CN109817594A - A kind of modularization spray cooler - Google Patents
A kind of modularization spray cooler Download PDFInfo
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- CN109817594A CN109817594A CN201910040978.3A CN201910040978A CN109817594A CN 109817594 A CN109817594 A CN 109817594A CN 201910040978 A CN201910040978 A CN 201910040978A CN 109817594 A CN109817594 A CN 109817594A
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
本发明公开一种模块化喷雾冷却器，由多个单位冷却模块构成。冷却器一侧紧贴发热单元，另一侧制冷液经冷风冷凝液化，单位冷却模块包括喷嘴、压电陶瓷件、液相通道肋片、气相通道肋片、铜片冷板、微型单向阀和结构通道，单位冷却器的结构通道包括冷风通道、冷凝通道、液相通道、气相通道、供液通道、储液腔、动力通道和喷雾腔。动力通道由压电陶瓷件提供动力，与喷雾腔连接；喷雾腔上端与气相通道连接，下端与液相通道连接；气相通道与冷凝通道相连接；液相通道与供液通道，供液通道与储液腔连接。本发明利用压电陶瓷作为动力源，喷雾冷却的换热性能好，温度均匀的优势，具备高效的冷却能力与适应性，可应用于高热流密度的微电子芯片的冷却。
The invention discloses a modular spray cooler, which is composed of a plurality of unit cooling modules. One side of the cooler is close to the heating unit, and the other side of the cooling liquid is condensed and liquefied by cold air. The unit cooling module includes nozzles, piezoelectric ceramics, liquid-phase channel fins, gas-phase channel fins, copper cold plate, and micro check valve. And structural passages, the structural passages of the unit cooler include cold air passages, condensation passages, liquid phase passages, gas phase passages, liquid supply passages, liquid storage chambers, power passages and spray chambers. The power channel is powered by piezoelectric ceramic pieces and is connected with the spray chamber; the upper end of the spray chamber is connected with the gas phase channel, and the lower end is connected with the liquid phase channel; the gas phase channel is connected with the condensation channel; the liquid phase channel is connected with the liquid supply channel, and the liquid supply channel with Reservoir connection. The invention utilizes piezoelectric ceramics as a power source, and has the advantages of good heat exchange performance and uniform temperature in spray cooling, efficient cooling capacity and adaptability, and can be applied to the cooling of microelectronic chips with high heat flux density.
Description
Technical field
The invention belongs to refrigeration technology fields, are related to one kind and are based on piezoceramic material as power source and combine spraying cold
But modular cooling device.
Background technique
With going deep into for information age, heat flow density caused by microelectronic chip is increasing.The arriving in 5G epoch, heat
Management becomes the important bottleneck for restricting chip development, how to scatter away the high hot-fluid of microelectronic chip generation, controls microelectronic chip
Temperature, have become critical issue urgently to be resolved, and obtained extensive concern.
Microelectronics cooling technology ever more important due to the surge of data processing, traditional cooling technology includes air-cooled and water
It is cold.Air-cooled cooling technology is mainly cooling by carrying out forced convertion to micromodule, but there are temperature distributing disproportionation, part temperature
The problem of heat is spent, simultaneously as compressor is as power source, noise is big, and operating environment is more severe.Cooling by water technology is then
It is indirectly to be taken away the heat that microelectronics generates by coolant media with inverse Carnot cycle principle.But the disadvantage is that equipment volume
It is huge, and it is laid out complexity, cost and maintenance are higher.
The drawbacks of to overcome traditional technology, microelectronics is cooling while some new technologies occurs, for example heat pipe is cooling, thermoelectricity
The novel cooling technology such as cooling, spray cooling.Heat pipe cold is the principle with heat pipe, and one end condenses, one end evaporation, while
Internal circulation, but other cooling means that compare are carried out under capillarity, thermal deformation easily occurs for heat pipe itself, and easily blocking etc. is asked
Topic.Thermoelectric-cooled is then a kind of Refrigeration Technique on the basis of establishing in Peltier, has many advantages, such as noiseless, small in size, but
The problems such as lower there is also thermoelectric conversion efficiency simultaneously.Spray cooling is then by being directly injected to air or other refrigerants
Heating surface is cooled down, but the problems such as bring temperature inhomogeneous cooling even.All in conceptual phase, itself is deposited these cooling technologies
In different disadvantages, large scale investment is not produced.
Summary of the invention
In order to overcome the shortcoming of above-mentioned cooling technology, the purpose of the present invention is to propose to a kind of modularization misting coolings
Device, it is intended to improve microelectronics cooling efficiency and have modularization and micromation feature.
