CN109613803A - A kind of alignment device of double-sided exposure, method and apparatus - Google Patents
A kind of alignment device of double-sided exposure, method and apparatus Download PDFInfo
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- CN109613803A CN109613803A CN201811557789.5A CN201811557789A CN109613803A CN 109613803 A CN109613803 A CN 109613803A CN 201811557789 A CN201811557789 A CN 201811557789A CN 109613803 A CN109613803 A CN 109613803A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims description 47
- 239000003550 marker Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 description 18
- 229910000838 Al alloy Inorganic materials 0.000 description 13
- 230000007306 turnover Effects 0.000 description 9
- 229910001374 Invar Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000004579 marble Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 230000003252 repetitive effect Effects 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010960 commercial process Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
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Abstract
The invention discloses a kind of alignment devices of double-sided exposure, method and apparatus, belong to printed wiring board technical field.Described device includes: including telltale mark, mark label and position acquisition device, the location information of telltale mark is all obtained by position acquisition device before each sample exposure to be exposed, to know the location variation in actual production of telltale mark, since the relative position of mark label and telltale mark is constant, so learning the location variation of mark label in actual production, adjust the position of the another side exposure figure of sample to be exposed in real time according to the location variation, it is inaccurate to solve the problems, such as that the prior art can not carry out exposure aligning caused by positioning in real time to mark label in real time, improve the precision of sample double-sided alignment to be exposed.
Description
Technical field
The present invention relates to a kind of alignment devices of double-sided exposure, method and apparatus, belong to printed wiring board technical field.
Background technique
Laser direct-writing (laser direct imaging, LDI) exposure machine is needed when producing internal layer circuit plate to printing
Circuit board (Printed Circuit Board, PCB) two sides image is precisely aligned, to guarantee the essence of pcb board two-side graph
Really contraposition.
In process of production, the mode for generalling use laser marking carries out the essence of internal layer pcb board from two mark of main pip
Really contraposition.There is mark to expose diaphragm in the bottom of vacuum chuck, when carrying out the exposure printing in the first face of internal layer pcb board, passes through
Mark exposes diaphragm in non-exposed areas two mark of label in a manner of laser marking at the another side edge of pcb board；Turnover panel
Afterwards, the rotation of PCB is calculated with the diaphragm coordinate for getting the two mark by 2 mark coordinates of laser labelling on pcb board face
Turn and translates, so that the exactitude position of PCB two-side graph is completed, it follows that the exactitude position of internal layer pcb board is such as completed,
Need to be accurately positioned the position of mark exposure diaphragm.
But mark, which exposes diaphragm, to be fixed on metal vacuum sucker, side length >=500mm of vacuum chuck, with production
It carries out, if board internal temperature varies widely, the vacuum chuck of metal, which is influenced by temperature, to expand with heat and contract with cold, moreover,
Have vacuum cavity among vacuum chuck, vacuumize pcb board is adsorbed when inside cavity vacuum degree reach -20kpa, very
Suction consolidation body main body of vacuum chuck under the atmospheric pressure by 20kpa deforms, and the deformation is irregular non-linear
Deformation, due to expanding with heat and contract with cold and vacuum suction can all lead to vacuum chuck deformation occurs, so being mounted on sucker edge
The position of mark exposure diaphragm also changes.When due to exposure, mark exposes diaphragm and is covered by the PCB of required exposure, nothing
Method it is carried out while or real-time calibration, therefore the positioning method of existing mark exposure diaphragm is, at interval of certain time, calibration
When calibration positioning is carried out to mark exposure diaphragm, if harmomegathus or deformation occur for vacuum chuck, then in interval of calibration
The position of mark exposure diaphragm changes, and continuously exposes so traditional localization method can not expose diaphragm to mark in pcb board
Light time be accurately positioned simultaneously or in real time.
Summary of the invention
In order to solve presently, there are the vacuum chuck in interval of calibration occur harmomegathus or deformation cause mark to expose
The position of diaphragm aligns inaccurate problem caused by changing, the present invention provides a kind of alignment device of double-sided exposure,
The exposure sources of method and the alignment device including double-sided exposure.
The first purpose of the invention is to provide a kind of alignment device of double-sided exposure, described device includes:
Telltale mark, mark label and position acquisition device；
The telltale mark is used to determine the position of the mark label in real time, thus the position marked according to the mark
Determine the exposure figure position of sample to be exposed；
The mark label carries out mark for treating exposed sample；
The position acquisition device is used to obtain the location information of the telltale mark in real time.
Optionally, the relative position variable quantity of the telltale mark and mark label is less than predetermined value, described predetermined
Value alignment precision required when carrying out double-sided exposure according to the sample to be exposed is set.
Optionally, the distance of the telltale mark and mark label is less than 20mm and/or is connected by resistance to deformation material
It connects.
Optionally, described device further include:
Sample bearing device and marking device；The sample bearing device is for carrying the sample to be exposed；It is described to beat
Device for mark is used to carry out mark to the sample to be exposed by mark label；
The mark label is located on the sample bearing device.
