CN1017324B - Flux assistant for tin soldering of printed circuit board - Google Patents
Flux assistant for tin soldering of printed circuit boardInfo
- Publication number
- CN1017324B CN1017324B CN 89105911 CN89105911A CN1017324B CN 1017324 B CN1017324 B CN 1017324B CN 89105911 CN89105911 CN 89105911 CN 89105911 A CN89105911 A CN 89105911A CN 1017324 B CN1017324 B CN 1017324B
- Authority
- CN
- China
- Prior art keywords
- acid
- rosin
- present
- bromide
- brazing flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000004907 flux Effects 0.000 title claims abstract description 31
- 238000005476 soldering Methods 0.000 title abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 39
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 21
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 21
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 21
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 5
- 238000005219 brazing Methods 0.000 claims description 24
- -1 aromatic carboxylic acids Chemical class 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 7
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 6
- 239000005711 Benzoic acid Substances 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- 235000010233 benzoic acid Nutrition 0.000 claims description 6
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 6
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 5
- 238000007323 disproportionation reaction Methods 0.000 claims description 4
- LPNBBFKOUUSUDB-UHFFFAOYSA-N p-toluic acid Chemical compound CC1=CC=C(C(O)=O)C=C1 LPNBBFKOUUSUDB-UHFFFAOYSA-N 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 239000003223 protective agent Substances 0.000 claims description 3
- 229960005137 succinic acid Drugs 0.000 claims description 3
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 229960000250 adipic acid Drugs 0.000 claims description 2
- 229960004365 benzoic acid Drugs 0.000 claims description 2
- VZWMKHUMEIECPK-UHFFFAOYSA-M benzyl-dimethyl-octadecylazanium;bromide Chemical group [Br-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 VZWMKHUMEIECPK-UHFFFAOYSA-M 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- PKMWMAMVKCMWQG-UHFFFAOYSA-N n,n-dimethylnonadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCCN(C)C PKMWMAMVKCMWQG-UHFFFAOYSA-N 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009736 wetting Methods 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 3
- 239000013543 active substance Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 231100000956 nontoxicity Toxicity 0.000 abstract 1
- 239000011814 protection agent Substances 0.000 abstract 1
- 125000001453 quaternary ammonium group Chemical group 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 230000003213 activating effect Effects 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 12
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 6
- 150000003863 ammonium salts Chemical class 0.000 description 5
- 230000031709 bromination Effects 0.000 description 5
- 238000005893 bromination reaction Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 241000972773 Aulopiformes Species 0.000 description 3
- 235000021314 Palmitic acid Nutrition 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 235000019515 salmon Nutrition 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- SZEMGTQCPRNXEG-UHFFFAOYSA-M trimethyl(octadecyl)azanium;bromide Chemical compound [Br-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C SZEMGTQCPRNXEG-UHFFFAOYSA-M 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 230000000680 avirulence Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- 206010009866 Cold sweat Diseases 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- MMCPOSDMTGQNKG-UHFFFAOYSA-N anilinium chloride Chemical compound Cl.NC1=CC=CC=C1 MMCPOSDMTGQNKG-UHFFFAOYSA-N 0.000 description 1
- 239000012867 bioactive agent Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a welding flux for the soft soldering of a printed circuit board, which is characterized in that quaternary ammonium bromides and aromatic carboxylic acid or diacid are selected as an active agent, a small amount of film-forming protection agents are added in rosin resin, and isopropyl alcohol is used as a solvent to form the welding flux of the present invention. The welding flux has the advantages of excellent performances, such as high activity, good weldability, great wetting power, fast expansion rate, high insulativity, non-corrosivity, non-toxicity, long-term stability, no need of washing, etc. The present invention can be used for wave soldering dip-soldering production lines of color television electrical adjustment, computer terminals, automation meters, post telephone and telegraph communication, machinery unit assembly of color television, etc.
Description
The present invention is a kind of printed wiring board solder brazing flux.
