CN100527400C - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
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- CN100527400C CN100527400C CNB2007101537748A CN200710153774A CN100527400C CN 100527400 C CN100527400 C CN 100527400C CN B2007101537748 A CNB2007101537748 A CN B2007101537748A CN 200710153774 A CN200710153774 A CN 200710153774A CN 100527400 C CN100527400 C CN 100527400C
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/40247—Connecting the strap to a bond pad of the item
- H01L2224/40249—Connecting the strap to a bond pad of the item the bond pad protruding from the surface of the item
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Abstract
本发明提供防止由构成半导体器件的电子部件的厚度的不同而导致的夹引线的倾斜、同时防止夹引线的水平移动的半导体器件，其具备：固定有电子部件的支持板、从该支持板离开地配置的引线端子、以及电连接电子部件的上面电极和引线端子的夹引线，引线端子和夹引线中的一方上设有垂直突出的突起，引线端子和夹引线中的另一方上设有与突起并行延伸的一对引导部件，以在一对引导部件内可以垂直滑动地夹持突起的方式形成夹引线的垂直引导部。由于与电子部件的厚度相对应地使夹引线垂直地滑动，所以可以防止由于电子部件的厚度不同而导致的夹引线的倾斜，同时可以防止夹引线的水平移动。
The present invention provides a semiconductor device that prevents the inclination of the lead wires caused by the difference in thickness of the electronic components constituting the semiconductor device and prevents the horizontal movement of the lead wires. The grounding lead terminal and the clip lead wire electrically connecting the upper electrode of the electronic component and the lead terminal, one of the lead terminal and the clip lead wire is provided with a vertically protruding protrusion, and the other side of the lead terminal and the clip lead wire is provided with a A pair of guide members in which the protrusions extend in parallel form a vertical guide portion for clamping the lead so that the protrusions are sandwiched so as to be vertically slidable within the pair of guide members. Since the clip lead is vertically slid corresponding to the thickness of the electronic component, inclination of the clip lead due to the difference in thickness of the electronic component can be prevented while horizontal movement of the clip lead can be prevented.
Description
技术领域 technical field
本发明是关于具有电连接半导体芯片等电子部件和引线端子的夹引线的倾斜防止机构和水平移动防止机构的半导体器件。The present invention relates to a semiconductor device having an inclination preventing mechanism and a horizontal movement preventing mechanism for clamping lead wires electrically connecting electronic components such as semiconductor chips and lead terminals.
背景技术 Background technique
例如，在下述的专利文件1中，公开有在利用焊锡进行焊接时，利用熔融的焊锡的表面张力，自动进行引线、夹钳以及电子芯片的对位(定心)的电子设备。在该电子设备中，在距离管芯(电子芯片)最近的引线端部上、设有在横方向上延伸的半圆筒状或V字形状的沟等凹部，在电连接管芯和引线的夹钳的引线侧的端部上、设有与引线的凹部项配合的形状的凸部，通过配合这些凹部和凸部，形成允许夹钳向横方向的移动而且控制其向管芯接点方向的移动以及在水平方向(方位方向)的旋转。因此，加热组装起来的管芯、夹钳、引线以及它们之间的焊锡膏时，管芯浮至管芯支持部上的熔融状态的焊锡上，夹钳浮至管芯上和引线上的熔融状态的焊锡上，通过各自的焊锡的表面张力，管芯朝向管芯支持部的上的中央部移动，同时夹钳沿引线的凹部在横方向上移动，所以可以自动进行引线、夹钳以及管芯的定中心、即对位。For example, Patent Document 1 below discloses an electronic device that automatically aligns (centers) leads, clamps, and electronic chips by utilizing the surface tension of molten solder during soldering. In this electronic device, recesses such as semi-cylindrical or V-shaped grooves extending in the lateral direction are provided on the end of the lead closest to the die (electronic chip), and the clip that electrically connects the die and the lead is provided. On the end of the lead side of the pliers, there is a convex part in a shape that matches the concave part of the lead. By cooperating with these concave parts and convex parts, it is formed to allow the movement of the clamp in the lateral direction and control its movement in the direction of the die contact. and rotation in the horizontal direction (azimuth direction). Thus, when the assembled die, clamps, leads, and solder paste between them are heated, the die floats to the molten solder on the die support, and the clamps float to the molten solder on the die and leads. On the solder in the state, by the surface tension of each solder, the die moves toward the upper center of the die support part, and at the same time, the clamp moves in the lateral direction along the concave part of the lead, so the lead, clamp and tube can be automatically carried out. Core centering, that is, alignment.
