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CN100399591C - Adaptive 360-degree body-emitting white light-emitting diode - Google Patents

Adaptive 360-degree body-emitting white light-emitting diode Download PDF

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CN100399591C
CN100399591C CNB2005100346782A CN200510034678A CN100399591C CN 100399591 C CN100399591 C CN 100399591C CN B2005100346782 A CNB2005100346782 A CN B2005100346782A CN 200510034678 A CN200510034678 A CN 200510034678A CN 100399591 C CN100399591 C CN 100399591C
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CN1776923A (en
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陈建伟
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本发明提供了一种自适应360度体发光白光发光二极管,该发明解决了通过改变具360度体发光白光发光二极管在光轴上的位置,可实现360度体发光,也可实现一粒白光发光二极管,同时产生聚光光束和散对光效果。它由透明灌封胶(1)、半导体发光芯片(3)、光致发光荧光粉(5)、导线(6)、抗沉淀的透明灌封胶(7)、不带反光杯发光二极管支架(12)组成,抗沉淀的透明灌封胶(7)内均匀分布有光致发光荧光粉(5),并包覆在半导体发光芯片(3)及不带反光杯发光二极管支架(12)的外表面上;透明灌封胶(1)包覆在抗沉淀的透明灌封胶(7)的外表面上。

Figure 200510034678

The invention provides an adaptive 360-degree body-emitting white light-emitting diode, which solves the problem that by changing the position of the 360-degree body-emitting white light-emitting diode on the optical axis, 360-degree body-emitting light can be realized, and a single white light can also be realized. Light-emitting diodes, which produce spotlight beams and diffuse light effects at the same time. It consists of a transparent potting compound (1), a semiconductor light-emitting chip (3), a photoluminescence phosphor (5), a wire (6), an anti-sedimentation transparent potting compound (7), and a light-emitting diode bracket without a reflector cup ( 12) composition, anti-precipitation transparent potting glue (7) is evenly distributed with photoluminescent phosphor powder (5), and coated on the outside of the semiconductor light-emitting chip (3) and the light-emitting diode bracket (12) without reflector cup On the surface: the transparent potting compound (1) is coated on the outer surface of the precipitation-resistant transparent potting compound (7).

Figure 200510034678

Description

自适应360度体发光白光发光二极管 Adaptive 360-degree body-emitting white light-emitting diode

技术领域 technical field

本发明涉及一种光电元器件中的光致发光二极管,尤其是一种自适应360度体发光白光发光二极管。The invention relates to a photoluminescent diode in a photoelectric component, in particular to a self-adaptive 360-degree body-emitting white light emitting diode.

背景技术 Background technique

我在2004年12月3日申请发明专利:发明名称“360度体发光高光效光致发光二极管,申请号:200410052487.4,该专利实现了光致发光二极管360度体发光。该发明的发光原理,在发光二极管支架(12)上加电压,电流经导线(6),使半导体发光芯片(3)发光,而半导体发光芯片(3)具有体发光或类似体发光的特征。且“薄胶体”(由光致发光荧光粉(5)和胶体(8)构成)涂覆在透明灌封胶(1)的外表面上,半导体芯片(3)所发出的光,激发光致发光荧光粉(5),依据光的折射和反射定律,光致发光原理,以及光的混色原理。光空间混色后即可实现360度体发光。(见图1)I applied for an invention patent on December 3, 2004: the name of the invention "360-degree volume luminescence high-efficiency photoluminescent diode, application number: 200410052487.4, this patent realizes 360-degree volume luminescence of photoluminescent diodes. The light-emitting principle of this invention, Apply voltage to the light-emitting diode support (12), and the current passes through the wire (6), so that the semiconductor light-emitting chip (3) emits light, and the semiconductor light-emitting chip (3) has the characteristics of volume luminescence or similar volume luminescence. And "thin colloid" ( Composed of photoluminescent phosphor (5) and colloid (8)) coated on the outer surface of the transparent encapsulant (1), the light emitted by the semiconductor chip (3) excites the photoluminescent phosphor (5) , according to the law of refraction and reflection of light, the principle of photoluminescence, and the principle of color mixing of light. After color mixing in light space, 360-degree volume luminescence can be realized. (See Figure 1)

该专利虽然实现了360度体发光发光。但仍然存在不足,例如,它不能在同一结构中,通过改变光源在光轴上的位置分别实现:360度体发光,或者达到聚光与散光同时产生的发光效果。Although the patent realizes 360-degree volume luminescence. However, there are still deficiencies. For example, it cannot achieve 360-degree volumetric lighting by changing the position of the light source on the optical axis in the same structure, or achieve the luminous effect of concentrating light and astigmatism at the same time.

