CN109581816A - A kind of offline photolithography method and system - Google Patents
A kind of offline photolithography method and system Download PDFInfo
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- CN109581816A CN109581816A CN201710909075.5A CN201710909075A CN109581816A CN 109581816 A CN109581816 A CN 109581816A CN 201710909075 A CN201710909075 A CN 201710909075A CN 109581816 A CN109581816 A CN 109581816A
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- 238000000034 method Methods 0.000 title claims abstract description 99
- 238000000206 photolithography Methods 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 104
- 239000003292 glue Substances 0.000 claims abstract description 87
- 238000003860 storage Methods 0.000 claims abstract description 37
- 238000001459 lithography Methods 0.000 claims abstract description 25
- 238000001259 photo etching Methods 0.000 claims abstract description 13
- 238000004891 communication Methods 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 348
- 238000004026 adhesive bonding Methods 0.000 claims description 45
- 238000012360 testing method Methods 0.000 claims description 33
- 238000011897 real-time detection Methods 0.000 claims description 27
- 238000012545 processing Methods 0.000 claims description 26
- 238000011161 development Methods 0.000 claims description 20
- 229920002120 photoresistant polymer Polymers 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 27
- 230000018109 developmental process Effects 0.000 description 19
- 238000001514 detection method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention provides a kind of offline photolithography method, comprising: automatic material transport unit transmits wafer to multiple glue spreaders；According to the occupied situation of at least one litho machine, wafer is preferentially sent to unappropriated any litho machine by automatic material transport unit；According to the occupied situation of multiple developing machines, wafer is preferentially sent to unappropriated any developing machine by automatic material transport unit；Wafer is sent to storage unit or storing goods shelf under time process apparatus, track by automatic material transport unit.The present invention also provides a kind of offline lithography systems, it include: multiple glue spreaders, at least one litho machine, multiple developing machines, automatic material transport unit, central control unit, wherein, central control unit communication is connected to multiple glue spreaders, litho machine, multiple developing machines.Offline photolithography method of the invention reduces the idle of expensive lithographic equipment, improves photoetching production efficiency.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, in particular to a kind of offline photolithography method and system.
Background technique
The wafer manufacturing shop of semiconductor factory is usually divided into multiple compartments (Bay) according to processing procedure.In each compartment
(Intrabay) and between compartment the wafer of (Interbay) transmits, and generally uses automatic material transport unit (AMHS, Auto
Material Handling System) Lai Shixian.Currently, it is unified formula AMHS (Unified that AMHS is widely used
AMHS), the direct conveying of device-to-device (Tool to Tool) may be implemented.Fig. 1 is existing wafer manufacturing shop layout
Schematic diagram.Wafer manufacturing shop 100 include: preceding processing procedure compartment 101, lithographic process compartment 102, rear processing procedure compartment 103~106,
Automatic material transport unit 107 and central control unit 108 (it should be pointed out that according to the needs of plant layout, it is possible to
It is set as function and the different compartment of quantity).Automatic material transport unit 107 includes: the transmission of the first transmission track 1071, second
Storage unit 1074 under track 1072, aerial transport carriage 1073 (OHT, Overhead Hoist Transfer), track (UTS,
Under Track Storage) and storing goods shelf 1075 (Stocker), wherein the first transmission track 1071 is used between compartment
Wafer transmission, the second transmission track 1072 is for the wafer transmission in lithographic process compartment 102.In lithographic process compartment 102
It is interior, it is provided with a plurality of photoetching production line, each photoetching production line is arranged using online mode (in-line), respectively by a gluing
Develop 1021, litho machines 1022 of all-in-one machine and the composition of transmission device 1023, wherein it is aobvious that transmission device 1023 connects gluing
Shadow all-in-one machine 1021 and litho machine 1022, and it is used for wafer transfer between the two.
Fig. 2 is the existing specific composition schematic diagram in Lithography production line.As shown in Fig. 2, puddle development all-in-one machine
1021 including at least solidified portion 10213 and development section 10214 after solidified portion 10212, exposure after gluing portion 10211, gluing；Photoetching
Machine 1022 includes at least exposure portion 10221；Transmission device 1023 includes at least positive transport unit 10231 and reversed transport unit
10232, it is respectively used to for the wafer after solidifying after gluing to be sent to litho machine 1022, and by the wafer after exposure from litho machine
1022 send back solidification after puddle development all-in-one machine 1021 is exposed and develop.Under existing on-line mode, above-mentioned gluing is aobvious
Shadow all-in-one machine 1021 often because yield is low, hardware fault or equipment PM and lead to equipment downtime, to cause entire life
Producing line stops production, and not only gluing and development are simultaneously stopped operation, can also cause expensive litho machine to be in idle state, cause
The increase of the wasting of resources and production cost.