Optionally, the mark label is located at the marginal portion of the sample bearing device.
Optionally, the mark label is corresponded with the telltale mark；The telltale mark is right therewith for determination
The position for the mark label answered.
A second object of the present invention is to provide a kind of alignment methods of double-sided exposure, the method is applied to above-mentioned double
In the alignment device of face exposure, which comprises
Treat being exposed on one side for exposed sample；
The another side of the sample to be exposed is marked by mark label；
The location information of telltale mark is obtained in real time；
The location information of the mark label is determined according to the location information of the telltale mark got in real time；
Alignment exposure is carried out to sample another side according to the location information that the mark marks.
Optionally, it is described treat being exposed on one side of exposed sample before, further includes:
It obtains in real time and treats the location information of telltale mark when being exposed on one side of exposed sample, and according to getting
The location information of telltale mark exposes intermediate marker out in the one side of sample to be exposed, and the intermediate marker is for determining its place
The position of the exposure figure in face.
Optionally, it is described by mark label the another side of the sample to be exposed is marked before, further includes:
At least two marks label is chosen according to the size of the sample to be exposed；
The sample to be exposed is covered on the mark label and selected mark label cannot be covered and is corresponded to
Telltale mark.
Optionally, the location information according to mark label be aligned exposing to sample another side includes:
Determine the position of the exposure figure of the sample another side to be exposed in real time according to the location information that the mark marks
It sets；
According to the position of the exposure figure of the sample another side to be exposed determined in real time to the sample to be exposed
Another side is exposed.
Third object of the present invention is a kind of exposure sources, and the exposure sources include the alignment dress of above-mentioned double-sided exposure
It sets.
The medicine have the advantages that
By providing a kind of alignment device of double-sided exposure, including telltale mark, mark label and position acquisition device,
Suitable mark all is chosen according to the size of sample to be exposed before each sample exposure to be exposed to mark, and passes through position acquisition
Device obtains the location information that selected mark marks corresponding telltale mark, then gets the position letter of mark label
Breath, so that it is determined that variable quantity of the position of mark label relative to commitment positions when the exposed sample exposes, according to the variable quantity
The position for adjusting the another side exposure figure of set sample to be exposed in real time, solving the prior art can not be in real time to mark mark
It remembers the inaccurate problem of exposure aligning caused by row positioning in real time into, improves the precision of sample double-sided alignment to be exposed.Pass through
The distance of telltale mark and mark label is less than 20mm and/or is attached by resistance to deformation material, ensure that the two is exposing
The predetermined value of required alignment precision setting when relative position variable quantity is less than according to sample exposure to be exposed in the process, thus
Improve the effect of the precision of sample double-sided alignment to be exposed；All pass through position acquisition before each sample exposure to be exposed
Device obtains the location information of telltale mark, then gets the location information of mark label, so that it is determined that the exposed sample exposes
Variable quantity of the position of light time mark label relative to commitment positions, set sample to be exposed is adjusted according to the variable quantity in real time
Another side exposure figure position, improve the precision of sample double-sided alignment to be exposed.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the alignment device schematic diagram for the double-sided exposure that the embodiment of the present invention one provides；
Fig. 2 is the alignment device schematic diagram for the double-sided exposure that the embodiment of the present invention two and three provides；
Fig. 3 is that the position that telltale mark and mark label are located at loading sucker edge lower part in the embodiment of the present invention is illustrated
Figure；
Fig. 4 is the position that telltale mark and mark label are located at loading sucker edge side and lower part in the embodiment of the present invention
Schematic diagram；
Fig. 5 is that sample to be exposed is placed in position view when being exposed on loading sucker；
Fig. 6 is the schematic diagram of the exposure sources for the alignment device including double-sided exposure that the embodiment of the present invention four provides；
Fig. 7 is the front position schematic diagram of telltale mark and mark label in the present invention, wherein 1 is that mark marks, 3 be fixed
Position label；
Fig. 8 is the positional relationship sectional view of 405 laser sources and mark label and telltale mark in the present invention, wherein 1 is to beat
Mark label, 3 be telltale mark, 4 be eyeglass, 5 be 405 laser, 6 be laser controller；
Fig. 9 is that telltale mark and mark label are by resistance to deformation material connection schematic diagram in the embodiment of the present invention, wherein 1 is
Mark label, 2 be resistance to deformation material, 3 be telltale mark；
Figure 10 is the placement schematic diagram of sample to be exposed in the exposure method of double-sided exposure that the embodiment of the present invention five provides；
Figure 11 is sample exposure process signal to be exposed in the exposure method for the double-sided exposure that the embodiment of the present invention five provides
Figure.
