CN101303703B - System and method for forming threading through hole - Google Patents

Abstract

A system and a method for forming a through hole are loaded in wiring software for manufacturing a printed circuit board, and comprise the following steps: detecting the conversion layer number of the differential line arranged on the printed circuit board through wiring software in advance so as to obtain the reference layer of the differential line and the change condition of the attribute of the corresponding reference layer in the line conversion process; analyzing the detected change conditions of the reference layer of the differential pair and the attribute of the reference layer corresponding to the reference layer according to the opening conditions of the threading through holes so as to judge whether the threading through holes corresponding to the reference layer need to be opened or not; searching the periphery of the conversion through hole of the differential line to determine a preset optimal opening position when the differential line needs to be provided with the threading through hole through analysis; and arranging the required threading through hole at the preset optimal arrangement position, so that the threading through hole provides a backflow path for the differential pair line, the electromagnetic interference of the differential pair line is prevented, and the signal transmission capability and the product quality of the printed circuit board are improved.

Description

System and method for opening through hole

technical field

The present invention relates to a layout technology of through-holes, and more specifically, relates to a system and a method for correspondingly laying through-holes when layer-changing layout of differential pairs.

Background technique

At present, electronic engineers usually use various software programs (such as Protel software) to complete the circuit layout (Layout) of multilayer printed circuit boards. Among them, because differential signals have the advantages of high speed, low voltage swing, and low power, they are more and more widely used. Therefore, in the existing wiring design, differential pairing is a relatively common wiring method.

However, during the layout process of the printed circuit board, due to design requirements, some differential pairs need to be placed on the printed circuit board for layer-changing layout. The reference layers of the two traces before and after the layer change point may also change accordingly. For example, if the differential pair is transferred from the top layer (Top) of the printed circuit board to the third layer (L3), the reference layers of the two traces before and after the layer change point are the ground of the second layer (L2) Layer (GND), the reference layer has not changed, the differential pair has a complete return path; and if the differential pair is switched from the top layer (Top) of the printed circuit board to the sixth layer (L6), relative to the change The reference layer of the front routing part of the layer point is the ground layer (GND) of the second layer (L2), and the reference layer of the rear routing part of the layer change point is converted to the ground layer (GND) of the seventh layer (L7). , the reference layer is changed, and the differential pair cannot provide a complete return path, which affects the signal transmission quality.

In order to solve the above-mentioned defect that the differential pair cannot provide a return path due to the change of the reference layer after the layer change, generally when opening a through hole, it is also necessary to consider opening a through hole around the through hole. In the existing practice, the wiring engineer first judges whether it is necessary to set up a pass-through around the layer-changing via hole of the differential pair according to whether the reference layer of the two routing parts before and after the layer-changing point and whether the reference layer attributes have changed. through-hole, and after determining the need to open a through-hole, check the layout of other lines within a certain range (for example, 100mil) around the layer-changing through-hole to determine a preset optimal opening position for the A through hole is opened at a preset optimal opening position.

However, in the above-mentioned prior art, since the determination of whether to open the through hole and the determination of the preset optimal opening position are all done manually by wiring engineers, the work efficiency is low. In addition, due to human negligence, wiring engineers may forget to open the corresponding lead-through holes, which will lead to difficulties in subsequent line checking errors. Other circuits have been densely covered, which makes it impossible to determine the best preset opening position, which affects the quality of the through-holes opened. On the other hand, the operation process is complicated, and the time-consuming and high cost of too many human resources is obviously extremely unreasonable for manufacturers who are eager to reduce production costs to increase product competitiveness.

Therefore, how to overcome the defects of the above-mentioned prior art, and then provide a method that can automatically detect the change of the reference layer and its reference layer attributes during the layer change operation of the differential line, so as to determine whether it is necessary to open a through hole, And to determine the preset optimal opening position around the conversion through hole, to avoid errors caused by human operation in the prior art, to simplify the operation process and save operation time, and to improve the work efficiency are problems to be solved urgently.

Contents of the invention

In view of the above-mentioned defects in the prior art, the main purpose of the present invention is to provide a through-hole that can be automatically arranged during the layer-changing layout of the differential pair to provide a return path for the through-hole of the differential pair. Hole opening system and method.

Another object of the present invention is to provide a through-hole opening system and method that can simplify the operation process, save working time and reduce production costs.

