CN101814574A - Light emitting diode base plate heat radiation structure and manufacture method thereof - Google Patents

Abstract

A light-emitting diode circuit board heat dissipation structure, including a circuit board and a light-emitting diode connected to a conductive circuit layer circuit in the circuit board, a heat-dissipating bottom plate is attached to the lower surface of the circuit board, and a through hole is opened at the position where the light-emitting diode is installed on the circuit board to emit light. The diode is pasted on the inner surface of the bottom plate through the through hole. This structure eliminates the damage to the circuit board itself and the negative impact of subsequent manufacturing and processing in the prior art by adding a heat-conducting bottom plate. The light-emitting diode can be directly attached to the heat-dissipating bottom plate, so that the entire substrate has a higher thermal conductivity. The emission effect and heat dissipation effect are excellent, and it does not affect the production and processing technology of the existing circuit board. The base plate can be processed separately. production cost.

Description

A light-emitting diode substrate heat dissipation structure and manufacturing method thereof

technical field

The invention relates to an improvement of a heat dissipation structure of a substrate.

Background technique

In the past, light-emitting diodes were developed to be installed on aluminum substrates as lighting sources. Especially in recent years, as the thermal conductivity of aluminum substrates has gradually increased, the driving current of light-emitting diodes can use a larger current. Furthermore, in order to reduce the volume of the lighting source, the integration degree of the light emitting diodes mounted on the aluminum substrate is originally higher. However, under the higher driving current of the highly integrated lighting source, the light-emitting diode will relatively generate more heat, which will affect other performances due to overheating, and even cause damage to the light-emitting diode. Please refer to Figure 1.

In order to further increase the thermal conductivity of the aluminum substrate and reduce its thermal resistance, the aluminum plate at the bottom is exposed by milling and the light-emitting diodes are directly mounted on the aluminum plate of the aluminum substrate. However, due to the poor reflection effect and unevenness of the light-emitting diode installation surface of the aluminum plate, it is still limited in improving the brightness of the lighting source. Please refer to Figure 2.

In order to solve the problem of poor reflection effect and unevenness of the aluminum plate at the bottom above, a scheme of silver-plating the conductive circuit layer contained on the aluminum substrate and the aluminum plate is proposed, but because the conductive circuit layer is silver-plated, the light-emitting diodes drawn out The welding of the gold wire on the silver-plated conductive circuit layer has the problem of weak welding.

In order to solve the above problem of weak welding, it is proposed to plate silver on the aluminum plate to improve the reflection effect, and to plate the conductive circuit layer with gold to solve the problem of weak welding. However, due to the difficulty of this process technology, the aluminum substrate with this structure has not been widely used. use.

Therefore, how to design a light-emitting diode substrate heat dissipation structure with simple manufacturing process and good heat dissipation effect is a major problem to be solved by engineers and technicians in the field.

Contents of the invention

One of the technical problems to be solved by the present invention is to overcome the deficiencies of the prior art and provide a light emitting diode substrate heat dissipation structure with good heat dissipation effect.

In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions to realize:

A light-emitting diode circuit board heat dissipation structure, including a circuit board and a light-emitting diode connected to a conductive circuit layer circuit in the circuit board, a heat-dissipating bottom plate is attached to the lower surface of the circuit board, and a through hole is opened at the position where the light-emitting diode is installed on the circuit board to emit light. The diode is pasted on the inner surface of the bottom plate through the through hole.

As an improvement to the above solution, the base plate is a sheet material with good heat dissipation, and the surface of the base plate on which the light-emitting diodes are attached is processed into a smooth surface that facilitates light reflection.

In order to ensure the stability of the entire structure and a good heat dissipation effect, the lower surface of the circuit board and the bottom plate are tightly bonded by a thermally conductive adhesive.

Wherein, the circuit board is an aluminum substrate or a glass fiber circuit board. The aluminum substrate is composed of a white oil layer on the upper surface of the wire circuit layer and an insulating layer/aluminum substrate sequentially located on the lower surface of the wire circuit layer, and the bottom plate is closely attached to the lower surface of the aluminum substrate. The glass fiber circuit board is composed of a white oil layer on the upper surface of the wire circuit layer and an insulating layer made of glass fiber material on the lower surface of the wire circuit layer, and the bottom plate is closely attached to the lower surface of the insulating layer.

