CN101346813A - Circuit board device for wafer inspection, probe card, and wafer inspection device - Google Patents

Abstract

This invention provides a circuit board apparatus for wafer inspection, which is low in production cost and has high connection reliability, a probe card comprising the circuit board apparatus for wafer inspection, and a wafer inspection apparatus. The circuit board apparatus for wafer inspection comprises a substrate body and a connector device provided on the substrate body and comprising a plurality of connector units stacked on top of each other. The connector unit comprises a first anisotropic electroconductive elastomer sheet, a composite electroconductive sheet, a second anisotropic electroconductive elastomer sheet, and a pitch conversion board. The composite electroconductive sheet comprises an insulating sheet with a plurality of through-holes formed therein and rigid conductors disposed in the through-holes in the insulating sheet so as to be protruded from each of both sides of the insulating sheet. The rigid conductor comprises a body inserted into the through-hole in the insulating sheet and a terminal part, with a larger diameter than the diameter of the through-hole in the insulating sheet, provided at both ends of the body. The conductor is movable in the thickness-wise direction in the insulating sheet.

Description

Circuit board device for wafer inspection, probe card, and wafer inspection device

technical field

The present invention relates to a wafer inspection circuit board device for electrically inspecting a plurality of integrated circuits formed on a wafer in a wafer state, a probe card having the wafer inspection circuit board device, and a wafer inspection device.

Background technique

Generally speaking, in the manufacturing process of semiconductor integrated circuit devices, for example, a plurality of integrated circuits are formed on a wafer composed of silicon, and then, by checking the basic electrical characteristics of each of these integrated circuits, screening for defective integrated circuits is carried out. Circuit probing tests. Next, semiconductor chips are formed by cutting this wafer, and the semiconductor chips are accommodated in a suitable package and sealed. Furthermore, for each packaged semiconductor integrated circuit device, a burn-in test is performed to screen potential defective semiconductor integrated circuit devices by examining their electrical characteristics in a high-temperature environment.

Then, the detection test is carried out on the integrated circuits formed on the wafer. In the past, the wafer is divided into multiple areas with multiple (for example, 16) integrated circuits formed, and all the integrated circuits formed in the area are detected together. test, and sequentially conduct probing tests on integrated circuits formed in other areas. In recent years, in order to improve the inspection efficiency and reduce the inspection cost, it is required to perform probing tests on more integrated circuits at the same time.

On the other hand, in the burn-in test, since the integrated circuit device to be inspected is small and inconvenient to handle, it takes a long time to perform the burn-in test of a plurality of integrated circuit devices one by one, so the inspection cost is considerable. high. For this reason, in recent years, a WLBI (Wafer Level Burn-in: Wafer Level Burn-in) test has been proposed in which a plurality of integrated circuits formed on a wafer are collectively subjected to a burn-in test.

In such electrical inspections of integrated circuits such as probing tests or burn-in tests, in order to electrically connect each of the inspected electrodes in the wafer to be inspected to a tester (tester), a device with a pattern corresponding to the inspected electrodes is used. A patterned set of probe cards with multiple contacts.

In the past, as probe cards, well-known contact members are cantilever type and vertical pin type. Recently, a planar probe card has been proposed in which a contact member includes an anisotropic conductive connector having an elastic anisotropic conductive film and a sheet-like probe in which an electrode structure is disposed on an insulating sheet (see Patent Document 1). These probe cards are configured by arranging the above-mentioned contact members on an inspection circuit board made of, for example, a multilayer printed wiring board.

However, when a plurality of integrated circuits formed on a wafer are collectively electrically inspected, as an inspection circuit board constituting a probe card used in the inspection, a circuit board having a considerable number of layers (for example, the number of layers is 30 to 40 layers or more) A circuit substrate composed of a multilayer printed wiring board.

However, it is difficult to reliably manufacture a multilayer printed wiring board with a relatively large number of layers and high connection reliability. Therefore, since the yield of the circuit board for inspection is relatively low, there is a problem that the manufacturing cost of the probe card is high, thereby increasing the inspection cost. Big question.

Patent Document 1: Japanese Unexamined Patent Publication No. 2004-53409

Contents of the invention

(problem to be solved by the invention)

The present invention has been made based on the above circumstances, and its object is to provide a circuit board device for wafer inspection that can be manufactured at low cost and has high connection reliability for electrically inspecting a plurality of integrated circuits. , A probe card and a wafer inspection device having the circuit board device for wafer inspection.

(solution to the problem)

The circuit substrate device for wafer inspection of the present invention is a circuit substrate device for wafer inspection for electrically inspecting a plurality of integrated circuits formed on a wafer in a wafer state, and is characterized in that:

It has: a substrate body composed of a wiring board having connection electrodes on the surface, and a connector device formed by overlapping a plurality of connector units provided on the surface of the substrate body;

Each connector unit in the above-mentioned connector device has: a first anisotropic conductive elastomer sheet, a composite conductive sheet arranged on the first anisotropic conductive elastomer sheet, and a composite conductive sheet arranged on the composite conductive sheet. A second anisotropic conductive elastomer sheet, and a pitch conversion plate arranged on the second anisotropic conductive elastomer sheet and composed of a wiring board having a connection electrode on the surface and a terminal electrode on the back;

The above-mentioned composite conductive sheet has: an insulating sheet formed with a plurality of through-holes each extending in the thickness direction; Each of the above-mentioned rigid conductors is formed with a terminal portion having a diameter larger than the diameter of the through-hole of the insulating sheet at both ends of the main body inserted into the through-hole of the insulating sheet, and can be positioned relative to the insulating sheet. Move in its thickness direction;

Each of the connection electrodes of the above-mentioned substrate body and the connection electrodes of the above-mentioned pitch conversion plate passes through the first anisotropic conductive elastomer sheet, the rigid conductor of the composite conductive sheet, and the second anisotropic conductive elastomer sheet. The sheet is electrically connected to the terminal electrodes of the pitch conversion board arranged directly above. (Hereafter, this invention is referred to as "the first invention")

In addition, the circuit substrate device for wafer inspection of the present invention is a circuit substrate device for wafer inspection for electrically inspecting a plurality of integrated circuits formed on a wafer in a wafer state, and is characterized in that:

It has: a substrate body composed of a wiring board having connection electrodes on the surface, and a connector device formed by overlapping a plurality of connector units provided on the surface of the substrate body;

Each connector unit in the above-mentioned connector device has: a first anisotropic conductive elastomer sheet, a composite conductive sheet disposed on the first anisotropic conductive elastomer sheet, and a composite conductive sheet disposed on the composite conductive sheet. A plate-shaped spacer member, a second anisotropic conductive elastomer sheet arranged on the spacer member, and an electrode provided on the surface of the second anisotropic conductive elastomer sheet and connected to the A pitch conversion board composed of a wiring board with terminal electrodes on the back;

The above-mentioned composite conductive sheet has: an insulating sheet formed with a plurality of through-holes each extending in the thickness direction; Each of the above-mentioned rigid conductors is formed with a terminal portion having a diameter larger than the diameter of the through-hole of the insulating sheet at both ends of the main body inserted into the through-hole of the insulating sheet, and can be positioned relative to the insulating sheet. Move in its thickness direction;

A plurality of openings having a diameter larger than a diameter of a terminal portion of the rigid conductor are formed on the spacer member at positions corresponding to the respective rigid conductors in the composite conductive sheet;

Each of the connection electrodes of the above-mentioned substrate body and the connection electrodes of the above-mentioned pitch conversion plate passes through the first anisotropic conductive elastomer sheet, the rigid conductor of the composite conductive sheet, and the second anisotropic conductive elastomer sheet. The sheet is electrically connected to the terminal electrodes of the pitch conversion board arranged directly above. (Hereafter, this invention is referred to as "the second invention")

In such a circuit board device for wafer inspection, it is preferable that the movable distance of the rigid conductor in the thickness direction of the insulating sheet of the composite conductive sheet is 5 to 50 μm.

In addition, it is preferable that each of the first anisotropic conductive elastomer sheet and the second anisotropic conductive elastomer sheet has conductive particles exhibiting magnetism aligned side by side in the thickness direction to form a chain. The state and the chain formed by the conductive particles are contained in the elastic polymer substance in the state of being dispersed in the plane direction.

The circuit substrate device for wafer inspection of the present invention is a circuit substrate device for wafer inspection for electrically inspecting a plurality of integrated circuits formed on a wafer in a wafer state, and is characterized in that:

It has: a substrate body composed of a wiring board having connection electrodes on the surface, and a connector device formed by overlapping a plurality of connector units provided on the surface of the substrate body;

Each connector unit in the above-mentioned connector device has: an anisotropic conductive elastomer sheet, and a wiring board disposed on the anisotropic conductive elastomer sheet and composed of a connection electrode on the surface and a terminal electrode on the rear surface. the pitch transformation board;

Both the connection electrodes of the substrate body and the connection electrodes of the pitch conversion board are electrically connected to the terminal electrodes of the pitch conversion board arranged directly above through the anisotropic conductive elastomer sheet. (Hereafter, this invention is referred to as the third invention)

In such a circuit board device for wafer inspection, it is preferable that the anisotropic conductive elastomer sheet is in a state in which conductive particles exhibiting magnetism are aligned side by side in the thickness direction to form a chain and is formed of conductive particles. The state in which the chains are dispersed in the plane direction is contained in the elastic polymer substance.

In addition, in such a circuit board device for wafer inspection, it is preferable that the connector device is formed by stacking three or more connector units.

The probe card of the present invention is characterized in that it includes the above-mentioned circuit board device for wafer inspection and a contact member provided on the circuit board device for wafer inspection.

A wafer inspection apparatus according to the present invention is characterized by comprising the above-mentioned probe card.

The composite conductive sheet of the present invention is characterized in that it has:

an insulating sheet formed with a plurality of through holes each extending in the thickness direction;

In each through hole of the insulating sheet protruding from both sides of the insulating sheet, a through hole with a diameter ratio of the insulating sheet is formed at both ends of the trunk part inserted into the through hole of the insulating sheet. The rigid conductor of the terminal portion with a large hole diameter; and

A plate-shaped spacer member having a plurality of openings having a diameter larger than a diameter of a terminal portion of the rigid conductor is formed integrally on the insulating sheet at a position corresponding to each of the rigid conductors, and

Each of the rigid conductors can move in the thickness direction with respect to the insulating sheet.