In order to achieve the above purpose and others, the present invention provides a through-hole opening system, which is loaded into the wiring software used to make a printed circuit board (Printed Circuit Board, PCB) through a data processing device, in order to provide a return path for For the differential pair laid out by the wiring software, the opening system of the through hole includes: detecting the number of conversion layers of the differential pair laid out by the wiring software on the printed circuit board, A detection module to obtain the change status of the reference layer of the differential pair and its corresponding reference layer attributes during the line conversion process; it is used to detect the detection module according to the opening conditions of the through hole Analyze the change status of the reference layer of the differential pair and its corresponding reference layer attributes to determine whether it is necessary to open an analysis module for the through-hole corresponding to the differential pair; When it is obtained that the differential pair needs to open a through hole, a position search module is used to search around the conversion via hole of the differential pair to determine a preset optimal opening position; and the position search module is used to A module for opening required through-holes at the determined preset optimal opening position.

In one form of the present invention, the wiring software has a report generating module, which is used to verify the opening result and generate an analysis report after the through hole is opened.

In one form of the present invention, the opening condition of the through hole means that only when the reference layer changes and its corresponding reference layer properties do not change, it is necessary to lay the through hole corresponding to the differential pair. through hole. And in a preferred embodiment, the reference layer attributes are, for example, a power layer and a ground layer. And the through hole also has an attribute corresponding to the attribute of the reference layer.

The present invention also provides a method for opening a through hole. The method for opening a through hole includes: (1) detecting the number of conversion layers of the printed circuit board on which the differential pair is laid by the wiring software, and Obtain the change status of the reference layer of the differential pair and its corresponding reference layer attributes during the line conversion process; (2) according to the opening conditions of the through hole, the reference layer of the detected differential pair Layer and its corresponding reference layer attributes are analyzed to determine whether it is necessary to open a through-hole corresponding to the differential pair, if so, perform step (3), if not, then end the process step; (3 ) search around the conversion via hole of the differential pair to determine a preset optimal opening position; and (4) open the required through-holes at the preset optimal opening position, so that The feedthrough provides a return path for the differential pair

Compared with the existing circuit layout technology, the system and method for opening the through hole of the present invention is to pre-detect the reference of the differential pair during the line conversion process when performing the layer change operation of the differential pair. Whether the properties of the layer and its corresponding reference layer have changed, and analyze the change to determine whether it is necessary to open a through hole, and when performing the opening operation, search around the conversion hole to determine a preset optimal The opening position is for opening the required lead-through holes, thereby providing a return path for the differential alignment, solving the problems of a lot of time and low efficiency due to manual opening in the prior art, improving work efficiency and reducing production cost.

Description of drawings

Fig. 1 is a schematic block diagram of the basic structure of the opening system of the through hole of the present invention;

Fig. 2 is a schematic flow chart of the opening method of the through hole of the present invention;

FIG. 3 is a more detailed schematic flow chart of steps S200 and S202 of the method for opening a through hole according to the present invention; and

FIG. 4 is a schematic diagram of an application embodiment of the system and method for opening through vias of the present invention.

Explanation of reference signs

1 Opening system for lead-through holes 10 Detection module

12 Analysis Module 14 Location Search Module

16 Open module 2 Wiring software

20 Report Generation Module 3 Printed Circuit Board

400 Differential Pair 410 Conversion Through Holes

421, 422 Reference layer 430 Preset best opening position

440 Feedthroughs S200 to S208 steps

S300 to S306 steps

Detailed ways

The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

Please refer to FIG. 1 , which is a schematic block diagram of the basic structure of the through-via opening system of the present invention. The opening system 1 of the through hole is loaded into the wiring software 2 used to execute the production of printed circuit boards through data processing devices such as personal computers, notebook computers, and workstations, so as to provide a return path for the layout of the wiring software 2. differential alignment. In this embodiment, the wiring software 2 can be, for example but not limited to, EDA, Protel, etc., and the differential pair can be, for example but not limited to, a high-speed signal line.

As shown in the figure, the through-via opening system 1 of the present invention includes: a detection module 10 , an analysis module 12 , a location search module 14 and an opening module 16 .

The detection module 10 is used to detect the number of conversion layers of the differential pair arranged on the printed circuit board through the wiring software 2, so as to obtain the reference layer of the differential pair and its corresponding reference layer during the circuit conversion process. Change status of layer properties. In this embodiment, the differential pair is converted to the wiring layer by opening a conversion via hole. The reference layer specifically includes a power layer and a ground layer.