Specific embodiment
In commercial process, the aligning accuracy of the tow sides of PCB internal layer imperforate plate is required within 10 μm, still
At precision and image due to influencing the repetitive positioning accuracy because being known as system axle system of this aligning accuracy, loading sucker system
Manage precision, wherein loading sucker system is due to following two: (1) suction cup main body uses metal material aluminium alloy, with temperature
Variation and there is the characteristic expanded with heat and contract with cold；(2) loading sucker needs to carry out vacuum suction to pcb board, and vacuum suction can be led
The deformation for causing sucker, so loading sucker system is caused to cause very the aligning accuracy of the tow sides of PCB internal layer imperforate plate
Big influence；In practical application, the thermal expansion coefficient of aluminium alloy is 23 μm/ DEG C .m, temperature fluctuation at ± 2 DEG C, loading sucker
In 650mm (width) * 850mm (length) size, edge deformation is respectively size
μm 23*4*0.85=78.2 (length)；μm 23*4*0.65=59.8 (width)；
That is for suction cup main body in the case where temperature fluctuation ± 2 DEG C, width direction changes 59.8 μm, length direction variation 78.2
μm.As the aligning accuracy of the fluctuation tow sides of temperature can change, the index far beyond 10 μm.
And when carrying out vacuum suction to pcb board, loading suction cup main body is 650mm (width) * 850mm (length) * 23mm (thickness)
Aluminum alloy part, and there is vacuum cavity in centre, and the vacuum degree of inside cavity reaches -20kpa when vacuumizing, and loading sucker is whole
Body causes suction cup main body that irregular nonlinear deformation occurs under the atmospheric pressure by 20kpa；Pass through actual test, deflection
At 5 μm or so, although the index without departing from 10 μm has contributed 50% to system aligning accuracy, caused by influence also to compare
It is larger.
For above-mentioned reason (1), it is proposed that the material for selecting thermal expansion coefficient low, such as invar, marble, silicon carbide,
Deng, but these material difficulty of processing are big, marble, silicon carbide are fragile, and cost is 5-10 times of aluminium alloy.So can not
Consider these materials.
And above-mentioned reason (2) is advised since the deformation of suction cup main body is irregular nonlinear so its variation can not be found
Rule, can not also solve.
Since in process of production, pcb board is covered on the hole mark, so the mode being commonly used is to pass through
The mode of periodic calibration positioning leads to the deformation of sucker, this side to compensate suction cup main body with variation with temperature and vacuum suction
Method can not determine the deflection of loading suction cup main body in real time.
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
Embodiment one
The present embodiment provides a kind of alignment devices of double-sided exposure, and referring to Fig. 1, described device includes:
Telltale mark 11, mark label 12 and position acquisition device 13；
Telltale mark 11 is used to determine the position of the mark label 12 in real time, thus true according to the position of mark label 12
The exposure figure position of fixed sample to be exposed；
Mark label 12 carries out mark for treating exposed sample；
Position acquisition device 13 is used to obtain the location information of the telltale mark in real time.
The embodiment of the present invention is by providing a kind of alignment device of double-sided exposure, including telltale mark, mark label and position
Acquisition device is set, obtains the location information of telltale mark in real time by position acquisition device, to get the reality of mark label
When location information, the another side of exposed sample is then treated according to the real-time position information that mark marks and carries out alignment exposure, is solved
The prior art of having determined can not carry out the inaccurate problem of exposure aligning caused by accurately positioning to mark label in real time, reach
Improve the effect of the precision of sample double-sided alignment to be exposed.
Embodiment two
The present embodiment provides a kind of alignment device of double-sided exposure and methods, and referring to fig. 2, described device includes:
Telltale mark 11, mark label 12, position acquisition device 13, sample bearing device 14 and marking device 15；
Telltale mark 11 in real time determine mark label 12 position, thus according to the position of mark label 12 determine to
The exposure figure position of exposed sample；
Mark label 12 carries out mark for treating exposed sample；
Position acquisition device 13 is used to obtain the location information of the telltale mark in real time；
Wherein, the relative position variable quantity of telltale mark 11 and mark label 12 be less than predetermined value, the predetermined value according to
Exposed sample carries out alignment precision setting required when double-sided exposure；The distance of telltale mark 11 and mark label 12 is less than
It 20mm and/or is connected by resistance to deformation material；
Sample bearing device 14 is for carrying sample to be exposed；Marking device 15 is used for through mark label 12 to be exposed
Sample carries out mark；
Mark label 12 is located on sample bearing device 14.
The present embodiment using sample to be exposed as pcb board, sample bearing device be carry and the loading sucker of fixed pcb board,
Loading sucker is made of aluminum alloy materials, and mark label 12 is the mark hole on loading sucker, and position acquisition device 13 is
CCD camera, marking device 15 be 405 laser sources for be illustrated.
