CN100498830C - Chip comprising different chip contacts for different operating modes - Google Patents
Chip comprising different chip contacts for different operating modes Download PDFInfo
- Publication number
- CN100498830C CN100498830C CNB2005800370915A CN200580037091A CN100498830C CN 100498830 C CN100498830 C CN 100498830C CN B2005800370915 A CNB2005800370915 A CN B2005800370915A CN 200580037091 A CN200580037091 A CN 200580037091A CN 100498830 C CN100498830 C CN 100498830C
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- CN
- China
- Prior art keywords
- chip
- contact
- contacts
- pattern
- mode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
- B42D25/22—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose for use in combination with accessories specially adapted for information-bearing cards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
提出了在芯片(20)中用于数据载体(1)的非接触操作模式芯片触点(24、25)和接触操作模式芯片触点(26、27、28、29、30、31、32、33)，其中，非接触操作模式芯片触点(24、25)和接触操作模式芯片触点(26、27、28、29、30、31、32、33)的至少一些每一个均具有接触头(38、39、40、41、42、43、44、45、46、47)，其中非接触操作模式芯片触点(24、25)的接触头(38、39)的头高度(H)比接触操作模式芯片触点(26、27、28、29、30、31、32、33)的接触头(40至47)的头高度(h)大。
Contactless operation mode chip contacts (24, 25) and contact operation mode chip contacts (26, 27, 28, 29, 30, 31, 32, 33) for a data carrier (1) in a chip (20) are proposed, wherein at least some of the contactless operation mode chip contacts (24, 25) and the contact operation mode chip contacts (26, 27, 28, 29, 30, 31, 32, 33) each have contact heads (38, 39, 40, 41, 42, 43, 44, 45, 46, 47), wherein the head height (H) of the contact heads (38, 39) of the contactless operation mode chip contacts (24, 25) is greater than the head height (h) of the contact heads (40 to 47) of the contact operation mode chip contacts (26, 27, 28, 29, 30, 31, 32, 33).
Description
Technical field
The present invention relates to a kind of chip; described chip is configured and is designed for different chip cards; described chip card in first embodiment only is suitable for the Touchless manipulation pattern; and only be suitable for the operating of contacts pattern in a second embodiment; and in the 3rd embodiment, be suitable for Touchless manipulation pattern and contact operation mould; described chip has semiconductor bulk; the integrated circuit that in semiconductor, forms; be designed for the passivation layer of protection integrated circuit; contactless operator scheme chip contacts; and operating of contacts pattern chip contacts, each all has the contact layer that is positioned at below the passivation layer described chip contacts.
The invention further relates to a kind of chip card that comprises chip.
Background technology
The chip of the type of mentioning in first section is commercial, comes from the patent applicant that the different designs variant is provided, and is known.The different variants that known chip are used for chip card, be designed and only be used for first variant of the chip card of Touchless manipulation pattern particularly, be designed and only be used for second variant of the chip card of operating of contacts pattern, and the 3rd variant that has been designed and has been used for the chip card of Touchless manipulation pattern and operating of contacts pattern.In known chip, the design of Touchless manipulation pattern chip contacts and operating of contacts pattern chip contacts makes whole these chip contacts only have to be positioned at a contact layer below the passivation layer.Thus, whole being only applicable to of these chips links to each other with the chip card contact that is associated by Wire Bonding Technology, and this has represented undesirable restriction.And can must be designed near the zone of the contact layer of bonding wire at least is anti-erosion and other negative consequences, and this requires additional expense.
Summary of the invention
One object of the present invention is to avoid above-mentioned difficulties, occurs in the chip of the type that described difficulty is mentioned in first paragraph and in the chip of the type of mentioning in second paragraph, and improved chip and improved data carrier are provided.
To achieve these goals, the with good grounds feature of the present invention of chip configuration according to the present invention makes that chip feature according to the present invention is as follows, that is:
Chip; with described chip configuration and be designed in the different chip cards; be only applicable to the Touchless manipulation pattern among described chip card first embodiment; be only applicable to the operating of contacts pattern in a second embodiment; in the 3rd embodiment, be applicable to Touchless manipulation pattern and operating of contacts pattern; and described chip has semiconductor bulk; the integrated circuit that in semiconductor bulk, forms; be designed for the passivation layer of protection integrated circuit; contactless operator scheme chip contacts; and operating of contacts pattern chip contacts; each all has the contact layer that is positioned at below the passivation layer described Touchless manipulation pattern chip contacts and operating of contacts pattern chip contacts; wherein Touchless manipulation pattern chip contacts and at least some operating of contacts pattern chip contacts each all have with contact layer and link to each other; and the contact head that protrudes in the hole from passivation layer; and each contact head has the relevant given head height degree in zone of the passivation layer adjacent with contact head, and the head height degree of the contact head of an aspect ratio operating of contacts pattern chip contacts of the contact head of Touchless manipulation pattern chip contacts is big.