The defect of existing online technique prevents lithographic equipment from continuously carrying out production flowing as a result, to influence
To the efficiency of wafer photo-etching technological and the production capacity of entirety.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of offline photolithography method, it is existing in the prior art at least to solve
Problem.The embodiment of the present invention is by the photoresist being compounded in an equipment in the prior art coating and developing function, by independent
Glue spreader and developing machine are respectively completed, while the setting of system is changed to offline mode (off-line) by online mode.Its
In, the glue spreader after fractionation solidifies after having the function of gluing and gluing, and the developing machine solidifies after having exposure and development
Function.
The technical solution of the embodiment of the present invention is achieved in that according to one embodiment of present invention, provide it is a kind of from
Linear light carving method, comprising: automatic material transport unit transmits wafer to multiple glue spreaders；Multiple glue spreaders are respectively to described
Wafer solidifies after carrying out gluing and gluing；According to the occupied situation of at least one litho machine, transported by the automatic material
The wafer after solidifying after gluing is preferentially sent to unappropriated any litho machine and is exposed by unit；According to more
The wafer after exposure is preferentially sent to not by the occupied situation of a developing machine by the automatic material transport unit
Occupied any developing machine solidifies after being exposed and development；And the automatic material transport unit will be after development
Storage unit or storage goods under the wafer is sent to time process apparatus, is temporarily stored into the track of the automatic material transport unit
Frame.
In some embodiments, through the glue spreader, treated before the wafer is transmitted to the litho machine, in
Entreat the multiple litho machines of control unit real-time detection whether occupied, when at least one of multiple litho machines are not occupied
Used time, the central control unit control the automatic material transport unit and the wafer are preferentially sent to unappropriated institute
State litho machine；Through the litho machine, treated before the wafer is transmitted to the developing machine, the central control unit
Whether the multiple developing machines of real-time detection are occupied, described when at least one of multiple developing machines are unoccupied
Central control unit controls the automatic material transport unit and the wafer is preferentially sent to the unappropriated developing machine.
In some embodiments, when the glue spreader, the litho machine and the developing machine are set in same compartment and
When the wafer has identical litho pattern, the central control unit controls the first biography of the automatic material transport unit
Track is sent to transmit the wafer to multiple glue spreaders via the second transmission track；The central control unit real-time detection is more
Whether a litho machine is occupied, and the third transmission track for controlling the automatic material transport unit is preferential by the wafer
It is sent to unappropriated any litho machine；Whether the multiple developing machines of central control unit real-time detection are occupied
With, and the 4th transmission track for controlling the automatic material transport unit wafer is preferentially sent to it is unappropriated any
The developing machine；The central control unit controls the 5th transmission track of the automatic material transport unit via described first
The wafer is sent to storage unit or the storing goods shelf under the secondary process apparatus, the track by transmission track.
In some embodiments, when the glue spreader, the litho machine and the developing machine are set in same compartment and
When the wafer has different litho patterns, the central control unit controls the first of the automatic material transport unit
Transmission track transmits the wafer to multiple glue spreaders via the second transmission track；The central control unit real-time detection
Whether the litho machine corresponding with the litho pattern of the wafer is occupied, and it is single to control the automatic material conveying
The wafer is preferentially sent to corresponding and not occupied with the litho pattern of the wafer by the third transmission track of member
Any litho machine；Central control unit real-time detection institute corresponding with the litho pattern of the wafer
State whether developing machine is occupied, and the 4th transmission track for controlling the automatic material transport unit preferentially transmits the wafer
To any developing machine corresponding and unappropriated with the litho pattern of the wafer；The central control unit
The wafer is sent to institute via first transmission track by the 5th transmission track for controlling the automatic material transport unit
State storage unit or the storing goods shelf under time process apparatus, the track.
In some embodiments, when the glue spreader, the litho machine and the developing machine are respectively arranged at different compartments
It is interior and when the wafer have identical litho pattern when, the central control unit controls the automatic material transport unit
First transmission track transmits the wafer to multiple glue spreaders via the second transmission track；The central control unit is real-time
Detect whether multiple litho machines are occupied, and controls the third transmission track of the automatic material transport unit via described
The wafer is preferentially sent to unappropriated any litho machine by the first transmission track and the 4th transmission track；In described
It entreats the multiple developing machines of control unit real-time detection whether occupied, and controls the 5th of the automatic material transport unit and pass
Send track that the wafer is preferentially sent to unappropriated any institute via first transmission track and the 6th transmission track
State developing machine；The 7th transmission track that the central control unit controls the automatic material transport unit is passed via described first
Send track that the wafer is sent to storage unit or the storing goods shelf under the secondary process apparatus, the track.
