CN101001751A - Apparatus and method for manufacturing photosensitive laminate - Google Patents

Abstract

A manufacturing apparatus (20) has a reel-out mechanism (32), a processing mechanism (36), a label bonding mechanism (40), a reservoir mechanism (42), a peeling mechanism (44), a substrate feed mechanism (45), and a joining mechanism (46). A detecting mechanism (47) for directly detecting a boundary position of a photosensitive web (22) is disposed upstream of and closely to the joining mechanism (46). Based on detected information from the detecting mechanism (47), a relative position of the boundary position and a substrate (24) in a joining position is adjusted.

Description

Apparatus and method for producing photosensitive laminated body

technical field

The present invention relates to exposing the exposed photosensitive material by conveying two or more elongated photosensitive webs each comprising a photosensitive material layer and a protective film sequentially stacked on a support, peeling off the protective film to expose the sensitive material layer and parallel to each other. Apparatus and method for making a photosensitive laminate in which layers are bonded to a substrate.

Background technique

For example, substrates for liquid crystal panels, substrates for printed wiring boards, and substrates for PDPs (plasma display panels) have a photosensitive sheet (photosensitive connection board) with a layer of photosensitive material (photosensitive resin) bonded to the surface of the substrate. ). The photosensitive sheet includes a layer of photosensitive material and a protective film sequentially placed on a flexible plastic support.

An applying apparatus for applying such a photosensitive sheet is generally operated to feed a substrate such as a glass substrate, a resin substrate, or the like at predetermined intervals, and to peel from the photosensitive sheet corresponding to the A protective film of the length of the photosensitive material layer of the substrate.

For example, as shown in FIG. 32 of the accompanying drawings, according to the method and apparatus for laminating films as disclosed in Japanese Laid-Open Patent Publication No. 11-34280, the laminated film 1a unwound from the film roll 1 surrounds the guide roller 2a, 2b is shaped and extended along the horizontal film feed plane. This guide roller 2b is combined with a rotary encoder 3 for outputting as many pulses depending on the length to which the laminated film 1a is fed.

The laminated film 1 a extending from the guide rolls 2 a , 2 b along the horizontal film feed plane is shaped around a suction roll 4 . Along the horizontal film feed plane, a partial cutter 5 and a cover film stripper 6 are disposed between the guide roll 2b and the suction roll 4 .

The partial cutter 5 has a pair of disc cutters 5a, 5b. The disc cutters 5a, 5b are movable laterally across the laminated film 1a to cut the cover film (not shown) of the laminated film 1a together with the photosensitive resin layer (not shown) on the back side of the cover film.

The cover film stripper 6 firmly presses the adhesive tape 7 a unwound from the tape roll 7 against the cover film between the press rollers 8 a , 8 b and then winds the adhesive tape 7 a around the take-up roller 9 . This cover film is peeled from the photosensitive resin layer by the tape 7a, and is wound up on the take-up roller 9 together with the tape 7a.

Downstream of this suction roller 4 is followed a pair of lamination rollers 12a, 12b for overlapping and pressing the lamination film 1a against the upper surfaces of a plurality of substrates 11 sequentially intermittently fed by the substrate feeder 10. A support film take-up roll 13 is provided downstream of the lamination rolls 12a, 12b. The light-transmitting support films (not shown) attached to the respective substrates 11 are peeled off and taken up by support film take-up rolls 13 .

In the above conventional technique, the measurement of the number of pulses generated by the rotary encoder 3 is started when the partial cutter 5 starts cutting the laminated film 1a. When the measured value of the pulse from the rotary encoder 3 reaches a value corresponding to a predetermined position on the laminated film 1a to be cut, the substrate feeder 10 is activated. Accordingly, the substrate 11 is fed between the lamination rollers 12a, 12b in synchronization with the lamination film 1a. In this way, the laminated film 1 a is positioned for attachment to each substrate 11 .

In the conventional technique, when the partial cutter 5 starts cutting, the measurement of the number of pulses generated by the rotary encoder 3 on the guide roller 2b is started. Based on the measured values, the substrate 11 is fed such that the part of the cut area is considered to reach a predetermined position between the laminating rollers 12a, 12b.

In this case, however, the length between the partial cutter 5 and the stacking rollers 12a, 12b is considerably large. Therefore, the length of the laminated film 1a may change due to the heat of the lamination unit, or the rotary encoder 3 may run idly. Therefore, it is impossible to precisely position the laminated film 1a and the substrate 11 with respect to the laminating rollers 12a, 12b.

Contents of the invention

A main object of the present invention is to provide an apparatus and method for manufacturing a high-quality photosensitive laminate by precisely bonding an elongated photosensitive web to a substrate through simple processing and arrangement.

According to the present invention, there is provided an apparatus for manufacturing a photosensitive laminated body, comprising: a web unwinding mechanism for unrolling an elongated photosensitive web comprising: a support; a photosensitive material disposed on a support layer; and a protective film disposed on the photosensitive material layer, the protective film has a peeling area and a remaining area; a handling mechanism, which is used at a boundary position between the peeling area and the remaining area, after being rolled out by the connecting plate A laterally separable processing area is formed in the protective film of the elongated photosensitive web that is rolled out; a peeling mechanism for peeling the peeled area from the elongated photosensitive web to leave a remaining area; a substrate feeding mechanism for The substrate that has been heated to a predetermined temperature is fed to the bonding position; a bonding mechanism for positioning the remaining area between the substrates and bonding the exposed area of the photosensitive material layer stripped of the peeled area into the bonding position The substrate is used to produce the bonding substrate; the detection mechanism arranged close to the bonding position is used to directly detect the boundary position of the elongated photosensitive connection plate, or the detection mark set on the elongated photosensitive connection plate related to the boundary position; and a control mechanism for adjusting the relative position of the substrate in the boundary position and the bonding position based on the boundary position information detected by the detection mechanism.

Since the relative positions of the elongated photosensitive web and the substrate can be adjusted by simple controls, the detection mechanism should preferably be arranged upstream of and close to the bonding position.

A storage mechanism should preferably be provided between the handling mechanism and the stripping mechanism for varying the speed or state at which the elongated photosensitive web is fed. Thus, the elongated photosensitive web is intermittently fed through the handling mechanism and thereafter continuously fed through the storage mechanism in the subsequent stripping mechanism.

Furthermore, a tension control mechanism should preferably be provided between the peeling mechanism and the bonding mechanism for applying tension to the elongated photosensitive web. As a result, for stretching, the elongated photosensitive web can be adjusted so that the border position to be adjusted is easily aligned with the bonding position.

Furthermore, a cutting mechanism should preferably be provided downstream of the bonding mechanism for severing the elongated photosensitive web between the substrates.

A support stripping mechanism should preferably be arranged downstream of the bonding mechanism for stripping the support from the bonded substrate. The support may be automatically stripped after being cut to lengths corresponding to the respective substrates, or may be continuously wound to be automatically stripped.

The bonding mechanism should preferably include: a pair of rubber rollers capable of being heated to a predetermined temperature; and a nip unit for moving one rubber roller back and forth. The roller clamp unit should preferably include: a cylinder for applying clamping pressure to a rubber roller; and a cam moved by an actuator for moving the cylinder back and forth.

A preheating unit should preferably be arranged upstream and close to the bonding mechanism for preheating the elongated photosensitive web to a predetermined temperature.

