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CN101679811B - 粘结剂组合物 - Google Patents

粘结剂组合物 Download PDF

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CN101679811B
CN101679811B CN2008800196096A CN200880019609A CN101679811B CN 101679811 B CN101679811 B CN 101679811B CN 2008800196096 A CN2008800196096 A CN 2008800196096A CN 200880019609 A CN200880019609 A CN 200880019609A CN 101679811 B CN101679811 B CN 101679811B
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CN101679811A (zh
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阿久津恭志
山田泰伸
宫内幸一
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Dexerials Corp
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Abstract

本发明涉及即使柔性布线衬底的布线金属表面或暴露于布线间的聚酰亚胺表面处于较平滑的状态，也能够对这些表面显示良好粘结强度的粘结剂组合物，其包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂，还包含式(1)所表示的末端具有氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯。CH2＝CR0-COO-R1-NHCOO-R2，其中R0是氢或甲基，R1是二价烃基，R2是任选取代的低级烷基。

Description

粘结剂组合物
技术领域
本发明涉及包含热塑性树脂、单官能丙烯酸酯和自由基聚合引发剂的粘结剂组合物。
背景技术
在液晶显示装置、等离子体显示装置和有机EL显示装置等显示装置中，大部分显示板经由各向异性导电膜与柔性布线衬底通过热压焊而各向异性导电连接。作为这样的各向异性导电膜通常使用将导电性粒子分散在以热塑性树脂、环氧类树脂和胺类硬化剂为主成分的粘结剂组合物中所形成的膜，该热压焊条件通常为180℃下7秒。
然而，近年来由于显示板的屏幕尺寸增加，因此在采用各向异性导电膜进行热压焊时，不可忽视热应力对显示板的影响，为了尽可能排除该影响，需要将热压焊条件由180℃下7秒变为160℃±20℃下4秒。因此，作为能够在较低温度下压焊的各向异性导电膜可使用将导电性粒子分散在以热塑性树脂、多官能丙烯酸酯和过氧化物作为主成分的粘结剂中而形成膜的自由基聚合性各向异性导电膜。此外，在这种自由基聚合性各向异性导电膜的热硬化过程中，不期望生成羟基，所述羟基提高对显示板或柔性布线衬底的粘结性。因此，为了改善粘结性，将分子内具有2个以上对聚酰亚胺表面或金属显示亲和性的高极性氨基甲酸酯键的氨基甲酸酯丙烯酸酯掺混至粘结剂中(专利文献1)。
专利文献1：日本特开2006-257208号公报
发明内容
发明所要解决的课题
为了提高与各向异性导电膜的粘结性，在热压焊之前将用于显示板或柔性布线衬底的各向异性导电连接的表面用化学药品进行表面粗糙化处理，但是随着最近布线间距的密集化，当将柔性布线衬底的布线金属表面或暴露于布线间的聚酰亚胺表面通过药剂与以往同样地进行表面粗糙化处理时，产生布线金属变细等不良影响，因此难以与以往同等水平地进行表面粗糙化处理。
因此，存在如下问题：必须在这些表面未充分进行表面粗糙化处理而保持较平滑的状态下通过各向异性导电膜进行热压焊，即使采用掺混有氨基甲酸酯丙烯酸酯的专利文献1的各向异性导电膜也不能确保显示板与柔性布线衬底间的充分粘结强度。
