CN109994416A - Blue film, blue film strips and production method - Google Patents
Blue film, blue film strips and production method Download PDFInfo
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- CN109994416A CN109994416A CN201910291368.0A CN201910291368A CN109994416A CN 109994416 A CN109994416 A CN 109994416A CN 201910291368 A CN201910291368 A CN 201910291368A CN 109994416 A CN109994416 A CN 109994416A
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- resin layer
- line
- blue
- glue
- iron ring
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- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 117
- 229920005989 resin Polymers 0.000 claims abstract description 117
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 72
- 241001062009 Indigofera Species 0.000 claims abstract description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 22
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
This disclosure relates to blue film, blue film strips and production method.According to one aspect of the disclosure, a kind of blue film is provided, comprising: resin layer, the resin layer has the first side and second side, and the resin layer has viscosity；Blue glue-line, the indigo plant glue-line covers the first side of the resin layer, and the side of the blue glue-line is connected to the first side of the resin layer；Counterdie, the counterdie cover second side of the resin layer, and the viscosity of the resin layer makes second side of counterdie and the resin layer detachably connected；Wherein the resin layer and the blue glue-line are dimensioned to match with the size of iron ring and wafer, so that the resin layer and the indigo plant glue-line are capable of fixing iron ring and wafer without cutting blue glue-line when the other side of the blue glue-line is attached to iron ring and wafer.
Description
Technical field
This disclosure relates to semiconductor fabrication process, more particularly, to for indigo plant film used in semiconductor fabrication process.
Background technique
Nowadays semiconductor technologies are showing improvement or progress day by day, and the size of semiconductor chip is smaller and smaller.In basic semiconductors manufacture work
Monocrystalline silicon growth, crystal bar cutting, crystal column surface polishing and oxidation processes, shaped electrode, wafer cutting are comprised the steps of: in skill
Etc..It before wafer cutting, needs to fix wafer and iron ring using blue film, then passes through wafer cutting step for wafer
It is cut into the chip of multiple fritters.Cutting can be used ultraviolet light and reduce the viscosity of blue membrane adhesive tape after completing, with
The chip of the fritter of well cutting is taken out, subsequent encapsulation step is used for.
In semiconductor fabrication process, there is the demand improved to blue film.
Summary of the invention
According to one aspect of the disclosure, a kind of blue film is provided characterized by comprising resin layer, the resin layer
With the first side and second side, and the resin layer has viscosity；Blue glue-line, the indigo plant glue-line cover the of the resin layer
Side, and the side of the blue glue-line is connected to the first side of the resin layer；Counterdie, the counterdie cover the resin layer
Second side, the viscosity of the resin layer makes second side of counterdie and the resin layer detachably connected；The wherein tree
Rouge layer and the blue glue-line are dimensioned to match with the size of iron ring and wafer, so that when the other side of the indigo plant glue-line is attached
The resin layer and the blue glue-line are capable of fixing iron ring and wafer without cutting blue glue-line when being connected to iron ring and wafer.
According to one aspect of the disclosure, the counterdie energy when the other side of the blue glue-line is attached to iron ring and wafer
It is enough to be dismantled from second side of the resin layer.
According to one aspect of the disclosure, the resin layer and the blue glue-line are designed to round, and the resin
The diameter design of layer and the blue glue-line is less than the overall diameter of iron ring at the interior diameter for being greater than iron ring.
According to one aspect of the disclosure, the size for being dimensioned so as to be equal to the blue glue-line of the resin layer.
According to one aspect of the disclosure, the size of the counterdie be greater than the size of the resin layer and the blue glue-line with
It can be dismantled from second side of the resin layer convenient for the counterdie.
According to one aspect of the disclosure, the resin layer increases the blue film to the support force of wafer.
According to one aspect of the disclosure, the resin layer is transparent.
According to one aspect of the disclosure, a kind of method for making blue film is provided, comprising the following steps: apply on counterdie
Resin layer is covered, there is the resin layer viscosity counterdie is separated from the resin layer；It is coated on the resin layer blue
Glue-line；Wherein the resin layer and the blue glue-line are dimensioned to match with the size of iron ring and wafer, so that described in
Blue glue-line when being attached to iron ring and wafer the resin layer and the blue glue-line be capable of fixing iron ring and wafer without cutting indigo plant
Glue-line.