Specifically, being covered on mark hole when pcb board is placed on loading sucker, so that 405 laser sources are to pcb board
Mark is carried out towards the one side of the direction, guarantees that pcb board is not covered with telltale mark, so that CCD camera obtains telltale mark
Location information, the telltale mark can be a location hole on loading sucker, and the location hole is small at a distance from mark hole
In 20mm, it is also possible to the marker connected with mark hole by resistance to deformation material, as shown in Figure 9；As long as meeting work
Less than one predetermined value of relative position variable quantity between telltale mark and mark hole in the process, the predetermined value according to pcb board into
The alignment precision required when row double-sided exposure is set；
Such as, it is desirable that the alignment of the tow sides of pcb board is accurately within 10 μm, then the predetermined value is set as 2 μm, if
The telltale mark is the location hole on loading sucker, is less than then the distance between the location hole and mark hole is arranged
20mm, then in pcb board exposure process, according to the 23 μm/ DEG C .m of thermal expansion coefficient of the making material aluminium alloy of loading sucker,
Temperature fluctuation range ± 2 DEG C in exposure process, then the location hole and the relative position variable quantity in mark hole are 23*4*0.02=
1.8 μm 2 μm of <, and due to the rigidity of aluminium alloy part be greater than integral rigidity, so between location hole and mark hole away from
From it is smaller when, suffered vacuum influence very little can be ignored；By actual test, the location hole is opposite with mark hole
Location variation meets the standard less than 2 μm of predetermined value.
Equally, if telltale mark is the marker being attached by resistance to deformation material and mark hole, then due to resistance
Shape material is affected by temperature very little, and the described telltale mark and the relative position variable quantity in mark hole can be ignored.
In practical application, the lesser materials of coefficients such as invar, marble, ceramics thermal expansion are can be used in resistance to deformation material, this
A little materials are affected by temperature very little, for example, the thermal expansion coefficient of invar is 0.8 μm/ DEG C/m, marmorean thermal expansion coefficient is 5 μ
M/ DEG C/m, ceramic thermal expansion coefficient is 7 μm/ DEG C/m, even if the length of connection telltale mark and the resistance to deformation material in mark hole
Up to 100mm, in ± 2 DEG C of range of temperature, the deformation quantity of resistance to deformation material is respectively 0.8*4*0.1=0.32 μ
M, 5*4*0.1=2 μm, 7*4*0.1=2.8 μm, and in practical application, it is up to the resistance to deformation material
100mm, such as the distance between above-mentioned telltale mark and mark hole are 20mm, then in ± 2 DEG C of range of temperature, resistance
The deformation quantity of shape material is respectively 0.8*4*0.02=0.064 μm, 5*4*0.02=0.4 μm, 7*4*0.02=0.56 μm, so
The telltale mark and the relative position variable quantity in mark hole can be ignored.
To reach higher alignment precision requirement, telltale mark can be set and be less than 20mm or less at a distance from mark label
Any number.
In exposure process, the location information for the telltale mark that CCD camera is got is exposed to pcb board another side
When, the location information of the telltale mark got according to CCD camera determines the location information in mark hole, thus according to mark hole
Location information determines the position of the exposure figure of pcb board another side, is then exposed.
For convenience of description, the two sides of pcb board is denoted as the face A and the face B respectively；
For example, the mark hole initial alignment position recorded in system is denoted asTelltale mark initial alignment position note
ForWhen exposing certain pcb board, telltale mark real time position is denoted asCCD camera gets telltale mark phase
Change in location for the initial position recorded in system are as follows:
Since telltale mark and the relative position variable quantity in mark hole can be ignored, it is known that, the position in mark hole
Set variation are as follows:
Mark hole is denoted as in the theoretical value of the face B mark position
When upper lower turnover panel, pcb board plate height is denoted as H, and board bottom side X-coordinate is denoted as Xbottom；
Obtaining mark hole in the desired locations in the face B in the theoretical value of the face B mark position according to above-mentioned mark hole is
The practical mark hole site captured in the face B after turnover panel
Alignment result
The face exposure figure A positionIt is obtained by Y mirror image
I.e. the face B graph position is
The embodiment of the present invention is by providing a kind of alignment device of double-sided exposure, including telltale mark, mark label and position
Acquisition device is set, obtains the location information of telltale mark in real time by position acquisition device, to get the reality of mark label
When location information, the another side of exposed sample is then treated according to the real-time position information that mark marks and carries out alignment exposure, is solved
The prior art of having determined can not carry out the inaccurate problem of exposure aligning caused by accurately positioning to mark label in real time, by fixed
The distance of position label and mark label is less than 20mm and/or to be attached by resistance to deformation material, both ensure that exposed
The predetermined value of required alignment precision setting when relative position variable quantity is less than according to sample exposure to be exposed in journey, to mention
The high effect of the precision of sample double-sided alignment to be exposed.
During actual exposure, mark label and telltale mark can to correspond, telltale mark for determine with
Corresponding mark label position；It can also be one-to-many；Such as the corresponding two or more telltale marks of mark label,
The comprehensive location information for determining mark label can also mark a corresponding telltale mark, the telltale mark pair with multiple marks
It should determine the position of above-mentioned multiple mark labels.
The following embodiments three of the present invention and example IV are said with telltale mark as one-to-one relationship using mark label
Bright, mark label and telltale mark positional relationship are as shown in Figure 7.