In some embodiments, when the glue spreader, the litho machine and the developing machine are respectively arranged at different compartments
Interior and when the wafer has different litho patterns, the central control unit controls the automatic material transport unit
The first transmission track transmit the wafer to multiple glue spreaders via the second transmission track；The central control unit is real
When corresponding with the litho pattern of the wafer litho machine of detection it is whether occupied, and control the automatic material
The wafer is preferentially sent to by the third transmission track of transport unit via first transmission track and the 4th transmission track
Corresponding with the litho pattern of the wafer and unappropriated any litho machine；The central control unit is real
When corresponding with the litho pattern of the wafer developing machine of detection it is whether occupied, and control the automatic material
The wafer is preferentially sent to by the 5th transmission track of transport unit via first transmission track and the 6th transmission track
Corresponding with the litho pattern of the wafer and unappropriated any developing machine；The central control unit control
Make the 7th transmission track of the automatic material transport unit wafer is sent to via first transmission track it is described
Storage unit or the storing goods shelf under secondary process apparatus, the track.
In some embodiments, the glue spreader detects the wafer after solidifying after gluing, and will test knot
Fruit sends the central control unit to, and the central control unit judges whether the testing result exceeds first reference value,
When the testing result exceeds the first reference value, the central control unit sets photolithographic parameters according to the testing result
Compensation, and the photolithographic parameters of compensation are sent to the litho machine, the litho machine is under the photolithographic parameters of compensation
Photoetching is carried out to the wafer；The litho machine detects the wafer after exposure, and will test result and send institute to
State central control unit；The central control unit judges whether the testing result exceeds the second a reference value, when the detection
As a result exceed second a reference value, the central control unit sets photographic parameter according to the testing result and compensates, and will
The photographic parameter of compensation is sent to the developing machine, and the developing machine is under the photographic parameter of compensation to the wafer
Develop.
A kind of offline lithography system, comprising:
Multiple glue spreaders, to form photoresist layer on wafer；
At least one litho machine, to be exposed to the photoresist layer；
Multiple developing machines, to develop to the photoresist layer；
Automatic material transport unit, including the first transmission track, the second transmission track, third transmission track, the 4th transmission
Storage unit and storing goods shelf under track, the 5th transmission track, track；The first transmission track transmission wafer is via described
Second transmission track is to multiple glue spreaders, and the third transmission track transmission is through the glue spreader treated the wafer
To the litho machine, the 4th transmission track transmission is through the litho machine treated the wafer to multiple developments
Machine, the 5th transmission track transmission is through the developing machine treated the wafer via first transmission track to secondary system
Journey equipment is temporarily stored into storage unit or the storing goods shelf under the track of the automatic material transport unit；And
Central control unit, communication are connected to the glue spreader, the litho machine and the developing machine；The center control
Unit controls the third transmission track and the wafer is preferentially sent to unappropriated any litho machine；The center
Control unit controls the 4th transmission track and the wafer is preferentially sent to unappropriated any developing machine；
Wherein, multiple glue spreaders, the litho machine and multiple developing machines are set in same compartment.
In some embodiments, each transmission track respectively includes multiple points of transmission tracks, wherein the third transmits
The multiple of track described divide transmission track described to divide transmission track corresponding multiple with multiple for being sent to the wafer
Any one in the litho machine；The multiple of 4th transmission track described divide transmission track for transmitting the wafer
To with multiple any one divided in the corresponding multiple developing machines of rotary track.
In some embodiments, further include aerial transport carriage, the aerial transport carriage it is current in each transmission track and
Divide on transmission track described in it, the central control unit communication is connected to the aerial transport carriage and controls the aerial conveying
Vehicle transmits the wafer.
A kind of offline lithography system, comprising:
Multiple glue spreaders, to form photoresist layer on wafer；
At least one litho machine, to be exposed to the photoresist layer；
Multiple developing machines, to develop to the photoresist layer；
Automatic material transport unit, including the first transmission track, the second transmission track, third transmission track, the 4th transmission
Storage unit and storing goods shelf under track, the 5th transmission track, the 6th transmission track, the 7th transmission track, track；Described
One transmission track transmits wafer via second transmission track to multiple glue spreaders, the third transmission track transmission warp
The glue spreader treated the wafer via first transmission track and the 4th transmission track to the litho machine,
5th transmission track transmission is through the litho machine treated the wafer via first transmission track and described the
Six transmission tracks are to multiple developing machines, and through the developing machine, treated that the wafer passes through for the 7th transmission track transmission
By first transmission track to secondary process apparatus, it is temporarily stored into storage unit under the track of the automatic material transport unit
Or the storing goods shelf；And
Central control unit, communication are connected to the glue spreader, the litho machine and the developing machine；The center control
Unit controls the 4th transmission track and the wafer is preferentially sent to unappropriated any litho machine；The center
Control unit controls the 6th transmission track and the wafer is preferentially sent to unappropriated any developing machine；
Wherein, multiple glue spreaders, the litho machine and multiple developing machines are respectively arranged in different compartments.