According to one aspect of the disclosure, the resin layer and the blue glue-line are designed to round, and the resin
The diameter design of layer and the blue glue-line is less than the overall diameter of iron ring at the interior diameter for being greater than iron ring.
According to one aspect of the disclosure, the size for being dimensioned so as to be equal to the blue glue-line of the resin layer.
According to one aspect of the disclosure, the size of the counterdie be greater than the size of the resin layer and the blue glue-line with
It can be separated from the resin layer convenient for the counterdie.
According to one aspect of the disclosure, a kind of blue film strips are provided, comprising: two or more any indigo plants above-mentioned
Film；Interconnecting piece, for being connected with each other the two or more blue films in a manner of removably；Support portion is connected by interconnecting piece
The two or more blue films connect are wrapped on the support portion by circumference to be stored, when used by making to support
Portion's rotation obtains single blue film for pasting in iron ring and iron ring to take out blue film strips, and by separation interconnecting piece
Wafer.
According to one aspect of the disclosure, interconnecting piece includes the notch between the counterdie of blue film, by tearing along notch
Blue film strips obtain single blue film.
By the detailed description referring to the drawings to the exemplary embodiment of the disclosure, the other feature of the disclosure and its
Advantage will become apparent.
Detailed description of the invention
Attached drawing constitutes part of specification, shows some embodiments of the present disclosure, and use together with the description
In the principle for explaining the disclosure.According to detailed description with reference to the accompanying drawings, the disclosure can be more clearly understood, in attached drawing
In:
Figure 1A, Figure 1B and Fig. 1 C show blue film in the prior art and its use.
Fig. 2 shows the exploded views of the structure of blue film according to an embodiment of the invention.
Fig. 3 A, Fig. 3 B show blue film according to an embodiment of the invention and its use.
Fig. 4 shows the method flow diagram according to an embodiment of the invention for making blue film.
Fig. 5 shows blue film strips according to an embodiment of the invention.
Note that same appended drawing reference is used in conjunction between different attached drawings sometimes in embodiments described below
It indicates same section or part with the same function, and omits its repeated explanation.In the present specification, using similar mark
Number and letter indicate similar terms, therefore, once being defined in a certain Xiang Yi attached drawing, then do not needed in subsequent attached drawing pair
It is further discussed.
In order to make it easy to understand, position, size and range of each structure shown in attached drawing etc. etc. do not indicate practical sometimes
Position, size and range etc..Therefore, disclosed invention is not limited to position, size and range disclosed in attached drawing etc. etc..
Specific embodiment
The various exemplary embodiments of the disclosure are described in detail now with reference to attached drawing.It should be noted that unless in addition specific
Illustrate, unlimited this public affairs of system of component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments
The range opened.In addition, technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail,
But in the appropriate case, the technology, method and apparatus should be considered as authorizing part of specification.
In the word "front", "rear" in specification and claim, "top", "bottom", " on ", " under " etc., if deposited
If, it is not necessarily used to describe constant relative position for descriptive purposes.It should be appreciated that the word used in this way
Language be in appropriate circumstances it is interchangeable so that embodiment of the disclosure described herein, for example, can in this institute
It is operated in those of description show or other other different orientations of orientation.
Any implementation of this exemplary description be not necessarily to be interpreted it is more preferred than other implementations or
It is advantageous.Moreover, the disclosure is not gone out by given in above-mentioned technical field, background technique, summary of the invention or specific embodiment
Theory that is any stated or being implied limited.
In addition, middle certain term of use can also be described below, and thus not anticipate just to the purpose of reference
Figure limits.For example, unless clearly indicated by the context, be otherwise related to the word " first " of structure or element, " second " and it is other this
Class number word does not imply order or sequence.
It should also be understood that one word of "comprises/comprising" as used herein, illustrates that there are pointed feature, entirety, steps
Suddenly, operation, unit and/or component, but it is not excluded that in the presence of or increase one or more of the other feature, entirety, step, behaviour
Work, unit and/or component and/or their combination.
The description of at least one exemplary embodiment is merely illustrative below, is not to the disclosure and its application
Or any restrictions used.
Figure 1A, Figure 1B and Fig. 1 C show blue film in the prior art and its use.
