CN101203121A - Heat radiation assembly structure - Google Patents

Abstract

The invention discloses a heat radiation component structure, which is combined with a heating component arranged on a circuit board, and the heat radiation component structure comprises a heat conduction plate and at least one elastic sheet, wherein the heat conduction plate further comprises a pressure applying surface and an abutting surface, the elastic sheet comprises at least one fixed section and a plurality of abutting sections extending from the fixed section, when the fixed section of the elastic sheet is fixed on the circuit board, each abutting section is respectively provided with a force for abutting the heat conduction plate against the heating component, so that the abutting surface is abutted to the heating component, the heat generated by the abutting surface is conducted to the heat conduction plate, and the simple structure provides a plurality of forces for pressing the heat conduction plate.

Description

Heat sink structure

technical field

The present invention relates to a heat dissipation component structure, in particular to a heat dissipation component structure that can provide positive downward pressure with a simple combination structure and is in close contact with the heating component.

Background technique

The chip unit used to provide computer computing and main control functions, such as the central processing unit (Central Processor Unit; CPU) as the center of the computer, its importance is of course not to be emphasized, regardless of whether it is a chip unit or other display chip modules , its high-frequency operation will also generate high heat, which is a heat-generating component in the computer, but its high temperature may become a potential crisis of computer system paralysis, resulting in a situation where the machine is prone to failure or damage. Therefore, the solution to this problem The cooling device came into being, and the mode of locking the cooling device on the main board of the computer to achieve heat dissipation is a widely used way of cooling at present, and most of the existing fixing technologies use the fixing place of the cooling device on the main board. And four holes are made relative to the heating component to provide four positive forces, and the heat sink is flatly attached to the heating component for stable locking.

However, in view of the trend of notebook computers becoming smaller and smaller, the relative size of the main board is of course also smaller. Therefore, for the heat dissipation device, there are relatively many restrictions on the location and number of holes that can be conveniently opened for fixing, especially for heat sinks. As far as a chip unit is concerned, the better fixing method is to punch holes in its surrounding corners to fix it, but when the above method is not practical, and it is necessary to use fewer holes, such as three holes, to achieve a stable lock. The purpose of fixing the cooling device will be a big problem at this time.

Therefore, in order to solve the disadvantage that the above-mentioned prior art cannot stably lock the cooling device on the main board with fewer holes, how to redesign a cooling component structure, which can meet the current trend of light, thin and small notebook computers, and be relatively thin It is the goal of the present inventor to provide positive force and stably lock the heat sink on the main board with fewer holes than the existing ones.

Contents of the invention

In view of the above-mentioned problems in the prior art, the present invention provides a heat dissipation assembly structure to solve the problem that the motherboard in the prior art cannot stably lock the heat sink on the motherboard with fewer holes, and at the same time overcome how to use three holes Reach the difficulty of stably locking the cooling device.

In order to achieve the above object, the present invention provides a heat dissipation component structure, which is combined with the heating component, and the heating component is arranged on a circuit board. The above heat dissipation component structure includes a heat conducting plate and at least one elastic piece, and the heat conducting plate also includes a pressing surface And the abutting surface, and the shrapnel includes at least one fixed section and a plurality of pressure sections, and the pressure section extends from the surrounding section. When the fixed section is fixed on the circuit board, it can make each pressure section Each has a force to press the heat conducting plate towards the heating component, so as to attach the abutting surface to the heating component, and conduct the heat generated by the heating component to the heat conducting plate.

The structure of the heat dissipation component of the present invention has the following significant efficiency improvement over the following method.

With the heat dissipation component structure of the present invention, it is possible to combine components such as a simple heat conduction plate and shrapnel, and provide positive downward pressure with fewer fixing points, such as three screw fixing points, so that the heat conduction plate can be smoothly attached to generate heat. The heat conduction of components is in line with the limited space of today's circuit boards, and it is impossible to open a large number of screw holes for fixing. It is also to meet the trend of notebook computers getting smaller and smaller, and further heat dissipation components also include limiting parts , to limit the shrapnel and provide a downward pressure force that the heat conduction plate and the heating component are more closely attached.

