CN109686832A - A kind of Novel LED chip encapsulating structure and manufacture craft - Google Patents
A kind of Novel LED chip encapsulating structure and manufacture craft Download PDFInfo
- Publication number
- CN109686832A CN109686832A CN201811390377.7A CN201811390377A CN109686832A CN 109686832 A CN109686832 A CN 109686832A CN 201811390377 A CN201811390377 A CN 201811390377A CN 109686832 A CN109686832 A CN 109686832A
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- Prior art keywords
- led chip
- bracket
- lens
- new type
- chip packaging
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- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 238000012536 packaging technology Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims abstract 2
- 239000004033 plastic Substances 0.000 claims description 17
- 229920003023 plastic Polymers 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 238000011900 installation process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 240000003380 Passiflora rubra Species 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000009738 saturating Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
Landscapes
- Led Device Packages (AREA)
Abstract
本发明涉及半导体封装的技术领域，尤其涉及一种新型LED芯片封装结构及其制作工艺。包括支架、LED芯片以及透镜，所述LED芯片为倒装芯片且采用倒装芯片封装技术安装在所述支架上，所述透镜采用模造成型工艺直接塑封在装有LED芯片的支架上；其LED芯片采用倒装技术安装在支架(基板)上，替代了传统需要通过金属导线的连接方式，从而在安装过程中避免了因回流焊导致LED芯片移位出现LED芯片中心偏移的情况，使得出光效果更好。而且透镜采用模造成型工艺在支架上成型，封装一体，简化了传统贴装的工序，有效减低人工、设备等成本。
The present invention relates to the technical field of semiconductor packaging, in particular to a novel LED chip packaging structure and a manufacturing process thereof. It includes a bracket, an LED chip and a lens. The LED chip is a flip chip and is mounted on the bracket by using flip-chip packaging technology. The chip is mounted on the bracket (substrate) by flip-chip technology, instead of the traditional connection method that needs to be connected by metal wires, so as to avoid the displacement of the LED chip caused by reflow soldering during the installation process. Better results. Moreover, the lens is formed on the bracket by the molding process, and the package is integrated, which simplifies the traditional mounting process and effectively reduces the cost of labor and equipment.
Description
[technical field]
The present invention relates to the technical field of semiconductor packages more particularly to a kind of Novel LED chip encapsulating structure and its systems
Make technique.
[background technique]
The lamps and lanterns such as panel light, advertising lamp box are area sources, it is desirable that light source has wide light emitting angle, light intensity space uniform point
Cloth.LED lamp bead is applied in panel light, advertising lamp box, needs to carry out secondary optical design, it is saturating that plastics are sticked on LED lamp bead
Mirror carries out secondary light-distribution, can be only achieved the purpose of wide light emitting angle, the distribution of light intensity space uniform.This LED lamp bead adds plastics saturating
The assembled scheme of mirror, has some disadvantages: 1. LED lamp bead position may deviate after Reflow Soldering, lead to LED lamp bead center
With plastic lens off-centring, light-out effect is influenced；2. increasing plastic lens mounts this procedure, equipment, artificial, former material
The increased costs such as material.
[summary of the invention]
To solve the problems, such as that LED lamp bead adds the assembled scheme of plastic lens its complex process, at high cost in the prior art, this
Invention provides a kind of Novel LED chip encapsulating structure.
The present invention is achieved by the following technical solutions:
A kind of Novel LED chip encapsulating structure, including bracket, LED chip and lens, the LED chip are upside-down mounting core
Piece and using flip-chip packaging techniques installation on the bracket, the lens are being filled using the direct plastic packaging of mould model technique
Have on the bracket of LED chip；
The outer surface of the lens is equipped with to match the recess of light direction, and the side wall of the recess is inclined to be set
It sets and the top of the recess is made to form flare openings, and the center of the recess is aligned with the center of the LED chip.
A kind of Novel LED chip encapsulating structure as described above, the bracket are installed on the end face of the end face of LED chip also
Equipped with cricoid bowl structure, the LED chip is mounted on the inside of the bowl structure.
The Sidewall Height of a kind of Novel LED chip encapsulating structure as described above, the bowl structure is less than the LED core
Height after piece installation.