Figure 1A is shown needs fixed iron ring 101 and wafer 102 during wafer-process, and it is solid that needs are shown
The top view and longitudinal sectional drawing of fixed iron ring and wafer.As described in Figure, wafer 102 is located in iron ring 101.
The blue film that Figure 1B shows the prior art is covered to the side of iron ring 101 and wafer 102, and blade 104 is located at blue film
Position corresponding with iron ring 101 on 103, for cutting away the extra part of blue film 103.Wherein, it shows corresponding with Figure 1A
The iron ring for being covered with blue film and wafer top view and longitudinal sectional drawing.
Fig. 1 C, which shows blade, to be formed by the wafer and iron ring fixed after the redundance excision of blue film.Its
In, it shows after extra blue film corresponding with Figure 1A and Figure 1B is removed and is formed by bowing for the iron ring and wafer fixed
View and longitudinal sectional drawing.As shown in figure 3, extra blue film forms blue film 103 ' after cutting after being removed.
The inventor of the present application discovered that blue film clast can be generated during cutting off extra blue film using blade, this
A little clasts will affect the progress of Subsequent semiconductor manufacturing process, increase non-controllable risk, or must not generate without cleaning
Step, and increase cost.
This application provides a kind of blue films characterized by comprising resin layer, the resin layer have the first side and the
Two sides, and the resin layer has viscosity；Blue glue-line, the indigo plant glue-line cover the first side of the resin layer, and described
The side of blue glue-line is connected to the first side of the resin layer；Counterdie, the counterdie covers second side of the resin layer, described
The viscosity of resin layer makes second side of counterdie and the resin layer detachably connected；The wherein resin layer and the blue glue
Layer is dimensioned to match with the size of iron ring and wafer, so that when the other side of the blue glue-line is attached to iron ring and wafer
Shi Suoshu resin layer and the blue glue-line are capable of fixing iron ring and wafer without cutting blue glue-line.It is another when the blue glue-line
Side is attached to counterdie when iron ring and wafer and can dismantle from second side of the resin layer.
Fig. 2 shows the exploded views of the structure of blue film according to an embodiment of the invention.
In the embodiment of fig. 2, the structure of blue film 200 is from top to bottom blue glue-line 201, resin layer 202 and bottom respectively
Film 203.
Resin layer 202 has the first side 202a and second side 202b, and resin layer 202 has viscosity.Blue glue-line 201 covers
First side 202a of lid resin layer 202, and the side of blue glue-line 201 is connected to the first side 202a of resin layer 202.Counterdie
Second side 202b of 203 covering resin layers 202.Wherein the viscosity of resin layer 202 makes the second of counterdie 203 and resin layer 202
Side 202b is detachably connected.
Specifically, the viscosity of resin layer 202 during the storage of blue film and completes fixed iron ring and crystalline substance using blue film
Before circle, so that counterdie 203 and second side 202b of resin layer 202 link together.And iron ring and wafer are fixed in blue film
Later, counterdie 203 can be separated with second side 202b of resin layer 202.After counterdie 203 is separated with resin layer 202, resin layer
202 and the fixed iron ring of blue glue-line 201 and wafer.
In one embodiment, as shown in Fig. 2, resin layer 202 and blue glue-line 201 are dimensioned to and iron ring and wafer
Size matching, enable when the other side of blue glue-line 201 is attached to iron ring and wafer resin layer 202 and blue glue-line 201
Fixed iron ring and wafer, without cutting blue glue-line by blade as shown in Figure 1B.
Therefore, blue film provided by the present invention reduces in subsequent technique not without cutting and avoiding generating blue film clast
Controllable risk.Therefore indigo plant film provided by the present invention need not also increase cleaning without cutting after cutting as in the prior art
Step thus effectively controls the cost of semiconductor technology.
According to one embodiment of present invention, the size for being dimensioned so as to be equal to blue glue-line 201 of resin layer 202.
According to one embodiment of present invention, the size of counterdie 203 is greater than the size of resin layer 202 and blue glue-line 201, with
Convenient for after blue film affixes to wafer and iron ring, counterdie 203 can be dismantled from second side of resin layer 202.
Fig. 3 A and Fig. 3 B show blue film and its use provided herein.
Fig. 3 A shows blue film provided by the present invention and is covered on iron ring and wafer for fixing iron ring and wafer, wherein
Blue glue-line 301 affixes to iron ring and wafer, and the waiting of counterdie 303 is disassembled to be detached from resin layer 302.