According to the present invention, there is also provided a method for manufacturing a photosensitive laminated body, comprising the steps of: rolling out an elongated photosensitive connection plate, the elongated photosensitive connection plate comprising: a support; a photosensitive material layer arranged on the support; and a photosensitive material layer arranged on the photosensitive material layer On the protective film, the protective film has a peeling area and a remaining area; at the boundary position between the peeling area and the remaining area, a laterally separable processing area is formed in the protective film of the elongated photosensitive connection plate that has been rolled out; The peeling area is peeled off from the elongated photosensitive connection plate, and the remaining area is left; by directly detecting the boundary position of the elongated photosensitive connection plate, or detecting the mark set on the elongated photosensitive connection plate related to the boundary position, the boundary position information is obtained ; feeding the substrate that has been heated to a predetermined temperature to the bonding position; adjusting the relative position of the substrate in the boundary position and the bonding position based on the obtained boundary position information; and positioning the remaining area between the substrates, and The photosensitive material layer peeled off the peeled area is bonded to the substrate in the bonding position for producing a bonded substrate.

According to the present invention, since the boundary position of the elongated photosensitive web is directly detected, or a mark provided on the elongated photosensitive web in relation to the boundary position, the boundary position can be positioned with high precision relative to the bonding position. Since the relative position between the boundary position and the substrate in the bonding position is adjusted based on the obtained boundary position information, the photosensitive material layer of the elongated photosensitive connection plate can be precisely bonded to the substrate as desired through a simple process and arrangement. area. Therefore, a high-quality photosensitive laminate can be efficiently produced.

The above and other objects, features and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings in which preferred embodiments of the present invention are shown by way of illustrated examples.

Description of drawings

1 is a schematic side view showing a manufacturing apparatus according to a first embodiment of the present invention;

Figure 2 is an enlarged fragmentary cross-sectional view of an elongated photosensitive web used in the fabrication apparatus;

Figure 3 is a fragmentary top view of an elongated photosensitive web with an adhesive label attached thereto;

Figure 4 is a front side view of the coupling mechanism of the manufacturing device;

Figure 5 is a fragmentary cross-sectional view of the pass-through region of the manufacturing apparatus;

Figure 6 is a schematic diagram of a part of the manufacturing device, showing its initial state;

Figure 7 is a fragmentary side front view showing the manner in which the protective film is peeled off from the elongated photosensitive web;

Fig. 8 is a schematic diagram of a part of the manufacturing apparatus, showing the manner in which the glass substrate enters between rubber rollers;

Figure 9 is a schematic diagram of a part of the manufacturing apparatus, showing the manner in which the rubber roller begins to rotate;

Figure 10 is a schematic diagram of a portion of the manufacturing apparatus showing operations at the end of the lamination process on the first glass substrate;

11 is a schematic diagram of a part of the manufacturing apparatus, showing the manner in which the rubber roller and the substrate feed roller rotate;

Figure 12 is a fragmentary cross-sectional view of a glass substrate onto which a photosensitive resin layer is transferred;

Figure 13 is a schematic diagram of a portion of a manufacturing apparatus showing the manner in which substrate feed rollers are spaced apart from the ends of bonded substrates;

Figure 14 is a schematic diagram of a portion of a manufacturing apparatus showing the manner in which the elongated photosensitive web is separated between bonded substrates;

Figure 15 is a schematic diagram of a portion of the manufacturing apparatus, shown in its stopped state;

Figure 16 is a schematic diagram of a portion of the manufacturing apparatus, shown in its finished state;

Figure 17 is a schematic diagram of a portion of a manufacturing apparatus showing the manner in which the photosensitive web is extended so that its front end is set in place;

Fig. 18 is a top view showing where the photosensitive resin layer is advanced with respect to the glass substrate;

Fig. 19 is a plan view showing where the photosensitive resin layer retards with respect to the glass substrate;

20 is a schematic side view of a manufacturing apparatus according to a second embodiment of the present invention;

Fig. 21 is a plan view showing the manner in which a photosensitive resin layer having a prescribed length is bonded to a glass substrate;

Fig. 22 is a plan view showing the manner in which a photosensitive resin layer larger than a prescribed length is bonded to a glass substrate;

Fig. 23 is a plan view showing the manner in which a photosensitive resin layer smaller than a prescribed length is bonded to a glass substrate;

24 is a schematic side view of a manufacturing apparatus according to a third embodiment of the present invention;

25 is an enlarged cross-sectional view of a pre-peeler of a manufacturing apparatus according to a third embodiment;

Figure 26 is an enlarged cross-sectional view showing the manner in which the pre-peeler operates;

Fig. 27 is a view of the manner in which the position of the photosensitive resin layer bonded to the glass substrate is detected;

Fig. 28 is a schematic side view of a conventional film bonding device.

Detailed ways

FIG. 1 shows an apparatus 20 for manufacturing a photosensitive laminate according to a first embodiment of the present invention in a schematic side view. The manufacturing apparatus 20 operates to thermally transfer the photosensitive resin layer 28 (described later) of the elongated photosensitive web 22 to the glass substrate 24 in the process of manufacturing a liquid crystal or organic EL color filter.

FIG. 2 shows the photosensitive connection board 22 used in the manufacturing apparatus 20 in cross section. The photosensitive connection board 22 includes a laminated assembly of a flexible base film (support) 26 , a photosensitive resin layer (photosensitive material layer) 28 provided on the flexible base film 26 ; and a protective film 30 provided on the photosensitive resin layer 28 .

As shown in Figure 1, the manufacturing device 20 includes: a roll-out mechanism for accommodating a photosensitive web roll 22a in the form of a rolled photosensitive web 22, and rolling out the photosensitive web 22 from the photosensitive web roll 22a; A mechanism 36 for forming a partial cut area (processing area) 34 at a laterally separable boundary position in the protective film 30 of the photosensitive web 22 unwound from the photosensitive web roll 22a; and a label bonding mechanism 40 for using Adhesive labels 38 (see FIG. 3 ) each having a non-adhesive area 38 a are bonded to the protective film 30 .

This manufacturing device 20 also has: a storage (reservoir) mechanism 42, which is positioned at the downstream of the label bonding mechanism 40, for changing the feed mode of the photosensitive connection plate 22 from an intermittent feed mode to a continuous feed mode; a peeling mechanism 44 for Peel off the protective film 30 of predetermined length from photosensitive connecting plate 22; Substrate feeding mechanism 45, it is used to feed the glass substrate 24 that is heated to predetermined temperature to bonding position; The exposed photosensitive resin layer 28 of the protective film 30 is bonded to the glass substrate 24 .

The detection mechanism 47 is located upstream of the bonding position in the bonding mechanism 46 and close to the bonding mechanism 46 , and is used for directly detecting the partially cut region 34 at the boundary position of the photosensitive connecting plate 22 . The inter-substrate connecting plate cutting mechanism 48 is located downstream of the bonding mechanism 46 and is used for cutting the photosensitive connecting plate 22 between adjacent glass substrates 24 . A web cutting mechanism 48a is provided upstream of the inter-substrate web cutting mechanism 48, which is used when the manufacturing apparatus 20 starts and ends operations.

The coupling base 49 is located downstream of the unwinding mechanism 32 and close to the unwinding mechanism 32 , and is used for coupling the end of the substantially used up photosensitive web 22 with the front end of the newly used photosensitive web 22 . Downstream of the bonding base 49 is followed a film end position detector 51 for controlling the lateral deviation of the photoweb 22 due to winding irregularities of the photoweb roll 22a. The position of the film end of the photosensitive web 22 is adjusted by the laterally moving unwinding mechanism 32 . However, the film end of the photosensitive web 22 can be adjusted by a position adjustment mechanism combined with a roller. The unwinding mechanism 32 may include a multi-axis mechanism composed of two or three unwinding shafts for supporting the photosensitive web roll 22 a and feeding out the photosensitive web 22 .

The processing mechanism 36 is provided downstream of the respective roller pairs 50 for calculating the diameter of the photoweb roll 22 a accumulated in the unwinding mechanism 32 . The processing mechanism 36 has a single circular blade 52 that travels laterally across the photosensitive web 22 to form a partially cut region 34 in the photosensitive web 22 at a given location thereon.

