CN101587557B - A kind of Subscriber Identity Module and manufacture method thereof and system - Google Patents
A kind of Subscriber Identity Module and manufacture method thereof and system Download PDFInfo
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- CN101587557B CN101587557B CN200910086757.6A CN200910086757A CN101587557B CN 101587557 B CN101587557 B CN 101587557B CN 200910086757 A CN200910086757 A CN 200910086757A CN 101587557 B CN101587557 B CN 101587557B
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- 238000000465 moulding Methods 0.000 claims description 7
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- 238000007639 printing Methods 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 4
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- 238000005266 casting Methods 0.000 claims description 2
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- 239000000463 material Substances 0.000 abstract description 17
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- 230000005540 biological transmission Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
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Abstract
The invention discloses a kind of manufacture method and system of Subscriber Identity Module, complex process many in order to the Subscriber Identity Module manufacturing process solving existing employing stepped construction, material, manufacture and transportation cost are high, problem such as waste resource, contaminated environment etc.The manufacture method of Subscriber Identity Module, comprise: the relative position residing on lesser calorie according to the shape and size of lesser calorie, the shape and size of IC chip module and IC chip module, adopts the lesser calorie card base of the shaping slot with IC chip module of one-shot forming technique; IC chip module is encapsulated in the slot place of described lesser calorie card base, obtains finished product lesser calorie.The present invention also provides a kind of Subscriber Identity Module.
Description
Technical Field
The invention relates to the technical field of smart card production, in particular to a user identification card and a manufacturing method and a system thereof.
Background
The ISO (international organization for standardization) 7816 standard specifies basic technical requirements of an ID-1 type contact IC (integrated circuits) card, including physical characteristics, electrical characteristics, and the like. Wherein, the dimension of the ID-1 type contact IC card is 85.60mm multiplied by 53.98mm multiplied by 0.76mm, and the error range of +/-0.08 mm can be allowed when the thickness is 0.76 mm; eight contacts C1-C8 are defined, and each contact should have a rectangular surface area of not less than 2mm x 1.7mm, and each contact should be electrically isolated from the other contacts.
SIM (subscriber identity module) cards, UIM (user identity module) cards, PIM (PHSSIM, PHS: personal handy-phone system) cards, USIM (UMTS: universal mobile telecommunications system; universal mobile telecommunications system subscriber identity module) cards, dual mode cards, and the like, which are used in mobile communication systems of various network systems, all belong to the category of contact IC cards, and may be collectively referred to as a subscriber identity card in this document.
First, the structure and function of the subscriber identity module card will be described by taking a SIM card applied to GSM (global system for mobile communications) as an example. As shown in fig. 1, a SIM card is composed of a large card base of ID-1 type and a small card embedded in the large card base, and the small card is provided with an IC chip module; patterns, characters and the like can be printed on the large card base and the small card according to requirements, and the names, personalized Logo (marks), card serial numbers and the like of operators are generally printed. The shape and the size of the large card base conform to the ISO7816 standard, the shape and the size of the small card, the relative position of the small card embedded into the large card base and the like conform to the GSM11.11 standard, the size of the small card is 25mm multiplied by 15mm multiplied by 0.76mm, the distance between the left edge of the small card and the left edge of the large card base is 6.25mm, and the distance between the upper edge of the small card and the upper edge of the large card base is 16.48 mm. The IC chip module mainly stores parameter information such as user identification information, authentication information, preferred network standards and frequency bands, home zone identification and the like, wherein the user identification information is mainly embodied as IMSI (international mobile subscriber identity), the IMSI comprises MCC (mobile country code), MNC (mobile network code) and MSISDN (Mobile station International ISDN number; ISDN: Integrated services digital network, Integrated services digital network), the MCC is used for identifying the home country of the mobile subscriber, the MNC is used for identifying the home network of the mobile subscriber, and the MCC and the MNC form a PLMN (public land Mobile network) value of a home network operator; the MSISDN, which is used to identify different mobile subscribers within a PLMN service area, consists of HLRID (home location register identifier) and subscriber number in HLR (home location register). If a user needs to use a GSM network to develop a mobile communication service, an SIM card must be inserted into a mobile terminal (generally, a mobile phone) for the GSM network to perform identity authentication, voice information encryption, and the like for the user. The user can purchase the SIM card through the SIM card selling point of the mobile operator, and the SIM card purchased by the user is shown in fig. 1.
