CN101803477A - Electronic component package and method for manufacturing the same - Google Patents

Abstract

The electronic component package comprises: a 1 st wiring board, an electronic component mounted on an upper surface of the 1 st wiring board, an adhesive layer provided on the upper surface of the 1 st wiring board, a 2 nd wiring board provided on an upper surface of the adhesive layer, and a metal cover covering the upper surface of the 1 st wiring board, the 2 nd wiring board, and the electronic component. The 2 nd wiring board is smaller than the 1 st wiring board. In the electronic component package, even if strain is generated on the metal cover, unnecessary stress is not generated on the electronic component.

Description

Electronic component package and manufacturing method thereof

technical field

The present invention relates to an electronic component package (package, package) in which electronic components such as coils and semiconductors are mounted on a wiring board (wiring board, wiring board) and a manufacturing method thereof.

Background technique

In recent years, with the miniaturization and high-performance of electronic equipment such as mobile phones, in order to prevent electronic components such as coils and semiconductors from being affected by external electric fields and/or magnetic fields, or to prevent Electric fields and/or magnetic fields do not affect surrounding circuits, and it is necessary to shield these multiple electronic components together.

FIG. 22A is an exploded perspective view of a conventional electronic component package 107 shown in Patent Document 1. As shown in FIG. FIG. 22B is a cross-sectional view of electronic component package 107 .

As shown in FIG. 22A , a plurality of electronic components 103 are mounted on a printed wiring board 104 (printed wiring board). A ground pad 105 (aspad) is formed at an end portion of the printed wiring board 104 . As shown in FIG. 22B , the end portion 102 of the metal cover 101 is placed and fixed on the ground pad 105 of the printed wiring board 104 by solder 106 to form an electronic component package 107 . The metal cover 101 is also fixed on the top surface (patio surface) of the tallest electronic component 103 by solder 106 to control the thickness of the electronic component package 107 .

In the conventional electronic component package 107 , in order to adjust the height of the electronic component package 107 or secure the strength of the package 107 , it is necessary to mount the tallest electronic component 103 at approximately the center of the electronic component package 107 . The strain generated by the thermal expansion of the metal cover 101 or the like is directly transmitted to the electronic component 103 fixed to the metal cover 101 . This strain generates stress in the soldered portion of the electronic component 103 and may affect the reliability of the electronic component 103 .

In addition, in the conventional electronic component package 107 , the variation in the thickness of the electronic component 103 and/or the variation in the height of the mounted electronic component 103 affect the variation in the height of the metal cover 101 . Furthermore, when the height of the electronic component 103 becomes higher than a design value, a gap will generate|occur|produce between the end part 102 of the metal cover 101, and the ground land 105 of the printed wiring board 104. FIG. This gap affects the shielding properties of the metal cover 101 and may reduce the mounting strength of the metal cover 101 .

In addition, in conventional electronic component package 107 , electronic component 103 can only be mounted on one side of printed wiring board 104 .

FIG. 23 is a perspective view of another conventional electronic component package 301 described in Patent Document 2. As shown in FIG. Electronic components 303 such as coils and semiconductors mounted on the surface of the substrate 302 are sealed by a sealing body 304 made of insulating resin such as epoxy resin. A nickel plating layer 305 is formed on the surface of the sealing body 304 .

In order to improve the productivity of the conventional electronic component package 301 , it is necessary to increase the area of the substrate 302 and to manufacture a plurality of electronic component packages 301 at once. The plurality of electronic component packages 301 are divided into predetermined sizes by dicing.

When the area of the substrate 302 becomes larger, the curvature and waviness of the substrate 302 become larger, and the thickness of the seal 304 inside the substrate 302 tends to be uneven. Liquid insulating resin may leak to the outside from the surface of the substrate 302 .

When the liquid insulating resin filled in the substrate 302 is heated and cured for several hours, if the large substrate 302 is not properly held horizontally, the thickness of the seal 304 will be uneven, and the liquid insulating resin will The case where the surface of the substrate 302 leaks to the outside.

In order to fill and cure the insulating resin to be the seal 304 on the plurality of substrates 302 , the dryer needs to have many shelves. However, it is actually difficult to keep all these shelves horizontal, and the shelves themselves may be inclined or deformed when heated.

When heated, the substrate 302 itself may be deformed or bent due to thermal expansion, thereby causing uneven thickness of the seal 304 .

In addition, in the electronic component package 301 , a step of forming the nickel plating layer 305 for obtaining a shielding effect is required, and the number of man-hours increases. In addition, the cost increases due to the step of sealing the electronic component 303 with an insulating resin such as epoxy resin used as the seal 304 .

Furthermore, in the conventional electronic component package 301, the large board|substrate 302 is cut|disconnected in two directions by punching, and the time required for punching and/or the cost by equipment becomes large.

Patent Document 1: JP-A-2003-309397

Patent Document 2: Japanese Unexamined Patent Publication No. 11-163583

Contents of the invention

The electronic component package includes: a first wiring board, an electronic component mounted on the upper surface of the first wiring board, an adhesive layer provided on the upper surface of the first wiring board, and an adhesive layer provided on the upper surface of the adhesive layer. The second wiring board, and the metal cover covering the upper surface of the first wiring board, the second wiring board and electronic components. The second wiring board is smaller than the first wiring board.

In this electronic component package, even if strain is generated on the metal cover, unnecessary stress is not generated on the electronic component.

Description of drawings

FIG. 1A is an exploded perspective view of the electronic component package in Embodiment 1. FIG.

FIG. 1B is a perspective view of the electronic component package in Embodiment 1. FIG.

FIG. 1C is a perspective view of another metal cover in Embodiment 1. FIG.

FIG. 2 is a bottom perspective view of the electronic component package in Embodiment 1. FIG.

3 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 1. FIG.

4 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 1. FIG.

5 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 1. FIG.

6A is an exploded perspective view of the electronic component package in Embodiment 2. FIG.

6B is a perspective view of the electronic component package in Embodiment 2. FIG.

6C is a perspective view of another metal cover in Embodiment 2. FIG.

7A is a bottom perspective view of the electronic component package in Embodiment 2. FIG.

7B is a bottom perspective view of another electronic component package in Embodiment 2. FIG.

FIG. 8 is a perspective view showing a method of manufacturing the electronic component package shown in FIG. 6B .

9 is an exploded perspective view of the electronic component package in Embodiment 3 of the present invention.

10A is a perspective view of an electronic component package in Embodiment 3. FIG.

10B is a bottom perspective view of the electronic component package in Embodiment 3. FIG.

FIG. 11 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 3. FIG.

12 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 3. FIG.

FIG. 13A is a perspective view of an electronic component package in Embodiment 4 of the present invention.

Fig. 13B is a cross-sectional view taken along line 13B-13B of the electronic component package shown in Fig. 13A .

14 is a bottom perspective view of the electronic component package in Embodiment 4. FIG.

15 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

16 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

17 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

18 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

19A is a cross-sectional view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

19B is a cross-sectional view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

20 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

21 is a perspective view showing a method of manufacturing the electronic component package in Embodiment 4. FIG.

22A is an exploded perspective view of a conventional electronic component package.

22B is a cross-sectional view of a conventional electronic component package.

FIG. 23 is a perspective view of another conventional electronic component package.

Symbol Description

112: metal cover

112A: top face

112B: side part (first side part)

112C: side part (the first side part)

113: Wiring board (1st wiring board)

113C: end (first end)

113D: end (second end)

114: Wiring board (2nd wiring board)

115: Adhesive layer (first adhesive layer) (adhesive layer, adhesive layer)

116: Electronic component (1st electronic component)

120A: Through hole

154: Wiring board (3rd wiring board)

155: Adhesive layer (second adhesive layer)

212: metal cover

212A: top face (celestial face)

212B: side part (first side part)

212C: side part (the first side part)

213: Wiring board (1st wiring board)

213C: end (first end)

213D: end (second end)

214: Wiring board (2nd wiring board)

215: Adhesive layer (first adhesive layer)

216A: Electronic component (1st electronic component)

216B: Electronic component (second electronic component)

220A: Through hole

254: Wiring board (3rd wiring board)

255: Adhesive layer (second adhesive layer)

264: Wiring board (4th wiring board)

265: Adhesive layer (third adhesive layer)

274: Wiring board (5th wiring board)

275: Adhesive layer (4th adhesive layer)

312: fill layer

313: Wiring board (1st wiring board)

313C: end (first end)

313D: end (second end)

314: Wiring board (2nd wiring board)

315: Adhesive layer (first adhesive layer)

316: Electronic components

320A: through hole

323: Filling material

354: Wiring board (3rd wiring board)

355: Adhesive layer (second adhesive layer)

412: metal cover

412A: top face

412B: side part (first side part)

412C: side part (the first side part)

413: Wiring board (1st wiring board)

413C: end (first end)

413D: end (second end)

414: Wiring board (2nd wiring board)

415: Adhesive layer (first adhesive layer)

416A: Electronic component (1st electronic component)

416B: Electronic component (second electronic component)

429A: Through hole

453: Wiring board (7th wiring board)

454: Wiring board (3rd wiring board)

455: Adhesive layer (second adhesive layer)

464: Wiring board (4th wiring board)

465: Adhesive layer (fifth adhesive layer)

474: Wiring board (5th wiring board)

475: Adhesive layer (6th adhesive layer)

485: Adhesive layer (third adhesive layer)

495: Adhesive layer (4th adhesive layer)

1112B: side (1st side)

1212B: side (1st side)

1412B: side (1st side)

1112C: side (2nd side)

1212C: side (second side)

1412C: side (2nd side)

Detailed ways

(Embodiment 1)

FIG. 1A is an exploded perspective view of electronic component package 111 in Embodiment 1. FIG. The metal cover 112 is formed by pressing a metal plate and bending it into a U-shape, and has claws 118 . Specifically, the metal cover 112 has a top surface 112A, side surfaces 112B, 112C, and claws 118 . The top surface portion 112A has a rectangular shape, and has mutually opposite sides 1112B, 1112C and mutually opposite sides 1112D, 1112E. The side parts 112B and 112C extend downward from the sides 1112B and 1112C of the top part 112A, respectively. The claw 118 extends downward from the side 1112D. The claws 118 are used to position the metal cover 112 when fixing the metal cover 112 to the wiring board 113 , and are formed in the form of small protrusions or by bending a part of the metal plate. The claw 118 may also have a hook shape.