This structure eliminates the damage to the circuit board itself and the negative impact of subsequent manufacturing and processing in the prior art by adding a heat-conducting bottom plate. The light-emitting diode can be directly attached to the heat-dissipating bottom plate, so that the entire substrate has a higher thermal conductivity. The emission effect and heat dissipation effect are excellent.

Another technical problem to be solved by the present invention is to provide a method for manufacturing a light-emitting diode substrate heat dissipation structure with a simple manufacturing method.

The method steps are:

a. Process the bottom plate according to the size of the circuit board and the distribution of light-emitting diodes, so that the bonding surface of the bottom plate and the circuit board is processed to a smooth surface;

b. Process the circuit board according to the distribution of the light-emitting diodes, and open through holes for accommodating the light-emitting diodes at the position where the light-emitting diodes are pre-installed on the circuit board;

c. Attach the light-emitting diode to the smooth surface of the base plate at the position corresponding to the through hole, and use a heat-conducting adhesive to attach the smooth surface of the base plate to the lower surface of the circuit board;

d. Solder the LED power line to the conductive circuit layer of the circuit board.

Compared with the existing circuit board structure with high heat dissipation effect, this method does not affect the production and processing technology of the existing circuit board, and the bottom plate of the main heat dissipation component can be processed separately, and the flatness and smoothness of the bottom plate are easier to ensure, which greatly The processing steps are simplified, the manufacturing difficulty is reduced, and thus the production cost is also reduced. The heat dissipation structure of the light-emitting diode circuit board manufactured by the method also makes it easier for the heat of the light-emitting diode to be conducted to the base plate for dissipation, and the light reflection effect of the light-emitting diode is also better.

Description of drawings

Accompanying drawing 1 is a schematic diagram of the heat dissipation structure of an existing LED circuit board;

Accompanying drawing 2 is the schematic diagram of heat dissipation structure of another existing light-emitting diode circuit board;

Accompanying drawing 3 is a structural schematic diagram of Embodiment 1 of the present invention;

Accompanying drawing 4 is the structural schematic diagram of embodiment 2 of the present invention.

Detailed ways

In order to facilitate the understanding of those skilled in the art, the structural principle of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings:

Embodiment 1: As shown in Figure 3, the heat dissipation structure of the light-emitting diode circuit board disclosed in this embodiment is an improvement on the heat dissipation structure of the conventional light-emitting diode aluminum substrate, which is consistent with the conventional aluminum substrate. The aluminum substrate 1 consists of White oil layer 12 , conductive circuit layer 11 , insulating layer 13 and aluminum substrate 14 .

Compared with the existing aluminum substrate, the biggest improvement of the aluminum substrate in this embodiment is that the bottom of the aluminum substrate 14 is closely pasted with a heat-dissipating base plate 3 through the heat-conducting adhesive 16, and the material of the base plate 3 can be good for heat dissipation The metal, silicon or ceramics can also be used. A through hole 15 is opened at the position where the light emitting diode 2 is installed on the substrate 14 , the light emitting diode 2 is closely attached to the surface of the bottom plate 3 through the through hole 15 , and the power line of the light emitting diode 2 is connected to the internal circuit of the conductive circuit layer 11 . In order to increase the reflective effect of the bottom plate 3, the position where the light-emitting diode 2 is pasted on the bottom plate 3 is processed to a smooth surface. Of course, for the convenience of processing, the bonding surface of the entire bottom plate and the substrate 14 can also be processed to a smooth surface.

Obviously, when making the heat dissipation structure of the light-emitting diode circuit board described in this embodiment, it is not necessary to change the structure of the existing aluminum substrate 1. It is only necessary to open a through-hole 15 at the position where the light-emitting diode is installed on the aluminum substrate 1, and then the light-emitting diode is passed through. On the bottom plate 3, then stick the pre-processed bottom plate 3 on the lower surface of the aluminum substrate 1, and connect the power line of the light emitting diode to the corresponding wire in the conductive circuit layer.

For specific production, the following steps can be used:

a. Process the bottom plate according to the size of the circuit board and the distribution of light-emitting diodes, so that the bonding surface of the bottom plate and the circuit board is processed to a smooth surface;

b. Process the circuit board according to the distribution of the light-emitting diodes, and open through holes for accommodating the light-emitting diodes at the position where the light-emitting diodes are pre-installed on the circuit board;

c. Attach the light-emitting diode to the smooth surface of the base plate at the position corresponding to the through hole, and use a heat-conducting adhesive to attach the smooth surface of the base plate to the lower surface of the circuit board;

d. Solder the LED power line to the conductive circuit layer of the circuit board.