In some embodiments, each transmission track respectively includes multiple points of transmission tracks, wherein the 4th transmission
The multiple of track described divide transmission track described to divide transmission track corresponding multiple with multiple for being sent to the wafer
Any one in the litho machine, the multiple of the 6th transmission track described divide transmission track for transmitting the wafer
To with multiple any one divided in the corresponding multiple developing machines of rotary track.
In some embodiments, further include aerial transport carriage, the aerial transport carriage it is current in each transmission track and
Divide on transmission track described in it, the central control unit communication is connected to the aerial transport carriage and controls the aerial conveying
Vehicle transmits the wafer.
Due to using the technology described above, have the advantage that reduces expensive lithographic equipment to the embodiment of the present invention
It is idle, improve photoetching production efficiency.
Above-mentioned general introduction is merely to illustrate that the purpose of book, it is not intended to be limited in any way.Except foregoing description
Schematical aspect, except embodiment and feature, by reference to attached drawing and the following detailed description, the present invention is further
Aspect, embodiment and feature will will be readily apparent.
Detailed description of the invention
In the accompanying drawings, unless specified otherwise herein, otherwise indicate the same or similar through the identical appended drawing reference of multiple attached drawings
Component or element.What these attached drawings were not necessarily to scale.It should be understood that these attached drawings depict only according to the present invention
Disclosed some embodiments, and should not serve to limit the scope of the present invention.
Fig. 1 is existing wafer manufacturing shop schematic layout pattern.
Fig. 2 is the existing specific composition schematic diagram in Lithography production line.
Fig. 3 is the flow diagram of the offline photolithography method of one embodiment of the invention.
Fig. 4 is the flow diagram of the offline photolithography method of another embodiment of the present invention.
Fig. 5 is the flow diagram of the offline photolithography method of another embodiment of the present invention.
Fig. 6 is the flow diagram of the offline photolithography method of another embodiment of the present invention.
Fig. 7 is the flow diagram of the offline photolithography method of another embodiment of the present invention.
Fig. 8 is the flow diagram of the offline photolithography method of another embodiment of the present invention.
Fig. 9 is the flow diagram of the offline photolithography method of another embodiment of the present invention.
Figure 10 is the flow diagram of the offline photolithography method of another embodiment of the invention.
Figure 11 is the composition schematic diagram of the offline lithography system of one embodiment of the invention.
Figure 12 is the composition schematic diagram of the offline lithography system of another embodiment of the present invention.
Figure 13 is the composition schematic diagram of the offline lithography system of another embodiment of the present invention.
Figure 14 is the composition schematic diagram of the offline lithography system of another embodiment of the invention.