A kind of Novel LED chip encapsulating structure as described above, the bracket are Five-gold-sheet, and the bowl structure is plastics
Bowl.
The end face of a kind of Novel LED chip encapsulating structure as described above, the bracket installation LED chip is plane, and
The lens are directly connected on this plane.
A kind of Novel LED chip encapsulating structure as described above, the bracket are ceramic substrate or aluminum substrate.
A kind of Novel LED chip encapsulating structure as described above, the recess is in inverted centrum shape, and the recess includes
The addendum cone mouth that is arranged outwardly and the base cone point being arranged towards the LED chip, the addendum cone mouth by cambered surface or folding surface with
The lens are mutually connected.
A kind of Novel LED chip encapsulating structure as described above, the LED chip are the chip of 5 face light transmissions.
A kind of Novel LED chip packaging technology, includes the following steps,
A, by LED chip flip-chip packaging techniques location and installation on bracket；
B, the bracket for installing LED chip is directed into the molding machine with lens cavity, and directly plastic packaging is saturating on bracket
Mirror；
C, by the bracket of plastic packaging carries out cutting section in step b.
A kind of Novel LED chip packaging technology as described above further includes step a1 after the step a, by bowl knot
Structure is installed to the bracket.
Compared with prior art, the present invention has the following advantages:
1, the present invention provides a kind of Novel LED chip encapsulating structure, LED chip is mounted on bracket using flip chip technology
On (substrate), the connection type by plain conductor is needed instead of tradition, to avoided during the installation process because of Reflow Soldering
LED chip displacement is caused the case where LED chip off-centring occur, so that light-out effect is more preferable.And lens are used and are molded as
Type technique forms on bracket, and encapsulation one, the process for simplifying tradition attachment effectively lowers the costs such as artificial, equipment.
2, after a kind of Novel LED chip encapsulating structure of the present invention is by improving, the plain conductor in tradition is not only eliminated,
It is further without and fixation is additionally packaged to LED chip and conducting wire using adhesive layer, biggish bowl structure is set without specific,
Bracket can be arranged to no bowl structure or frivolous bowl structure, the save the cost from raw material, and make bracket more
It is frivolous.
3, the present invention also provides a kind of Novel LED chip packaging technologies, and which simplify traditional LED lamp beads to encapsulate work
Skill, and the position precision of LED chip is high, is not easy to deviate, and is conducive to improve light-out effect, and bracket can be more frivolous, reduce
Materials and cost.
[Detailed description of the invention]
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of Novel LED chip encapsulating structure embodiment one of the present invention (having bowl structure)；
Fig. 2 is a kind of structural schematic diagram of Novel LED chip encapsulating structure embodiment two (no bowl structure) of the present invention.
[specific embodiment]
In order to which the technical problems, technical solutions and beneficial effects solved by the present invention is more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
The present invention is achieved by the following technical solutions:
As shown in Figure 1, a kind of Novel LED chip encapsulating structure, including bracket 1, LED chip 2 and lens 3, the LED
Chip 2 is flip-chip and is mounted on the bracket 1 using flip-chip packaging techniques that the lens 3 use mould model
The direct plastic packaging of technique is on the bracket 1 equipped with LED chip 2；
The outer surface of the lens 3 is equipped with to match the recess 4 of light direction, and the side wall of the recess 4 is in incline
Tiltedly it is arranged and the top of the recess 4 is made to form flare openings, and in the center and the LED chip 2 of the recess 4
Heart alignment.The present invention provides a kind of Novel LED chip encapsulating structure, LED chip is mounted on bracket (base using flip chip technology
Plate) on, the connection type by plain conductor is needed instead of tradition, to avoided during the installation process because Reflow Soldering causes
There is the case where LED chip off-centring in LED chip displacement, so that light-out effect is more preferable.And lens use mould model work
Skill forms on bracket, and encapsulation one, the process for simplifying tradition attachment effectively lowers the costs such as artificial, equipment.
In the present solution, mould model technique basic procedure are as follows: the bracket (substrate) for being equipped with LED chip to be sent into
In the die cavity of the upper and lower mould of molding board (molding machine) (die cavity that the die cavity is lens shape), while plastic packaging material being led
Enter in mold, plastic packaging material solidifies after equipment is to mold heating, and then equipment automatically sends out the good bracket of plastic packaging, i.e., complete
At encapsulation, which makes lens installation encapsulate one progress with LED, realizes efficiently and saves manually, reduces costs.
And it in the present solution, enables to support Design to obtain without carrying out bonding wire craft after eliminating conducting wire more frivolous, is convenient for
The design of more diversification.
In addition, flip LED chips are managed using die bond, tin cream, elargol, eutectic weldering etc. is can be used in die bond conducting resinl, effectively
Manage its offset and voidage.And good heat dissipation effect, improve light-out effect.
This programme is due to saving bonding wire, and after the process of adhesive layer is arranged, bracket be can be set to bowl structure or without bowl
Cup structure.
Moreover, the bracket 1 is additionally provided with the insulation strip 8 for the bracket 1 to be isolated into positive pole zone and negative regions.
Embodiment one: as shown in Figure 1, there is bowl structure, and specifically, the bracket 1 installs the end face of LED chip 2
End face on be additionally provided with cricoid bowl structure 5, the LED chip 2 is mounted on the inside of the bowl structure 5.Wherein, described
Bracket 1 is Five-gold-sheet, and the bowl structure 5 is plastics bowl.It uses current material to be made, at low cost, easily manufactured.And bowl
Cup structure is only used for the intensity of reinforced support, it is made not allow easy fracture, more durable.
Moreover, the Sidewall Height h of the bowl structure 5 is less than the height after the LED chip 2 installation in the present embodiment
H.Due to being fixed in bowl without refilling adhesive layer, therefore its height can be thinned, and be conducive to the volume for reducing bowl, from
And the integral thickness of bracket is reduced, it additionally is able to the sound of shadow out for reducing bowl structure to LED chip, improves light-out effect.
Embodiment two: as shown in Fig. 2, without bowl structure, the bracket 1 installs the end face of LED chip 2 as plane, and institute
Lens 3 are stated to be directly connected on this plane.After it eliminates bowl structure, light-emitting angle is bigger, and light-out effect is more preferable, but bracket
Intensity needs be guaranteed.In the present embodiment, the bracket 1 is ceramic substrate or aluminum substrate.Its intensity is high, meets use and wants
Ask, but its cost is relatively high.
Further, the recess 5 is in inverted centrum shape, and the recess 5 includes the addendum cone mouth being arranged outwardly and direction
The base cone point that the LED chip 2 is arranged, the addendum cone mouth are connected by cambered surface or folding surface with 3 phase of lens.By straight
The setting recess 5 on the lens 3 is connect, realizes the light direction for changing the LED chip, forms the light type point of Batwing type
Cloth, and the recess 5 is designed to horn-like groove, so that the light that the LED chip 2 is issued passes through the recess 5
Refraction achievees the purpose that expand light emitting angle, and makes distribution curve flux in Batwing type, thus improve the face to be illuminated uniformity and
The utilization rate of light energy makes the light of LED lamp sending more evenly, avoids and increase secondary lens in application end, save production
The time of process flow reduces the cost of secondary optical design, so that overall structure is more compact, convenient for production and reduces
Production cost.
Moreover, the lens 2 use silica gel, silicone resin, epoxy resin, acrylic, the PC material, COC for being easy compression molding
Material, ABS material etc. are made, and preferred material is silica gel, it is to be understood that the curvature of the indent of the recess 5, linear etc. not by
Limitation.
In the present embodiment, the central core light of the LED chip 2 can be by the inner wall of the recess 5 toward periphery
It projects, largely the light of ratio can pass through the realization Batwing type light distribution curve of the recess 5.The addendum cone mouth is logical
It crosses arc surface or folding surface to be connected with 3 phase of lens, so that other can pass through the circular arc without the light of the recess 5
Face is projected toward periphery, light even transition, so that plane of illumination has the more preferably uniformity.
Further, the LED chip 2 is the chip of 5 face light transmissions, and photochromic consistency is good, and illumination effect is good.
