CN109976106A - A kind of developing apparatus and developing method - Google Patents
A kind of developing apparatus and developing method Download PDFInfo
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- CN109976106A CN109976106A CN201910295633.2A CN201910295633A CN109976106A CN 109976106 A CN109976106 A CN 109976106A CN 201910295633 A CN201910295633 A CN 201910295633A CN 109976106 A CN109976106 A CN 109976106A
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 150
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims description 34
- 238000001179 sorption measurement Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000498 cooling water Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention relates to a kind of developing apparatus and developing method, developing apparatus includes: processing chamber, and the receiving area of composite members to be developed is provided in the processing chamber；The composite members to be developed include substrate and mask plate；Developer solution steam providing apparatus, the developer solution steam providing apparatus are used to provide developer solution steam into the processing chamber；Cooling device, the cooling device is for cooling down the substrate.Developer solution steam is provided by developer solution steam providing apparatus picture substrate to be developed, and make developer solution steam in the drop that photoresist surface liquefaction to be reacted is nano-scale under the action of cooling device, on the one hand developing uniformity can be improved, on the other hand step of exposure can be saved, also improves production efficiency while saving process costs.
Description
Technical field
The present invention relates to display panel manufacturing fields, and in particular to a kind of developing apparatus and developing method.
Background technique
During the manufacture of existing display panel, patterning process process has run through intimate entire processing procedure, direct shadow
Ring the yield of product.Over-borrowing helps mask plate to develop photoresist in patterning process at present, and then realizes graphical.But
Exposure development equipment price is expensive, and exposure development technique takes a long time, and process costs is caused to greatly increase, while production capacity reduces.
And developing process mostly uses top-down spray mode at present, is specifically driven respectively on roller using multiple development nozzle for liquid
Glass above spraying developer solution, and then realize development, supplied the vibration of unstable, board and nozzle itself by developer solution
Reason, therefore the homogeneity developed is bad.
Summary of the invention
In view of this, the present invention provides a kind of developing apparatus and developing method, to improve non-uniform problem of developing.
A kind of developing apparatus, comprising:
Processing chamber is provided with the receiving area of composite members to be developed in the processing chamber；The composite members packet to be developed
Include substrate and mask plate；
Developer solution steam providing apparatus, the developer solution steam providing apparatus is for providing development into the processing chamber
Liquid steam；
Cooling device, the cooling device is for cooling down the substrate.
It in one of the embodiments, further include composite members fixation kit to be developed.
The composite members fixation kit to be developed includes circumferential along the processing chamber inner wall in one of the embodiments,
The substrate locating part of setting, and the substrate locating part corresponds to the substrate and is provided with opening, the opening area is less than described
Substrate area.
The substrate locating part is located at side of the mask plate far from the substrate in one of the embodiments,；Or
The substrate locating part is located at side of the substrate far from the mask plate, the fixed group of composite members to be developed
Part further includes being located at exposure mask plate support of the mask plate far from the substrate side, it is preferable that the mask plate fixing piece
Including along the guide rail perpendicular to the orientation substrate, and the exposure mask plate support being removably set on the guide rail.
The composite members fixation kit to be developed further includes being located at the substrate far from described in one of the embodiments,
The substrate adsorption part 140 of mask plate side,
Preferably, the substrate adsorption part 140 includes several vacuum chucks, several described vacuum chucks are for adsorbing
The substrate；
Preferably, the mask plate is metal mask plate, and the substrate adsorption part 140 is separate including being set to the substrate
The magnetic absorption component of mask plate side.
The cooling device includes the outlet of several cold wind in one of the embodiments, several cold wind outlet
It is arranged towards the substrate；Or
The cooling device includes at least one cold water pipes, at least one cold water pipes setting is remote in the substrate
Side from the mask plate.
The processing chamber is internally provided with developer solution steam distributor, the developer solution in one of the embodiments,
The processing chamber is divided into first area and second area by steam distributor, and the receiving area of the composite members to be developed is located at
The first area, the developer solution steam provide device and provide the developer solution steam to the second area.
It includes that the first heating member and developer solution accommodate that the developer solution steam, which provides device, in one of the embodiments,
Chamber；Preferably, first heating member and developer solution accommodating chamber are arranged inside the processing chamber；Preferably, described first
Heating member is heated base, and the heated base is located at the bottom inside the developer solution accommodating chamber；Preferably, the developer solution
Accommodating chamber is a part of the processing chamber.