本发明旨在解决上述现有技术的问题，其目的在于：即使柔性布线衬底的布线金属表面或暴露于布线间的聚酰亚胺表面处于较平滑状态，包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂的粘结剂组合物也能够对这些表面显示良好的粘结强度。
解决课题的手段
本发明人发现之所以掺混至包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂的粘结剂组合物中的常规氨基甲酸酯丙烯酸酯在比较平滑的显示板与柔性布线衬底之间不能确保充分的粘结强度，是因为在专利文献1中使用的氨基甲酸酯丙烯酸酯的氨基甲酸酯键不是存在于分子末端而是存在于内部，因而对柔性布线衬底的布线金属表面或暴露于布线间的聚酰亚胺表面的作用由于立体位阻等的影响而被抑制，并发现通过使用末端具有氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯代替分子内具有2个以上氨基甲酸酯键的氨基甲酸酯丙烯酸酯能够实现上述目的，从而完成本发明。
即本发明提供粘结剂组合物，其包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂，其特征在于，包含式(1)所表示的末端具有氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯。
CH2＝CR0-COO-R1-NHCOO-R2       (1)
式(1)中，R0是氢或甲基，R1是二价烃基，R2是任选取代的低级烷基。
此外，本发明提供连接结构，其由相对向的电极经由夹持于其间的上述粘结剂组合物进行电连接而形成，所述粘结剂组合物包含用于各向异性导电连接的导电离子。
发明效果
包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂的本发明的粘结剂组合物包含末端存在氨基甲酸酯残基的氨基甲酸酯丙烯酸酯。在这种情况下，丙烯酸酯残基是聚合位点并期望存在于分子末端，因此末端存在氨基甲酸酯残基的氨基甲酸酯丙烯酸酯必定是单官能的。因此与分子内具有2个以上氨基甲酸酯键的氨基甲酸酯丙烯酸酯相比，末端存在氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯能够使分子结构本身变小，并能够充分发挥氨基甲酸酯键对柔性布线衬底的布线金属表面或暴露于布线间的聚酰亚胺表面的亲和作用，因此即使这些表面处于比较平滑的状态也能够显示良好的粘结强度。
附图简述
图1是粘结强度试验的说明图(图中，FPC是柔性印刷电路的缩写，TAB是卷带自动接合的缩写，ACF是各向异性导电膜的缩写)。
实施发明的最佳方式
本发明的粘结剂组合物是包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂的粘结剂组合物，其特征在于，包含式(1)所表示的末端具有氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯。
CH2＝CR0-COO-R1-NHCOO-R2       (1)
在式(1)中，R0是氢或甲基。本文中，当R0是氢时，式(1)的单官能氨基甲酸酯丙烯酸酯的末端具有相对于甲基丙烯酸酯更富于反应性的丙烯酸酯残基，当R0为甲基时，式(1)的单官能氨基甲酸酯丙烯酸酯的末端具有甲基丙烯酸酯残基。因此，当要求粘结剂组合物的具有较高反应性时，优选R0是氢，当要求粘结剂组合物具有较低反应性时，优选R0是甲基。
R1是二价烃基。作为二价烃基，可列举出亚甲基、亚乙基、亚丙基、亚丁基、亚环己基等亚烷基，亚苯基、亚萘基等亚芳基，亚二甲苯基等亚芳烷基。其中，在提高粘结强度效果方面优选亚烷基，特别优选亚甲基、亚乙基，更优选亚乙基。
R2是任选取代的低级烷基。作为取代基，可列举出甲氧基、乙氧基等烷氧基，苯基等芳基。此外，作为低级烷基可列举出甲基、乙基、异丙基、丙基、丁基、异丁基、戊基、己基、环己基等。作为R2的优选具体实例，可列举出甲基、乙基、乙氧基乙基、丁基、己基，其中在提高粘结强度效果方面更优选甲基或乙基。