专利文献1特开平2-121356号公报Patent Document 1 Japanese Unexamined Publication No. H2-121356
但是，在上述专利文献1的电子设备中，如果管芯、即电子芯片的厚度不同，则会以引线的凹部和夹钳的凸部的配合部分作为轴、夹钳在垂直方向上位移，夹钳相对于电子芯片和引线发生倾斜，所以会存在电子芯片以及夹钳之间熔融的焊锡流向电子芯片的侧面，使PN结短路，从而使电子芯片和夹钳之间电短路的情况。此时，无法获得电子设备的良好的电特性，存在生产上的成品率及可靠性低下的问题。However, in the electronic device of the above-mentioned Patent Document 1, if the thickness of the die, that is, the electronic chip is different, the clamp will be displaced in the vertical direction with the mating portion of the concave portion of the lead and the convex portion of the clamp as an axis, and the clamp The clamp is inclined relative to the electronic chip and the lead wires, so the molten solder between the electronic chip and the clamp may flow to the side of the electronic chip, short-circuiting the PN junction, thereby electrically shorting the electronic chip and the clamp. In this case, good electrical characteristics of the electronic device cannot be obtained, and there is a problem that the production yield and reliability are low.
发明内容 Contents of the invention
本发明的目的在于提供防止由于电子芯片等的电子部件的厚度的不同而导致的夹引线的倾斜、同时可以防止夹引线的水平移动的半导体器件。An object of the present invention is to provide a semiconductor device capable of preventing inclination of clamp leads due to differences in thickness of electronic components such as electronic chips and preventing horizontal movement of the clamp leads.
关于本发明的半导体器件，其具备：固定有电子部件(1)的支持板(2)、从该支持板(2)离开地配置的引线端子(3)、以及电连接电子部件(1)的电极和引线端子(3)的夹引线(4)。在该半导体器件中，引线端子(3)和夹引线(4)中的一方上设有垂直地突出的突起(3a，4a)，引线端子(3)和夹引线(4)中的另一方上设有与突起(3a，4a)并行延伸的一对引导部件(3b，4b)，以在一对引导部件(3b，4b)内可垂直滑动地夹持突起(3a，4a)的方式，形成夹引线(4)的垂直引导部(5)。Regarding the semiconductor device of the present invention, it is provided with: a support plate (2) to which the electronic component (1) is fixed, a lead terminal (3) arranged away from the support plate (2), and a device for electrically connecting the electronic component (1) Clamp leads (4) for electrodes and lead terminals (3). In this semiconductor device, one of the lead terminal (3) and the clip lead (4) is provided with a vertically protruding protrusion (3a, 4a), and the other of the lead terminal (3) and the clip lead (4) is provided with a A pair of guide parts (3b, 4b) extending in parallel with the protrusions (3a, 4a) are provided, and the protrusions (3a, 4a) are vertically slidably held in the pair of guide parts (3b, 4b), forming Vertical guide (5) for clip leads (4).
由于以在一对引导部件(4b，3b)内可以垂直滑动地夹持滑动突起(3a，4a)的方式形成夹引线(4)的垂直引导部(5)，所以夹引线(4)相对于引线端子(3)可以垂直移动，但水平移动被阻止。即便在支持板(2)和夹引线(4)之间电连接厚度不同的电子部件(1)时，也可以与电子部件(1)的厚度相对应地使夹引线(4)垂直地滑动，从而可以防止由于电子部件(1)的厚度不同而导致的夹引线(4)的倾斜，同时可以防止夹引线(4)的水平移动。由此，可以避免夹引线(4)倾斜时由熔融的焊锡的移动所导致的电子部件(1)的电短路。Since the vertical guide portion (5) of the clamp lead (4) is formed in such a way that the slide protrusion (3a, 4a) can be vertically slidably clamped in a pair of guide members (4b, 3b), the clamp lead (4) is relatively The lead terminal (3) can move vertically, but horizontal movement is blocked. Even when electronic parts (1) having different thicknesses are electrically connected between the support plate (2) and the clip lead (4), the clip lead (4) can be slid vertically corresponding to the thickness of the electronic part (1), Therefore, the inclination of the clamping lead wire (4) caused by the difference in thickness of the electronic component (1) can be prevented, and the horizontal movement of the clamping lead wire (4) can be prevented at the same time. Thereby, an electrical short circuit of the electronic component (1) caused by movement of molten solder when the clip lead (4) is inclined can be avoided.