A kind of developing method, includes the following steps:
The substrate to be developed for having photoresist is provided；
The substrate to be developed is cooled down；
Developer solution steam is provided into processing chamber, the substrate to be developed of the developer solution steam after the cooling period has photoetching
The surface of glue is liquefied, and then is developed to the photoresist.
Include the steps that repeatedly developing to the photoresist in one of the embodiments, repeatedly to the light
In the step of photoresist is developed, including previous development step and rear development step, before the rear development step, by institute
Remaining developer solution on substrate is stated to remove.
This programme at least has the following beneficial effects:
Device is provided by developer solution steam and provides developer solution steam to substrate to be developed, and under the action of cooling device
The substrate for being provided with photoresist is cooled down, so that developer solution steam is liquefied on photoresist surface to be reacted is nanometer ruler
On the one hand the purpose of very little drop and then realization development, this mode can be improved developing uniformity, on the other hand can save
Step of exposure also improves production efficiency while saving process costs.
Detailed description of the invention
Fig. 1 show a kind of one of developing device structure schematic diagram provided by the invention；
Fig. 2 show the two of a kind of developing device structure schematic diagram provided by the invention；
Fig. 3 show the three of a kind of developing device structure schematic diagram provided by the invention；
Fig. 4 show the four of a kind of developing device structure schematic diagram provided by the invention；
Fig. 5 show the flow diagram of the developing method of one embodiment of the invention offer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
According to an aspect of the present invention, a kind of developing apparatus is provided.Fig. 1 show the aobvious of one embodiment of the invention offer
The structural schematic diagram of image device 100.The developing apparatus includes processing chamber 110, is provided in the processing chamber 110 wait develop
The receiving area 120 of composite members；The composite members to be developed include substrate 121 and mask plate 122；
Developer solution steam providing apparatus 170, the developer solution steam providing apparatus 170 are used for the processing chamber 110
Middle offer developer solution steam；
Cooling device 130, the cooling device is for cooling down the substrate 121.
Specifically, the substrate 121 that composite members receiving area 120 to be developed is placed can be glass substrate, metal substrate or
It is flexible polymer substrate.In developing process, photoresist is set to the side of substrate 121, and developer solution steam is from developer solution steam
Feeding mechanism 170 issues, and is provided with the side surface upper liquid chemical conversion of photoresist in substrate 121 under the action of cooling device 130
The drop of nano-scale, developer solution react on substrate 121 with photoresist, realize development, and developer solution steam is from developer solution
Steam providing apparatus 170 issues, and flows to 121 direction of substrate.
In the prior art, developer solution mostly uses top-down spray mode, such as: utilize multiple development nozzle for liquid point
The 121 top spraying developer solution of substrate not being driven on roller, and then realize development.Stability requirement of this kind of mode to equipment
It is higher, easily there is non-uniform problem of developing, therefore usually require cooperation step of exposure, is also dropped while process costs are promoted
Low production efficiency.
In the present solution, providing developer solution steam by developer solution steam providing apparatus 170, and in the work of cooling device 130
Development substrate 121 is treated under to be cooled down, and then developer solution steam is made to be provided with a side surface liquid of photoresist in substrate 121
On the one hand developing uniformity can be improved in the drop for turning to nano-scale, on the other hand can save step of exposure, saves technique
Production efficiency is also improved while cost.
In one embodiment, the developing apparatus 100 further includes composite members fixation kit to be developed.
Specifically, as shown in Figure 1, developing apparatus 100 further includes composite members fixation kit to be developed, for that will be answered wait develop
Component is fixed on inside processing chamber, in order to develop.
In one embodiment, the composite members fixation kit to be developed includes circumferentially being arranged along the processing chamber inner wall
Substrate locating part, and the substrate locating part corresponds to the substrate and is provided with opening, the opening area is less than the real estate
Product.
Specifically, substrate locating part is circumferentially set along processing chamber inner wall, as shown in Figure 2.Substrate locating part 200 is along work
110 inner wall of skill chamber forms an end to end closed loop.The corresponding substrate 121 of opening 210 is arranged, in fact, opening 210
It is arranged on counterpart substrate 121 to developing regional, can prevents substrate locating part 200 from hindering developer solution to substrate 121 to aobvious in this way
The development in shadow zone domain, 210 areas of opening are less than the area of substrate 121, when substrate locating part 200 is contacted with substrate 121, substrate
Processing chamber 110 is divided to for upper and lower two relatively independent chambers by locating part 200 and substrate 121, prevents from showing to a certain extent
Shadow liquid steam more controls developer solution steam in lower chamber to top chamber, is conducive to improve developer solution
Utilization rate.