因此,我结合了,我在2004年7月15日申报的发明专利“复眼发光二极管”申请号:200410028065.3(见图7,图8),而该专利的最基本特征,就是能实现发光二极管聚光光束;它的聚光原理:发光二极管(4)所发出的光,经两处会聚[一处经发光二极管(4)灌封成型的凸透镜会聚;另一处则经反光杯(10)会聚]即可实现会聚光束。会聚光束所照射面积的大小,由发光二极管(4)在光轴(2)上的位置决定。例:若发光二极管(4)在透明灌封胶(1)成型的凸透镜的焦点上,则得到的聚光光束就小,所照射的面积同样也小;反知,据凸透镜会聚原理,发光二极管(4)处于小于焦点的位置,则得到的聚光光束就大,所照射的面积同样也大。Therefore, I combined the application number of the invention patent "light-emitting diode with compound eyes" that I declared on July 15, 2004: 200410028065.3 (see Figure 7, Figure 8), and the most basic feature of this patent is that it can realize the light-emitting diode light beam; its concentrating principle: the light emitted by the LED (4) is converged at two places [one is converged by a convex lens potted and molded by the LED (4); the other is converged by a reflective cup (10) ] to achieve a converging beam. The size of the area illuminated by the converging light beam is determined by the position of the light emitting diode (4) on the optical axis (2). Example: if the light-emitting diode (4) is on the focal point of the convex lens formed by the transparent potting compound (1), then the concentrated light beam obtained is just small, and the illuminated area is also small; (4) At a position smaller than the focal point, the resulting concentrated light beam is large, and the illuminated area is also large.

发明内容 Contents of the invention

综合上述两项发明专利的特点,我采用了新的结构,发明了“自适应360度体发光白光发出二极管”(见图2)。该发明最大的特点:通过改变“具360度体发光白光发光二极管”(9)在光轴(2)上的位置,可实现360度体发光(见图5),也可实现一粒白光发光二极管,同时产生聚光光束和散射光效果(见图4)。Combining the characteristics of the above two invention patents, I adopted a new structure and invented the "adaptive 360-degree body-emitting white light emitting diode" (see Figure 2). The biggest feature of this invention: by changing the position of the "white light emitting diode with 360-degree body light emission" (9) on the optical axis (2), 360-degree body light emission (see Figure 5) can be realized, and a white light emission can also be realized Diodes, which produce both a spotlight beam and a diffuse light effect (see Figure 4).

(一)发明的目的(1) Purpose of the invention

本发明旨在提供一种具有“自适应360度(体发光)白光发光二极管”,本发明不仅能实现360度体发光,而且能够通过改变发光光源在光轴上的位置,实现具有聚光光束与散射光同时发光的效果。该发明即能满足空间发光照明,同样也能满足特殊用途的照明,从而拓宽了白光发光二极管的应用领域。The present invention aims to provide a "adaptive 360-degree (volume emission) white light-emitting diode". The present invention can not only realize 360-degree body light emission, but also realize a spotlight beam by changing the position of the light source on the optical axis. The effect of emitting light simultaneously with scattered light. The invention can meet not only space luminous lighting, but also special-purpose lighting, thereby broadening the application field of white light emitting diodes.