发明的效果The effect of the invention
在本发明的半导体器件中，由于在利用焊锡进行焊接作业时，可以防止夹引线的水平移动，同时可以防止由电子部件的厚度不同而导致的夹引线的倾斜、从而能够避免由焊锡的移动导致的电子部件的电短路，所以能够获得良好的电特性，同时也可改善生产上的成品率及可靠性。In the semiconductor device of the present invention, since the horizontal movement of the lead wires can be prevented when the soldering is used, and the inclination of the lead wires caused by the difference in thickness of the electronic components can be prevented, thereby avoiding the movement caused by the soldering tin. The electrical short circuit of electronic components can be obtained, so good electrical characteristics can be obtained, and the yield and reliability of production can also be improved.
附图说明 Description of drawings
图1是表示根据本发明的半导体器件的实施方式的立体图。FIG. 1 is a perspective view showing an embodiment of a semiconductor device according to the present invention.
图2是表示图1的右视图。Fig. 2 is a right side view showing Fig. 1 .
图3是表示图1的平面图。Fig. 3 is a plan view showing Fig. 1 .
图4是表示图1的正视图。Fig. 4 is a front view showing Fig. 1 .
图5是表示图1的夹引线的展开平面图。Fig. 5 is a developed plan view showing the lead wire of Fig. 1 .
图6是表示图1的半导体器件的变形实施方式的右视图。FIG. 6 is a right side view showing a modified embodiment of the semiconductor device of FIG. 1 .
图7是图6的平面图。FIG. 7 is a plan view of FIG. 6 .
图8是图6的正视图。FIG. 8 is a front view of FIG. 6 .
具体实施方式 Detailed ways
下面，参照附图1～8对根据本发明的半导体器件的实施方式进行说明。Next, embodiments of a semiconductor device according to the present invention will be described with reference to FIGS. 1 to 8 .
本实施方式的半导体器件，如图1所示，具有：固定有作为电子部件的半导体芯片(1)的支持板(2)、离开支持板(2)地配置的一方的引线端子(3)、以及电连接半导体芯片(1)的上面电极和一方的引线端子(3)的夹引线(4)。支持板(2)如图1～图4所示，从另一方的引线端子(6)的内侧端部(6a)延伸出而形成。在与支持板(2)相对的一方的引线端子(3)的内侧端部(3c)上、设有垂直向上突起的滑动突起(3a)，在与一方的引线端子(3)相对的夹引线(4)的一个端部(4c)上、设有与滑动突起(3a)并行延伸的一对引导部件(4b)。在与半导体芯片(1)的上面电极相对的夹引线(4)的另一个端部(4d)上、设有截面积向着半导体芯片(1)的上面电极逐渐地减小、成圆锥状地突起的圆锥突起(4e)。在一对引导部件(4b)的前端设有从滑动突起(3a)的前端部开始突起的一对突起部(4f)，该一对突起部(4f)之间的宽度形成得比滑动突起(3a)的宽度大。The semiconductor device of the present embodiment, as shown in FIG. 1, has: a support plate (2) on which a semiconductor chip (1) as an electronic component is fixed, a lead terminal (3) disposed away from the support plate (2), And the clip lead (4) electrically connecting the top electrode of the semiconductor chip (1) and one lead terminal (3). As shown in FIGS. 1 to 4 , the support plate ( 2 ) is formed by extending from the inner end portion ( 6 a ) of the other lead terminal ( 6 ). On the inner end portion (3c) of one lead terminal (3) opposite to the support plate (2), a sliding protrusion (3a) protruding vertically upwards is provided, and the lead wire is clamped on the opposite side of the lead terminal (3) (4) One end (4c) is provided with a pair of guide members (4b) extending parallel to the sliding protrusion (3a). On the other end (4d) of the clip lead (4) opposite to the upper electrode of the semiconductor chip (1), there is a conical protrusion with a cross-sectional area that gradually decreases toward the upper electrode of the semiconductor chip (1). conical protrusions (4e). A pair of protrusions (4f) protruding from the front end of the sliding protrusion (3a) are provided at the front ends of the pair of guide members (4b), and the width between the pair of protrusions (4f) is formed to be wider than that of the sliding protrusion (3a). 3a) has a large width.
