A kind of molding plate heat exchanger
Technical field
The present invention relates to a kind of molding plate heat exchangers, belong to technical field of heat exchange equipment.
Background technique
Plate heat exchanger carries out heat exchange by plate, is that liquid-liquid, liquid-vapour carry out the ideal equipment of heat exchange, it
Have the characteristics that heat exchange efficiency is high, heat loss is small, advantages of compact and light structure, occupied area is small, is widely used, long service life.
Plate heat exchanger has some unique distinctions in manufacture and use, therefore, as a kind of efficient, compact, light and handy
Heat exchange equipment, petrochemical industry, aerospace, electronics, atomic energy, weapon industrial, metallurgy, power engineering and machinery etc. lead
Domain is used widely, and using thermal energy, recovery waste heat, save raw material, reduce cost and some specific uses on obtain
Significant economic benefit.In recent years, the research that the design theory of plate heat exchanger, experimental study, manufacturing process, developing are applied
It is in the ascendant.
But that there are heat exchange efficiencies is not high for the plate heat exchanger of the prior art, and since traditional welding technique leads to not
The problems such as bad working environments such as adaptation high temperature, high pressure, corrosion and higher cost take up a large area.
Summary of the invention
The present invention be solve the prior art heat exchanger heat exchange efficiency it is not high, and since traditional welding technique leads to nothing
The problem of bad working environments such as method adaptation high temperature, high pressure, corrosion and higher cost take up a large area, it is board-like to provide a kind of molding
Heat exchanger, no gasket, without soldering have higher appliance integrality, and heat transfer efficiency is high, safe and reliable, low in cost, account for
The small advantage of ground area.
The present invention proposes that a kind of molding plate heat exchanger includes n molding plate, 2n sealing strip and m thin plate, wherein n
>=1, m >=1, m and n are natural number, and there are two sealing strips for the both ends installation of the non-inlet and outlet part of the molding plate, described
The top and bottom of molding plate are placed with thin plate, and adjacent two layers molding plate is mutually perpendicular to stack.
Preferably, the section of the molding plate is multiple " several " fonts arranged in a straight line.
Preferably, the molding plate uses the machine-shaping of punch process mode.
Preferably, the welding manner of the molding plate and thin plate uses vacuum diffusion welding connection technology, and Diffusion Bonded Joint is total
Plastic strain is higher than base material.
The working principle of molding plate heat exchanger of the present invention are as follows:
The heat exchange element of the molding plate heat exchanger is made of molding plate, thin plate and sealing strip, and each layer includes into
Template piece and end part seal item, are separated by thin plate between layers, and such structural unit body is exactly the substantially single of heat exchange
Member.Many such cell cubes are piled up according to the arrangement of fluid-flow mode, cold and hot fluid is adjacent substantially single
It is flowed in the runner of first body, heat exchange is carried out by molding plate and the thin plate being connected with plate, it is multiple such basic
Cell cube constitutes the core of molding plate heat exchanger.Welding manner uses vacuum diffusion welding, in the diffusion in vacuum welder of accumulation
On skill experiential basis, molding plate vacuum diffusion welding technique is targetedly devised for the characteristic of punch forming plate, is mentioned
High postwelding quality, and yield rate is higher.
Molding plate heat exchanger of the present invention has the beneficial effect that
1, the molding plate of the molding plate heat exchanger of molding plate heat exchanger of the present invention uses punch process, mark
Quasi-ization degree is high, and cost is compared with other methods more cheap.
2, the plate heat exchanger of the present invention that forms is since the heat exchange efficiency of novel forming plate heat exchanger is high, stamped
Molding plate is relatively thin, heat exchange area is also big compared with conventional etch plate, therefore realizes identical heat exchange amount, novel forming plate-type heat-exchange
Device occupied area is smaller.
3, molding plate heat exchanger of the present invention, while meeting heat exchange efficiency, using Diffusion Welding technology groups
Heat exchanger is welded, the strain of Diffusion Bonded Joint total plastic property is slightly above base material and common welding point, and Diffusion Bonded Joint has good prolong
Malleability and high temperature resistance are adapted to the bad working environments such as high temperature, high pressure, corrosion.The difficulty of plate welding is its surface
The processing of oxide layer and the guarantee of material matrix intensity, and diffusion welding craft can guarantee that welding region keeps the group of base material substantially
Knit structurally and mechanically characteristic.