(二)发明所依据的基本原理(2) The basic principle on which the invention is based

本发明所依据的基本原理:一、发光二极管芯片自身具有的发光特性为体发光或近似体发光;其二.依据光致发光的原理;其三.依据几何光学折射与反射定律;其四.依据透镜会聚原理;其五.依据了光的混色原理。The basic principles on which the present invention is based: 1. The luminescence characteristic of the LED chip itself is volume luminescence or approximate volume luminescence; 2. Based on the principle of photoluminescence; 3. Based on the law of geometrical optics refraction and reflection; 4. Based on the principle of lens convergence; Fifth, based on the color mixing principle of light.

(三)自适应360度(体发光)白光发光二极管基本构成(3) Basic composition of self-adaptive 360-degree (body-emitting) white light-emitting diodes

本发明依据上述基本原理,发明了“自适应360度(体发光)白光发光二极管”,其基本结构构成(如图2)。Based on the above basic principles, the present invention has invented an "adaptive 360-degree (volume emitting) white light emitting diode", which has a basic structure (as shown in Figure 2).

本发明由不带反光杯的发光二极管支架,半导体发光芯片,导线,透明灌封胶,光致发光荧光粉,以及抗沉淀的透明灌封胶构成。The invention is composed of a light-emitting diode bracket without a reflective cup, a semiconductor light-emitting chip, a wire, a transparent potting glue, a photoluminescent fluorescent powder, and a precipitation-resistant transparent potting glue.

抗沉淀的透明灌封胶是指:能使光致发光荧光粉在其内部均匀分布,不产生沉淀的透明灌封胶。Anti-precipitation transparent encapsulants refer to transparent encapsulants that can make photoluminescent phosphors evenly distributed inside without precipitation.

(四)自适应360度(体发光)白光发光二极管实现过程(见图2):(4) Realization process of self-adaptive 360-degree (body-emitting) white light-emitting diode (see Figure 2):

在不带反光杯发光二极管支架上固有半导体发光芯片,且两者经过导线完成电路联接。然后用抗沉淀的透明灌封胶与光致发光荧光粉调配并灌封成型,从而构成“具360度体发光白光发光二极管”(见图3)。再将“具360度体发光白光发光二极管”,用透明灌封胶灌封成型,(参见图2)。[可根据不同的需要,不同的发光要求来确定“具360度体发光白光发光二极管”在光轴上的位置(参见图4,图5)。]There is a semiconductor light-emitting chip on the light-emitting diode bracket without a reflector, and the two are connected through a wire to complete the circuit. Then, anti-precipitation transparent potting glue and photoluminescent phosphor powder are formulated and potted to form a "white light-emitting diode with 360-degree body luminescence" (see Figure 3). Then the "white light-emitting diode with 360-degree body light emission" is potted and molded with a transparent potting glue (see Figure 2). [The position on the optical axis of the "white light-emitting diode with 360-degree body-emitting light" can be determined according to different needs and different lighting requirements (see Figure 4, Figure 5). ]

(五)本发明发光机理:(5) Light-emitting mechanism of the present invention:

一)关于自适应:1) Regarding self-adaptation:

就是在同一个结构中,可以通过改变“具360度体发光白光发光二极管”在光轴上的位置,来实现不同发光效果,满足不同照明要求。(参见图4、图5、图6、图8)That is, in the same structure, it is possible to achieve different lighting effects and meet different lighting requirements by changing the position of the "360-degree body-emitting white light-emitting diode" on the optical axis. (See Figure 4, Figure 5, Figure 6, Figure 8)

二)关于360度体发光(参见图2、图3、图5)2) Regarding 360-degree volumetric lighting (see Figure 2, Figure 3, and Figure 5)

在图3中,采用了抗沉淀的透明灌封胶,则可保证光致发光荧光粉在该胶体内分布的均匀性,由于半导体发光芯片自身具有体发光的特征,因而可制得“具360度体发光白光发光二极管”。In Figure 3, the anti-precipitation transparent encapsulant is used, which can ensure the uniformity of photoluminescent phosphor distribution in the colloid. Since the semiconductor light-emitting chip itself has the characteristics of volume emission, it can be made into a "360" Body-emitting white light-emitting diodes".