Embodiment three
The present embodiment provides a kind of alignment device of double-sided exposure and methods, and referring to fig. 2, described device includes:
Telltale mark 11, mark label 12, position acquisition device 13, sample bearing device 14 and marking device 15；
Telltale mark 11 in real time determine mark label 12 position, thus according to the position of mark label 12 determine to
The exposure figure position of exposed sample；
Mark label 12 carries out mark for treating exposed sample；
Position acquisition device 13 is used to obtain the location information of the telltale mark in real time；
Wherein, the relative position variable quantity of telltale mark 11 and mark label 12 be less than predetermined value, the predetermined value according to
Exposed sample carries out alignment precision setting required when double-sided exposure；The distance of telltale mark 11 and mark label 12 is less than
It 20mm and/or is connected by resistance to deformation material；
Sample bearing device 14 is for carrying sample to be exposed；Marking device 15 is used for through mark label 12 to be exposed
Sample carries out mark；
Mark label 12 is located on sample bearing device 14.
The present embodiment using sample to be exposed as pcb board, sample bearing device be carry and the loading sucker of fixed pcb board,
Loading sucker is made of aluminum alloy materials, and mark label 12 is the mark hole on loading sucker, and position acquisition device 13 is
CCD camera, marking device 15 be 405 laser sources for be illustrated.
405 laser source of marking device and the positional relationship sectional view of mark label and telltale mark are as shown in Figure 8；
Specifically, being covered on mark hole when pcb board is placed on loading sucker, so that 405 laser sources are to pcb board
Mark is carried out towards the one side of the direction, guarantees that pcb board is not covered with telltale mark, so that CCD camera obtains telltale mark
Location information, the telltale mark can be a location hole on loading sucker, and the location hole is small at a distance from mark hole
In 20mm, it is also possible to the marker connected with mark hole by resistance to deformation material, is positioned as long as meeting in the course of work
Less than one predetermined value of relative position variable quantity between label and mark hole, the predetermined value carry out double-sided exposure according to pcb board
The alignment precision of Shi Yaoqiu is set；
Such as, it is desirable that the alignment of the tow sides of pcb board is accurately within 10 μm, then the predetermined value is set as 2 μm, if
The telltale mark is the location hole on loading sucker, is less than then the distance between the location hole and mark hole is arranged
20mm, then in pcb board exposure process, according to the 23 μm/ DEG C .m of thermal expansion coefficient of the making material aluminium alloy of loading sucker,
Temperature fluctuation range ± 2 DEG C in exposure process, then the location hole and the relative position variable quantity in mark hole are 23*4*0.02=
1.8 μm 2 μm of <, and due to the rigidity of aluminium alloy part be greater than integral rigidity, so between location hole and mark hole away from
From it is smaller when, suffered vacuum influence very little can be ignored；By actual test, the location hole is opposite with mark hole
Location variation meets the standard less than 2 μm of predetermined value.
Equally, if telltale mark is the marker being attached by resistance to deformation material and mark hole, then due to resistance
Shape material is affected by temperature very little, and the described telltale mark and the relative position variable quantity in mark hole can be ignored.
In practical application, the lesser materials of coefficients such as invar, marble, ceramics thermal expansion are can be used in resistance to deformation material, this
A little materials are affected by temperature very little, for example, the thermal expansion coefficient of invar is 0.8 μm/ DEG C/m, marmorean thermal expansion coefficient is 5 μ
M/ DEG C/m, ceramic thermal expansion coefficient is 7 μm/ DEG C/m, even if the length of connection telltale mark and the resistance to deformation material in mark hole
Up to 100mm, in ± 2 DEG C of range of temperature, the deformation quantity of resistance to deformation material is respectively 0.8*4*0.1=0.32 μ
M, 5*4*0.1=2 μm, 7*4*0.1=2.8 μm, and in practical application, it is up to the resistance to deformation material
100mm, such as the distance between above-mentioned telltale mark and mark hole are 10mm, then in ± 2 DEG C of range of temperature, resistance
The deformation quantity of shape material is respectively 0.8*4*0.02=0.064 μm, 5*4*0.02=0.4 μm, 7*4*0.02=0.56 μm, so
The telltale mark and the relative position variable quantity in mark hole can be ignored.
To reach higher alignment precision requirement, telltale mark can be set and be less than 20mm or less at a distance from mark label
Any number.
In exposure process, mark label is chosen according to the size of pcb board；As shown in Fig. 3, Fig. 4 and Fig. 5, according to pcb board
Size chooses arbitrary mark label.
Mark label can be located at any position of loading sucker.
In exposure process, the location information for the telltale mark that CCD camera is got is exposed to pcb board another side
When, the location information of the telltale mark got according to CCD camera determines the location information in mark hole, thus according to mark hole
Location information determines the position of the exposure figure of pcb board another side, is then exposed.