(invention effect)

According to the circuit board devices for wafer inspection according to the first and second inventions, since there is a connector device constituted by overlapping a plurality of connector units having pitch conversion boards, the pitch conversion boards in each connector unit can be wired in a single layer. A multilayer wiring board or a multilayer wiring board with a small number of layers can be manufactured relatively easily with a high yield, so that the manufacturing cost of the entire circuit board device for wafer inspection can be reduced.

In addition, between adjacent pitch changing plates and between the substrate body and the pitch changing plate, the first anisotropic conductive elastomer sheet, the composite conductive sheet having a rigid conductor, and the second anisotropic conductive elastic body The sheets are stacked, because the rigid conductor in the composite conductive sheet can move in the thickness direction relative to the insulating sheet, so the first anisotropic conductive elastomer sheet and the second anisotropic conductive elastomer sheet pass through the rigid conductor As a result of moving and compressively deforming in conjunction with each other, the unevenness of both can absorb energy reliably, so high reliability can be obtained between adjacent pitch changing plates and between the substrate body and the pitch changing plate.

Therefore, a wafer inspection circuit board device can be manufactured at low cost and has high connection reliability.

In addition, according to the circuit board device for wafer inspection according to the second invention, since the spacer member is provided between the composite conductive sheet of the connector unit and the second anisotropic conductive elastic body sheet, it is possible to alleviate the stress caused by the rigid conductor. The pressure on the first anisotropic conductive elastomer sheet and the second anisotropic conductive elastomer sheet can prevent or suppress the pressure on the first anisotropic conductive elastomer sheet and the second anisotropic conductive elastomer sheet Chips fail early on.

According to the circuit board device for wafer inspection according to the third invention, since it has a connector device composed of a plurality of connector units having a pitch conversion board stacked, the pitch conversion board in each connector unit can be composed of a single-layer wiring board and a layer. With a small number of multilayer wiring boards, such a wiring board can be manufactured relatively easily with a high yield, so that the manufacturing cost of the entire wafer inspection circuit board device can be reduced.

According to the probe card of the present invention, since the above-mentioned circuit board device for wafer inspection is provided, the probe can be manufactured at low cost, and high connection reliability can be obtained.

According to the wafer inspection apparatus of the present invention, since the probe card is provided, it is possible to reduce the inspection cost and to perform highly reliable inspection on the wafer.

Description of drawings

1 is an explanatory cross-sectional view showing the configuration of an example of a circuit board device for wafer inspection according to the first invention.

2 is an explanatory cross-sectional view showing the configuration of a main part of the circuit board device for wafer inspection shown in FIG. 1 .

Fig. 3 is a plan view of the circuit board device for wafer inspection shown in Fig. 1 .

FIG. 4 is an explanatory view showing an enlarged lead electrode portion in the circuit board device for wafer inspection shown in FIG. 1 .

Fig. 5 is an explanatory cross-sectional view showing an enlarged main part of the anisotropic conductive elastomer sheet.

6 is an explanatory cross-sectional view showing a molding member on one surface, a molding member on the other surface, and a spacer for producing the first anisotropic conductive elastomer sheet.

7 is an explanatory cross-sectional view showing a state where a conductive elastomer material is applied to the surface of the other-side molding member.

8 is an explanatory sectional view showing a state in which a material layer for a conductive elastomer is formed between a one-surface-side molding member and another-surface-side molding member.

FIG. 9 is an enlarged explanatory cross-sectional view showing the conductive elastomer material layer shown in FIG. 8 .

10 is an explanatory cross-sectional view showing a state where a magnetic field acts on the conductive elastomer material layer shown in FIG. 8 in its thickness direction.

Fig. 11 is an enlarged plan view showing a main part of the composite conductive sheet.

Fig. 12 is an explanatory cross-sectional view showing the structure of a laminated material used to manufacture a composite conductive sheet.

13 is an explanatory cross-sectional view showing a state in which openings are formed in the metal layer in the laminated material.

14 is an explanatory cross-sectional view showing a state in which a through-hole is formed in an insulating sheet in a laminated material.

Fig. 15 is an explanatory sectional view showing the structure of the composite laminate.

16 is an explanatory cross-sectional view showing a state where a photoresist film is formed in a composite laminated material.

17 is an explanatory cross-sectional view showing a state in which a rigid conductor is formed in a through-hole of an insulating sheet in a composite laminated material.

18 is an explanatory cross-sectional view showing a state where a photoresist film has been removed from the composite laminated material.

19 is a plan view showing another example of the circuit board device for wafer inspection according to the first invention.

20 is an explanatory cross-sectional view showing the configuration of a main part of an example of the circuit board device for wafer inspection according to the second invention.

21 is an explanatory cross-sectional view showing the configuration of a main part of an example of the circuit board device for wafer inspection according to the third invention.

22 is an explanatory cross-sectional view showing the structure of a first example of the probe card according to the present invention.

Fig. 23 is a plan view of an anisotropic conductive connector in the probe card of the first example.

Fig. 24 is an explanatory sectional view showing an enlarged main part of the anisotropic conductive connector in the probe card of the first example.

Fig. 25 is a plan view of a chip probe in the probe card of the first example.

Fig. 26 is an enlarged plan view of the contact film of the chip probe in the probe card of the first example.

27 is an explanatory sectional view showing an enlarged structure of a contact film of a chip probe in the probe card of the first example.

28 is a plan view showing a frame plate of a chip probe in the probe card of the first example.

FIG. 29 is an explanatory cross-sectional view showing the structure of a laminate for manufacturing a sheet-like probe.

FIG. 30 is an explanatory cross-sectional view showing a state in which a protective tape is disposed on a peripheral portion of a frame plate;

31 is an explanatory cross-sectional view showing a state in which a bonding layer is formed on the metal foil for a back electrode portion in the laminate shown in FIG. 29 .

32 is an explanatory cross-sectional view showing a state in which a frame plate is joined to the metal foil for the back electrode portion in the laminate.

33 is an explanatory cross-sectional view showing a state in which a through-hole is formed in a resin sheet for an insulating film in a laminate.

34 is an explanatory cross-sectional view showing a state in which a short-circuit portion and a surface electrode portion are formed in a resin sheet for an insulating film in a laminate.

35 is an explanatory cross-sectional view showing a state in which the metal foil for the back electrode portion is exposed by removing a part of the bonding layer.

FIG. 36 is an explanatory cross-sectional view showing a state in which a rear surface electrode portion is formed.

37 is an explanatory cross-sectional view showing a state where an insulating film is formed.

Fig. 38 is an explanatory sectional view showing the structure of a second example of the probe card according to the present invention.

Fig. 39 is a plan view of an anisotropic conductive connector in the probe card of the second example.

Fig. 40 is a plan view of the frame plate of the chip probe in the probe card of the second example.

Fig. 41 is an explanatory sectional view showing the structure of the first example of the wafer inspection apparatus according to the present invention.

42 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the wafer inspection apparatus of the first example.

43 is an explanatory cross-sectional view showing enlarged connectors in the wafer inspection apparatus of the first example.

44 is an explanatory cross-sectional view showing the structure of a second example of the wafer inspection apparatus according to the present invention.

(Symbol Description)

2 controllers

3 input and output terminals

3R input and output terminal section

4 connectors

4A conductive needle

4B support components

5 wafer stage

6 chips

7 electrodes to be inspected

10 probe cards

11 Circuit board device for wafer inspection

12 substrate body

13 lead electrodes

13R Lead electrode part

14 brackets

14K opening

14S steps

15 Electrodes for connection

17 reinforcement material

20 connector set

21 connector unit

22 The first anisotropic conductive elastomer sheet

Material layer for 22A conductive elastomer

22B Materials for Conductive Elastomers

23 The second anisotropic conductive elastomer sheet

23a Anisotropic conductive elastomer sheet

24 spacer parts

24H opening

25 composite conductive sheet

25A composite laminated material

25B laminate material

26 insulating sheets

26H through hole

27 rigid conductor

27a trunk

27b terminal part

28A metal layer

28B thin metal layer

28K opening

29 photoresist film

29H pattern hole

30 pitch conversion board

31 Electrodes for connection

32-terminal electrode

35 side forming parts

36 other side forming parts

37 spacers

37K opening

38 pressure roller device

38a pressure roller

38b support roller

39 contact parts

40 Anisotropic Conductive Connectors

41 frame board

42 openings

43 elastic anisotropic conductive film

44 Conductive part for connection

45 insulation part

46 functional department

47 protrusion

48 Supported Ministry

50 sheet probes

51 frame board

52 openings

54 holding parts

55 contact film

55A laminate

56 insulation film

56A resin sheet for insulating film

57 electrode structures

57H through hole

57a surface electrode part

57b rear electrode part

57c short circuit part

57d Keeping Department

58 metal film

58A metal foil for back electrode

59 bonding layer

60 protective tape

Detailed ways

Embodiments of the present invention will be described in detail below.

<Circuit board device for wafer inspection>

1 is an explanatory cross-sectional view showing the structure of an example of the circuit board device for wafer inspection according to the first invention, and FIG. 2 is an explanatory cross-sectional view showing the structure of a main part of the circuit board device for wafer inspection shown in FIG. 1 . .

This wafer inspection circuit board device 11 is used to conduct electrical inspections of all integrated circuits formed on, for example, a wafer in a wafer state. As shown in FIG. 3, it has a wafer-shaped wiring board The substrate body 12 that constitutes, the central part of the surface (upper surface of Fig. 1 and Fig. 2) of this substrate body 12, is provided with the connector device 20 that plane shape is regular octagon, and this connector device 20 is fixed on the substrate body 12 The bracket 14 remains on the surface. In addition, a reinforcing member 17 is provided on the central portion of the back surface of the substrate body 12 .

The bracket 14 has an opening 14K having a shape (a regular octagon in the illustrated example) suitable for the outer shape of the connector device 20 , and the connector device 20 is accommodated in the opening 14K. In addition, the outer edge of the bracket 14 is circular, and a stepped portion 14S is formed along the circumferential direction on the outer edge of the bracket 14 .

On the central portion of the surface of the substrate main body 12, a plurality of connection electrodes 15 corresponding to the electrodes to be inspected of all the integrated circuits formed on the wafer to be inspected are formed in an appropriate pattern. In addition, on the peripheral portion of the back surface of the substrate main body 12, as shown in FIG. . The pattern of the lead electrode 13 is a pattern corresponding to the pattern of the input/output terminal of the controller in the wafer inspection apparatus described later. Further, each lead electrode 13 is electrically connected to a connection electrode through an internal wiring (not shown).