To achieve these goals, in comprising the chip card of chip, chip card disposes according to chip of the present invention.
Provide feature according to the present invention to mean: Touchless manipulation pattern chip contacts and at least some operating of contacts pattern chip contacts boths have contact head, wherein can produce whole contact heads, make and to guarantee very simple and cost is effectively made by independent manufacture method.In the said chip contact, provide contact head to mean: in simple mode, rely on the contact head of Touchless manipulation pattern chip contacts to have bigger head height degree, can guarantee to stablize and be connected with ageing-resistant conduction, described ageing-resistant conduction connection can adopt the plain mode of flip chip technology (fct) to produce, and only take less gross thickness, described gross thickness can be based upon Touchless manipulation pattern chip contacts and distribute between the terminal of transmitting device of these Touchless manipulation pattern chip contacts, described transmitting device configuration and be designed for the non-contact transmission of signal.In addition; provide feature according to the present invention to mean: to link to each other with the terminal of the transmitting device of data carrier with flip chip technology (fct) at Touchless manipulation pattern chip contacts; and with data carrier designed and only be used under the situation of Touchless manipulation pattern; cannot be used for obsolete in this case operating of contacts pattern chip contacts; to increase destructive effect; particularly with any short circuit of the transmitting device of the non-contact transmission that is used for signal and data; and do not use here and dispose under the situation of operating of contacts pattern chip contacts of contact head; by the contact head that under any circumstance all exists; make to need not just to have placed erosion and other undesirable changes, the contact layer of these operating of contacts pattern chip contacts is protected well avoid environmental impact and other destructive influences contact layer at the required separation protective device of this purpose.In addition; provide the method according to this invention to mean: at will chip configuration according to the present invention design and only be used for the operating of contacts pattern according to data carrier of the present invention; or design and be used for the situation according to data carrier of the present invention of Touchless manipulation pattern and operating of contacts pattern; by having the contact head of less height of head; operating of contacts pattern chip contacts is applicable to that the bonding of setting up between the relative contact (countercontact) of the less contact head of operating of contacts pattern chip contacts and data carrier in simple mode connects; described data carrier is assigned to these operating of contacts pattern chip contacts; and is enterable with known manner from the data carrier outside; another contact head that wherein has their bigger head height degree has realized being used for the specific defencive function of the bonding wire that links to each other with less contact head as the result of bigger head height degree.
In chip according to the present invention, the head height degree of the contact head of Touchless manipulation pattern chip contacts can be greater than 25 μ m, and for example can have the value between the 30 and 50 μ m.Yet, if the head height degree of the contact head of verified Touchless manipulation pattern chip contacts is very favorable between 15 μ m and 25 μ m.Relatively with their bigger head height degree, manufacturing time and material that the requirement of this kind contact head is less relatively.Yet, this kind design is particularly advantageous, because if Touchless manipulation pattern chip contacts links to each other with the relative contact of the transmitting device of chip card by flip chip technology (fct), between Touchless manipulation pattern chip contacts and relative contact, exist enough big interval on the one hand, obtained the advantage of less gross thickness on the other hand to receive so-called underfill layer.And the manufacturing tolerance limit of less contact head is lower, as its result, has increased the reliability of mechanical connection and electrical connection therefore.
In chip according to the present invention, the head height degree of the contact head of operating of contacts pattern chip contacts can for example can have the value between 12 μ m and the 30 μ m greater than 10 μ m.Yet, if the head height degree of the contact head of verified operating of contacts pattern chip contacts is very favorable between 1 μ m and 10 μ m.Relatively with their bigger head height degree, manufacturing time and material that the requirement of this kind contact head is less relatively.Yet, this kind design is particularly advantageous, because between the less head height degree of the contact head of the bigger head height degree of the contact head of Touchless manipulation pattern chip contacts and operating of contacts pattern chip contacts, realized bigger difference, as its result, provide to prevent because the higher safe coefficient of the operating of contacts pattern chip contacts of the undesirably short circuit of manufacturing tolerance limit.
In chip according to the present invention, have been found that during test experiments, if the head height degree of the contact head of verified operating of contacts pattern chip contacts is that 18 μ m are particularly advantageous.
In chip according to the present invention, and have been found that during test experiments, if the head height degree of the contact head of verified operating of contacts pattern chip contacts is that 5 μ m are particularly advantageous.