The wave-soldering connection is adopted in the welding of each discrete component and circuit on the microelectronic product printed wiring board, and the carrying out of wave-soldering must be used brazing flux.People early have recognized that single rosin solvent-borne type brazing flux, help the weldering ability, and welding effect is bad, wherein make high-quality brazing flux and select for use activating agent to add.The hydrogen halogen salt activating agent of methyl amine, ethylamine helps the weldering ability to increase, but with brazing flux carrier intermiscibility bad (special public clear 36-16266 communique, special public clear 52-34016 communique).And aromatic amine, the aromatic amine activating agent of hexichol and brazing flux carrier intermiscibility are good, but help the weldering ability to reduce (special public clear 36-16267 communique) again.Once tried out anilinechloride activating agent and carrier intermiscibility and helped the weldering ability better, but toxicity is too big, it is dangerous to bring for the pile line operation personnel, and corrosivity is big, and the weldering plate must clean.
The objective of the invention is to select one or more can be better with brazing flux carrier intermiscibility, can improve braze ability, the avirulent activating agent of no burn into again, thereby make that high activity, non-aggressive, weldering plate are tack-free, long-time stability, avirulent high-quality brazing flux.
The present invention implements like this: with purifying or modified rosin 10-35%, aromatic carboxylic acids or binary acid 1-10%, and quaternary ammonium salt bromide 0.5-3%(weight), surplus is that isopropyl alcohol is formed the said brazing flux of the present invention.
Said purifying of the present invention or modified rosin are any one in disproportionation rosin, first class rosin, superfine rosin, the Foral.
One of activating agent of brazing flux of the present invention quaternary ammonium salt bromide can be octadecyl dimethyl benzyl ammonium bromide or octadecyl trimethylammonium bromide.
Select for use this class activating agent corrosivity minimum, molecular weight is big, and content of halide ions is low, has excellent emulsibility again, makes product possess favorable uniformity, and the foaming pipe is not stopped up in not sedimentation of long-term storage during use, have characteristics such as no burn into avirulence.
Two aromatic carboxylic acids of the activating agent of brazing flux of the present invention or binary acid are any one in p-methylbenzoic acid, cumfrey, P-hydroxybenzoic acid, benzoic acid, butanedioic acid, adipic acid, the decanedioic acid.
Select for use this class activating agent cost of material lower, and can guarantee the reducing power to the metal base oxide, owing under welding temperature sublimation process is arranged, reduced the surface tension of scolder simultaneously, improved solderability, postwelding is noresidue again.
The plate face after welding of rosin flux always sticking hand can occur and be clamminess, for clean appearance comfortable needs of guaranteeing the plate face cleans.The present invention adopts and add the protectant way of a small amount of film forming in abietic resin, to improve softening point, protects solder joint and weld interface, postwelding nature film forming, and weldering plate cleaning is tack-free, need not to clean.The film forming protective agent can be polyvinyl butyral resin (viscosity 11m
2/ s), in the polyethylene glycol (molecular weight 200 or 400), newtrex (140#) any one, addition is a 0.5-5%(weight).
For making solder joint not dazzling, also can add 2-10%(weight) palmitic acid plays photoextinction.
The preparation method of brazing flux of the present invention:
(addition is not strict with to add part in the reactor of agitator is housed earlier; being convenient to stirring and dissolving gets final product) isopropyl alcohol; under agitation add activating agent quaternary ammonium salt bromide; treat that bromide dissolving back adds the rosin (granularity does not have strict demand) through crushing; add aromatic carboxylic acids or binary acid again; add remaining isopropyl alcohol at last; all feeding intake finishes continues to stir; until the solution transparent and homogeneous; blowing, centrifugal filtration, product are yellow or orange red uniform liquid then, also can add the film forming protective agent after adding rosin.
Be transportation or easy to carry, also can be made into the siccative of paste.
It is activating agent that the present invention selects quaternary amine bromide and aromatic acid or binary acid, in the preparation process of brazing flux, need not heating, directly just can be dissolved in well in the brazing flux carrier in normal temperature even when room temperature is 0 ℃, this brazing flux is preserved no precipitum at cold compartment of refrigerator long-term (more than 1 year) and is separated out.And the condition stirring and dissolving that the interpolation of activating agent 2 ethylhexylamine hydrohalogenic acid salts need be heated at 100 ℃ in the existing technology makes brazing flux, and the intermiscibility of brazing flux of the present invention is better than prior art undoubtedly.And, among the present invention the adding of two kinds of bioactive agent compositions played the cleaned base material surface, make scolder to base material be full infiltration, reduce solder surface tension force, give the higher wetting power of solder flux effect, have excellent solderability, because non-corrosiveness, weldering plate can be without cleaning post processing, avirulence, guaranteeing operating personnel's health.
