CN101303389A - Test method and device thereof - Google Patents

Abstract

The invention discloses a testing method and a device thereof, which are applied to ICT (In-Circuit Test) testing of a Circuit board, wherein the Circuit board comprises at least one electronic part to be tested, two sides of the electronic part to be tested are respectively connected with the Circuit board through a welding pad, and the electronic part to be tested and the welding pad are welded and fixed through soldering tin. The test method comprises the following steps: placing the circuit board at a position to be tested; providing at least one set of probes; moving the position of each group of probes and positioning the probes on the electronic part to be tested; each set of probes is contacted with each pad or solder to obtain the test signal.

Description

Test method and its device

technical field

The present invention relates to a testing method and its device, in particular to a testing method and its device applied to ICT (In-Circuit Test) testing, which can greatly increase the measurable rate of electronic parts and reduce the noise interference of test signals .

Background technique

Current handheld electronic products (such as mobile phones or GPS navigation devices, etc.) are all designed in the direction of lightness, thinness and miniaturization, which makes the internal parts of the product more and more dense. Relatively, in the process of manufacturing such electronic products, ICT (In- Circuit Test) testing is also becoming more and more important. As shown in FIG. 1 of the prior art, generally, both sides of the electronic part 20 to be tested are connected to the circuit board 10 with a pad (PAD) 30, and the electronic part 20 to be tested and the pad 30 are connected by a pad 30. A 60 solder fix. The traditional ICT test method is to pull out the test pad (Test PAD) 40 electrically connected to the pad 30 from the trace of the circuit board 10, and then contact the test pad (Test PAD) 50 through the micro probe (micro probe) 50 on the ICT device. The test pad 40 is used to test the circuit characteristics of the electronic component 20 to be tested. However, when testing, the measured signal is easily affected by the test pad 40 to generate noise. In addition, because the density of electronic components on the circuit board 10 is too high, the space for additionally installing the measuring pads 40 is relatively less and less. Under this condition, it is necessary to reduce the number of measuring pads 40 provided on the circuit board 10. The test pad 40 can only be set for some important parts, and the measurable rate of the parts is also greatly reduced.

Therefore, in order to solve the above-mentioned conventional problems, the idea of the present invention was produced.

Contents of the invention

The main purpose of the present invention is to provide a testing method, which can test electronic parts to be tested without setting test pads on the circuit board, can greatly increase the testability of electronic parts, and reduce noise interference of test signals.

Another object of the present invention is to provide a testing device for applying the aforementioned testing method.

The test method of the present invention is applied to the ICT test of a circuit board. The circuit board includes at least one electronic part to be tested. The two sides of the electronic part to be tested are respectively connected to the circuit board with a welding pad, and the electronic part to be tested is connected to the welding pad. Between is fixed with a solder welding. The test method of the present invention comprises the following steps: placing the circuit board at a position to be tested; providing at least one set of probes; moving the positions of each set of probes and positioning them on the electronic parts to be tested; and contacting each set of probes respectively Each pad or solder to obtain the test signal.

In order to achieve the above-mentioned another purpose, the test device of the present invention includes a test host and a jig, the jig is electrically connected to the test host, the jig includes at least one set of probes, and each set of probes is movable and transparent. Position it through the jig. It is characterized in that each group of probes directly contacts each welding pad or solder of each electronic component to be tested to obtain a test signal.

Description of drawings

Figure 1 is a schematic diagram of the prior art.

Fig. 2 is a flow chart of the testing method of the present invention.

Fig. 3 is a schematic diagram of the testing method of the present invention.

Fig. 4a and Fig. 4b are schematic diagrams of the test area of the test method of the present invention.

Fig. 5 is a schematic diagram of the testing device of the present invention.

Symbol description of main parts

circuit board 10

Electronic parts to be tested 20

Pad 30

Measuring Pad 40

Probe 50

Solder 60

Test device 100

Test host 110

Fixture 120

Probe 121

Detailed ways

In order to allow your examiners to better understand the technical content of the present invention, preferred specific embodiments are given and described as follows.

