CN100387351C - Particle grinding device - Google Patents
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- CN100387351C CN100387351C CNB031496288A CN03149628A CN100387351C CN 100387351 C CN100387351 C CN 100387351C CN B031496288 A CNB031496288 A CN B031496288A CN 03149628 A CN03149628 A CN 03149628A CN 100387351 C CN100387351 C CN 100387351C
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Abstract
Description
技术领域 technical field
本发明是关于一种微粒研磨装置,特别是关于一种微粒研磨装置之分离结构。The invention relates to a particle grinding device, in particular to a separation structure of the particle grinding device.
背景技术 Background technique
在众多纳米微粒制造方法中,湿式研磨分散方法和设备具有成本低、产量大以及操作容易等优点。湿式研磨装置是以机械力量带动原料粒子和高硬度的研磨介质产生碰撞,使其产生高能量密度的撞击及剪切力将微粒微细化。即是将粒子和研磨分散介质一起引进研磨机中,透过研磨液加以湿润,再以叶片或是其它机械装置来搅动原料颗粒与研磨介质,使其于非常高的速度下互相碰撞来产生研磨的效果;透过某一分离结构使研磨至某一程度的颗粒可以与研磨介质分离而随液体流出到粉体收集处。Among the many nanoparticle manufacturing methods, the wet grinding and dispersing method and equipment have the advantages of low cost, large output and easy operation. The wet grinding device uses mechanical force to drive the raw material particles to collide with the high-hardness grinding medium, so that it produces high-energy-density impact and shear force to make the particles finer. That is, the particles and the grinding dispersion medium are introduced into the grinding machine together, wetted by the grinding liquid, and then the raw material particles and the grinding medium are stirred with blades or other mechanical devices, so that they collide with each other at a very high speed to produce grinding The effect; through a certain separation structure, the particles that are ground to a certain extent can be separated from the grinding medium and flow out to the powder collection place with the liquid.
一般的研磨装置的分离结构多使用间隙、叶片或是筛网等结构来分离研磨介质与粒子。为求得到较小的微粒粒径,着力于使用颗粒较小的研磨介质,故须尽量缩小间隙、叶片或是筛网的筛滤孔隙,但也因此容易造成阻塞而产生背压,影响生产效率。所以为避免阻塞又需采用减少背压增加流动量的设计,惟增加流动量和缩小筛滤孔隙两者互相矛盾。The separation structure of general grinding devices often uses structures such as gaps, blades or screens to separate grinding media and particles. In order to obtain a smaller particle size, focus on the use of grinding media with smaller particles, so it is necessary to minimize the gap, the sieve pores of the blades or the screen, but it is also easy to cause clogging and back pressure, which affects production efficiency . Therefore, in order to avoid clogging, it is necessary to adopt a design that reduces the back pressure and increases the flow rate, but increasing the flow rate and reducing the sieve pores are contradictory.
如美国第5620147号专利案,即是透过微米级的筛网使最后研磨完成的微粒与研磨介质分离。然而,由于研磨介质本身的粒子亦相当微细,容易对筛网的孔隙造成阻塞及磨耗;进而影响到筛网的分离效果。或者是如美国第5346145号专利案,则是利用微小的间隙来作为研磨装置的出料口,使研磨达到标准的粒子才得以通过。同样的,研磨介质也容易在其间隙出料口处造成磨耗和堵塞,而产生不良的影响。此外,使用机械式筛选方式受限于机械结构本身的孔径大小,而无法达到更细的研磨粒径。For example, the U.S. Patent No. 5,620,147 uses a micron-sized sieve to separate the final ground particles from the grinding media. However, since the particles of the grinding medium itself are quite fine, it is easy to cause blockage and wear to the pores of the screen, thereby affecting the separation effect of the screen. Or, as in U.S. Patent No. 5,346,145, a small gap is used as the discharge port of the grinding device, so that the particles that have been ground to the standard can pass through. Similarly, the grinding medium is also easy to cause wear and blockage at the discharge port of the gap, which will have adverse effects. In addition, the use of mechanical screening is limited by the pore size of the mechanical structure itself, and cannot achieve a finer grinding particle size.