因此，作为式(1)的单官能氨基甲酸酯丙烯酸酯的优选具体实例，可列举出N-(甲基丙烯酰氧乙基)氨基甲酸甲酯、N-(甲基丙烯酰氧乙基)氨基甲酸乙酯、N-(甲基丙烯酰氧乙基)氨基甲酸乙氧基乙酯、N-(甲基丙烯酰氧乙基)氨基甲酸丁酯、N-(甲基丙烯酰氧乙基)氨基甲酸己酯等。特别优选N-(甲基丙烯酰氧乙基)氨基甲酸甲酯或乙酯。
单官能氨基甲酸酯丙烯酸酯在粘结剂组合物中的含量过少时则引起粘结力下降，过多时则存在引起内聚力下降而传导不良的倾向，因此所述单官能氨基甲酸酯丙烯酸酯在树脂固体成分(热塑性树脂、多官能丙烯酸酯、自由基聚合引发剂和单官能氨基甲酸酯丙烯酸酯的总计)中的含量优选为2质量％-20质量％，更优选5质量％-10质量％。
需说明的是，作为单官能氨基甲酸酯丙烯酸酯能够使用市售商品，但是如日本特开昭54-005921号公报中所公开，通过使具有甲基丙烯酰氧基和末端异氰酸酯基的化合物与醇类反应能够合成单官能氨基甲酸酯丙烯酸酯。
构成本发明粘结剂组合物的热塑性树脂是用于形成膜的成分，并能够从通常用于各向异性导电粘结剂或绝缘性粘结剂等领域的热塑性树脂中适当选择使用。作为热塑性树脂的具体实例，可列举出苯氧基树脂、聚氨基甲酸酯树脂、聚酰亚胺、聚酰胺、聚(甲基)丙烯酸酯、聚醚聚氨基甲酸酯、NBR树脂等。从确保成膜性并担保与其它成分的相容性来看，这些热塑性树脂的重均分子量通常为5000-150000。
热塑性树脂在粘结剂组合物中的含量过少时则难以膜化，过多时则存在连接时不能排除树脂而引起传导不良的倾向，因此所述热塑性树脂在树脂固体成分(热塑性树脂、多官能丙烯酸酯、自由基聚合引发剂和单官能氨基甲酸酯丙烯酸酯的总计)中的含量优选10质量％-60质量％，更优选20质量％-50质量％。
构成本发明粘结剂组合物的多官能丙烯酸酯是向粘结剂组合物膜中引入三维网状结构并使内聚力提高的成分。作为这样的多官能丙烯酸酯是分子中具有2个以上丙烯酸酯残基或甲基丙烯酸酯残基的聚合性化合物，并能够从通常用于各向异性导电粘结剂或绝缘性粘结剂等领域的多官能丙烯酸酯中适当选择使用。作为多官能丙烯酸酯的具体实例，可列举出三羟甲基丙烷三(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚亚烷基二醇二(甲基)丙烯酸酯、二环戊烯基(甲基)丙烯酸酯、二环戊烯基氧乙基(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、异氰尿酸改性的2官能(甲基)丙烯酸酯、异氰尿酸改性的3官能(甲基)丙烯酸酯等。
多官能丙烯酸酯在粘结剂组合物中的含量过少时则因内聚力不足而使连接可靠性下降，过多时则存在变硬而使应力松弛效果下降并粘结力下降的倾向，因此所述多官能丙烯酸酯在树脂固体成分(热塑性树脂、多官能丙烯酸酯、自由基聚合引发剂和单官能氨基甲酸酯丙烯酸酯的总计)中的含量优选10质量％-60质量％，更优选20质量％-50质量％。
构成本发明粘结剂组合物的自由基聚合引发剂是用于使多官能丙烯酸酯以及单官能氨基甲酸酯丙烯酸酯自由基聚合的引发剂，并能够从通常用于各向异性导电粘结剂或绝缘性粘结剂等领域且在聚合中不易产生气体的自由基聚合引发剂中适当选择使用。从稳定性、反应性、相容性的观点来看，作为自由基聚合引发剂的具体实例，能够优选使用1分钟半衰期温度为90℃-175℃且分子量为180-1,000的有机过氧化物。作为这样的有机过氧化物的具体实例，可列举出过氧化苯甲酰、过氧化新癸酸枯基酯、过氧化新癸酸1，1，3，3-四甲基丁酯、过氧化新癸酸1-环己基-1-甲基乙酯、过氧化新癸酸叔己酯、过氧化新癸酸叔丁酯、过氧化特戊酸叔丁酯、过氧化-2-乙基己酸1，1，3，3-四甲基丁酯、2，5-二甲基-2，5-二(2-乙基过氧化己酰)己烷(2，5-ジメチル-2，5-ジ(2-エチルヘキサノイルパ一オキシ)ヘキサン)、过氧化-2-乙基己酸叔己酯、过氧化-2-乙基己酸叔丁酯、过氧化新庚酸叔丁酯、过氧化-2-乙基己酸叔戊酯、过氧化六氢对苯二甲酸二-叔丁酯、过氧化-3，5，5-三甲基己酸叔戊酯、过氧化新癸酸3-羟基-1，1-二甲基丁酯、过氧化新癸酸叔戊酯、过氧化-2-乙基己酸叔戊酯、过氧化异丙基单碳酸叔己酯、过氧化马来酸叔丁酯、过氧化-3，5，5-三甲基己酸叔丁酯、过氧化月桂酸叔丁酯、2，5-二甲基-2，5-二(3-甲基过氧化苯甲酰)己烷(2，5-ジメチル-2，5-ジ(3-メチルベンソイルパ一オキシ)ヘキサン)、过氧化-2-乙基己基单碳酸叔丁酯、过氧化苯甲酸叔己酯、2，5-二甲基-2，5-二(过氧化苯甲酰)己烷(2，5-ジメチル-2，5-ジ(ベンソイルパ一オキシ)ヘキサン)、过氧化苯甲酸叔丁酯、过氧化三甲基己二酸二丁酯、过氧化正辛酸叔戊酯、过氧化异壬酸叔戊酯、过氧化苯甲酸叔戊酯等。这些化合物可两种以上混合使用。