夹引线(4)，是把由例如铜(Cu)等导电性良好的金属构成的板材、通过公知的冲压加工等冲压成如图5所示的形状而制作成的，形成从一个端部(4c)向两侧延伸的一对的舌片(4h、4i)、且隔着宽度狭窄的中间部(4j)、在宽度大的另一个端部(4d)的中心部形成圆锥突起(4e)。在一对舌片(4h、4i)之间，形成有插入滑动突起(3a)的贯通口(4g)。进一步，通过把形成为图5所示形状的夹引线(4)的一对舌片(4h、4i)以及中间部(4j)在凸弯(M1～M5)和凹弯(V1～V3)进行弯曲加工，形成如图1～图4所示形状的一对引导部件(4b)、一对突起部(4f)以及中间部(4j)。The lead wire (4) is made by stamping a plate made of a metal with good conductivity such as copper (Cu) into a shape as shown in Figure 5 by known stamping process, etc. 4c) a pair of tongues (4h, 4i) extending to both sides, and forming a conical protrusion (4e) at the center of the other end (4d) having a wider width across the narrow middle portion (4j) . Between the pair of tongue pieces (4h, 4i), a through hole (4g) into which the slide protrusion (3a) is inserted is formed. Further, by forming a pair of tongues (4h, 4i) and the middle part (4j) of the lead wire (4) of the shape shown in Figure 5 in the convex bend (M1-M5) and concave bend (V1-V3) The bending process forms a pair of guide members (4b), a pair of protrusions (4f), and an intermediate portion (4j) in the shapes shown in FIGS. 1 to 4 .
通过在夹引线(4)的贯通口(4g)插入一方的引线端子(3)的滑动突起(3a)、在一对引导部件(4b)内可以垂直滑动地夹持滑动突起(3)，形成夹引线(4)的垂直引导部(5)。半导体芯片(1)、支持板(2)、夹引线(4)、垂直引导部(5)以及一对引线端子(3、6)的内侧端部(3c，6c)，利用由两点划线所表示的树脂密封体(7)进行密封，从树脂密封体(7)的两端引出的一对外部电极(3d、6b)，沿着树脂密封体(7)的表面弯曲加工(成型)成大致コ字形状。By inserting the sliding protrusion (3a) of one lead terminal (3) into the through hole (4g) of the clamping lead wire (4), the sliding protrusion (3) can be vertically slidably clamped in a pair of guide members (4b), forming Vertical guide (5) for clip leads (4). Semiconductor chip (1), supporting plate (2), clip lead (4), vertical guide portion (5) and the inside end portion (3c, 6c) of a pair of lead terminal (3, 6), utilize the two-dot-dash line The resin sealing body (7) shown is sealed, and a pair of external electrodes (3d, 6b) drawn from both ends of the resin sealing body (7) are bent (molded) along the surface of the resin sealing body (7) into Roughly U-shaped.