In one embodiment, the substrate locating part is located at the side of the mask plate 122 far from the substrate；Or it is described
Substrate locating part is located at side of the substrate far from the mask plate 122, and the composite members fixation kit to be developed further includes
Exposure mask plate support positioned at the mask plate 122 far from the substrate side, it is preferable that the mask plate fixing piece includes edge
Perpendicular to the guide rail of the orientation substrate, and the exposure mask plate support being removably set on the guide rail.
Specifically, substrate locating part can be set in side of the mask plate 122 far from substrate, that is, be arranged wait develop
The downside of composite members, for composite members to be developed to be fixed on inside processing chamber 110, and substrate locating part and substrate are by technique
Chamber 110 is divided to for upper and lower two relatively independent chambers；Certain substrate locating part also can be set in substrate far from mask plate 122
Side, that is, the upside of composite members to be developed is set, composite members fixation kit to be developed further includes being located at exposure mask at this time
Exposure mask plate support of the plate 122 far from substrate side, the substrate locating part positioned at substrate far from 122 side of mask plate can be covered with this
Diaphragm plate supporting element cooperates jointly, in this way, composite members to be developed are fixed on inside processing chamber 110.Preferably, mask plate is fixed
Part includes along the guide rail perpendicular to orientation substrate, and the exposure mask plate support being removably set on guide rail, specifically, exposure mask
Plate support may include a support slipper 151 and the motor that drives the support slipper 151 to move towards 122 direction of mask plate
152, in this way, mask plate 122 is adjacent under the active force of exposure mask plate support with substrate, in order to improve the accuracy of development.
In one embodiment, the composite members fixation kit to be developed further includes being located at the substrate far from the mask plate
The substrate adsorption part 140 of 122 sides,
Preferably, the substrate adsorption part 140 includes several vacuum chucks, several described vacuum chucks are for adsorbing
The substrate；
Preferably, the mask plate 122 is metal mask plate, and the substrate adsorption part 140 includes being set to the substrate
Magnetic absorption component far from 122 side of mask plate.
Specifically, composite members fixation kit to be developed can also include being located at substrate of the substrate far from 122 side of mask plate
Adsorption piece 140, it is preferable that substrate adsorption part 140 include several matrix forms distribution vacuum chuck, several vacuum chucks with
Vacuum pumping pump outside processing chamber 110 is connected, and when operation, vacuum chuck is in contact with substrate, and generates adsorption capacity to substrate；When
When mask plate 122 is metal mask plate, substrate adsorption part 140 includes being set to substrate to inhale far from the magnetism of 122 side of mask plate
Attached component, magnetic absorption component can adsorb mask plate 122 across substrate, be conducive to help substrate and exposure mask as a result,
Plate 122 is adjacent to.Also, the presence of substrate adsorption part 140, which has, is conducive to improve the partial loop variation that substrate is generated by gravity, substrate
140 position of adsorption piece can be variation, can be rationally arranged according to substrate deformation position, it is to be understood that multiple magnetic blocks
It can also be separated by a distance with substrate, meanwhile, magnetic block can be permanent magnet, be also possible to electromagnet.
In one embodiment, the cooling device includes the outlet of several cold wind, several described cold wind export direction
The substrate setting；Or
The cooling device includes at least one cold water pipes, at least one cold water pipes setting is remote in the substrate
Side from the mask plate 122.
Specifically, cooling device 130 is exported including several cold wind, outside the outlet of several cold wind and processing chamber 110
Air-cooler connection, cold wind outlet towards substrate 121 be arranged, to substrate 121 blow a cold wind over so that cool down substrate 121, lower temperature
Degree passes to the photoresist on substrate 121 from substrate 121, and the outlet of several cold wind can correspond to the aperture position on mask plate 122
It is configured, in this way, the photoresist that can treat developing regional preferably cool down.It is understood that air-cooler can wrap
Include one also may include it is multiple, in order to save cost and simplify structure, preferably air-cooler be one.Preferably, cooling dress
It sets 130 and side of the substrate 121 far from mask plate 122 is set, in this way, not interfering mask plate 122 far from the aobvious of 121 side of substrate
The flowing of shadow liquid steam does not block substrate 121 yet and contacts photoresist to be developed on a side surface with mask plate 122, and when aobvious
When image device includes substrate adsorption part 140, cold water pipes can be distributed in the region that substrate and substrate adsorption part 140 define.