In chip according to the present invention, contact head can be made up of silver or palladium.Yet, if verified whole contact head form by gold and to produce by electroplating technology be particularly advantageous.Because long-time known apparatus and method are used to make the contact head according to chip of the present invention in essence, this is particularly advantageous.
Above-mentioned aspect of the present invention and other aspect reveal from the example of embodiment described below, and this example of reference example is explained.
Description of drawings
The present invention will describe further with reference to the example of as shown in the figure embodiment, yet, not restriction the present invention.
Fig. 1 schematically shows data carrier, promptly comprises chip card according to the chip of an example of the embodiment of the invention in top view.
Fig. 2 shows the part of the chip card of Fig. 1 in top view and with the ratio bigger than Fig. 1, described part comprises chip.
Fig. 3 has illustrated the chip card as shown in Figure 2 with chip in the section that obtains along the III-III line among Fig. 2.
Embodiment
Fig. 1, Fig. 2 and Fig. 3 show the chip card 1 of the card body 2 with laminate patch technology manufacturing of passing through a plurality of films of use.Also made card body 2 by injection molding.Chip card 1 is designed and is applicable to Touchless manipulation pattern and the operating of contacts pattern carried out.For this reason, chip card 1 at first has the transmission coil 3 that is embedded in the card body 2, and as the non-contact transmission device that is used for transmission signals and data, next has contact array 4.Transmission coil 3 has 5,6,7,8 and two coil terminals 9,19 of four (4) coil winding.Contact array 4 has eight (8) card contact 10,11,12,13,14,15,16,17, described card contact 10,11,12,13,14,15,16,17 is come-at-able from chip card 1 outside at the relative contact of writing, and it is possible making signal contact transmission with data.8 card contacts 10,11,12,13,14,15,16,17 of contact array 4 are arranged on the carrier 18 of contact array 4, and described carrier 18 is made up of electrically insulating material.In this case, carrier 18 is made up of printing plate material.Yet carrier 18 also can form by plastic sheeting.In the chip card this kind of transmission coil 3 and this kind contact array 4 provide known in essence the long period, therefore do not provide the other detailed description of this respect here.
Chip card 1 also is included among Fig. 1 not shown and only at the chip 20 shown in Fig. 2 and Fig. 3.Here show chip 20 with respect to contact array 4 at that amplify aspect its chip surface rather than actual chip 20.Therefore, thickness as shown in Figure 3 is actual than not, but selects greatlyyer therebetween for the sake of simplicity.Under situation as shown in Figure 1 to Figure 3, chip card 1 is designed and is applicable to Touchless manipulation pattern and the operating of contacts pattern carried out, as mentioned above.Yet, chip 20 can be used in the chip card that is only applicable to the Touchless manipulation pattern.Chip 20 can also be used for being only applicable to the chip card of operating of contacts pattern.
Chip 20 has semiconductor bulk.Be schematically shown as Fig. 3, in semiconductor bulk 21, form integrated circuit 22.Chip 20 also has passivation layer 23, is designed for the protection integrated circuit in fact.
In this case, chip 20 also has two Touchless manipulation pattern chip contacts 24 and 25, and 8 operating of contacts pattern chip contacts 26,27,28,29,30,31,32,33.Above-mentioned 10 chip contacts 24 to 33, each all has the contact layer that is positioned at below the passivation layer 23, in Fig. 3, only show some of described contact layer and can in Fig. 3, find out, that is, described contact layer disposes the contact layer of the contact 24,25,27,31 of reference symbol 34,35,36,37.
Chip 20 particularly advantageously is to have such design: wherein each Touchless manipulation pattern chip contacts 24,25 all has the contact head that contacts and pass through the hole protrusion in the passivation layer 23 with contact layer 34,35,36,37 with each operating of contacts pattern chip contacts 26,27,28,29,30,31,32,33.Above-mentioned hole in the passivation layer 23 can still not provide reference symbol as seen from Figure 3. Dispose reference symbol 38,39,40,41,42,43,44,45,46,47 to above-mentioned contact head.Each contact head 38 to 47 has the given head height degree with respect to the zone of the passivation layer 23 adjacent with each contact head 38 to 47.About contact head, what it might also be mentioned is not to be whole operating of contacts pattern chip contacts 26,27,28,29,30,31,32,33 must have and contact layer 34,35,36,37 contacts, and contact head 40 to 47 by the protrusion of the hole in the passivation layer 23, but operating of contacts pattern chip contacts 26 only, 27,28,29,30,31,32, some of 33 need have contact head, for example, if have only operating of contacts pattern chip contacts 26,27,28,29,30,31,32, in fact some of 33 are configured and are used for linking to each other with the chip card contact, like this, the operating of contacts pattern chip contacts that is not used just can be designed as does not have contact head.