自由基聚合引发剂在粘结剂组合物中的含量过少时则硬化不足，过多时则存在加热加压时树脂排除性下降并连接阻力升高的倾向，因此所述自由基聚合引发剂在树脂固体成分(热塑性树脂、多官能丙烯酸酯、自由基聚合引发剂和单官能氨基甲酸酯丙烯酸酯的总计)中的含量优选1质量％-10质量％，更优选2质量％-8质量％。
根据需要，本发明的粘结剂组合物能够包含粒径为0.1μm-10μm的镍粒子等导电粒子、粒径为2μm-10μm的树脂被覆镍粒子等各向异性导电粒子、粒径为0.01μm-1μm的二氧化硅等绝缘填充物等。如果包含导电粒子，则能够用作导电性粘结剂组合物。如果包含各向异性导电粒子，则能够用作各向异性导电粘结剂。在这种情况下，在树脂固体成分(热塑性树脂、多官能丙烯酸酯、自由基聚合引发剂和单官能氨基甲酸酯丙烯酸酯的总计)中，优选以1质量％-50质量％、更优选以1质量％-40质量％掺混各向异性导电粒子。此外，如果包含填充物，则能够使该硬化物的机械强度提高。此外，为了在硬化时的应力松弛，可包含各种橡胶材料。此外根据需要，能够适当掺混甲醇、乙醇、丁醇等醇类，乙酸乙酯等酯类，丙酮、甲基乙基酮等酮类等通用溶剂。当使粘结剂组合物膜化时，优选包含这些溶剂。
本发明的粘结剂组合物能够如下配制：将热塑性树脂、多官能丙烯酸酯、自由基聚合引发剂、式(1)所表示的末端具有氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯和根据需要的其它添加成分或溶剂以常规方法均匀混合。
本发明的粘结剂组合物根据公知方法能够作为糊料或膜使用。例如，将本发明的粘结剂组合物作为糊料或膜夹持在相对向的电极间进行热压焊，由此获得由电极彼此电连接而形成的连接结构。作为相对向的电极，能够列举出显示板的电极与柔性布线衬底的电极的组合，但不限于此。此外，作为优选方式，相对向的电极之一可列举出半导体元件的电极极板。
作为热压焊条件，可列举出在较低温度下短时间的硬化条件，通常为100℃-200℃、3秒-10秒，优选130℃-200℃、3秒-6秒。由此，能够实现宽压焊温度界限。
实施例
以下将通过实施例具体地说明本发明。
实施例1
将100质量份甲醇添加至10质量份甲基丙烯酸异氰酸基乙酯中，在60℃下搅拌10小时以获得N-(甲基丙烯酰氧基乙基)氨基甲酸甲基酯的甲醇溶液。向所含N-(甲基丙烯酰氧基乙基)氨基甲酸甲基酯为10质量份的量的上述甲醇溶液中均匀地混合40质量份苯氧基树脂(YP50，东都化成社)、40质量份二丙烯酸酯(ライトエステル3EG，共荣社化学社)、10质量份聚酯系聚氨基甲酸酯(ニツポラン3113，日本ポリウレタン工业社)、3质量份过氧化苯甲酰(日本油脂社)和乙酸乙酯与甲苯的混合溶剂(1∶1(体积比)，该混合溶剂的量使得树脂固体成分为50质量％)，以获得粘结剂组合物。
实施例2
除了使用100质量份乙醇代替100质量份甲醇以外，通过重复与实施例1同样的操作以配制N-(甲基丙烯酰氧基乙基)氨基甲酸乙酯的乙醇溶液，从而获得粘结剂组合物。
实施例3
除了使用100质量份乙氧基乙醇代替100质量份甲醇以外，通过重复与实施例1同样的操作以配制N-(甲基丙烯酰氧基乙基)氨基甲酸乙氧基乙酯的乙氧基乙醇溶液，从而获得粘结剂组合物。
实施例4
除了使用100质量份丁醇代替100质量份甲醇以外，通过重复与实施例1同样的操作以配制N-(甲基丙烯酰氧基乙基)氨基甲酸丁酯的丁醇溶液，从而获得粘结剂组合物。
实施例5
除了使用100质量份己醇代替100质量份甲醇以外，通过重复与实施例1同样的操作以配制N-(甲基丙烯酰氧基乙基)氨基甲酸己酯的己醇溶液，从而获得粘结剂组合物。