The different types of subscriber identity cards are different in the applied network systems, that is, the specific parameter values of the parameter information stored in the IC chip module are different, and the structure, function and manufacturing method are basically the same. In this document, a method for manufacturing a subscriber identity module card is still described by taking an SIM card as an example, and includes the following process flows:
step 1, manufacturing an IC chip module;
since the manufacturing process of the IC chip module belongs to a well-established technology, it will not be described in this document;
step 2, manufacturing a large card base template;
the manufacturing raw materials of the large card base template are two initial large card base mother boards with the thickness of 0.39mm, the size of the initial large card base mother board meets (M multiplied by 85.60mm) multiplied by (N multiplied by 53.98mm), and therefore M multiplied by N large card base templates which accord with the ISO7816 standard can be finally obtained through punching;
carrying out front printing on one surface of one of the initial large card base mother boards, carrying out reverse printing on one surface of the other initial large card base mother board, and carrying out laminating treatment on two unprinted surfaces of the two initial large card base mother boards to obtain a large card base mother board with the thickness of 0.76mm and printed on both the front surface and the back surface;
it should be noted that the thickness of the initial large card substrate mother board is not limited to 0.39mm, the number of layers of the large card substrate mother board and the thickness of each layer can be adjusted, as long as the finally obtained thickness meets the standard of 0.68-0.84 mm (0.76mm +/-0.08 mm);
and carrying out PVC film coating treatment on the front and back printing layers of the large card base mother board, and carrying out punch cutting on the large card base mother board according to the size specified by the ISO7816 standard after the PVC film coating treatment is finished to obtain M multiplied by N large card base templates.
And 3, executing the following operations aiming at each large card base template:
milling a slot position of an IC chip module at a corresponding position (referring to the GSM11.11 standard for specific position) of the large card base template, and packaging the IC chip module at the milled slot position;
cutting the small card at the corresponding position of the large card base template (please refer to GSM11.11 standard for specific position) according to the shape and size of the small card;
initializing the IC chip module and inputting parameter information such as user identification information, authentication information, preferred network system and frequency band, home zone identification and the like, thereby completing the manufacturing process of the SIM card.
The existing user identification card adopts a laminated structure, has multiple manufacturing procedures and complex process, and the laminated structure does not exclude the doping of non-environment-friendly materials; the user needs to take out the embedded small card from the large card base for use, the area of the small card only accounts for less than 10 percent of the area of the whole card, the rest 90 percent of the area of the small card is the large card base, and the large card base is generally directly discarded, so that the material, manufacturing and transportation costs are higher, and the waste of resources and the pollution to the environment are caused.
Disclosure of Invention
The invention provides a manufacturing method and a system of a user identification card, which are used for solving the problems of multiple manufacturing processes, complex process, high material, manufacturing and transportation cost, resource waste, environment pollution and the like of the existing user identification card adopting a laminated structure.
Correspondingly, the invention provides the user identification card.
The invention provides a method for manufacturing a user identification card, which comprises the following steps:
forming a small card base with a slot position of the IC chip module by using a small card base mold which is manufactured in advance according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card by adopting a one-step forming process;
and packaging the IC chip module at the slot position of the small card base to obtain a finished small card.
The invention provides a manufacturing system of a user identification card, comprising:
the one-step forming equipment is used for forming the small card base with the slot position of the IC chip module by adopting one-step forming technology by using a small card base mould which is manufactured in advance according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card;
and the packaging equipment is used for packaging the IC chip module at the slot position of the small card base manufactured by the one-step molding equipment to obtain a finished small card.
The invention provides a user identification card, comprising: the integrated circuit IC chip module and the small card base with the slot position of the IC chip module; the small card base is formed by adopting a one-step forming process by using a small card base mold which is manufactured in advance according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card; the IC chip module is packaged at the slot position of the small card base.
The invention provides a method and a system for manufacturing a user identification card and the user identification card. The manufacturing process reduces a plurality of existing manufacturing procedures, and the process is simple, so that the production efficiency is effectively improved; the small card base is formed by adopting a one-step forming process, and the dimensional accuracy of the small card base is controlled by a mould, so that the problems of layering, poor punch cutting, dimensional deviation and the like are fundamentally solved compared with the prior process flow, and the product accuracy is improved; the one-step forming process limits the use of non-environment-friendly materials, and ensures the green and environment-friendly performance of the finished small card; the finished product small card directly issued is beneficial to environmental protection as the waste and the discard of resources of the card base of the large card are avoided; the finished small card saves material and reduces manufacturing and shipping costs.
