CN109803517B

CN109803517B - Heat dissipation is arranged

Info

Publication number: CN109803517B
Application number: CN201711141729.0A
Authority: CN
Inventors: 童凯炀; 陈虹汝
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2017-11-17
Filing date: 2017-11-17
Publication date: 2020-08-18
Anticipated expiration: 2037-11-17
Also published as: CN109803517A

Abstract

The invention discloses a heat radiation row which comprises a plurality of tube bodies, wherein the tube bodies are configured to allow cooling liquid to circulate, the tube bodies are connected with each other to form an annular structure, and the arrangement direction is defined from the inner side of the annular structure to the outer side of the annular structure. The tube body comprises a plurality of sub-tube bodies, the sub-tube bodies are arranged in parallel along the arrangement direction, each sub-tube body is provided with a width and a height, the width is parallel to the arrangement direction, the height is perpendicular to the arrangement direction, and the height is larger than the width.

Description

Heat dissipation is arranged

Technical Field

The present invention relates to a heat sink, and more particularly, to a heat sink for a two-phase immersion cooling system.

Background

To effectively reduce the influence of excessive heat generated during operation of large-scale equipment or electronic devices on the operation efficiency and even damage, how to achieve effective heat dissipation is undoubtedly a very important issue.

In immersion cooling systems, the user immerses the instruments that generate heat during operation in a cooling chamber, which is usually provided with a heat sink to remove the high temperature inside the cooling chamber.

Disclosure of Invention

One objective of the present invention is to provide a heat sink which can enhance the heat exchange effect with the heated fluid.

According to one embodiment of the present invention, a heat dissipation bar includes a plurality of tubes configured to allow a cooling fluid to flow therethrough, the tubes being connected to each other to form a ring structure, an arrangement direction being defined from an inside of the ring structure toward an outside of the ring structure. The tube body comprises a plurality of sub-tube bodies, the sub-tube bodies are arranged in parallel along the arrangement direction, each sub-tube body is provided with a width and a height, the width is parallel to the arrangement direction, the height is perpendicular to the arrangement direction, and the height is larger than the width.

In one or more embodiments of the present invention, the cross section of the sub-pipe body is a hollow rectangle.

In one or more embodiments of the present invention, the two adjacent sub-tubes have a gap therebetween in the arrangement direction.

In one or more embodiments of the present invention, the heat dissipation bar further includes a plurality of fins. The fins are arranged in the gaps and connected with two adjacent sub-tube bodies arranged along the arrangement direction.

In one or more embodiments of the present invention, the fin extends along the height of the sub-tube.

In one or more embodiments of the present invention, the annular structure is a rectangular structure.

In one or more embodiments of the present invention, the heat dissipation plate further includes a plurality of connection portions, an inlet structure and an outlet structure. The connecting parts are connected between the pipe bodies and communicated with the connected pipe bodies. The inlet arrangement is located in one of the connection portions and the outlet arrangement is located in one of the connection portions.

In one or more embodiments of the present invention, the inlet structure and the outlet structure are located at different connecting portions.

In one or more embodiments of the present invention, the inlet structure and the outlet structure are located in one of the same connecting portions, the corresponding connecting portion has a partition plate therein, the partition plate divides the internal chamber of the corresponding connecting portion into a first chamber and a second chamber, the inlet structure is communicated with the first chamber, and the outlet structure is communicated with the second chamber.

In one or more embodiments of the present invention, one of the tubes communicates with the first chamber, and the other of the tubes communicates with the second chamber.

The above embodiments of the present invention have at least the following advantages:

(1) because the height of the sub-tube body is larger than the width, when the dielectric liquid vapor flows upwards, the sub-tube body can provide more surfaces for the dielectric liquid vapor to contact, so that the heat exchange effect between the dielectric liquid vapor and the sub-tube body is enhanced.

(2) By vertically arranging the sub-tube body in the cooling box body along the height, the dielectric liquid steam is not blocked by the sub-tube body when the dielectric liquid steam is convected upwards, and therefore, the heat exchange rate of the dielectric liquid steam and the sub-tube body can be improved.

(3) The dielectric liquid condensed by the dielectric liquid vapor on the surface of the daughter pipe body in the heat exchange process flows back into the cooling box body due to the self-weight of the dielectric liquid and is not accumulated on the vertical surface of the pipe body, so the heat exchange rate of the dielectric liquid vapor and the daughter pipe body can be maintained.