As the substrate material constituting the substrate body 12, various materials known in the past can be used. Specific examples include glass fiber reinforced epoxy resin, glass fiber reinforced phenolic resin, glass fiber reinforced polyimide resin, glass fiber Reinforced bismaleimide triazine resin and other composite resin substrate materials, etc.

The connector device 20 is constituted by overlapping a plurality of connector units 21 . Each connector unit 21 is composed of a first anisotropic conductive elastomer sheet 22, a composite conductive sheet 25 arranged on the first anisotropic conductive elastomer sheet 22, and a composite conductive sheet 25 arranged on the composite conductive sheet 25. The second anisotropic conductive elastic body sheet 23 and the pitch changing board 30 arranged on the second anisotropic conductive elastic body sheet 23 and made of, for example, a printed wiring board are constituted.

In such a connector device 20 , preferably three or more connector units 21 are stacked, more preferably five or more. When the number of connector units 21 is too small, the pitch conversion board 30 must be composed of a multilayer wiring board with a large number of layers, so the yield of the pitch conversion board 30 is low, and as a result, the overall manufacturing cost of the circuit board device 11 for wafer inspection increases. Large, so not preferred.

Each of the first anisotropic conductive elastomer sheet 22 and the second anisotropic conductive elastomer sheet 23 in the connector unit 21 is formed so as to be oriented side by side in the thickness direction as shown in FIG. 5 The conductive particles P exhibiting magnetism are contained in the insulating elastic polymer substance in a chain state in which the chains formed of the conductive particles P are dispersed in the plane direction.

As the elastic polymer substance forming each of the first anisotropic conductive elastomer sheet 22 and the second anisotropic conductive elastomer sheet 23, a polymer substance having a crosslinked structure is preferable. Various materials can be used as the hardening polymer material forming material for obtaining such an elastic polymer material, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and polyisoprene rubber. Conjugated diene rubbers such as rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, and their hydrogenated products; styrene-butadiene-diene block copolymer rubber , styrene-isoprene block copolymers and other block copolymer rubbers and their hydrogenated products; chloroprene, polyurethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene Copolymer rubber, ethylene-propylene-diene copolymer rubber, etc. Among these rubbers, silicone rubber is preferably used from the viewpoints of durability, moldability, and electrical properties.

As the silicone rubber, silicone rubber obtained by crosslinking or condensing liquid silicone rubber is preferable. Liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a shear rate of 10 ^-1 sec, and can be any of condensation type rubber, additive type rubber, rubber containing vinyl and hydroxyl groups, and the like. Specifically, dimethyl silicone raw rubber, methylvinyl silicone raw rubber, methyl styrene-based silicone raw rubber, etc. are mentioned.

In addition, it is preferable that the molecular weight Mw (that is, standard polystyrene conversion weight average molecular weight, the same applies hereinafter) of the silicone rubber is 10,000 to 40,000. Furthermore, since good heat resistance can be obtained in the obtained anisotropic conductive elastomer sheet, it is preferable that the molecular weight distribution index (ie, standard polystyrene-equivalent weight average molecular weight Mw and standard polystyrene-equivalent number average The ratio Mw/Mn of the molecular weight Mn, hereinafter the same) is 2 or less.

As the conductive particles P contained in each of the first anisotropic conductive elastomer sheet 22 and the second anisotropic conductive elastomer sheet 23, the particles can be easily made by the method described later. Since the orientation is aligned in the thickness direction, conductive particles exhibiting magnetism can be used. Specific examples of such conductive particles include magnetic metal particles such as iron, cobalt, and nickel, or particles of their alloys, or particles containing these metals; or these particles are used as core particles. On the surface, the metal plated particles with good conductivity such as gold, silver, palladium, rhodium, etc. are implemented; or inorganic material particles such as non-magnetic metal particles or glass beads or polymer particles are used as core particles, and the Particles whose surface is plated with a conductive magnetic metal such as nickel or cobalt, or the like.

Among these, it is preferable to use nickel particles as core particles, and the surfaces thereof are plated with gold having good conductivity.

The method of coating the surface of the core particle with the conductive metal is not particularly limited, and for example, electroless plating or electrolytic plating, sputtering, vapor deposition, and the like can be used.

As the electroconductive particle P, when using the particle that covers conductive metal on the surface of the core particle, in order to obtain good conductivity, the coverage of the electroconductive metal on the particle surface (covered area of the electroconductive metal The ratio to the surface area of the core particle) is preferably 40% or more, more preferably 45% or more, particularly preferably 47 to 95%.

In addition, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, still more preferably 3 to 25% by mass, particularly preferably 4 to 20% by mass. When the coated conductive metal is gold, the coating amount is preferably 0.5 to 30% by mass of the core particle, more preferably 2 to 20% by mass, and still more preferably 3 to 15% by mass.

Moreover, it is preferable that the number average particle diameter of electroconductive particle P is 3-20 micrometers, and it is more preferable that it is 5-15 micrometers. When the number average particle diameter is too small, it becomes difficult to orient electroconductive particle P in the thickness direction in the manufacturing method demonstrated later. On the other hand, when the number average particle diameter is too large, it becomes difficult to obtain an anisotropic conductive elastomer sheet having high decomposability.

Moreover, the particle diameter distribution (Dw/Dn) of electroconductive particle P becomes like this. Preferably it is 1-10, More preferably, it is 1.01-7, More preferably, it is 1.05-5, Especially preferably, it is 1.1-4.

In addition, the shape of the conductive particles P is not particularly limited, but spherical, star-shaped particles, or secondary particles of these aggregates are preferable because they can be easily dispersed in the polymer substance forming material.

Moreover, as electroconductive particle P, the particle|grain whose surface was treated with the coupling agent, such as a silane coupling agent, and a lubricant can be used suitably. By treating the surface of the particles with a coupling agent and a lubricant, the durability of the obtained anisotropic conductive elastomer sheet is improved.

Preferably, such conductive particles P are contained in the anisotropic conductive elastomer sheet at a volume fraction of 10-40%, particularly 15-35%. When the ratio is too small, an anisotropic conductive elastomer sheet having sufficiently high conductivity in the thickness direction may not be obtained. On the other hand, when the ratio is too large, the obtained anisotropic conductive elastomer sheet tends to become fragile, and the necessary elasticity as the anisotropic conductive elastomer sheet may not be obtained.

In addition, the respective thicknesses of the first anisotropic conductive elastomer sheet 22 and the second anisotropic conductive elastomer sheet 23 are preferably 20 to 100 μm, more preferably 25 to 70 μm. When the thickness is too small, the anisotropic conductive elastomer sheet may not be able to obtain a sufficient ability to absorb unevenness. On the other hand, when the thickness is too large, high decomposition performance may not be obtained in the anisotropic conductive elastomer sheet.

The first anisotropic conductive elastomer sheet 22 can be produced as follows.

First, as shown in FIG. 6 , the sheet-shaped one-side molding member 35 and the other-side molding member 36 are respectively prepared, and have a shape suitable for the planar shape of the first anisotropic conductive elastomer sheet 22 as the purpose. opening 37K and having a frame-shaped spacer 37 having a thickness corresponding to the thickness of the first anisotropic conductive elastomer sheet 22, and at the same time preparing a liquid polymer material that becomes an elastic polymer material after hardening. A material for conductive elastomer containing conductive particles in the material.

Then, as shown in FIG. 7, spacers 37 are arranged on the molding surface (upper surface in FIG. 7) of the other side molding member 36, and the opening 37K of the spacer 37 on the molding surface of the other side molding member 36 is Inside, the prepared conductive elastomer material 22B is applied, and then, on the conductive elastomer material 22B, the one-side molding member 35 is arranged so that its molding surface (lower surface in FIG. 7 ) is aligned with the conductive elastic material 22B. The body material 22B is in contact with each other.

As described above, resin sheets made of polyimide resin, polyester resin, acrylic resin, or the like can be used as the one-surface side molding member 35 and the other-surface side molding member 36 .

In addition, the thickness of the resin sheet constituting the one-surface-side molding member 35 and the other-surface-side molding member 36 is preferably 50 to 500 μm, more preferably 75 to 300 μm. When the thickness is less than 50 μm, necessary strength may not be obtained as a molded part. On the other hand, when the thickness exceeds 500 μm, it is difficult to act a magnetic field of required strength on the material layer for conductive elastomer described later.

Next, as shown in FIG. 8 , the conductive elastic body material 22B is pressed by the forming member 35 on one surface and the forming member 36 on the other surface using a pressure roller device 38 composed of a pressure roller 38 a and a backup roller 38 b, A conductive elastomer material layer 22A having a desired thickness is formed between the one-surface-side molding member 35 and the other-surface-side molding member 36 . In this conductive elastomer material layer 22A, as enlargedly shown in FIG. 9 , conductive particles P are contained in a uniformly dispersed state.

Then, a pair of electromagnets are arranged, for example, on the back surface of the one-side molding member 35 and the back surface of the other-side molding member 36. By operating the electromagnets, a parallel magnetic field is formed in the thickness direction of the conductive elastomer material layer 22A. on the role. As a result, in the material layer 22A for a conductive elastomer, the conductive particles P dispersed in the material layer 22A for a conductive elastomer, as shown in FIG. By aligning upward, chains of a plurality of electroconductive particles P each extending in the thickness direction are formed in a state dispersed in the plane direction.

Then, in this state, by hardening the conductive elastomer material layer 22A, the conductive particles P are oriented in the thickness direction and the conductive particles P are formed in a chain. The first anisotropic conductive elastomer sheet 22 contained in the elastic polymer material is contained in a state of being dispersed in the plane direction.

As described above, the curing treatment of the conductive elastomer material layer 22A can also be performed while maintaining the application of the parallel magnetic field, but it can also be performed after the application of the parallel magnetic field is stopped.

The strength of the parallel magnetic field acting on the conductive elastomer material layer 22A is preferably 0.02 to 2.5 Tesla on average.

The curing treatment of the conductive elastomer material layer 22A is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of polymer material constituting the conductive elastomer material layer 22A, the time required for the movement of the conductive particles P, and the like.

In addition, the 2nd anisotropic conductive elastomer sheet 23 can be manufactured using the same method as the 1st anisotropic conductive elastomer sheet 22.

The composite conductive sheet 25 in the connector unit 21, as shown in FIG. 11 , is formed with a plurality of through holes extending in the thickness direction in a pattern corresponding to the pattern of the terminal electrodes 32 of the pitch conversion board 30 described later. 26H, and a plurality of rigid conductors 27 protruding from both surfaces of the insulating sheet 26 in each through-hole 26H of the insulating sheet 26 .