Drawings
Fig. 1 is a schematic structural diagram of a SIM card in the prior art;
FIG. 2 is a schematic structural diagram of a SIM card according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a small card base according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the size requirements of a small card and an IC chip module in an embodiment of the invention;
FIG. 5 is a flow chart illustrating a process for manufacturing a SIM card according to an embodiment of the present invention;
FIG. 6 is a block diagram of a system for manufacturing a SIM card according to an embodiment of the present invention.
Detailed Description
In order to overcome the problems of multiple manufacturing procedures, complex process, high material, manufacturing and transportation cost, resource waste, environmental pollution and the like of the existing user identification card adopting a laminated structure, the embodiment of the invention provides a manufacturing method and a system of the user identification card, which thoroughly abandon a large card base, form a small card base with a slot position by adopting a one-step forming process, and directly package an IC chip module at the slot position of the small card base to obtain a finished product small card.
First, a structure of a subscriber identity module card according to an embodiment of the present invention is described, as shown in fig. 2, including an IC chip module 201 and a small card base 202 having a slot of the IC chip module, where the small card base 202 is formed by a one-step forming process according to a shape and a size of the small card, a shape and a size of the IC chip module, and a relative position of the IC chip module 201 on the small card; the IC chip module 201 is packaged at a slot of the small card base 202. In the embodiment of the present invention, the small card with the slot of the IC chip module without packaging the IC chip module is referred to as a small card base, and actually, the shape and size of the small card base are identical to those of the small card. Wherein:
the structure, function and manufacturing process of the IC chip module are consistent with those in the prior art, the IC chip module is a core component of the user identification card and mainly stores user identification information, authentication information, preferred network system, frequency band, home zone identification and other parameter information. The chip personalization parameter information in the user identification cards of different network systems is different, and the required chip personalization parameter information is determined according to the network systems during specific implementation.
The shape and size of the small card, the shape and size of the IC chip module, and the relative position of the IC chip module on the small card need to comply with standards specified by mobile communication systems, such as the GSM11.11 standard for SIM cards used in GSM networks. Fig. 3 is a schematic diagram of the shape of the small card and the slot position of the IC chip module (corresponding to the relative position of the IC chip module on the small card). Referring to fig. 4, the size of the small card is 25mm × 15mm × 0.76mm, the thickness of the small card is 0.76mm, and an error range of ± 0.08mm can be allowed, the size of the IC chip module is not very strict, but the IC chip module needs to completely cover eight contacts C1-C8, and the relative position of the IC chip module on the small card is determined by referring to the relative positions of the eight contacts C1-C8 on the small card.
The subscriber identity module card described in the embodiment of the present invention includes but is not limited to a SIM card applied to a GSM system, a UIM card applied to a CDMA (code division multiple access) system, a PIM card applied to a PHS system, a USIM card applied to a UMTS system, and a dual mode card that can be applied to both network systems.
In the embodiment of the present invention, a method for manufacturing a subscriber identity module card is also described by taking a SIM card applied to a GSM system as an example. As shown in fig. 5, the method comprises the following process flow:
s501, forming a small card base with a slot position of the IC chip module by adopting a one-step forming process according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card;
the one-step forming process allows preset identification information to be arranged on the small card base through embossing or hollow-out effects, and the preset identification information can be patterns and characters and generally comprises operator names, personalized logos, card serial numbers and the like.
And S502, packaging the IC chip module at the slot position of the small card base to obtain a finished small card.
Preferably, before the finished small card is obtained, the method further comprises the step of initializing the IC chip module, wherein the step of initializing the IC chip module can be performed before the IC chip module is packaged at the slot position of the small card base, or can be performed before the IC chip module is packaged at the slot position of the small card base.
In specific implementation, a coiled IC chip module may be directly initialized through a corresponding device or functional module with Pin (Pin) contacts, and the initialization of the IC chip module includes loading an operating system, establishing a chip system structure, writing a key, and the like; then packaging the initialized IC chip module at the slot position of the small card base, namely fixing the IC chip module at the slot position of the small card base in a sticking, absorbing and other modes, thereby finally obtaining a finished small card;
or, the IC chip module can be packaged at the slot position of the small card base; then, initializing an IC chip module packaged on the small card base through corresponding equipment or a functional module, thereby finally obtaining a finished small card; when an IC chip module packaged on a small card substrate is initialized, a corresponding device or a functional module is required to meet the requirements of the small card on the shape and size, so as to initialize the IC chip module on the small card substrate.