The technical scheme of the present invention is realized as follows:
A kind of modularization spray cooler, entirety are made of multiple unit refrigerating modules.Unit refrigerating module side is tight
Heat-generating units are pasted, it is good using copper sheet cold plate thermal conductivity, the heat of heat-generating units is led into copper sheet cold plate, the other side and cold wind carry out
Heat exchange.Piezoelectric ceramics part is vibrated using the high-frequency of piezoelectric ceramic piece as power, generates cold wind.Each unit is cooling
Module includes micro nozzle, piezoelectric ceramics part, gas phase channel fin, liquid channel fin, copper sheet cold plate and micro one-way valve.Institute
The structure channel for stating cooler includes cold air duct, condensation channel, gas phase channel, liquid channel, liquid feeding channel, liquid storage chamber, moves
Power channel and spraying chamber.The power path provides power by piezoelectric ceramics part, and micro nozzle is mounted on power path end；Institute
Spraying chamber side installation copper sheet cold plate is stated, spraying chamber upper end is connected with gas phase channel, and lower end is connected with liquid channel, gas phase
Channel and liquid channel front and middle part are uniformly distributed enhanced heat exchange fin, and power is provided by piezoelectric ceramics part；The gas phase channel
Tight distribution adjacent with condensation channel；The condensation channel is closely interspersed with cold air duct, and channel both side surface is to strengthen
Heat exchange surface；The liquid channel is connected with liquid feeding channel, and interchannel installs micro one-way valve；Liquid feeding channel and liquid storage chamber phase
Connection, installs micro one-way valve between the two.
The modularization spray cooler is vertical or heat-generating units are close on slant setting, right side, and left side carries out cold wind heat exchange
It is cooling.
The inner passage of the modularization spray cooler is integrally cast, no pipeline connection.
The unit refrigerating module independently cools down mutually, can weld, and self-mountable & dismountuble combination integrated can also be cast.
The liquid channel is close to be distributed up and down with gas phase channel, and channel interior is distributed liquid channel fin and gas phase channel
Fin.
It is enhanced heat exchange surface that the copper sheet cold plate, which is sprayed side,.
The condensation channel is closely adjacently positioned with cold air duct, and both side surface is enhanced heat exchange surface, heat exchange mode
For cross flow heat exchange.
The power path is distributed multiple piezoelectric ceramics parts, by adjusting the frequency of different piezoelectric ceramics parts, guarantees spraying
Uniformity.
The invention has the following advantages that
(1) modular construction of the present invention, the feature for having integrated level high, convenient for disassembly and assembly are not only suitable for integrated fever and set
It is standby, it is also applied for distributed heat-producing device, it is widely used.
(2) each mutual independent operating of unit refrigerating module of the present invention, is easily installed and dismantles.
(3) unit refrigerating module of the present invention all takes enclosed construction, and refrigerating fluid is not directly contacted with heater element, has
The advantages of anti-leak.
(4) present invention use spray cooling, have the characteristics that spray cooling heat dissipation ability by force, uniformity of temperature profile.
(5) liquid channel fin of the invention and gas phase channel fin can enhance gas phase and liquid phase exchanges heat, and increase heat transfer sheet
Face and increase turbulent flow, reduce the temperature difference between the two, mix after being more advantageous to gas phase condensation with liquid phase.
(6) surface of condensation channel of the invention and cold air duct is enhanced heat exchange surface, and gas phase more efficient can obtain cold
It is solidifying.
(7) for the present invention using piezoelectric ceramics part as power source, frequency stability is good, precision height and applicable frequency range
Width, and it is small in size, nonhygroscopic, the service life is long, noise is small the advantages that, by adjust piezoelectric ceramics part frequency, difference can be met
Heat flow density.
Detailed description of the invention
Fig. 1 is the structure top view of modular cooling device of the present invention.
Fig. 2 is the structural front view of unit refrigerating module of the present invention.
Figure label explanation: 1, micro nozzle, 2, piezoelectric ceramics part, 3, gas phase channel fin, 4, liquid channel fin, 5,
Copper sheet cold plate, 6, micro one-way valve, 7, cold air duct, 8, condensation channel, 9, gas phase channel, 10, liquid channel, 11, feed flow it is logical
Road, 12, liquid storage chamber, 13, power path, 14, spraying chamber, 15, heat-generating units, 16, cold wind import end, 17, cold wind outlet end.