Drawings

Fig. 1 is a perspective view of a heat dissipation bar according to an embodiment of the invention.

Fig. 2 is a partially enlarged view of the range X of fig. 1.

Fig. 3 is a cross-sectional view of line Y of fig. 1.

Fig. 4 is a perspective view of a heat dissipation bank according to another embodiment of the invention.

Fig. 5 is an internal structure diagram of the connection part of fig. 4.

Description of the symbols:

100: heat dissipation is arranged

110: pipe body

111: sub-pipe body

120. 120a, 120 b: connecting part

121: partition board

130: fin plate

140: inlet structure

150: outlet structure

A: ring structure

C: cooling liquid

D: direction of arrangement

F1, F2, F3, F4: direction of flow

G: voids

H: height

W: width of

S: internal chamber

S1: the first chamber

S2: second chamber

X: range of

Y: line segment

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simple schematic manner. And features of different embodiments may be applied interactively if possible to implement.

Please refer to fig. 1-2. Fig. 1 is a schematic perspective view illustrating a heat dissipation bar 100 according to an embodiment of the invention. Fig. 2 is a partially enlarged view illustrating a range X of fig. 1. In the present embodiment, as shown in FIGS. 1-2, a heat dissipation plate 100 is suitable for an immersion cooling system (not shown). The heat dissipation array 100 includes a plurality of tubes 110, the tubes 110 being configured to allow a cooling fluid (see fig. 3) to flow therethrough, the tubes 110 being connected to each other to form a ring structure a, and an arrangement direction D being defined from an inner side of the ring structure a to an outer side of the ring structure a. More specifically, the pipe 110 includes a plurality of sub-pipes 111, the sub-pipes 111 are arranged in parallel along an arrangement direction D, the sub-pipes 111 have a width W parallel to the arrangement direction D and a height H perpendicular to the arrangement direction D, and the height H is greater than the width W.

That is, when the heat dissipation bar 100 is vertically disposed in the cooling box (not shown), the fluid heated in the cooling box is convected upward and contacts the surface of the sub-pipe 111. For example, the heated fluid may be a dielectric fluid vapor. As mentioned above, since the height H of the sub-pipe 111 is greater than the width W, the sub-pipe 111 provides more surface for the dielectric liquid vapor to contact when the dielectric liquid vapor is convected upward, so as to enhance the heat exchange effect between the dielectric liquid vapor and the sub-pipe 111.

It should be noted that the outer portion of the ring structure a can be shaped correspondingly to the shape of the inner space of the cooling box. For example, in the present embodiment, the annular structure a is a rectangular structure, but the invention is not limited thereto.

Fig. 3 is a cross-sectional view of line Y in fig. 1. More specifically, as shown in fig. 3, the cross section of the sub-pipe body 111 is a hollow rectangle, and the coolant C flows through the hollow portion.

Please refer to fig. 1-3. By vertically disposing the sub-tubes 111 in the cooling box along the height H, the dielectric fluid vapor is not blocked by the sub-tubes 111 during the upward convection, so that the heat exchange rate between the dielectric fluid vapor and the sub-tubes 111 can be improved.

In addition, the dielectric liquid condensed from the dielectric liquid vapor on the surface of the sub-tube 111 during the heat exchange flows back into the cooling box due to its own weight without being accumulated on the vertical surface of the sub-tube 111, so that the heat exchange rate between the dielectric liquid vapor and the sub-tube 111 can be maintained.

Furthermore, the upward convection of the dielectric liquid vapor and the downward backflow of the dielectric liquid are natural phenomena without additional pushing, and therefore, a driving device such as a fan is not additionally provided in the immersion cooling system, so that the overall structure of the immersion cooling system can be simplified.

More specifically, as shown in fig. 1 to 2, a gap G is formed between two adjacent sub-tubes 111 in the arrangement direction D. That is, the dielectric liquid vapor can also flow upward in the gap G to increase the heat exchange effect between the dielectric liquid vapor and the surface of the sub-tube 111.

In the present embodiment, as shown in fig. 1-2, the heat dissipation bar 100 further includes a plurality of fins 130. The fins 130 are disposed in the gap G, and the fins 130 are connected to two adjacent sub-tubes 111 arranged along the arrangement direction D. Since the fin 130 is connected to the sub-body 111, the temperature of the fin 130 is also affected by the sub-body 111 and is reduced. By contacting the surface of the fins 130 with the dielectric fluid vapor during upward convection, the dielectric fluid vapor exchanges heat with the fins 130, which helps to lower the temperature of the dielectric fluid vapor.