A plurality of electronic components 116 are mounted on upper surface 113A of wiring board 113 . The electronic component 116 is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

Wiring patterns and/or solder resists are provided on the upper surface 113A and the lower surface 113B of the wiring board 113 . Wiring patterns and/or solder resists are provided on the upper surface 114A and the lower surface 114B of the wiring board 114 . Wiring patterns and/or solder resists are provided on the upper surface 154A and the lower surface 154B of the wiring board 154 . Electronic component 116 has external electrode portions connected to upper surface 113A of wiring board 113 by soldering. The wiring boards 113, 114, and 154 are printed wiring boards, but may be other wiring boards.

Wiring board 114 is fixed to upper surface 113A at end 113C of wiring board 113 via adhesive layer 115 . That is, an adhesive layer 115 is provided on the upper surface 113A at the end portion 113C of the wiring board 113 , and the wiring board 114 is fixed to the adhesive layer 115 . Wiring board 154 is fixed to upper surface 113A at end 113D on the opposite side to end 113C of wiring board 113 via adhesive layer 155 . That is, an adhesive layer 155 is provided on the upper surface 113A at the end portion 113D of the wiring board 113 , and the wiring board 154 is fixed to the adhesive layer 155 . The wiring boards 114, 154 extend parallel to each other.

FIG. 1B is a perspective view of the electronic component package 111 . Top surface 112A of metal cover 112 is located on upper surface 114A of wiring board 114 and upper surface 154A of wiring board 154 , and covers upper surface 113A of wiring board 113 and electronic components 116 .

The metal cover 112, that is, the side portions 112B, 112C has a height 117B. Height 117B is preferably equal to or less than the total thickness of wiring boards 113 and 114 and adhesive layer 115 117C. In addition, it is preferable to set the height of electronic component 116 from upper surface 113A of wiring board 113 to be smaller than the height of upper surfaces 114A and 154A of wiring boards 114 and 154 from upper surface 113A. This prevents the electronic component 116 from coming into direct contact with the metal cover 112 .

As shown in FIG. 1B , by bringing claws 118 formed on metal cover 112 into contact with wiring board 114 , displacement of metal cover 112 can be prevented, and metal cover 112 can be easily and accurately positioned relative to wiring board 114 .

By enlarging the claw 118, the shielding effect by the claw 118 can be obtained. FIG. 1C is a perspective view of another metal cover 612 in the first embodiment. In FIG. 1C, the same parts as those in FIG. 1A are denoted by the same reference numerals, and description thereof will be omitted. Metal cover 612 replaces claw 118 of metal cover 112 shown in FIG. 1A , and has side 112D extending downward from side 1112D of top surface 112A and side 112E extending downward from side 1112E opposite side 1112D. The side part 112D is connected to the side parts 112B and 112C, and the side part 112E is connected to the side parts 112B and 112C. The side parts 112D and 112E cover the side surfaces of the wiring boards 114 and 154 and the side surfaces of the adhesive layers 115 and 155 , and can effectively shield the electronic component 116 .

In this way, the electronic component package 111 is a small Chip Size/Scale Package (CSP) (chip scale package) capable of shielding a plurality of electronic components 116 such as semiconductors.

FIG. 2 is a bottom perspective view of the electronic component package 111 . A plurality of electrodes 119B are provided on the lower surface 113B of the wiring board 113 . The electrodes 119B are connected to a motherboard (printed board, motherboard), and the electronic component package 111 is mounted on the motherboard. The multiple electrodes 119B shown in FIG. 2 are Land Grid Array (LGA) (grid soldering station array) or Fine Pitch LGA (FLGA) (narrow pitch grid soldering station array). In addition, according to the application, the plurality of electrodes 119B can also be Ball Grid Array (BGA) (grid solder ball array (package)) and/or Fine Pitch BGA (FBGA). The electrodes 119B may be formed of copper foil and/or solder resist formed on the lower surface 113B of the wiring board 113 to increase the mounting density of the electronic component package 111 .

The wiring board 113 is formed of a multilayer wiring board such as glass epoxy resin (Glass Epokishi resin) or a multilayer board using a built-up technology, so that the lower surface 113B of the electronic component package 111 can be made to correspond to High density installation.

By providing wiring boards 114 and 154 smaller than wiring board 113 , it is possible to increase the area where electronic component 116 can be mounted on upper surface 113A of wiring board 113 .

In electronic component package 111 , wiring boards 114 , 155 are respectively provided on adhesive layers 115 , 155 provided on upper surface 113A of wiring board 113 . By arranging the metal cover 112 on the upper surfaces 114A, 154A of the wiring boards 114, 154, the height of the metal cover 112 can be controlled with high precision, so that the thickness unevenness of the electronic component package 111 can be suppressed, and even thinner parts The electronic component package 111 is mounted. Metal cover 112 is fixed to wiring boards 114 , 154 provided on opposite ends 113C, 113D of wiring board 113 . With this structure, the metal cover 112 can be made parallel to the upper surface 113A of the wiring board 113 with high precision, and the rigidity of the electronic component package 111 can be improved. Moreover, with this structure, the metal cover 112 can be easily fitted and fixed to the wiring boards 114 and 154 by an automatic machine, and the productivity of the electronic component package 111 can be improved.

The metal cover 112 is formed by bending a metal plate into a U-shape. Height 117B of metal cover 112 (side surfaces 112B, 112C) is equal to or smaller than height 117C of wiring board 113 , adhesive layer 115 , and wiring board 114 in total. Accordingly, it is possible to prevent stress from being generated in the electronic component 116 due to the attachment of the metal cover 112 . The metal cover 112 can be attached to the wiring boards 113, 114, 154 by soldering and/or machining.

Next, a method of manufacturing electronic component package 111 will be described. 3 to 5 are perspective views illustrating a method of manufacturing the electronic component package 111 .

As shown in FIG. 3 , conductive paste (conductive paste) is filled in the holes formed in the adhesive layers 115 and 155 to form through holes 120A and 120B. The adhesive layer 115 having the through hole 120A is laminated on the wiring board 114 , and the adhesive layer 155 having the through hole 120B is laminated on the wiring board 154 . Then, the adhesive layers 115 and 155 are laminated on the wiring board 113 by tools such as a die and a press machine. In this way, wiring boards 114, 154 are fixed to wiring board 113 via adhesive layers 115, 155 having through holes 120A, 120B, respectively. The adhesive layer 115 has an upper surface 115A and a lower surface 115B on the opposite side. The adhesive layer 155 has an upper surface 155A and a lower surface 155B on the opposite side. Lower surfaces 115B and 155B are located on upper surface 113A of wiring board 113 . Upper surfaces 115A, 155A are located on lower surfaces 114B, 154B of wiring boards 114, 154, respectively.

A plurality of electrodes 119A are formed on upper surface 113A of wiring board 113 . Electrode 131A is formed on lower surface 114B of wiring board 114 . Electrode 131B is formed on lower surface 154B of wiring board 154 . Via hole 120A connects electrode 119A of wiring board 113 and electrode 131A of wiring board 114 . Via hole 120B connects electrode 119A of wiring board 113 and electrode 131B of wiring board 154 .

Wiring boards 114 and 154 may be simultaneously fixed to wiring board 113 via adhesive layers 115 and 155 having through holes 120A and 120B. By doing so, man-hours can be reduced.

When the adhesive layers 115 and 155 are not relatively hard solids, the adhesive layers 115 and 155 are pasted on the wiring board 113 in advance. The adhesive layers 115, 155 can be easily handled by pasting the adhesive layers 115, 155 on the wiring boards 114, 154 in advance.

FIG. 4 is a perspective view of laminated wiring boards 113 , 114 , 154 and adhesive layers 115 , 155 . Upper surface 113A of wiring board 113 has effective area 121 exposed from adhesive layers 115 and 155 and electronic component 116 can be mounted on. Electronic components 116 are mounted on effective area 121 of upper surface 113A of wiring board 113 . By fixing the wiring boards 114, 154 via the adhesive layers 115, 155 to the opposite ends 113C, 113D of the wiring board 113, the effective area 121 can be increased, and the electronic components 116 can be mounted at a high density until reaching adhesive layer 115 , 155 and/or wiring board 114 , 154 .

