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CN109611711A - 灯条制造方法及用于制造灯条的绕线架 - Google Patents

灯条制造方法及用于制造灯条的绕线架 Download PDF

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Publication number
CN109611711A
CN109611711A CN201810311959.5A CN201810311959A CN109611711A CN 109611711 A CN109611711 A CN 109611711A CN 201810311959 A CN201810311959 A CN 201810311959A CN 109611711 A CN109611711 A CN 109611711A
Authority
CN
China
Prior art keywords
bobbin winder
winder bracket
wire rod
lamp bar
hollow portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810311959.5A
Other languages
English (en)
Inventor
蔡乃成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kosmo Lighting Co
Cosmo Lighting Inc
Original Assignee
Kosmo Lighting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kosmo Lighting Co filed Critical Kosmo Lighting Co
Publication of CN109611711A publication Critical patent/CN109611711A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H54/00—Winding, coiling, or depositing filamentary material
    • B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
    • B65H54/10—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers
    • B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
    • H02G1/1248—Machines
    • H02G1/1251—Machines the cutting element not rotating about the wire or cable
    • H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
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    • H02J7/855—
    • H02J7/963—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/42—Antiparallel configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H05B45/44—Details of LED load circuits with an active control inside an LED matrix
    • H05B45/48—Details of LED load circuits with an active control inside an LED matrix having LEDs organised in strings and incorporating parallel shunting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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    • H10H20/85—Packages
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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    • H10H20/85—Packages
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
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Abstract

本发明提供一种灯条制造方法及用于制造灯条的绕线架。所述方法包括至少下列步骤：绕设线材：提供一绕线架，所述绕线架的两端各形成一固线部；所述绕线架沿着纵长方向形成一中空部；将多条线材绕设多数圈于所述绕线架上，每一所述线材具有一漆包层，并使所述线材重复地横跨过所述中空部；移除绝缘层：沿着所述中空部，移除每一所述线材部分的所述绝缘层以露出芯线；以及贴附并固定芯片于所述线材露出的所述芯线，使所述芯片稳固地电连接于所述线材。本发明可自动化生产LED灯条，以降低成本。