The analysis module 12 is used to analyze the change status of the reference layer of the differential pair detected by the detection module 10 and the change of the corresponding reference layer attribute according to the opening condition of a through hole to determine whether A through hole corresponding to the differential pair needs to be opened. In this embodiment, the opening condition means that if the reference layer of the two traces before and after the conversion of the differential pair is not changed, there is no need to open a through hole; If the reference layer of the line part is changed, and the properties of the changed two reference layers are also changed, it is not necessary to open a through hole; When the reference layer attribute of the reference layer is not changed, it is necessary to arrange the through hole corresponding to the differential pair.

The position search module 14 is used to search around the conversion via (via) of the differential pair to determine a preset when the analysis module 12 analyzes that the differential pair needs to open a through hole. the best opening location. In this embodiment, the preset optimal opening position is located within a certain range (for example, 100 mil) around the conversion through hole, and maintains an inclination angle of, for example, 45 degrees with the conversion through hole. In another embodiment, if there are other signal traces densely distributed around the conversion via hole, the search range can be correspondingly narrowed (for example, 35mil), and appropriate adjustments can be made subsequently.

The opening module 16 is used to open the required through hole at the preset optimal opening position determined by the position search module 14, so that the through hole provides a return path for the differential pair, so that The electromagnetic interference generated by the differential pair is prevented, and the problem of a large amount of time-consuming and low efficiency in the prior art that needs to be manually set up is avoided, and the work efficiency is improved and the production cost is reduced. In addition, in the process of opening the through-via in this embodiment, the opening module 16 further includes providing an attribute corresponding to the attribute of the reference layer to the arranged through-via.

In addition, the wiring software 2 has a report generation module 20, which is used to check the opening result and generate an analysis report after the through-hole opening is completed through the opening module 16, so that the layout engineer can make subsequent adjustments. . In this embodiment, the check can be, for example, a design rule check (Design Rule Check, DRC).

As shown in FIG. 2 , the method for opening a through hole of the present invention includes the following detailed implementation steps: In step S200, Make the detection module 10 detect in advance the number of conversion layers of the differential pair line on the printed circuit board laid out by the wiring software 2, so as to obtain the reference layer of the differential pair line and its corresponding reference layer during the circuit conversion process The change status of the attribute. Subsequently, step S202 is executed.

In step S202, the analysis module 12 is made to analyze the change status of the reference layer of the differential pair detected by the detection module 10 and the corresponding reference layer attributes according to the opening condition of a through-hole. It is judged whether it is necessary to open a through-hole corresponding to the differential pair. If yes, execute step S204; otherwise, if no, execute step S208.

In step S204, the position search module 14 is configured to search around the conversion via hole of the differential pair to determine a preset optimal opening position. Subsequently, step S206 is executed.

In step S206, let the opening module 16 open the required through-holes at the preset optimal opening positions determined by the position search module 14, and give the laid-out through-holes corresponding to the reference layer properties, thereby providing a return path to the differential pair to prevent electromagnetic interference from the differential pair.

In step S208, the routing software 2 continues to execute other routing operations.

Subsequently, the report generating module 20 of the wiring software 2 can also be used to check the opening result and generate an analysis report, so that the layout engineer can make subsequent adjustments.

Please continue to refer to FIG. 3 , which is a more detailed description of steps S200 and S202 of the method for opening through vias of the present invention. In step S300, the detection module 10 is made to detect in advance the number of conversion layers of the differential pair laid out by the wiring software 2 on the printed circuit board, and determine whether the reference layer of the differential pair has changed during the circuit conversion process , if there is a change, execute step S302; otherwise, if there is no change, execute step S306, and the analysis module 12 finds that there is no need to open a through hole.

In step S302, let the detection module 10 further determine whether the reference layer attribute corresponding to the changed reference layer has not changed, and if there is a change, then go to step S306, and the analysis module 12 analyzes that there is no need to open a through hole ; On the contrary, if there is no change, execute step S304.

In step S304 , the analyzing module 12 is instructed to analyze and obtain the need to open through vias according to the above-mentioned change status that the reference layer has changed but the attributes of the reference layer have not changed.