By enlarging the effective area 121, the printing area of the solder paste on the upper surface 113A of the wiring board 113 can be enlarged, the thickness unevenness of the solder paste can be reduced, and the printing accuracy of the solder paste can be improved. As a result, manufacturability is improved, and the production cost of the electronic component package 111 is suppressed. By cutting the laminated wiring boards 113, 114, 154 and adhesive layers 115, 155 at the dividing line 111A, a plurality of electronic component packages 111 can be produced together.

FIG. 5 is a perspective view of divided wiring boards 113 , 114 , 154 and adhesive layers 115 , 155 . The laminated wiring boards 113 , 114 , 154 and adhesive layers 115 , 155 can be cut mechanically using a router bit or the like. In addition, the laminated wiring boards 113 may be divided by slits and/or V-grooves and/or machining lines (ミシンプ, eyelets) previously formed in the wiring boards 113, 114, 154 along the dividing line 111A. , 114, 154 and adhesive layers 115, 155.

Mounting cost can be suppressed by mounting electronic component 116 on upper surface 113A of wiring board 113 before dividing laminated wiring boards 113 , 114 , 154 and adhesive layers 115 , 155 . Even when wiring board 113 is folded and divided, wiring boards 114 and 154 maintain the rigidity of wiring board 113 , so unnecessary stress can hardly be generated in electronic component 116 when wiring board 113 is cut. By the method described above, the electronic component package 111 capable of reliably shielding the electronic component 116 can be manufactured stably.

The through holes 120A, 120B have a shielding effect. In addition, by forming the through holes 120A, 120B with a member with high thermal conductivity (thermal conductivity, thermal conductivity), the heat of the wiring board 113 and/or the electronic component 116 can be transferred to the metal cover 112 to effectively dissipate heat from the electronic component 116. .

The adhesive layers 115 and 155 preferably have a (thin) sheet shape and are composed of a thermosetting resin and inorganic fillers such as alumina and silica dispersed in the thermosetting resin. By forming the adhesive layers 115, 155 into a sheet shape, thickness unevenness of the adhesive layers 115, 155 can be suppressed. In addition, via holes 120A and 120B can be easily formed by forming holes in adhesive layers 115 and 155 by laser or the like and filling them with conductive paste. The reliability of the electronic component package 111 can be improved by using an epoxy resin as a thermosetting resin of the adhesive layers 115 and 155 .

In addition, thermoplastic resins such as polyphenylene sulfide (PPS), polyetheretherketone (PEEK), and polyethersulfone (PES) may be added to the thermosetting resin in an amount of 5% to 30% by weight relative to the thermosetting resin. Thereby, fluidity at the time of heating can be suppressed, and thermoplastic resin can be prevented from softening and flowing out or seeping out from the adhesive layer 115 . When the content of the thermoplastic resin is less than 5% by weight relative to the thermosetting resin, the effect of addition may not be obtained. When the thermoplastic resin content exceeds 30% by weight relative to the thermosetting resin, the adhesive force and reliability of the adhesive layers 115 and 155 may be affected.

The thickness of the adhesive layers 115 and 155 is preferably not less than 30 μm and not more than 300 μm (30 μm to 300 μm). When the thickness of the adhesive layer 115 , 155 is less than 30 μm, sufficient adhesive force may not be obtained due to the influence of unevenness on the surface of the wiring board 113 , 114 , 154 . When the thickness of the adhesive layers 115 and 155 exceeds 300 μm, it is difficult to provide the electronic component package 111 thinly. In addition, the particle diameter of the inorganic filler is preferably not less than 1 μm and less than 30 μm. When the particle diameter of the inorganic filler is less than 1 μm, the price of the inorganic filler increases, and it is difficult to disperse in the thermosetting resin. If the particle diameter is larger than 30 μm, it may be difficult to make the adhesive layer 115 thin, and it may be difficult to form holes in the adhesive layer 115 by laser to form the through holes 120A and 120B.

The content of the inorganic filler in the adhesive layers 115 and 155 is preferably not less than 30% by volume and not more than 80% by volume. When the content of the inorganic filler is less than 30% by volume, the thermosetting resin may flow out or seep out to the portion where the electronic component 116 is mounted in the bonding step of the bonding layers 115 and 155 . If the content of the inorganic filler exceeds 80% by volume, the adhesive force of the adhesive layers 115 and 155 may decrease.

The coefficient of thermal expansion of the adhesive layers 115 and 155 is preferably not less than 4 ppm/°C and not more than 65 ppm/°C at a temperature lower than the glass transition temperature of the thermosetting resin. In order to make the coefficient of thermal expansion smaller than 4 ppm/°C, it is necessary to use a special and expensive inorganic filler. When the thermal expansion coefficient is set higher than 65 ppm/°C, the electronic component package 111 may be deformed or bent. In addition, the coefficient of thermal expansion of the adhesive layer 115 is preferably smaller than that of the wiring boards 113 , 114 , and 154 . Thereby, warpage and/or waviness caused by heat of the electronic component package 111 can be suppressed.

In addition, the glass transition temperature can be measured by the TMA method and/or the DSC method shown in JIS C 6481 or the like. In the TMA method, the temperature of the test piece is raised from room temperature at a rate of 10° C./minute, and the coefficient of thermal expansion in the thickness direction is measured with a thermal analyzer. In the DSC method, the temperature of the test piece is raised from room temperature at a rate of 20° C./minute, and the calorific value is measured with a differential operation calorimeter.

In addition, the reliability of the electronic component package 111 can be improved by using components with high reliability of FR4 (grade) and/or FR5 for the adhesive layers 115, 155 and/or the wiring boards 113, 114, 154. sex.

When the size of wiring board 113 is 10 mm×10 mm or less, the strength of electronic component package 111 can be ensured by the structure shown in FIG. 1A . When the size of the wiring board 113 exceeds 10mm×10mm, another adhesive layer with the same structure as the adhesive layers 115, 155 may be provided in the center between the adhesive layers 115, 155 on the upper surface 113A. Another wiring board having the same structure as the wiring boards 114 and 154 is provided on the bonding layer. The upper surface of the wiring board is in contact with the top surface portion 112A of the metal cover 112 . Thereby, the strength in the thickness direction of the electronic component package 111 can be improved. In addition, by fixing the wiring board and the metal cover 112 by soldering, an adhesive, or the like, the rigidity of the electronic component package 111 can be increased.

The metal cover 112 is preferably formed of a metal plate with a thickness of not less than 0.1 mm and not more than 1.0 mm. When the thickness is less than 0.1 mm, there is a possibility of deformation during handling. On the other hand, if the thickness exceeds 1.0 mm, the processing of the metal plate will become difficult and the weight will increase. Through the metal cover 112, in addition to the shielding effect, a heat dissipation effect and/or a heat spreading effect can also be obtained. At this time, the shape of the metal cover 112 may be a heat sink shape, or a heat sink for heat dissipation may be attached to the metal cover 112 .

Also at this time, by forming through holes 120A, 120B with a member with high thermal conductivity, the heat of wiring board 113 and/or electronic component 116 can be transmitted to metal cover 112 to effectively dissipate heat from electronic component 116 .

In addition, by plating at least a part of the metal cover 112, discoloration of the metal part can be prevented. In addition, by performing nickel plating, solder plating (handa metsuki), etc., the metal cover 112 can be firmly connected to the wiring boards 114 and 154 by soldering.

In electronic component package 111 , wiring boards 114 , 154 are fixed to wiring board 113 via adhesive layers 115 , 155 , respectively, and metal cover 112 is fixed to wiring boards 114 , 154 . Metal cover 112 is separated from electronic component 116 mounted on upper surface 113A of wiring board 113 without contacting it. As a result, the external force transmitted to the metal cover 112 is not transmitted to the electronic component 116, so that no stress is generated on the electronic component 116, and a small and highly reliable electronic component package 111 can be obtained. In addition, the height or unevenness of the electronic component 116 does not affect the height 117B of the metal cover 112 and/or the height of the electronic component package 111 .

(Embodiment 2)

FIG. 6A is an exploded perspective view of electronic component package 211 in Embodiment 2. FIG. The wiring pattern formed on the upper surface 213A of the wiring board 213 can be connected to the metal cover 212 via the electrode 232A formed on the upper surface 214A of the wiring board 214 and the electrode 232B formed on the upper surface 254A of the wiring board 254 . The wiring boards 213, 214, and 254 are printed wiring boards, but may be other wiring boards.

The metal cover 212 is formed by pressing and bending a metal plate into a U-shape, and has claws 218 . Specifically, the metal cover 212 has a top surface 212A, side surfaces 212B, 212C, and claws 218 . The top surface portion 212A has a rectangular shape and has mutually opposite sides 1212B and 1212C and mutually opposite sides 1212D and 1212E. The side parts 212B and 212C extend downward from the sides 1212B and 1212C of the top part 212A, respectively. The claw 218 extends downward from the side 1212D. The claws 218 position the metal cover 212 when fixing the metal cover 212 to the wiring board 213 , and are formed in a small protrusion shape or by bending a part of a metal plate. The claw 218 may also have a hook shape.