Appended drawing reference
100: existing wafer manufacturing shop layout 101: preceding processing procedure compartment 102: lithographic process compartment 103,104,105,
106: rear processing procedure compartment 107: automatic material transport unit 108: central control unit 1021: puddle development all-in-one machine 1022: light
Quarter machine 1023: 1071: the first transmission unit of transmission device, 1072: the second transmission unit 1073: aerial transport carriage 1074: under track
Storage unit 1075: storing goods shelf 1076: 10711,10712,10713: the first transmission track of transit point divides transmission track
10721,10722,10723,10724: the second transmission tracks divide transmission track
1021: puddle development all-in-one machine 1022: litho machine 1023: transmission device 10211: gluing portion 10212: solid after gluing
Change portion 10213: solidified portion 10214 after exposure: development section 10221: exposure portion 10231: positive transport unit 10232: reversed transmission
Portion
200: lithography system 201 of the invention: preceding processing procedure compartment 202: lithographic process compartment 203,204,205,206: after
Processing procedure compartment 207: automatic material transport unit 208: central control unit 2021: glue spreader 2022: litho machine 2023: developing machine
2071: the first transmission track, 2072: the second transmission track 2073: 2074: the four transmission track 2075: the five of third transmission track
Transmission track 2076: aerial transport carriage 2077: storage unit 2078 under track: storing goods shelf 2079: transit point
300: lithography system 301 of the invention: preceding processing procedure compartment 302: lithographic process compartment 303,304,305,306: after
Processing procedure compartment 307: automatic material transport unit 308: central control unit 3021: glue spreader 3022: litho machine 3023: developing machine
3071: the first transmission track, 3072: the second transmission track 3073: 3074: the four transmission track 3075: the five of third transmission track
Transmission track 3076: aerial transport carriage 3077: storage unit 3078 under track: storing goods shelf 3079: transit point 30711,
30712, point for dividing 30721,30722,30723,30724: the second transmission track of transmission track of 30713: the first transmission tracks
Transmission track
400: lithography system 401 of the invention: preceding processing procedure compartment 402: lithographic process compartment 403,404,405,406: after
Processing procedure compartment 407: automatic material transport unit 408: central control unit 4021: glue spreader 4031: litho machine 4041: developing machine
4071: the first transmission track, 4072: the second transmission track 4073: 4074: the four transmission track 4075: the five of third transmission track
4076: the six transmission track of transmission track, 4077: the seven transmission track 4078: aerial transport carriage 4079: storage unit under track
407A: storing goods shelf 407B: transit point
500: lithography system 501 of the invention: preceding processing procedure compartment 502: lithographic process compartment 503,504,505,506: after
Processing procedure compartment 507: automatic material transport unit 508: central control unit 5021: glue spreader 5031: litho machine 5041: developing machine
5071: the first transmission track, 5072: the second transmission track 5073: 5074: the four transmission track 5075: the five of third transmission track
5076: the six transmission track of transmission track, 5077: the seven transmission track 5078: aerial transport carriage 5079: storage unit under track
507A: storing goods shelf 507B: 50711,50712,50713: the first transmission track of transit point divide transmission track 50721,
50722,50723,50724: the second transmission tracks divide transmission track
Specific embodiment
Hereinafter, certain exemplary embodiments are simply just described.As one skilled in the art will recognize that
Like that, without departing from the spirit or scope of the present invention, described embodiment can be modified by various different modes.
Therefore, attached drawing and description are considered essentially illustrative rather than restrictive.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " go up ", " under ", " preceding ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " bottom ", " interior ", " outside ", "
Clockwise ", " counterclockwise " wait the orientation or positional relationship of instructions to be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second " are only
For descriptive purposes, it is not understood to indicate or imply relative importance or implicitly indicates the number of indicated technical characteristic
Amount." first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more spy
Sign.In the description of the present invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected: can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature its " upper " or it " under "
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first spy
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and it is " following " including fisrt feature right above second feature and oblique upper, or be merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides the examples of various specific techniques and material, but those of ordinary skill in the art can anticipate
Know the application of other techniques and/or the use of other materials.
Fig. 3 is the flow diagram of offline photolithography method provided by one embodiment of the present invention.As shown, the present embodiment
Photolithography method S100 in, in step S101, automatic material transport unit transmits wafer to multiple glue spreaders；In step S102,
Multiple glue spreaders are respectively to curing process after wafer progress gluing and gluing.In step S103, at least one litho machine is judged
Operating status, when litho machine is all in occupied state (i.e. in operation), then wafer waits litho machine to be disposed, meanwhile, after
It is continuous that the operating status of litho machine is judged, until at least one of litho machine in unoccupied state (i.e. idle or
Wait expect).In step S104, the wafer after solidifying after gluing is preferentially sent to by automatic material transport unit unappropriated
Any litho machine is exposed.Similarly, in step S105, judge the operating status of multiple developing machines, when multiple developing machines all
In occupied state (i.e. in operation), then wafer waits developing machine to be disposed, meanwhile, continue the operation to multiple developing machines
State judged, until at least one of multiple developing machines are in unoccupied state (i.e. idle or wait expect).In step
Wafer after exposure is preferentially sent to unappropriated any developing machine by automatic material transport unit and is exposed by S106
Solidify afterwards and develops.In step S107, the wafer after development is sent to time process apparatus, is temporarily stored by automatic material transport unit
Storage unit or storing goods shelf under the track of automatic material transport unit.
Fig. 4 is the flow diagram for the offline photolithography method that another embodiment of the present invention provides.As shown, this implementation
In the photolithography method S200 of example, in step S201, automatic material transport unit transmits wafer to multiple glue spreaders；In step
S202, multiple glue spreaders are respectively to curing process after wafer progress gluing and gluing.In step S203, central control unit is real-time
The operating status for detecting multiple litho machines, when multiple litho machines are all in occupied state (i.e. in operation), then wafer waits light
Quarter, machine was disposed, meanwhile, continue to be measured in real time the operating status of multiple litho machines, until in multiple litho machines extremely
Few one in unoccupied state (i.e. idle or wait expect).In step S204, central control unit controls automatic material conveying
Wafer after solidifying after gluing is preferentially sent to unappropriated any litho machine and is exposed by unit.Similarly, in step
S205, the operating status of the multiple developing machines of central control unit real-time detection, when multiple developing machines all in occupied state (i.e.