Please refer to FIG. 2 and FIG. 3 together below, which are a flow chart and a schematic diagram of the testing method of the present invention. As shown in Figure 2, test method of the present invention comprises the following steps:

Step S1: Place the circuit board 10 at a position to be tested. As shown in Figure 3, the circuit board 10 includes at least one electronic part 20 to be tested, and the two sides of the electronic part 20 to be tested are respectively connected to the circuit board 10 with a pad 30, and the electronic part 20 to be tested and the pad 30 are connected to each other. The space is fixed with 60 solder. When the ICT test is to be performed, the circuit board 10 is placed on a position to be tested and fixed.

Step S2: providing at least one set of probes 50 . After the circuit board 10 is placed properly, one or more sets of probes 50 can be provided to prepare for testing the electronic components 20 to be tested according to the number of electronic components 20 to be tested on the circuit board 10 or according to different requirements.

Step S3: Move the positions of each group of probes 50 and position them on the electronic component 20 to be tested. After determining the number of electronic components 20 to be tested and the number of probes 50 in step S2 , one or more groups of probes 50 are moved to the positions of the electronic components 20 to be tested and positioned.

Step S4 : Touch each group of probes 50 to each pad 30 to obtain a test signal. After each group of probes 50 is in contact with each welding pad 30 or solder 60 on both sides of each electronic part 20 to be tested, power is provided to each group of probes 50. Since the welding pad 30 can penetrate the solder 60 and the electronic part to be tested 20 are connected, so a conduction circuit can be formed for each electronic component 20 to be tested, so as to test the circuit characteristics of each electronic component 20 to be tested.

Through the above steps, the probe 50 can be used to directly test the electronic component 20 to be tested in the ICT test, without worrying about the setting of the test pad on the circuit board, and the test result can be prevented from being affected by the easily generated noise caused by the test pad.

Please refer to FIG. 4a and FIG. 4b which are schematic diagrams of the test area of the test method of the present invention. As shown in FIG. 4 a and FIG. 4 b , the testing method of the present invention is to define a testing area on the surface of the pad 30 , and make the probe 50 touch the range of the testing area for testing. The test area is a rectangular area formed by the length of the pad 30 and the substantially vertical distance from the outer edge of the pad 30 to the electronic component 20 to be tested. The size of the test area varies according to the size of the solder pad 30 used. In this embodiment, the length of the test area is set to be the length B (mil) of the solder pad 30, and the width of the test area is the substantially vertical distance L (mil) from the outer edge of the solder pad 30 to the electronic component 20 to be tested, that is, the test The size of the area is B×L. When testing electronic parts 20 to be tested with the same or different passive components or packaged chip specifications, the size of the pads 30 used by each electronic part to be tested 20 is different due to various design requirements. The size of the test area formed on the pad 30 will also vary. 4a and 4b list the size of the test area formed under the condition of using solder pads 30 of different sizes for the electronic components 20 to be tested with different specifications of the passive components.

In addition, the position of the test area touched by the probe 50 varies according to the size of the test area. Since the test area includes the solder 60 for welding the electronic part 20 to be tested and the pad 30, and the solder 60 is a non-flat surface with a certain curvature, so when using the probe 50 to touch the test area for testing, it is necessary to find a way to facilitate needle sticking. position, so that the probe 50 will not slip during the test, and at the same time, a more stable test signal can be obtained. According to the actual measurement results in this embodiment, when the size B×L of the test area is greater than 24mil×10mil, the position of the test area touched by the probe 50 is 0.4-0.5 of the substantially vertical distance from the outer edge of the pad 30 inward. A stable and better test signal can be obtained within the range of 0.4 L to 0.5 L from the outer edge of the pad 30 inwardly. When the size of the test area is equal to 24mil×10mil, the position of the test area touched by the probe 50 is within the range of a substantially vertical distance of 4-5 mil from the outer edge of the solder pad 30 inward. At this time, the probe 50 can obtain a stable and better the test signal. When the size of the test area is less than 24mil×10mil, the position of the test area touched by the probe 50 is within the range of a substantially vertical distance of 3 to 4 mil from the outer edge of the solder pad 30 inward. At this time, the probe 50 can obtain a stable and better the test signal.

Please refer to FIG. 5 which is a schematic diagram of the testing device of the present invention. The test device 100 of the present invention includes a test host 110 and a jig 120, the jig 120 is electrically connected to the test host 110, the jig 120 includes at least one group of probes 121, each group of probes 121 can move and pass through the jig 120 To be positioned. It is characterized in that each group of probes 121 directly contacts each pad 30 or solder 60 of each electronic component 20 to be tested to obtain a test signal. The test device 100 of the present invention is designed by applying the aforementioned test method, so that the test device 100 can perform circuit characteristic tests on any electronic component 20 to be tested on the circuit board 10, thereby improving the testability of electronic components.