Each rigid conductor 27 is composed of a cylindrical trunk portion 27a inserted through the through hole 26H of the insulating sheet 26, and a portion exposed on the surface of the insulating sheet 26 formed integrally with both ends of the trunk portion 27a. The terminal portion 27b is formed. The length L of the trunk portion 27a in the rigid conductor 27 is greater than the thickness d of the insulating sheet 26, and the diameter r2 of the trunk portion 27a is smaller than the diameter r1 of the through hole 26H of the insulating sheet 26. The rigid conductor 27 can move in the thickness direction of the insulating sheet 26 . In addition, the diameter r3 of the terminal portion 27b in the rigid conductor 27 is set larger than the diameter r1 of the through-hole 26H of the insulating sheet 26 .

As the material constituting the insulating sheet 26, resin materials such as liquid crystal polymers, polyimide resins, polyester resins, polyaramid resins, and polyamide resins; glass fiber-reinforced epoxy resins, glass fiber-reinforced Fiber-reinforced resin materials such as polyester resin and glass fiber-reinforced polyimide resin; composite resin materials containing inorganic materials such as alumina and boron nitride as fillers in epoxy resin, etc.

In addition, when the circuit board device 11 for wafer inspection is used in a high-temperature environment, it is preferable to use a linear thermal expansion coefficient of 3×10 ^-5 /K or less as the insulating sheet 26 , more preferably 1×10 ^-6 to 2 ×10 ^-5 /K, particularly preferably 1×10 ^-6 to 6×10 ^-6 /K. By using such an insulating sheet 26 , it is possible to suppress displacement of the rigid conductor 27 due to thermal expansion of the insulating sheet 26 .

In addition, the thickness d of the insulating sheet 26 is preferably 10 to 200 μm, more preferably 15 to 100 μm.

In addition, the diameter r1 of the through hole 26H of the insulating sheet 26 is preferably 20 to 250 μm, more preferably 30 to 150 μm.

As the material constituting the rigid conductor 27, a rigid metal material can be appropriately used, and in particular, a material that is more difficult to etch than the thin metal layer formed on the insulating sheet 26 is preferably used in a manufacturing method described later. Specific examples of such metal materials include simple metals such as nickel, cobalt, gold, and aluminum, or alloys thereof.

The diameter r2 of the trunk portion 27a in the rigid conductor 27 is preferably equal to or greater than 18 μm, more preferably equal to or greater than 25 μm. When the diameter r2 is too small, the strength required for the rigid conductor 27 may not be obtained. Also, the difference (r1−r2) between the diameter r1 of the through hole 26H of the insulating sheet 26 and the diameter r2 of the main portion 27a in the rigid conductor 27 is preferably 1 μm or more, more preferably 2 μm or more. When the difference is too small, it becomes difficult to move the rigid conductor 27 with respect to the thickness direction of the insulating sheet 26 .

The diameter r3 of the terminal portion 27b in the rigid conductor 27 is preferably 70 to 150% of the diameter of the electrode to be connected (that is, the terminal electrode 32 in the pitch conversion board 30 ). Also, the difference (r3−r1) between the diameter r3 of the terminal portion 27b in the rigid conductor 27 and the diameter r1 of the through hole 26H of the insulating sheet 26 is preferably 5 μm or more, more preferably 10 μm or more. When the difference is too small, the rigid conductor 27 may fall off from the insulating sheet 26 .

The movable distance of the rigid conductor 27 in the thickness direction of the insulating sheet 26, that is, the difference (L-d) between the length L of the main body portion 27a in the rigid conductor 27 and the thickness d of the insulating sheet 26 is preferably 5 to 50 μm, More preferably, it is 10 to 40 μm. When the movable distance of the rigid conductor 27 is too small, it is difficult to obtain sufficient concave-convex energy absorption in the entire connector unit. On the other hand, when the movable distance of the rigid conductor 27 is too large, the length of the main part 27a of the rigid conductor 27 exposed from the through hole 26H of the insulating sheet 26 increases, and when the rigid conductor 27 is used for inspection, the The trunk portion 27a may be bent or damaged.

The above-mentioned composite conductive sheet 25 can be produced as follows, for example.

First, as shown in FIG. 12 , a laminated material 25B formed by integrally laminating an easily-etched metal layer 28A on one side of an insulating sheet 26 is prepared. A part thereof is removed by etching, and a plurality of openings 28K are formed in a pattern corresponding to an electrode pattern to be connected to the metal layer 28A, as shown in FIG. 13 . Next, as shown in FIG. 14 , on the insulating sheet 26 in the laminated material 25B, through-holes 26H that respectively communicate with the openings 28K of the metal layer 28A and extend in the thickness direction are formed. Then, as shown in FIG. 15 , an easily etchable cylindrical thin metal layer 28B is formed to cover the inner wall surface of the through hole 26H of the insulating sheet 26 and the opening edge of the metal layer 28A. In this way, a composite laminated material 25A having an insulating sheet 26 formed with a plurality of through-holes 26H each extending in the thickness direction, and laminated on one side of the insulating sheet 26 with holes each connected to the insulating sheet 26 is manufactured. The easily etchable metal layer 28A of the plurality of openings 28K of the through hole 26H of the sheet 26, and the easily etchable metal layer formed to cover the inner wall surface of the through hole 26H of the insulating sheet 26 and the opening edge of the metal layer 28A. Thin layer 28B.

In the above case, as a method of forming the through hole 26H of the insulating sheet 26 , a laser processing method, a drilling processing method, an etching processing method, or the like can be utilized.

Copper or the like can be used as an easily etchable metal material constituting the metal layer 28A and the thin metal layer 28B.

In addition, the thickness of the metal layer 28A is set in consideration of the required movable distance of the rigid conductor 27 and the like, and specifically, it is preferably 5 to 25 μm, and more preferably 8 to 20 μm.

In addition, the thickness of the thin metal layer 28B is set in consideration of the diameter of the through-hole 26H of the insulating sheet 26 and the diameter of the main portion 27a of the rigid conductor 27 to be formed.

In addition, as a method of forming the thin metal layer 28B, an electroless plating method or the like can be used.

Then, the rigid conductor 27 is formed in each of the through-holes 26H of the insulating sheet 26 by applying photoplating to the composite laminated material 25A. Specifically, as shown in FIG. 16 , on the surface of the metal layer 28A formed on one side of the insulating sheet 26 and on the other side of the insulating sheet 26, rigid conductors 27 formed according to requirements are formed respectively. The photoresist film 29 in which a plurality of pattern holes 29H respectively communicating with the through-holes 26H of the insulating sheet 26 are formed in a pattern corresponding to the pattern of the terminal portion 27b. Next, metal layer 28A is used as a common electrode to carry out electroplating treatment, thereby depositing metal on the exposed portion on the metal layer 28A, and depositing metal on the surface of the thin metal layer 28B, so that the through hole of the insulating sheet 26 26H and pattern hole 29H of photoresist film 29 are filled with metal to form rigid conductor 27 extending in the thickness direction of insulating sheet 26 as shown in FIG. 17 .

After rigid conductor 27 is thus formed, by removing photoresist film 29 from the surface of metal layer 28A, metal layer 28A is exposed as shown in FIG. 18 . Thereafter, the composite conductive sheet 25 shown in FIG. 1 can be obtained by performing an etching process to remove the metal layer 28A and the metal thin layer 28B.

On the surface of the pitch conversion board 30 in the connector unit 21, a plurality of connection electrodes 31 corresponding to the electrodes to be inspected of all the integrated circuits formed on the wafer to be inspected are formed in an appropriate pattern. In the illustrated example, the pitch changing board 30 of the uppermost connector unit 21 is arranged in a pattern corresponding to the pattern of the electrodes to be inspected on the wafer to be inspected.

A plurality of terminal electrodes 32 are formed on the back surface of the pitch changing board 30 . Each terminal electrode 32 is basically arranged in a pattern corresponding to the pattern of the connecting electrodes 31 of the pitch changing board 30 in the connector unit 21 arranged directly below the connector unit 21 to which the pitch changing board 30 belongs. The lower connector unit 21 (connector unit 21 disposed on the board body 12 ) is arranged in a pattern corresponding to the pattern of the connecting electrodes of the board body 12 on the pitch changing plate 30 .

Then, each connection electrode 31 is electrically connected to the terminal electrode 32 through an internal wiring (not shown).

As the material of the wiring board constituting the pitch changing board 30, conventionally known various materials can be used, and specific examples thereof include: glass fiber reinforced epoxy resin, glass fiber reinforced phenolic resin, glass fiber reinforced epoxy resin, glass fiber reinforced Composite resin substrate materials such as polyimide resin, glass fiber reinforced bismaleimide triazine resin, etc.

In addition, the pitch conversion board 30 can be manufactured by the conventionally well-known manufacturing method of a printed wiring board.

Then, in the connector device 20, a plurality of connector units 21 are stacked and fixed by an appropriate fixing device (not shown) in a state of being pressed in the thickness direction. Thus, the terminal electrodes 31 of the pitch changing board 30 in the connector unit 21 pass through the second anisotropic conductive elastomer sheet 23, the rigid conductor 27 of the composite conductive sheet 25, and the first anisotropic conductive elastomer sheet. 22 , electrically connected to the connection electrodes 31 of the pitch conversion board 30 or the connection electrodes 15 of the substrate body 12 in the connector unit 21 disposed directly below the connector unit 21 .

According to such a circuit board device 11 for wafer inspection, since there is a connector device 20 constituted by overlapping a plurality of connector units 21 having a pitch changing board 30, the pitch changing board 30 in each connector unit 21 can be made of a single layer. A wiring board or a multilayer wiring board with a small number of layers can be manufactured relatively easily with a high yield, so that the manufacturing cost of the entire wafer inspection circuit board device 11 can be reduced.

In addition, between the adjacent pitch changing plates 30 and between the substrate body 12 and the pitch changing plates 30, the first anisotropic conductive elastomer sheet 22, the composite conductive sheet 25 having the rigid conductor 27, and the second each The anisotropic conductive elastomer sheet 23 is laminated, because the rigid conductor 27 in the composite conductive sheet 25 can move in its thickness direction relative to the insulating sheet 26, so the first anisotropic conductive elastomer sheet 22 and The second anisotropic conductive elastomer sheet 23 is compressively deformed in cooperation with each other when the rigid conductor 27 moves. High connection reliability is obtained between the body 12 and the pitch conversion board 30 .

Therefore, it is possible to manufacture at low cost and obtain a circuit board device 11 for wafer inspection with high connection reliability.