Cooling device 130 is also possible to the cold water pipes of a snakelike disk cloth, and cooling water pipeline can be with processing chamber 110
External cold water provides device and is connected, and specifically, it may include cold water storage cistern, refrigeration machine that cold water, which provides device, and cold water provides dress
It sets and provides cooling water to cooling water pipeline, and then substrate is cooled down, meanwhile, cooling water pipeline can also be with setting in technique
Suction pump outside chamber 110 is connected, and suction pump is for promoting cooling water to circulate in cold water pipes.Preferably, cold
Side of the substrate 121 far from mask plate 122 is arranged in waterpipe, and when developing apparatus includes substrate adsorption part 140, cold water pipe
Road can be distributed in the region that substrate absorption device and substrate define, to recirculated cooling water is passed through in cold water pipes, to substrate
121 are cooled down, and certain cold water pipes are also possible to a plurality of.
In one embodiment, the processing chamber 110 is internally provided with developer solution steam distributor 170, the development
The processing chamber 110 is divided into first area and second area, the appearance of the composite members to be developed by liquid steam distributor 170
Receiving area 320 is located at the first area, and the developer solution steam provides device 360 and provides the developer solution to the second area
Steam.
Specifically, as Fig. 3 developer solution steam distributor 170 is located inside processing chamber 110, processing chamber 110 is divided
Receiving area 120 for first area, i.e. upper area and second area, i.e. lower area, composite members to be developed is located at the firstth area
Domain.Developer solution steam distributor 170 provides device 160 with developer solution steam and is connected to, and face parallel with substrate 121 is arranged.?
Several evenly arranged openings are provided on developer solution steam distributor 170, developer solution steam provides device 160 to the secondth area
Domain provides developer solution steam, and developer solution steam passes through several openings on developer solution steam distributor 170 again and issues, to substrate
121 side flowings to be developed, develop more uniform.
In one embodiment, it includes that the first heating member 162 and developer solution accommodate that the developer solution steam, which provides device 160,
Chamber 161；Preferably, first heating member 162 and developer solution accommodating chamber 161 are arranged inside the processing chamber 110；It is preferred that
Ground, first heating member 162 are heated base, and the heated base is located at the bottom inside the developer solution accommodating chamber 161；
Preferably, the developer solution accommodating chamber 161 is a part of the processing chamber 110.
As shown in figure 3, it is a kind of developing apparatus 300 provided by the present invention, developer solution steam provides device 160 and is arranged
Inside processing chamber 110.It includes the first heating member that 110 bottom of processing chamber is arranged in that developer solution steam, which provides device 160,
162, and the developer solution accommodating chamber 161 that the first 162 or more heating member is set and is directly contacted with the first heating member 162, the
One heating member 162 heats the developer solution in developer solution accommodating chamber 161, and then generates developer solution steam.First heating member
162 also can be set in the bottom of 161 chamber interior of developer solution, in this way, the first heating member 162 is directly contacted with developer solution, more
Developer solution is heated well, developer solution steam is provided.Developer solution accommodating chamber 161 can be a part of processing chamber 110, that is,
It says, developer solution accommodating chamber 161 is also possible to the space of the first heating member 162 with 110 inner wall of processing chamber composition.As shown in figure 3,
Developer solution steam distributor 170 can be set in 161 top of developer solution accommodating chamber.As shown in Figure 1,161 top of developer solution accommodating chamber
It can be not provided with developer solution steam distributor 170, developer solution steam is directly issued from 161 top of developer solution accommodating chamber, flows to base
Plate 121.
In one embodiment, the developing apparatus 400 in Fig. 4 is please referred to, the developer solution steam provides device 160 and is set to
Outside the processing chamber 110, the developer solution steam provides device 160 and is connected to the second area.
Specifically, developer solution steam, which provides device 160, can also be provided at certain side outside processing chamber 110, similarly,
It includes heating device 161 and developer solution accommodating chamber 161 that developer solution steam, which provides device 160, and developer solution accommodating chamber 161 is for accommodating
Developer solution, developer solution steam provide device 160 and are heated by heating device 161 to developer solution, and then provide developer solution and steam
Vapour.The developer solution steam that 110 outside side of processing chamber is arranged in provides the second area phase of device 160 and processing chamber 110
Connection, developer solution steam provides after device 160 generates from developer solution steam, into the second area of processing chamber 110, using
Developer solution steam distributor 170 flows to substrate, and then realizes development operation.
