CN100454203C - ballast control card - Google Patents

Abstract

A ballast controller is provided on a through slot (42) wave solder daughter card (2) package mounted vertically on a motherboard (40). The ballast drives a fluorescent lamp (4), and a cover (6) is provided over internal ballast control circuit components mounted on a circuit board (8).

Description

ballast control card

Background of the invention

1. Field of invention

The invention relates to a ballast control card, in particular to a ballast control circuit configured on a through-slot wave solderable daughter card that can be vertically installed on a mother board.

2. Description of related technologies

Electronic ballasts used to control fluorescent or high-intensity discharge (HID) lamps typically require electronics to preheat the filament, strike the bulb, bring the bulb to a given wattage, detect bulb fault conditions, and safely shut down the circuit. circuit.

Electronic ballasts for gas discharge circuits have been widely used because of the availability of power metal-oxide-semiconductor field-effect transistor (MOSFET) switching devices and insulated gate bipolar switching devices that can replace previously used power bipolar switching devices Transistors (IGBTs). A large number of integrated circuits (ICs) have been designed for driving the gates of power MOSFETs and IGBTs in electronic ballasts. Examples of such integrated circuits include the models IR2155, IR2157 and IR21571 sold by International Rectifier Corporation and those disclosed in U.S. Patent Nos. 5,545,955 and 6,211,623, the disclosures of which are incorporated herein by reference in their entirety.

Contents of the invention

The present invention provides a fully integrated, fully protected 600V ballast control card designed for use with all types of fluorescent lamps. The ballast control card includes a step-up power factor correction (PFC) controller and a half-bridge ballast controller for controlling the entire effective power factor electronic ballast.

The ballast control card of the present invention incorporates the ballast control IC with power factor correction disclosed in U.S. Patent Application Serial No. 09/981,753 filed October 19, 2001 (the entire disclosure of which is incorporated incorporated herein by reference), and includes two power FETs, a PFC field-effect transistor, and associated passive components integrated with the IC.

According to the present invention, the ballast control circuit including the control IC and FET is arranged on the through-slot wave soldering daughter card. The daughter card is mounted vertically on the motherboard. During manufacture, pads around slots formed through the motherboard are soldered to pads on the vertical daughter card in a wave soldering chamber.

The ballast control card of the present invention greatly simplifies ballast design and significantly reduces the number of ballast components. Externally programmable features such as DC bus voltage level, warm-up time and frequency, ignition ramp (ignitionramp) properties, and run mode operating frequency provide great flexibility to the ballast designer.

Included in this design are comprehensive protection features such as protection against lamp ignition failure, filament failure, asymmetrical lamp voltage (end of life), low AC line conditions, thermal overload and lamp failure during normal operation, and an automatic restart function .

The ballast control card of the present invention has the following characteristics:

- Fully integrated ballast control card.

- Boundary conduction mode boost PFC

-Half bridge ballast output

- Charge Pump Supply input

- Programmable warm-up time and frequency

-Programmable ignition ramp (ignition Ramp)

-Programmable over-current (Over-Current)

- Internal fault counter

- Asymmetric lamp voltage protection

-Filament sensing and protection

-Capacitive mode protection

- Brown-out protection

- Dynamic restart

- Automatic restart for lamp replacement

- thermal overload protection

- Internal 15.6V zener clamp diode turns on VCC

-Through slot wave solder card package

Other features and advantages of the present invention will become clearer in the following description of the present invention in conjunction with the accompanying drawings.

Brief description of the drawings

Fig. 1 is a typical application diagram of the ballast control card of the present invention;

Figure 2 shows the top trace layer of the ballast control card shown in Figure 1;

Figure 3 shows the top solder mask for the ballast control card shown in Figure 1;

Figure 4 shows the top silkscreen layer of the ballast control card shown in Figure 1;

Figure 5 shows the bottom trace layer of the ballast control card shown in Figure 1;

Figure 6 shows a bottom solder mask for the ballast control card shown in Figure 1;

Figure 7 shows the bonding wires of the ballast control card shown in Figure 1;

Figure 8 shows the bottom copper layer for the ballast motherboard of the present invention;

Figure 9 shows the top silkscreen layer for a ballast motherboard of the present invention;

Figure 10 shows the bottom screen printing layer for the ballast motherboard of the present invention;

Figure 11 shows the bottom solder mask for the ballast motherboard of the present invention;

12 is a schematic diagram of a ballast control card circuit according to the present invention.