In a specific implementation, before obtaining the finished product small card, the method may further include a step of inputting chip personalization parameter information on the initialized IC chip module, and certainly, the method may also not perform the input of the chip personalization parameter information, and then the chip personalization parameter information is automatically input by an operator who purchases the finished product small card.
If the small card base formed by the one-step forming process is not provided with preset identification information such as the name of an operator, the personalized Logo, the card serial number and the like, the method can further comprise the step of printing the preset identification information on the small card base, for example, printing patterns and characters, which generally comprise the name of the operator, the personalized Logo, the card serial number and the like, through laser printing or personalized processing. Of course, the finished small card without patterns and characters can be directly provided without printing, and then the finished small card is printed by an operator who purchases the finished small card.
Preferably, after the finished product small cards are obtained, a packaging procedure of the finished product small cards can be further included, and a set number of the finished product small cards are fed into the unsealed packaging material and sealed, so that independent (the set number is 1) or row-by-row packaging (the set number is more than 1) of the finished product small cards is realized.
The common one-step molding process includes injection molding process, extrusion molding process, casting molding process, etc. The molding process of the small card base with the slot of the IC chip module will be briefly described below by taking an injection molding process as an example.
The injection molding process is that plastic materials are molded into melt through external heating and shearing heat generated by screw rotation in a charging barrel of an injection molding machine, a certain pressure is applied through a hydraulic machine, the melt is injected into a mold with a specific shape, and a plastic product with the specific shape is molded after cooling and shaping. The injection molding process, i.e., the cycle of injection molding, includes: locking a mold, seating and feeding, injecting glue, maintaining pressure, melting glue, cooling, ejecting, opening the mold and seating and retreating; three basic elements of injection molding are as follows: the machine comprises an injection molding machine and an auxiliary machine, a mold and a plastic material. In the embodiment of the invention, a small card base mold is manufactured in advance according to the shape and the size of a small card, the shape and the size of an IC chip module and the relative position of the IC chip module on the small card, a plastic material is plasticized into a melt through the external heating and the shearing heat generated by the rotation of a screw rod in a charging barrel of an injection molding machine, a certain pressure is applied through a hydraulic machine, the melt is injected into the small card base mold, and the small card base with the groove position of the IC chip module can be molded after cooling and shaping.
In the process flow of forming the small card base by adopting the injection molding process, the following factors need to be particularly noticed:
1. temperature of
A. Oil temperature: for the hydraulic machine, heat energy generated by the movement friction of hydraulic oil due to the continuous operation of the machine is controlled by cooling water, the oil temperature is confirmed to be about 45 ℃ when the machine is started, and if the oil temperature is too high or too low, the transmission of pressure is influenced;
B. material temperature: i.e. the temperature of the barrel, which is set according to the shape and function of the material and product;
C. and (3) mold temperature: the temperature is also an important parameter, and the level of the temperature has great influence on the performance of the product, so that the temperature is set by considering the function and the structure of the product and considering the material and the period.
2. Speed of rotation
A. The speed of opening and closing the die is generally set according to the principle of slow-fast-slow and is comprehensively considered according to machines, dies and periods;
B. the ejection speed can be set according to the structure of the product, and the product with a complex structure generally adopts a mode of ejecting slowly and then demoulding quickly, so that the period is shortened.
C. Shooting speed: the setting is carried out according to the size and the structure of a product, if the structure is complex and the wall is thin, the setting can be fast, if the structure is simple and the wall thickness can be slow, the setting is carried out from slow to fast according to the performance of the material.
3. Pressure of
A. Injecting glue pressure: according to the size of the product and the thickness of the wall, from low to high, other factors can be comprehensively considered during debugging.
B. Pressure maintaining: the pressure for pressure holding is mainly to ensure the shaping of the product and the stability of the size, and needs to be set according to the structure and the shape of the product.
C. Low-pressure protection pressure: the pressure mainly protects the mold and minimizes damage to the mold.
D. Mold clamping force: the mold clamping force is the force required by the mold for clamping high pressure, some machines can adjust the mold clamping force, and some machines cannot adjust the mold clamping force.