In one embodiment, developer solution steam provides device 160 and is connected to second area by pipeline, 181 outer wall of pipeline
Further include thermal insulation layer 182, several second heating members 183 are provided between 181 outer wall of pipeline and thermal insulation layer 182.
Specifically, the developer solution steam outside processing chamber is located at using the connection of pipeline 181 and device 160 and processing chamber is provided
Second area, developer solution steam provides the second area that device 160 enters processing chamber by developer solution steam, then by aobvious
Shadow liquid steam distributor 170 issues, and flows to substrate 121.Thermal insulation layer 182 is set in 181 outer wall of pipeline, thermal insulation layer 182 wraps up
There are gaps on 181 outer wall of pipeline, and between 181 outer wall of thermal insulation layer 182 and pipeline, be arranged in gap several second
Heating member 183, it is preferable that several the second heating members 183 are uniformly arranged along 181 outer wall of pipeline, the second heating member 183 of control
Temperature is not less than the temperature of developer solution steam.In this way, reducing the loss of developer solution steam on the transmit path, in order to develop
Technique preferably carries out.Certainly, 183 temperature of the second heating member control can by be arranged in 110 outside processing chamber first
Controller is controlled, several second heating members 183 are commonly connected to same first controller, by preset temperature to
Two heating members 183 are controlled, and then are controlled the temperature of 181 outer wall of pipeline, and heating temperature can be according to the group of developer solution
It is adjusted at reasonable.
In one embodiment, developer solution steam provides device 160 and is connected to second controller, and second controller is for controlling
Developer solution steam provides heating temperature and the heating time of device 160.
Specifically, developer solution steam provides device 160 and is connected to second controller, and second controller is set to processing chamber
Outside 410, heating temperature and the heating time of device 160 are provided for controlling developer solution steam, it is preferable that second controller is logical
The switch of process control heating device 182 is crossed to control heating time, can be closed according to the thickness and solution level of photoresist
Reason adjusts heating temperature and heating time, it is to be understood that second controller can be the same control with the first controller
Device.
According to another aspect of the present invention, a kind of developing method is provided, is included the following steps:
S510: the substrate to be developed with photoresist is provided.
The conventional method that this field can be used in photoresist is configured, and photoresist is arranged for example, by using the mode of coating
The substrate for being loaded with photoresist is sent into processing chamber after on substrate, then carrying out soft baking.The methods specifically prepared, can
To be adjusted according to the demand of those skilled in the art, the present invention is not specifically limited in this embodiment.
S520: the substrate to be developed is cooled down.
Specifically, it opens cooling device to cool down to substrate, and then photoresist is cooled down, so that photoresist surface
Evaporating temperature of the tool not higher than developer solution in the developing apparatus.Preferably, the step of cooling device cools down to substrate is opened
Prior to development step.
S530: developer solution steam, substrate the to be developed tool of the developer solution steam after the cooling period are provided into processing chamber
There is the surface of photoresist to liquefy, and then develops to the photoresist.
Before developer solution steam reaches photoresist surface, the lower temperature in photoresist surface is assigned by cooling device, this
Control developer solution steam is issued from developer solution steam (vapor) outlet portion afterwards, and developer solution can cooling liquid Cheng Na after reaching photoresist surface
The drop of meter ruler cun, and then reacted with photoresist.
In one embodiment, developing method provided by this programme includes the step repeatedly developed to the photoresist
Suddenly, in the step of repeatedly developing to the photoresist, including previous development step and rear development step, after described
Before secondary development step, developer solution remaining on the substrate is removed.
Specifically, developing process can be primary, can also be intermittent multidevelopment, specific number can be according to photoresist film thickness
And the size of solution level is rationally arranged.After previous development, stop the supply of developer solution steam, at this time substrate
Upper corresponding position can be removed the developer solution of substrate surface by giant or air knife there are extra developer solution, then be opened
Developer solution steam provides device and provides developer solution steam, time development after progress, in this way, by the developer solution of big drop remaining on substrate
Removal provides developer solution steam again and develops to photoresist, can effectively control photoresist surface development liquid drop size
It is not too big, be conducive to the uniformity and accuracy that improve development.