比较例1
除了使用100质量份苯酚代替100质量份甲醇以外，通过重复与实施例1同样的操作，以配制N-(甲基丙烯酰氧基乙基)氨基甲酸苯酯的苯酚溶液，从而获得粘结剂组合物。
比较例2
将10质量份2官能氨基甲酸酯丙烯酸酯(U-ZPPA，新中村化学社)与40质量份苯氧基树脂(YP50，东都化成社)、40质量份二丙烯酸酯(ライトエステル3EG，共荣社化学社)、10质量份聚酯系聚氨基甲酸酯(ニツポラン3113，日本ポリウレタン工业社)、3质量份过氧化苯甲酰(日本油脂社)和乙酸乙酯与甲苯的混合溶剂(1∶1(体积比)，该混合溶剂的量使得树脂固体成分为50质量％)均匀地混合，以获得粘结剂组合物。
比较例3
将40质量份苯氧基树脂(YP50，东都化成社)、40质量份二丙烯酸酯(ライトエステル3EG，共荣社化学社)、10质量份聚酯系聚氨基甲酸酯(ニツポラン3113、日本ポリウレタン工业社)和3质量份过氧化苯甲酰(日本油脂社)和乙酸乙酯与甲苯的混合溶剂(1∶1(体积比)，该混合溶剂的量使得树脂固体成分为50质量％)均匀地混合，以获得粘结剂组合物。
评价
将实施例和比较例的粘结剂组合物涂布于厚度为50μm的经剥离处理的聚对苯二甲酸乙二酯膜上，使干燥厚度为50μm，并使其在80℃的烘箱中干燥5分钟以制备粘结膜。采用所得粘结膜如下所述地测定粘结强度。
(粘结强度试验：参照图1)
在0.7mm厚的玻璃衬底上准备已形成ITO膜的ITO玻璃衬底和50μm间距(铜布线宽度为25μm，铜布线厚度为8μm)的聚酰亚胺柔性布线衬底(带宽为40mm)，使布线的电极分别相对向，并在其间夹持粘结膜，以160℃、4MPa下4秒的条件热压焊。热压焊后，在聚酰亚胺柔性布线衬底上以10mm宽度切开直至粘结膜的切口，并用拉伸试验装置(テンシロン，オリエンテツク社)以50mm/min的速度进行90度剥离。此时获得的粘结强度值如表1所示。此外，从实用性来看，期望粘结强度为5N/cm以上。
[表1]
如表1所示，从实用性来看，实施例1-5的粘结剂组合物的粘结强度优选5N/cm以上，特别是R2为甲基、乙基时粘结强度尤其高。
另一方面，在R2为苯基的比较例1的情况、使用了2官能氨基甲酸酯丙烯酸酯的比较例2的情况、未使用氨基甲酸酯丙烯酸酯的比较例3的情况中任一情况下，粘结强度均不为5N/cm以上。
工业上的利用可能性
包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂的本发明的粘结剂组合物包含末端存在氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯。由此，能够充分发挥氨基甲酸酯键对柔性布线衬底的布线金属表面或暴露于布线间的聚酰亚胺表面的亲和作用，因此即使这些表面处于较平滑的状态也能够显示良好的粘结强度。因此能够用于间距密集化且粘覆表面较平滑的电子材料的连接。

Claims (8)

1.粘结剂组合物，其包含热塑性树脂、多官能丙烯酸酯和自由基聚合引发剂，其特征在于，包含式(1)所表示的末端具有氨基甲酸酯残基的单官能氨基甲酸酯丙烯酸酯，
CH2＝CR0-COO-R1-NHCOO-R2              (1)
其中，R0是氢或甲基，R1是二价烃基，R2是任选取代的甲基、乙基、异丙基、丙基、丁基、异丁基、戊基、己基或环己基，
树脂固体成分中包含2质量％-20质量％的所述单官能氨基甲酸酯丙烯酸酯。
2.权利要求1的粘结剂组合物，其中，R1是亚烷基。
3.权利要求2的粘结剂组合物，其中，亚烷基是亚乙基。
4.权利要求1-3中任一项的粘结剂组合物，其中，R2是甲基、乙基、乙氧基乙基、丁基或己基。
5.权利要求4的粘结剂组合物，其中，R2是甲基或乙基。
6.权利要求1-3中任一项的粘结剂组合物，其中，所述粘结剂组合物包含用于各向异性导电连接的导电粒子。
7.连接结构，其由相对向的电极经由夹持于其间的权利要求6的粘结剂组合物进行电连接而形成。
8.权利要求7的连接结构，其中，相对向的电极之一是半导体元件的电极极板。
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