In operation), then wafer waits developing machine to be disposed, meanwhile, continue to be measured in real time the operating status of multiple developing machines,
Until at least one of multiple developing machines are in unoccupied state (i.e. idle or wait expect).In step S206, center control
Wafer after exposure is preferentially sent to unappropriated any developing machine and is exposed by unit control automatic material transport unit
Solidify afterwards and develops.In step S207, the wafer after development is sent to time process apparatus, is temporarily stored by automatic material transport unit
Storage unit or storing goods shelf under the track of automatic material transport unit.
Fig. 5 is the flow diagram for the offline photolithography method that another embodiment of the present invention provides.As shown, this implementation
In the photolithography method S300 of example, in step S301, when glue spreader, litho machine, developing machine are all set in same compartment and are worked as
Wafer to be processed all litho pattern having the same when, central control unit control automatic material transport unit first transmission
Track transmits wafer to multiple glue spreaders via the second transmission track.In step S302, multiple glue spreaders respectively carry out wafer
Solidify after gluing and gluing.In step S303, central control unit is measured in real time the operating status of multiple litho machines, when
Multiple litho machines are all in occupied state (i.e. in operation), then wafer waits litho machine to be disposed, meanwhile, center control is single
Member continues to implement real-time detection to the operating status of multiple litho machines, until at least one of multiple litho machines are not in occupied
With state (i.e. idle or wait expect).In step S304, the third that central control unit controls automatic material transport unit transmits rail
Wafer is preferentially sent to unappropriated any litho machine and is exposed by road.Similarly, in step S305, central control unit
The operating status of multiple developing machines is measured in real time, when multiple developing machines are all in occupied state (i.e. in operation), then
Wafer waits developing machine to be disposed, meanwhile, central control unit continues to implement inspection in real time to the operating status of multiple developing machines
It surveys, until at least one of multiple developing machines are in unoccupied state (i.e. idle or wait expect).In step S306, center control
Wafer is preferentially sent to unappropriated any developing machine by the 4th transmission track of unit control automatic material transport unit processed
Solidify after being exposed and develops.In step S307, central control unit controls the 5th transmission rail of automatic material transport unit
Wafer is sent to storage unit or storing goods shelf under time process apparatus, track via the first transmission track by road.
Fig. 6 is the flow diagram for the offline photolithography method that another embodiment of the present invention provides.As shown, this implementation
In the photolithography method S400 of example, in step S401, when glue spreader, litho machine, developing machine are all set in same compartment and are worked as
When wafer to be processed has different litho patterns, central control unit controls the first transmission rail of automatic material transport unit
Wafer is transmitted to multiple glue spreaders via the second transmission track in road.It is corresponding with the litho pattern of wafer more in step S402
A glue spreader is respectively to curing process after wafer progress gluing and gluing.In step S403, central control unit pair and wafer
The operating status of the corresponding litho machine of litho pattern is measured in real time, when litho machine corresponding with same litho pattern all
In occupied state (i.e. in operation), then the wafer with same litho pattern waits corresponding litho machine to be disposed, together
When, central control unit continues to implement real-time detection to the operating status of above-mentioned litho machine corresponding with same litho pattern,
Until at least one of described litho machine is in unoccupied state (i.e. idle or wait expect).In step S404, center control
Wafer is preferentially sent to corresponding with the litho pattern of wafer by the third transmission track of unit control automatic material transport unit
And unappropriated any litho machine be exposed.Similarly, in step S405, the photoetching of central control unit pair and wafer
The operating status of the corresponding developing machine of figure is measured in real time, when developing machine corresponding with same litho pattern all in
Occupied state (i.e. in operation), then wafer waits corresponding developing machine to be disposed, meanwhile, central control unit continues to upper
The operating status for stating developing machine corresponding with same litho pattern implements real-time detection, until at least one in the developing machine
It is a in unoccupied state (i.e. idle or wait expect).In step S406, central control unit controls automatic material transport unit
The 4th transmission track wafer is preferentially sent to corresponding with the litho pattern of wafer and unappropriated any developing machine
Solidify after being exposed and develops.In step S407, central control unit controls the 5th transmission rail of automatic material transport unit
Wafer is sent to storage unit or storing goods shelf under time process apparatus, track via the first transmission track by road.It needs exist for
It is bright, in multiple litho machines processing have same litho pattern wafer litho machine (i.e. with same litho pattern phase
Corresponding litho machine) it is at least one, processing has the developing machine of same litho pattern wafer (i.e. and together in multiple developing machines
A kind of corresponding developing machine of litho pattern) it is at least one.For example, wafer to be processed in system is respectively provided with litho pattern
P, Q, Z, litho machine corresponding with litho pattern P, Q, Z (are respectively arranged with photoetching corresponding with litho pattern P, Q, Z to cover
Film) it can be respectively provided with one or more, corresponding with litho pattern P, Q, Z developing machine (is respectively arranged with and litho pattern
P, Q, Z corresponding technological parameter X, Y, Z) one or more can be respectively provided with.Preferably, processing has same photoetching figure
The litho machine of the wafer of shape or the quantity of developing machine are greater than one, to prevent from handling the crystalline substance with this kind of litho pattern at work
Round litho machine breaks down or when PM, not can replacement equipment at any time, and influence production efficiency.Wherein, processing has same
The litho machine of wafer or the quantity of developing machine of kind litho pattern can be adaptively adjusted according to need of work, however it is not limited on
State quantity defined in example.