As shown in FIG. 2 , the part of the cutting area 34 needs to be formed in the protective film 30 and at least pass through the protective film 30 . Actually, in order to reliably cut the protective film 30 , the circular blade 52 is set to a cutting depth sufficient to cut into the photosensitive resin layer 28 or the base film 26 . The circular blade 52 may be fixed, non-rotating, and moved laterally across the photosensitive web 22 to form the partial cutting region 34; or may rotate without slip on the photosensitive web 22 and move laterally across the photosensitive web 22. The plates 22 are joined to form a partial cutting area 34 . This circular blade 52 may for example be replaced by a laser beam or ultrasonic cutter, blade or advancing blade (Thompson blade).

The processing mechanism 36 may include two processing mechanisms disposed with a predetermined gap along the direction indicated by the arrow A in which the photosensitive web 22 is fed, for simultaneously forming two partially cut regions 34 with the remaining region 30b interposed therebetween.

Two closely spaced partially cut regions 34 formed in the protective film 30 serve to provide a separation gap between two adjacent glass substrates 24 . These partially cut regions 34 are formed in the protective film 30 at positions spaced inwardly from the respective edges of the glass substrate 24 by 10 mm, for example. The part of this protective film 30 is between the partial cutting regions 34 and is exposed between the glass substrates 24. , the protective film 30 is used as a mask.

The label bonding mechanism 40 supplies an adhesive label 38 for interconnecting the front peel area 30aa and the rear peel area 30ab to leave the remaining area 30b of the protective film 30 between the glass substrates 24 . As shown in FIG. 2, a front peeling region 30aa to be peeled initially and a rear peeling region 30ab to be peeled later are positioned on respective both sides of the remaining region 30b.

As shown in FIG. 3 , each adhesive label 38 is in the shape of a rectangular strip, and is made of the same material as the protective film 30 . Each adhesive label 38 has: a non-adhesive non-adhesive (or slightly adhesive) area 38a located at the center; On the longitudinally opposite ends of the side (adhesive side), that is, on the longitudinally opposite ends of the adhesive label 38, a first adhesive region 38b and a second adhesive region 38c are bonded to the front peeling area 30aa and the rear peeling area 30ab, respectively.

As shown in FIG. 1, the label bonding mechanism 40 has suction cups 54a to 54e for bonding up to five adhesive labels 38 with a predetermined gap. The support base 56 vertically movable for holding the photosensitive connection board 22 from below is provided at a position where the adhesive label 38 is attached to the photosensitive connection board 22 by the suction cups 54a to 54e.

The storage mechanism 42 bridges the speed difference between the intermittent feed mode in which the photosensitive web 22 is fed upstream of the storage mechanism 42 and the continuous feed mode in which the photosensitive web 22 is fed downstream of the storage mechanism 42 . The storage mechanism 42 has a jumping roller unit 61 including two distance rollers 60 that are rotatable and swingable for preventing changes in tension. Depending on the desired storage capacity of the web, the skip roller unit 61 may comprise only one roller or three or more rollers.

Disposed downstream of the storage mechanism 42 is a peeling mechanism 44 having a suction drum 62 for resisting changes in tension to which the supplied photosensitive web 22 is subjected, thereby stabilizing the tension of the photosensitive web 22 when it is subsequently laminated. This peeling mechanism 44 also has a peeling roller 63 provided close to the suction drum 62 . The protective film 30 is peeled off from the photosensitive connecting plate 22 at a sharp peeling angle, and the protective film 30 is wound by the protective film tightening unit 64 except for the remaining area 30b.

A tension control mechanism 66 for transmitting tension to the photosensitive web 22 is provided downstream of the peeling mechanism 44 . The tension control mechanism 66 has a cylinder 68 actuatable to angularly displace a tension jumper 70 to adjust the photosensitive web 22 in rolling contact with the tension jumper 70 . The tension control mechanism 66 can only be used when necessary and can be omitted.

The detection mechanism 47 has a photoelectric sensor 72, such as a laser sensor, a photosensitive device or the like, for direct detection of photosensitive connections due to wedge-shaped grooves in the partly cut area 34, steps produced by the protective film 30 of different thicknesses, or a combination thereof. Plate 22 changes. The detection signal from the photosensor 72 is used as a boundary position signal representing a boundary position in the protective film 30 . The photoelectric sensor 72 is provided in a relationship facing the pad roller 73 . Alternatively, instead of the photoelectric sensor 72, a non-contact type displacement meter or an image inspection device such as a CCD camera or the like may be used.

The position data of the partial cutting area 34 detected by the detection mechanism 47 can be statistically processed and converted into graphic data in real time. When the position data detected by the detection mechanism 47 shows excessive changes or deviations, the manufacturing device 20 will issue an alarm.

For generating boundary position signals, the manufacturing device 20 can use different systems. According to this different system, the partially cut area 34 is not detected directly, but the markings are attached to the photosensitive web 22 . For example, holes may be recessed in the photosensitive web 22 near the partially cut region 34 near the processing mechanism 36; or the photosensitive web 22 may be cut by a laser beam or water jet, or may be marked by an inkjet printer or printer. Marks on the photosensitive web 22 are detected, and the detection signal is used as a boundary position signal.

This substrate feeding mechanism 45 has: a plurality of substrate heating units (for example, heaters) 74 provided to sandwich and heat the glass substrate 24; and a feeder 76 for feeding in the direction indicated by arrow C Glass substrate 24. The temperature of the glass substrate 24 in the substrate heater unit 74 is constantly monitored. When the temperature of the monitored glass substrate 24 is abnormal, the feeder 76 is inactivated, and an alarm is issued, and the abnormal information is sent to reject and discharge the glass substrate 24 in the follow-up process, and is also used for quality control and production management. The feeder 76 has an air floating plate (not shown) for floating and feeding the glass substrate 24 in the direction indicated by the arrow C. As shown in FIG. Alternatively, the feeder 76 may comprise a roller conveyor for feeding the glass substrate 24 .

Depending on the contact process (eg using a thermocouple) or non-contact process, the temperature of the glass substrate 24 should preferably be measured in the substrate heating unit 74, or just before the bonding location.

A substrate storage rack 71 for storing a plurality of glass substrates 24 is provided upstream of the substrate heating unit 74 . The suction cup 79 on the hand 75 a of the robot 75 sucks the glass substrates 24 stored in the substrate storage rack 71 one by one, takes them out from the substrate storage rack 71 , and inserts them into the substrate heating unit 74 .

Stopper 77 and position sensor 78 are positioned at the downstream of substrate heating unit 74, and stopper 77 is used for being close to the front end of glass substrate 24 and keeps glass substrate 24, and position sensor 78 is used for detecting the position of the front end of glass substrate 24 . On its way to the bonding position, the position sensor 78 detects the position of the front end of the glass substrate 24 . After the position sensor 78 has detected the position of the front end of the glass substrate 24 , the glass substrate 24 is fed a predetermined distance and positioned between the rubber rollers 80 a , 80 b of the bonding mechanism 46 . Preferably, a plurality of position sensors 78 are arranged at predetermined intervals along the feeding path for monitoring the timing at which the glass substrate 24 reaches the respective positions of the position sensors 78, thereby checking the Swipe or similar delay. In FIG. 1, the glass substrate 24 is heated by the substrate heating unit while the glass substrate 24 is being fed. However, the glass substrate 24 can be heated in a batch furnace and fed by a robot.

The bonding mechanism 46 has a pair of vertically spaced laminated rubber rollers 80a, 80b capable of being heated to a predetermined temperature. The bonding mechanism 46 also has a pair of backup rollers 82a, 82b held in rolling contact with the rubber rollers 80a, 80b, respectively. The backup roller 82b is pressed against the rubber roller 80b by a roller clamp unit 83.