19 is a plan view showing another example of the circuit board device for wafer inspection according to the first invention.

The circuit board device 11 for wafer inspection can be used to collectively perform electrical inspection of individual integrated circuits among integrated circuits formed on, for example, a wafer in a wafer state. In this wafer inspection circuit board device 11, the connection electrodes 15 (see FIG. 2 ) of the substrate main body 12, the rigid conductors 27 (see FIG. 2 ) in the composite conductive sheet 25, the connection electrodes 31 of the pitch conversion plate 30 and The terminal electrodes 32 (refer to FIG. 2 ) are all provided corresponding to electrodes to be inspected in, for example, 32 (8×4) integrated circuits arranged vertically and horizontally among the integrated circuits formed on the wafer to be inspected. In addition, Basically, it has the same configuration as the wafer inspection circuit board device 11 shown in FIG. 1 .

According to such a circuit board device 11 for wafer inspection, the same effect as that of the circuit board device 11 for wafer inspection shown in FIG. 1 can be obtained.

20 is an explanatory cross-sectional view showing the configuration of a main part of an example of the circuit board device for wafer inspection according to the second invention. This circuit board device for wafer inspection basically has the same configuration as the circuit board device for wafer inspection shown in FIG. 1 except for the connector device 20 .

In this circuit board device for wafer inspection, each connector unit 21 constituting the connector device 20 is composed of a first anisotropic conductive elastic body sheet 22 The composite conductive sheet 25, the plate-shaped spacer member 24 integrally provided on the composite conductive sheet 25, the second anisotropic conductive elastomer sheet 23 arranged on the spacer member 24, and the Arranged on the second anisotropic conductive elastomer sheet 23 is a pitch changing board 30 made of, for example, a printed wiring board. Here, the first anisotropic conductive elastomer sheet 22, the composite conductive sheet 25, the second anisotropic conductive elastomer sheet 23, and the pitch changing plate 30 are identical to the circuit board for wafer inspection shown in FIG. The device has the same structure.

The spacer member 24 is formed with a plurality of openings 24H having a diameter larger than the diameter of the terminal portion 27b of the rigid conductor 27 at positions corresponding to the respective rigid conductors 27 in the composite conductive sheet 25, and the terminal portions of the rigid conductor 27 are rigid conductors. 27b is located in this opening 24H.

The thickness of the spacer member 24 is appropriately set in consideration of the movable distance of the rigid conductor 27 and the thickness of the terminal portion 27b, and is preferably, for example, 15 to 100 μm, more preferably 25 to 75 μm.

The diameter of the opening 24H of the spacer member 24 is preferably 1.1 to 8 times, more preferably 1.5 to 3 times the diameter of the terminal portion 27b of the rigid conductor 27 .

As a material constituting the spacer member 24 , a photoresist material or an appropriate resin material can be suitably used from the viewpoint that the spacer member 24 can be easily formed.

When a photoresist material is used as the material constituting the spacer member 24, the spacer member 24 integrally formed on the insulating sheet 26 can be obtained by photolithography.

When an appropriate resin material is used as the material constituting the spacer member 24, an opening can be formed in a film made of the resin material, and by bonding it to the insulating sheet 26, an integral formation on the insulating sheet 26 can be obtained. The spacer part 24.

According to such a circuit board device for wafer inspection, the same effect as that of the circuit board device 11 for wafer inspection shown in FIG. A spacer member 24 is provided between the conductive elastic body sheets 23, which can relax the pressure applied by the rigid conductor 27 on the first anisotropic conductive elastic body sheet 22 and the second anisotropic conductive elastic body sheet 23, As a result, early failure of the first anisotropic conductive elastomer sheet 22 and the second anisotropic conductive elastomer sheet 23 can be prevented or suppressed.

21 is an explanatory cross-sectional view showing the configuration of a main part of an example of the circuit board device for wafer inspection according to the third invention. This circuit board device for wafer inspection has the same structure as the circuit board device for wafer inspection shown in FIG. 1 except for the connector device 20 .

In this circuit board device for wafer inspection, each connector unit 21 constituting the connector device 20 is composed of an anisotropic conductive elastic body sheet 23a, and an anisotropic conductive elastic body sheet arranged on the anisotropic conductive elastic body sheet 23a by, for example, a printed film. The pitch conversion board 30 constituted by the wiring board is constituted. Here, the anisotropic conductive elastic body sheet 23a has the same structure as the first anisotropic conductive elastic body sheet 22 in the circuit board device for wafer inspection shown in FIG. 1 . The pitch changing plate 30 also has the same structure as the pitch changing plate in the circuit board device for wafer inspection shown in FIG. 1 .

According to such a circuit board device 11 for wafer inspection, since there is a connector device 20 constituted by overlapping a plurality of connector units 21 having a pitch changing board 30, the pitch changing board 30 in each connector unit 21 can be made of a single layer. The wiring board is composed of a multilayer wiring board with a small number of layers, and such a wiring board can be manufactured relatively easily with a high yield, so that the manufacturing cost of the entire wafer inspection circuit board device 11 can be reduced.

[Probe card]

22 is a cross-sectional view illustrating the structure of the first example of the probe card according to the present invention. The probe card 10 of the first example is used to integrate all integrated circuits formed on, for example, a wafer in a wafer state. The electrical inspection of each of these integrated circuits is composed of the wafer inspection circuit board device 11 shown in FIG. The contact member 39 is composed of an anisotropic conductive connector 40 and a chip probe 50 disposed on the anisotropic conductive connector 40 .

FIG. 23 is a plan view of the anisotropic conductive connector 40 in the probe card 10 of the first example, and FIG. 24 is an illustration showing an enlarged main part of the anisotropic conductive connector 40 shown in FIG. 23. Use a cutaway view.

The anisotropic conductive connector 40 has a disc-shaped frame plate 41 formed with a plurality of openings 42 each penetrating in the thickness direction. The opening 42 of the frame plate 41 is formed corresponding to the pattern of the electrode region in which the electrode to be inspected is formed in all the integrated circuits formed on the wafer to be inspected. In the frame plate 41 , a plurality of elastic anisotropic conductive films 43 having conductivity in the thickness direction are supported by opening edge portions of the frame plate 41 so as to block one opening 42 .

The base material of each elastic anisotropic conductive film 43 is composed of an elastic polymer substance, and has a plurality of conductive parts 44 for connection extending in the thickness direction, and formed around each of the conductive parts 44 for connection. The functional portion 46 constituted by the insulating portion 45 that insulates the conductive portions 44 for connection from each other; the functional portion 46 is disposed in the opening 42 of the frame plate 41 . The connecting conductive portion 44 in the functional portion 46 is provided in a pattern corresponding to the pattern of the electrodes to be inspected in the electrode region of the integrated circuit formed on the wafer to be inspected.

A supported portion 48 fixedly supported by the opening edge portion of the frame plate 41 is formed around the functional portion 46 and integrally formed continuously with the functional portion 46 . Specifically, the supported portion 48 in this example is formed in two strands, and is fixed and supported in a state of close contact so as to sandwich the opening edge portion of the frame plate 41 .

In the conductive part 44 for connection in the functional part 46 of the elastic anisotropic conductive film 43, the electroconductive particle P which has magnetism is contained densely in the state aligned so that it may align in the thickness direction. On the other hand, the insulating part 45 does not contain electroconductive particle P at all or contains almost no.

In addition, in the illustrated example, protrusions 47 are formed on both surfaces of the functional portion 46 in the elastic anisotropic conductive film 43 protruding from surfaces other than where the connecting conductive portion 44 and its peripheral portion are located.

The thickness of the frame plate 41 varies depending on its material, but is preferably 20 to 600 μm, more preferably 40 to 400 μm.

When the thickness is less than 20 μm, the required strength cannot be obtained when the anisotropic conductive connector 40 is used, and the durability is likely to be lowered, and the rigidity of the degree that can maintain the shape of the frame plate 41 cannot be obtained, and the anisotropic The operability of the conductive connector 40 becomes low. In addition, when the thickness exceeds 600 μm, the thickness of the elastic anisotropic conductive film 43 formed on the opening 42 is too large, and it is difficult to obtain good conductivity on the conductive portion 44 for connection and between adjacent conductive portions 44 for connection. insulation.

The shape and size of the opening 42 of the frame plate 41 in the plane direction are designed according to the size, pitch, and pattern of the electrodes to be inspected on the wafer to be inspected.

The material constituting the frame plate 41 is not particularly limited, as long as the frame plate 41 is not easily deformed and has rigidity to the extent that its shape can be stably maintained. For example, various materials such as metal materials, ceramic materials, and resin materials can be used. When the frame plate 41 is made of, for example, a metal material, an insulating coating film may be formed on the surface of the frame plate 41 .

Specific examples of metal materials constituting the frame plate 41 include metals such as iron, copper, nickel, titanium, and aluminum, or alloys or alloy steels formed by combining two or more of these metals.

In addition, the material constituting the frame plate 41 is preferably a material having a linear thermal expansion coefficient of 3×10 ^-5 /K or less, more preferably -1×10 ^-7 to 1×10 ^-5 /K, and particularly preferably 1×10 ^-6 ~8×10 ^-6 /K.

Specific examples of such materials include invar-type alloys such as invar, elinvar-type alloys such as elinvar, super invar, and kovar alloys. (covar), 42 alloy and other alloys or alloy steel, etc.

The total thickness of the elastic anisotropic conductive film 43 (thickness of the connecting conductive portion 44 in the illustrated example) is preferably 50 to 3000 μm, more preferably 70 to 2500 μm, particularly preferably 100 to 2000 μm. When the thickness is 50 μm or more, the elastic anisotropic conductive film 43 having sufficient strength can be reliably obtained. In addition, when the thickness is 3000 μm or less, the conductive portion 43 for connection having desired conductive characteristics can be reliably obtained.

The sum of the protrusion heights of the protrusions 47 is preferably 10% or more of the thickness of the protrusions 47, more preferably 20% or more. By forming the protruding portion 47 having the above-mentioned protruding height, the conductive portion 44 for connection can be sufficiently compressed with a small pressing force, so that good conductivity can be reliably obtained.

In addition, the protruding height of the protruding portion 47 is preferably 100% or less of the shortest width or diameter of the protruding portion 47 , more preferably 70% or less. By forming the protruding portion 47 having the above-mentioned protruding height, since the protruding portion 47 is not bent when pressurized, desired conductivity can be reliably obtained.