In order to have a further understanding of the purpose, structural features and functions of the present invention, the relevant embodiments and drawings are described in detail as follows:

Description of drawings

FIG. 1A is a schematic diagram of the first embodiment of the heat dissipation assembly structure of the present invention;

FIG. 1B to FIG. 1C are schematic diagrams of the operation of the first embodiment of the heat dissipation assembly structure of the present invention;

2A is a schematic diagram of a second embodiment of the structure of the heat dissipation assembly of the present invention;

2B to 2C are schematic diagrams of the operation of the second embodiment of the heat dissipation assembly structure of the present invention;

Fig. 3 is a schematic diagram of the third embodiment of the structure of the heat dissipation assembly of the present invention attached to the circuit board;

FIG. 4 is a schematic diagram of a third embodiment of the heat dissipation assembly structure of the present invention; and

5A to 5B are schematic diagrams of the four resisting sections of the shrapnel of the heat dissipation assembly structure of the present invention.

Wherein, reference sign is:

10a, 10b, 10c Heat dissipation component structure

11 Heat conduction plate

111 Pressure surface

112 abutment surface

12a, 12b, 12c shrapnel

121 Fixed section

122 Resisting pressure section

123 slots

13 Limiting parts

131 junction

132 Cover top

14 Pressurized shrapnel

15 Locking hole

16 heat dissipation module

17a, 17a' through hole

17b Screw hole

18 screws

20 Heating components

30 circuit board

Detailed ways

Please refer to FIG. 1A , the present invention is a heat dissipation component structure, which is used to set on a heating component 20 to guide away the heat generated by the operation of the heating component 20, and the heating component 20 is set on a circuit board 30, and the aforementioned heat generation The component 20 is a component such as a chip, such as a central processing unit or a display chip, which emits high heat during operation, so effective heat dissipation is required to maintain its stable operation. Furthermore, the heat dissipation component structure 10a includes a heat conducting plate 11 And at least one elastic piece 12a, the above-mentioned heat conduction plate 11 includes a pressing surface 111 and an abutment surface 112, the abutment surface 112 is used to be attached to the heating element 20 to conduct heat to the heat conduction plate 11, and the elastic piece 12a includes At least one fixing section 121 and a plurality of pressing sections 122 are formed. The pressing section 122 extends from the fixing section 121 , and the fixing section 121 is fixed on the circuit board 30 .

In the first embodiment of the present invention, the elastic piece 12a discloses in more detail at least two above-mentioned pressing sections 122, the two ends of which are respectively fixed on the pressing surface 111 of the heat conducting plate 11, and the two pressing sections 122 are respectively The self-fixing sections 121 are symmetrical to each other and extend in opposite directions. Furthermore, the pressing sections 122 are arranged symmetrically on both sides of the heating element 20 and are linear, so when the elastic piece 12a is fixed by the fixing section 121 When it is installed on the circuit board 30, as in this embodiment, the fixed section 121 of the elastic piece 12a is provided with a through hole 17a, and the heat conducting plate 11 is also provided with another through hole 17a' corresponding to the through hole 17a, and the circuit board 30 is provided with a screw hole 17b relative to the through hole 17a, and the elastic piece 12a is locked on the circuit board 30 by a screw 18. As shown in Figure 1B and Figure 1C, the pressing section 122 will slide and be flat on the circuit board 30. The heat conduction plate 11 is such that each pressing section 122 has a force to press the heat conduction plate 11 toward the heating element 20, so that the heat conduction plate 11 is closely attached to the heat generating element 20, and the above-mentioned shrapnel 12a is fixed on the heat conduction plate in a figure-eight shape. The pressing surface 111 of the plate 11 .

Please refer to FIG. 2A. The heat dissipation assembly structure 10b is the second embodiment of the present invention. The heat dissipation assembly structure 10b inherits from the first embodiment, and also includes a heat conducting plate 11 and at least one elastic piece 12b, and at least has a limiting member 13, The limiting member 13 is fixed on the heat conducting plate 11, and limits the movement path of the end of the elastic piece 12b. The limiting member 13 has a joint portion 131 and a cover top 132 extending from the joint portion 131, and the limiting member 13 13 is fixed on the pressing surface 111 of the heat conduction plate 11. In this embodiment, when the stopper 13 is a rivet, the joint 131 is the nail post fixed on the heat conduction plate 11. The pressing surface 111, and the top 132 of the cover is its rivet cap, which is also formed by extending the nail post. In addition, the end of the shrapnel 12b is provided with a slot 123 for the setting of the stopper 13, and the stopper 13 It can be but not limited to a T-shaped rivet. When the aforementioned rivet is fixed in the slot 123, it can limit the movement path of the end of the elastic piece 12a. Of course, the aforementioned limiting member 13 can also be a screw. Please refer to FIG. 2B and As shown in Figure 2C, when the above-mentioned elastic piece 12a is fixed on the circuit board 30, each pressing section 122 has a force to press the heat conducting plate 11 toward the heating element 20 respectively. When the fixed section 121 of the elastic piece 12a gets closer When the heat conduction plate 11 is installed, the tail end of the pressing section 122 will be lifted. At this time, the pressing section 122 will hold the top of the cover 132 to prevent the tail end of the shrapnel 12b from lifting, so that the heat conduction plate 11 can be tightly attached. In the heating element 20, as shown in FIG. 3 .

