CN101005264A - Intelligent fan rotating speed control method - Google Patents

Abstract

A fan speed control method is applicable to a computer device, so as to implement heat dissipation for an electronic component in the computer device, and the method comprises the following steps: measuring and generating load-temperature curve data of the electronic component within an operation load range of the electronic component. Generating speed-temperature curve data of the fan according to the load-temperature curve data. And controlling the speed of the fan according to the speed-temperature curve data of the fan.

Description

Intelligent fan speed control method

technical field

The invention relates to a fan speed control method, in particular to an intelligent fan speed control method suitable for a computer device.

Background technique

Generally speaking, electronic components such as a central processing unit (CPU), a motherboard, and a power supply disposed inside a computer device tend to generate high temperatures during use, and different electronic components usually have different load-temperature curves. Taking the three different types of CPUs shown in FIG. 1 as an example, the above three different CPUs have three different load-temperature curves of C1, C2, and C3 according to their different characteristics.

In order to prevent the performance from being too high due to high system temperature, it is known that a fan is usually installed inside the computer device to dissipate heat from the above-mentioned heat source. As shown in Figures 2, 3, and 4, most traditional fans can only maintain a fixed speed after activation (as shown in Figure 2). In addition, there are also fans with multi-stage speed design (as shown in Figures 3 and 4). The speed of the fan is mainly to adjust the speed of the fan according to the temperature. However, regardless of the design of fixed speed or multi-stage speed, it is known that the speed-temperature curve of the fan is a fixed parameter and cannot be adjusted arbitrarily.

Contents of the invention

The present invention provides a method for controlling fan speed, which is suitable for a computer device, so as to dissipate heat from an electronic component in the computer device. Component load-temperature curve data. The speed-temperature curve data of the aforementioned fan is correspondingly generated according to the load-temperature curve data. And, the speed of the fan is controlled according to the speed-temperature curve data of the aforementioned fan.

In a preferred embodiment, the aforementioned method further includes the following step: judging in an operating system of the aforementioned computer device whether there is load-temperature curve data of the aforementioned electronic components in the aforementioned computer device.

In a preferred embodiment, the aforementioned method further includes the following step: storing the rotational speed-temperature curve data of the aforementioned fan.

In a preferred embodiment, the aforementioned electronic component is a central processing unit (CPU) in the computer device.

In a preferred embodiment, the aforementioned electronic component is an integrated circuit (IC) in the computer device.

In a preferred implementation, the aforementioned electronic component is a motherboard in the computer device.

In a preferred embodiment, the aforementioned electronic component is a power supply in the computer device.

In a preferred embodiment, the aforementioned computer device includes a plurality of fans and a plurality of electronic components, and the aforementioned fans respectively correspond to the aforementioned electronic components.

In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, detailed implementations and accompanying drawings are described in detail below.

Description of drawings

FIG. 1 is a schematic diagram showing load-temperature curves of three different CPUs;

Fig. 2 is a schematic diagram showing a speed-temperature curve of a well-known fixed speed fan;

Figures 3 and 4 are schematic diagrams showing the rotational speed-temperature curves of well-known multi-stage rotational speed fans;

5 is a schematic diagram showing the intelligent fan speed control method of the present invention;

FIG. 6 is a schematic diagram of a load-temperature curve generated according to step 140 in FIG. 5;

FIG. 7 is a schematic diagram of a fan speed-temperature curve corresponding to the load-temperature curve in FIG. 6;

FIG. 8 is a schematic diagram showing a temperature-load curve of a specific electronic component having a temperature control circuit;

FIG. 9 is a schematic diagram of a fan speed-temperature curve corresponding to the load-temperature curve in FIG. 8; and

Fig. 10 is a schematic diagram showing another embodiment of the present invention.

Detailed ways

Please refer to FIG. 5 first, which shows a schematic diagram of the intelligent fan speed control method of the present invention. The above-mentioned intelligent fan speed control method is applicable to a computer device, so as to dissipate heat from specific electronic components in the computer device, such as a central processing unit (CPU), an integrated circuit (IC), a motherboard or a power supply, etc. A heat source is provided in the computer device.

As shown in step 110 in Figure 5, when the computer device is turned on, it first enters a basic input/output system (Basic Input Output System, BIOS), and the user can choose whether to activate the intelligent fan speed control mode in the BIOS, if selected "No" directly enters the operating system and does not control the fan speed (as shown in step 120'). On the contrary, when the user chooses to activate the intelligent fan speed control mode in the BIOS, he then enters the operating system (as shown in step 120); (such as CPU) load-temperature curve data (as shown in step 130), the above-mentioned load-temperature curve data is as shown in Figure 6, wherein L maximum and L minimum respectively represent the maximum and minimum loads in the operating load range of the aforementioned electronic components , Tmax and Tmin represent the highest and lowest temperatures measured within the operating load range.

In step 130, if it is found that there is already a load-temperature curve data of a certain electronic component, the procedure of step 160 is directly carried out, that is, a corresponding load-temperature curve data (as shown in FIG. 6 ) is generated according to the aforementioned load-temperature curve data. Fan speed-temperature curve data (as shown in Figure 7). In this embodiment, the slope change of the aforementioned fan speed-temperature curve roughly corresponds to the load-temperature curve shown in FIG. 6 , wherein Rmax and Rmin in FIG. 7 represent the maximum and minimum speeds of the fan, respectively. After performing step 160, the system will immediately store the aforementioned fan speed-temperature curve data (as shown in step 170), and control the speed of the fan according to the aforementioned fan speed-temperature curve data (as shown in step 180), so that the fan The rotating speed can be adjusted timely with the temperature change.

However, if no existing load-temperature curve data is found in step 130 , then perform measurement within an operating load range of the aforementioned electronic components, and generate a load-temperature curve data (as shown in step 140 ). The aforementioned load-temperature curve data is shown in Figure 6, where Lmax and Lmin respectively represent the maximum and minimum loads within the operating load range of the aforementioned electronic components, and Tmax and Tmin represent the measured loads within this operating load range. maximum and minimum temperatures.

After step 140 is completed, the system will select the fan address corresponding to the aforementioned electronic components (as shown in step 150), and then generate a corresponding fan speed-temperature curve according to the aforementioned load-temperature curve data (as shown in step 160 Show). The data of the fan speed-temperature curve in this embodiment is shown in FIG. 7 , and its slope change roughly corresponds to the load-temperature curve in FIG. 6 . However, the user can also adjust the curve in FIG. 7 appropriately according to actual needs, so as to flexibly change the rotation speed of the fan. Similarly, after performing step 160, the system will immediately store the aforementioned fan speed-temperature curve data (as shown in step 170), and control the fan speed according to the aforementioned fan speed-temperature curve data (as shown in step 180) , so that the fan speed can be adjusted in a timely manner as the temperature changes.

Then please refer to FIG. 8 , which is a schematic diagram showing a load-temperature curve of a specific electronic component with a temperature control circuit (Temperature Control Circuit, TCC). The specific electronic component is, for example, a central processing unit (CPU) inside a computer device, The aforementioned temperature-load curve data can be generated by measuring within an operating load range Lmax-Lmin of a specific electronic component using the method shown in FIG. 10 . In particular, when the temperature of this type of electronic component reaches a maximum limit temperature T1, the aforementioned temperature control circuit will automatically lower the operating frequency of the electronic component, thereby reducing the load and temperature of the specific electronic component in a timely manner (as shown by the arrow in Figure 8 shown in direction A). Although such electronic components with temperature control circuits have the function of automatically lowering the operating frequency to reduce the temperature, it also reduces the processing performance of the electronic components.

In view of this, in order to avoid the reduction of the operating frequency of the aforementioned electronic components and affect the processing performance, in this embodiment, it is mainly aimed at the aforementioned specific electronic components with temperature control circuits, according to their load-temperature curve data (as shown in Figure 8) Correspondingly generate a fan speed-temperature curve data (as shown in FIG. 9 ). Please refer to FIG. 10 , where the difference between FIG. 10 and FIG. 5 is that the aforementioned step 160 includes step 1601 and step 1602 . In this embodiment, step 1601 is mainly to set a critical temperature T2 (as shown in FIG. 9 ) according to the aforementioned maximum limit temperature T1 of the specific electronic component, wherein the critical temperature T2 is lower than the aforementioned maximum limit temperature T1. In particular, the fan speed-temperature curve in FIG. 9 can be divided into a first section S1 and a second section S2 by setting the critical temperature T2; then in step 1602, the critical temperature T2 is used as the boundary , generate the curve data of the aforementioned first segment S1 and the second segment S2 respectively. As shown in the figure, the temperature range covered by the first section S1 is from the minimum temperature Tmin to the critical temperature T2, and the temperature range covered by the second section S2 is from the critical temperature T2 to the maximum limit temperature T1.