4, molding plate heat exchanger of the present invention without gasket, without soldering, there is higher appliance integrality.
5, the board-like heat exchanger heat transfer of molding of the present invention is high-efficient, safe and reliable, can prevent two media
It is mutually mixed.
6, molding plate heat exchanger of the present invention passes through the available suitable capacity of adjustable plate piece number and heat transfer
Effect is conducive to the utilization of low-temperature heat source.
7, molding plate heat exchanger of the present invention is due to heat exchange area, occupied area, the reduction of the projects numerical value such as flow resistance
So that equipment investment, the expenses such as power consumption are greatly reduced, since the heat exchange efficiency of novel forming plate heat exchanger is high, stamped
Molding plate is relatively thin, heat exchange area is also big compared with conventional etch plate, therefore realizes identical heat exchange amount, novel forming plate-type heat-exchange
Device occupied area is smaller, and when using material costly, cost is relatively low, is conducive to reduced cost.
Detailed description of the invention
Fig. 1 is the main view of molding plate heat exchanger of the present invention;
Fig. 2 is the axonometric drawing of molding plate heat exchanger of the present invention;
Fig. 3 is the main view of the molding plate of molding plate heat exchanger of the present invention;
Fig. 4 is the shaft side figure of the molding plate of molding plate heat exchanger of the present invention;
Fig. 5 is the thin plate axonometric drawing of molding plate heat exchanger of the present invention;
Appended drawing reference: 1- forms plate;2- sealing strip;3- thin plate.
Specific embodiment
Below in conjunction with attached drawing, specific embodiments of the present invention will be described in further detail:
Specific embodiment 1: illustrating present embodiment referring to Fig. 1-Fig. 5.Molding plate-type heat-exchange described in present embodiment
Device includes n molding plate 1,2n sealing strip 2 and m thin plate 3, and wherein n >=1, m >=1, m and n are natural number, it is described at
There are two sealing strip 2, the top and bottom of the molding plate 1 to be placed with thin for the both ends installation of the non-inlet and outlet part of template piece 1
Plate 3, adjacent two layers molding plate 1 are mutually perpendicular to stack.
The section of the molding plate 1 is multiple " several " fonts arranged in a straight line, and the structure of " several " font is conducive to fluid
In bulky grain pass through, be suitable for the lower working medium of fluid cleaning degree.
The molding plate 1 uses punch process mode, and standardization level is high, and cost is compared with other methods more low
It is honest and clean.
The welding manner of the molding plate 1 and thin plate 3 uses vacuum diffusion welding connection technology, and Diffusion Bonded Joint total plastic property is answered
Get higher in base material and common welding point, Diffusion Bonded Joint has good ductility and high temperature resistance, be adapted to high temperature,
The bad working environments such as high pressure, corrosion.
The basic heat exchange element of the molding plate heat exchanger is made of molding plate 1, thin plate 3 and sealing strip 2, each layer
Including molding plate 1 and end part seal item 2, separated between layers by thin plate 3, such structural unit body is exactly heat exchange
Basic unit.Many such cell cubes are piled up according to the arrangement of fluid-flow mode, stacking in this way is placed, often
It is separated between layer heat exchange element by thin plate 3, the runner in layer and layer forms cross-flow, and cold and hot fluid is in adjacent basic unit
It is flowed in the runner of body, heat exchange is carried out by molding plate 1 and the thin plate 3 being connected with molding plate 1, it is multiple such
Basic unit body constitutes the core of molding plate heat exchanger.
The plate that such stacking is placed is subjected to vacuum diffusion welding, adjusts No. of plates to obtain suitable capacity and heat transfer
Effect.
Welding manner uses vacuum diffusion welding, on the basis of the vacuum diffusion welding process experiences of accumulation, for punch forming
The characteristic of plate targetedly devises molding plate vacuum diffusion welding technique, improves postwelding quality, and yield rate is more
It is high.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
It describes in detail bright.It should be understood that the above is only a specific embodiment of the present invention, it is not intended to restrict the invention, also
It can be the reasonable combination for the feature that above-mentioned each embodiment is recorded, all timess within spirit of that invention and principle, done
What modification, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.