Description

灯条制造方法及用于制造灯条的绕线架
技术领域
本发明涉及一种灯条制造方法及用于制造灯条的绕线架，特别是指一种自动化生产发光二极管(LED)灯条制造方法及用于制造灯条的绕线架。
背景技术
在一些节日或特别装饰的场合，常见LED灯条，然而LED灯条制造方法仍无法完全自动化生产，以致于生产效率低且成本偏高。
发明内容
本发明所要解决的技术问题，在于提供一种灯条制造方法，可以自动化生产LED灯条，以降低成本。
为了解决上述技术问题，根据本发明的其中一种方案，提供一种灯条制造方法，包括至少下列步骤：
绕设线材：提供一绕线架，所述绕线架的两端各形成一固线部；所述绕线架沿着纵长方向形成一中空部；将多条线材绕设多数圈于所述绕线架上，每一所述线材具有一漆包层，并使所述线材重复地横跨过所述中空部；
移除绝缘层：沿着所述中空部，移除每一所述线材部分的所述绝缘层以露出芯线；以及
贴附并固定芯片于所述线材露出的所述芯线，使所述芯片稳固地电连接于所述线材。
在本发明的一优选实施例中，所述固线部包括一凹陷部、及一缠线销，所述凹陷部形成于所述绕线架的一端，所述缠线销固定于所述凹陷部内，其中所述线材的一端缠固于所述缠线销。
在本发明的一优选实施例中，所述绕线架还具有多个止滑条，多个所述止滑条装设于所述绕线架的周围，以防止所述线材滑移。
在本发明的一优选实施例中，两个所述止滑条相对地位于所述绕线架的所述中空部的两侧，并且局部外露于所述绕线架的顶面。
在本发明的一优选实施例中，所述移除绝缘层的步骤是以激光沿着所述中空部照射多条所述线材。
在本发明的一优选实施例中，所述中空部是部分开口的槽状。
在本发明的一优选实施例中，所述贴附并固定芯片的步骤，包括：
刷布导电材料：将导电材料涂布于每一所述线材露出的所述芯线；
贴附芯片：将多个LED芯片置放于所述导电材料；及
固定芯片：使所述LED芯片固定地导接于所述线材上；
并且，所述灯条制造方法还包含下列步骤：
点着胶体：沿着所述中空部，将胶体包覆所述LED芯片；
固化胶体：固化所述胶体固化；及
拆卸灯条：将多条所述线材由所述绕线架解开。
在本发明的一优选实施例中，所述导电材料为锡膏，在固定芯片的步骤中，沿着所述中空部，以预定的温度烘烤锡膏，使所述LED芯片固定地导接于所述线材上。
在本发明的一优选实施例中，所述导电材料为锡膏，所述刷布导电材料的步骤，包括提供一承载架，将多个已绕设所述线材的所述绕线架并排地固定于所述承载架，所述承载架具有一对定位座，每一所述定位座形成多个插置凹部，每一所述绕线架的两端各置入于所述插置凹部，并以印刷方式将导电材料印刷于所述线材上。
在本发明的一优选实施例中，所述贴附芯片的步骤，包括以视觉辨识方式，取得所述线材移除所述绝缘层的置晶位置，将以吸取头吸附所述LED芯片并移动至所述置晶位置。
在本发明的一优选实施例中，所述固定芯片的步骤，包括以热风机沿着所述中空部烘烤所述LED芯片的位置。
本发明另一目的还在于提供一种用于制造灯条的绕线架，在于提供一种绕线架，可以配合LED灯条的自动化量产，以降低成本。
为了解决上述技术问题，根据本发明的其中一种方案，提供一种用于制造灯条的绕线架，所述绕线架沿着纵长方向具有大致相同的截面，所述绕线架具有一顶面、沿着纵长方向的一中空部、及多个止滑条，多个所述止滑条固定于所述绕线架的周围并且局部外露于所述顶面。
在本发明的一优选实施例中，所述绕线架还具有一顶线座，所述顶线座可活动地插设于所述绕线架。
本发明具有以下有益效果：本发明可自动化生产LED灯条，以降低成本。
为了能更进一步了解本发明为达成既定目的所采取的技术、方法及功效，请参阅以下有关本发明的详细说明、附图，相信本发明的目的、特征与特点，当可由此得以深入且具体的了解，然而附图与说明仅提供参考与说明，并非用来对本发明加以限制。
附图说明
图1为本发明的灯条制造方法的流程图。
图2A为本发明的绕线架绕设线材的示意图。
图2B为本发明的绕线架的固线部局部放大图。
图2C为本发明的绕线架的剖视图。
图3为本发明的移除绝缘层的示意图。
图4为本发明的线材移除绝缘层后的俯视图。
图5为本发明的刷布导电材料的示意图。
图6为本发明的贴附芯片的示意图。
图7为本发明的固定芯片的示意图。
图8为本发明点着胶体的示意图。
图9为本发明的绕线架及承载架的示意图。
图10为本发明的绕线架组合的剖视图。
图11为本发明的锡膏槽座的示意图。
图12为本发明的另一种绕线架组合的剖视图。
具体实施方式
请参考图1，为本发明的灯条制造方法的流程图。本发明的灯条制造方法包括下列主要步骤：绕设线材S10、移除绝缘层S20、刷布导电材料S30、贴附芯片S40、固定芯片S50、测试维修S60、点着胶体S70、固化胶体S80、及拆卸灯条S90。接着分别描述各个步骤。
绕设线材S10的步骤说明如下，请参考图2A至图2C，首先，提供一绕线架10，所述绕线架10的两端各形成一固线部12。绕线架10沿着纵长方向形成一中空部14，绕线架10可以是金属件，例如铝材经过铝挤制成型，但并不限制于此，例如也可以是耐热的塑料件制成。中空部14可以是部分开口的槽状。
