CN1008425B - Automic lead wire tinning of tape-packaged components - Google Patents
Automic lead wire tinning of tape-packaged componentsInfo
- Publication number
- CN1008425B CN1008425B CN 86100716 CN86100716A CN1008425B CN 1008425 B CN1008425 B CN 1008425B CN 86100716 CN86100716 CN 86100716 CN 86100716 A CN86100716 A CN 86100716A CN 1008425 B CN1008425 B CN 1008425B
- Authority
- CN
- China
- Prior art keywords
- lead
- ripple
- station
- soft soldering
- scolding tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000005476 soldering Methods 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000011135 tin Substances 0.000 description 17
- 229910052718 tin Inorganic materials 0.000 description 17
- 230000014509 gene expression Effects 0.000 description 3
- 229910001338 liquidmetal Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- NNIPDXPTJYIMKW-UHFFFAOYSA-N iron tin Chemical compound [Fe].[Sn] NNIPDXPTJYIMKW-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to automatic tinning equipment packed with soft tapes for a lead of an electronic element, which comprises a soft soldering wave station, a device and a heating and sucking device, wherein the soft soldering wave station can form a liquid soldering tin wave, the wave presents a convex shape on a cross section which is transverse to an axis line, and the cross section area of the wave is reduced with the distance from the axis; the device can transmit an electrical element along the axis through the wave, and the element is at least provided with a linear conductor which is perpendicular to the axis; the heating and sucking device is used for removing redundant soldering tin on the conductor.
Description
The present invention relates to the field of electric manufacturing, particularly relate to the conductor part of the electronic component of the form supply of soft tape spool directly soft with on zinc-plated equipment.
For electronic component the coml user, can with large batch of mode buy element commonly used for required in the future be eaily.In order to adapt to this large batch of buying pattern, supplier is contained in these elements between the rectangular belt sometimes and is wrapped on the spool, so that the buyer stores and takes conveniently.
Aspect commercial Application, element preferably extends through the hole on the circuit board conductive pattern with its lead and is placed in the position that requires on the circuit board.Conductor part is that the mode with wave soldering is connected on the conductive pattern.The conductor part of this expression element must have good solderability in use, how long all has this performance no matter this element has stored.
Yet each supplier adopts different surface treatment methods to the element lead, and plating gold, silver and tin are arranged as is known, and they respectively have characteristics such as different thickness, porousness and surface contamination.After wave soldering, need certain degree " repair welding " (" touch up ") usually, so that original not satisfied soft soldering connection status is improved extremely perfectly degree, and this is a kind of manual operations of costliness.Make us the influence that is difficult to expect buying also to have to the solderability of this section element lead between the storage life that uses.
A kind of method that addresses this problem is after element takes off on by spool, all leads is given the manual tin that scalds before being contained on the circuit board, but this also is a kind of operation of very expensive and spended time.
Equipment of the present invention is after element is bought by suppliers, do not need with element from soft promptly automatically will be zinc-plated with taking off with the electronic component conductor part that soft band forms stores.The present invention has been found the lead that can overcome element and has grown with time and the trend of the more difficult soft soldering that becomes, carry out zinc-plated no matter the conductor part of element with which kind of surface treatment mode, all can reach not expensive mode fast and automatically.The present invention's equipment to have opposite end by element extend to round about soft band " axial lead " element and extend to the element of " radial lead " of single paper tape to single direction for the single end with element all effectively same.Utilize the present invention, no matter the former supply in which way before this of element, use at any time and all can provide gratifying solderability.
Various advantage of the present invention and novelty are all listed in the claims, but, and in order to understand advantage of the present invention further, use object, should to reach corresponding explanation with reference to the accompanying drawings, comprising a most preferred embodiment.
In the accompanying drawings, identical label is represented corresponding part among each figure.Fig. 1 is a part that is packaged into a collection of element with axial lead, Fig. 2 is the calcspar according to a zinc-plated system of lead of the present invention, Fig. 3 is a part of plane graph of the present invention, Fig. 4 is the partial plan layout that the part of Fig. 3 is amplified, Fig. 5 is along the oriented partial section of 5-5 line display element among Fig. 4, Fig. 6 has gone into the partial section of positioning states among Fig. 4 along 6-6 line display element, Fig. 7 is with the similar view of Fig. 5 but takes out along the 7-7 line among Fig. 3 that Fig. 8 is a part that is packaged into the element band with radial lead.
Referring now to Fig. 1,, wherein shown to be packaged into the part of soft band forms for a volume electronic component that stores.Many here diodes 11 have axial lead 12 and 13 and are extended round about by the opposite end of element.Article one, the tenaculum 14 that has viscosity extends perpendicular to the free end of lead 12, and 15 of the tenaculums that another second has viscosity extend perpendicular to the free end of lead 13, and whole like this assembly has constituted the belt 16 that is called as element.Some " a " need be zinc-plated on the lead of every limit of element, because this position just will be by the position of soft soldering when element is used on the circuit board in the future.Liquid scolding tin cannot iron " b " part, because scald the heat of tin element is suffered damage, and same " c " part should not iron tin yet, and is impaired in order to avoid tenaculum 14 and 15 is heated.