又如中国台湾第451750号专利,以数片盘状的筛滤片层叠构成筛滤装置。通过任两个相邻的筛滤片之间所产生的缝隙,来分离研磨完成的微粒与研磨介质。盘状之筛滤片构成一旋转筛网,缝隙间无相对运动产生,如此用以分离微粒之缝隙易造成堵塞和磨损。Another example is the Chinese Taiwan No. 451750 patent, which forms a sieve device by stacking several disk-shaped sieve filters. Through the gap created between any two adjacent sieves, the ground particles and grinding media are separated. The disc-shaped sieve filter forms a rotating screen, and there is no relative movement between the gaps, so the gaps used to separate particles are prone to blockage and wear.
因此未来技术发展需以增加流动量并可使用较小研磨介质为目标来设计,另外,原料粒子和高硬度的研磨介质产生碰撞将随之发生放热情形,为使其产生高能量密度的研磨,需加强研磨设备之冷却和散热设计。Therefore, future technology development needs to be designed with the goal of increasing the flow rate and using smaller grinding media. In addition, the collision between raw material particles and high-hardness grinding media will cause heat release. In order to produce high-energy-density grinding , It is necessary to strengthen the cooling and heat dissipation design of the grinding equipment.
发明内容 Contents of the invention
为改掉现有技术的缺点,本发明提供一种微粒研磨装置,其特征在于用以分离微粒和研磨介质的分离结构设计,由两组交错之同轴叶片所组成,邻接之外围叶片和内圈叶片间形成一缝隙,而使研磨完成的微粒得以通过其缝隙之后加以收集。In order to get rid of the shortcomings of the prior art, the present invention provides a particle grinding device, which is characterized in that the separation structure design for separating particles and grinding media is composed of two sets of staggered coaxial blades, and the adjacent peripheral blades and inner blades A gap is formed between the ring blades, so that the ground particles can be collected after passing through the gap.
本发明之微粒研磨装置设有一研磨槽,研磨槽内充填适当的研磨液,并加入原料颗粒与研磨介质,再以分散叶片来搅动,使其于非常高的速度下互相碰撞来产生研磨的效果;并透过设于研磨槽内的分离结构使研磨至某一程度的颗粒可以与研磨介质分离而排出。其分离结构由两组交错之同轴叶片所组成,相邻之外围叶片边缘和内圈叶片边缘间形成一缝隙以作为微粒的筛选机制,其内圈叶片之边缘部分高于内侧之环状部分,使外围叶片相邻于内圈叶片内侧环状部分的间隔大于缝隙,且环状部分设有复数个导孔。使微粒一旦尺寸够小足以通过缝隙,即可快速进入较大的间隔并由导孔流出。由于微粒通过缝隙的时间很短即进入内圈叶片内侧环状部分的间隔流出,因此可以有效避免微粒阻塞来减少背压并增加流动量。The particle grinding device of the present invention is provided with a grinding tank, and the grinding tank is filled with appropriate grinding liquid, and raw material particles and grinding media are added, and then stirred by dispersing blades, so that they collide with each other at a very high speed to produce a grinding effect ; And through the separation structure set in the grinding tank, the particles that have been ground to a certain extent can be separated from the grinding media and discharged. Its separation structure is composed of two sets of staggered coaxial blades. A gap is formed between the edge of the adjacent peripheral blade and the edge of the inner ring blade as a screening mechanism for particles. The edge part of the inner ring blade is higher than the inner ring part , the distance between the peripheral blade and the inner annular portion of the inner ring blade is greater than the gap, and the annular portion is provided with a plurality of guide holes. Once the particle size is small enough to pass through the gap, it can quickly enter the larger gap and flow out through the guide hole. Because the time for the particles to pass through the gap is very short, that is, they enter the inner annular part of the inner ring blade and flow out, so it can effectively avoid particle blockage, reduce the back pressure and increase the flow rate.