The present invention provides device by developer solution steam and provides developer solution steam into processing chamber, and in cooling device
The substrate for being provided with photoresist is cooled down under effect, makes the developer solution steam be in photoresist surface liquefaction to be reacted
On the one hand developing uniformity can be improved in the drop of nano-scale, on the other hand can save step of exposure, saves process costs
While also improve production efficiency.Certainly, according to actual needs, step of exposure can not also be saved.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. a kind of developing apparatus characterized by comprising
Processing chamber is provided with the receiving area of composite members to be developed in the processing chamber；The composite members to be developed include base
Plate and mask plate；
Developer solution steam providing apparatus, the developer solution steam providing apparatus, which is used to provide developer solution into the processing chamber, to be steamed
Vapour；
Cooling device, the cooling device is for cooling down the substrate.
2. developing apparatus according to claim 1, which is characterized in that further include circumferentially being arranged along the processing chamber inner wall
Substrate locating part, and the substrate locating part corresponds to the substrate and is provided with opening, and the opening area is less than the substrate
Area.
3. developing apparatus according to claim 2, which is characterized in that it is separate that the substrate locating part is located at the mask plate
The side of the substrate.
4. developing apparatus according to claim 2, which is characterized in that the substrate locating part is located at the substrate far from institute
State the side of mask plate；The composite members fixation kit to be developed further includes being located at the mask plate far from the substrate side
Exposure mask plate support；
Preferably, the mask plate fixing piece includes guide rail of the edge perpendicular to the orientation substrate, and is removably set on institute
State the exposure mask plate support on guide rail.
5. developing apparatus according to claim 1, which is characterized in that further include being located at the substrate far from the mask plate
The substrate adsorption part of side,
Preferably, the substrate adsorption part includes several vacuum chucks, several described vacuum chucks are for adsorbing the base
Plate；
Preferably, the mask plate is metal mask plate, and the substrate adsorption part includes being set to the substrate far from mask plate
The magnetic absorption component of side.
6. developing apparatus according to claim 1, which is characterized in that the cooling device includes the outlet of several cold wind,
Several cold wind outlet is arranged towards the substrate；Or
The cooling device includes at least one cold water pipes, at least one described cold water pipes are arranged in the substrate far from institute
State the side of mask plate.
7. developing apparatus according to claim 1, which is characterized in that the processing chamber is internally provided with developer solution steam
Distributor, the processing chamber is divided into first area and second area by the developer solution steam distributor, described wait develop
The receiving area of composite members is located at the first area, and the developer solution steam provides device and provides described show to the second area
Shadow liquid steam.
8. developing apparatus according to claim 1 or 6, which is characterized in that it includes that the developer solution steam, which provides device,
One heating member and developer solution accommodating chamber；
Preferably, first heating member and developer solution accommodating chamber are arranged inside the processing chamber；
Preferably, first heating member is heated base, and the heated base is located at the bottom inside the developer solution accommodating chamber
Portion；
Preferably, the developer solution accommodating chamber is a part of the processing chamber.
9. a kind of developing method, which comprises the steps of:
The substrate to be developed for having photoresist is provided；
The substrate to be developed is cooled down；
Developer solution steam is provided into processing chamber, the substrate to be developed of the developer solution steam after the cooling period has photoresist
Surface liquefaction, and then develop to the photoresist.
10. developing method according to claim 9, which is characterized in that including what is repeatedly developed to the photoresist
Step, in the step of repeatedly developing to the photoresist, including previous development step and rear development step, described
Afterwards before secondary development step, developer solution remaining on the substrate is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114236979A (en) * | 2021-12-15 | 2022-03-25 | 江苏集萃微纳自动化系统与装备技术研究所有限公司 | Nanostructure developing device, developing method and application |
| CN116107156A (en) * | 2023-04-11 | 2023-05-12 | 深圳市龙图光罩股份有限公司 | Mask etching equipment, method and system and computer readable storage medium |
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| CN114236979A (en) * | 2021-12-15 | 2022-03-25 | 江苏集萃微纳自动化系统与装备技术研究所有限公司 | Nanostructure developing device, developing method and application |
| CN116107156A (en) * | 2023-04-11 | 2023-05-12 | 深圳市龙图光罩股份有限公司 | Mask etching equipment, method and system and computer readable storage medium |
| CN116107156B (en) * | 2023-04-11 | 2023-06-23 | 深圳市龙图光罩股份有限公司 | Mask etching equipment, method and system and computer readable storage medium |
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Application publication date: 20190705 |