In chip 20, the head height degree H of the contact head 38,39 of Touchless manipulation pattern chip contacts 24,25 is particularly advantageously greater than the head height degree of the contact head 40 to 47 of operating of contacts pattern chip contacts 16 to 33.In chip 20, the bigger head height degree H of the contact head 38,39 of Touchless manipulation pattern chip contacts 24,25 is chosen as 18 μ m specifiedly.The less head height degree of the contact head 40 to 47 of operating of contacts pattern chip contacts 16 to 33 is chosen as 5 μ m specifiedly.Whole 10 contact heads 38 are made up of gold to 47, and by electroplating technology production.10 contact heads 38 to 47 have been produced, for example by printing process according to different modes.Yet, be favourable if contact head 38 to 47 forms by so-called raised pad (gold bump particularly).
The contact head 38,39 of Touchless manipulation pattern chip contacts 24,25 links to each other with coil terminals 9,19 by flip chip technology (fct), wherein provides underfilling between passivation layer 23 and transmission coil 3, and described underfilling is made up of plastic material.The contact head 40 to 47 of operating of contacts pattern chip contacts 26 to 33 is electrically connected with blocking contact 10,11,12,13,14,15,16,17 by the Wire Bonding Technology of using bonding wire 48,49,50,51,52,53,54,55 under each situation, wherein bonding wire 48,49,50,51,52,53,54,55 each all pass the hole 56,57,58,59,60,61,62,63 of the carrier 18 of contact array 4.
In chip 20 and chip card 1, obtained the advantage mentioned in the preface part of describing.Do not have the chip card 1 of transmission coil when chip 20 being used for only have contact truth 4 or do not have only having transmission coil 3 contact array 1 the time, also can obtain at least some of these advantages.
In chip 20 and chip card 21, each fact that all has whole 10 chip contacts 24 to 33 of contact head 38 to 47 provides such advantage: at the operation with contact head, additionally use described contact head for test purpose, can use the testing needle of the testing apparatus (probe card) of independent design, the testing needle that promptly has circular distal.
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04104176.5 | 2004-08-31 | ||
| EP04104176 | 2004-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101048789A CN101048789A (en) | 2007-10-03 |
| CN100498830C true CN100498830C (en) | 2009-06-10 |
Family
ID=35169447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800370915A Expired - Fee Related CN100498830C (en) | 2004-08-31 | 2005-08-24 | Chip comprising different chip contacts for different operating modes |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1789914A1 (en) |
| JP (1) | JP2008511891A (en) |
| KR (1) | KR20070068354A (en) |
| CN (1) | CN100498830C (en) |
| WO (1) | WO2006024990A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
| WO1997005571A1 (en) * | 1995-08-01 | 1997-02-13 | Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh | Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module therefor |
| CN1476587A (en) * | 2001-09-14 | 2004-02-18 | ASK�ɷ�����˾ | Contactless or hybrid contact-contactless smart card with enhanced connection of electronic modules |
| US20040124540A1 (en) * | 2002-12-30 | 2004-07-01 | Yu-Wen Chen | [flip chip package structure] |
-
2005
- 2005-08-24 EP EP05775726A patent/EP1789914A1/en not_active Withdrawn
- 2005-08-24 WO PCT/IB2005/052772 patent/WO2006024990A1/en active Application Filing
- 2005-08-24 KR KR1020077007358A patent/KR20070068354A/en not_active Withdrawn
- 2005-08-24 CN CNB2005800370915A patent/CN100498830C/en not_active Expired - Fee Related
- 2005-08-24 JP JP2007529089A patent/JP2008511891A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5598032A (en) * | 1994-02-14 | 1997-01-28 | Gemplus Card International | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
| WO1997005571A1 (en) * | 1995-08-01 | 1997-02-13 | Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh | Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module therefor |
| CN1476587A (en) * | 2001-09-14 | 2004-02-18 | ASK�ɷ�����˾ | Contactless or hybrid contact-contactless smart card with enhanced connection of electronic modules |
| US20040124540A1 (en) * | 2002-12-30 | 2004-07-01 | Yu-Wen Chen | [flip chip package structure] |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1789914A1 (en) | 2007-05-30 |
| JP2008511891A (en) | 2008-04-17 |
| KR20070068354A (en) | 2007-06-29 |
| CN101048789A (en) | 2007-10-03 |
| WO2006024990A1 (en) | 2006-03-09 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20080516 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20080516 Address after: Holland Ian Deho Finn Applicant after: Koninkl Philips Electronics NV Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
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