Fig. 2 is presented in this equipment, and the belt that element formed is pulled out from presenting spool 20, and is got up by a take-up ribbon spool 21 rollings, and several treating stations are arranged in the path of passing through therebetween.The conductor part of element roughly keeps horizontal direction by this path the time.This can settle suitable guide rail to realize at certain intervals, certain orientation easily.Tenaculum extends beyond outside element at the both ends of the belt of element formation, debouches among the equipment with guide element.
The path of element warp is with label 30 expression, 38 and dry stations 39, cleaning station after it includes a precleaning station being arranged in order 31, liquid handling station 32,33, first soft soldering ripple station 34, the first distortion station, reverse twist station 35, the second soft soldering ripple station 36, a cooling and recovers 37, one at station.
Precleaning station 31 has spray nozzle device, provides the cleaning solutions employed to lead, and liquid handling station 32 has the device of sponge shape head, is used for liquid is coated in lead, particularly " a " part on the lead.In distortion station 33, the formed belt of element is twisted into the position at about 20 degree angles, makes lead 12 downward-sloping by element 11.The direction of this inclination remains unchanged in the whole first soft soldering ripple station 34, also will further specify this below.In the second distortion station 35, the element band is twisted round about, makes lead 13 downward-sloping by element 11.After by soft soldering ripple station 36, promptly by cooling stations 37, if necessary, this station also includes fan or air-supply arrangement to the formed belt of element, and the element band is resumed in this station to its original level.Cleaning station, back 38 has spray nozzle device, on the lead that a branch of current can have been sprayed to by soft soldering, element and tenaculum then give drying by the appropriate device of station in 39, and send to take-up ribbon spool 21, they can be received and kept when element need be used afterwards till.Except standing 34 and 36, the structure at other station all is known.
Now referring to Fig. 3,33 to 37 the gratifying embodiment of standing is made of a chamber or groove, and it has adiabatic wall, and the scolding tin of the molten state of remaining on is arranged in chamber or groove, and scolding tin is by the heater heating that does not illustrate in the drawings.Liquid scolding tin is by first liquid metal pump 41 pump to the first soft soldering ripple station 34 from chamber 40 constantly.Equally, liquid scolding tin is also by second liquid metal pump 42 pump to the second soft soldering ripple station 36 from chamber 40 constantly.Element band 16 is drawn in track 43 and 44 from left to right, and by standing 34, these tracks promptly stop after station 34.Then the element band is drawn in track 45 and 46 by standing 36, before track 45 and 46 starts from station 36.Track 43 and 44 make be with 16 by the distortion of normal horizontal direction to first direction, be about 20 degree, the position of track 44 and tenaculum 15 is higher than track 43 and tenaculum 14.On the other hand, 45 on track is higher than track 46, makes the tenaculum 14 in this track be higher than tenaculum 15, and element band 16 is twisted to second direction by horizontal level, is about 20 degree.Between track 43,44 and the track 45,46 is reverse twist station 35.Tenaculum 14 elder generations advance in track 45 back in track 43, and tenaculum 15 then advances in track 46 elder generation back in track 44, make element band 16 that 40 distortions of spending altogether take place.Utilize this arrangement, " a " part of lead 12 has been plated tin in station 34, and " a " part of lead 13 has then been plated tin in station 36.
It is 34 36 similar with the station to stand, so only introduce one of them in detail here.Standing 34 comprises a vertical lifting device or vertical tube 50, utilizes a suitable pump to keep a fusing soft solder that upwards flows in vertical tube, and this pump can obtain on the market.At the top of vertical tube, a side 51 is lower than opposite side 52, and has the crimping shown in number in the figure 53, scolding tin 38 ' can overflow thus.The element band 16 of element is moved through the top of vertical tube 50 to termination 56 by termination 55 shown in arrow among the figure 57.
Ripple former 60 is arranged in the vertical tube 50, and to change the shape of the scolding tin ripple of being gushed out by vertical tube, the waveform of near-end 55 is represented with 61 in Fig. 5, and the waveform of far-end 56 is with 62 expressions.Tenaculum 14 and 15 moves through vertical tube in track 43 and 44, the mode of its arrangement makes when each element has just entered the scolding tin ripple, the major part of its length, and " a " part is dipped into, but along with the advancing of element band, the immersion of lead 12 length partly shortens.Utilize this setup, scolding tin too much on the lead 12 just flows to low side, and formation can be referred to as a point of " icicle ", though this moment, this still was liquid but not solid-state.
If allow little icicle solidify, this element successfully inserts in the circuit board after then can having a strong impact on.Therefore, need use a device before little icicle solidifies removes it.The afterbody 56 that is in close proximity to vertical tube 50 is provided with a calandria 70 afterwards, will one opening 71 be arranged by part when next-door neighbour's element leaves vertical tube on it.Vacuum passage 72 couples together opening 71 and receiving flask 73, and utilizes suitable pump to make receiving flask keep below atmospheric pressure through pipeline 74.When each root lead 12 passed through opening 71, any little " icicle ", promptly too much liquid scolding tin all were drawn in the bottle 73 with pneumatic mode.