Specific embodiment
In order to which the purpose of the present invention, summary of the invention and advantage is more clearly understood, below in conjunction with attached drawing and case study on implementation,
The present invention is illustrated in further detail.It should be appreciated that the specific embodiments described herein are only to explain this hair
It is bright, it is not used to limit invention.
Referring to Fig.1, the cooler is vertical or slant setting, heat-generating units 15 are close to copper sheet cold plate 5, make heat is thermally conductive to arrive
Copper sheet cold plate 5, the other end generates cold wind using the vibration of the piezoelectric ceramic piece in piezoelectric ceramics part 2, through cold air duct 7 and inside
Refrigerating fluid exchange heat, cold wind enters from cold wind import end 16, and cold wind outlet section 17 goes out.Colling end by piezoelectric ceramics part 2,
Cold wind import end 16, cold air duct 7, cold wind outlet end 17 are constituted.
Referring to Fig. 2, each unit refrigerating module includes a micro nozzle 1, six piezoelectric ceramics part 2, gas phase channel rib
Piece 3, liquid channel fin 4, copper sheet cold plate 5 and three micro one-way valves 6.The structure channel of the unit refrigerating module includes cold
Wind channel 7, condensation channel 8, gas phase channel 9, liquid channel 10, liquid feeding channel 11, liquid storage chamber 12, power path 13 and spraying chamber
14.The power path 13 provides power by piezoelectric ceramics part 2, and micro nozzle 1 is mounted on power path right end；On spraying chamber 12
End is connected with gas phase channel 9, and lower end is connected with liquid channel 10, and gas phase channel 9 and 10 front and middle part of liquid channel are uniform
It is distributed fin, conveying power is provided by piezoelectric ceramics part 2；The gas phase channel 9 is connected with condensation channel 8, and channel two sides are
Enhanced heat exchange surface；The liquid channel 10 is connected with 11 channel of feed flow, and two wing passages are connected by micro one-way valve 6；Feed flow
Channel 11 is connect with liquid storage chamber 12, and the two is connected by micro one-way valve 6.Power path 13, spraying chamber 14, gas phase channel 9, condensation
Channel 8, liquid feeding channel 11, liquid storage chamber 12 and power path 13 constitute a circulation loop.Power path 13, spraying chamber 14, liquid
Phase channel 10, liquid feeding channel 11, liquid storage chamber 12 and power path 13 constitute another circulation loop.
At work, refrigerating fluid is transported to micro nozzle 1 by piezoelectric ceramics part 2, and refrigerating fluid is cold to copper sheet in spraying chamber 14
Plate 5 carries out misting cooling, and spray droplet takes away amount of heat, to cool down indirectly by a variety of heat exchange modes such as impact, phase transformations
Heat-generating units 15.Refrigerating fluid is vaporized into gas phase and moves up, and unboiled liquid phase avoids freezing because gravity moves down
Liquid liquefies to form a film in copper sheet cold plate 5 hinders heat exchange, while taking away heat.The refrigerant of vaporization is under the conveying of piezoelectric ceramics part 2
It is first forward exchanged heat, is entered back into condensation channel 8 and cold air duct 7 with the refrigerating fluid of another unit refrigerating module of top
Cold wind carries out distributary heat exchange, and refrigerating fluid is liquefied as liquid phase.Unvaporized liquid phase is under the conveying that piezoelectric ceramics part 2 acts on, under
The gas phase refrigerating fluid of another unit refrigerating module of side is equally forward exchanged heat, then is mixed with the liquid phase after gas phase condensation
It closes, is acted on by the extruding conveying of piezoelectric ceramics part 2, enter liquid feeding channel 11 through micro one-way valve 6.As buffer area, liquid is first
Into liquid storage chamber 12, power path 13 is entered back into, to complete the circulation of entire misting cooling.
Above embodiment is concrete case of the invention, and any conspicuous improvement, replacement etc. belong to the present invention
Protection scope.
Claims (6)
1. a kind of modularization spray cooler, which is characterized in that whole to be made of multiple unit refrigerating modules, each unit is cooling
Module includes micro nozzle (1), piezoelectric ceramics part (2), gas phase channel fin (3), liquid channel fin (4), copper sheet cold plate
(5), micro one-way valve (6), cold air duct (7), condensation channel (8), gas phase channel (9), liquid channel (10), liquid feeding channel
(11), liquid storage chamber (12), power path (13) and spraying chamber (14)；The copper sheet cold plate (5) is close to heat-generating units (15)；It is described
Power path (13) provides power by piezoelectric ceramics part (2), and micro nozzle (1) is mounted on power path (13) end；The spray
Mist chamber (14) upper end is connected with gas phase channel (9), and lower end is connected with liquid channel (10), and gas phase channel (9) and liquid phase are logical
Fin is evenly distributed on road (10) front middle part end, power transmission is provided by piezoelectric ceramics part (2), gas phase channel (9) and condensation
Channel (8) is connected；Condensation channel (8) is closely interspersed with cold air duct (7)；Liquid channel (10) and liquid feeding channel (11)
Connection, interchannel install micro one-way valve (6)；Liquid feeding channel (11) is connect with liquid storage chamber (12), is installed between the two miniature unidirectional
Valve (6).