The brazing flux that the present invention makes is yellow or salmon liquid, the rate of spread 93 ± 3(%), wetting power-80～-86 dyne (average 3 seconds to copper cash), insulaion resistance＞1 * 10
11Ω (the JIS3197-1976 standard is pressed in test).
The brazing flux that the present invention makes can be used on various wave-solderings, the immersed solder streamlines such as colour TV electricity accent, terminal, instrument and meter for automation, post and telecommunications, colour TV assembling.
Embodiment one:
With 100kg is example:
In enamel still, add the 50kg isopropyl alcohol earlier, under agitation add 1.2kg octadecyl dimethyl benzyl bromination ammonium salt, treat that salt dissolving back adds the Foral 30kg that crushes, add benzoic acid 4.8kg again, continue to add isopropyl alcohol 14kg, up to the solution transparent and homogeneous, through centrifugal filtration, obtain faint yellow uniform liquid at last by the reactor blowing.
Embodiment two:
Basic operation such as embodiment one, it is as follows specifically to fill a prescription:
Disproportionation rosin 30%
Octadecyl trimethylammonium bromide salt 1%
P-hydroxybenzoic acid 5%
Isopropyl alcohol 64%
Embodiment three:
Basic operation such as embodiment one, specifically fill a prescription as follows:
Disproportionation rosin 26%
Octadecyl dimethyl benzyl bromination ammonium salt 1.2%
Benzoic acid 5.5%
Isopropyl alcohol 67.3%
More than three examples make brazing flux proportion D
20 4Between 0.86～0.88, the rate of spread 93 ± 3%, wetting power (average 3 seconds) is-80 dyne～-86 dyne to copper cash, insulaion resistance＞1 * 10
11Ω, water-soluble resistance 4 * 10
4(Ω-cm), be successfully used to the wave soldering of various printed substrates such as electric wave-soldering, immersed solder and the electronic computer of transferring of colour TV, post and telecommunications, instrument and meter for automation.
Embodiment four:
Basic operation such as embodiment one, it is as follows specifically to fill a prescription:
Superfine rosin 20%
Polyvinyl butyral resin (viscosity 11m
2/ s) 1%
Octadecyl dimethyl benzyl bromination ammonium salt 1.2%
Benzoic acid 3%
Palmitic acid 3%
Isopropyl alcohol 71.8%
Embodiment five:
Basic operation such as embodiment one, it is as follows specifically to fill a prescription:
Superfine rosin 18%
Newtrex 2%
Octadecyl trimethylammonium bromide salt 1%
Benzoic acid 4%
Palmitic acid 3%
Isopropyl alcohol 72%
More than the brazing fluxes that obtain of two examples be salmon liquid, have the rate of spread higher, and a weldering plate nature film forming than first three example, can clean, be suitable for the welding of colour TV complete machine and use.
Embodiment six:
Basic operation such as embodiment one, it is as follows specifically to fill a prescription:
Superfine rosin 15%
Octadecyl dimethyl benzyl bromination ammonium salt 1.0%
Adipic acid 2.0%
Isopropyl alcohol 82%
Embodiment seven:
Basic operation such as embodiment one, it is as follows specifically to fill a prescription:
First class rosin 18%
Octadecyl dimethyl benzyl bromination ammonium salt 1.2%
Butanedioic acid 1.8%
Isopropyl alcohol 79%
More than two examples join brazing flux be salmon liquid, proportion D
15 4Be 0.83, the rate of spread is more on the low side than top example, and used tin solder is lower than 1～5 routine fusing point, belongs to Sn parent metal (be Sn 60%, Pb 40%), is suitable for colour TV complete machine welding usefulness, and solder joint is full, do not draw point, and system test is qualified.