A kind of Novel LED chip packaging technology, includes the following steps, a, positions 2 flip-chip packaging techniques of LED chip
It is mounted on bracket 1；B, the bracket 1 for installing LED chip 2 is directed into the molding machine with 2 die cavity of lens, directly in bracket
Plastic packaging lens 2 on 1；C, by the bracket 1 of plastic packaging carries out cutting section in step b.Which simplify traditional LED lamp beads to encapsulate work
Skill, and the position precision of LED chip is high, is not easy to deviate, and is conducive to improve light-out effect, and bracket can be more frivolous, reduce
Materials and cost.Make full use of the photochromic consistency of LED chip good, so that overall volume is small, the advantages of good heat dissipation.And exempt from
Process in addition to mounting lens, reduces cost of labor.
Traditional LED packaging LED chips are connected on bracket using conducting wire, are needed by Reflow Soldering process, by air
Or nitrogen is heated to sufficiently high temperature after-blow to the wiring board for having posted element, after allowing the solder of elements on either side to melt with master
Plate bonding.With the development of science and technology, being sized for for chip is fewer and fewer, chip is being easy to cause by the way of the Reflow Soldering
Displacement causes its center and the center of lens after installing to shift, directly affects its light-out effect.
In addition, further include after the step a step a1, by the installation of bowl structure 5 on the bracket 1.It is suitable for
Increase the intensity of bracket, and be maximumlly thinned bowl structure, bracket can corresponding constriction, it is lightening and more convenient for product
The design of diversification.
The present invention provides a kind of Novel LED chip encapsulating structure, LED chip is mounted on bracket using flip chip technology
On (substrate), the connection type by plain conductor is needed instead of tradition, to avoided during the installation process because of Reflow Soldering
LED chip displacement is caused the case where LED chip off-centring occur, so that light-out effect is more preferable.And lens are used and are molded as
Type technique forms on bracket, and encapsulation one, the process for simplifying tradition attachment effectively lowers the costs such as artificial, equipment.
It is the one or more embodiments provided in conjunction with particular content as described above, does not assert specific reality of the invention
It applies and is only limited to these instructions.It is all approximate with method of the invention, structure etc., identical, or for present inventive concept under the premise of
It makes several technologies to deduce, or replacement all should be considered as protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811390377.7A CN109686832A (en) | 2018-11-21 | 2018-11-21 | A kind of Novel LED chip encapsulating structure and manufacture craft |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811390377.7A CN109686832A (en) | 2018-11-21 | 2018-11-21 | A kind of Novel LED chip encapsulating structure and manufacture craft |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109686832A true CN109686832A (en) | 2019-04-26 |
Family
ID=66184880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811390377.7A Pending CN109686832A (en) | 2018-11-21 | 2018-11-21 | A kind of Novel LED chip encapsulating structure and manufacture craft |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686832A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241354A (en) * | 2022-08-09 | 2022-10-25 | 东莞市立德达光电科技有限公司 | LED packaging structure and method |
| CN117293254A (en) * | 2023-09-26 | 2023-12-26 | 湖北瑞华光电有限公司 | LED packaging structure and packaging method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845817A (en) * | 2016-03-25 | 2016-08-10 | 武汉优炜星科技有限公司 | Large-power inverted-structure ultraviolet LED curing light source and preparation method thereof |
| CN108281537A (en) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | Packaging structure of L ED lamp pearl |
| CN207967043U (en) * | 2018-03-20 | 2018-10-12 | 木林森股份有限公司 | packaging structure of L ED lamp pearl |
-
2018
- 2018-11-21 CN CN201811390377.7A patent/CN109686832A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845817A (en) * | 2016-03-25 | 2016-08-10 | 武汉优炜星科技有限公司 | Large-power inverted-structure ultraviolet LED curing light source and preparation method thereof |
| CN108281537A (en) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | Packaging structure of L ED lamp pearl |
| CN207967043U (en) * | 2018-03-20 | 2018-10-12 | 木林森股份有限公司 | packaging structure of L ED lamp pearl |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115241354A (en) * | 2022-08-09 | 2022-10-25 | 东莞市立德达光电科技有限公司 | LED packaging structure and method |
| CN117293254A (en) * | 2023-09-26 | 2023-12-26 | 湖北瑞华光电有限公司 | LED packaging structure and packaging method |
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Application publication date: 20190426 |