此外,为了能够提升微粒研磨装置的散热性能,本发明更包含冷却流道设计,于研磨槽的外围制作螺旋状的冷却流道。同时为带走内圈叶片和研磨介质或微粒碰撞所产生的热量,亦可将内圈叶片之转轴轴心的内部挖空注入冷却液体,作为轴心冷却流道。In addition, in order to improve the heat dissipation performance of the particle grinding device, the present invention further includes a cooling channel design, and a spiral cooling channel is formed on the periphery of the grinding tank. At the same time, in order to take away the heat generated by the collision between the inner ring blades and the grinding medium or particles, the inside of the shaft center of the inner ring blades can also be hollowed out and injected with cooling liquid as a cooling channel for the shaft center.
附图说明 Description of drawings
图1为本发明实施例之分离结构的示意图;Fig. 1 is the schematic diagram of the separation structure of the embodiment of the present invention;
图1A为本发明实施例之筛选机制示意图;Figure 1A is a schematic diagram of the screening mechanism of the embodiment of the present invention;
图2为本发明实施例之内圈叶片形状示意图;Fig. 2 is a schematic diagram of the shape of the inner ring blade of the embodiment of the present invention;
图3为本发明实施例之微粒研磨装置示意图;及Figure 3 is a schematic diagram of a particle grinding device according to an embodiment of the present invention; and
图4为本发明实施例之转轴的间接传动示意图。图中Fig. 4 is a schematic diagram of the indirect transmission of the rotating shaft according to the embodiment of the present invention. in the picture
100 分离结构 110 外围叶片100
120 内圈叶片 121 导孔120
130 固定件 140 垫圈130
150 转轴轴心 151 轴心冷却流道150 Shaft
200 研磨槽 210 分散叶片200
220 螺旋状冷却流道 230 进料口220 Spiral Cooling Channel 230 Feed Port
240 传动皮带轮 300 马达240
310 皮带 320 转动皮带轮310
具体实施方式 Detailed ways
请参考图1,其为本发明实施例之分离结构的示意图。分离结构100包含一组外围叶片110与一组内圈叶片120,外围叶片110成一环状,其具有对应之复数个贯穿孔,以提供固定件130穿置来固定复数个外围叶片110,同时其固定件130通过每一外围叶片110同时贯穿一垫圈140,使外围叶片110两两之间可维持适当的间距以容置一内圈叶片120。每一内圈叶片120以适当的间距固定于转轴轴心150以带动内圈叶片120旋转,使内圈叶片120两两之间可维持适当的间距以容置一外围叶片110,使外围叶片110与内圈叶片120成为同轴交错。内圈叶片120相对外围叶片110旋转,相邻之外围叶片110边缘和内圈叶片120边缘间形成一缝隙,微粒由箭头方向进入缝隙所形成之筛选机制。请参考图1A,其为本发明实施例之筛选机制示意图。内圈叶片120之边缘与外围叶片之间成一微缝隙,并且其内圈叶片120之边缘部分突起高于内侧,使外围叶片110与相邻之内圈叶片120内侧的间隔大于两者之间边缘部分的缝隙,微粒需研磨至小于缝隙的尺寸才得以通过。Please refer to FIG. 1 , which is a schematic diagram of a separation structure of an embodiment of the present invention. The
请参考图2,其为本发明实施例之内圈叶片形状示意图。且内圈叶片120之边缘部分高于内侧之环状部分,内圈叶片120内侧环状部分设有复数个导孔121,使得尺寸足以通过缝隙之微粒,可快速进入较大的间隔并由导孔121流出而被分离。Please refer to FIG. 2 , which is a schematic diagram of the shape of the inner ring vane according to an embodiment of the present invention. And the edge portion of the
上述之分离结构需结合至微粒研磨装置,请参考图3,其为本发明实施例之微粒研磨装置示意图,设有一研磨槽200,于研磨槽200内充填适当的研磨液,并加入研磨介质和原料颗粒,再以分散叶片210搅动,产生碰撞而将原料颗粒研磨成微粒。其分离结构100设于研磨槽200,以使微粒与研磨介质分离并排出。原料颗粒由进料口230进入研磨槽200之后,先经分散叶片210搅拌产生碰撞,当原料颗粒形成尺寸足以通过缝隙之微粒,可快速经由外围叶片110通过缝隙,进入内圈叶片120之间隔并由导孔流出而被分离。于研磨槽200的外围并设有螺旋状冷却流道220以降低研磨槽200的温度,同时为带走内圈叶片120和研磨介质或微粒碰撞所产生的热量,亦将内圈叶片120之转轴轴心150的内部挖空注入冷却液体,作为轴心冷却流道151。另外,为维持内圈叶片120旋转之轴心准度,以间接传动方式经由传动皮带轮240来带动内圈叶片120的转轴轴心150。The above-mentioned separation structure needs to be combined with a particle grinding device, please refer to Fig. 3, which is a schematic diagram of a particle grinding device according to an embodiment of the present invention. A