在制造本实施方式的半导体器件时，首先从铜(Cu)等金属制的板材、把形成有支持板(2)以及一对引线端子(3，6)的引线框架、利用公知的冲压加工形成图1～图4所示的形状，表面上覆盖有镍镀层，令支持板(2)的上面与半导体芯片(1)的下面电极相对、利用锡焊等而固定。另外，在一方的引线端子(3)的内侧端部(3c)的一部分上切入切口，如图1及图2所示地垂直向上弯曲、形成滑动突起(3a)。另外，虽未图示，进行树脂密封之前的一对引线端子(3，6)的外部电极(3d，6b)并不加工成大致コ字形状，而是直线状地延伸。When manufacturing the semiconductor device of this embodiment, firstly, the lead frame on which the support plate (2) and a pair of lead terminals (3, 6) are formed is formed from a metal plate such as copper (Cu) by known press work. The shape shown in FIGS. 1 to 4 is covered with nickel plating on the surface, and the upper surface of the support plate (2) is opposed to the lower electrode of the semiconductor chip (1), and fixed by soldering or the like. In addition, a notch is made in a part of the inner end portion (3c) of one lead terminal (3), and it is bent vertically upward as shown in Figs. 1 and 2 to form a sliding protrusion (3a). Also, although not shown, the external electrodes (3d, 6b) of the pair of lead terminals (3, 6) before being resin-sealed are not processed into a substantially U-shaped shape, but extend linearly.
接着，如图5所示，准备从铜(Cu)等金属质的板材通过周知的冲压加工而形成有圆锥突起(4e)、中间部(4j)、贯通口(4g)以及一对舌片(4h、4i)的夹引线(4)，把一对舌片(4h、4i)以及中间部(4j)在凸弯(M1～M5)和凹弯(V1～V3)进行弯曲加工，形成如图1～图4所示形状的一对引导部件(4b)、一对突起部(4f)以及中间部(4j)。其后，如图2所示，通过在夹引线(4)的贯通口(4g)插入一方的引线端子(3)的滑动突起(3a)、配置在一对引导部件(4b)之间，在一对引导部件(4b)内可以垂直滑动地夹持滑动突起(3)，形成夹引线(4)的垂直引导部(5)。由此，由于夹引线(4)与半导体芯片(1)的厚度相对应地垂直滑动，所以可以防止由于半导体芯片(1)的厚度不同而导致的夹引线(4)的倾斜，同时可以防止夹引线(4)的水平移动。此时，在一对引导部件(4b)的前端所形成的一对突起部(4f)，从滑动突起(3a)的前端部突起。其后，在一对引导部件(4b)的突起部(4f)之间附着熔融的焊锡并使其固化，利用焊锡固定一对引导部件(4b)和滑动突起(3a)，同时通过锡焊等固定半导体芯片(1)的上面电极和夹引线(4)的圆锥突起(4e)。由此，半导体芯片(1)的上面电极和一方的引线端子(3)通过夹引线(4)而电连接，形成引线框架组装体。Next, as shown in FIG. 5, a conical protrusion (4e), an intermediate portion (4j), a through hole (4g) and a pair of tongues ( 4h, 4i) of the lead wire (4), the pair of tongues (4h, 4i) and the middle part (4j) are bent in the convex bend (M1 ~ M5) and concave bend (V1 ~ V3), forming a A pair of guide members (4b), a pair of protrusions (4f) and an intermediate portion (4j) of the shape shown in Fig. 1 to Fig. 4 . Thereafter, as shown in FIG. 2, by inserting the sliding protrusion (3a) of one lead terminal (3) into the through opening (4g) of the lead wire (4), and disposing between the pair of guide members (4b), the The slide protrusion (3) can be vertically slidably clamped in a pair of guide parts (4b), forming a vertical guide portion (5) for clamping the lead wire (4). Thereby, since the clamping lead (4) slides vertically corresponding to the thickness of the semiconductor chip (1), it is possible to prevent the inclination of the clamping lead (4) due to the difference in thickness of the semiconductor chip (1), and at the same time prevent the clamping Horizontal movement of the lead (4). At this time, the pair of protrusions (4f) formed on the front ends of the pair of guide members (4b) protrude from the front ends of the slide protrusions (3a). Thereafter, the molten solder is adhered and solidified between the protrusions (4f) of the pair of guide members (4b), and the pair of guide members (4b) and the sliding protrusions (3a) are fixed by soldering, while soldering, etc. Fix the upper electrode of the semiconductor chip (1) and the conical protrusion (4e) that clamps the lead (4). Thereby, the upper surface electrode of the semiconductor chip (1) and one lead terminal (3) are electrically connected by pinching the lead wire (4), forming a lead frame assembly.