Detailed Description of Embodiments of the Invention

Referring to FIG. 1 , a typical connection diagram of the ballast control card 2 of the present invention is schematically shown. The ballast drives the fluorescent lamp 4 . A cover 6 is provided over internal ballast control circuit components (to be described further below) mounted on a circuit board 8 . The card is usually 37.05mm x 14.5mm in size. The card is approximately 25 mils thick.

Programmable features of the ballast controller, such as DC bus voltage level, preheat time and frequency, ignition Ignition ramp properties and run mode operating frequency. The list of connection solder joints is as follows:

+ rectified AC line input

BD Boost FET Drain

ZX Zero Cross, PFC Inductor

BS Boost FET Source

VBUS DC bus voltage level programming resistor

OC Overcurrent (SC+) Threshold Programming

RUN Running frequency resistance

RT Oscillator Timing Resistor

RPH Preheat Frequency Resistor and Ignition Ramp Capacitor

CPH Warm up timing capacitor

VDC AC Line Turn-On Voltage Programming Resistor

COM2 Programmable component ground

VCC Logic and low-side gate drive supply

HSD High-side FET drain

VS Half-bridge output

CP Charge pump input

LS Low-side FET source and current sense input

COM1 IC power and signal ground

SD shutdown input

Typical external components are schematically shown in FIG. 1 . As described further below, the external components are preferably mounted on a motherboard housing the ballast control daughter card.

The ballast controller receives power from the positive rectified AC line input, which is loaded through the transformer 10 to the PFC circuit and the main control circuit. Resistor 12 allows external programming of the DC bus voltage level. Use resistor 14 to establish the overcurrent threshold. Resistor 16 establishes the run mode frequency. Preheat timing is programmed using resistor 18 and capacitor 20 . Capacitor 22 programs the ignition ramp.

Referring to Fig. 2 to Fig. 7, the mechanical structure layout of the ballast control card is shown. Figure 2 shows the top layer trace, Figure 3 shows the top solder mask, and Figure 4 shows the top silk screen layer. Figure 5 shows the bottom track layer. Figure 6 shows the bottom solder mask. Figure 7 shows a bond wire.

8 to 11 are mechanical drawings of a female ballast plate 40 in accordance with the present invention. Motherboard 40 includes through-slots 42 that receive the connection edges of ballast card 2 . FIG. 8 shows the bottom copper layer on the motherboard 40 . Figure 9 shows the topsilk screen layer showing component layout, and Figure 10 shows the bottom silkscreen layer. FIG. 11 shows a bottom solder mask for motherboard 40 .

Referring to FIG. 12, there is shown a schematic diagram of internal and external circuits for the ballast control card of the present invention. The element numbers correspond to those in the other figures, especially FIGS. 4 and 7 in which the layout of the components of the daughter card is shown. Note that the resistors labeled RVBUS 1-3 in Figure 12 correspond to resistors RBUS 1-3 in Figure 4. Also, CCOMP1 and 2 in FIG. 4 are equivalent to CCOMP in FIG. 12 . Similarly, while FIG. 12 shows two bootstrap capacitors CVCC1 and 2, FIG. 4 includes an additional capacitor CVCC3. The capacitor CBOOT and the resistor R7 marked in FIG. 12 correspond to the capacitor CBS and the resistor RLIM1 in the layout diagram of FIG. 4 respectively.

The ballast controller is built around IC50. Shown is the assignee International Rectifier Corporation's product identified by IR2167 IC. Further implementation details are available from International Rectifier Corporation's IR2167 data sheet, and in pending U.S. patent application Serial No. 09/981,753, filed October 19, 2001, both of which are incorporated in their entirety This article is used as a reference.

The ballast control card incorporates high and low side drive MOSFETs 52 and 54 and a power factor correction MOSFET (MFPC) on a single board.

Although the invention has been described in conjunction with specific embodiments thereof, it is evident to those skilled in the art that many other variations, modifications and applications will be apparent. Accordingly, the invention is preferably not limited by the specific disclosure herein, but only by the appended claims.

Claims (2)

1. An electronic ballast, comprising: a motherboard, with external components; and a daughter board having a control element capable of being programmed by said external elements to provide a DC bus voltage level, a warm-up time, and a plurality of power switching devices and a control integrated circuit for controlling the operation of said power switching devices variable setting of at least one of , preheat frequency, ignition ramp characteristics and run mode operating frequency, Wherein the sub-board is vertically installed on the motherboard and electrically connected with the motherboard. 2. The electronic ballast according to claim 1, wherein the daughter board includes an edge connector for electrical connection with the motherboard.

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