As shown in FIG. 4 , the roller clamp unit 83 has a drive motor (actuator) 93 whose drive shaft is coupled to a speed reducer that is coaxially connected to a drive shaft 93b of a ball screw 94. 93a. The nut 95 is screwed onto the ball screw 94 and mounted to the slide base 96 . Conical cams 97a, 97b are fixedly mounted on respective opposite ends of the slide base 96 in the transverse direction of the photosensitive connection plate 22 indicated by arrow B. As shown in FIG. The tapered cams 97a, 97b gradually become higher in the direction indicated by the arrow B1. The rollers 98a, 98b are placed on the respective conical cams 97a, 97b and are held at the respective lower ends of the pressing cylinders 84a, 84b.

As shown in FIG. 1 , a contact preventing roller 86 is movably disposed near the rubber roller 80 a for preventing the photosensitive web 22 from contacting the rubber roller 80 a. The preheating unit 87 is disposed upstream of the bonding mechanism 46 and close to the bonding mechanism 46 for preheating the photosensitive web 22 to a predetermined temperature. The pre-heating unit 87 includes an infrared heating rod or heat application device.

Along the feed path 88 extending in the direction indicated by the arrow C, the glass substrate 24 is fed from the bonding mechanism 46 via the inter-substrate web cutting mechanism 48 . The feed path 88 includes a roller array including a film feed roller 90 and a substrate feed roller 92 with the web cutting mechanism 48a interposed therebetween. The distance between the rubber rollers 80a, 80b and the substrate feed roller 92 is equal to or less than the length of one glass substrate 24.

In the manufacturing device 20 , the unwinding mechanism 32 , the processing mechanism 36 , the label bonding mechanism 40 , the storage mechanism 42 , the peeling mechanism 44 , the tension control mechanism 66 and the detection mechanism 47 are arranged above the bonding mechanism 46 . In the manufacturing device 20, the unwinding mechanism 32, the processing mechanism 36, the label bonding mechanism 40, the storage mechanism 42, the peeling mechanism 44, the tension control mechanism 66 and the detection mechanism 47 can be arranged under the bonding mechanism 46, so as to: The web 22 may be conveyed upside down so that the photosensitive resin layer 28 is bonded to the lower surface of the glass substrate 24 . Alternatively, all mechanisms of the manufacturing device 20 may be arranged linearly.

As shown in FIG. 1 , the entire manufacturing apparatus 20 is controlled by a lamination process controller 100 . The manufacturing device 20 also has: a lamination controller 102 ; a substrate heating controller 104 , etc., for controlling different functional parts of the manufacturing device 20 . These controllers are interconnected by an in-process network. The lamination process controller 100 is connected to the network of the factory to which the manufacturing device 20 belongs, and executes production information processing based on instruction information (condition device and production information) from the factory CPU (not shown), such as production management and mechanism operation manage.

The substrate heating controller 104 controls the substrate heating unit 74 to receive the glass substrate 24 from an upstream process and heats the received glass substrate 24 to a desired temperature, and controls the feeder 76 to feed the heated glass substrate 24 feeds to the bonding mechanism 46; and also controls the processing of information about the glass substrate 24.

The stack controller 102 functions as a process manager for controlling the functional components of the manufacturing apparatus 20 . The lamination controller 102 serves as a control mechanism for, for example, controlling the substrate feeding mechanism 45 based on the position information of the partial cut region 34 of the photosensitive web 22 detected by the detection mechanism 47 .

The installation space of the manufacturing apparatus 20 is divided into a first clean room 112 a and a second clean room 112 b by a partition wall 110 . The first clean room 112 a accommodates the unwinding mechanism 32 , the handling mechanism 36 , the label bonding mechanism 40 , the storage mechanism 42 , the stripping mechanism 44 and the tension control mechanism 66 . The detection mechanism 47 and other components behind the detection mechanism 47 are accommodated in the second clean room 112b. The first clean room 112 a and the second clean room 112 b are connected to each other by a communication area 114 .

As shown in FIG. 5, the communication area 114 has a dust remover 115 provided in the first clean room 112a and an air sealer 116 provided in the second clean room 112b.

The dust remover 115 has: a pair of suction nozzles 117a provided in a relationship facing the opposite surface of the photosensitive web 22; and a pair of nozzles 118 respectively provided in the suction nozzles 117a. The nozzle 118 sprays air to the photosensitive connection board 22 to remove dust particles from the photosensitive connection board 22 ; and the suction nozzle 117 a sucks the sprayed air and the removed dust particles. Preferably, the air from the nozzle 118 may be electrically neutral (or antistatic) air.

The air sealer 116 has a pair of suction nozzles 117b provided in a relationship facing opposite surfaces of the photosensitive connection board 22 . The suction nozzle 117b draws air to seal through the area 114 . The positions of the precipitator 115 and the gas sealer 116 may be interchanged; or a plurality of dust removers 115 and a plurality of gas sealers 116 may be combined with each other. Only the suction nozzle 117a, but not the nozzle 118, may be disposed in facing relationship to the side of the photosensitive connection board 22 in which the photosensitive resin layer 28 is exposed.

In the manufacturing apparatus 20 , the partition wall 110 prevents the heated air from the bonding mechanism 46 from thermally affecting the photosensitive web 22 , that is, wrinkling, deforming, thermally shrinking or stretching the photosensitive web 22 . The partition wall 110 separates the upper area of the manufacturing device 20 (ie the first clean room 112a prone to dust particles) from the lower area of the manufacturing device 20 (ie the second clean room 112b ), thereby keeping the coupling mechanism 46 particularly clean. Desirably, the pressure in the second clean chamber 112b is maintained higher than the pressure in the first clean chamber 112a to prevent dust particles from flowing from the first clean chamber 112a into the second clean chamber 112b.

An air supply device (not shown) for supplying clean air flowing down is provided at an upper portion of the second clean room 112b.

The operation of the manufacturing apparatus 20 for performing the manufacturing method according to the present invention will be described below.

Initially, in order to position the front end of the photo-web, the photo-web 22 is unwound from the photo-web roll 22 a housed in the unwinding mechanism 32 . The photosensitive web 22 is conveyed to the film feed roll 90 via the processing mechanism 36 , label bonding mechanism 40 , storage mechanism 42 , peeling mechanism 44 and bonding mechanism 46 . The front end of the photosensitive web 22 is pressed by the film feed roller 90 .

When the partially cut area 34 is detected by the photoelectric sensor 72 , the film feed roller 90 rotates based on the detection signal from the photoelectric sensor 72 . With the film feed roller 22, the photosensitive web 22 is now fed a predetermined distance to the bonding position. The partially cut region 34 is positioned corresponding to the bonding location. Alternatively, the partially cut region 34 may be detected at a position downstream of the bonding position, and the photosensitive web 22 may be stopped at a predetermined position.

As shown in FIG. 6, the contact preventing roller 86 is lowered to prevent the photosensitive web 22 from contacting the rubber roller 80a. The glass substrate 24 waits just before the bonding position. The photosensitive connection plate 22 is now in the initial state of the manufacturing device 20 .

The operation of manufacturing the functional parts of the device 20 in the lamination mode will be described below.

As shown in Figure 1, in the processing mechanism 36, the circular blade 52 moves laterally through the photosensitive connecting plate 22 to cut into the protective film 30, the photosensitive resin layer 28 and the base film 26, thereby forming a part of the cutting area 34 (see Figure 2 ). Then, along the direction indicated by arrow A (see FIG. 1 ), the photosensitive connection plate 22 is fed again by a distance corresponding to the size of the remaining area 30b of the protective film 30, and then stops, so that the circular blade 52 forms another part therein Cutting area 34. As shown in FIG. 2, the front peeling area 30aa and the rear peeling area 30ab are now disposed in the photosensitive web 22 with the remaining area 30b interposed therebetween.