In addition, the thickness of the supported portion 48 (thickness of one of the two parts in the illustrated example) is preferably 5 to 600 μm, more preferably 10 to 500 μm, particularly preferably 20 to 400 μm.

In addition, the supported portion 48 is not necessarily formed in a bifurcated shape, and may be fixed to only one side of the frame plate 41 .

The elastic polymer material constituting the elastic anisotropic conductive film 43 and the conductive particles P constituting the conductive portion 44 for connection can be used as the first anisotropic conductive elastic body sheet 22 and the second anisotropic conductive elastic body. The elastic polymer material and the conductive particles P of the body sheet 23 are exemplified.

Preferably, the content ratio of the electroconductive particle P in the conductive part 44 for connection of the functional part 46 is 10-60 % by volume fraction, More preferably, it is the ratio of 15-50 %. When this ratio is less than 10%, the conductive part 44 for connection which has a resistance value small enough may not be obtained. Moreover, when this ratio exceeds 60%, the obtained conductive part 44 for connection becomes fragile easily, and the elasticity required as the conductive part 44 for connection may not be obtained.

Such an anisotropic conductive connector 40 can be manufactured by, for example, the method described in JP-A-2002-334732.

25 is a plan view showing the chip probe 50 in the probe card 10 of the first example, and FIGS. 26 and 27 are an enlarged plan view and explanatory cross-sectional view showing the contact film of the chip probe 50 .

As shown in FIG. 28 , the sheet probe 50 has a circular frame plate 51 made of metal with a plurality of openings 52 formed therein. The opening 52 of the frame plate 51 is formed corresponding to the pattern of the electrode region in which the electrode to be inspected is formed in all the integrated circuits formed on the wafer to be inspected.

As the metal constituting the frame plate 51, iron, copper, nickel, titanium, or their alloys or alloy steel, etc. can be used, but in the subsequent manufacturing method, from the viewpoint of easy formation of the opening 52 by etching, 42 alloy is preferable. , Invar alloy, Kovar alloy and other iron-nickel alloy steels.

In addition, the linear thermal expansion coefficient of the frame plate 51 is preferably 3×10 ^-5 /K or less, more preferably -1×10 ^-7 to 1×10 ^-5 /K, particularly preferably 1×10 ^-6 to 8×10 ^-6 /K.

Specific examples of the material constituting such a frame plate 51 include Invar-type alloys such as Invar alloys, Ellingvar-type alloys such as Erlingvar alloys, super-Invar alloys, Kovar alloys, and alloys such as 42 alloys. Or alloy steel etc.

The thickness of the frame plate 51 is preferably 10 to 200 μm, more preferably 10 to 150 μm.

When the thickness is too small, the strength required as a frame plate supporting the contact film may not be obtained. In addition, when the thickness is too large, it is difficult to form the opening 52 with high dimensional accuracy by etching in a subsequent manufacturing method.

A metal film 58 is integrally formed on one side of the frame plate 51 via a bonding layer 59, and a plurality of contact films 55 are arranged and fixed on the metal film 58 so as to block one opening 52 of the frame plate 51, whereby each contact The film 55 is supported on the frame plate 51 via the bonding layer 59 and the metal film 58 . In addition, on the other surface of the frame plate 51 , a circular columnar holding member 54 is arranged on the other surface of the frame plate 51 along the peripheral portion of the frame plate 51 , and the frame plate 51 is held by the holding member 54 .

The metal film 58 is made of the same material as the back electrode portion 57b in the electrode structure 57 described later.

In addition, as a material constituting the bonding layer 59, silicone rubber-based adhesives, epoxy-based adhesives, polyimide-based adhesives, cyanoacrylate-based adhesives, and polyurethane-based adhesives can be used. wait.

As the material constituting the holding member 54, Invar-type alloys such as Invar alloy and super-Invar alloy, Erlingvar-type alloys such as Erlingvar alloy, Kovar alloy, 42 alloy and other low thermal expansion metal materials or alumina, carbide, etc. can be used. Silicon, silicon nitride and other ceramic materials.

Each contact film 55 has a flexible insulating film 56, and in the insulating film 56, a plurality of electrode structures 57 made of metal extending in the thickness direction of the insulating film 56 conform to the pattern formed on the wafer to be inspected. The pattern corresponding to the pattern of the electrode to be inspected in the electrode region of the integrated circuit is arranged separately from each other in the plane direction of the insulating film 56, and the contact film 55 is arranged so that each electrode structure 57 is located in the opening 52 of the frame plate 51. .

Each electrode structure 57 has a structure in which a protruding surface electrode portion 57a exposed from the surface of the insulating film 56 and a plate-shaped rear electrode portion 57b exposed from the back surface of the insulating film 56 pass through the insulating film 56 in the thickness direction. The short-circuit portion 57c protruding to the ground is integrally connected.

The material constituting the insulating film 56 is not particularly limited as long as it is an insulating and flexible material. Resin materials such as polyimide and liquid crystal polymers or composite materials thereof can be used. In the method, polyimide is preferably used from the viewpoint that the through-hole for the electrode structure can be easily formed by an etching method.

As another material constituting the insulating film 56, a mesh or a nonwoven fabric, or a material impregnated with a resin or an elastic polymer substance can be used. As the fibers forming such a net or nonwoven fabric, organic fibers such as aramid fibers, polyethylene fibers, polyacrylate fibers, nylon fibers, fluororesin fibers such as Teflon (registered trademark) fibers, and polyester fibers can be used. fiber. By using such a material as the material constituting the insulating film 56, even if the electrode structures 57 are arranged at a small pitch, the flexibility of the contact film 55 as a whole will not be greatly reduced. The protruding height of the inspection electrode fluctuates, but the contact film 55 can sufficiently absorb the fluctuation due to its flexibility, so that stable electrical connection to each of the electrodes to be inspected can be reliably achieved.

The thickness of the insulating film 56 is not particularly limited as long as the flexibility of the insulating film 56 is not impaired, but is preferably 5 to 150 μm, more preferably 7 to 100 μm, and even more preferably 10 to 50 μm.

As a material constituting the electrode structure 57, nickel, iron, copper, gold, silver, palladium, cobalt, tungsten, rhodium, or alloys thereof, alloy steel, or the like can be used. The electrode structure 57 may be composed of a single metal as a whole, may be composed of an alloy or alloys of two or more metals, or may be composed of two or more metals laminated.

In addition, when the electrode to be inspected with an oxide film formed on its surface is electrically inspected, the electrode to be inspected is brought into contact with the electrode structure 57 of the chip probe 50, and the surface electrode portion 57a of the electrode structure 57 needs to destroy the electrode to be inspected. The oxide film on the surface of the electrode is inspected to realize the electrical connection between the electrode structure 57 and the electrode to be inspected. Therefore, it is preferable that the surface electrode portion 57 a of the electrode structure 57 has a hardness to such an extent that the oxide film can be easily broken. In order to obtain such a surface electrode portion 57a, a powder substance having high hardness may be contained in the metal constituting the surface electrode portion 57a.

As such powdery substances, diamond powder, silicon nitride, silicon carbide, ceramics, glass, etc. can be used. Since an appropriate amount of these non-conductive powdery substances is contained, the conductivity of the electrode structure 57 can be used without impairing the conductivity of the electrode structure 57. The surface electrode portion 57a of 57 destroys the oxide film formed on the surface of the electrode to be inspected.

In addition, in order to easily destroy the oxide film on the surface of the electrode to be inspected, the shape of the surface electrode portion 57a in the electrode structure 57 can be made into a sharp protrusion, or fine unevenness can be formed on the surface of the surface electrode portion 57a.

The pitch p of the electrode structures 57 on the contact film 55 is set according to the pitch of the electrodes to be inspected on the wafer to be inspected, and is, for example, preferably 40 to 250 μm, more preferably 40 to 150 μm.

Here, the "pitch between electrode structures" refers to the center-to-center distance between adjacent electrode structures, and refers to the shortest distance.

In the electrode structure 57, the ratio of the protrusion height to the diameter R in the surface electrode portion 57a is preferably 0.2 to 3, more preferably 0.25 to 2.5. By satisfying such a condition, even if the electrodes to be inspected are minute due to the small pitch, the electrode structure 57 having a pattern corresponding to the pattern of the electrodes to be inspected can be easily formed, and stable stability to the wafer can be reliably obtained. electrical connection status.

In addition, the diameter R of the surface electrode portion 57a is preferably 1 to 3 times, more preferably 1 to 2 times, the diameter r of the short circuit portion 57c.

In addition, the diameter R of the surface electrode portion 57a is preferably 30 to 75% of the pitch p of the electrode structure 57, more preferably 40 to 60%.

In addition, the outer diameter D of the back electrode portion 57b only needs to be larger than the diameter r of the short-circuit portion 57c and smaller than the pitch p of the electrode structures 57, but it is preferably as large as possible. Stable electrical connection of the opposite sex conductive connector 40 .

In addition, the diameter r of the short-circuit portion 57c is preferably 15 to 75% of the pitch p of the electrode structures 57, more preferably 20 to 65%.

Regarding the specific dimensions of the electrode structure 57, the protruding height of the surface electrode portion 57a is preferably 15 to 50 μm, more preferably 15 to 30 μm, from the viewpoint of achieving stable electrical connection to the test electrode.

The diameter R of the surface electrode portion 57a is set in consideration of the above-mentioned conditions and the diameter of the electrode to be inspected, and is, for example, 30 to 200 μm, preferably 35 to 150 μm.

The diameter r of the short-circuit portion 57 c is preferably 10 to 120 μm, more preferably 15 to 100 μm, from the viewpoint of obtaining sufficiently high strength.

The thickness of the back electrode portion 57 b is preferably 15 to 150 μm, more preferably 20 to 100 μm, from the viewpoint of obtaining sufficiently high strength and excellent repeat durability.

On the front electrode portion 57 a and the back electrode portion 57 b in the electrode structure 57 , a cover film may be formed as necessary. For example, when the electrode to be inspected is made of a solder material, it is preferable to form a coating film made of a diffusion-resistant metal such as silver, palladium, and rhodium on the surface electrode portion 57a from the viewpoint of preventing diffusion of the solder material.

In addition, the chip probe 50 is disposed so that the back electrode portion 57b of each electrode structure 57 is in contact with the conductive portion 44 for connection of the anisotropic conductive connector 40, and the holding member 54 is placed on the circuit board 11 for wafer inspection. The stepped portion 14S of the upper bracket 14 is engaged and fixed.

Such a sheet probe 50 can be produced by the following method.

