CN101815400B - Divided type pad with surface mount elements - Google Patents
Divided type pad with surface mount elements Download PDFInfo
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- CN101815400B CN101815400B CN2009100104086A CN200910010408A CN101815400B CN 101815400 B CN101815400 B CN 101815400B CN 2009100104086 A CN2009100104086 A CN 2009100104086A CN 200910010408 A CN200910010408 A CN 200910010408A CN 101815400 B CN101815400 B CN 101815400B
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- pad
- chip component
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- bonding pad
- pads
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- 238000003466 welding Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
本发明提供了一种印刷电路板上贴片元件分割式焊盘，所要解决的技术问题是：贴片元器件任何一端的虚焊和漏焊可能会导致电路特性变化，从而引发安全事故。本发明的要点是：有贴片元件的焊盘，将贴片元件一个引脚的焊盘分割成两个以上、且相互绝缘的焊盘，形成分割式焊盘。本发明的的有益效果是：当发生虚焊或漏焊，负载回路与输入回路断开，使安全的可靠性大大提高，满足某些电子产品的安全要求。
The invention provides a segmented solder pad for patch components on a printed circuit board, and the technical problem to be solved is: the virtual soldering or missing soldering at any end of the chip component may lead to changes in circuit characteristics, thereby causing safety accidents. The gist of the present invention is: there is a bonding pad of the chip component, and the bonding pad of one pin of the chip component is divided into two or more bonding pads which are insulated from each other to form a divided bonding pad. The beneficial effect of the present invention is: when a virtual or missing welding occurs, the load circuit is disconnected from the input circuit, greatly improving the safety reliability and meeting the safety requirements of some electronic products.
Description
技术领域 technical field
本发明涉及印刷电路板中贴片元件的焊盘，具体是分割式焊盘。The invention relates to pads of chip components in printed circuit boards, in particular to split pads.
背景技术 Background technique
在一块印刷电路板上既有通孔插装元件的焊盘，也有贴片元件的焊盘，贴片元件的焊盘用于固定元器件，并使该元器件与外部连接，通常贴片元件的每个引脚对应PCB上的一个焊盘。贴片元器件任何引脚的虚焊或漏焊可能会导致电路特性变化，从而引发安全事故。例如图1是整体焊盘式分压电路图。如VI＝10V，R1＝R2，当R2虚焊或漏焊会使输出电压V0从5V变成10V，在铁路信号控制系统中，这种故障有可能导致一个原本红灯的输出变成绿灯，造成事故。On a printed circuit board, there are pads for through-hole plug-in components and pads for chip components. The pads for chip components are used to fix components and connect the components to the outside, usually chip components Each pin corresponds to a pad on the PCB. False soldering or missing soldering of any pin of SMD components may lead to changes in circuit characteristics, resulting in safety accidents. For example, Figure 1 is a circuit diagram of an integral pad type voltage divider. Such as VI=10V, R1=R2, when R2 is welded or leaked, the output voltage V0 will change from 5V to 10V. In the railway signal control system, this kind of failure may cause the output of an original red light to turn green. cause an accident.
发明内容 Contents of the invention
为克服已有技术的不足，本发明的目的在于提供一种将贴片元件的焊盘分割成两个(含两个，下同)以上的贴片元件分割式焊盘。In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a split pad of a chip component that divides the pad of the chip component into two or more (including two, the same below).
本发明的目的是这样实现的：有贴片元件的焊盘，其特征是：将贴片元件一个引脚的焊盘分割成两个以上、且相互绝缘的焊盘，形成分割式焊盘。本发明如无虚焊或漏焊，其效果与整体焊盘式相同，无区别；一旦所连接的元器件产生虚焊或漏焊，负载回路与输入回路断开，从而避免安全事故的发生。The object of the present invention is achieved in the following way: there is a bonding pad of a chip component, which is characterized in that: the bonding pad of one pin of the chip component is divided into more than two bonding pads which are insulated from each other to form a split bonding pad. If there is no false welding or missing welding, the effect of the present invention is the same as that of the integral pad type, and there is no difference; once the connected components produce virtual welding or missing welding, the load circuit is disconnected from the input circuit, thereby avoiding the occurrence of safety accidents.
与现有技术相比，本发明的有益效果是：当发生虚焊或漏焊，负载回路与输入回路断开，使安全的可靠性大大提高，满足某些电子产品的安全要求。Compared with the prior art, the beneficial effect of the present invention is: when a virtual or missing welding occurs, the load circuit is disconnected from the input circuit, greatly improving the safety reliability and meeting the safety requirements of some electronic products.
附图说明 Description of drawings
下面结合附图进一步说明本发明。Further illustrate the present invention below in conjunction with accompanying drawing.
图1是整体焊盘式分压电路图。Figure 1 is a circuit diagram of the overall pad type voltage divider.
图2是分割式焊盘分压电路图，也是铁路控制信号的电原理图。Figure 2 is a circuit diagram of a divided pad voltage divider, which is also an electrical schematic diagram of a railway control signal.
具体实施方式 Detailed ways
参见图2，将R2的每端的焊盘1分割成两个，形成两对分割式焊盘，其中一对与R1串联，另一对外接负载。元器件正常焊接时，图1与图2没有区别；如果R2产生虚焊和漏焊，负载回路与输入回路断开，输出电压V0变成0，如果此时，将V0的低电压产生的结果定义为红灯，就能在出现故障时，保证列车安全。Referring to Figure 2, the pad 1 at each end of R2 is divided into two to form two pairs of split pads, one pair is connected in series with R1, and the other is connected to a load. When the components are normally welded, there is no difference between Figure 1 and Figure 2; if R2 produces virtual welding and missing welding, the load circuit is disconnected from the input circuit, and the output voltage V0 becomes 0. If at this time, the result of the low voltage of V0 is Defined as a red light, it can ensure the safety of the train in the event of a failure.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100104086A CN101815400B (en) | 2009-02-20 | 2009-02-20 | Divided type pad with surface mount elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100104086A CN101815400B (en) | 2009-02-20 | 2009-02-20 | Divided type pad with surface mount elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101815400A CN101815400A (en) | 2010-08-25 |
| CN101815400B true CN101815400B (en) | 2012-06-20 |
Family
ID=42622471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100104086A Active CN101815400B (en) | 2009-02-20 | 2009-02-20 | Divided type pad with surface mount elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101815400B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766542A (en) | 1993-08-24 | 1995-03-10 | Matsushita Electric Ind Co Ltd | Printed board |
| US5877033A (en) * | 1997-03-10 | 1999-03-02 | The Foxboro Company | System for detection of unsoldered components |
| JP2008198687A (en) * | 2007-02-09 | 2008-08-28 | Onkyo Corp | Printed wiring board |
| CN201345778Y (en) * | 2009-02-20 | 2009-11-11 | 沈阳铁路信号工厂 | Paster element segmented bonding pad |
-
2009
- 2009-02-20 CN CN2009100104086A patent/CN101815400B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766542A (en) | 1993-08-24 | 1995-03-10 | Matsushita Electric Ind Co Ltd | Printed board |
| US5877033A (en) * | 1997-03-10 | 1999-03-02 | The Foxboro Company | System for detection of unsoldered components |
| JP2008198687A (en) * | 2007-02-09 | 2008-08-28 | Onkyo Corp | Printed wiring board |
| CN201345778Y (en) * | 2009-02-20 | 2009-11-11 | 沈阳铁路信号工厂 | Paster element segmented bonding pad |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101815400A (en) | 2010-08-25 |
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