Then, the photosensitive web 22 is fed to the label bonding mechanism 40 to place the predetermined bonding area of the protective film 30 on the support base 56 . In the label bonding mechanism 40, a predetermined number of adhesive labels 38 are attracted by suction and held by the suction cups 54b to 54e, and are firmly bonded to the front peeling area of the holding film 30 across the remaining area 30b thereof. 33aa and post-stripping region 30ab (see Figure 3).

The photosensitive web 22 to which, for example, 5 adhesive labels 38 are bonded is isolated by the storage mechanism 42 from tension variations to which the supplied photosensitive web 22 is subjected, and is then continuously fed to the peeling mechanism 44 . As shown in FIG. 7, in the peeling mechanism 44, the base film 26 of the photosensitive web 22 is attracted to the suction drum 62, and the protective film 30 is peeled off from the photosensitive web 22, leaving a remaining area 30b. The protective film 30 is peeled off at a sharp peeling angle, and wound by the protective film take-up unit 64 (see FIG. 1 ). Preferably, electrically neutral air can be blown on the peeled-off portion.

At this time, since the photosensitive web 22 is firmly held by the suction drum 62 , the shock generated when the protective film 30 is peeled off from the photosensitive web 22 is not transmitted to the photosensitive web 22 downstream of the suction drum 62 . Therefore, such shock is not transmitted to the bonding mechanism 46, and thus, the laminated portion of the glass substrate 24 is effectively prevented from developing into a stripe-shaped defect region.

After the peeling mechanism 44 has peeled the protective film 30 from the base film 26, leaving the remaining area 30b, the tension control mechanism 66 regulates the tension of the photosensitive connection board paper 22; Partially cut area 34 .

Based on the detection signal of the partial cutting area 34 , the film feed roller 90 is rotated to feed the photosensitive web 22 to the bonding mechanism 46 by a predetermined length. At this time, the contact prevention roller 86 waits above the photosensitive web 22 , and the rubber roller 80 b is disposed under the photosensitive web 22 .

As shown in FIG. 8 , the preheated first glass substrate 24 is fed to the bonding position by a substrate feeding mechanism 45 . The glass substrate 24 is temporarily positioned between the rubber rollers 80a, 80b to align with the bonded photosensitive resin layer 28 of the photosensitive web 22.

Then, as shown in FIG. 4, the ball screw 94 is rotated in a specific direction by the speed reducer 93a coupled to the drive motor 93, and together with the nut 95 screwed on the ball screw 94, moves and slides in the direction indicated by the arrow B2. Base 96. Thus, the tapered cams 97a, 97b raise their cam surfaces in contact with the raised rollers 98a, 98b, displacing the rollers 98a, 98b upwardly. The pressing cylinders 84a, 84b are raised, and the pad roller 82b and the rubber roller 80b are raised to sandwich the glass substrate 24 between the rubbers 80a, 80b at a predetermined pressing pressure. At this time, the pressing pressure is regulated by the air pressure supplied to the pressing cylinders 84a, 84b. The rubber roller 80 a is rotated to transfer, ie, laminate, the photosensitive resin layer 28 melted by heat to the glass substrate 24 .

The photosensitive resin layer 28 is laminated on the glass substrate 24 under the following conditions: the photosensitive resin layer 28 is fed at a speed ranging from 1.0 m/min. to 10.0 m/min; A temperature of 150° C., and a hardness ranging from 40 to 90; and applying a pressure ranging from 50 N/cm to 400 N/cm (linear pressure).

As shown in FIG. 9 , when the front end of the glass substrate 24 reaches a position close to the film feed roller 90 , the film feed roller 90 moves away from the glass substrate 24 . When the front end of the photosensitive web 22 protruding forward from the glass substrate 24 in the direction indicated by the arrow C reaches a predetermined position relative to the web cutting mechanism 48a, the web cutting mechanism 48a is activated to cut off the front end of the photosensitive web 22. . Except for the timing of cutting the front end of the photosensitive web 22 , the timing of operation termination and the timing of cutting the photosensitive web 22 in case of failure, the web cutting mechanism 48 a returns to its standby position. When the manufacturing device 20 is working normally, the web cutting mechanism 48a will not be used.

As shown in FIG. 10, when the photosensitive web 22 has been laminated on the glass substrate 24 by the rubber rollers 80a, 80b up to its trailing end, the rubber rollers 80a, 80b stop rotating, and are sandwiched by the substrate feed rollers 92 with the laminated film. The glass substrate 24 of the photosensitive connection board 22 (also referred to as "bonding substrate 24a").

The rubber roller 80b retracts from the rubber roller 80a, releasing the bonded substrate 24a. Specifically, as shown in FIG. 4 , the speed reducer 93 a coupled to the driving motor 93 is reversed, causing the ball screw 94 and the nut 95 to move in the direction indicated by the arrow B1 to slide the bottom 96 . Accordingly, the tapered cams 97a, 97b lower their cam surfaces contacting the rollers 98a, 98b, displacing the pressing cylinders 84a, 84b downward. The backup roller 82b and rubber roller 80b are lowered, releasing the bonded substrate 24a.

The substrate feed roller 92 then starts to rotate to feed the bonded substrate 24a in the direction indicated by arrow C by a predetermined distance. The position 22b of the photosensitive web 22 to be fed between two adjacent glass substrates 24 is now displaced to a position under the rubber roller 80a. The next glass substrate 24 is fed forward by the substrate feed mechanism 45 to the bonding position. When the front end of the next glass substrate 24 is positioned between the rubber rollers 80a, 80b, the rubber roller 80b is lifted, sandwiching the next glass substrate 24 and photosensitive web 22 between the rubber rollers 80a, 80b. At the same time, the substrate feed rollers 92 sandwich the bonded substrate 24a. The rubber rollers 80a, 80b and the substrate feed roller 92 are rotated to start laminating the photosensitive web 22 on the glass substrate 24, and feed the bonded substrate 24a in the direction indicated by arrow C (see FIG. 11).

At this time, as shown in FIG. 12, the opposite ends of the bonded substrate 24a cover the respective remaining regions 30b.

As shown in FIG. 13, when the rear end of the first bonded substrate 24a reaches the substrate feed roller 92, the upper one of the substrate feed rollers 92 is lifted to release the first substrate 24a, and the substrate feed roller 92 The lower one and the other rollers of the feed path 88 are continuously rotated to feed the bonded substrate 24a. When the rear end of the next, second bonded substrate 24a reaches a position near the rubber rollers 80a, 80b, the rubber rollers 80a, 80b and the substrate feed roller 92 stop rotating. The upper one of the substrate feed rollers 92 is lowered to clamp the second bonded substrate 24a, and the rubber roller 80b is lowered to release the second bonded substrate 24a. Then, the substrate feeding roller 92 is rotated to feed the second bonded substrate 24a. The position 22b of the photosensitive web 22 to be fed between two adjacent glass substrates 24 is now displaced to a position under the rubber roller 80a;

As shown in FIG. 14 , while moving in the direction indicated by arrow C at the same speed as the bonded substrates 24a, when the position between two adjacent bonded substrates 24a reaches the position corresponding to the connecting plate cutting mechanism 48 between the substrates position, the inter-substrate connection plate cutting mechanism 48 separates the photosensitive connection plate 22 between the bonded substrates 24a. Subsequently, the inter-substrate web cutting mechanism 48 returns to the stand-by position, and the base film 26 and the remaining region 30b are peeled off from the front bonding substrate 24a, thereby manufacturing the photosensitive laminated body 106.

As shown in FIG. 15, when the lamination process is temporarily stopped, the film feed roller 90 and the rubber roller 80b enter the unclamped position, and the contact preventing roller 86 is lowered to prevent the photosensitive web 22 from contacting the rubber roller 80a.