A plurality of electronic components 216A are mounted on upper surface 213A of wiring board 213 . The electronic component 216A is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise. On the lower surface 213B of the wiring board 213, a plurality of electronic components 216B are mounted. The electronic component 216B is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

By forming the wiring board 213 from a multilayer wiring board, the electronic component 216A and the electronic component 216B can be connected. Electronic component 216A and electronic component 216B can be connected to each other through through holes connected to upper surface 213A and lower surface 213B of wiring board 213 , thereby improving the degree of freedom in designing the circuit pattern of electronic component package 211 .

Wiring board 113 may incorporate a β (beta) pattern or shield pattern made of copper foil or the like. With this pattern, the electronic components 216A, 216B can be electromagnetically separated from each other and interference can be prevented.

A wiring pattern and/or a solder resist are formed on the upper surface 213A and the lower surface 213B of the wiring board 213 . Electronic components 216A and 216B have external electrode portions connected to upper surface 213A and/or lower surface 213B of wiring board 213 by soldering.

Wiring board 214 is fixed to upper surface 213A at end 213C of wiring board 213 via adhesive layer 215 . That is, an adhesive layer 215 is provided on an upper surface 213A of an end portion 213C of the wiring board 213 , and the wiring board 214 is fixed to the adhesive layer 215 . Wiring board 254 is fixed to upper surface 213A at end 213D on the opposite side to end 213C of wiring board 213 via adhesive layer 255 . That is, an adhesive layer 255 is provided on the upper surface 213A at the end portion 213D of the wiring board 213 , and the wiring board 254 is fixed to the adhesive layer 255 .

Wiring board 264 is fixed to lower surface 213B at end 213C of wiring board 213 via adhesive layer 265 . That is, an adhesive layer 265 is provided on the lower surface 213B of the end portion 213C of the wiring board 213 , and the wiring board 264 is fixed to the adhesive layer 265 . Wiring board 274 is fixed to lower surface 213B at end 213D on the opposite side to end 213C of wiring board 213 via adhesive layer 275 . That is, an adhesive layer 275 is provided on the lower surface 213B of the end portion 213D of the wiring board 213 , and the wiring board 274 is fixed to the adhesive layer 275 . The wiring boards 214, 254, 264, 274 extend parallel to each other.

FIG. 6B is a perspective view of the electronic component package 211 . Top surface portion 212A of metal cover 212 is located on upper surface 214A of wiring board 214 and upper surface 254A of wiring board 254 , and covers upper surface 213A of wiring board 213 and electronic components 216A. Side portions 212B and 212C of metal cover 212 extend to wiring boards 264 and 274 to surround electronic component 216B.

The metal cover 212, that is, the side portions 212B, 212C has a height 217B. Height 217B is preferably equal to or less than the total thickness of wiring boards 213 , 214 , 264 and adhesive layers 215 , 265 . In addition, it is preferable to set the height of electronic component 216A from upper surface 213A of wiring board 213 to be smaller than the height of upper surfaces 214A and 254A of wiring boards 214 and 254 from upper surface 213A. This prevents the electronic component 216 from coming into direct contact with the metal cover 212 . Also with this configuration, it is possible to secure an insulating distance between the metal cover 212 and the motherboard on which the electronic component package 211 is mounted.

By enlarging the claw 218, the shielding effect by the claw 218 can be obtained. FIG. 6C is a perspective view of another metal cover 712 in the second embodiment. In FIG. 6C, the same parts as those in FIG. 6A are denoted by the same reference numerals, and description thereof will be omitted. Metal cover 712 replaces claw 218 of metal cover 212 shown in FIG. 6A , and has side 212D extending downward from side 1212D of top surface 212A and side 212E extending downward from side 1212E opposite side 1212D. The side part 212D is connected to the side parts 212B and 212C, and the side part 212E is connected to the side parts 212B and 212C. Side parts 212D, 212E cover side surfaces of wiring boards 213, 214, 254, 264, 274 and side surfaces of adhesive layers 215, 255, 265, 275, and can effectively shield electronic components 216A, 216B.

In this way, the electronic component package 211 is a small Chip Size/Scale Package (CSP) capable of shielding electronic components such as a plurality of semiconductors.

FIG. 7A is a bottom perspective view of the electronic component package 211 . A plurality of electrodes 232C are provided on the lower surface 264B of the wiring board 264 . A plurality of electrodes 232D are provided on the lower surface 274B of the wiring board 274 . The electrodes 232C and 232D are connected to the motherboard, and the electronic component package 211 is mounted on the motherboard. The plurality of electrodes 232C and 232D shown in FIG. 7A are Land Grid Array (LGA) or FinePitch LGA (FLGA). In addition, according to the application, the plurality of electrodes 232C and 232D may also be Ball Grid Array (BGA) and/or Fine Pitch BGA (FBGA). The electrodes 232C and 232D may be formed of copper foil and/or solder resist formed on the lower surfaces 264B and 274B of the wiring boards 264 and 274 to increase the mounting density of the electronic component package 211 .

FIG. 7B is a bottom perspective view of another electronic component package 211A in Embodiment 2. FIG. In FIG. 7B, the same code|symbol is attached|subjected to the same part as electronic component package 211 shown in FIG. 7A, and description is abbreviate|omitted. Electronic component package 211A shown in FIG. 7B is provided with metal cover 712 shown in FIG. 6C instead of metal cover 212 of electronic component package 211 shown in FIG. 7A .

As shown in FIGS. 6A, 6B, 7A, and 7B, by setting the wiring boards 214, 254, 264, and 274 smaller than the wiring board 213, the distance between the upper surface 213A and the lower surface 213B of the wiring board 213 can be increased. The area where electronic components 216A, 216B can be mounted. By mounting electronic components 216A and 216B on upper surface 213A and lower surface 213B of wiring board 213 , it is possible to reduce the size and weight of electronic component package 211 .

The metal cover 212 is formed by bending a metal plate into a U-shape. Height 217B of metal cover 212 (side portions 212B, 212C) is equal to or smaller than height 217C of wiring board 213 , adhesive layers 215 , 265 , and wiring boards 214 , 264 in total. Accordingly, it is possible to prevent stress caused by attachment of the metal cover 212 from being generated in the electronic component 216A. The metal cover 212 can be attached to the wiring boards 213, 214, 254, 264, 274 by soldering and/or machining.

By bringing the claws 218 formed on the metal cover 212 into contact with the wiring board 214 , displacement of the metal cover 212 can be prevented, and the metal cover 212 can be easily positioned with respect to the wiring board 214 with high precision.

Next, a method of manufacturing electronic component package 211 will be described. FIG. 8 is an exploded perspective view illustrating a method of manufacturing the electronic component package 211 . The holes formed in the adhesive layers 215 , 255 , 265 , and 275 are filled with conductive paste to form through holes 220A, 220B, 220C, and 220D, respectively. Then, adhesive layers 215 , 255 are laminated on lower surfaces 214B, 254B of wiring boards 214 , 254 , and adhesive layers 265 , 275 are laminated on upper surfaces 264A, 274A of wiring boards 264 , 274 , respectively. Then, the adhesive layers 215 and 255 are laminated on the upper surface 213A of the wiring board 213 by tools such as a die and a press, and the adhesive layers 265 and 275 are laminated on the lower surface 213B of the wiring board 213 by a tool such as a die and a press. In this way, wiring boards 213, 214, 254, 264, and 274 are fixed by adhesive layers 215, 255, 265, and 275 having through holes 220A, 220B, 220C, and 220D, respectively.

A plurality of electrodes 219A are formed on an upper surface 213A of the wiring board 213 . Electrodes 231A are formed on lower surface 214B of wiring board 214 . Electrode 231B is formed on lower surface 254B of wiring board 254 . Via hole 220A connects electrode 219A of wiring board 213 and electrode 231A of wiring board 214 . Via hole 220B connects electrode 219A of wiring board 213 and electrode 231B of wiring board 254 . A plurality of electrodes 219B are formed on the lower surface 213B of the wiring board 213 . Electrode 231C is formed on upper surface 264A of wiring board 264 . Electrode 231D is formed on upper surface 274A of wiring board 274 . Via hole 220C connects electrode 219B of wiring board 213 and electrode 231C of wiring board 264 . The through hole 220D connects the electrode 219B of the wiring board 213 and the electrode 231D of the wiring board 274 . The adhesive layer 215 has an upper surface 215A and a lower surface 215B on the opposite side. The adhesive layer 255 has an upper surface 255A and a lower surface 255B on the opposite side. Lower surfaces 215B and 255B are located on upper surface 213A of wiring board 213 . Upper surfaces 215A, 255A are located on lower surfaces 214B, 254B of wiring boards 214, 254, respectively. The adhesive layer 265 has an upper surface 265A and a lower surface 265B on the opposite side. The adhesive layer 275 has an upper surface 275A and a lower surface 275B on the opposite side. Upper surfaces 265A, 275A are located on lower surface 213B of wiring board 213 . Lower surfaces 265B, 275B are located on upper surfaces 264A, 274A of wiring boards 264, 274, respectively.

In addition, the wiring boards 213, 214, 254, 264, and 274 may be simultaneously laminated and fixed through the adhesive layers 215, 255, 265, and 275 having through holes 220A, 220B, 220C, and 220D, respectively. By doing so, man-hours can be reduced.

Then, like the wiring boards 113, 114, 154 and/or adhesive layers 115, 155 shown in FIGS. , 265, 275 divisions. Then, metal cover 212 is attached to wiring boards 213 , 214 , 254 , 264 , 274 so that metal cover 212 is in contact with upper surfaces 214A, 254A of wiring boards 214 , 254 .