接着，把直线状延伸的一对引线端子(3，6)的外部电极(3d，6b)配置在未图示的模具的下模的两端部，对下模闭锁上模来夹持引线框架组装体的一对的引线端子(3，6)。由此，在未图示的模具内形成与应形成的树脂密封体(7)的形状(图1～图4的两点划线部)一致的成型空间(空腔)。Next, the external electrodes (3d, 6b) of a pair of lead terminals (3, 6) extending linearly are arranged at both ends of the lower mold of a mold not shown, and the upper mold is closed to the lower mold to clamp the lead frame. A pair of lead terminals (3, 6) of the assembly. Thus, a molding space (cavity) conforming to the shape of the resin sealing body ( 7 ) to be formed (the two-dot chain line portion in FIGS. 1 to 4 ) is formed in the mold (not shown).
其后，从设在未图示的模具上的树脂注入口、向成型空间填充由流动的环氧树脂等热固化性树脂构成的密封用树脂，形成密封半导体器件(1)、支持板(2)、夹引线(4)、垂直引导部(5)以及一对引线端子(3，6)的内侧端部(3c、6a)的树脂密封体(7)。在填充到未图示的模具的成型空间内的密封用树脂固化后，打开上模和下模，取出形成了树脂密封体(7)的引线框架组装体，除去树脂注入口的部分，得到引出了从树脂密封体(7)的两端直线状延伸的一对外部电极(3d，6b)的状态的半导体器件。进一步，通过把直线状延伸的一对外部电极(3d、6b)弯曲加工(成型)成沿着树脂密封体(7)的表面成大致呈コ字形状，得到图1～图4所示的半导体器件。Thereafter, from a resin injection port provided on a mold not shown, the molding space is filled with a sealing resin made of a thermosetting resin such as epoxy resin that flows to form a sealed semiconductor device (1), a support plate (2 ), the clamping lead (4), the vertical guide (5) and the resin sealing body (7) of the inner end (3c, 6a) of a pair of lead terminals (3, 6). After the sealing resin filled in the molding space of the mold (not shown) is cured, the upper mold and the lower mold are opened, and the lead frame assembly with the resin sealing body (7) is taken out, and the part of the resin injection port is removed to obtain the lead frame assembly. A semiconductor device in the state of a pair of external electrodes (3d, 6b) linearly extending from both ends of a resin sealing body (7). Further, by bending (molding) a pair of external electrodes (3d, 6b) extending linearly into a substantially U-shaped shape along the surface of the resin sealing body (7), the semiconductor electrode shown in FIGS. 1 to 4 is obtained. device.
本实施方式中，由于在一对引导部件(4b)内可以垂直滑动地夹持滑动突起(3a)、形成夹引线(4)的垂直引导部(5)，所以夹引线(4)对于一方的引线端子(3)可以相对地垂直移动，但水平移动被阻止。因此，即便在支持板(2)和夹引线(4)之间电连接厚度不同的半导体芯片(1)时，也可以与半导体芯片(1)的厚度相对应地使夹引线(4)垂直地滑动，从而可以防止由于半导体芯片(1)的厚度不同而导致的夹引线(4)的倾斜，同时可以防止夹引线(4)的水平移动。由此，可以避免夹引线(4)倾斜时由熔融的焊锡的移动所导致的半导体芯片(1)的电短路。另外，由于在一对引导部件(4b)的前端设置从滑动突起(3a)的前端部突起的一对突起部(4f)、令一对突起部(4f)之间的宽度比滑动突起(3a)的宽度大，所以通过在一对突起部(4f)之间附着熔融的焊锡并使其固化，可以良好地利用焊锡固定一对引导部件(4b)和滑动突起(3a)。进一步，由于在与半导体芯片(1)的上面电极相对的夹引线(4)的另一个端部(4d)上、设有截面积向着半导体芯片(1)的上面电极逐渐减小、成圆锥状突起的圆锥突起(4e)，所以在锡焊夹引线(4)的另一个端部(4d)和半导体芯片(1)的上面电极时，熔融的焊锡通过夹引线(4)的圆锥突起(4e)流动，焊锡从半导体芯片(1)的上面电极的中心部沿着周边部爬上去。因此，通过水平状态地保持夹引线(4)且令其良好地接触半导体芯片(1)，可以良好地锡焊到各种大小的半导体芯片(1)上。In this embodiment, since the sliding protrusion (3a) can be vertically slidably clamped in a pair of guide members (4b) to form the vertical guide portion (5) of the clamping lead (4), the clamping lead (4) is relatively stable for one side. The lead terminals (3) can relatively move vertically, but the horizontal movement is blocked. Therefore, even when semiconductor chips (1) having different thicknesses are electrically connected between the support plate (2) and the clip leads (4), the clip leads (4) can be vertically aligned corresponding to the thickness of the semiconductor chip (1). Sliding, so that the inclination of the clamping lead (4) caused by the