First, as shown in FIG. 29, a resin sheet 56A for an insulating film is prepared by integrally laminating a resin sheet 56A for an insulating film on one side of a metal foil 58A for a back electrode part made of the same material as the back electrode part 57b in the electrode structure 57 to be formed. A circular laminated body 55A is formed.

On the other hand, as shown in FIG. 30, a circular frame plate 51 having a plurality of openings 52 is formed in accordance with the pattern of the electrode region where the electrode to be inspected is formed in the integrated circuit on the wafer as the inspection object is produced. A protective tape 60 is arranged on one surface of the plate 51 along the peripheral edge thereof. Here, as a method of forming the opening 52 of the frame plate 51 , an etching method or the like can be utilized.

Then, as shown in FIG. 31 , a bonding layer 59 made of, for example, an adhesive resin is formed on the other surface of the metal foil 58A for the back electrode portion in the laminated body 55A, and a protective tape is bonded as shown in FIG. 32 . 60 frame plate 51. Then, as shown in FIG. 33 , a plurality of through holes 57H penetrating in the thickness direction are formed in a pattern corresponding to the pattern of the electrode structure 57 to be formed on the insulating film resin sheet 56A in the laminated body 55A. Here, as a method of forming the through hole 57H in the insulating film resin sheet 56A, laser processing, etching processing, or the like can be used.

Then, the back surface of the frame plate 51 and the opening 52 in the laminated body 55A are covered with a protective tape (omitted in the figure), and the metal foil 58A for the rear electrode portion in the laminated body 55A is plated, as shown in FIG. 34 , A short-circuit portion 57c integrally connected to the back electrode portion metal foil 58A is formed in each through-hole 57H formed in the insulating film resin sheet 56A, and a short-circuit portion 57c integrally connected to the short-circuit portion 57c is formed. The surface electrode portion 57a protrudes from the surface of the sheet 56A. Then, the protective tape is removed from the back surface of the frame plate 51. As shown in FIG. The exposed portion of the back electrode portion metal foil 58A is etched to form a plurality of back electrode portions 57b integrally connected to the short circuit portion 57c as shown in FIG. 36 , thereby forming the electrode structure 57 . Then, by performing an etching process on the insulating film resin sheet 56A to remove a part thereof, as shown in FIG. 37 , a plurality of insulating films 56 independent from each other are formed. As a result, a plurality of contact films 55 in which a plurality of electrode structures 57 penetrating and protruding in the thickness direction are formed on the insulating film 56 .

Next, the protective tape 60 (refer to FIG. 30 ) is removed from the peripheral portion of the frame plate 51, and then by arranging and fixing a protective member on the peripheral portion on the back surface of the frame plate 51, the sheet-shaped probe shown in FIGS. 25 to 27 is obtained. 50.

According to the probe card 10 of the above-mentioned first example, since it has the circuit board device 11 for wafer inspection shown in FIG.

Fig. 38 is an explanatory sectional view showing the structure of a second example of the probe card according to the present invention.

The probe card 10 of this second example is used to collectively perform electrical inspection of some of the integrated circuits formed on, for example, the integrated circuits in the state of the wafer. The circuit board device 11 is constituted by a contact member 39 disposed on one surface (upper surface in FIG. 38 ) of the wafer inspection circuit board 11 . The contact member 39 is composed of an anisotropic conductive connector 40 and a chip probe 50 disposed on the anisotropic conductive connector 40 .

The anisotropic conductive connector 40 has, as shown in FIG. 39 , a rectangular plate-shaped frame plate 41 formed with a plurality of openings 42 penetrating in the thickness direction. The openings 42 of the frame plate 41 are formed corresponding to electrode region patterns in which electrodes to be inspected are formed in, for example, 32 (8×4) integrated circuits among the integrated circuits formed on the wafer to be inspected. In the frame plate 41 , a plurality of elastic anisotropic conductive films 43 having conductivity in the thickness direction are supported by opening edge portions of the frame plate 41 so as to block one opening 42 . Other configurations of the anisotropic conductive connector 40 are the same as those of the anisotropic conductive connector 40 in the probe card 10 of the first example (see FIG. 24 ).

The sheet probe 50 has a metal frame plate 51 formed with a plurality of openings 52 as shown in FIG. 40 . The openings 52 of the frame plate 51 are formed corresponding to electrode region patterns in which electrodes to be inspected are formed in, for example, 32 (8×4) integrated circuits among the integrated circuits formed on the wafer to be inspected. Other configurations of the chip probe 50 are the same as those of the chip probe 50 in the probe card 10 of the first example (see FIGS. 26 and 27 ).

In addition, the chip probe 50 can be manufactured in the same manner as the chip probe 50 in the probe card 10 of the first example.

In addition, the chip probe 50 is arranged so that the back electrode portion 57b of each electrode structure 57 is in contact with the conductive portion 44 for connection of the anisotropic conductive connector 40, and the holding member 54 is connected to the circuit for wafer inspection. The stepped portion 14S of the holder 14 in the substrate 11 is engaged and fixed.

According to the probe card 10 of the above-mentioned second example, since it has the circuit board device 11 for wafer inspection shown in FIG. 19, the probe card 10 can be manufactured at a low cost and can obtain high connection reliability.

[Wafer inspection device]

41 is an explanatory cross-sectional view showing an outline of the structure of a first example of a wafer inspection apparatus according to the present invention, and FIG. 42 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the wafer inspection apparatus of the first example. The wafer inspection apparatus of the first example is used to collectively perform an electrical inspection of the integrated circuits, such as a burn-in test, for each of all the integrated circuits formed on the wafer in the state of the wafer.

The wafer inspection apparatus of the first example has a controller 2 for controlling the temperature of the wafer 6 to be inspected, supplying power for inspection of the wafer 6, controlling the input and output of signals, and detecting the output signal from the wafer 6 to determine whether the Whether the integrated circuits in wafer 6 are good. As shown in FIG. 43 , the controller 2 has an input-output terminal portion 3R in which a plurality of input-output terminals 3 are arranged along the circumferential direction on its lower surface.

The probe card 10 of the first example is provided below the controller 2, and each lead electrode 13 formed on the first substrate body 12 in the wafer inspection circuit board device 11 is arranged so as to communicate with the input and output of the controller 2. The state in which the terminals 3 are facing each other is held by an appropriate holding means.

A connector 4 is provided between the input/output terminal portion 3R of the controller 2 and the lead electrode portion 13R of the wafer inspection circuit board 11 in the probe card 10, and each of the wafer inspection circuit board devices 11 is connected to each other through the connector 4. The lead electrodes 13 are electrically connected to the respective input and output terminals 3 of the controller 2 . The connector 4 of the illustrated example is composed of a plurality of conductive pins 4A that can be elastically compressed in the longitudinal direction and a support member 4B that supports these conductive pins 4A. The conductive pins 4A are arranged to be located between the input and output terminals 3 of the controller 2 and Between the lead electrodes 13 formed on the first substrate member 12 .

A wafer stage 5 on which a wafer 6 to be inspected is placed is provided below the probe card 10 .

In the wafer inspection apparatus described above, the wafer 6 to be inspected is placed on the wafer stage 5, and then the probe card 10 is pressurized from below, and each surface electrode portion of the electrode structure 57 of the chip probe 50 is 57 a is in contact with each of the electrodes 7 to be inspected on the wafer 6 , and each of the electrodes 7 to be inspected on the wafer 6 is pressurized by each of the surface electrode portions 57 a. In this state, each connecting conductive part 44 in the elastic anisotropic conductive film 43 of the anisotropic conductive connector 40 is connected to the connecting electrode 31 of the circuit board device 11 for wafer inspection and the electrode of the chip probe 50. The back surface electrode portion 57b of the structure body 57 is sandwiched and compressed in the thickness direction, thereby forming a conductive path in the thickness direction of the connection conductive portion 44, and as a result, the inspection target electrode 7 of the wafer 6 and the wafer inspection Electrical connection is realized between the connection electrodes 31 of the circuit board 11 . Then, the wafer 6 is heated to a predetermined temperature by the wafer stage 5, and in this state, required electrical inspections are performed for each of the plurality of integrated circuits in the wafer 6.

According to the wafer inspection apparatus of the above-mentioned first example, since the probe card 10 of the above-mentioned first example is provided, the inspection cost can be reduced, and the wafer 6 can be inspected with high reliability.

44 is an explanatory cross-sectional view showing an outline of the structure of a second example of a wafer inspection apparatus according to the present invention, the first wafer inspection apparatus for inspecting each of a plurality of integrated circuits formed on a wafer in a wafer state. An electrical inspection such as a probe test of the integrated circuit is also performed.

The wafer inspection apparatus of the second example has basically the same structure as the wafer inspection apparatus of the first example, except that the probe card 10 of the first example is replaced with the probe card 10 of the second example.

In the wafer inspection apparatus of the second example, the probe card 10 is electrically connected to the inspected electrodes 7 of, for example, 32 integrated circuits selected from all the integrated circuits formed on the wafer 6 to be inspected, and then the The probe card 10 is electrically connected to the inspected electrodes 7 of a plurality of integrated circuits selected from other integrated circuits for inspection, and by repeating this process, a probe test is performed on all the integrated circuits formed on the wafer 6 .

According to the wafer inspection apparatus of the above-mentioned second example, the electrical connection to the electrode 7 to be inspected of the wafer 6 to be inspected is realized by the probe card 10 of the second example, so a good electrical connection state to the wafer 6 can be reliably realized. , and can stably maintain a good electrical connection state to the wafer 6, therefore, in the probing test of the wafer 6, the required electrical inspection of the wafer 6 can be reliably performed.

According to the wafer inspection apparatus of the above-mentioned first example, since the probe card 10 of the above-mentioned first example is provided, the inspection cost can be reduced, and the wafer 6 can be inspected with high reliability.

The present invention is not limited to the above-described embodiments, and various modifications are possible as described below.

(1) In the circuit board device for wafer inspection shown in FIG. 19 , each connector unit in the connector device 20 may also be made of a first anisotropic conductive elastic body sheet on which the first anisotropic conductive A composite conductive sheet arranged on the elastomer sheet, a plate-shaped spacer member arranged on the composite conductive sheet, a second anisotropic conductive elastomer sheet arranged on the spacer member, and the second anisotropic conductive elastomer sheet arranged on the second each Anisotropic conductive elastomer sheet arranged on the surface has electrodes for connection and a pitch conversion plate made of wiring boards with terminal electrodes on the back (refer to FIG. 20); may also be composed of anisotropic conductive elastomer sheet, and The anisotropic conductive elastomer sheet is arranged on a pitch changing board composed of a wiring board having connection electrodes on the front surface and terminal electrodes on the back surface (see FIG. 21 ).

