CN109768188B - Method for manufacturing open pore structure of organic light-emitting panel and organic light-emitting panel - Google Patents
Method for manufacturing open pore structure of organic light-emitting panel and organic light-emitting panel Download PDFInfo
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- CN109768188B CN109768188B CN201910148527.1A CN201910148527A CN109768188B CN 109768188 B CN109768188 B CN 109768188B CN 201910148527 A CN201910148527 A CN 201910148527A CN 109768188 B CN109768188 B CN 109768188B
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- 238000000034 method Methods 0.000 title claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000011148 porous material Substances 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 238000004140 cleaning Methods 0.000 claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 230000008020 evaporation Effects 0.000 claims abstract description 11
- 238000001704 evaporation Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000012858 packaging process Methods 0.000 claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 74
- 239000010409 thin film Substances 0.000 claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 238000005336 cracking Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 111
- 238000005520 cutting process Methods 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
A method for making open pore structure of organic light-emitting panel comprises forming organic film layer on glass substrate to form substrate; forming an array substrate layer on the organic film layer; and carrying out a laser cleaning process at a preset position on the array substrate layer to penetrate through the array substrate layer and the organic film layer so as to form a slot hole surrounded by the array substrate layer and the organic film layer. On the array substrate layer with the slot, a metal mask and an electroluminescent material are used for carrying out an evaporation process to form a whole organic light-emitting layer. And performing a film packaging process by using the metal photomask, and forming a film packaging layer. Directly performing water absorption packaging adhesive coating and curing process at the section position of the slotted hole. And carrying out a laser stripping process on the glass substrate, and removing the film layer structure corresponding to the lower part of the slotted hole to enable the slotted hole to penetrate through the glass substrate.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a display technology, and more particularly, to a method for fabricating an opening structure of an organic light emitting panel and an organic light emitting panel.
[ background of the invention ]
With the continuous development of technology, people have higher and higher requirements on display devices. As is well known, an Organic Light Emitting Diode (OLED) display device has attracted much attention due to its advantages of narrow frame, light weight, being rollable, being easy to carry, and the like. Nowadays, the design of a full screen becomes the mainstream of the times, and all supplier units concentrate on developing full screen products with higher screen ratio. The Notch design and the round hole cutting (O-Cut) design which are recently developed are compared with the O-Cut design, the O-Cut design is closer to the full screen effect, and the size of the O-Cut can be realized only by considering a front camera. Therefore, the O-Cut area is far smaller than the space of the whole panel occupied by the Notch area, and the overall screen advantage of the camera under the O-Cut screen is more obvious.
In the conventional process of manufacturing flexible organic light emitting diode panels, the flexible organic light emitting diode panels are generally produced according to the following main sites: array substrate (Array) fabrication → Evaporation → Thin Film Encapsulation (TFE) → module molding (module, including post-processes such as O-Cutting). Aiming at the O-Cut panel, two problems mainly exist in the cutting process: first, since an Electroluminescent (EL) organic film is formed by evaporation using a metal mask, there is an EL organic layer at the edge section of the O-Cut removal region, which may cause moisture to intrude from the position and cause panel failure. Secondly, although the inorganic layer of Array can be designed to be avoided, when TFE is subjected to a Chemical Vapor Deposition (CVD) process by using a metal mask, the inorganic layer of TFE cannot be avoided, and cracks are easily generated in the inorganic layer of TFE during cutting, and the cracks may extend to cause package failure.
[ summary of the invention ]
The invention aims to provide a method for manufacturing an open pore structure of an organic light-emitting panel and the organic light-emitting panel, which can prevent cracks of a film layer structure in the panel and water vapor from invading by a round hole cutting process in a process adjustment and optimization mode.
In order to achieve the above object, a method of fabricating an opening structure of an organic light emitting panel according to the present invention includes: forming an organic film layer on a glass substrate to form a substrate; forming an array substrate layer on the organic film layer; performing a laser cleaning process at a predetermined position on the array substrate layer to penetrate through the array substrate layer and the organic film layer, thereby forming a slot surrounded by the array substrate layer and the organic film layer; on the array substrate layer with the slotted holes, carrying out an evaporation process by utilizing a metal photomask and an electroluminescent material to form a whole organic light-emitting layer, wherein the organic light-emitting layer is naturally cut off at the positions of the slotted holes; performing a film packaging process by using a metal photomask, and forming a film packaging layer, wherein the film packaging layer is naturally cut off at the position of the slotted hole corresponding to the organic film layer; directly performing water absorption packaging adhesive coating and curing processes on the section position of the slotted hole; and carrying out a laser stripping process on the glass substrate, and removing the film layer structure corresponding to the lower part of the slotted hole to enable the slotted hole to penetrate through the glass substrate.