For convenience of description, the two sides of pcb board is denoted as the face A and the face B respectively；
For example, the mark hole initial alignment position recorded in system is denoted asTelltale mark initial alignment position note
ForWhen exposing certain pcb board, telltale mark real time position is denoted asCCD camera gets telltale mark phase
Change in location for the initial position recorded in system are as follows:
Since telltale mark and the relative position variable quantity in mark hole can be ignored, it is known that, the position in mark hole
Set variation are as follows:
Mark hole is denoted as in the theoretical value of the face B mark position
When upper lower turnover panel, pcb board plate height is denoted as H, and board bottom side X-coordinate is denoted as Xbottom；
Obtaining mark hole in the desired locations in the face B in the theoretical value of the face B mark position according to above-mentioned mark hole is
The practical mark hole site captured in the face B after turnover panel
Alignment result
The face exposure figure A positionIt is obtained by Y mirror image
I.e. the face B graph position is
The embodiment of the present invention is by providing a kind of alignment device of double-sided exposure, including telltale mark, mark label and position
Acquisition device is set, all obtains the position letter of telltale mark by position acquisition device before each sample exposure to be exposed
Breath, then get mark label location information, so that it is determined that the exposed sample expose when mark label position relative to
The variable quantity of commitment positions adjusts the position of the another side exposure figure of set sample to be exposed according to the variable quantity in real time,
It solves the problems, such as that the prior art can not carry out exposure aligning caused by positioning in real time to mark label in real time and be not allowed, improves
The precision of sample double-sided alignment to be exposed.It is less than 20mm by the distance that telltale mark and mark mark and/or passes through resistance to deformation
Material is attached, and ensure that the two is wanted when relative position variable quantity is less than according to sample exposure to be exposed in exposure process
The predetermined value for the alignment precision setting asked, to improve the effect of the precision of sample double-sided alignment to be exposed；Each to
The location information for all obtaining telltale mark before exposed sample exposure by position acquisition device, then gets mark label
Location information, so that it is determined that variable quantity of the position of mark label relative to commitment positions when the exposed sample exposes, according to this
Variable quantity adjusts the position of the another side exposure figure of set sample to be exposed in real time, improves sample double-sided alignment to be exposed
Precision.
Example IV
The present embodiment provides the exposure sources for the alignment device for including double-sided exposure, and referring to Fig. 6, described device includes:
Telltale mark 11, mark label 12, position acquisition device 13, sample bearing device 14, marking device 15 and exposure
Equipment 16；
Telltale mark 11 in real time determine mark label 12 position, thus according to the position of mark label 12 determine to
The exposure figure position of exposed sample；
Mark label 12 carries out mark for treating exposed sample；
Position acquisition device 13 is used to obtain the location information of the telltale mark in real time；
Exposure sources 16 are exposed for treating exposed sample；
Wherein, the relative position variable quantity of telltale mark 11 and mark label 12 be less than predetermined value, the predetermined value according to
Exposed sample carries out alignment precision setting required when double-sided exposure；The distance of telltale mark 11 and mark label 12 is less than
It 20mm and/or is connected by resistance to deformation material；
Sample bearing device 14 is for carrying sample to be exposed；Marking device 15 is used for through mark label 12 to be exposed
Sample carries out mark；
Mark label 12 is located on sample bearing device 14.
The present embodiment using sample to be exposed as pcb board, sample bearing device be carry and the loading sucker of fixed pcb board,
Loading sucker is made of aluminum alloy materials, and mark label 12 is the mark hole on loading sucker, and position acquisition device 13 is
CCD camera, marking device 15 be 405 laser sources for be illustrated.
Specifically, being covered on mark hole when pcb board is placed on loading sucker, so that 405 laser sources are to pcb board
Mark is carried out towards the one side of the direction, guarantees that pcb board is not covered with telltale mark, so that CCD camera obtains telltale mark
Location information, the telltale mark can be a location hole on loading sucker, and the location hole is small at a distance from mark hole
In 20mm, it is also possible to the marker connected with mark hole by resistance to deformation material, is positioned as long as meeting in the course of work
Less than one predetermined value of relative position variable quantity between label and mark hole, the predetermined value carry out double-sided exposure according to pcb board
The alignment precision of Shi Yaoqiu is set；
Such as, it is desirable that the alignment of the tow sides of pcb board is accurately within 10 μm, then the predetermined value is set as 2 μm, if
The telltale mark is the location hole on loading sucker, is less than then the distance between the location hole and mark hole is arranged
20mm, then in pcb board exposure process, according to the 23 μm/ DEG C .m of thermal expansion coefficient of the making material aluminium alloy of loading sucker,
Temperature fluctuation range ± 2 DEG C in exposure process, then the location hole and the relative position variable quantity in mark hole are 23*4*0.02=
1.8 μm 2 μm of <, and due to the rigidity of aluminium alloy part be greater than integral rigidity, so between location hole and mark hole away from
From it is smaller when, suffered vacuum influence very little can be ignored；By actual test, the location hole is opposite with mark hole
Location variation meets the standard less than 2 μm of predetermined value.