2. modularization spray cooler according to claim 1, which is characterized in that cold air duct (7), condensation channel (8),
Gas phase channel (9), liquid channel (10), liquid feeding channel (11), liquid storage chamber (12), power path (13) and spraying chamber (14) are whole
Body is cast, no pipeline connection.
3. modularization spray cooler according to claim 1, which is characterized in that the unit refrigerating module is independent mutually
It is cooling, welding, loading and unloading type combination or integration casting.
4. modularization spray cooler according to claim 1, which is characterized in that the gas phase channel (9) and liquid phase are logical
Distribution is close in road (10) up and down, and channel interior is dispersed with gas phase channel fin (3) and liquid channel fin (4).
5. modularization spray cooler according to claim 1, which is characterized in that the condensation channel (8) and cold wind are logical
Road (7) is closely adjacently positioned, and the copper sheet cold plate (5) fits closely with heat-generating units (15), condensation channel (8), cold air duct
(7), copper sheet cold plate (5) side surface is enhanced heat exchange surface, is millimeter structure, micrometer structure, nanostructure or micro-nano knot
Structure.
6. modularization spray cooler according to claim 1, which is characterized in that power path (13) distribution is multiple
Piezoelectric ceramics part (2) guarantees spraying uniformity by adjusting the frequency of different piezoelectric ceramics parts (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910040978.3A CN109817594B (en) | 2019-01-16 | 2019-01-16 | Modular spray cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910040978.3A CN109817594B (en) | 2019-01-16 | 2019-01-16 | Modular spray cooler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109817594A true CN109817594A (en) | 2019-05-28 |
| CN109817594B CN109817594B (en) | 2020-07-28 |
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ID=66604377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910040978.3A Active CN109817594B (en) | 2019-01-16 | 2019-01-16 | Modular spray cooler |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351981A (en) * | 2019-06-25 | 2019-10-18 | 南京理工大学 | A kind of high heat flux density spray cooling device and system |
| CN120319742A (en) * | 2025-04-15 | 2025-07-15 | 爱微(江苏)电力电子有限公司 | An E-Comp and PTC two-in-one power semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3618476A1 (en) * | 1985-06-05 | 1986-12-11 | Siegfried Kuebler | Cooling device for air conditioning units or the like and method for its operation |
| CN1993030A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Compact spray cooling heat sink |
| CN102914114A (en) * | 2012-11-12 | 2013-02-06 | 重庆大学 | Independent portable domestic refrigeration system bi-circulating all-in-one machine |
| CN106376225A (en) * | 2016-11-25 | 2017-02-01 | 中国科学技术大学 | Plug-in spray cooling device applied to supercomputing center |
-
2019
- 2019-01-16 CN CN201910040978.3A patent/CN109817594B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3618476A1 (en) * | 1985-06-05 | 1986-12-11 | Siegfried Kuebler | Cooling device for air conditioning units or the like and method for its operation |
| CN1993030A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Compact spray cooling heat sink |
| CN102914114A (en) * | 2012-11-12 | 2013-02-06 | 重庆大学 | Independent portable domestic refrigeration system bi-circulating all-in-one machine |
| CN106376225A (en) * | 2016-11-25 | 2017-02-01 | 中国科学技术大学 | Plug-in spray cooling device applied to supercomputing center |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351981A (en) * | 2019-06-25 | 2019-10-18 | 南京理工大学 | A kind of high heat flux density spray cooling device and system |
| CN110351981B (en) * | 2019-06-25 | 2021-03-26 | 南京理工大学 | A high heat flux density spray cooling device and system |
| CN120319742A (en) * | 2025-04-15 | 2025-07-15 | 爱微(江苏)电力电子有限公司 | An E-Comp and PTC two-in-one power semiconductor device |
| CN120319742B (en) * | 2025-04-15 | 2025-11-28 | 爱微(江苏)电力电子有限公司 | A dual-function power semiconductor device combining E-Comp and PTC |
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| Publication number | Publication date |
|---|---|
| CN109817594B (en) | 2020-07-28 |
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