在图2中,我们在光轴上移动“具360度体发光白光发光二极管”的位置,使之达至图5(即小于透明灌封胶成型的凸透镜的焦距)该光源越远离焦距,凸透镜的会聚作用越小,则散射光的角度越大;因此360度体发光的效果也就越好。(参见图2封装结构)In Figure 2, we move the position of the "360-degree body-emitting white light emitting diode" on the optical axis to make it reach Figure 5 (that is, it is smaller than the focal length of the convex lens formed by the transparent encapsulant). The farther the light source is from the focal length, the convex lens The smaller the convergence, the larger the angle of scattered light; therefore, the better the effect of 360-degree volumetric lighting. (See Figure 2 Package Structure)

三)关于聚光与散射光的发光(参见图2、图3、图4)3) About the luminescence of concentrated light and scattered light (see Figure 2, Figure 3, Figure 4)

在图2中,同样我们在光轴上移动“具360度体发光白光发光二极管”的位置,使之达至图4(即等于透明灌封胶成型的凸透镜的焦距)则该光源中一部分光经凸透镜会聚后延光轴方向以聚光形式发射;而其它部分的光则以散射光形式向四周发射,从而实现聚光与散射光同时产生的发光效果。In Figure 2, we also move the position of the "360-degree body-emitting white light emitting diode" on the optical axis to make it reach Figure 4 (that is, equal to the focal length of the convex lens formed by the transparent encapsulant), then a part of the light in the light source After being converged by the convex lens, it is emitted in the form of concentrated light along the direction of the optical axis; while the other part of the light is emitted to the surroundings in the form of scattered light, so as to achieve the luminous effect of both concentrated light and scattered light.

自适应360度体发光白光发光二极管适用于由紫光、兰光激发光致发光荧光粉发出复合光,激发光源波长260nm~480nm。The self-adaptive 360-degree body-emitting white light-emitting diode is suitable for emitting composite light from photoluminescent phosphors excited by purple light and blue light, and the wavelength of the excitation light source is 260nm-480nm.

附图说明 Description of drawings

下面结合附图及实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

图1是现有360度体发光高光效光致发光二极管示意图;Fig. 1 is a schematic diagram of an existing 360-degree volume luminous high-efficiency photoluminescent diode;

图2是本实施例示意图;Fig. 2 is a schematic diagram of the present embodiment;

图3是本实施例具360度体发光白光发光二极管;Fig. 3 is a 360-degree body-emitting white light-emitting diode in this embodiment;

图4是本实施例实现“聚光与散射光同时发光的”示意图;Fig. 4 is a schematic diagram of realizing "concentrating light and scattering light simultaneously" in this embodiment;

图5是本实施例实现“360度体发光”示意图;Fig. 5 is a schematic diagram of realizing "360-degree volumetric lighting" in this embodiment;

图6是本实施例应用举例示意图;FIG. 6 is a schematic diagram of an application example of this embodiment;

图7是“复眼发光二极管”示意图;Fig. 7 is a schematic diagram of "compound eye light-emitting diode";

图8是“复眼发光二极管”实现组合光源示意图。Fig. 8 is a schematic diagram of the combined light source realized by the "fly-eye light-emitting diode".

图中:1.透明灌封胶;2.光轴;3.半导体发光芯片;4.普通发光二极管;5.光致发光荧光粉;6.导线;7.抗沉淀的透明灌封胶;8.胶体;9.具360度体发光白光发光二极管;10.反光碗;11.自适应360度体发光白光发光二极管;12.不带反光杯发光二极管支架。In the figure: 1. Transparent potting compound; 2. Optical axis; 3. Semiconductor light-emitting chip; 4. Ordinary light-emitting diode; .Colloid; 9. 360-degree body-emitting white light-emitting diode; 10. Reflective bowl; 11. Self-adaptive 360-degree body-emitting white light-emitting diode; 12. LED bracket without reflective cup.

具体实施方式 Detailed ways

参照图2,本实施例由透明灌封胶(1)、半导体发光芯片(3)、光致发光荧光粉(5)、导线(6)、抗沉淀的透明灌封胶(7)、不带反光杯发光二极管支架(12)组成。Referring to Figure 2, this embodiment consists of a transparent potting compound (1), a semiconductor light-emitting chip (3), a photoluminescence phosphor (5), a wire (6), an anti-precipitation transparent potting compound (7), without Reflector cup light-emitting diode support (12) is formed.