Please refer to FIG. 4 , which shows a schematic diagram of an application embodiment of the system and method for opening through vias of the present invention. As shown in the figure, the differential pair 400 is converted from the top layer (Top) of the printed circuit board 3 to the sixth layer (L6) through the conversion via hole 410 opened by the wiring software 2, wherein the wiring part before the layer change The reference layer 421 is the ground layer (GND) of the second layer (L2), and the reference layer 422 of the routing part after the layer change is converted to the ground layer (GND) of the seventh layer (L7). The reference layer is changed but the reference Layer properties are unchanged. According to the opening conditions of the through-hole, it is necessary to open the through-hole, so the preset optimal opening position 430 is determined around the conversion through-hole 410 to open the through-via 440 with properties corresponding to the ground layer (GND). , so that the through hole 440 provides a return path for the differential pair, so as to prevent electromagnetic interference from the differential pair 400 and improve signal transmission quality.

To sum up, the system and method for opening through holes of the present invention is to detect in advance the number of conversion layers of the differential alignment on the printed circuit board when performing the layer change operation of the differential alignment, so as to judge Whether the reference layer of the differential pair line and its corresponding reference layer attributes are changed during the line conversion process, and analyze the change to determine whether it is necessary to open a through hole, and when the opening operation is performed, to the conversion via hole Search around to determine a preset optimal opening position, so as to open the required through-holes accordingly, which can provide a return path to the differential pair, so as to prevent electromagnetic interference from the differential pair and improve the signal Excellent transmission quality, solves the problems of a lot of time-consuming and low efficiency due to the need to manually set up in the prior art, and indeed improves work efficiency and reduces production costs.

The above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present invention, and are not intended to limit the present invention, that is, other changes can still be made in the present invention. Therefore, any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be as listed in the preceding claims.

Claims (8)

1. A system for opening a through-hole, which is loaded into the wiring software used to make a printed circuit board through a data processing device, in order to provide a return path for the differential pair line laid by the wiring software, the through-hole The through-hole opening system includes: A detection module, which is used to detect the number of conversion layers of the differential pair arranged by the wiring software on the printed circuit board, so as to obtain the reference layer of the differential pair and its corresponding reference during the circuit conversion process The change status of layer attributes; An analysis module, which is used to analyze the changes of the reference layer of the differential pair detected by the detection module and the corresponding reference layer attributes according to the opening conditions of the through-hole, so as to determine whether it is necessary to open The through-hole corresponding to the differential pair, wherein the opening condition of the through-hole means that only when the reference layer changes and its corresponding reference layer properties do not change, it is necessary to lay out the differential pair. The lead-through hole corresponding to the line; A position search module, which is used to search around the conversion via hole of the differential pair to determine a preset optimal opening position when the differential pair needs to be opened through the analysis module. ;as well as The opening module is used for opening the required through hole at the preset optimal opening position determined by the position search module, so that the through hole provides a return path for the differential pair. 2. The opening system for through-holes according to claim 1, wherein the wiring software also has a report generating module for checking the opening results and generating an analysis after the opening of the through-holes is completed. Report. 3 . The through-via opening system according to claim 1 , wherein the opening module further comprises providing an attribute corresponding to an attribute of the reference layer to the laid through-via during the opening process. 4 . 4. The system for opening through vias according to claim 1, wherein the reference layer properties include a power layer and a ground layer. 5. A method for opening a through hole, which is loaded into the wiring software used to make a printed circuit board through a data processing device, in order to provide a return path to the differential pair line laid by the wiring software, the through hole The opening methods of through holes include: 1) Detecting the number of conversion layers of the differential pair arranged by the wiring software on the printed circuit board, so as to obtain the change status of the reference layer of the differential pair and its corresponding reference layer attributes during the circuit conversion process; 2) According to the opening conditions of the through-hole, analyze the detected reference layer of the differential pair and the change status of the corresponding reference layer attributes to determine whether it is necessary to open the corresponding differential pair. If yes, then execute step 3, if not, then end the process step; wherein, the opening condition of the through hole means that only when the reference layer changes and its corresponding reference layer attributes do not change, the It is necessary to lay out through-holes corresponding to the differential pair; 3) searching around the conversion via hole of the differential pair to determine a preset optimal opening position; and 4) Opening required through-holes at the preset optimal opening position, so that the through-holes can provide return paths for the differential pairs. 6 . The method for opening a through-via according to claim 5 , further comprising checking the opening result and generating an analysis report after the through-hole is opened. 7 . 7 . The method for opening a through via according to claim 5 , wherein step 4 further comprises providing an attribute corresponding to an attribute of the reference layer to the routed through via. 8 . 8. The method for opening a through via according to claim 5, wherein the reference layer attributes include a power layer and a ground layer.

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