It can be seen that the fabrication and installation of this structure are very convenient in process, low in difficulty, good in heat dissipation effect, and low in cost.

Embodiment 2: As shown in accompanying drawing 4, the structural principle of this embodiment is consistent with that of Embodiment 1, the difference is that the glass fiber circuit board in the circuit board is improved, and the glass fiber circuit board 1 is from top to bottom The lower layer includes a white oil layer 12, a conductive circuit layer 11 and an insulating layer 13 in sequence, which is consistent with the improvement in the embodiment. A heat dissipation bottom plate 3 is also closely attached to the bottom of the insulating layer 13 through a heat-conducting adhesive 16. The light-emitting diode 2 is preset in the The through holes on the glass fiber circuit board 1 are closely attached to the base plate 3 , and the power lines of the LEDs 2 are also connected to the wiring layer 11 .

Similarly, the following steps can be used for specific production:

a. Process the bottom plate according to the size of the circuit board and the distribution of light-emitting diodes, so that the bonding surface of the bottom plate and the circuit board is processed to a smooth surface;

b. Process the circuit board according to the distribution of the light-emitting diodes, and open through holes for accommodating the light-emitting diodes at the position where the light-emitting diodes are pre-installed on the circuit board;

c. Attach the light-emitting diode to the smooth surface of the base plate at the position corresponding to the through hole, and use a heat-conducting adhesive to attach the smooth surface of the base plate to the lower surface of the circuit board;

d. Solder the LED power line to the conductive circuit layer of the circuit board.

It can be seen that the fabrication and installation of this structure are very convenient in process, low in difficulty, good in heat dissipation effect, and low in cost.

The above-mentioned embodiments are only preferred implementation manners of the present invention, and besides this, the present invention may also have other implementation manners. That is to say, on the premise of not departing from the concept of the present invention, any obvious replacement shall fall within the protection scope of the present invention.

Claims (7)

1. A light-emitting diode circuit board heat dissipation structure, comprising a circuit board (1) and a light-emitting diode (2) connected to a circuit of a conductive circuit layer (11) in the circuit board, characterized in that: a heat dissipation device is closely attached to the circuit board lower surface The base plate (3) is provided with a through hole (15) at the position where the light emitting diode is installed on the circuit board, and the light emitting diode is pasted on the inner surface of the base plate through the through hole. 2 . The heat dissipation structure of the LED substrate according to claim 1 , wherein the base plate is a sheet material with good heat dissipation, and the surface of the base plate pasted with the LEDs is processed into a smooth surface that facilitates light reflection. 3 . 3 . The LED substrate heat dissipation structure according to claim 2 , wherein the lower surface of the circuit board and the base plate are closely bonded by a heat-conducting adhesive. 4 . 4 . The light emitting diode substrate heat dissipation structure according to claim 1 , wherein the circuit board is an aluminum substrate or a glass fiber circuit board. 5. The light-emitting diode substrate heat dissipation structure according to claim 4, characterized in that: the aluminum substrate is composed of a white oil layer (12) positioned on the upper surface of the wire circuit layer and an insulating layer (13) sequentially positioned on the lower surface of the wire circuit layer ), an aluminum base plate (14), the base plate is closely attached to the lower surface of the aluminum base plate. 6. The light-emitting diode substrate heat dissipation structure according to claim 4, characterized in that: the glass fiber circuit board is composed of a white oil layer (12) located on the upper surface of the wire circuit layer and a glass fiber layer located on the lower surface of the wire circuit layer. The insulating layer (13) made of material is composed, and the bottom plate is closely attached to the lower surface of the insulating layer. 7. A method for manufacturing a heat dissipation structure for a light-emitting diode circuit board according to claim 1, wherein the steps are: a. Process the bottom plate according to the size of the circuit board and the distribution of light-emitting diodes, so that the bonding surface of the bottom plate and the circuit board is processed to a smooth surface; b. Process the circuit board according to the distribution of the light-emitting diodes, and open through holes for accommodating the light-emitting diodes at the position where the light-emitting diodes are pre-installed on the circuit board; c. Attach the light-emitting diode to the smooth surface of the base plate at the position corresponding to the through hole, and use a heat-conducting adhesive to attach the smooth surface of the base plate to the lower surface of the circuit board; d. Solder the light-emitting diode wires in the conductive circuit layer circuit of the circuit board.

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