(2) In the probe card 10 shown in FIG. 22 , the circuit board device 11 for wafer inspection may have the configuration shown in FIG. 20 or the configuration shown in FIG. 21 . In addition, in the probe card 10 shown in FIG. 37 , the circuit board device 11 for wafer inspection may include the connector device 20 described in (1) above.

(3) In the anisotropic conductive connector 40 of the probe card 10, it is not necessary to form protrusions on the elastic anisotropic conductive film 43, and the entire surface of the elastic anisotropic conductive film 43 may be flat. .

(4) On the elastic anisotropic conductive film 43 in the anisotropic conductive connector 40, in addition to the conductive portion 44 for connection formed in a pattern corresponding to the pattern of the electrode to be inspected, it is also possible to form Check the non-connection conductive part where the electrode is electrically connected.

(5) The sheet probe 50 may have an insulating sheet with a single opening and an insulating film provided to block the opening of the insulating sheet; it may also have an insulating sheet with a plurality of openings formed. A sheet and a plurality of insulating films provided to block each opening; or an insulating sheet having a plurality of openings, and one or more insulating films provided to block one opening of the insulating sheet Two or more insulating films, and one or more insulating films provided so as to close two or more openings of the insulating sheet.

(6) The contact member is not limited to a planar contact member composed of an anisotropic conductive connector and a chip probe, and a cantilever-type contact member, a vertical pin-type contact member, and the like can be used.

(7) In the wafer inspection device shown in FIG. 41 or the wafer inspection device shown in FIG. 44 , the probe card 10 may include the circuit board device for wafer inspection described in (2) above.

(8) The connector 4 for electrically connecting the controller 2 in the wafer inspection apparatus to the wafer inspection circuit board device 11 is not limited to the connector shown in FIG. 43 , and various configurations can be used.

Claims (13)

1. A circuit substrate device for wafer inspection, for electrically inspecting a plurality of integrated circuits formed on a wafer in a wafer state, characterized in that: It has: a substrate body composed of a wiring board having connection electrodes on the surface, and a connector device formed by overlapping a plurality of connector units provided on the surface of the substrate body; Each connector unit in the above-mentioned connector device has: a first anisotropic conductive elastomer sheet, a composite conductive sheet arranged on the first anisotropic conductive elastomer sheet, and a composite conductive sheet arranged on the composite conductive sheet. A second anisotropic conductive elastomer sheet, and a pitch conversion plate arranged on the second anisotropic conductive elastomer sheet and composed of a wiring board having a connection electrode on the surface and a terminal electrode on the back; The above-mentioned composite conductive sheet has: an insulating sheet formed with a plurality of through-holes each extending in the thickness direction; Each of the above-mentioned rigid conductors is formed with a terminal portion having a diameter larger than the diameter of the through-hole of the insulating sheet at both ends of the main body inserted into the through-hole of the insulating sheet, and can be positioned relative to the insulating sheet. Move in its thickness direction; Each of the connection electrodes of the above-mentioned substrate body and the connection electrodes of the above-mentioned pitch conversion plate passes through the first anisotropic conductive elastomer sheet, the rigid conductor of the composite conductive sheet, and the second anisotropic conductive elastomer sheet. The sheet is electrically connected to the terminal electrodes of the pitch conversion board arranged directly above. 2. A circuit substrate device for wafer inspection, for electrically inspecting a plurality of integrated circuits formed on the wafer in a wafer state, characterized in that: It has: a substrate body composed of a wiring board having connection electrodes on the surface, and a connector device formed by overlapping a plurality of connector units provided on the surface of the substrate body; Each connector unit in the above-mentioned connector device has: a first anisotropic conductive elastomer sheet, a composite conductive sheet disposed on the first anisotropic conductive elastomer sheet, and a composite conductive sheet disposed on the composite conductive sheet. A plate-shaped spacer member, a second anisotropic conductive elastomer sheet arranged on the spacer member, and an electrode provided on the surface of the second anisotropic conductive elastomer sheet and connected to the A pitch conversion board composed of a wiring board with terminal electrodes on the back; The above-mentioned composite conductive sheet has: an insulating sheet formed with a plurality of through-holes each extending in the thickness direction; Each of the above-mentioned rigid conductors is formed with a terminal portion having a diameter larger than the diameter of the through-hole of the insulating sheet at both ends of the main body inserted into the through-hole of the insulating sheet, and can be positioned relative to the insulating sheet. Move in its thickness direction; The spacer member is formed with a plurality of openings having a diameter larger than a diameter of a terminal portion of the rigid conductor at a position corresponding to each rigid conductor in the composite conductive sheet; The connection electrodes of the above-mentioned substrate body and the connection electrodes of the above-mentioned pitch conversion plate are connected to each other through the first anisotropic conductive elastomer sheet, the rigid conductor of the composite conductive sheet, and the second anisotropic conductive elastomer sheet. The terminal electrodes of the pitch conversion board arranged above are electrically connected. 3. The circuit board device for wafer inspection according to claim 1 or 2, wherein the movable distance of the rigid conductor in the thickness direction of the insulating sheet of the composite conductive sheet is 5 to 50 μm. 4. The circuit board device for wafer inspection according to any one of claims 1 to 3, wherein each of the first anisotropic conductive elastomer sheet and the second anisotropic conductive elastomer sheet In either case, the conductive particles exhibiting magnetism are contained in the elastic polymer substance in a state where the conductive particles are aligned side by side in the thickness direction to form chains, and the chains formed by the conductive particles are dispersed in the plane direction. 5. A circuit substrate device for wafer inspection, for electrically inspecting a plurality of integrated circuits formed on the wafer in a wafer state, characterized in that: It has: a substrate body composed of a wiring board having connection electrodes on the surface, and a connector device formed by overlapping a plurality of connector units provided on the surface of the substrate body; Each connector unit in the above-mentioned connector device has: an anisotropic conductive elastomer sheet; Composed of pitch transformation plates; Each of the connecting electrodes of the substrate main body and the connecting electrodes of the pitch changing board is electrically connected to a terminal electrode of the pitch changing board disposed directly above via the anisotropic conductive elastic body sheet. 6. The circuit board device for wafer inspection according to claim 5, wherein the anisotropic conductive elastomer sheet is in a state in which conductive particles exhibiting magnetism are aligned side by side in the thickness direction to form a chain, and It is contained in the elastic polymer substance in a state where the chains formed by the conductive particles are dispersed in the plane direction. 7. The circuit board device for wafer inspection according to any one of claims 1 to 6, wherein the connector device is formed by overlapping three or more connector units. 8. A probe card comprising the circuit board device for wafer inspection according to any one of claims 1 to 7 and a contact member provided on the circuit board device for wafer inspection. 9. A wafer inspection apparatus comprising the probe card according to claim 8. 10. A composite conductive sheet, characterized in that it has: an insulating sheet formed with a plurality of through holes each extending in the thickness direction; In each through hole of the insulating sheet protruding from both sides of the insulating sheet, a through hole with a diameter ratio of the insulating sheet is formed at both ends of the trunk part inserted into the through hole of the insulating sheet. The rigid conductor of the terminal portion with a large hole diameter; and A plate-shaped spacer member having a plurality of openings having a diameter larger than a diameter of a terminal portion of the rigid conductor, integrally provided on the insulating sheet, at a position corresponding to each of the rigid conductors, and Each of the rigid conductors can move in the thickness direction with respect to the insulating sheet. 11. A connector device, characterized in that: It is composed of a plurality of overlapping connector units. The connector unit has: a first anisotropic conductive elastomer sheet, a composite conductive sheet arranged on the first anisotropic conductive elastomer sheet, and a composite conductive sheet arranged on the first anisotropic conductive elastomer sheet. A second anisotropic conductive elastomer sheet arranged on the conductive sheet, and a wiring board arranged on the second anisotropic conductive elastomer sheet is composed of a wiring board having connection electrodes on the surface and terminal electrodes on the back surface. plate; The above-mentioned composite conductive sheet has: an insulating sheet formed with a plurality of through-holes each extending in the thickness direction; Each of the above-mentioned rigid conductors is formed with a terminal portion having a diameter larger than the diameter of the through-hole of the insulating sheet at both ends of the main body inserted into the through-hole of the insulating sheet, and can be positioned relative to the insulating sheet. Move in its thickness direction; Each connection electrode of the above-mentioned pitch conversion plate passes through the first anisotropic conductive elastomer sheet, the rigid conductor of the composite conductive sheet, the second anisotropic conductive elastomer sheet, and the pitch converter plate arranged directly above. The terminal electrodes are electrically connected. 12. A connector device, characterized in that: It is composed of a plurality of overlapping connector units. The connector unit has: a first anisotropic conductive elastomer sheet, a composite conductive sheet arranged on the first anisotropic conductive elastomer sheet, and a composite conductive sheet arranged on the first anisotropic conductive elastomer sheet. A plate-shaped spacer member provided on the spacer member, a second anisotropic conductive elastomer sheet arranged on the spacer member, and a second anisotropic conductive elastomer sheet arranged on the second anisotropic conductive elastomer sheet. Pitch conversion boards composed of wiring boards with electrodes and terminal electrodes on the back; The above-mentioned composite conductive sheet has: an insulating sheet formed with a plurality of through-holes each extending in the thickness direction; Each of the above-mentioned rigid conductors is formed with a terminal portion having a diameter larger than the diameter of the through-hole of the insulating sheet at both ends of the main body inserted into the through-hole of the insulating sheet, and can be positioned relative to the insulating sheet. Move in its thickness direction; The spacer member is formed with a plurality of openings having a diameter larger than a diameter of a terminal portion of the rigid conductor at a position corresponding to each rigid conductor in the composite conductive sheet; Each connection electrode of the above-mentioned pitch conversion plate passes through the first anisotropic conductive elastomer sheet, the rigid conductor of the composite conductive sheet, the second anisotropic conductive elastomer sheet, and the pitch converter plate arranged directly above. The terminal electrodes are electrically connected. 13. A connector device, characterized in that: Constructed by stacking a plurality of connector units, the connector unit has: an anisotropic conductive elastomer sheet, and a connecting electrode arranged on the anisotropic conductive elastomer sheet and a terminal on the back surface. The spacing conversion board composed of the electrode wiring board; Each of the connecting electrodes of the pitch changing board is electrically connected to the terminal electrodes of the pitch changing board disposed directly above via the anisotropic conductive elastomer sheet.

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