When the manufacturing apparatus 20 is to be closed, the substrate feed roller 92 is rotated to feed the bonded substrate 24 a in the direction indicated by arrow C, and the film feed roller 90 sandwiches the photosensitive web 22 . The web cutting mechanism 48 a travels laterally across the photosensitive web 22 , severing the photosensitive web 22 as the rotating film feed roller 90 is clamping the photosensitive web 22 .

Next, as shown in FIG. 16, the photosensitive web 22 passes between the rubber rollers 80a, 80b, is sandwiched by the film feed roller 90, and is supported by the lowered contact preventing roller 86 away from the rubber roller 80a. The web cutting mechanism 48a has been placed in its standby position.

When the inter-substrate web cutting mechanism 48 and the web cutting mechanism 48a cut the photosensitive web 22, they move in the direction indicated by the arrow C in synchronization with the photosensitive web 22. However, the inter-substrate web cutting mechanism 48 and web cutting mechanism 48a can only move laterally past the photosensitive web 22 to sever the photosensitive web 22 . The photosensitive web 22 can be cut by a Thompson blade while the web is held stationary, or can be severed by a rotating blade while the web is in motion.

As shown in FIG. 17 , when the manufacturing apparatus 20 is operated in its initial state, the contact preventing roller 86 is disposed at the lower position, and the rubber roller 80b is spaced apart from the rubber roller 80a. Then, the film feed roller 90 is rotated to discharge the photosensitive web 22 into a web processing container (not shown). At this time, the photosensitive web 22 is separated into specific lengths by the web cutting mechanism 48a.

When the detection mechanism 47 detects the partially cut region 34 of the photosensitive web 22, the photosensitive web 22 is fed by a predetermined length from the detection position. Specifically, when the contact prevention roller 86 is raised, the photosensitive web 22 is fed until the partially cut region 34 reaches the position where the photosensitive web 22 is to be laminated by the rubber rollers 80a, 80b. The front end of the photosensitive web 22 is now positioned in place.

In the first embodiment, the partially cut region 34 of the photosensitive connecting plate 22 is directly detected by the photoelectric sensor 72 above and close to the bonding mechanism 46 . The distance from the detection mechanism 47 to the position where the partially cut region 34 is stopped by the rubber rollers 80a, 80b needs to be smaller than the shortest length of the photosensitive web 22 to be laminated. Here, through feedback, the information of the detected partial cutting area 34 is used for the next layer of stacking.

The detection mechanism 47 carries out two measuring processes described below. According to the first measurement process, the rubber rollers 80a, 80b clamp the glass substrate 24; , 80b starts to rotate the distance of feeding the glass substrate 24, which is compared with the preset number of pulses generated when the partially cut area 34 will be detected by the detection mechanism 47, thereby measuring the displacement of the partially cut area 34. If the partially cut region 34 of the photosensitive web 22 is detected before reaching the predetermined number of pulses, the partially cut region 34 is judged to be displaced by the distance indicated by the difference in the number of pulses before the predetermined position on the glass substrate 24 . Conversely, if the partially cut region 34 of the photosensitive web 22 is detected after reaching the predetermined number of pulses, the partially cut region 34 is judged to be displaced behind the predetermined position on the glass substrate 24 .

According to the second measurement procedure, the number of pulses produced by an encoder combined with a drive motor (not shown) for driving the rubber rollers 80a, 80b is measured from the detection of a partial cutting area 34 to the detection of the next partial cutting area 34 , so as to measure the stacking length H of the photosensitive connecting plate 22 . The preset number of pulses corresponding to the lamination length under normal conditions of each photosensitive web 22 is compared with the actually measured number of pulses. If the actually measured number of pulses is greater than the preset number of pulses, the photosensitive transfer plate 22 is judged to be stretched by the distance indicated by the difference in the number of pulses due to heat or the like. If the actual measured pulse number is less than the preset pulse number, the photosensitive connecting plate 22 is judged to be shortened.

As shown in FIG. 18, if according to the first measurement process, the front end of the photosensitive resin layer 28 is displaced (advanced) by the same distance or substantially the same distance relative to the bonding range P1-P2 of the glass substrate 24, then the adjustment The relative positions of the glass substrate 24 and the partially cut region 34 of the photosensitive connecting plate 22 .

Specifically, if the partially cut region 34 detected by the photoelectric sensor 72 is detected to advance from a predetermined position, as shown in FIG. Sets the distance represented by the difference between distance and distance traveled. As a result, the partially cut region 34 is positionally adjusted and placed in a predetermined position between the rubber rollers 80a, 80b. Thereafter, under normal conveying control, the glass substrate 24 is conveyed between the rubber rollers 80a, 80b, and the photosensitive resin layer 28 is bonded to the glass substrate 24 at the normal position, that is, within the bonding range of the glass substrate 24. P1-P2.

As shown in FIG. 19, if the partially cut region 34 detected by the photosensor 72 is detected to be delayed from the bonding range P1-P2 of the glass substrate 24, the substrate feed roller 92 will unbond the laminated photosensitive connection plate 22. The section feeds the distance represented by the sum of the preset distance and the extended distance.

Instead of adjusting the distance by which the bonded substrate 24a is fed by the substrate feed roller 92, the substrate feeding mechanism 45 may be controlled to adjust the forward or retarded distance of the position where the glass substrate 24 is to be stopped.

According to the second measurement process, the distance between the partially cut regions 34 detected by the photosensor 72, the length H of the photosensitive resin layer 28 to be bonded to the glass substrate 24, is measured. If the length H is greater than the bonding range, the processing mechanism 36 changes the position of the partially cut regions 34 so that the distance between the partially cut regions 34, ie the length H, is reduced by the difference. If the length H is less than the bonding range, the processing mechanism 36 changes the position of the partially cut regions 34 so that the distance between the partially cut regions 34, ie the length H, increases by the difference. In this way, the bonding length of the photosensitive resin layer 28 is adjusted to a predetermined length.

By using the tension jumper 70 of the tension control mechanism 66 to adjust the tension of the photosensitive web 22 , the stretching amount of the photosensitive web 22 can also be changed.

Therefore, the partially cut region 34 of the photosensitive connecting plate 22 can be positioned with high precision relative to the bonding position, so that the photosensitive resin layer 28 of the photosensitive connecting plate 22 can be precisely bonded to the desired area of the glass substrate 24 . Therefore, the high-quality photosensitive laminated body 106 can be efficiently manufactured through simple processes and arrangements.

FIG. 20 schematically shows a manufacturing device 120 according to a second embodiment of the invention in side view. Those parts of the manufacturing device 120 according to the second embodiment that are identical to those of the manufacturing setup 20 according to the first embodiment are indicated by the same designations and will not be described in detail below.

As shown in FIG. 20, the manufacturing apparatus 120 includes: a detection mechanism 47a; a cooling mechanism 122 provided downstream of the inter-substrate web cutting mechanism 48; and a base peeling mechanism 124 provided downstream of the cooling mechanism 122. The detection mechanism 47a has photoelectric sensors 72a, 72b, which are spaced apart from each other by a predetermined distance L, and are arranged in facing relationship with the pad rollers 73a, 73b, respectively.

After the photosensitive web 22 is cut between the bonding substrate 24a and the following bonding substrate 24a by the inter-substrate web cutting mechanism 48, the cooling mechanism 122 supplies cooling air to the bonding substrate 24a to cool the bonding substrate. 24a. Specifically, the cooling mechanism 122 supplies cold air having a temperature of 10° C. at a speed ranging from 1.0 to 2.0 m/min. Alternatively, the cooling mechanism 122 can be omitted, and the bonded substrate 24a can be cooled in a photosensitive laminate storage rack 132 (described later) without using any dedicated cooling means.