Fig. 7 is the flow diagram for the offline photolithography method that another embodiment of the present invention provides.As shown, this implementation
In the photolithography method S500 of example, in step S501, when glue spreader, litho machine, developing machine are respectively arranged in different compartments and are worked as
When wafer to be processed litho pattern having the same, central control unit controls the first transmission rail of automatic material transport unit
Wafer is transmitted to multiple glue spreaders via the second transmission track in road.In step S502, multiple glue spreaders respectively apply wafer
Solidify after glue and gluing.In step S503, central control unit is measured in real time the operating status of multiple litho machines, when more
A litho machine is all in occupied state (i.e. in operation), then wafer waits litho machine to be disposed, meanwhile, central control unit
Continue to implement real-time detection to the operating status of multiple litho machines, until at least one of multiple litho machines are in unoccupied
State (i.e. idle or wait expect).In step S504, central control unit controls the third transmission track of automatic material transport unit
Wafer unappropriated any litho machine is preferentially sent to via the first transmission track and the 4th transmission track to be exposed.?
Step S505, central control unit are measured in real time the operating status of multiple developing machines, when multiple developing machines are all in quilt
Occupied state (i.e. in operation), then wafer waits developing machine to be disposed, meanwhile, central control unit continues to multiple developing machines
Operating status implement real-time detection, until at least one of multiple developing machines in unoccupied state (i.e. idle or to
Material).In step S506, central control unit controls the 5th transmission track of automatic material transport unit via the first transmission track
Wafer is preferentially sent to after unappropriated any developing machine is exposed with the 6th transmission track and solidifies and develops.In step
The 7th transmission track of S507, central control unit control automatic material transport unit transmit wafer via the first transmission track
Storage unit or storing goods shelf under to time process apparatus, track.
Fig. 8 is the flow diagram for the offline photolithography method that another embodiment of the present invention provides.As shown, this implementation
In the photolithography method S600 of example, in step S601, when glue spreader, litho machine, developing machine are respectively arranged in different compartments and are worked as
When wafer to be processed has different litho patterns, central control unit controls the first transmission rail of automatic material transport unit
Wafer is transmitted to multiple glue spreaders via the second transmission track in road.It is corresponding with the litho pattern of wafer more in step S602
A glue spreader is respectively to curing process after wafer progress gluing and gluing.In step S603, central control unit pair and wafer
The operating status of the corresponding litho machine of litho pattern is measured in real time, when litho machine corresponding with same litho pattern all
In occupied state (i.e. in operation), then the wafer with same litho pattern waits corresponding litho machine to be disposed, together
When, central control unit continues to implement real-time detection to the operating status of above-mentioned litho machine corresponding with same litho pattern,
Until at least one of described litho machine is in unoccupied state (i.e. idle or wait expect).In step S604, center control
The third transmission track that unit controls automatic material transport unit is excellent by wafer via the first transmission track and the 4th transmission track
Corresponding with the litho pattern of wafer and unappropriated any litho machine is first sent to be exposed.Similarly, in step
The operating status of S605, central control unit pair developing machine corresponding with the litho pattern of wafer are measured in real time, when with
The corresponding developing machine of same litho pattern is all in occupied state (i.e. in operation), then wafer waits at corresponding developing machine
Reason finishes, meanwhile, central control unit continues to implement the operating status of above-mentioned developing machine corresponding with same litho pattern
Real-time detection, until at least one of described developing machine is in unoccupied state (i.e. idle or wait expect).In step S606,
Central control unit controls the 5th transmission track of automatic material transport unit via the first transmission track and the 6th transmission track
Wafer is preferentially sent to after corresponding with the litho pattern of wafer and unappropriated any developing machine is exposed and is solidified
And development.In step S607, central control unit controls the 7th transmission track of automatic material transport unit via the first transmission
Wafer is sent to storage unit or storing goods shelf under time process apparatus, track by track.With to example scheme shown in fig. 6
Illustrate consistent, it should be pointed out that there is the litho machine of the wafer of same litho pattern to be at least for processing in multiple litho machines
One, there is the developing machine of same litho pattern wafer to be at least one for processing in multiple developing machines.