Claims (2)
1, a kind of printed substrate solder brazing flux is characterized in that by purifying or modified rosin 10-35% (weight), aromatic carboxylic acids or binary acid 1-10%, and quaternary ammonium salt bromide 0.5-3%, surplus is that isopropyl alcohol is formed, wherein,
A. purifying or modified rosin are any one in superfine rosin, first class rosin, disproportionation rosin, the Foral,
B. aromatic carboxylic acids or binary acid are any one in p-methylbenzoic acid, cumfrey, P-hydroxybenzoic acid, benzoic acid, butanedioic acid, hexanedioic acid, the decanedioic acid,
C. the quaternary ammonium salt bromide is octadecyl dimethyl benzyl ammonium bromide or octadecyl trimethyl amine bromide.
2, brazing flux according to claim 1 is characterized in that adding in polyvinyl butyral resin, polyethylene glycol, the newtrex any one as the film forming protective agent, and addition is a 0.5-3%(weight).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89105911 CN1017324B (en) | 1989-05-09 | 1989-05-09 | Flux assistant for tin soldering of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89105911 CN1017324B (en) | 1989-05-09 | 1989-05-09 | Flux assistant for tin soldering of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1047238A CN1047238A (en) | 1990-11-28 |
| CN1017324B true CN1017324B (en) | 1992-07-08 |
Family
ID=4856545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89105911 Expired CN1017324B (en) | 1989-05-09 | 1989-05-09 | Flux assistant for tin soldering of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1017324B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308114C (en) * | 2004-10-12 | 2007-04-04 | 哈尔滨商业大学 | Use of 1-methyl-4-isopropyl-bicyclic [2,2,2] octene-2,3-dicarboxylic acid |
| CN100421862C (en) * | 2002-05-30 | 2008-10-01 | 弗莱氏金属公司 | Brazing Paste Flux Systems |
| CN100574965C (en) * | 2002-07-30 | 2009-12-30 | 自由度半导体公司 | Method for preparing metal surfaces to be soldered with supersaturated fine-grained flux and method for preparing said flux |
| CN101745760B (en) * | 2008-12-08 | 2012-07-04 | 厦门法拉电子股份有限公司 | Lead-free solder environmental-protection scaling powder used for soldering capacitor with film adhered on surface |
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| CN1056795C (en) * | 1997-02-21 | 2000-09-27 | 清华大学 | Solid soldering agent used in soldering tin rod |
| JP3797990B2 (en) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | Thermosetting flux and solder paste |
| JP4213642B2 (en) * | 2004-08-16 | 2009-01-21 | ハリマ化成株式会社 | Soldering flux, soldering method and printed circuit board |
| JP4883996B2 (en) * | 2005-05-24 | 2012-02-22 | 四国化成工業株式会社 | Water-soluble preflux and its use |
| CN101332548B (en) * | 2008-03-31 | 2010-07-21 | 苏州优诺电子材料科技有限公司 | Halogen-free extinction welding flux |
| US8430295B2 (en) * | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
| CN107127413A (en) * | 2017-06-14 | 2017-09-05 | 四川九洲空管科技有限责任公司 | A kind of method of removal SMT component's feets oxidation |
| CN117733406B (en) * | 2023-11-30 | 2024-08-13 | 江苏三沃电子科技有限公司 | Lead-free halogen-free no-clean soldering paste |
| CN119368967B (en) * | 2024-12-27 | 2025-03-11 | 东莞市星马焊锡有限公司 | Low-splashing lead-free externally-coated rosin soldering tin wire |
-
1989
- 1989-05-09 CN CN 89105911 patent/CN1017324B/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100421862C (en) * | 2002-05-30 | 2008-10-01 | 弗莱氏金属公司 | Brazing Paste Flux Systems |
| CN100574965C (en) * | 2002-07-30 | 2009-12-30 | 自由度半导体公司 | Method for preparing metal surfaces to be soldered with supersaturated fine-grained flux and method for preparing said flux |
| CN1308114C (en) * | 2004-10-12 | 2007-04-04 | 哈尔滨商业大学 | Use of 1-methyl-4-isopropyl-bicyclic [2,2,2] octene-2,3-dicarboxylic acid |
| CN101745760B (en) * | 2008-12-08 | 2012-07-04 | 厦门法拉电子股份有限公司 | Lead-free solder environmental-protection scaling powder used for soldering capacitor with film adhered on surface |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1047238A (en) | 1990-11-28 |
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