Fig. 3 B is shown is formed by counterdie 303 wherein the fixed wafer of blue film and iron ring after the separation of resin layer 302
Structure.Wherein, the top view and longitudinal sectional drawing of iron ring and wafer that the blue film after being separated by counterdie is fixed are shown.Bottom
After film 303 is separated, resin layer 302 and blue glue-line 301 are pasted on wafer and iron ring, play the work of fixed iron ring and wafer
With.
According to one embodiment of present invention, as shown in Figure 3B, resin layer 302 and blue glue-line 301 are designed to round, and
And the diameter design of resin layer 302 and blue glue-line 301 is less than the overall diameter of iron ring at the interior diameter for being greater than iron ring, so that tree
Rouge layer 302 and blue glue-line 301 are capable of fixing iron ring and need to cut without departing from the part of iron ring area simultaneously, therefore avoid cutting out
It cuts.
It will be appreciated by those skilled in the art that the shape of resin layer 302 and blue glue-line 301 is not necessarily limited to circle,
But it can be and iron ring and the matched arbitrary shape of wafer.
The shape of resin layer 302 and blue glue-line 301 is designed to the area of covering wafer while covering iron ring cross-sectional area
A part so that wafer and iron ring are fixed together due to pasting simultaneously with resin layer 302 and blue glue-line 301.But it sets
The shape of rouge layer 302 and blue glue-line 301 is without departing from the outside of iron ring, therefore resin layer 302 and blue glue-line 301 are relative to iron ring
There is no extra part with wafer, because without cutting.Thus it avoids cutting brought non-controllable risk or unnecessary attached
Add processing cost.
According to one embodiment of present invention, wherein resin layer 302 is transparent.
According to one embodiment of present invention, wherein resin layer 302 increases blue film to the support force of wafer.
Fig. 4 shows the method flow diagram according to an embodiment of the invention for making blue film.
As shown in figure 4, according to one embodiment of present invention, the method for making blue film includes the following steps, in step 401
In, the coated with resins layer on counterdie, the resin layer has viscosity, which enables counterdie to separate from the resin layer；
In step 402, blue glue-line is coated on the resin layer；Wherein the resin layer and the blue glue-line be dimensioned to
The size of iron ring and wafer matching, so that the resin layer and the blue glue-line when the blue glue-line is attached to iron ring and wafer
Iron ring and wafer are capable of fixing without cutting blue glue-line.
In the method according to an embodiment of the invention for making blue film, resin layer and blue glue-line are designed to round
Shape, and the diameter design of resin layer and blue glue-line is less than the overall diameter of iron ring at the interior diameter for being greater than iron ring.
In the method according to an embodiment of the invention for making blue film, resin layer is dimensioned so as to equal to indigo plant
The size of glue-line.
In the method according to an embodiment of the invention for making blue film, the size of counterdie be greater than the resin layer and
The size of the indigo plant glue-line can be dismantled in order to the counterdie from the resin layer.
In the method according to an embodiment of the invention for making blue film, provided resin layer is transparent.
In the method according to an embodiment of the invention for making blue film, provided resin layer increases blue film to crystalline substance
Round support force.
According to another embodiment of the invention, a kind of blue film strips are provided, comprising: two or more aforementioned any indigo plants
Film；Interconnecting piece, for being connected with each other the two or more blue films in a manner of removably；Support portion is connected by interconnecting piece
The two or more blue films connect are wrapped on the support portion by circumference to be stored, when used by making to support
Portion's rotation obtains single blue film for pasting in iron ring and iron ring to take out blue film strips, and by separation interconnecting piece
Wafer.
Fig. 5 shows blue film strips 500 according to an embodiment of the invention.
As shown in figure 5, indigo plant film strips 500 according to the present invention include: two or more foregoing blue films, interconnecting piece
502 and support portion 503, blue film, such as 501a, 501b and 501c etc..Wherein, interconnecting piece 502 is used to incite somebody to action in a manner of removably
The two or more indigo plant film 501a, 501b and 501c are connected with each other.It is connected by interconnecting piece 502 the two or more
Blue film 501a, 501b and 501c are wrapped on support portion 503 by circumference to be stored.When used by making support portion 503
Rotation obtains single blue film 501a, 501b and 501c to take out blue film strips 500, and by separation interconnecting piece 502, is used for
Paste the wafer in iron ring and iron ring.