首先,将半导体发光芯片(3)固定在不带反光杯发光二极管支架(12)上,用导线(6)实现电路联接,然后将抗沉淀的透明灌封胶(7)与光致发光荧光粉(5)混合调配,搅拌均匀,脱气后,制成“具360度体发光白光发光二极管”(9)。(参见图3)First, the semiconductor light-emitting chip (3) is fixed on the light-emitting diode bracket (12) without a reflector cup, and the circuit connection is realized with a wire (6), and then the anti-precipitation transparent potting glue (7) and the photoluminescent phosphor (5) Mix and prepare, stir evenly, and after degassing, make a "white light-emitting diode with 360-degree volumetric light emission" (9). (see Figure 3)

然后将“具360度体发光白光发光二极管(9)”与透明灌封胶(1)制成“自适应360度体发光白光发光二极管”(11),制造过程按传统封装工艺,但需要注意的是“具360度体发光白光发光二极管(9)”在光轴(2)上的位置,决定了自适应360度体发光白光发光二极管的发光效果,例如:当“具360度体发光白光发光二极管,”在光轴上的位置等于由透明灌封胶(1)成型的凸透镜的焦距时,“自适应360度体发光白光发光二极管”的发光效果,就产生聚光与散射光;(参见图4),如果小于焦距时,自适应360度体发光白光发光二极管的发光效果,就产生“360度体发光”(参见图5)Then "360-degree body-emitting white light-emitting diode (9)" and transparent potting compound (1) are made into "adaptive 360-degree body-emitting white light-emitting diode" (11). The manufacturing process follows the traditional packaging process, but attention should be paid It is the position of the "white light emitting diode with 360-degree volume emission (9)" on the optical axis (2), which determines the luminous effect of the white light emitting diode with self-adaptive 360-degree volume emission. For example: when the "white light emitting diode with 360-degree volume emission When the position on the optical axis of the "light-emitting diode" is equal to the focal length of the convex lens formed by the transparent potting compound (1), the light-emitting effect of the "adaptive 360-degree body-emitting white light-emitting diode" will produce concentrated light and scattered light; ( See Figure 4), if it is less than the focal length, the luminous effect of the adaptive 360-degree volume luminous white light-emitting diode will produce "360-degree volume luminescence" (see Figure 5)

(一)封装“自适应360度体发光白光发光二极管”制作实例。(1) An example of encapsulating "adaptive 360-degree body-emitting white light-emitting diodes".

我们将抗沉淀的透明灌封胶(7)的材料选用硅胶;将光致发光荧光粉(5)选用YAG荧光粉,实现了“YAG荧光粉”在该胶体内均匀分布,且不沉淀,并制得了“具360度体发光白光发光二极管(9)”,在制造“自适应360度体发光白光发光二极管”的过程中,我们将透明灌封胶(1)的材料选用透明环氧AB胶,并按“具体实施方式”中要求,分别制得“自适应360度体发光白光发光二极管”的两种发光效果,即“聚光与散射光”的发光效果;“360度体发光”的发光效果。We use silica gel as the material of the anti-precipitation transparent potting glue (7); use YAG phosphor as the photoluminescent phosphor (5), so that the "YAG phosphor" is evenly distributed in the colloid without precipitation and The "white light-emitting diode with 360-degree volume luminescence (9)" was prepared. In the process of manufacturing the "adaptive 360-degree volume luminescence white light-emitting diode", we used transparent epoxy AB glue as the material of the transparent potting glue (1) , and according to the requirements in the "Specific Implementation Mode", two kinds of luminous effects of "adaptive 360-degree volume luminescence white light-emitting diodes" are respectively obtained, that is, the luminous effects of "concentrating light and scattered light"; the "360-degree volume luminescence" glow effect.

(二)“自适应360度体发光白光发光二极管”应用举例。(2) Application example of "adaptive 360-degree body-emitting white light-emitting diode".