In this embodiment, the slope change of the fan speed-temperature curve in the first section S1 roughly corresponds to the temperature-load curve shown in FIG. 8 . In particular, in order to prevent the temperature control circuit from triggering the temperature control circuit to reduce the operating frequency of the specific electronic component after the temperature of the specific electronic component reaches the maximum limit temperature T1, the fan speed in the second section S2 is rapidly raised to the maximum. The rotational speed R is the largest to achieve the purpose of rapid cooling, wherein the maximum slope of the second section S2 is greater than the maximum slope of the first section S1. Or, in a preferred embodiment, when the above-mentioned specific electronic components reach the critical temperature T2, the corresponding fan speed can be directly jumped to the maximum speed Rmax (as shown in the second section S2' in FIG. 9 ), so as to speed up the cooling of the specific electronic components to prevent their temperature from rising to the maximum limit temperature T1, thereby preventing the above-mentioned specific electronic components from affecting their performance due to automatic lowering of the operating frequency. However, the user can still flexibly adjust the fan speed-temperature curves of the first and second sections S1 and S2 according to various usage conditions.

Different from the traditional fan control design with fixed speed and multi-stage speed, the intelligent fan speed control method of the present invention can individually generate specific load-temperature curves for different electronic components, and generate corresponding The fan speed-temperature curve. Because the rotation speed of the fan in the present invention can be adjusted in time according to the load and temperature changes of the electronic components, the heat dissipation efficiency of the fan can be greatly improved and the electric energy can be saved at the same time.

The present invention can also establish different load-temperature curves and corresponding fan speed-temperature curves for multiple electronic components inside the computer device, wherein the above-mentioned electronic components are, for example, a central processing unit (CPU), an integrated circuit (IC), a motherboard and heat sources such as power supplies. In this way, the present invention can achieve the effect of improving heat dissipation efficiency and saving electric energy by individually controlling the fan speed corresponding to each electronic component.

While the invention has been described in conjunction with specific embodiments thereof, other changes and modifications and other uses will be apparent to those skilled in the art. Therefore, the protection scope of the present invention is not limited by the above description, but only limited by the claims of the present invention.

Claims (15)

1. An intelligent fan speed control method, suitable for a computer device, wherein the computer device has at least one fan and at least one electronic component, the fan is used to dissipate heat from the electronic component, the method includes the following step: measuring and generating load-temperature curve data of the electronic component within an operating load range of the electronic component; Generate correspondingly according to the load-temperature curve data-fan speed-temperature curve data; and The fan speed is controlled according to the fan speed-temperature curve data. 2. The intelligent fan speed control method according to claim 1, wherein the method further comprises the following steps: In an operating system of the computer device, it is judged whether there is load-temperature curve data of the electronic component. 3. The intelligent fan speed control method according to claim 1, wherein the method further comprises the following steps: Select the fan address that corresponds to that particular electronic assembly. 4. The intelligent fan speed control method according to claim 1, wherein the method further comprises the following steps: Store the fan speed-temperature curve data. 5. The intelligent fan speed control method as claimed in claim 1, wherein the method is to determine whether to activate in a basic input/output system of the computer device. 6 . The intelligent fan speed control method according to claim 1 , wherein the computer device has a plurality of fans and a plurality of electronic components, and each fan corresponds to each electronic component. 7. The intelligent fan speed control method according to claim 1, wherein the electronic component is an integrated circuit (IC). 8. The intelligent fan speed control method according to claim 1, wherein the electronic component is a motherboard. 9. The intelligent fan speed control method according to claim 1, wherein the electronic component is a power supply. 10. The intelligent fan speed control method according to claim 1, wherein the electronic component is a central processing unit (CPU). 11. The intelligent fan speed control method according to claim 1, wherein the step of generating the fan speed-temperature curve data further comprises the following steps: A critical temperature is set according to a maximum limit temperature of the electronic component, wherein the critical temperature is smaller than the maximum limit temperature. 12. The intelligent fan speed control method according to claim 11, further comprising the following steps: Taking the critical temperature as a boundary, dividing the fan speed-temperature curve into a first section and a second section, wherein the slope of the first section roughly corresponds to the load-temperature curve of the electronic component, And the maximum slope in the second section is greater than the maximum slope in the first section. 13. The intelligent fan speed control method according to claim 11, wherein the electronic component has a temperature control circuit, and when the electronic component reaches the maximum limit temperature, the temperature control circuit immediately lowers the processing an operating frequency of the device. 14 . The intelligent fan speed control method according to claim 11 , wherein when the electronic component reaches the critical temperature, the fan speed immediately jumps to a maximum speed. 15 . 15. The intelligent fan speed control method according to claim 12, wherein the speed of the fan rises to a maximum speed in the second section.

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