Please refer to FIG. 4, the heat dissipation assembly structure 10c is the third embodiment of the present invention, the heat dissipation assembly structure 10c inherits the second embodiment, and also includes a heat conducting plate 11, at least one elastic piece 12b and a limiting member 13, and further has A pressurized shrapnel 14, the aforementioned pressurized shrapnel 14 straddles the fixed section 121 of the second shrapnel 12b, when the second shrapnel 12b is fixed on the circuit board 30, the pressurized shrapnel 14 is linked together, and at the same time, a force of traction toward the circuit board 30 is generated , so as to push the heat conducting plate 11 against the heating component 20 , of course, in the third embodiment, the limiting member 13 can also be omitted, and the heat conducting plate 11 can also be closely attached to the heating component 20 .

In addition, the heat conduction plate 11 of the heat dissipation assembly structure 10a, 10b, 10c can further have a locking hole 15, the locking hole 15 is located at one end of the heat conduction plate 11, so that one end of the heat conduction plate 11 is fixed on the circuit board 30, thereby To provide a downward pressure to make the heat conducting plate 11 close to the heating element 20, and another elastic piece 12c is added on the above-mentioned locking hole 15, the elastic piece 12c includes a fixed section 121 and a resistance extending from the fixed section 121. The pressing section 122 , so that when the heat conduction plate 11 is fixed on the circuit board 30 , the elastic piece 12 c generates a downward force toward the circuit board 30 to push the heat conduction plate 11 against the heating element 20 .

The heat dissipation component structures 10a, 10b, 10c also include a heat dissipation module 16, which is disposed on the heat conduction plate 11 to dissipate the heat conducted by the heat conduction plate.

In addition, the structure of the elastic piece 12a can also include a plurality of pressing segments 122, for example, four pressing segments 122, as shown in FIG. 5A. Of course, the elastic piece 12b can also include four pressing segments 122, As shown in FIG. 5B , the way it is structured on the heat conducting plate 11 and the way it is actuated and pressed against the heating element 20 are the same as those described in the above-mentioned embodiments.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make various corresponding modifications according to the present invention without departing from the spirit and essence of the present invention. Changes and deformations, but these corresponding changes and deformations should fall within the scope of protection of the appended claims of the present invention.

Claims (16)

1. heat radiation assembly structure, it is incorporated into a heat generating component, and this heat generating component produces heat and also is arranged on the circuit board, it is characterized in that this heat radiation assembly structure comprises:

One heat-conducting plate, this heat-conducting plate comprise the face of exerting pressure and a bearing surface, and this bearing surface fits in this heat generating component to conduct this heat to this heat-conducting plate; And

At least one shell fragment, this shell fragment comprise at least one section of setting firmly and a plurality of section of compressing of extending from this section of setting firmly, and this section of setting firmly is fixedly arranged on this circuit board and feasible respectively this section of compressing and has the power that this heat-conducting plate is compressed towards this heat generating component respectively.

2. heat radiation assembly structure according to claim 1 is characterized in that, this heat radiation assembly structure also comprises a locating part at least, and this locating part is fixedly arranged on this heat-conducting plate and limits the mobile route of this shell fragment end.

3. heat radiation assembly structure according to claim 1 is characterized in that, these at least two these sections of compressing are symmetry status from this section of setting firmly, and extension forms in the opposite direction.

4. heat radiation assembly structure according to claim 1, it is characterized in that, this heat radiation assembly structure also comprises a locating part at least, this locating part is fixedly arranged on this heat-conducting plate and limits the mobile route of this shell fragment end, and the end of this shell fragment offers a slotted eye for this locating part setting, to limit the mobile route of this shell fragment end.

5. heat radiation assembly structure according to claim 4 is characterized in that, this limit assembly is a screw, and this screw is fixedly arranged in this slotted eye, to limit the mobile route of this shell fragment end.

6. heat radiation assembly structure according to claim 4 is characterized in that, this limit assembly is a rivet, and this rivet is fixedly arranged in this slotted eye, to limit the mobile route of this shell fragment end.