According to one embodiment of present invention, interconnecting piece 502 includes the notch 502 ' between the counterdie of blue film, by along
Notch tears blue film strips to obtain single blue film.
It is disclosed or can thus disclose that can apparently to obtain embodiment may include the more of specific operation
A example, and can change operation order in other various embodiments.But others are modified, variations and alternatives are same
It is possible.Therefore, the specification and drawings should be counted as illustrative and not restrictive.
Although being described in detail by some specific embodiments of the example to the disclosure, the skill of this field
Art personnel it should be understood that above example merely to be illustrated, rather than in order to limit the scope of the present disclosure.It is disclosed herein
Each embodiment can in any combination, without departing from spirit and scope of the present disclosure.It is to be appreciated by one skilled in the art that can be with
A variety of modifications are carried out without departing from the scope and spirit of the disclosure to embodiment.The scope of the present disclosure is limited by appended claims
It is fixed.
Claims (10)
1. a kind of indigo plant film characterized by comprising
Resin layer, the resin layer has the first side and second side, and the resin layer has viscosity；
Blue glue-line, the indigo plant glue-line covers the first side of the resin layer, and the side of the blue glue-line is connected to the tree
First side of rouge layer；
Counterdie, the counterdie cover second side of the resin layer, and the viscosity of the resin layer makes counterdie and the resin layer
Second side it is detachably connected；
Wherein the resin layer and the blue glue-line are dimensioned to match with the size of iron ring and wafer, so that when the indigo plant
The other side of glue-line when being attached to iron ring and wafer the resin layer and the blue glue-line be capable of fixing iron ring and wafer without
Cut blue glue-line.
2. indigo plant film according to claim 1, which is characterized in that when the other side of the blue glue-line is attached to iron ring and wafer
Shi Suoshu counterdie can be dismantled from second side of the resin layer.
3. indigo plant film according to claim 1, which is characterized in that the resin layer and the blue glue-line are designed to round,
And the diameter design of the resin layer and the blue glue-line is less than the overall diameter of iron ring at the interior diameter for being greater than iron ring.
4. indigo plant film according to claim 1, which is characterized in that the resin layer is dimensioned so as to be equal to the blue glue
The size of layer.
5. indigo plant film according to claim 1, which is characterized in that the size of the counterdie is greater than the resin layer and the indigo plant
The size of glue-line can be dismantled in order to the counterdie from second side of the resin layer.
6. indigo plant film according to claim 1, which is characterized in that the resin layer increases support of the blue film to wafer
Power.
7. indigo plant film according to claim 1, which is characterized in that the resin layer is transparent.
8. a kind of method for making blue film, which comprises the following steps:
There is viscosity counterdie is separated from the resin layer for the coated with resins layer on counterdie, the resin layer；
Blue glue-line is coated on the resin layer；
Wherein the resin layer and the blue glue-line are dimensioned to match with the size of iron ring and wafer, so that when the indigo plant
Glue-line when being attached to iron ring and wafer the resin layer and the blue glue-line be capable of fixing iron ring and wafer without cutting blue glue
Layer.
9. according to the method described in claim 8, it is characterized in that, the resin layer and the blue glue-line are designed to round,
And the diameter design of the resin layer and the blue glue-line is less than the overall diameter of iron ring at the interior diameter for being greater than iron ring.
10. according to the method described in claim 8, it is characterized in that, the resin layer is dimensioned so as to equal to the indigo plant
The size of glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910291368.0A CN109994416A (en) | 2019-04-12 | 2019-04-12 | Blue film, blue film strips and production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910291368.0A CN109994416A (en) | 2019-04-12 | 2019-04-12 | Blue film, blue film strips and production method |
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| CN109994416A true CN109994416A (en) | 2019-07-09 |
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| CN201910291368.0A Pending CN109994416A (en) | 2019-04-12 | 2019-04-12 | Blue film, blue film strips and production method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110726427A (en) * | 2019-10-28 | 2020-01-24 | 青岛歌尔微电子研究院有限公司 | Dustproof structure and manufacturing method thereof |
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Application publication date: 20190709 |