Equally, if telltale mark is the marker being attached by resistance to deformation material and mark hole, then due to resistance
Shape material is affected by temperature very little, and the described telltale mark and the relative position variable quantity in mark hole can be ignored.
In practical application, the lesser materials of coefficients such as invar, marble, ceramics thermal expansion are can be used in resistance to deformation material, this
A little materials are affected by temperature very little, for example, the thermal expansion coefficient of invar is 0.8 μm/ DEG C/m, marmorean thermal expansion coefficient is 5 μ
M/ DEG C/m, ceramic thermal expansion coefficient is 7 μm/ DEG C/m, even if the length of connection telltale mark and the resistance to deformation material in mark hole
Up to 100mm, in ± 2 DEG C of range of temperature, the deformation quantity of resistance to deformation material is respectively 0.8*4*0.1=0.32 μ
M, 5*4*0.1=2 μm, 7*4*0.1=2.8 μm, and in practical application, it is up to the resistance to deformation material
100mm, such as the distance between above-mentioned telltale mark and mark hole are 10mm, then in ± 2 DEG C of range of temperature, resistance
The deformation quantity of shape material is respectively 0.8*4*0.02=0.064 μm, 5*4*0.02=0.4 μm, 7*4*0.02=0.56 μm, so
The telltale mark and the relative position variable quantity in mark hole can be ignored.
To reach higher alignment precision requirement, telltale mark can be set and be less than 20mm or less at a distance from mark label
Any number.
In exposure process, pcb board is placed on when being exposed on loading sucker, is chosen at least according to the size of pcb board
Two mark labels；Mark label is located at the marginal portion arbitrary portion of loading sucker, as shown in Fig. 3, Fig. 4 and Fig. 5.
Pcb board is covered on mark mark hole and the selected corresponding telltale mark in mark mark hole cannot be covered.
In exposure process, the location information for the telltale mark that CCD camera is got is exposed to pcb board another side
When, the location information of the telltale mark got according to CCD camera determines the location information in mark hole, thus according to mark hole
Location information determines the position of the exposure figure of pcb board another side, is then exposed.
For convenience of description, the two sides of pcb board is denoted as the face A and the face B respectively；
For example, the mark hole initial alignment position recorded in system is denoted asTelltale mark initial alignment position note
ForWhen exposing certain pcb board, telltale mark real time position is denoted asCCD camera gets telltale mark phase
Change in location for the initial position recorded in system are as follows:
Since telltale mark and the relative position variable quantity in mark hole can be ignored, it is known that, the position in mark hole
Set variation are as follows:
Mark hole is denoted as in the theoretical value of the face B mark position
When upper lower turnover panel, pcb board plate height is denoted as H, and board bottom side X-coordinate is denoted as Xbottom；
Obtaining mark hole in the desired locations in the face B in the theoretical value of the face B mark position according to above-mentioned mark hole is
The practical mark hole site captured in the face B after turnover panel
Alignment result
The face exposure figure A positionIt is obtained by Y mirror image
I.e. the face B graph position is
Through actual test, the present invention reaches 1 μm in system shafting repetitive positioning accuracy, and image procossing precision reaches 1 μm
Under the premise of, it can guarantee being accurately located within 10 μm for the tow sides of PCB internal layer imperforate plate.
The embodiment of the present invention is by providing a kind of alignment device of double-sided exposure, including telltale mark, mark label and position
Acquisition device is set, suitable mark mark is all chosen according to the size of sample to be exposed before each sample exposure to be exposed
Note obtains the location information that selected mark marks corresponding telltale mark by position acquisition device, then gets and beat
The location information of label, so that it is determined that variation of the position of mark label relative to commitment positions when the exposed sample exposes
Amount, adjusts the position of the another side exposure figure of set sample to be exposed in real time according to the variable quantity, solves the prior art
The inaccurate problem of exposure aligning caused by positioning in real time can not be carried out to mark label in real time, it is two-sided to improve sample to be exposed
The precision of alignment.It is less than 20mm by the distance that telltale mark and mark mark and/or is attached by resistance to deformation material, is protected
The two alignment precision required when relative position variable quantity is less than according to sample exposure to be exposed in exposure process has been demonstrate,proved to set
Fixed predetermined value, to improve the effect of the precision of sample double-sided alignment to be exposed；Each sample exposure to be exposed it
The preceding location information that telltale mark is all obtained by position acquisition device, then gets the location information of mark label, thus
Variable quantity of the position of mark label relative to commitment positions, adjusts in real time according to the variable quantity when determining exposed sample exposure
The precision of sample double-sided alignment to be exposed is improved in the position of the another side exposure figure of set sample to be exposed.
Embodiment five
The present embodiment provides a kind of exposure methods of double-sided exposure, referring to Figure 10 and Figure 11.
As shown in Figure 10, substrate 20 to be exposed is placed on sample bearing device 14, while position acquisition device 13 obtains
Take the location information of selected telltale mark 11.
As shown in figure 11, the location information that selected telltale mark 11 is obtained according to position acquisition device 13, uses exposure
Equipment 16 exposes positioning Mark 21 out on substrate 20 to be exposed, makes to position the label that Mark 21 and mark label 12 are printed
One-to-one relationship is established, while positioning graph position telltale mark of the Mark 21 for exposure base face exposure when, mark
Graph position telltale mark when 12 frankings of label are exposed for exposure base reverse side, therefore two-side graph can be set up
Accurate positional relationship.
For convenience of description, the two sides of pcb board is denoted as the face A and the face B respectively；
For example, the mark hole initial alignment position recorded in system is denoted asTelltale mark initial alignment position note
ForWhen exposing certain pcb board, telltale mark real time position is denoted asCCD camera gets telltale mark phase
Change in location for the initial position recorded in system are as follows:
Since telltale mark and the relative position variable quantity in mark hole can be ignored, it is known that, the position in mark hole
Set variation are as follows:
Mark hole is denoted as in the theoretical value of the face B mark position
Exposure device 16 uses mark position theoretical value in the face AExpose the positioning Mark out as central marker
21, positioning Mark 21 is used to determine the graph position when exposure of the face exposure base A；
When upper lower turnover panel, pcb board plate height is denoted as H, and board bottom side X-coordinate is denoted as Xbottom；
Obtaining mark hole in the desired locations in the face B in the theoretical value of the face B mark position according to above-mentioned mark hole is
The practical mark hole site captured in the face B after turnover panel
Alignment result
The face exposure figure A positionIt is obtained by Y mirror image
I.e. the face B graph position is
Through actual test, the present invention reaches 1 μm in system shafting repetitive positioning accuracy, and image procossing precision reaches 1 μm
Under the premise of, it can guarantee being accurately located within 10 μm for the tow sides of PCB internal layer imperforate plate.
Part steps in the embodiment of the present invention, can use software realization, and corresponding software program can store can
In the storage medium of reading, such as CD or hard disk.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of alignment device of double-sided exposure, which is characterized in that described device includes:
Telltale mark, mark label and position acquisition device；
The telltale mark is used to determine the position of the mark label in real time, to be determined according to the position of mark label
The exposure figure position of sample to be exposed；
The mark label carries out mark for treating exposed sample；
The position acquisition device is used to obtain the location information of the telltale mark in real time.
2. the apparatus according to claim 1, which is characterized in that the relative position of the telltale mark and mark label
Variable quantity is less than predetermined value, and predetermined value alignment precision required when carrying out double-sided exposure according to the sample to be exposed is set
It is fixed.
3. the apparatus according to claim 1, which is characterized in that the distance of the telltale mark and mark label is less than
It 20mm and/or is connected by resistance to deformation material.
4. the apparatus according to claim 1, which is characterized in that described device further include:
Sample bearing device and marking device；The sample bearing device is for carrying the sample to be exposed；The mark dress
It sets for carrying out mark to the sample to be exposed by mark label；
The mark label is located on the sample bearing device.
5. device according to claim 4, which is characterized in that the mark label is located at the side of the sample bearing device
Edge point.
6. a kind of alignment methods of double-sided exposure, which is characterized in that the method is applied to the alignment device of above-mentioned double-sided exposure
In, which comprises
Treat being exposed on one side for exposed sample；
The another side of the sample to be exposed is marked by mark label；
The location information of telltale mark is obtained in real time；
The location information of the mark label is determined according to the location information of the telltale mark got in real time；
Exposed sample another side, which is treated, according to the location information that the mark marks carries out alignment exposure.
7. according to the method described in claim 6, it is characterized in that, it is described treat being exposed on one side of exposed sample before,
Further include:
The location information of telltale mark when being exposed on one side for treating exposed sample is obtained in real time, and according to the positioning got
The location information of label exposes intermediate marker out in the one side of sample to be exposed, face where the intermediate marker is used to determine it
The position of exposure figure.
8. the method according to the description of claim 7 is characterized in that described marked by mark to the another of the sample to be exposed
Before being marked on one side, further includes:
At least two marks label is chosen according to the size of the sample to be exposed；
The sample to be exposed is covered on mark label and cannot to cover selected mark label corresponding fixed
Position label.
9. according to the method described in claim 8, it is characterized in that, the location information according to mark label treats exposure
Light sample another side carries out alignment exposure
Determine the position of the exposure figure of the sample another side to be exposed in real time according to the location information that the mark marks；
According to the position of the exposure figure of the sample another side to be exposed determined in real time to the another of the sample to be exposed
Face is exposed.
10. a kind of exposure sources, which is characterized in that the exposure sources include any double-sided exposure of Claims 1 to 5
Alignment device.
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| CN115236096A (en) * | 2022-07-22 | 2022-10-25 | 锡凡半导体无锡有限公司 | A method for detecting interlayer alignment accuracy of PCB inner layer board |
| CN116699951A (en) * | 2023-06-16 | 2023-09-05 | 江西景旺精密电路有限公司 | Exposure platform and LDI exposure device |
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