我们将制成的“自适应360度体发光白光发光二极管”(其发光效果为“聚光与散射光”),用反光碗(10)进行会聚(见图6),其结果在光轴上获得了一束聚光照射距离远,聚光性好的光斑,并且在该光斑的周围形成了大面积的散射光,该现象的发现,对拓宽白光发光二极管的应用领域是十分有宜的,它可以应用于发光二极管手电筒,矿灯,以及汽车前大灯等等。The "adaptive 360-degree volume luminescent white light emitting diode" (its luminous effect is "light concentrating and scattered light") that we will make is converged (see Fig. 6) with a reflective bowl (10), and the result is on the optical axis Obtained a beam of concentrated light with long irradiation distance and good light spot, and formed a large area of scattered light around the light spot. The discovery of this phenomenon is very beneficial to broaden the application field of white light emitting diodes. It can be applied to LED flashlights, miner's lamps, and car headlights, etc.

Claims (3)

1.一种自适应360度体发光白光发光二极管,它由透明灌封胶(1)、半导体发光芯片(3)、光致发光荧光粉(5)、导线(6)、抗沉淀的透明灌封胶(7)、不带反光杯发光二极管支架(12)组成;其特征在于:1. An adaptive 360-degree body-emitting white light-emitting diode, which consists of a transparent potting compound (1), a semiconductor light-emitting chip (3), a photoluminescence phosphor (5), a wire (6), and a precipitation-resistant transparent potting It is composed of sealing glue (7), light-emitting diode bracket (12) without reflector cup; it is characterized in that: 抗沉淀的透明灌封胶(7)内均匀分布有光致发光荧光粉(5);Photoluminescent phosphor powder (5) is evenly distributed in the anti-precipitation transparent encapsulant (7); 抗沉淀的透明灌封胶(7)包覆在半导体发光芯片(3)及不带反光杯发光二极管支架(12)的外表面上;The anti-precipitation transparent potting glue (7) is coated on the outer surface of the semiconductor light-emitting chip (3) and the light-emitting diode bracket (12) without reflector cup; 透明灌封胶(1)包覆在抗沉淀的透明灌封胶(7)的外表面上。The transparent encapsulant (1) is coated on the outer surface of the precipitation-resistant transparent encapsulant (7). 2.根据权利要求1所述的自适应360度体发光白光发光二极管,其特征还在于:半导体发光芯片(3)适用于光波波长为260nm-480nm的紫光、兰光半导体发光芯片。2. The self-adaptive 360-degree body-emitting white light-emitting diode according to claim 1, further characterized in that: the semiconductor light-emitting chip (3) is suitable for purple light and blue light semiconductor light-emitting chips with light wavelengths of 260nm-480nm. 3.根据权利要求1所述的自适应360度体发光白光发光二极管,其特征还在于:适用于以半导体发光芯片为激发能量源,激发光致发光荧光粉所形成的复合光。3. The self-adaptive 360-degree body-emitting white light-emitting diode according to claim 1, further characterized in that it is suitable for using semiconductor light-emitting chips as excitation energy sources to excite composite light formed by photoluminescence phosphors.
CNB2005100346782A 2005-05-24 2005-05-24 Adaptive 360-degree body-emitting white light-emitting diode Expired - Fee Related CN100399591C (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223749A (en) * 1999-01-29 2000-08-11 Seiwa Electric Mfg Co Ltd Light emitting diode lamp, method for manufacturing the same, chip type light emitting diode element and dot matrix type light emitting diode unit
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
CN1156029C (en) * 1996-09-20 2004-06-30 西门子公司 Wavelength conversion filler and application thereof
CN1614793A (en) * 2004-07-15 2005-05-11 陈建伟 Compound eye LEDs

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
CN1156029C (en) * 1996-09-20 2004-06-30 西门子公司 Wavelength conversion filler and application thereof
JP2000223749A (en) * 1999-01-29 2000-08-11 Seiwa Electric Mfg Co Ltd Light emitting diode lamp, method for manufacturing the same, chip type light emitting diode element and dot matrix type light emitting diode unit
CN1614793A (en) * 2004-07-15 2005-05-11 陈建伟 Compound eye LEDs

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