The through holes 220A to 220D have a shielding effect. In addition, by forming through holes 220A to 220D with a member with high thermal conductivity, the heat of wiring board 213 and/or electronic components 216A and 216B can be transmitted to metal cover 212 to effectively dissipate heat from electronic components 216A and 216B.

By electrically connecting the wiring patterns formed on the wiring boards 213, 214, 254, 264, and 274 to the metal cover 212, not only the metal cover 212 but also the wiring boards 213, 214, 254, 264, and 274 can be positioned relatively to the electronics. The components 216A, 216B have a shielding effect and/or a heat dissipation effect.

The adhesive layers 215 , 255 , 265 , and 275 are made of the same material and have the same thickness and/or shape as the adhesive layers 115 , 155 in the first embodiment shown in FIG. 1A , and have the same effect.

In addition, by using components with high reliability of FR4 class and/or FR5 class for the adhesive layers 215, 255, 265, 275 and wiring boards 213, 214, 254, 264, 274, it is possible to improve the reliability of the electronic component package. 211 reliability.

When the size of wiring board 213 is 10 mm×10 mm or less, the strength of electronic component package 211 can be ensured by the structure shown in FIG. 6A . When the size of the wiring board 213 exceeds 10mm×10mm, another adhesive layer with the same structure as the adhesive layers 215, 255 may be provided in the center between the adhesive layers 215, 255 on the upper surface 213A. Another wiring board having the same structure as the wiring boards 214 and 254 is provided on the bonding layer. The upper surface of the wiring board is in contact with the top surface portion 212A of the metal cover 212 . Thereby, the strength in the thickness direction of the electronic component package 211 can be improved. In addition, the rigidity of the electronic component package 211 can be improved by fixing the wiring board and the metal cover 212 by soldering, an adhesive, or the like.

The metal cover 212 is preferably formed of a metal plate with a thickness of not less than 0.1 mm and not more than 1.0 mm. When the thickness is less than 0.1 mm, there is a possibility of deformation during handling. On the other hand, if the thickness exceeds 1.0 mm, the processing of the metal plate will become difficult and the weight will increase. With the metal cover 212, in addition to the shielding effect, it is possible to obtain a heat dissipation effect and/or a heat spreading effect (ヒ一トトスプレツツ effect). At this time, the shape of the metal cover 212 may be a heat sink shape, or a heat sink for heat dissipation may be attached to the metal cover 212 .

Also at this time, by forming through holes 220A, 220B with a member with high thermal conductivity, the heat of wiring board 213 and/or electronic components 216A, 216B can be transmitted to metal cover 212 to effectively dissipate heat from electronic components 216A, 216B.

In addition, by plating at least a part of the metal cover 212, discoloration of the metal part can be prevented. In addition, by performing nickel plating, tin plating, or the like, the metal cover 212 can be firmly connected to the wiring boards 214 and 254 by soldering.

In electronic component package 211 , wiring boards 214 , 254 are fixed to wiring board 213 via adhesive layers 215 , 255 , respectively, and metal cover 212 is fixed to wiring boards 214 , 254 . Metal cover 212 is separated from electronic component 216A mounted on upper surface 213A of wiring board 213 without being in contact therewith. Thereby, the external force transmitted to the metal cover 2112 is not transmitted to the electronic component 216A, so that no stress is generated on the electronic component 216A, and a compact and highly reliable electronic component package 211 can be obtained. In addition, the height or unevenness of the electronic component 216A does not affect the height 217B of the metal cover 212 and/or the height of the electronic component package 211 .

(Embodiment 3)

FIG. 9 is an exploded perspective view of an electronic component package 411 in the third embodiment. The metal cover 412 is formed by pressing and bending a metal plate into a U-shape, and has claws 418 . Specifically, the metal cover 412 has a top surface 412A, side surfaces 412B, 412C, and claws 418 . The top surface portion 412A has a rectangular shape, and has mutually opposite sides 1412B and 1412C and mutually opposite sides 1412D and 1412E. The side parts 412B and 412C extend downward from the sides 1412B and 1412C of the top part 412A, respectively. The claw 418 extends downward from the side 1412D. The claw 418 positions the metal cover 412 when fixing the metal cover 412 to the wiring board 413 , and is formed in a small protrusion shape or by bending a part of a metal plate. The claw 418 may also have a hook shape.

A plurality of electronic components 416A are mounted on an upper surface 413A of the wiring board 413 . The electronic component 416A is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

A wiring pattern and/or a solder resist are formed on the upper surface 413A and the lower surface 413B of the wiring board 413 . Wiring patterns and/or solder resists are provided on the upper surface 414A and the lower surface 414B of the wiring board 414 . Electronic component 416A has an external electrode portion connected to upper surface 413A of wiring board 413 by soldering.

The wiring board 414 is fixed to the upper surface 413A at an end portion 413C of the wiring board 413 via an adhesive layer 415 . That is, an adhesive layer 415 is provided on an upper surface 413A of an end portion 413C of the wiring board 413 , and the wiring board 414 is fixed to the adhesive layer 415 . The wiring board 454 is fixed to the upper surface 413A at the end 413D opposite to the end 413C of the wiring board 413 via the adhesive layer 455 . That is, an adhesive layer 455 is provided on the upper surface 413A at the end portion 413D of the wiring board 413 , and the wiring board 454 is fixed to the adhesive layer 455 .

On the upper surface 453A of the wiring board 453, a plurality of electronic components 416B are mounted. The electronic component 416B is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

A wiring pattern and/or a solder resist are provided on the upper surface 453A and the lower surface 453B of the wiring board 453 . Wiring patterns and/or solder resists are provided on the upper surface 414A and the lower surface 414B of the wiring board 414 . Wiring patterns and/or solder resists are provided on the upper surface 464A and the lower surface 464B of the wiring board 464 . Electronic component 416B has external electrode portions connected to upper surface 453A of wiring board 453 by soldering. The wiring boards 413, 414, 453, and 464 are printed wiring boards, but may be other wiring boards.

Wiring board 464 is fixed to upper surface 453A at end 453C of wiring board 453 via adhesive layer 465 . That is, an adhesive layer 465 is provided on the upper surface 453A at the end portion 453C of the wiring board 453 , and the wiring board 464 is fixed to the adhesive layer 465 . Wiring board 474 is fixed to upper surface 453A at end 453D on the opposite side to end 453C of wiring board 453 via adhesive layer 475 . That is, an adhesive layer 475 is provided on the upper surface 453A at the end portion 453D of the wiring board 453 , and the wiring board 474 is fixed to the adhesive layer 475 . The wiring boards 414, 454, 464, 474 extend parallel to each other.

An adhesive layer 485 is provided on the upper surface 464A of the wiring board 464 . An adhesive layer 495 is laminated on the upper surface 474A of the wiring board 474 . An adhesive layer 485 is provided on the lower surface 413B of the end portion 413C of the wiring board 413 . An adhesive layer 495 is laminated on the lower surface 413B of the end portion 413D of the wiring board 413 . The through holes 420E, 420F formed in the adhesive layers 485, 495, the electrodes formed in the wiring boards 464, 474, and the through holes formed in the adhesive layers 465, 475 can pass between the wiring boards 413, 453. connect.

FIG. 10A is a perspective view of the electronic component package 411 . Top surface 412A of metal cover 412 is located on upper surface 414A of wiring board 414 and upper surface 454A of wiring board 454 , and covers upper surface 413A of wiring board 413 and electronic components 416A. The side parts 412B and 412C of the metal cover 412 extend to the wiring board 453 and surround the electronic component 416B.

FIG. 10B is a bottom perspective view of the electronic component package 411 . A plurality of electrodes 419D are provided on the lower surface 453B of the wiring board 453 . The electrodes 419D are connected to the motherboard, and the electronic component package 411 is mounted on the motherboard. The electrode 419D is Land Grid Array (LGA) or Fine PitchLGA (FLGA). In addition, according to the application, the electrode 419D can also be Ball Grid Array (BGA) and/or Fine Pitch BGA (FBGA). The electrodes 419D may be formed of copper foil and/or solder resist formed on the lower surface 453B of the wiring board 453 to increase the mounting density of the electronic component package 411 .

Next, a method of manufacturing electronic component package 411 will be described. 11 and 12 are perspective views illustrating a method of manufacturing the electronic component package 411 .

Like the electronic component package 111 shown in FIG. 3 , an adhesive layer 415 having through holes is laminated on a wiring board 414 . An adhesive layer 455 having through holes is laminated on the wiring board 454 . Then, the adhesive layers 415 and 455 are laminated on the wiring board 413 by tools such as a die and a press machine. In this way, the wiring boards 413, 414, 454 are fixed via the adhesive layers 415, 455 having through holes. Electrodes 432A, 432B are provided on upper surfaces 414A, 454A of wiring boards 414, 454, respectively. The upper surface 413A of the wiring board 413 has an effective area 421 exposed from the adhesive layers 415 and 455 so that the electronic component 416A can be mounted. Electronic component 416A is mounted on effective area 421 of upper surface 413A of wiring board 413 . By fixing the wiring boards 414, 454 via the adhesive layers 415, 455 to the opposite ends 413C, 413D of the wiring board 413, the effective area 421 can be increased, and the electronic components 416A can be mounted at a high density until reaching Adhesive layers 415 , 455 and/or wiring boards 414 , 454 .