7. heat radiation assembly structure according to claim 1 is characterized in that, this heat radiation assembly structure comprises two these shell fragments, and the arranged on both sides of this exert pressure face and this heat generating component of symmetry that this two shell fragment is fixedly arranged on this heat-conducting plate is also linearly.

8. heat radiation assembly structure according to claim 7, it is characterized in that, this two shell fragment also comprises a pressurization shell fragment, this pressurization shell fragment cross-over connection is in this section of setting firmly of this two shell fragment, this pressurization shell fragment of interlock when this two shell fragment is fixedly arranged on this circuit board, produce strength simultaneously, so that this heat-conducting plate is pushed against in this heat generating component towards this circuit board traction.

9. heat radiation assembly structure according to claim 1 is characterized in that, this heat-conducting plate also has the end that a locking hole is positioned at this heat-conducting plate, supplies this end of this heat-conducting plate to be fixedly arranged on this circuit board.

10. heat radiation assembly structure according to claim 1 is characterized in that this heat radiation assembly structure also comprises a radiating module, and this radiating module is arranged at this heat-conducting plate, the heat that is conducted in order to this heat-conducting plate of dissipation.

11. heat radiation assembly structure according to claim 1 is characterized in that, this section of setting firmly of this shell fragment is fixedly arranged on this circuit board in the solid mode of spiral shell.

12. heat radiation assembly structure according to claim 9, it is characterized in that, also add another shell fragment on this locking hole, this shell fragment comprises a section of setting firmly and a section of compressing from this section of setting firmly extension, when this heat-conducting plate is fixedly arranged on this circuit board, this shell fragment produces the strength that presses down towards this circuit board, so that this heat-conducting plate is pushed on this heat generating component.

13. heat radiation assembly structure according to claim 4, it is characterized in that, this locating part has a joint portion and and extends the tops that forms by this joint portion, this joint portion of this locating part is for this bearing surface that is fixedly arranged on this heat-conducting plate, and when this section of setting firmly is fixedly arranged on this circuit board, this tops is held in this shell fragment, avoids this shell fragment tail end perk.

14. heat radiation assembly structure according to claim 6 is characterized in that, the shape of this rivet is a T shape.

15. heat radiation assembly structure according to claim 1 is characterized in that, this shell fragment is to be this face of exerting pressure that Eight characters shape is fixedly arranged on this heat-conducting plate.

16. a heat radiation assembly structure, it is incorporated into a heat generating component, and this heat generating component produces heat and is arranged on the circuit board, it is characterized in that this heat radiation assembly structure comprises:

One heat-conducting plate, this heat-conducting plate comprise the face of exerting pressure and a bearing surface, and this bearing surface fits in this heat generating component to conduct this heat to this heat-conducting plate;

One locking hole, this locking hole are positioned at an end of this heat-conducting plate, are fixedly arranged on this circuit board for this end of this heat-conducting plate, and this locking hole also adds another shell fragment, and this shell fragment comprises a section of setting firmly and a section of compressing from this section of setting firmly extension;

One radiating module, this radiating module is arranged at this heat-conducting plate, the heat that is conducted in order to this heat-conducting plate of dissipation;

Two shell fragments, those shell fragments comprise at least one section of setting firmly and a plurality of section of compressing of extending from this section of setting firmly rightabout respectively, these sections of compressing are symmetry status from this section of setting firmly, this section of setting firmly is fixedly arranged on this circuit board in the solid mode of spiral shell and makes this section of compressing respectively have the power that this heat-conducting plate is compressed towards this heat generating component respectively, and the end of this shell fragment also offers a slotted eye;

At least one locating part, this locating part is to be a screw or a rivet of a T shape and to be fixedly arranged on this heat-conducting plate and to limit the mobile route of this shell fragment end, and this slotted eye is provided with for this locating part, to limit the mobile route of this shell fragment end, and this locating part also has a joint portion and and extends the tops that forms by this joint portion, this joint portion of this locating part is for this bearing surface that is fixedly arranged on this heat-conducting plate, and when this section of setting firmly is fixedly arranged on this circuit board, this tops is held in this shell fragment, avoids this shell fragment tail end perk; And

One pressurization shell fragment, this pressurization shell fragment cross-over connection are in this section of setting firmly of this two shell fragment, and this pressurization shell fragment of interlock when those shell fragments are fixedly arranged on this circuit board produces the strength towards this circuit board traction, simultaneously so that this heat-conducting plate is pushed against in this heat generating component.

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