请参考图4,其为本发明实施例之转轴的间接传动示意图。以外部转动马达300作为主动之转动组件,并以皮带310连接马达300的转动皮带轮320和研磨装置的内圈叶片转轴之传动皮带轮240,通过马达300转动以间接传动方式经由传动皮带轮240来带动内圈叶片的转轴轴心,以间接传动来控制转轴的转动情形可避免转轴产生角度的偏移。Please refer to FIG. 4 , which is a schematic diagram of the indirect transmission of the rotating shaft according to the embodiment of the present invention. The external
虽然本发明之较佳实施例揭露如上所述,然其并非用以限定本发明,任何熟习相关技术者,在不脱离本发明之精神和范围内,当可做些许改动与润饰,因此本发明之专利保护范围须视本说明书所附之申请专利范围所界定为准。Although the preferred embodiment of the present invention is disclosed as above, it is not intended to limit the present invention. Anyone who is familiar with the related art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection shall be defined in the scope of patent application attached to this manual.
Claims (7)
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CNB031496288A CN100387351C (en) | 2003-08-01 | 2003-08-01 | Particle grinding device |
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CN107755018A (en) * | 2017-11-23 | 2018-03-06 | 恩平市弘彩数码科技有限公司 | A kind of nano-level grinder gap separator |
CN109909038B (en) * | 2019-01-29 | 2024-04-16 | 浙江工业大学之江学院 | Cavitation smashing device for inorganic fine particles |
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US5346145A (en) * | 1991-12-13 | 1994-09-13 | Inoue Mfg., Inc. | Dispersing and grinding apparatus |
US5620147A (en) * | 1995-10-04 | 1997-04-15 | Epworth Manufacturing Co., Inc. | Continuous media mill |
US5630557A (en) * | 1994-12-31 | 1997-05-20 | Omya Gmbh | Stirring bead mill with separator to strain out grinding beads |
JPH10113568A (en) * | 1996-10-08 | 1998-05-06 | Aimetsukusu Kk | Horizontal wet type mill |
CN2441560Y (en) * | 2000-08-07 | 2001-08-08 | 三尹实业有限公司 | Sand Mill Screening Device |
CN1307934A (en) * | 2001-02-12 | 2001-08-15 | 宜兴市洪流集团公司 | Improved sand mill |
CN1345257A (en) * | 1999-03-17 | 2002-04-17 | 科尔公司 | Agitator mill and method of use for low contamination grinding |
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2003
- 2003-08-01 CN CNB031496288A patent/CN100387351C/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5346145A (en) * | 1991-12-13 | 1994-09-13 | Inoue Mfg., Inc. | Dispersing and grinding apparatus |
US5630557A (en) * | 1994-12-31 | 1997-05-20 | Omya Gmbh | Stirring bead mill with separator to strain out grinding beads |
US5620147A (en) * | 1995-10-04 | 1997-04-15 | Epworth Manufacturing Co., Inc. | Continuous media mill |
JPH10113568A (en) * | 1996-10-08 | 1998-05-06 | Aimetsukusu Kk | Horizontal wet type mill |
CN1345257A (en) * | 1999-03-17 | 2002-04-17 | 科尔公司 | Agitator mill and method of use for low contamination grinding |
CN2441560Y (en) * | 2000-08-07 | 2001-08-08 | 三尹实业有限公司 | Sand Mill Screening Device |
CN1307934A (en) * | 2001-02-12 | 2001-08-15 | 宜兴市洪流集团公司 | Improved sand mill |
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