By enlarging the effective area 421, the printing area of the solder paste on the upper surface 413A of the wiring board 413 can be enlarged, the thickness unevenness of the solder paste can be reduced, and the printing accuracy of the solder paste can be improved. As a result, manufacturability is improved, and the production cost of the electronic component package 411 is suppressed. The laminated wiring boards 413 , 414 , 454 and adhesive layers 415 , 455 are cut at the dividing line 411A.

An adhesive layer 465 having through holes is laminated on the wiring board 464 . An adhesive layer 475 having through holes is laminated on the wiring board 474 . Then, the adhesive layers 465 and 475 are laminated on the wiring board 453 using tools such as a die and a press machine. In this way, the wiring boards 453, 464, 474 are fixed via the adhesive layers 465, 475 having through holes. The holes formed in the adhesive layers 485 and 495 are filled with conductive paste to form the via holes 420E and 420F. An adhesive layer 485 having a through hole 420E is laminated on the upper surface 464A of the wiring board 464 . An adhesive layer 495 having a through hole 420F is laminated on the upper surface 474A of the wiring board 474 . Via holes 420E, 420F are exposed on upper surfaces 485A, 495A of adhesive layers 485, 495, respectively. The upper surface 453A of the wiring board 453 has an effective area 421A exposed from the adhesive layers 465 and 475 so that the electronic component 416B can be mounted. The electronic component 416B is mounted on the effective area 421A of the upper surface 453A of the wiring board 453 . By fixing the wiring boards 464, 474 via the adhesive layers 465, 475 to the opposite ends 453C, 453D of the wiring board 453, the effective area 421A can be increased, and the electronic components 416B can be mounted at a high density until reaching Adhesive layers 465 , 475 and/or wiring boards 464 , 474 . By making wiring boards 414, 454, 464, 474 smaller than wiring boards 413, 453, effective areas 421, 421A of upper surfaces 413A, 453A of wiring boards 413, 453 can be increased.

In addition, the adhesive layer 485 and the adhesive layer 465 may be respectively fixed on the upper surface 464A and the lower surface 464B of the wiring board 464, and the adhesive layer 495 and the adhesive layer may be respectively fixed on the upper surface 474A and the lower surface 474B of the wiring board 474. 475. Then, adhesive layers 465 and 475 are laminated on upper surface 453A of wiring board 453 .

By enlarging the effective area 421A, it is possible to enlarge the printing area of the solder paste on the upper surface 453A of the wiring board 453 , to reduce uneven thickness of the solder paste, and to improve the printing accuracy of the solder paste. As a result, manufacturability is improved, and the production cost of the electronic component package 411 is suppressed. The laminated wiring boards 453 , 464 , 474 and adhesive layers 465 , 475 , 485 , 495 are cut at the dividing line 411B.

Then, wiring boards 464 , 474 are laminated on lower surface 413B of wiring board 413 via adhesive layers 485 , 495 having through holes 420E, 420F, respectively. The adhesive layer 415 has an upper surface 415A and a lower surface 415B on the opposite side. The adhesive layer 455 has an upper surface 455A and a lower surface 455B on the opposite side. The lower surfaces 415B and 455B are located on the upper surface 413A of the wiring board 413 . Upper surfaces 415A, 455A are located on lower surfaces 414B, 454B of wiring boards 414, 454, respectively. The adhesive layer 465 has an upper surface 465A and a lower surface 465B on the opposite side. The adhesive layer 475 has an upper surface 475A and a lower surface 475B on the opposite side. Upper surfaces 465A, 475A are located on lower surfaces 464B, 474B of wiring boards 464, 474, respectively. The lower surfaces 465B and 475B are located on the upper surface 453A of the wiring board 453 . The adhesive layer 485 has an upper surface 485A and a lower surface 485B on the opposite side. The adhesive layer 495 has an upper surface 495A and a lower surface 495B on the opposite side. Lower faces 485B, 495B are located on upper faces 464A, 474A of wiring boards 464, 474, respectively. Upper surfaces 485A, 495A are located on lower surface 413B of wiring board 413 .

Fig. 12 is a perspective view of divided wiring boards 413, 414, 453, 454, 464, 474 and adhesive layers 415, 455, 465, 475, 485, 495. The laminated wiring boards 413, 414, 453, 454, 464, 474 and adhesive layers 415, 455, 465, 475, 485, 495 can be mechanically cut along the dividing lines 411A, 411B with a milling cutter or the like. . In addition, the laminated wiring may be divided by slits and/or V-grooves and/or machining lines previously formed in the wiring boards 413, 414, 453, 454, 464, and 474 along the dividing lines 411A and 411B. Plates 413 , 414 , 453 , 454 , 464 , 474 and adhesive layers 415 , 455 , 465 , 475 , 485 , 495 .

In addition, by mounting electronics on the upper surfaces 413A, 453A of the wiring boards 413, 453 before dividing the wiring boards 413, 414, 453, 454, 464, 474 and adhesive layers 415, 455, 465, 475, 485, 495, Components 416A, 416B can suppress installation cost. Even when the wiring boards 413, 453 are folded and divided, the wiring boards 414, 454, 464, 474 maintain the rigidity of the wiring boards 413, 453, so that the electronic Parts 416A, 416B are less prone to unwanted stress. By the method described above, the electronic component package 411 capable of reliably shielding the electronic components 416A and 416B can be manufactured stably.

The adhesive layers 415, 455, 465, 475, 485, and 495 are made of the same material as the adhesive layers 115, 155 in Embodiment 1 shown in FIG. 1A, and have the same shape and/or thickness, and have the same Effect.

In addition, by using FR4 and/or FR5 highly reliable components for the adhesive layers 415, 455, 465, 475, 485, 495 and/or the wiring boards 413, 414, 453, 454, 464, and 474 , the reliability of the electronic component package 411 can be improved.

In addition, by using FR4 and/or FR5 highly reliable components for the adhesive layers 415, 455, 465, 475, 485, 495 and/or the wiring boards 413, 414, 453, 454, 464, and 474 , the reliability of the electronic component package 411 can be improved.

When the size of the wiring boards 413 and 453 is 10 mm×10 mm or less, the strength of the electronic component package 411 can be ensured by the structure shown in FIG. 9 . When the size of the wiring boards 413, 453 exceeds 10 mm x 10 mm, another adhesive layer having the same structure as the adhesive layers 415, 455 may be provided in the center between the adhesive layers 415, 455 on the upper surface 413A. Another wiring board having the same structure as the wiring boards 414 and 454 is provided on this adhesive layer. The upper surface of the wiring board is in contact with the top surface portion 412A of the metal cover 412 . Thereby, the strength in the thickness direction of the electronic component package 411 can be improved. In addition, by fixing the wiring board and the metal cover 412 with soldering, an adhesive, or the like, the rigidity of the electronic component package 411 can be increased.

The metal cover 412 is preferably formed of a metal plate with a thickness of not less than 0.1 mm and not more than 1.0 mm. When the thickness is less than 0.1 mm, there is a possibility of deformation during handling. On the other hand, if the thickness exceeds 1.0 mm, the processing of the metal plate will become difficult and the weight will increase. Through the metal cover 412, in addition to the shielding effect, a heat dissipation effect and/or a heat spreading effect can also be obtained. At this time, the shape of the metal cover 412 may be a heat sink shape, or a heat sink for heat dissipation may be attached to the metal cover 412 .

In addition, at this time, by forming the through holes 420A, 420B with a member with high thermal conductivity, the heat of the wiring boards 413, 453 and/or the electronic components 416A, 416B can be transmitted to the metal cover 412, thereby effectively cooling the electronic components 416A, 416B. Heat dissipation.

In addition, by plating at least a part of the metal cover 412, discoloration of the metal part can be prevented. In addition, by performing nickel plating, tin plating, or the like, the metal cover 412 can be firmly connected to the wiring boards 414 and 454 by soldering.

In electronic component package 411 , wiring boards 414 , 454 are fixed to wiring board 413 via adhesive layers 415 , 455 , respectively, and metal cover 412 is fixed to wiring boards 414 , 454 . The metal cover 412 is separated from the electronic component 416A mounted on the upper surface 413A of the wiring board 413 without being in contact therewith. Thereby, the external force transmitted to the metal cover 412 is not transmitted to the electronic component 416A, so that no stress is generated on the electronic component 416A, and a compact and highly reliable electronic component package 411 can be obtained. In addition, the height of the electronic component 416A or the uneven height does not affect the height 417C of the metal cover 412 and/or the height of the electronic component package 411 .

(Embodiment 4)

FIG. 13A is an exploded perspective view of an electronic component package 311 in Embodiment 4. FIG. FIG. 13B is a cross-sectional view taken along the line 13B-13B of the electronic component package 311 shown in FIG. 13A .

On the upper surface 313A of the wiring board 313, a plurality of electronic components 316 such as semiconductors and chip components are mounted.

A wiring pattern and/or a solder resist are provided on the upper surface 313A and the lower surface 313B of the wiring board 313 . Wiring patterns and/or solder resists are provided on the upper surface 314A and the lower surface 314B of the wiring board 314 . Wiring patterns and/or solder resists are provided on the upper surface 354A and the lower surface 354B of the wiring board 354 . Electronic component 316 has external electrode portions connected to upper surface 313A of wiring board 313 by soldering. The wiring boards 313, 314, and 354 are printed wiring boards, but may be other wiring boards.