4. Time of day
A. And (3) injecting glue: the time setting needs to be slightly longer than the actual time and can also play a role of glue injection protection, the set value is generally larger than the actual value by about 0.2 seconds during the setting, and the setting needs to be considered to be matched with the pressure, the speed and the temperature.
B. Low-voltage protection time: in the manual state, the time is set to 2 seconds first, and then about 0.02 second is added from the actual time.
C. Cooling time: the time is generally set according to the size and thickness of the product, but the glue melting time is not longer than the cooling time, so that the product can be fully shaped.
D. Pressure maintaining time: the time is the time for cooling the gate before the melt is allowed to flow back under the pressure of the pressure maintaining in order to ensure the size of the product after the injection is completed, and can be set according to the size of the gate.
5. Position of
A. Opening and closing the mold: the starting position of low-pressure protection is set according to the speed of opening and closing the mould, namely the starting position of low pressure is the most possible to protect the mould without influencing the period, and the ending position is the position contacted by the front mould and the rear mould of the mould during slow mould closing.
B. And (4) ejecting position: the position can meet the requirement that the product is completely demoulded, the setting is carried out by increasing from small to large, the backspacing position is set to be 0 when the mould is filled, otherwise the mould is easy to damage.
C. And (4) melting the glue: the material quantity is calculated according to the size of the product and the size of the screw, and then the corresponding position is set.
Based on the same technical concept, an embodiment of the present invention provides a system for manufacturing a subscriber identity card, as shown in fig. 6, including:
the one-step forming device 601 is used for forming the small card base with the slot position of the IC chip module by adopting one-step forming technology according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card;
the packaging device 602 is configured to package the IC chip module in the slot of the small card base manufactured by the one-step molding device 601, so as to obtain a finished small card.
Preferably, the system may further comprise:
a module processing device 603 configured to initialize the IC chip module before the packaging device 602 packages the IC chip module at the slot of the small card base; alternatively, the IC chip module packaged on the small card base by the packaging apparatus 602 is initialized.
In a specific implementation, the module processing device 603 is further configured to input chip personalization parameter information on the initialized IC chip module.
Preferably, the system may further comprise:
and the packaging equipment 604 is used for feeding the set number of finished product small cards into the unsealed packaging material and sealing the unsealed packaging material to package the finished product small cards.
The subscriber identity module card and the manufacturing method and system thereof provided by the embodiment of the invention are based on a one-step forming process, and compared with the existing subscriber identity module card with a laminated structure, the subscriber identity module card has the following advantages:
the manufacturing process reduces a plurality of existing manufacturing procedures, and the process is simple, so that the production efficiency is effectively improved;
the small card base is formed by adopting a one-step forming process, and the dimensional accuracy of the small card base is controlled by a mould, so that the problems of layering, poor punch cutting, dimensional deviation and the like are fundamentally solved compared with the prior process flow, and the product accuracy is improved;
the one-step forming process limits the use of non-environment-friendly materials, and ensures the green and environment-friendly performance of the finished small card; the finished product small card directly issued is beneficial to environmental protection as the waste and the discard of resources of the card base of the large card are avoided;
the finished small card saves material and reduces manufacturing and shipping costs.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A method of manufacturing a subscriber identification card, comprising:
forming a small card base with a slot position of the IC chip module by using a small card base mold which is manufactured in advance according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card by adopting a one-step forming process; wherein, the shape and the size of the small card both accord with the GSM11.11 standard;
and packaging the IC chip module at the slot position of the small card base to obtain a finished small card.
2. The method of claim 1, further comprising:
before packaging an IC chip module at the slot position of the small card base, initializing the IC chip module;
or,
and initializing the IC chip module packaged on the small card base.
3. The method of claim 2, further comprising the step of entering chip personalization parameter information on the initialized IC chip module prior to obtaining the finished minicard.
4. The method according to claim 1, 2 or 3, characterized in that the small card base formed by one-step forming process is provided with preset identification information with relief or hollow effect;
or, before the finished small card is obtained, the method further comprises the step of printing preset identification information on the small card base.
5. The method of claim 1, 2 or 3, further comprising:
and (4) feeding the small finished cards with the set number into an unsealed packaging material and sealing the packaging material to package the small finished cards.
