience obtain.The control computer can be controlled at the blanking time that when begins to measure laser blast wave wavefront expansion radius and measurement in the punching process.
Laser blast wave is expanded to ambient atmosphere with near-sonic speed, and therefore, the CCD camera exposure time is short more, can obtain laser blast wave image clearly more.But the CCD camera exposure time, the short more performance requirement to the CCD camera was high more, and the requirement of strength to the auxiliary exposure light source is high more simultaneously.Usually the time for exposure scope of CCD camera is less than 100ns, and preferred time for exposure scope is 100ps to 50ns, and preferred scope is 500ps to 20ns, takes into account cost and required precision, and most preferred scope is 1ns to 10ns.
Interact for avoiding being used for the plasma that punching pulse that shock wave takes a picture and preceding continuous punching pulse produced, being before avoiding the continuous punching plasma that pulse produced influence shock wave and takes a picture, and carries out the shock wave photograph again after the continuous punching plasma that pulse produced of Ying Zaiqian dissipates fully.It has been generally acknowledged that in the hundreds of microsecond after laser pulse and material effects, material plasma can dissipate fully.Therefore, the blanking time that is used for punching pulse that shock wave takes a picture and last punching pulse should be greater than this plasma resolution time, and preferred range is 500 μ s to 10s, and preferred scope is 1ms to 1s, detect effect and detection efficiency in order to take into account, most preferred scope is 1ms to 10ms.
Implement the laser processing of a kind of non-through hole of the present invention, require punching laser pulse intensity to be higher than the energy threshold of detonation wave (LSDW) phenomenon of material production laser support, different materials produces the energy threshold difference of detonation wave (LSDW) phenomenon of laser support, and for example: aluminium is 1.2 ± 0.2 * 10
8W/cm
2, copper is 1.5 ± 0.3 * 10
8W/cm
2, epoxy resin is 1.4 ± 0.3 * 10
8W/cm
2, usually, use power density greater than about 2 * 10
8W/cm
2Laser pulse.
In addition, laser pulse power density is determined by laser pulse width that also for co-energy laser pulse, pulsewidth is short more, and intensity is high more.Therefore, use the formation that helps laser blast wave than the laser pulse of short pulse duration.Simultaneously, pulsewidth is short more, and the LASER HEAT zone of influence is more little, can obtain higher punching machining accuracy.Implement the punching pulse width range that the laser processing of non-through hole of the present invention uses and be 1fs to 500ns, preferable range is 100fs to 100ns, and more preferably scope is 1ps to 10ns, takes into account cost and machining accuracy, and most preferred range is 10ps to 1ns.
In the laser processing of non-through hole of the present invention, in order effectively to obtain the laser blast wave image, when requiring the shock wave photographic system to take pictures, shock wave forms, and also do not dissipate, and can tell apparent shock wave wavefront, promptly require taking pictures of high-speed CCD camera constantly must be within the life period of shock wave.
From before research work obtain, use the laser pulse ablation aluminium matter workpiece of 500fs, pulse energy 500 μ J, behind laser action 2.2ns, just can observe shock wave profile clearly; Use the laser pulse ablation copper test specimen of 25ns, pulse energy 40mJ, after laser begins to act on 3ns, also can begin to observe the shock wave profile.Can think that thus to nanosecond laser pulses, under the discernmible situation of existing photographic method, shock wave will form for femtosecond in laser begins effect a few times nanosecond of back.After this, the laser plasma shock wave is constantly expanse in time, and when shock wave wavefront pressure was reduced to approximate ambient pressure, the expansion of shock wave was tending towards stopping, and the shock wave wavefront progressively dissipates.Required time when the shock wave wavefront pressure that Fig. 9 produces for the different-energy laser pulse that obtains of simulation is attenuated to and equates with pressure of ambient gas.As can be seen from the figure, for the pulse energy scope of 1mJ to 100mJ, shock wave wavefront pressure will be reduced to the ambient pressure value in several microseconds, and its expanse is tending towards stopping, and after this is difficult to detect shock wave wavefront clearly.Therefore, for femtosecond to the nanosecond width pulse, the trigger delay time that synchronizing relay module time-delay triggering shock wave photographic system is taken pictures should be after the laser pulse effect in 100ps to the 100 μ s scope, preferable range is 500ps to 10 μ s, more preferably scope is 1ns to 1 μ s, and most preferred range is 1ns to 200ns.