Wiring board 314 is fixed to upper surface 313A at end portion 313C of wiring board 313 via adhesive layer 315 . That is, an adhesive layer 315 is provided on the upper surface 313A at the end portion 313C of the wiring board 313 , and the wiring board 314 is fixed to the adhesive layer 315 . Wiring board 354 is fixed to upper surface 313A at end 313D on the opposite side to end 313C of wiring board 313 via adhesive layer 355 . That is, an adhesive layer 355 is provided on the upper surface 313A at the end portion 313D of the wiring board 313 , and the wiring board 354 is fixed to the adhesive layer 355 . The wiring boards 314, 354 extend parallel to each other.

At least a part of the plurality of electronic components 316 is covered with a filled layer 312 made of resin filled between the wiring boards 314 and 354 . By covering electronic component 316 with filling layer 312 , long-term reliability of electronic component 316 can be improved.

The height of filling layer 312 from upper surface 313A of wiring board 313 is preferably equal to or less than the height of upper surface 314A of wiring board 314 from upper surface 313A of wiring board 313 . Thereby, scratches are less likely to be generated on the filling layer 312 during handling, and the electronic component packages 311 can be stacked in the thickness direction. In addition, with this structure, the liquid resin is sealed by the wiring boards 314 and 354, thereby making the thickness of the filling layer 312 made of resin uniform and making the filling layer 312 thinner, so that the electronic component package 311 can be reduced in size. the cost of.

In this way, the electronic component package 311 is a small Chip Size/Scale Package (CSP) in which a plurality of electronic components 316 such as semiconductors can be protected by the filling layer 312 .

FIG. 14 is a bottom perspective view of the electronic component package 311 . A plurality of electrodes 318B are provided on the lower surface 313B of the wiring board 313 . The electrodes 318B are connected to the motherboard, and the electronic component package 311 is mounted on the motherboard. The plurality of electrodes 318B shown in FIG. 14 are Land Grid Array (LGA) or Fine Pitch LGA (FLGA). In addition, according to the application, the plurality of electrodes 318B can also be Ball Grid Array (BGA) and/or Fine Pitch BGA (FBGA). The electrodes 318B may be formed of copper foil and/or solder resist formed on the lower surface 313B of the wiring board 313 to increase the mounting density of the electronic component package 311 .

By providing wiring boards 314 and 354 smaller than wiring board 313 , it is possible to increase the area where electronic component 316 can be mounted on upper surface 313A of wiring board 313 .

When wiring boards 313 , 314 , 354 are made of glass epoxy resin, filling layer 312 mainly contains epoxy resin, thereby matching (matching) thermal expansion coefficients of wiring boards 313 , 314 , 354 and filling layer 312 . Therefore, even when the wiring board 313 is thin, for example, when the wiring board 313 is a four-layer multilayer wiring board having a thickness of 0.6 mm or less, preferably 0.4 mm or less, the wiring board 313 does not bend, The electronic component package 311 can be prevented from being bent (warped, reversed).

Next, a method for manufacturing the electronic component package 311 will be described. 15 to 18 , FIG. 20 , and FIG. 21 are perspective views showing a method of manufacturing the electronic component package 311 .

As shown in FIG. 15 , conductive paste is filled in the holes formed in the adhesive layers 315 and 355 to form through holes 319A and 319B. The adhesive layer 315 having the through hole 319A is laminated on the wiring board 314 , and the adhesive layer 355 having the through hole 319B is laminated on the wiring board 354 . Then, the adhesive layers 315 and 355 are laminated on the wiring board 313 by tools such as a die and a press machine. In this way, the wiring boards 314, 354 are fixed to the wiring board 313 via the adhesive layers 315, 355 having the through holes 319A, 319B, respectively. In particular, when the adhesive layers 315, 355 are not relatively hard solids, the adhesive layers 315, 355 are pasted on the wiring board 313 in advance in this way. By fixing the adhesive layers 315, 355 to the wiring boards 314, 354 in advance, the adhesive layers 315, 355 can be handled easily. The adhesive layer 315 has an upper surface 315A and a lower surface 315B on the opposite side. The adhesive layer 355 has an upper surface 355A and a lower surface 355B on the opposite side. The lower surfaces 315B and 355B are located on the upper surface 313A of the wiring board 313 . Upper surfaces 315A, 355A are located on lower surfaces 314B, 354B of wiring boards 314, 354, respectively.

A plurality of electrodes 318A are formed on an upper surface 313A of the wiring board 313 . An electrode 331A is formed on the lower surface 314B of the wiring board 314 . Electrode 331B is formed on lower surface 354B of wiring board 354 . The through hole 319A connects the electrode 318A of the wiring board 313 and the electrode 331A of the wiring board 314 . The through hole 319B connects the electrode 318A of the wiring board 313 and the electrode 331B of the wiring board 354 .

Wiring boards 314 and 354 may be simultaneously fixed to wiring board 313 via adhesive layers 315 and 355 having through holes 319A and 319B. By doing so, man-hours can be reduced.

FIG. 16 is a perspective view of laminated wiring boards 313, 314, 354 and adhesive layers 315, 355. FIG. Upper surface 313A of wiring board 313 has effective area 320 exposed from adhesive layers 315 and 355 and electronic component 316 can be mounted on. Electronic components 316 are mounted on effective area 320 of upper surface 313A of wiring board 313 . By fixing the wiring boards 314, 354 via the adhesive layers 315, 355 to the ends 313C, 313D on opposite sides of the wiring board 313, the effective area 320 can be increased, and the electronic components 316 can be mounted at a high density until reaching the end. Adhesive layers 315 , 355 and/or wiring boards 314 , 354 .

By enlarging the effective area 320, the printing area of the solder paste on the upper surface 313A of the wiring board 313 can be enlarged, the thickness unevenness of the solder paste can be reduced, and the printing accuracy of the solder paste can be improved. As a result, manufacturability is improved, and the production cost of the electronic component package 311 is suppressed.

Electrodes 332A, 332B may be provided on upper surfaces 314A, 354A of wiring boards 314, 354, respectively. By connecting the electrodes 332A and 332B to the motherboard, the electronic component package 311 can be mounted on the motherboard so that the upper surface 313A of the wiring board 313 faces the motherboard.

As shown in FIG. 17 , a plurality of electronic components 316 are mounted on the effective area 320 on the upper surface 313A of the wiring board 313 . Then, at least a portion of the electronic component 316 is covered by the filling layer 312 .

FIG. 18 shows the wall portion 321 for forming the filling layer 312 . A cutout 322 is formed in the wall portion 321 . As shown in FIG. 18 , the wall portion 321 is fixed to the wiring boards 313 , 314 , and 354 . The wall portion 321 can be detached from the wiring boards 313 , 314 , and 354 and can be reused, so that the filling layer 312 can be efficiently formed. Effective area 320 on upper surface 313A of wiring board 313 is entirely surrounded by wiring boards 314 , 354 , adhesive layers 315 , 355 , and wall portion 321 . A filling material to be the filling layer 312 is injected into the effective area 320 on the upper surface 313A of the wiring board 313 surrounded by these members.

19A and 19B are cross-sectional views of wiring board 313 in which filling material 323 is injected into effective area 320 . The filler 323 is made of liquid resin such as silicone resin or epoxy resin before curing. The viscosity of the filler 323 is preferably 1 poise to 1000 poise in the range of a velocity gradient (zuri velocity) of 1/sec to 100/sec. Filling material 323 with a low viscosity of less than 1 poise is expensive. It is difficult for a high-viscosity filler 323 exceeding 1000 poise to expel air bubbles entangled in the filler 323 . In addition, when the velocity gradient at the time of viscosity measurement is less than 1/second, it is difficult to generate shear stress (ずり応force), so viscosity measurement is difficult. When the velocity gradient exceeds 100/sec, it is necessary to measure the viscosity with an expensive viscometer that is stable in rotation at high speed.

FIG. 19A shows a large amount of filling material 323 filling the effective area 320 surrounded by the wall portion 321 and/or the wiring boards 314 , 354 . When the filling material 323 bulges upward from the upper surfaces 314A, 354A of the wiring boards 314 , 354 , the surface of the filling material 323 is easily damaged, which affects the reduction of the height of the electronic component package 311 . Furthermore, filler 323 may overflow from wiring boards 314 and 354 to the outside, and may contaminate the outer peripheral portion of electronic component package 311 and/or electrode 318B formed on lower surface 313B of wiring board 313 .

The height H301 of the bottom 322A of the cutout 322 formed in the wall portion 321 from the upper surface 313A is lower than the height H302 of the upper surfaces 314A, 354A of the wiring boards 314 , 354 from the upper surface 313A. As a result, excess filler material 323 can be released from the effective area 320 to the outside through the cutout 322, and as shown in FIG. , it is possible to prevent the filling material 323 from overflowing from the wiring boards 314 and 354 . Accordingly, as shown in FIG. 14 , electrodes 332A and 332B can be formed on upper surfaces 314A and 354A of wiring boards 314 and 354 , respectively. Thereby, the filling material 323 can be filled easily, and the filling and/or curing of the filling material 323 can be performed automatically by a machine.

FIG. 20 shows the filling layer 312 obtained by curing the filling material 323 . In addition, in FIG. 20, the wall part 321 is removed. By cutting the laminated wiring boards 313, 314, 354 and adhesive layers 315, 355 at the dividing line 311A, a plurality of electronic component packages 311 can be produced together.

FIG. 21 is a perspective view of divided wiring boards 313 , 314 , 354 , adhesive layers 315 , 355 , and filling layer 312 . The wiring boards 313, 314, 354, the adhesive layers 315, 355, and the filling layer 312 can be cut mechanically with a milling cutter or the like. In addition, the laminated wiring boards 313, 314, 354 and bonding boards 313, 314, 354 may be divided by slits and/or V-grooves and/or machining lines previously formed on the wiring boards 313, 314, 354 along the dividing line 311A. Connect layers 315,355.

The adhesive layers 315 and 355 are made of the same material and have the same thickness and/or shape as the adhesive layers 115 and 155 in Embodiment 1 shown in FIG. 1A , and have the same effect.

In addition, the reliability of the electronic component package 311 can be improved by using members with high reliability of FR4 class and/or FR5 class for the adhesive layers 315 , 355 and/or the wiring boards 313 , 314 , 354 .

In addition, the filling material 323 (filling layer 312 ) mainly contains resin such as epoxy resin and/or silicone resin, thereby improving the reliability of the filling layer 312 . In addition, in order to increase the strength of the filling layer 312, the filling material 323 may also contain glass and/or inorganic fillers such as silicon oxide and aluminum oxide. The filling material 323 may contain a non-combustible material such as aluminum hydroxide, thereby making the filling layer 312 difficult to burn. Aluminum hydroxide Al(OH) ₃ is a crystal of white powder and is stable up to a temperature of about 200°C. If the temperature is above this temperature, a dissociation reaction of crystal water will occur, and aluminum hydroxide will be decomposed into 66% _Al2O3 and 34% water. During _this reaction, a large endothermic effect can be obtained, making the filled layer 312 is difficult to burn.

The electronic component package may be shielded by covering the surface of the electronic component package 311 with a conductive film such as a nickel plating layer.

In the above-mentioned embodiments, terms indicating directions such as "above", "below", and "below" only indicate relative directions depending on the positions of structural components of electronic component packages such as wiring boards and/or adhesive layers. Absolute directions such as up-down and reverse are not indicated.

In this electronic component package, even if stress is generated on the metal cover, unnecessary stress is not generated on the electronic component, so it is useful as a small electronic device that is less affected by noise.

Claims (17)

1. electronic component package wherein, comprising:

The 1st distributing board;

The 1st electronic unit, it is installed on described the 1st distributing board top;

The 1st adhesive linkage is on it is arranged on above described the 1st distributing board described;

The 2nd distributing board, it is arranged on described the 1st adhesive linkage top, and is littler than described the 1st distributing board; With

Crown cap, it covers above described the 1st distributing board described, described the 2nd distributing board and described the 1st electronic unit.

2. electronic component package as claimed in claim 1, wherein:

Also comprise:

The 2nd adhesive linkage is on it is arranged on above described the 1st distributing board described; With

The 3rd distributing board, it is arranged on described the 2nd adhesive linkage top,

Described the 1st distributing board has the 1st end and the 2nd end of mutual opposition side,

Described the 1st adhesive linkage and described the 2nd adhesive linkage are arranged at described the 1st end and described the 2nd end of described the 1st distributing board respectively,

Described crown cap covers above described the 1st distributing board described, described the 2nd distributing board, described electronic unit and described the 3rd distributing board.

3. electronic component package as claimed in claim 1, wherein, described crown cap has:

Top part, it touches above described the 2nd distributing board, has the 1st limit and the 2nd limit of mutual opposition side;

The 1st side surface part, extend downwards on its described the 1st limit from described top part, has the following height of total height of described the 1st distributing board, described the 1st adhesive linkage and described the 2nd distributing board; With

The 2nd side surface part, extend downwards on its described the 2nd limit from described top part, has the following height of total height of described the 1st distributing board, described the 1st adhesive linkage and described the 2nd distributing board.

4. electronic component package as claimed in claim 1, wherein, described the 1st adhesive linkage has the through hole that described the 1st distributing board is electrically connected with described the 2nd distributing board.

5. electronic component package as claimed in claim 1, wherein, described the 1st adhesive linkage contains thermosetting resin and inorganic filler, and having thickness is the chip shape of 30 μ m～300 μ m.

6. electronic component package as claimed in claim 1, wherein:

Also comprise:

The 2nd adhesive linkage is on it is arranged on above described the 1st distributing board described;

The 3rd distributing board, it is arranged on described the 2nd adhesive linkage top;

The 2nd electronic unit, it was installed on described the 1st distributing board following;

The 3rd adhesive linkage is on it is arranged on below described the 1st distributing board described; With

Described the 4th distributing board, it was arranged on described the 3rd adhesive linkage following;

Described crown cap covers above described the 1st distributing board described, described the 2nd distributing board, described the 1st electronic unit and described the 3rd distributing board.

7. electronic component package as claimed in claim 6, wherein:

Also comprise:

The 4th adhesive linkage is on it is arranged on below described the 1st distributing board described; With

Described the 5th distributing board, it was arranged on described the 4th adhesive linkage following;

Described the 1st distributing board has the 1st end and the 2nd end of mutual opposition side;

Described the 1st adhesive linkage and described the 3rd adhesive linkage are arranged at described the 1st end of described the 1st distributing board;

Described the 2nd adhesive linkage and described the 4th adhesive linkage are arranged at described the 2nd end of described the 1st distributing board.

8. electronic component package as claimed in claim 1, wherein:

Also comprise:

The 2nd adhesive linkage is on it is arranged on above described the 1st distributing board described;

The 3rd distributing board, it is arranged on described the 2nd adhesive linkage top;

The 3rd adhesive linkage is on it is arranged on below described the 1st distributing board described;

The 4th distributing board, it was arranged on described the 3rd adhesive linkage following;

The 4th adhesive linkage, it was arranged on described the 1st distributing board following;

The 5th distributing board, it was arranged on described the 4th adhesive linkage following;

The 5th adhesive linkage, it was arranged on described the 5th distributing board following;

The 6th adhesive linkage, it was arranged on described the 6th distributing board following;

The 7th distributing board, it is arranged on described the 5th adhesive linkage following go up and on described the 6th adhesive linkage following; With

The 2nd electronic unit, its be installed in described the 7th distributing board above,

Described crown cap covers above described the 1st distributing board described, described the 2nd distributing board, described the 1st electronic unit and described the 3rd distributing board.

9. electronic component package wherein, comprising:

The 1st distributing board;

The 1st adhesive linkage, it is arranged on described the 1st distributing board top;

The 2nd distributing board, it is arranged on described the 1st adhesive linkage top;

The 2nd adhesive linkage is on it is arranged on above described the 1st distributing board described;

The 3rd distributing board, it is arranged on described the 2nd adhesive linkage top;

Electronic unit, its between described the 2nd distributing board and described the 3rd distributing board, be installed in above described the 1st distributing board described on; With

Packed layer, it covers above at least a portion of described electronic unit and described the 1st distributing board described between described the 2nd distributing board and described the 3rd distributing board.

10. electronic component package as claimed in claim 9, wherein,

Described the 1st distributing board has the 1st end and the 2nd end of mutual opposition side;

Described the 2nd distributing board and described the 3rd distributing board are arranged at described the 1st end and described the 2nd end of described the 1st distributing board respectively.

11. electronic component package as claimed in claim 9, wherein, the thickness of described packed layer is below the aggregate thickness of described the 2nd distributing board and described the 1st adhesive linkage.

12. electronic component package as claimed in claim 9, wherein, described packed layer mainly contains resin.

13. electronic component package as claimed in claim 9, wherein, described the 1st adhesive linkage has the through hole that described the 1st distributing board is electrically connected with described the 2nd distributing board.

14. electronic component package as claimed in claim 9, wherein, described the 1st adhesive linkage contains thermosetting resin and inorganic filler, and having thickness is the chip shape of 30 μ m～300 μ m.

15. the manufacture method of an electronic component package wherein, comprising:

Fix the step of 2nd distributing board littler on the 1st distributing board than described the 1st distributing board via the 1st adhesive linkage;

The step of the 1st electronic unit is installed on described the 1st distributing board described; With

With crown cap cover above described the 1st distributing board described, the step of described the 2nd distributing board and described electronic unit.

16. the manufacture method of electronic component package as claimed in claim 15 wherein, also comprises:

Fix the step of 4th distributing board littler on below described the 1st distributing board than described the 1st distributing board via the 3rd adhesive linkage; With

The step of the 2nd electronic unit is installed on below described the 1st distributing board described.

17. the manufacture method of an electronic component package wherein, comprising:

The step of fixing the 2nd distributing board via the 1st adhesive linkage that is arranged on described the 1st distributing board top;

The step of fixing the 3rd distributing board via the 2nd adhesive linkage on described the 1st distributing board described;

Between described the 2nd distributing board and described the 3rd distributing board, the step of electronic unit being installed on described the 1st distributing board described; With

Between described the 2nd distributing board and described the 3rd distributing board, inject packing material, the step of the described top packed layer of at least a portion of the described electronic unit of formation covering and described the 1st distributing board.

Images