Flow for optimal liquid scolding tin, should revise edge 51, make it have little curve 75, and a calandria 70 that has recess 76 is set, liquid metal can slightly be flowed to the moving direction of element band.
It is 36 34 similar with the station to stand, and except the top inclined in opposite directions of its vertical tube, and guide rail guiding lead 13 rather than lead 12 be by outside the scolding tin, and all the other are all similar.Can not axial lead, then a tenaculum of needs and a soft soldering ripple station if obvious element only has radial lead.
Multifrequency nature of the present invention and advantage are all illustrated in front, and function of the present invention and detailed structure have been introduced, its features of novelty will be listed in the claim, yet, the introduction here is just illustrative, the arrangement of details wherein, especially shape, size and each several part can be changed in principle scope of the present invention, all should belong within the scope of the present invention.
Claims (6)
1, a kind of lead soft soldering equipment, it comprises a soft soldering ripple station (34,36) and a conveyer (43-46,20,21) that transmits electric component (11) along transfer path (57,30) of setting up liquid scolding tin ripple (61,62), this electric component has a lead (12,13) transverse to the extension of described path at least, it is characterized in that, be followed successively by with lower device along comprising on the path:
Present spool (20) for one, be used to install continuous electric component (11), these elements are carried by vertical with it strap means (14,15) in its lead (12,13) end;
A precleaning station (31), it has spray nozzle device and provides cleaning used solution for the predetermined position of described lead;
A device is used for the direction of strap means to alignment request, makes lead (12) downward-sloping from an end of element (11);
A liquid handling station (32), it has sponge shape head device, is used for liquid is coated in the predetermined position of described lead;
Described soft soldering ripple station (34), it can set up a liquid scolding tin ripple (61,62), this ripple is convex on the cross section transverse to described path (30), so that the predetermined position of described lead (12) is by described ripple (61,62), and then deviate from from this ripple, (57,30) reduce the area of section of this convex ripple (61,62) gradually along described path, and this soft soldering ripple station also comprises the device (70-74) of the unnecessary scolding tin (65) of removing described lead low side remnants;
A cooling stations (37);
Cleaning station (38) after one, it has spray nozzle device, is provided with cleaning solution in order to the predetermined position to described conductor;
A dry station (39);
A spool (21) of collecting described strap means (14,15).
2, by the lead soft soldering device of claim 1, it is characterized in that: have device (35,45,46) and be used for strap means (14,15) is aimed at required direction, make second lead (13) downward-sloping from second end of element (11); One second soft soldering ripple station (36), it can set up a liquid scolding tin ripple (61,62), this ripple is convex in the cross section transverse to described path (30), so that the predetermined position of second lead (13) is by described ripple (61,62), and then deviate from from this ripple, (57,30) reduce the area of section of this convex ripple (61,62) gradually along described path, and this soft soldering ripple station also comprises the device (70-74) of removing unnecessary scolding tin remaining on described second lead (13) low side.
3, according to the lead soft soldering device of claim 1 or 2, it is characterized in that: the device (70-74) of removing the last unnecessary scolding tin of described lead (12,13) comprises makes described unnecessary scolding tin remain liquid heater (70), and the aspirator (73,74) of taking out unnecessary scolding tin from described lead.
4, according to the lead soft soldering device of claim 3, it is characterized in that: the device that described convex ripple reduces gradually along described path area of section comprises the vertical tube (50) of a fusing soft solder (38 ') that can keep up mobile, and one is that (57,30) reduce the ripple former (60) that vertical tube (50) openings of sizes is equivalent to cover plate along described path.
5, according to the lead soft soldering device of claim 4, it is characterized in that: ripple former (60) tilts from a side to the opposite side of vertical tube (50), adapts with the gradient with element (11).
6, according to the lead soft soldering device of claim 5, it is characterized in that: ripple former (60) is triangular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 86100716 CN1008425B (en) | 1986-02-06 | 1986-02-06 | Automic lead wire tinning of tape-packaged components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 86100716 CN1008425B (en) | 1986-02-06 | 1986-02-06 | Automic lead wire tinning of tape-packaged components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN86100716A CN86100716A (en) | 1987-08-26 |
| CN1008425B true CN1008425B (en) | 1990-06-20 |
Family
ID=4801170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 86100716 Expired CN1008425B (en) | 1986-02-06 | 1986-02-06 | Automic lead wire tinning of tape-packaged components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1008425B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003147A (en) * | 2022-05-23 | 2022-09-02 | 新华三技术有限公司 | Solder paste adjusting device and SMT automatic processing system |
-
1986
- 1986-02-06 CN CN 86100716 patent/CN1008425B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CN86100716A (en) | 1987-08-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |