CN109600905A

CN109600905A - The electronic device of printed circuit board and the application printed circuit board

Info

Publication number: CN109600905A
Application number: CN201710915449.4A
Authority: CN
Inventors: 张锋
Original assignee: Shaoxing Jicheng Packaging Machinery Co ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Shaoxing Jicheng Packaging Machinery Co ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2017-09-30
Filing date: 2017-09-30
Publication date: 2019-04-09

Abstract

A printed circuit board includes a top layer, a bottom layer, a first dielectric layer, a second dielectric layer and a passive element, the passive element is arranged on the first dielectric layer, and the first dielectric layer between the second dielectric layer and the bottom layer, the second dielectric layer is disposed between the top layer and the first dielectric layer and overlapped with the first dielectric layer, the passive A cavity is opened around the element, and the cavity is formed by hollowing out part of the medium of the second medium layer. The present invention also provides an electronic device using the printed circuit board. The printed circuit board and the electronic device using the printed circuit board of the present invention can make the signal only pass through the air when passing through the cavity, and the signal loss caused by the air is almost zero, so the signal loss can be greatly reduced. Dielectric loss.

Description

The electronic device of printed circuit board and the application printed circuit board

Technical field

The present invention relates to the electronic devices of a kind of printed circuit board and the application printed circuit board.

Background technique

Printed circuit board (printed circuit board, PCB) generally comprises signals layer and upper and lower two reference layers, And the dielectric between two reference layers will also generate certain dielectric loss.

Usual dielectric loss is higher, and the electric property of the element in printed circuit board is lower.And also by limitation carrying letter Number bandwidth promoted.

Summary of the invention

In view of above content, it is necessary to provide a kind of printed circuit board and the electronic device using the printed circuit board.

A kind of printed circuit board is applied in an electronic device, and the printed circuit board includes a top layer, a bottom, one First medium layer, a second dielectric layer and a passive element, the passive element are set on the first medium layer, and described One dielectric layer is set between the second dielectric layer and the bottom, and the second dielectric layer is set to the top layer and described first Between dielectric layer and it is superimposed on the first medium layer, a cavity is offered around the passive element, the cavity passes through It hollows out the local medium of the second dielectric layer and is formed.

Further, the cavity opened up around the passive element is also situated between by hollowing out the part of the second dielectric layer The local medium of matter and the first medium layer and formed.

Further, the cavity makes the first medium layer be divided into the two parts not connected each other to be formed One separating layer, the passive element are set in the separating layer.

Further, the top layer is a bus plane, and the bottom is a ground plane.

Further, the top layer is a dielectric layer, and the bottom is a ground plane.

Further, the printed circuit board further includes a third dielectric layer, and the third dielectric layer is set to the top layer Between the second dielectric layer and it is superimposed on the second dielectric layer.

Further, the cavity is process by techniques such as physics cutting or chemical etchings.

A kind of electronic device, including a printed circuit board, the printed circuit board include a top layer, a bottom, one first Dielectric layer, a second dielectric layer and a passive element, the passive element are set on the first medium layer, and described first is situated between Matter layer is set between the second dielectric layer and the bottom, and the second dielectric layer is set to the top layer and the first medium Between layer and it is superimposed on the first medium layer, a cavity is offered around the passive element, the cavity is by hollowing out The local medium of the second dielectric layer and formed.

Further, the cavity opened up around the passive element is also situated between by hollowing out the part of the second dielectric layer The local medium of matter and the first medium layer and formed, the cavity is divided into the first medium layer not have each other There are two parts of connection to form a separating layer, the passive element is set in the separating layer.

The electronic device of above-mentioned printed circuit board and the application printed circuit board passes through around the passive element The cavity opened up, so that signal only passes through air when passing through the cavity, and loss of signal caused by air is almost It is zero, therefore the dielectric loss that will can considerably reduce signal.

Detailed description of the invention

Combining better embodiment with reference to the accompanying drawings, present invention is further described in detail:

Fig. 1 is the schematic diagram of the better embodiment of electronic device of the present invention.

Fig. 2 is the side view of the first better embodiment of printed circuit board in Fig. 1.

Fig. 3 is the side view of the second better embodiment of printed circuit board in Fig. 1.

Fig. 4 is the side view of the third better embodiment of printed circuit board in Fig. 1.

Main element symbol description

Printed circuit board 100

Top layer 110

First medium layer 120

Second dielectric layer 130

Bottom 140

Passive element 150

Cavity 160

Separating layer 170

Third dielectric layer 180

Electronic device 200

The present invention that the following detailed description will be further explained with reference to the above drawings.

Specific embodiment

Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.

The objectives, technical solutions, and advantages of the present invention are more clearly understood, below with reference to drawings and the embodiments, The electronic device of printed circuit board and the application printed circuit board in the present invention is described in further detail and is mutually spoken on somebody's behalf It is bright.

Referring to FIG. 1, better embodiment of the present invention provides a kind of printed circuit board 100, the printed circuit board 100 is answered For in an electronic device 200.

In a specific embodiment, the printed circuit board 100 is a computer main board, and the electronic device 200 is one Laptop or a desktop computer.

In a specific embodiment, the printed circuit board 100 can also be encapsulation or integrated circuit (integrated Circuit, IC).

The electronic device 200 further includes other structures and element, due to unrelated with improvement of the invention, therefore do not add and retouches It states.

Referring to FIG. 2, the printed circuit board 100 includes a top layer 110, a bottom 140, a first medium layer 120, one Second dielectric layer 130 and a passive element 150.

Wherein, the first medium layer 120 is set between the second dielectric layer 130 and the bottom 140, and described second Dielectric layer 130 is set between the top layer 110 and the first medium layer 120 and is superimposed on the first medium layer 120.

The passive element 150 is set on the first medium layer 120, is offered around the passive element 150 One cavity 160, the cavity 160 are formed and hollowing out the local medium of the second dielectric layer 130, specifically can be by physics The techniques such as cutting or chemical etching are process.

It is understood that in the present embodiment, on the first medium layer 120 only with a passive element 150 into Row explanation, in other embodiments in, multiple passive elements 150 are also set up on the first medium layer 120, and in multiple nothings The cavity 160 is opened up around source element 150, can be specifically adjusted according to actual needs.

In a specific embodiment, the top layer 110 is a bus plane, and the bottom 140 is a ground plane.At other In embodiment, the top layer 110 can also be a dielectric layer.

It is understood that due to offering the cavity 160 around the passive element 150, so that signal is logical Only pass through air when crossing cavity, loss of signal caused by air is almost nil, therefore will can considerably reduce signal Dielectric loss.

Referring to FIG. 3, Fig. 3 is the schematic diagram of the second better embodiment of the printed circuit board 100.With above-mentioned first Unlike embodiment, the cavity 160 that 150 surrounding of passive element is opened up is by hollowing out the second dielectric layer The local medium of 130 local medium and the first medium layer 120 and formed.

The cavity 160 will make the first medium layer 120 be divided into the two parts not connected each other to be formed One separating layer 170, and the passive element 150 is set in the separating layer 170.

With continued reference to FIG. 4, wherein Fig. 4 is the schematic diagram of the third better embodiment of the printed circuit board 100, with Unlike first embodiment, the printed circuit board 100 further includes a third dielectric layer 180.

The first medium layer 120 is set between the second dielectric layer 130 and the bottom 140, the second medium Layer 130 is set between the third dielectric layer 180 and the first medium layer 120 and is superimposed on the first medium layer 120.Institute Third dielectric layer 180 is stated to be set between the top layer 110 and the second dielectric layer 130 and and be superimposed on the second dielectric layer 130。

The passive element 150 is set on the first medium layer 120, is opened up around the passive element 150 Cavity 160 formed and hollowing out the local medium of the second dielectric layer 130.

The printed circuit board 100 may further include other layers, such as signals layer, since the present invention is not related to other layers Structure, therefore other layers are not specifically described herein.

The electronic device 200 of above-mentioned printed circuit board 100 and the application printed circuit board 100 can be by described passive The cavity 160 opened up around element 150, so that signal only passes through air, and air institute when passing through the cavity 160 The loss of signal of generation is almost nil, therefore the dielectric loss that will can considerably reduce signal.

Finally it should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting.This field It is to be appreciated by one skilled in the art that can modify to technical solution of the present invention or equivalent replacement, without departing from the present invention The spirit and scope of technical solution.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creativeness Every other embodiment obtained, will all belong to the scope of protection of the invention under the premise of labour.

Claims

1. A printed circuit board, used in an electronic device, wherein the printed circuit board comprises a top layer, a bottom layer, a first dielectric layer, a second dielectric layer and a passive element, the Passive elements are disposed on the first dielectric layer, the first dielectric layer is disposed between the second dielectric layer and the bottom layer, and the second dielectric layer is disposed between the top layer and the first dielectric layer Between the dielectric layers and overlapping with the first dielectric layer, a cavity is opened around the passive element, and the cavity is formed by hollowing out a part of the dielectric of the second dielectric layer.

2 . The printed circuit board according to claim 1 , wherein the cavity opened around the passive element is further formed by hollowing out a part of the dielectric of the second dielectric layer and a part of the first dielectric layer. 3 . formed by the medium.

3 . The printed circuit board of claim 2 , wherein the cavity allows the first dielectric layer to be divided into two parts that are not connected to each other to form a separation layer, and the passive components are disposed on 3 . on the separation layer.

4. The printed circuit board of claim 1, wherein the top layer is a power layer, and the bottom layer is a ground layer.

5. The printed circuit board of claim 1, wherein the top layer is a dielectric layer, and the bottom layer is a ground layer.

6 . The printed circuit board of claim 1 , wherein the printed circuit board further comprises a third dielectric layer, and the third dielectric layer is disposed between the top layer and the second dielectric layer. 7 . and overlapped with the second dielectric layer.

7 . The printed circuit board of claim 2 , wherein the cavity is formed by a process such as physical cutting or chemical etching. 8 .

8. An electronic device, comprising a printed circuit board, wherein the printed circuit board comprises a top layer, a bottom layer, a first dielectric layer, a second dielectric layer and a passive element, the passive element The element is disposed on the first dielectric layer, the first dielectric layer is disposed between the second dielectric layer and the bottom layer, and the second dielectric layer is disposed between the top layer and the first dielectric layer Between and overlapping with the first dielectric layer, a cavity is opened around the passive element, and the cavity is formed by hollowing out a part of the dielectric of the second dielectric layer.

9 . The electronic device according to claim 8 , wherein the cavity opened around the passive element is further formed by hollowing out the local dielectric of the second dielectric layer and the local dielectric of the first dielectric layer. 10 . The cavity is formed such that the first dielectric layer is divided into two parts that are not connected to each other to form a separation layer, and the passive element is disposed on the separation layer.

10. The electronic device of claim 8, wherein the printed circuit board further comprises a third dielectric layer, the third dielectric layer is disposed between the top layer and the second dielectric layer and overlapped with the second dielectric layer.