如图2B及图2C所示，针对金属材质的绕线架10而言，绕线架10优选可以具有多个止滑条15，多个止滑条15装设于绕线架10的周围，可以稍微突出于绕线架10的表面，但不限制于此，以防止线材W1，W2滑移。止滑条15例如可以是橡胶、塑料…等。本实施例中，两个止滑条15相对地位于绕线架10的中空部14的两侧，并且局部外露于绕线架10的顶面。所述外露可以是包含突出。优选的，止滑条15是可替换地装设于绕线架10。
如图2A所示，将多条线材W1，W2绕设多数圈于绕线架10上，并以马达M转动绕线架10，使线材W1，W2重复地横跨过中空部14。绕设的过程，先是将线材W1，W2的末端卷绕以固定于固线部12，如图2B所示，固线部12包括一凹陷部120、及一缠线销123。凹陷部120形成于绕线架10的一端，缠线销123固定于凹陷部120内，其中线材W1，W2的一端缠固于缠线销123。线材例如可以为漆包线，但不限制于此。每一线材W1，W2具有一包覆在外面的绝缘层(如图2A所示外层，未标号)，以漆包线而言，绝缘层即为漆包层。本实施例以两条线材W1，W2为例说明，但并不限制于此。线材的数量可以是两条以上，视灯条的需要而定。
移除绝缘层S20的步骤说明如下，如图3及图4所示，沿着中空部14，移除每一线材W1，W2部分的绝缘层以露出芯线C1、C2。如图3所示，其中移除绝缘层的步骤，可以是以激光源L发出激光线，沿着中空部14照射多条线材W1，W2。
接着，贴附并固定芯片C于所述线材W1，W2露出的所述芯线C1、C2上，使所述芯片C稳固地电连接于所述线材W1，W2。具体的说，贴附并固定芯片C含有步骤S30、S40及S50。
刷布导电材料的步骤S30说明如下，如图5所示，将导电材料S涂布于每一所述线材W1，W2露出的所述芯线C1、C2上。例如透过网板90配合刮板92，将导电材料S涂布于预定的位置。导电材料可以是锡膏、银胶、导电胶…等，并不限制于此。以锡膏作为导电材料举一可行的例子，其具体步骤说明如下。请一并参考图9，为批次生产，本实施例优选的提供一承载架100，将多个已绕设线材W1，W2的绕线架10并排地固定于承载架100，承载架100具有一对定位座102，每一定位座102形成多个插置凹部1020，每一绕线架10的两端各置入于所述插置凹部1020，并以印刷方式将导电材料S印刷于所述线材W1，W2上。承载架100的两侧还可设有一对握把103。
贴附芯片的步骤S40说明如下，如图6所示，将多个LED芯片C置放于所述导电材料S。本实施例，包括以视觉辨识方式，取得所述线材W1，W2移除所述绝缘层的置晶位置，将以吸取头30吸附所述LED芯片C并移动至置晶位置。
固定芯片的步骤S50说明如下，如图7所示，沿着绕线架10的中空部14，以预定的温度烘烤所述导电材料S，熔化在导电材料S内的锡粉，使所述LED芯片C固定地导接于所述线材W1，W2上。本实施例中，所述固定芯片的步骤，包括以热风机H沿着所述中空部14烘烤所述LED芯片C的位置。
测试维修S60的步骤，目的在于LED芯片C当未焊接固定以前，检测是否确实电性连接于线材W1，W2而可以发光。若LED芯片C不会发光的，加以检查或替换。
点着胶体的步骤S70说明如下，如图8所示，沿着所述中空部14，利用胶枪G将胶体g包覆所述LED芯片C。
固化胶体的步骤S70说明如下，固化所述胶体g固化。通常透过烘烤，例如烤箱，而加以固化。
拆卸灯条的步骤S80说明如下：将多条所述线材由所述绕线架解开。
请参阅图10及图11，本发明配合灯条制造方法，除了上述的绕线架10，其沿着纵长方向具有大致相同的截面，所述绕线架10具有一顶面、沿着纵长方向的一中空部14、及多个止滑条，多个所述止滑条固定于所述绕线架的周围并且局部外露于所述顶面。还提供一种用于制造灯条的绕线架10，具有相关的配件。绕线架还具有一顶线座20、外座30，顶线座20可活动地插设于所述绕线架10。再将绕线架10置入外座30内。顶线座20包括一底部21及由底部21向上突出的突台22。顶线座20底部具有一底垫件28。顶线座20的顶端可以形成有线槽220，以供线材W1，W2定位，避免滑移。线槽220的深度小于线材W1，W2的直径，线材W1，W2可以稍微外露于顶线座20的顶面。
图11显示，另一种涂布导电材料的方式，提供锡膏槽座95，将绕线架10倒置以使线材W1、W2的芯线可以沾附导电材料S。
图12显示，绕线架10a具有多个插置部17a,17b,顶线座20a的底部21a可以插入于不同的插置部17a,17b，以使线材绕设的长度不同，也就是线材的圆周长度不同。因此本实施例可以调整LED芯片的放置位置，以制作具有不同间隔LED芯片的灯条。
本发明的特点及功能在于，可以自动化生产LED灯条，有利于降低成本。
以上所述仅为本发明的优选可行实施例，凡依本发明申请专利范围所做的均等变化与修饰，皆应属本发明的涵盖范围。