Claims (9)
1. the laser processing of a non-through hole, the pulse laser beam that pulse laser sends is implemented punching via the punch position for the treatment of that the punching optical system focuses on workpiece, when pulse laser sends the punching laser pulse, the triggering synchronous time delay module, after it postpones through certain hour, triggering the shock wave photographic system takes pictures to the shock wave of punching laser pulse and workpiece interaction generation, picture data is via image capture module input control computer, control computer shock wave photo carries out analyzing and processing, obtain the real-time deep of machining hole with reference to the processing reference data of storing in the control computer, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
2. a kind of laser processing of non-through hole according to claim 1, it is characterized in that implementation step is: the first step, at workpiece to be punched, set up the reference database of laser blast wave wavefront expansion radius and hole depth relation, and it is stored in the control computer; Second step, in pulse laser punching process, take the shock wave photo that punching laser pulse and workpiece interact and produce in real time, picture data is via image capture module input control computer, the control computer adopts special image recognition algorithm, identify the laser blast wave wavefront profile, obtain with the hole inlet is the laser blast wave wavefront expansion radius at center, and with reference to the processing reference data of storing in the control computer, obtain the real-time deep of machining hole, and judge whether hole depth reaches requirement, and then the control impuls laser instrument continues or the termination punching.
3. the laser processing of a kind of non-through hole as claimed in claim 1, it is characterized in that the shock wave photographic system can adopt high speed shadowgraph method or Mach-Zehnder optical interdferometer photographic process that the shock wave of punching laser pulse and workpiece interaction generation is taken pictures.
4. the laser processing of a kind of non-through hole as claimed in claim 1, it is characterized in that, the time-delay of synchronizing relay module triggers the shock wave photographic system shock wave of punching laser pulse and workpiece interaction generation is taken pictures, the selection of its trigger delay time will make the shock wave photographic system when taking pictures, shock wave forms, and does not dissipate as yet.
5. the laser processing of a kind of non-through hole as claimed in claim 1, it is characterized in that, the auxiliary exposure light source in the shock wave photographic system can adopt independently the auxiliary exposure laser instrument or from the pulse laser that described punching pulse laser sends beam split obtain.
6. the implementation step of the laser processing of a kind of non-through hole as claimed in claim 2, it is characterized in that, when setting up the reference database of laser blast wave wavefront expansion radius and hole depth relation, different depth hole pairing laser blast wave wavefront expansion radius should be got the repeatedly mean value of experiment.
7. the laser processing device of a non-through hole, it comprises: pulse laser, punching optical system, synchronizing relay module, shock wave photographic system, image capture module, control computer; The pulse laser beam that pulse laser sends is implemented punching via the punch position for the treatment of that the punching optical system focuses on workpiece; When pulse laser sends laser pulse, the triggering synchronous time delay module, it triggers the shock wave photographic system after postponing through certain hour; The shock wave photographic system is taken pictures to the shock wave of laser pulse and workpiece interaction generation, and picture data is via image capture module input control computer; Control computer shock wave photo carries out analyzing and processing, and with reference to the processing reference data of storing in the control computer, obtains the real-time deep of machining hole; The control computer judges whether hole depth reaches requirement, and the control laser instrument continues or the termination punching.
8. the laser processing device of a kind of non-through hole as claimed in claim 7 is characterized in that, adopts high speed shadowgraph method or Mach-Zehnder optical interdferometer photographic process to make up the shock wave photographic system.
9. the laser processing device of a kind of non-through hole as claimed in claim 7, it is characterized in that, the auxiliary exposure light source in the shock wave photographic system can adopt independently the auxiliary exposure laser instrument or from the pulse laser that described punching pulse laser sends beam split obtain.
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| WO2015196373A1 (en) * | 2014-06-24 | 2015-12-30 | 西门子公司 | Control method and system for utilizing laser pulse to process hole on hollow component |
| WO2015196374A1 (en) * | 2014-06-24 | 2015-12-30 | 西门子公司 | Control method and system for utilizing laser pulse to process hole on hollow component |
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| CN112525163A (en) * | 2020-11-23 | 2021-03-19 | 嘉兴聚林电子科技有限公司 | Punch piercing detection system, method, device, control device and storage medium |
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| CN112317978B (en) * | 2020-10-26 | 2021-11-09 | 中国科学院力学研究所 | Mobile defocusing method for multi-pulse laser drilling |
| CN112317978A (en) * | 2020-10-26 | 2021-02-05 | 中国科学院力学研究所 | A moving defocus method for multi-pulse laser drilling |
| CN112525163A (en) * | 2020-11-23 | 2021-03-19 | 嘉兴聚林电子科技有限公司 | Punch piercing detection system, method, device, control device and storage medium |
| CN112872629A (en) * | 2021-01-18 | 2021-06-01 | 华东师范大学 | Four-optical-wedge rotary-cut drilling method and system based on ultrafast laser pulse sequence |
| CN112872629B (en) * | 2021-01-18 | 2022-07-01 | 星控激光科技(上海)有限公司 | A method and system for four-optical wedge rotary drilling based on ultrafast laser pulse sequence |
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