6. The method of claim 1, wherein the one-shot molding process comprises an injection molding process, an extrusion molding process, and a casting process.
7. The method of claim 1, wherein the subscriber identification card comprises: SIM card, UIM card, PIM card, USIM card and dual-mode card.
8. A system for manufacturing a subscriber identification card, comprising:
the one-step forming equipment is used for forming the small card base with the slot position of the IC chip module by adopting one-step forming technology by using a small card base mould which is manufactured in advance according to the shape and the size of the small card, the shape and the size of the IC chip module and the relative position of the IC chip module on the small card; wherein, the shape and the size of the small card both accord with the GSM11.11 standard;
and the packaging equipment is used for packaging the IC chip module at the slot position of the small card base manufactured by the one-step molding equipment to obtain a finished small card.
9. The system of claim 8, further comprising:
the module processing equipment is used for initializing the IC chip module before the packaging equipment packages the IC chip module at the slot position of the small card base; or, initializing the IC chip module packaged on the small card base by the packaging equipment.
10. The system of claim 9,
the module processing device is further configured to input chip personalization parameter information on the initialized IC chip module.
11. The system of claim 8, 9 or 10, further comprising:
and the packaging equipment is used for feeding the small finished cards with the set number into the unsealed packaging material and sealing the unsealed packaging material to package the small finished cards.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910086757.6A CN101587557B (en) | 2009-06-29 | 2009-06-29 | A kind of Subscriber Identity Module and manufacture method thereof and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910086757.6A CN101587557B (en) | 2009-06-29 | 2009-06-29 | A kind of Subscriber Identity Module and manufacture method thereof and system |
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| CN101587557B true CN101587557B (en) | 2015-12-09 |
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| EP2372987B1 (en) * | 2010-04-02 | 2013-07-17 | Research In Motion Limited | Solving character display ambiguities |
| EP2445181B1 (en) | 2010-10-21 | 2015-07-01 | BlackBerry Limited | Displaying characters and images based on support |
| CN102004940B (en) * | 2010-11-30 | 2013-01-09 | 天水华天科技股份有限公司 | High-density SIM (Subscriber Identity Module) card packaging element and production method thereof |
| CN102955972B (en) * | 2011-08-25 | 2015-11-18 | 上海一芯智能科技有限公司 | A kind of gsm mobile telephone address card and method for packing thereof and equipment |
| CN102496583A (en) * | 2011-11-25 | 2012-06-13 | 北京六所新华科电子技术有限公司 | SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling |
| CN112529136A (en) * | 2020-12-17 | 2021-03-19 | 捷德(中国)科技有限公司 | Manufacturing method and manufacturing system of smart card |
| CN116852632A (en) * | 2023-07-04 | 2023-10-10 | 中国银行股份有限公司 | card making device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996351A (en) * | 2000-04-28 | 2007-07-11 | 株式会社日立制作所 | IC card |
| CN101303745A (en) * | 2008-04-18 | 2008-11-12 | 上海坤锐电子科技有限公司 | Dual interface SIM card and its radio frequency identification system |
| CN101430774A (en) * | 2008-11-21 | 2009-05-13 | 中电智能卡有限责任公司 | SIM card based on metal framework injection molding and its manufacturing technique |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201025538Y (en) * | 2007-02-09 | 2008-02-20 | 凤凰微电子（中国）有限公司 | An intelligent card integrating multi-user recognition module |
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- 2009-06-29 CN CN200910086757.6A patent/CN101587557B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996351A (en) * | 2000-04-28 | 2007-07-11 | 株式会社日立制作所 | IC card |
| CN101303745A (en) * | 2008-04-18 | 2008-11-12 | 上海坤锐电子科技有限公司 | Dual interface SIM card and its radio frequency identification system |
| CN101430774A (en) * | 2008-11-21 | 2009-05-13 | 中电智能卡有限责任公司 | SIM card based on metal framework injection molding and its manufacturing technique |
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| CN101587557A (en) | 2009-11-25 |
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Address after: 100015 Beijing city Chaoyang District Dongzhimen West eight Street No. 2 room Wanhong Yan Dong Business Garden Patentee after: BEIJING WATCHDATA Co.,Ltd. Address before: 100015 Beijing city Chaoyang District Dongzhimen West eight Street No. 2 room Wanhong Yan Dong Business Garden Patentee before: BEIJING WATCH DATA SYSTEM Co.,Ltd. |
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