Claims (13)

1.一种灯条制造方法，其特征在于，包括至少下列步骤：
绕设线材：提供一绕线架，所述绕线架的两端各形成一固线部；所述绕线架沿着纵长方向形成至少一中空部；将多条线材绕设多数圈于所述绕线架上，每一所述线材具有一漆包层，并使所述线材重复地横跨过所述中空部；
移除绝缘层：沿着所述中空部，移除每一所述线材部分的所述绝缘层以露出芯线；以及
贴附并固定芯片于所述线材露出的所述芯线，使所述芯片稳固地电连接于所述线材。
2.如权利要求1所述的灯条制造方法，其特征在于，所述固线部包括一凹陷部、及一缠线销，所述凹陷部形成于所述绕线架的一端，所述缠线销固定于所述凹陷部内，其中所述线材的一端缠固于所述缠线销。
3.如权利要求1所述的灯条制造方法，其特征在于，所述绕线架还具有多个止滑条，多个所述止滑条装设于所述绕线架的周围，以防止所述线材滑移。
4.如权利要求3所述的灯条制造方法，其特征在于，两个所述止滑条相对地位于所述绕线架的所述中空部的两侧，并且局部外露于所述绕线架的顶面。
5.如权利要求1所述的灯条制造方法，其特征在于，所述移除绝缘层的步骤是以激光沿着所述中空部照射多条所述线材。
6.如权利要求1所述的灯条制造方法，其特征在于，所述中空部是部分开口的槽状。
7.如权利要求1所述的灯条制造方法，其特征在于，所述贴附并固定芯片的步骤，包括：
刷布导电材料：将导电材料涂布于每一所述线材露出的所述芯线；
贴附芯片：将多个LED芯片置放于所述导电材料；及
固定芯片：使所述LED芯片固定地导接于所述线材上；
并且，所述灯条制造方法还包含下列步骤：
点着胶体：沿着所述中空部，将胶体包覆所述LED芯片；
固化胶体：固化所述胶体固化；及
拆卸灯条：将多条所述线材由所述绕线架解开。
8.如权利要求7所述的灯条制造方法，其特征在于，所述导电材料为锡膏，在固定芯片的步骤中，沿着所述中空部，以预定的温度烘烤锡膏，使所述LED芯片固定地导接于所述线材上。
9.如权利要求7所述的灯条制造方法，其特征在于，所述导电材料为锡膏，所述刷布导电材料的步骤，包括提供一承载架，将多个已绕设所述线材的所述绕线架并排地固定于所述承载架，所述承载架具有一对定位座，每一所述定位座形成多个插置凹部，每一所述绕线架的两端各置入于所述插置凹部，并以印刷方式将导电材料印刷于所述线材上。
10.如权利要求9所述的灯条制造方法，其特征在于，所述贴附芯片的步骤，包括以视觉辨识方式，取得所述线材移除所述绝缘层的置晶位置，将以吸取头吸附所述LED芯片并移动至所述置晶位置。
11.如权利要求1所述的灯条制造方法，其特征在于，所述固定芯片的步骤，包括以热风机沿着所述中空部烘烤所述LED芯片的位置。
12.一种用于制造灯条的绕线架，其特征在于，所述绕线架沿着纵长方向具有大致相同的截面，所述绕线架具有一顶面、沿着纵长方向的至少一中空部、及多个止滑条，多个所述止滑条装设于所述绕线架的周围并且局部外露于所述顶面。
13.如权利要求12所述的用于制造灯条的绕线架，其特征在于，所述绕线架还具有一顶线座，所述顶线座可活动地插设于所述绕线架。
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