According to a preferred embodiment of the present invention, when the array substrate layer is formed on the organic film layer, an anti-cracking structure and a retaining wall are further disposed at a predetermined position of the array substrate layer.
According to another preferred embodiment of the present invention, after the array substrate layer is formed, a photoresist is further coated at a predetermined position of the array substrate layer to protect the array substrate layer.
According to another preferred embodiment of the present invention, the laser cleaning process includes cleaning a remover, wherein the remover includes particle cleaning at a cross-sectional position of the trench, and the photoresist on the glass substrate is removed after the cleaning of the remover.
According to another preferred embodiment of the present invention, the organic film layer is made of polyimide, and the array substrate layer includes a thin film transistor module.
The present invention further provides a method of fabricating an open-cell structure of an organic light-emitting panel, comprising: forming an organic film layer on a glass substrate to form a substrate base plate, and performing a laser cleaning process on a preset position of the substrate base plate to penetrate the organic film layer and form a slotted hole; forming an array substrate layer on a substrate having the slots, wherein the array substrate layer naturally fractures at the slot locations; on the array substrate layer with the slotted holes, carrying out an evaporation process by utilizing a metal photomask and an electroluminescent material to form a whole organic light-emitting layer, wherein the organic light-emitting layer is naturally cut off at the positions of the slotted holes; performing a film packaging process by using a metal photomask, and forming a film packaging layer, wherein the film packaging layer is naturally cut off at the position of the slotted hole corresponding to the organic film layer; directly performing water absorption packaging adhesive coating and curing processes on the section position of the slotted hole; and carrying out a laser stripping process on the glass substrate, and removing the film layer structure corresponding to the lower part of the slotted hole to enable the slotted hole to penetrate through the glass substrate.
According to a preferred embodiment of the present invention, when the array substrate layer is formed on the organic film layer, an anti-cracking structure and a retaining wall are further disposed at a predetermined position of the array substrate layer.
According to another preferred embodiment of the present invention, after the array substrate layer is formed, a photoresist is further coated at a predetermined position of the array substrate layer to protect the array substrate layer.
According to another preferred embodiment of the present invention, the laser cleaning process includes cleaning a remover, wherein the remover includes particle cleaning at a cross-sectional position of the trench, and the photoresist on the glass substrate is removed after the cleaning of the remover.
The present invention further provides an organic light emitting panel, comprising a transparent display region and an effective display region surrounding the transparent display region, wherein the transparent display region comprises: the array substrate comprises a substrate base plate, an array base plate, an organic light-emitting layer, a thin film packaging layer and a slotted hole, wherein the slotted hole penetrates through a film structure of the transparent display area by utilizing a laser clearing process, a water absorption packaging adhesive is arranged at the section of the slotted hole, and an anti-cracking structure and a retaining wall are arranged around the array base plate corresponding to the slotted hole.
The method for manufacturing the open pore structure of the organic light-emitting panel realizes the design of the camera under the screen, and utilizes the laser cleaning process to form the circular slotted hole in advance after the organic film layer or the array substrate layer of the substrate machine plate is formed, and then the preparation and packaging processes of the light-emitting layer are sequentially carried out on the film layer structure with the slotted hole, so that the evaporation coating of the organic light-emitting layer and the preparation process of the packaging layer can be naturally cut off at the cross section of the slotted hole, and the generation of cracks of the internal film layer structure caused by the round hole cutting process of the traditional module section can be avoided, and water vapor can be invaded from the round hole area. The invention effectively solves the problems that the traditional organic light-emitting panel cuts the round hole at the last module section in the preparation process, which can cause the invasion of water vapor from the organic light-emitting layer on the section of the round hole, or the crack of the metal film packaging layer is caused when the round hole is cut, thereby causing the packaging failure and the failure of the panel due to the infiltration of the water vapor.
[ description of the drawings ]
Fig. 1A to 1G are schematic partial cross-sectional views of an opening structure of an organic light-emitting panel according to a preferred embodiment of the invention.
Fig. 2 is a flowchart of a method for fabricating an opening structure of an organic light emitting panel according to a preferred embodiment of the invention.
Fig. 3A to 3F are schematic partial cross-sectional views of an opening structure of an organic light-emitting panel according to another preferred embodiment of the invention.
Fig. 4 is a flowchart of a method of fabricating an opening structure of an organic light emitting panel according to another preferred embodiment of the present invention.
FIG. 5 is a schematic plan view of an organic light-emitting panel according to a preferred embodiment of the invention.
[ detailed description ] embodiments
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc. refer to directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.
The invention discloses a method for manufacturing an open-pore structure of an organic light-emitting panel and the organic light-emitting panel, wherein the organic light-emitting panel is also called an organic light-emitting display panel. Fig. 1A to 1G are schematic partial cross-sectional views of an opening structure of an organic light-emitting panel according to a preferred embodiment of the invention, which also serve as a process for fabricating the opening structure of the invention. Fig. 2 is a flowchart of a method for fabricating an opening structure of an organic light emitting panel according to a preferred embodiment of the invention. Please refer to fig. 1A to 1G in conjunction with fig. 2. As shown in fig. 2, the method for manufacturing the opening structure of the organic light emitting panel of the present invention includes steps S11-S17, which are described in detail below.
Step S11: an organic film layer 12 is formed on a glass substrate 11 to form a substrate 1 (as shown in fig. 1A). In this preferred embodiment, the material of the organic film 12 is Polyimide (PI).
Step S12: an array substrate layer 2 is formed on the organic film layer 12, and the array substrate layer 2 includes an inorganic functional layer 21 and a thin film transistor module 22 (as shown in fig. 1B) disposed on the inorganic functional layer 21. Specifically, when the array substrate layer 2 is formed, an anti-cracking structure 23 and a retaining wall 24 are further disposed at the periphery of a predetermined position of the array substrate layer 2. In addition, after the array substrate layer 2 is formed, a photoresist coating or a protective film (not shown) may be attached to protect the array substrate layer from contamination and damage caused by subsequent processes.
Step S13: a laser cleaning (laser cleaning) process is performed at a predetermined position on the array substrate layer 2 to penetrate through the array substrate layer 2 and the organic film layer 12, so as to form a circular slot 3 surrounded by the array substrate layer 2 and the organic film layer 12 (as shown in fig. 1C). In another embodiment, the slot may be excavated by a laser cutting process. The purpose of the laser cleaning process is to remove the array substrate layer 2 and the organic film layer 12, so that a significant offset is formed at the cross-sectional position of the slot 3. Specifically, the laser cleaning process includes cleaning a remover, wherein the remover includes particle cleaning at a cross-sectional position of the slot 3, and after the cleaning of the remover, the photoresist on the glass substrate 11 is removed. Specifically, the anti-crack structure 23 is provided in step S12 to prevent cracks from extending around the circular hole during laser ablation and laser cutting, and is configured by cutting the inorganic layer into strips and filling the strips with an organic material.
Step S14: on the array substrate layer 2 having the slots 3, a metal mask (not shown) and an Electroluminescence (EL) material are used to perform an evaporation process to form a full-surface organic light emitting layer 4 (as shown in fig. 1D), wherein the organic light emitting layer 4 is naturally cut off at the positions of the slots 3. The organic light emitting layer 4 has a structure of a general organic light emitting film layer, that is, includes an anode layer, a light emitting layer, and a cathode layer (not shown). Because the slot 3 is formed before the organic light-emitting layer 4, the metal mask can be directly evaporated without special design, and the organic light-emitting layer 4 can be naturally cut at the position of the slot 3, thereby realizing the manufacture of the circular hole panel.
Step S15: using a metal mask, performing a film encapsulation (TFE) process by using a chemical vapor deposition method in combination with an inkjet printing technology, and forming a film encapsulation layer 5 (as shown in fig. 1E), wherein the film encapsulation layer 5 is naturally cut at a position where the slot 3 corresponds to the organic film layer 12. Because the slot 3 is formed before the thin film packaging layer 5, the formation of the thin film packaging layer 5 can avoid the crack and crack (crack) phenomenon of the inorganic layer of the metal thin film packaging caused by the last module section of the panel manufacturing in the traditional round hole cutting process. Specifically, the purpose of the step S12 is to dispose the retaining wall 24 to prevent the thin film encapsulation layer (i.e. the metal thin film encapsulation layer) from overflowing, and reduce the material required for laser cleaning in the circular hole cutting area, wherein the retaining wall 24 is formed by stacking organic layers.
Step S16: the process of coating and curing the water-absorbing packaging adhesive 31 is directly performed on the cross-section of the slot 3 (as shown in fig. 1F). In particular, since the film encapsulation process is performed in a nitrogen environment, and the water-absorbing adhesive having a water-absorbing function is coated and cured in an oxygen-free environment, the water-absorbing encapsulation adhesive 31 can be directly coated and cured at the cross-section of the slot hole 3 by using the characteristics of the former environmental conditions.
Step S17: performing a Laser Lift Off (LLO) process on the glass substrate 11, and removing the film structure corresponding to the lower portion of the slot 3, so that the slot 3 penetrates through the glass substrate 11 (as shown in fig. 1G).
Fig. 3A to 3F are schematic partial cross-sectional views of an opening structure of an organic light-emitting panel according to another preferred embodiment of the invention. Fig. 4 is a flowchart of a method of fabricating an opening structure of an organic light emitting panel according to another preferred embodiment of the present invention. Please refer to fig. 3A to 3F in conjunction with fig. 4. As shown in fig. 4, the method for manufacturing the opening structure of the organic light emitting panel according to another embodiment of the present invention includes steps S21-S26, which are described in detail below.
Step S21: an organic film 12 is formed on a glass substrate 11 to form a substrate 1, and a laser cleaning process is performed at a predetermined position of the substrate 1 to penetrate the organic film 12 and form a slot 3 (as shown in fig. 3A). In this preferred embodiment, the material of the organic film 12 is polyimide. Specifically, the laser energy required for the laser cleaning process of the present embodiment is smaller than that of the embodiment illustrated in fig. 2, the laser process is relatively easy, and the residual particles are small and easy to clean.
Step S22: an array substrate layer 2 is formed on the substrate base plate 1 having the slot 3, wherein the array substrate layer 2 is naturally broken at the position of the slot 3 (as shown in fig. 3B).
Step S23: on the array substrate layer 2 with the slots 3, a metal mask (not shown) and an electroluminescent material are used to perform an evaporation process to form a whole organic light-emitting layer 4, wherein the organic light-emitting layer 4 is naturally cut off at the positions of the slots 3 (as shown in fig. 3C).
Step S24: and performing a film packaging process by using a metal mask, and forming a film packaging layer 5, wherein the film packaging layer 5 is naturally cut off at a position where the slot hole 3 corresponds to the organic film layer 12 (as shown in fig. 3D).
Step S25: the water-absorbing packaging adhesive coating and curing process is directly performed on the cross-section of the slot 3 (as shown in fig. 3E).
Step S26: and carrying out a laser stripping process on the glass substrate 11, and removing a film structure corresponding to the lower part of the slotted hole 3, so that the slotted hole 3 penetrates through the glass substrate 11. (as shown in fig. 3F).
The method of the present invention for fabricating an open-cell structure of an organic light-emitting panel shown in fig. 4 is mainly different from the method shown in fig. 2 in that: the laser cleaning process is performed after the organic film 12 is formed, that is, the laser cleaning process only cleans the organic film 12, and the slot 3 is formed before the array substrate layer 2 is prepared. Except for the foregoing differences, the steps of the method for fabricating the opening structure shown in fig. 4 are identical to the method for fabricating the opening structure shown in fig. 2, and the opening structure of the organic light emitting panel shown in fig. 3A to 3F is identical to the opening structure of the organic light emitting panel shown in fig. 1A to 1G, and will not be repeated herein.
FIG. 5 is a schematic plan view of an organic light-emitting panel according to a preferred embodiment of the invention. The present invention additionally provides an organic light emitting panel. The organic light emitting panel comprises a transparent display area 101 and an effective display area 102 surrounding the transparent display area 101, and is used for providing a picture with a full screen for an electronic product. The transparent display region 101 includes an opening structure as shown in fig. 1G and fig. 3F, that is, a substrate 1, an array substrate 2, an organic light emitting layer 4, a thin film encapsulation layer 5, and a slot 3. The slotted hole 3 penetrates through the film layer structure of the transparent display area 101 by utilizing a laser clearing process, a water absorption packaging adhesive 31 is arranged at the section of the slotted hole 3, and an anti-cracking structure 23 and a retaining wall 24 are arranged around the array substrate layer 2 corresponding to the slotted hole 3. In particular, the slot 3 is used for arranging a camera of an electronic product.
The method for manufacturing the open pore structure of the organic light-emitting panel realizes the design of the camera under the screen, and utilizes the laser cleaning process to form the circular slotted hole in advance after the organic film layer or the array substrate layer of the substrate machine plate is formed, and then the preparation and packaging processes of the light-emitting layer are sequentially carried out on the film layer structure with the slotted hole, so that the evaporation coating of the organic light-emitting layer and the preparation process of the packaging layer can be naturally cut off at the cross section of the slotted hole, and the generation of cracks of the internal film layer structure caused by the round hole cutting process of the traditional module section can be avoided, and water vapor can be invaded from the round hole area. The invention effectively solves the problems that the traditional organic light-emitting panel cuts the round hole at the last module section in the preparation process, which can cause the invasion of water vapor from the organic light-emitting layer on the section of the round hole, or the crack of the metal film packaging layer is caused when the round hole is cut, thereby causing the packaging failure and the panel failure caused by the water vapor infiltration.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (7)
1. A method of making an open-cell structure for an organic light-emitting panel, comprising:
forming an organic film layer on a glass substrate to form a substrate;
forming an array substrate layer on the organic film layer;
performing a laser cleaning process at a predetermined position on the array substrate layer to penetrate through the array substrate layer and the organic film layer, thereby forming a slot surrounded by the array substrate layer and the organic film layer;
on the array substrate layer with the slotted holes, carrying out an evaporation process by utilizing a metal photomask and an electroluminescent material to form a whole organic light-emitting layer, wherein the organic light-emitting layer is naturally cut off at the positions of the slotted holes;
performing a film packaging process by using a metal photomask, and forming a film packaging layer, wherein the film packaging layer is naturally cut off at the position of the slotted hole corresponding to the organic film layer;
directly performing water absorption packaging adhesive coating and curing processes on the section position of the slotted hole; and
carrying out a laser stripping process on the glass substrate, and removing a film layer structure corresponding to the lower part of the slotted hole to enable the slotted hole to penetrate through the glass substrate, wherein the slotted hole is used for placing a camera;
when the array substrate layer is formed on the organic film layer, an anti-cracking structure and a retaining wall are further arranged at a preset position of the array substrate layer, and the anti-cracking structure is used for preventing cracks from extending around the slotted hole during laser removal and laser cutting.
2. The method according to claim 1, wherein after the array substrate layer is formed, a photoresist is further coated at a predetermined position of the array substrate layer to protect the array substrate layer.
3. The method according to claim 2, wherein the laser cleaning process comprises cleaning a remover, wherein the remover comprises particle cleaning at the cross-sectional position of the slot, and removing the photoresist on the glass substrate after the cleaning of the remover.
4. The method according to claim 1, wherein the organic film layer is made of polyimide, and the array substrate layer comprises a thin film transistor module.
5. A method of making an open-cell structure for an organic light-emitting panel, comprising:
forming an organic film layer on a glass substrate to form a substrate base plate, and performing a laser cleaning process on a preset position of the substrate base plate to penetrate the organic film layer and form a slotted hole;
forming an array substrate layer on a substrate having the slots, wherein the array substrate layer naturally fractures at the slot locations;
on the array substrate layer with the slotted holes, carrying out an evaporation process by utilizing a metal photomask and an electroluminescent material to form a whole organic light-emitting layer, wherein the organic light-emitting layer is naturally cut off at the positions of the slotted holes;
performing a film packaging process by using a metal photomask, and forming a film packaging layer, wherein the film packaging layer is naturally cut off at the position of the slotted hole corresponding to the organic film layer;
directly performing water absorption packaging adhesive coating and curing processes on the section position of the slotted hole; and
carrying out a laser stripping process on the glass substrate, and removing a film layer structure corresponding to the lower part of the slotted hole to enable the slotted hole to penetrate through the glass substrate, wherein the slotted hole is used for placing a camera;
when the array substrate layer is formed on the organic film layer, an anti-cracking structure and a retaining wall are further arranged at a preset position of the array substrate layer, and the anti-cracking structure is used for preventing cracks from extending around the slotted hole during laser removal and laser cutting.
6. The method according to claim 5, wherein after the array substrate layer is formed, a photoresist is further coated at a predetermined position of the array substrate layer to protect the array substrate layer.
7. The method according to claim 6, wherein the laser cleaning process comprises cleaning a remover, wherein the remover comprises particle cleaning at the cross-sectional position of the slot, and removing the photoresist on the glass substrate after the cleaning of the remover.
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| CN110265439A (en) | 2019-06-06 | 2019-09-20 | 武汉华星光电半导体显示技术有限公司 | Organic LED display panel and electronic equipment |
| CN110491913B (en) * | 2019-07-31 | 2021-11-02 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN110867475B (en) | 2019-11-26 | 2023-09-29 | 京东方科技集团股份有限公司 | Electroluminescent display substrate and preparation method thereof, electroluminescent display device |
| CN110890474B (en) * | 2019-11-27 | 2022-04-26 | 武汉天马微电子有限公司 | Display panel and display device |
| CN111725267A (en) * | 2020-06-02 | 2020-09-29 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN111740028B (en) * | 2020-06-29 | 2024-01-02 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof |
| CN112397675B (en) * | 2020-11-18 | 2022-07-22 | 合肥维信诺科技有限公司 | Display panel preparation method and display panel |
| CN113539127B (en) * | 2021-07-09 | 2023-04-11 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
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