difference in thickness of the semiconductor chip (1) can be prevented, and the horizontal movement of the clamping lead (4) can be prevented at the same time. Thus, an electrical short circuit of the semiconductor chip (1) caused by movement of molten solder when the clip lead (4) is tilted can be avoided. In addition, since a pair of protrusions (4f) protruding from the front end of the sliding protrusion (3a) are provided at the front ends of the pair of guide members (4b), the width between the pair of protrusions (4f) is wider than that of the sliding protrusion (3a). ) width is large, so by adhering molten solder between the pair of protrusions (4f) and solidifying it, the pair of guide members (4b) and sliding protrusions (3a) can be fixed well with solder. Further, because on the other end portion (4d) of the clip lead (4) opposite to the upper electrode of the semiconductor chip (1), the cross-sectional area is gradually reduced toward the upper electrode of the semiconductor chip (1), and is conical. Protruding conical protrusion (4e), so when soldering the other end portion (4d) of clamping lead (4) and the top electrode of semiconductor chip (1), the solder of melting passes through the conical protrusion (4e) of clamping lead (4). ) flows, and the solder climbs up from the center portion of the upper electrode of the semiconductor chip (1) along the peripheral portion. Therefore, by keeping the clip lead (4) in a horizontal state and making it contact the semiconductor chip (1) well, it is possible to solder well to semiconductor chips (1) of various sizes.
本发明的实施方式并不限于上述实施方式，可能有各种变形。例如，在上述实施方式中，设有从一方的引线端子(3)的内侧端部(3c)垂直向上突出的滑动突起(3a)，在与一方的引线端子(3)相对的夹引线(4)的一个端部(4c)上设有一对引导部件(4b)，但也可以如图6～图8所示、设置从夹引线(4)的一个端部(4c)垂直向下突出的滑动突起(4a)、在一方的引线端子(3)的内侧端部(3c)上设置一对引导部件(3b)。此时，在夹引线(4)的一个端部(4c)上设有向一侧延伸的舌片，把该舌片垂直向下折弯、形成滑动突起(4a)，在一方的引线端子(3)的内侧端部(3c)设置向两侧延伸的一对舌片，同时在一对舌片间设置贯通口(3f)，把一对舌片按照与图5所示的情况相反地进行弯曲，形成一对引导部件(3b)以及突出部(3e)就可以。另外，在上述实施方式中，通过对形成一方的引线端子(3)和夹引线(4)的金属板进行弯曲加工，形成滑动突起(3a，4a)以及一对引导部件(4b，3b)，但也可以在一方的引线端子(3)以及夹引线(4)的各自的相应部位上另外加上滑动突起(3a，4a)以及一对引导部件(4b，3b)。进一步，在上述实施方式中，在与半导体芯片(1)的上面电极相对的夹引线(4)的另一个端部(4d)上、设有截面积向着半导体芯片(1)的上面电极逐渐减小、成圆锥状地突起的圆锥突起(4e)，但突起(4e)的形状并不限于圆锥状，也可以是三角锥或四角锥等角锥状的突起。Embodiments of the present invention are not limited to the above-described embodiments, and various modifications are possible. For example, in the above-mentioned embodiment, a sliding protrusion (3a) protruding vertically upward from the inner end portion (3c) of one lead terminal (3) is provided, and a clamping lead (4) opposite to one lead terminal (3) is provided. ) is provided with a pair of guide parts (4b) on one end (4c), but as shown in Figures 6 to 8, a slide protruding vertically downward from one end (4c) of the clip lead (4) can also be provided. A protrusion (4a), and a pair of guide members (3b) are provided on an inner end portion (3c) of one lead terminal (3). At this time, one end (4c) of the clip lead wire (4) is provided with a tongue piece extending to one side, and the tongue piece is bent vertically downward to form a sliding protrusion (4a), and on one side of the lead terminal ( 3) The inner end (3c) is provided with a pair of tongues extending to both sides, and a through hole (3f) is provided between the pair of