Specifically, in order to avoid the blocking of the dielectric liquid vapor during the upward convection, in the present embodiment, the fins 130 extend along the height H of the sub-tubes 111, i.e. the fins 130 are also vertically disposed.

Structurally, as shown in fig. 1, the heat dissipation bar 100 further includes a plurality of connection portions 120 (including

connection portions

120a, 120b, and 120c), an inlet structure 140, and an outlet structure 150. The connection part 120 is connected between the sub-tubes 111, and the connection part 120 communicates with the connected sub-tubes 111. That is, the cooling liquid (see fig. 3) may also flow through the connection portion 120. The inlet structure 140 is located in one of the connection portions 120 and the outlet structure 150 is also located in one of the connection portions 120. The inlet structure 140 allows the cooling fluid to flow to the connection 120 so as to be within the sub-tube 111, while the outlet structure 150 allows the cooling fluid to exit the connection 120.

The inlet structure 140 and the outlet structure 150 may be located at different connections 120, depending on the actual situation. For example, in the present embodiment, as shown in fig. 1, the inlet structure 140 and the outlet structure 150 are respectively located at the opposite connecting

portions

120a and 120b (the outlet structure 150 is located at the back of the connecting portion 120b in fig. 1, and is shielded by the connecting portion 120 b). In this way, after the coolant flows into the connecting portion 120a through the inlet structure 140, the coolant flows along the sub-tube 111 to the connecting portion 120c along the flow direction F1 on both sides and turns to flow along the flow direction F2 to the connecting portion 120 b.

In addition, the inlet structure 140 and the outlet structure 150 may be located at the same connecting portion 120 according to actual conditions. Fig. 4 is a schematic perspective view illustrating a heat dissipation bar 100 according to another embodiment of the invention. In the present embodiment, as shown in fig. 4, after the cooling liquid flows into the connection portion 120 through the inlet structure 140, the cooling liquid flows through the sub-tubes 111 of the annular structure a in the flow directions F1, F2, F3 and F4 in sequence and returns to the same connection portion 120.

Fig. 5 is a schematic diagram illustrating an internal structure of the connection portion 120 in fig. 4. As shown in fig. 5, the connecting portion 120 has a partition plate 121 therein, the partition plate 121 divides the internal chamber S of the connecting portion 120 into a first chamber S1 and a second chamber S2, the inlet structure 140 communicates with the first chamber S1, and the outlet structure 150 communicates with the second chamber S2. The sub-tube 111 communicates with the first chamber S1 and the second chamber S2, respectively.

In summary, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages:

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A heat dissipation bar, comprising:

a plurality of tubes configured to allow a cooling fluid to flow therethrough, the tubes being connected to one another to form an annular structure, an inner portion of the annular structure defining an arrangement direction toward an outer portion of the annular structure, each of the tubes comprising:

a plurality of sub-tubes, the sub-tubes being arranged in parallel with each other along the arrangement direction, each sub-tube having a width parallel to the arrangement direction and a height perpendicular to the arrangement direction, the height being greater than the width; wherein a gap is arranged between two adjacent sub-tubes in the arrangement direction;

and the plurality of fins are arranged in the gaps and are connected with the two adjacent sub-tube bodies arranged along the arrangement direction.

2. The heat dissipation bar of claim 1, wherein each of the plurality of sub-tubes has a hollow rectangular cross-section.

3. The heat spreader of claim 1, wherein each of the fins extends along the heights of the sub-tubes.

4. The heat dissipation bar of claim 1, wherein the annular structure is a rectangular structure.

5. The heat sink row of claim 1, further comprising:

a plurality of connecting parts connected among the pipe bodies, wherein each connecting part is communicated with the connected pipe bodies;

an inlet structure located in one of the connecting portions; and

an outlet structure is located in one of the connecting portions.

6. The heat sink fin of claim 5, wherein the inlet structure and the outlet structure are located at different connecting portions.

7. A heat sink fin according to claim 5, wherein the inlet structure and the outlet structure are located in one of the same connecting portions, the corresponding connecting portion having a partition therein, the partition dividing an interior chamber of the corresponding connecting portion into a first chamber and a second chamber, the inlet structure communicating with the first chamber and the outlet structure communicating with the second chamber.

8. The heat sink bank of claim 7, wherein one of the tubes communicates with the first chamber and another of the tubes communicates with the second chamber.