The testing device 100 of the present invention can be applied to the aforementioned testing method. By touching the probes 121 to the solder pads 30 or solder 60 on both sides of the electronic component 20 to be tested, a testing region with a stable testing signal can be obtained to achieve a good testing effect.

To sum up, the present invention, regardless of its purpose, means, and efficacy, shows its characteristics that are completely different from the prior art. It is a major breakthrough. I sincerely hope that your review committee will be aware of it and grant a patent as soon as possible to benefit the society. Virtuous. However, it should be noted that the above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present invention, and are not intended to limit the scope of the present invention. Any person familiar with the technology can modify and change the embodiments without violating the technical principle and spirit of the present invention. The protection scope of the present invention should be described in the claims.

Claims (12)

1, a kind of method of testing, be applied to ICT (in-circuit test) test of a circuit board, this circuit board comprises at least one electronic component to be measured, these electronic component to be measured both sides distinctly are connected with this circuit board with a weld pad, and are fixing with scolding tin welding between this electronic component to be measured and this weld pad; This method of testing may further comprise the steps:

(a) this circuit board is positioned over a position to be measured;

(b) provide at least one group of probe;

(c) move the position of this group probe respectively and being positioned on this electronic component to be measured; And

(d) respectively this group probe contacts respectively this weld pad or this scolding tin respectively to obtain the test signal.

2, method of testing as claimed in claim 1 wherein limits a test zone in this weld pad surface, and this test zone is to test for this probe contact.

3, method of testing as claimed in claim 2 is that the vertical range in fact to this electronic component to be measured is the rectangular area that two length of sides are constituted with this weld pad length and from this weld pad outer rim in this test zone wherein.

4, method of testing as claimed in claim 3, wherein when the size of this test zone during greater than 24mil * 10mil, the position of this test zone that this probe contacts is in 0.4～0.5 times of scope of the vertical range in fact to this electronic component to be measured from this weld pad outer rim.

5, method of testing as claimed in claim 3, wherein when the size of this test zone during less than 24mil * 10mil, the position of this test zone that this probe contacts is from this weld pad outer rim inwardly in fact in vertical range 3～4mil scope.

6, method of testing as claimed in claim 3, wherein when the size of this test zone equals 24mil * 10mil, the position system of this test zone that this probe contacts is from this weld pad outer rim inwardly in fact in vertical range 4～5mil scope.

7, a kind of proving installation, be applied to the ICT test of a circuit board, this circuit board comprises at least one electronic component to be measured, and these electronic component to be measured both sides distinctly are connected with this circuit board with a weld pad, and is fixing with scolding tin welding between this electronic component to be measured and this weld pad; This proving installation comprises:

One Test Host; And

One tool is electrically connected with this Test Host, and this tool comprises at least one group of probe, and respectively this group probe is removable and located by this tool;

It is characterized in that: by this group probe respectively directly contact respectively respectively this weld pad of this electronic component to be measured or this scolding tin to obtain the test signal.

8, proving installation as claimed in claim 7 wherein limits a test zone in this weld pad surface, and this test zone is to test for this probe contact.

9, proving installation as claimed in claim 8 is that the vertical range in fact to this electronic component to be measured is the rectangular area that two length of sides are constituted with this weld pad length and from this weld pad outer rim in this test zone wherein.

10, method of testing as claimed in claim 9, wherein when the size of this test zone during greater than 24mil * 10mil, the position of this test zone that this probe contacts is in 0.4～0.5 times of scope of the vertical range in fact to this electronic component to be measured from this weld pad outer rim.

11, proving installation as claimed in claim 9, wherein when the size of this test zone during less than 24mil * 10mil, the position of this test zone that this probe contacts is from this weld pad outer rim inwardly in fact in vertical range 3～4mil scope.

12, proving installation as claimed in claim 9, wherein when the size of this test zone equals 24mil * 10mil, the position of this test zone that this probe contacts is from this weld pad outer rim inwardly in fact in vertical range 4～5mil scope.

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