tongues at the same time, and the pair of tongues is carried out in the opposite manner as shown in Figure 5. What is necessary is just to bend and form a pair of guide member (3b) and a protrusion part (3e). In addition, in the above embodiment, the sliding protrusions (3a, 4a) and the pair of guide members (4b, 3b) are formed by bending the metal plate forming the one lead terminal (3) and the lead wire (4), But it is also possible to additionally add sliding protrusions (3a, 4a) and a pair of guide members (4b, 3b) on the respective corresponding positions of one lead terminal (3) and the clip lead wire (4). Further, in the above embodiment, on the other end (4d) of the clip lead (4) opposite to the upper electrode of the semiconductor chip (1), a cross-sectional area is provided that gradually decreases toward the upper electrode of the semiconductor chip (1). Small conical protrusions (4e) that protrude in a conical shape, but the shape of the protrusions (4e) is not limited to the conical shape, and may be pyramid-shaped protrusions such as triangular pyramids or quadrangular pyramids.
产业上的可利用性Industrial availability
本发明可以良好地适用于具有电连接半导体芯片等电子部件和引线端子的夹引线的大功率二极管、晶体管或晶闸管、或者IC(集成电路)等半导体器件。The present invention can be suitably applied to semiconductor devices such as high-power diodes, transistors or thyristors, or ICs (integrated circuits) having pinch leads that electrically connect electronic components such as semiconductor chips and lead terminals.
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| DE102014118628A1 (en) * | 2014-12-15 | 2016-06-16 | Infineon Technologies Ag | Bonding slip, carrier and method of making a bonding clip |
| US10163762B2 (en) * | 2015-06-10 | 2018-12-25 | Vishay General Semiconductor Llc | Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting |
| JP2017170627A (en) * | 2016-03-18 | 2017-09-28 | 富士電機株式会社 | Mold product manufacturing method and mold product |
| CN109757119B (en) * | 2017-09-05 | 2022-12-23 | 新电元工业株式会社 | Semiconductor device |
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| US12308338B2 (en) * | 2022-07-14 | 2025-05-20 | Littelfuse, Inc. | Power substrate assembly with reduced warpage |
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|---|---|---|---|---|
| CN1310474A (en) * | 2000-02-24 | 2001-08-29 | 欧佩克欧洲功率半导体股份有限两合公司 | Large power semiconductor assembly capable of relieving mechanical stress |
| CN1381886A (en) * | 2001-04-13 | 2002-11-27 | 雅马哈株式会社 | Semiconductor device and packaging and its manufacturing method |
-
2006
- 2006-11-29 JP JP2006322438A patent/JP2008140788A/en active Pending
-
2007
- 2007-08-22 TW TW096131126A patent/TWI344197B/en not_active IP Right Cessation
- 2007-09-20 CN CNB2007101537748A patent/CN100527400C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1310474A (en) * | 2000-02-24 | 2001-08-29 | 欧佩克欧洲功率半导体股份有限两合公司 | Large power semiconductor assembly capable of relieving mechanical stress |
| CN1381886A (en) * | 2001-04-13 | 2002-11-27 | 雅马哈株式会社 | Semiconductor device and packaging and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200824083A (en) | 2008-06-01 |
| TWI344197B (en) | 2011-06-21 |
| JP2008140788A (en) | 2008-06-19 |
| CN101192580A (en) | 2008-06-04 |
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