The base peeling mechanism 124 is provided downstream of the cooling mechanism 122, and has a plurality of suction cups 126 for attracting the lower surface of the bonded substrate 24a. When the suction cup 126 attracts the bonded substrate 24a with suction, the base film 26 and the remaining area 30b are peeled off from the bonded substrate 24a by the robot 128 . An electrically neutral blower (not shown) for blowing ionized air to the 4 sides of the lamination area of the bonded substrate 24 a is provided upstream, downstream and beside the chuck 126 . The base film 26 and the remaining area 30b are peelable from the bonded substrate 24a, while the stage for supporting the bonded substrate 24a thereon is positioned vertically, obliquely or upside down for dust removal.

Downstream of the bottom peeling mechanism 124 is a photosensitive stack storage rack 132 for storing a plurality of photosensitive stacks 106 . When the bottom peeling mechanism 124 peels the base film 26 and the remaining area 30b from the bonded substrate 24a, the photosensitive laminated body 106 is produced, and the photosensitive laminate 106 is picked up by the suction cup 136 on the hand 134a of the robot 134 and taken out from the bottom peeling mechanism 124. , and placed in the photosensitive laminate storage rack 132.

Each of the substrate storage rack 71 and the photosensitive stack storage rack 132 has a dust removal fan unit (or duct unit) 137 on three sides thereof except the side where the glass substrate 24 or photosensitive laminate 106 is placed and taken out. The fan unit 137 blows clean and electrically neutral air into the substrate storage rack 71 and the photosensitive laminate storage rack 132 .

The lamination controller 102 , the substrate heating controller 104 and the substrate stripping controller 138 are connected to the lamination process controller 100 . This bottom peeling controller 138 controls the bottom peeling mechanism 124 to peel the base film 26 from the bonded substrate 24a supplied from the bonding mechanism 46, and also discharges the photosensitive laminate 106 to a downstream process. The bottom release controller 138 also handles information about the bonded substrate 24a and the photosensitive laminate 106 .

In the detection mechanism 47 a according to the second embodiment, the photosensor 72 a located upstream of the photosensor 72 b first detects the partially cut region 34 of the photosensitive connection plate 22 . Thereafter, the downstream photoelectric sensor 72b detects the partial cutting area 34 of the photosensitive connection plate 22. The distance L between the pad rollers 73a, 73b corresponds to the length of the photosensitive resin layer 28 bonded to the glass substrate 24 .

The photoresist can be accurately calculated from the difference between the moment when the upstream photosensor 72a detects the partially cut region 34 of the photosensitive web 22 and the moment when the downstream photosensor 72b detects the same partially cut region 34 of the photosensitive web 22. The actual fit length of layer 28. Based on the calculated actual bonding length of the photosensitive resin layer 28 , the feeding speed of the photosensitive web 22 is adjusted to bond the photosensitive resin layer 28 to the center of the glass substrate 24 .

Therefore, according to the second embodiment, the distance between the partial cutting regions 34 of the photosensitive connection plate 22, that is, the length H of the photosensitive resin layer 28 bonded to the glass substrate 24 is accurately detected to bond the photosensitive resin layer 28. to the center of the glass substrate 24 (see FIG. 21).

As shown in Figure 22, if the length H1 of the photosensitive resin layer 28 detected by the detection mechanism 47a is greater than the normal length H, the photosensitive resin layer 28 is attached to the center of the glass substrate 24, so that the opposite ends of the photosensitive resin layer 28 The parts are spaced the same distance outward from the ends of the fit length L.

As shown in Figure 23, if the length H2 of the photosensitive resin layer 28 detected by the detection mechanism 47a is less than the normal length H, the photosensitive resin layer 28 is attached to the center of the glass substrate 24, so that the opposite ends of the photosensitive resin layer 28 The parts are spaced the same distance inward from the end of the fit length L. In this case, the target displacement of the bonding position of the photosensitive resin layer 28 is approximately half of the displacement that would occur if the opposite ends of the photosensitive resin layer 28 were not spaced inwardly from the end of the bonding length L by the same distance.

In addition, according to the second embodiment, a partial cut area 34 is formed in the photosensitive connection sheet 22 unwound from the unwinding mechanism 32; is laminated on the glass substrate 24 to transfer the photosensitive resin layer 28; and then, the base film 26 and the remaining region 30b are peeled off by the bottom peeling mechanism 124, thereby manufacturing the photosensitive laminated body 106. This photosensitive laminated body 106 can be easily and automatically manufactured.

FIG. 24 schematically shows a manufacturing device 140 according to a third embodiment of the invention in side view. Those parts of the manufacturing device 140 according to the third embodiment that are identical to those of the manufacturing setup 20 according to the first embodiment are indicated by the same designations and will not be described in detail below.

The fabrication mechanism 140 includes an inter-substrate web cutting mechanism 48, which is not normally used, except to cut the photo-web 22 in the event of a failure, and to separate the photo-web 22 to drain the problematic area. This manufacturing apparatus 140 has a cooling mechanism 122 and an automatic bottom peeling mechanism 142 provided downstream of the web cutting mechanism 48a. The automatic bottom peeling mechanism 142 is used to continuously peel off the elongated bottom film 26 by which the glass substrates 24 spaced at given intervals are bonded together. The automatic bottom peeling mechanism 142 has: a pre-peeler 144 ; a peeling roller 146 having a relatively small diameter; a take-up roller 148 ; and an automatic bonding unit 150 .

As shown in FIGS. 25 and 26 , the pre-striper 144 has a pair of roller assemblies 152 , 154 and a stripper bar 156 . The roller assemblies 152, 154 are movable toward and away from each other in the direction in which the glass substrate 24 is fed. The roll assemblies 152, 154 have vertically movable upper rolls 152a, 154a and lower rolls 152b, 154b. The upper rollers 152a, 154a and the lower rollers 152b, 154b sandwich the glass substrate 24 as the upper rollers 152a, 154a are lowered. The peel bar 156 is vertically movable between adjacent glass substrates 24 . The upper rollers 152a, 154a are replaced by pressing rods or pressing pins.

The photosensitive web 22 is reheated by the peel roll 146 to a temperature ranging from 30° C. to 120° C., or at a location just before the peel roll 146 . When the photosensitive web 22 is thus reheated, when the base film 26 is peeled off, the color material layer is prevented from being peeled off therefrom, so that a high-quality lamination surface can be produced on the glass substrate 24 . The reheating may be performed by a peeling roller also serving as a heating roller, such as a roller heated by hot water therein. Alternatively, reheating can be performed by split rod heaters or IR heaters.

Downstream of the automatic bottom peel mechanism 142 is a measurement unit 158 that is used to measure the area of the photosensitive resin layer 28 that is actually bonded to the glass substrate 24 . The measurement unit 158 has a plurality of spaced cameras 160 each including a CCD or the like. As shown in FIG. 27 , the measurement unit 158 has, for example, four cameras 160 for capturing images of the four corners K1 to K4 where the photosensitive resin layer 28 is bonded to the glass substrate 24 . Alternatively, the measurement unit 158 may have at least two cameras for capturing images of each longitudinal and lateral side of the glass substrate 24, instead of images of the 4 corners K1 to K4.

The measuring unit 158 may include a color sensor or a laser sensor for detecting the end surface of the glass substrate 24 ; or may include an LED sensor, a photodiode sensor or a line sensor for detecting the end surface of the glass substrate 24 . To detect the straightness of each end face, at least two of these sensors should desirably be used to capture an image of each end face.

A surface inspection unit (not shown) may be used to detect surface defects of the photosensitive laminated body 106, such as surface irregularities caused by the photosensitive web 22 itself, laminated film density irregularities caused by manufacturing facilities, wrinkles, stripes, etc. patterns, dust particles and other foreign matter. When such a surface defect is detected, the manufacturing device 140 issues an alarm, discharges a defective product, and manages subsequent processes based on the detected surface defect.

According to the third embodiment, the bonded substrate 24 a of the laminated photosensitive connection board 22 is cooled by the cooling mechanism 122 and then transferred to the pre-peeler 144 . In the pre-peeler 144, the roller assembly 152, 154 clamps the tail and the front end of two adjacent glass substrates 24, and the roller assembly 152 moves in the direction indicated by the arrow C at the same speed as the glass substrate 24, Roller assembly 154 is decelerated in its travel in the direction indicated by arrow C. As shown in FIG.

As a result, the photosensitive web 22 between the glass substrates 24 can be bent between the roller assemblies 152,154 as shown in FIG. Then, the peeling bar 156 is lifted to push the photosensitive connection plate 22 upward, and the protruding film 30 is peeled off from the rear end and the front end of the two adjacent glass substrates 24 .

In the automatic bottom peeling mechanism 142, the take-up roll 148 is rotated to continuously wind the bottom film 26 from the bonded substrate 24a. After the photosensitive web 22 is cut off in the event of failure and separated to discharge defective parts, the photosensitive web 22 begins to be laminated with the front end of the base film 26 on the bonded substrate 24a and wound on a take-up roller 148. The rear ends of the upper base films 26 are automatically connected to each other by the automatic bonding unit 150 .

The glass substrate 24 from which the bottom film 26 has been peeled is placed in an inspection stand combined with the measurement unit 158 . In the inspection station, glass substrate 24 is held in place and four cameras 160 capture images of glass substrate 24 and photoresist layer 28 . This captured image is processed to determine the locations a to d of the fit.

In the inspection station, the glass substrate 24 can be fed without stopping, and the lateral ends of the glass substrate 24 can be detected by a camera or image scanning, and the longitudinal ends thereof can be detected by a timing sensor. The glass substrate 24 can then be based on camera or image scanning probe data and sensor measurements.

According to the third embodiment, after the photosensitive web 22 has been laminated on the glass substrate 24, the photosensitive web 22 between two adjacent bonded substrates 24a is not cut. More specifically, the base film 26 is continuously peeled off from the bonded substrate 24 a and wound around the rotating take-up roller 148 while the bonded substrate 24 a is being pressed by the peeling roller 146 . Also, the peeled base film 26 is easily handled.

According to the third embodiment, the same advantages as those of the second embodiment are obtained, for example, the photosensitive laminated body 106 can be manufactured automatically and efficiently. In addition, the structure of the manufacturing device 140 is simple.

While certain preferred embodiments of the present invention have been shown and described in detail, it should be understood that various changes and modifications may be made therein without departing from the scope of the appended claims.

Claims (15)

1. An apparatus for manufacturing a photosensitive laminate, comprising: A connecting plate roll-out mechanism (32) for rolling out an elongated photosensitive connecting plate (22), the elongated photosensitive connecting plate (22) comprising: a support (26); a photosensitive connecting plate arranged on the support (26) a material layer (28); and a protective film (30) disposed on the photosensitive material layer (28), the protective film (30) having a peeling area (30aa) and a remaining area (30b); a processing mechanism (36), which is used for, at the boundary position between the peeling area (30aa) and the remaining area (30b), the said connecting plate unwinding mechanism (32) has been rolled out In the protective film (30) of the elongated photosensitive connection plate (22), a laterally separable processing area (34) is formed; a peeling mechanism (44) for peeling said peeling region (44) from said elongated photosensitive web (22), leaving said remaining region (30b); a substrate feeding mechanism (45) for feeding the substrate (24) heated to a predetermined temperature to the bonding position; bonding means (46) for positioning said remaining region (30b) between said substrates (24) and exposing said photosensitive material layer (28) from said peeling region (30aa) regions bonded to said substrate (24) in said bonding sites for producing a bonded substrate (24a); A detection mechanism (47) arranged close to the joint position, which is used to directly detect the boundary position of the elongated photosensitive connection plate (22), or a position related to the boundary position arranged on the elongated photosensitive connection detection marks on the plate (22); and A control mechanism (102) for adjusting the relative position of the boundary position and the substrate (24) in the bonding position based on the boundary position information detected by the detection mechanism (47). 2. Apparatus according to claim 1 , wherein said detection means (47) is arranged upstream and close to said joint location. 3. The apparatus according to claim 1, further comprising: a storage mechanism (42) arranged between said processing mechanism (36) and said stripping mechanism (44) for changing said elongated photosensitive web (22) The speed or state being fed. 4. The apparatus according to any one of claims 1 to 3, further comprising: a tension control mechanism (66) arranged between said stripping mechanism (44) and said bonding mechanism (46), for applying tension to the elongated photosensitive connecting plate (22). 5. The apparatus according to any one of claims 1 to 3, further comprising: a cutting mechanism (48) arranged downstream of the bonding mechanism (46) for severing the stretch between the substrates (24). Long photosensitive connecting plate (22). 6. Apparatus according to any one of claims 1 to 3, further comprising: a support stripping mechanism (124) arranged downstream of said bonding mechanism (46), for stripping said support (26) from said bonding Substrate (24a). 7. The apparatus according to claim 1, wherein: said coupling mechanism (46) comprises: a pair of rubber rollers (80a, 80b) heated to a predetermined temperature; and a roller clamp unit (83) for moving one of said rubber rollers (80b) back and forth; The roller clamp unit (83) includes: a cylinder (84a) for applying clamping pressure to said one of said rubber rollers (80b); and A cam (97a) movable by an actuator (93) for moving said cylinder (84a) back and forth. 8. The apparatus according to claim 1, further comprising: a preheating unit (87) arranged upstream and close to the bonding mechanism (46) for extensifying the photosensitive The connection plate (22) is preheated to a predetermined temperature. 9. A method of manufacturing a photosensitive laminate, comprising the steps of: Roll out the elongated photosensitive connection plate (22), and the elongated photosensitive connection plate (22) includes: a support (26); a photosensitive material layer (28) arranged on the support (26); A protective film (30) on the photosensitive material layer (28), the protective film (30) having a peeling area (30aa) and a remaining area (30b); At the boundary position between the peeling area (30aa) and the remaining area (30b), a laterally adjustable separate treatment areas (34); peeling off said stripped region (30aa) from said elongated photosensitive web (22), leaving said remaining region (30b); Obtaining boundary position information by directly detecting the boundary position of the elongated photosensitive connection plate (22), or detecting a mark set on the elongated photosensitive connection plate (22) related to the boundary position; feeding the substrate (24) heated to a predetermined temperature to the bonding position; adjusting the relative position of the substrate (24) in the boundary position and the bonding position based on the obtained boundary position information; and for positioning the remaining region (30b) between the substrates (24), and bonding the exposed area of the photosensitive material layer (28) peeled off the peeling region (30aa) to the bonding position Said substrate (24) in is used for producing bonded substrate (24a); 10. The method of claim 9, wherein the boundary location information is obtained upstream of and close to the junction location. 11. The method of claim 9, further comprising the step of: intermittently feeding said elongated photosensitive web (22) through said processing mechanism (36); and Thereafter, in the stripping mechanism (44) and subsequently, the elongated photosensitive web (22) is continuously fed through the storage mechanism (42). 12. A method according to any one of claims 9 to 11, further comprising the step of: between said step of peeling said peeled-off region (30aa) and said step of bonding the exposed region of said layer of photosensitive material (28) , applying tension to the elongated photosensitive web (22). 13. A method according to any one of claims 9 to 11, further comprising the step of: After said step of bonding exposed areas of said photosensitive material layer (28), severing said elongated photosensitive web (22) between said substrates (24); and Thereafter, the support (26) is peeled off from the bonded substrate (24a) to produce a photosensitive laminated assembly (106). 14. A method according to any one of claims 9 to 11, further comprising the step of: after said step of bonding the exposed regions of said layer of photosensitive material (28), continuously or intermittently removing from said bonding substrate (24a) The support (26) is peeled off. 15. A method according to any one of claims 9 to 11, further comprising the step of heating said elongated photosensitive web (22) to Predetermined temperature.

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