Fig. 9 is the flow diagram for the offline photolithography method that another embodiment of the present invention provides.The present embodiment is to be based on
Fig. 5 or example scheme shown in fig. 6 and set up.As shown in figure 9, in the photolithography method S700 of the present embodiment, in step
S701, multiple glue spreaders are respectively to curing process after wafer progress gluing and gluing.In step S702, glue spreader is to solid after gluing
Wafer after change is detected, and be will test result and sent central control unit to.In step S703, central control unit is to more
The operating status of a litho machine is measured in real time, when multiple litho machines are all in occupied state (i.e. in operation), then wafer
Litho machine is waited to be disposed, meanwhile, central control unit continues to implement real-time detection to the operating status of multiple litho machines, directly
To at least one of multiple litho machines in unoccupied state (i.e. idle or wait expect).In step S704, center control is single
The testing result that member sends glue spreader judges, when first reference value of the testing result without departing from default, then in step
Wafer after applying adhesive curing is preferentially sent to unappropriated any by rapid S706, central control unit control third transmission track
Litho machine is exposed；When testing result exceeds the first reference value of default, then in step S705, central control unit root
According to testing result setting photolithographic parameters compensation, and the photolithographic parameters of compensation are sent to unappropriated any litho machine, in step
Rapid S706 ', central control unit control third transmission track and are sent to unappropriated by the wafer after applying adhesive curing and have
The litho machine of the photolithographic parameters of compensation is exposed.In step S707, litho machine detects the wafer after exposure, and will inspection
It surveys result and sends central control unit to.In step S708, central control unit carries out the operating status of multiple developing machines real
When detect, when multiple developing machines are all in occupied state (i.e. in operation), then wafer waits developing machine to be disposed, meanwhile,
Central control unit continues to implement real-time detection to the operating status of multiple developing machines, until at least one of multiple developing machines
In unoccupied state (i.e. idle or wait expect).In the testing result that step S709, central control unit send litho machine
Judged, when second a reference value of the testing result without departing from default, then in step S711, central control unit control the
Wafer after exposure is preferentially sent to after unappropriated any developing machine is exposed by four transmission tracks to be solidified and develops；When
Testing result exceeds the second a reference value of default, then in step S710, central control unit sets aobvious according to testing result
The compensation of shadow parameter, and the photographic parameter of compensation is sent to unappropriated any developing machine, in step S711 ', center control
Unit controls the 4th transmission track and the wafer after exposure is sent to unappropriated and the balanced photographic parameter of tool development
Machine solidifies after being exposed and development.In step S712, developing machine detects the wafer after development.
Figure 10 is the flow diagram for the offline photolithography method that another embodiment of the invention provides.The present embodiment is to be based on
Fig. 7 or example scheme shown in Fig. 8 and set up.As shown in Figure 10, in the photolithography method S800 of the present embodiment, in step
S801, multiple glue spreaders are respectively to curing process after wafer progress gluing and gluing.In step S802, glue spreader is to solid after gluing
Wafer after change is detected, and be will test result and sent central control unit to.In step S803, central control unit is to more
The operating status of a litho machine is measured in real time, when multiple litho machines are all in occupied state (i.e. in operation), then wafer
Litho machine is waited to be disposed, meanwhile, central control unit continues to implement real-time detection to the operating status of multiple litho machines, directly
Unoccupied state (i.e. idle or wait expect) is in at least one litho machine.In step S804, central control unit is to gluing
The testing result that machine is sent is judged, when first reference value of the testing result without departing from default, then in step S806, in
Entreat control unit control third transmission track via the first transmission track and the 4th transmission track by the wafer after solidifying after gluing
Unappropriated any litho machine is preferentially sent to be exposed；When first reference value of the testing result beyond default, then
In step S805, central control unit sets photolithographic parameters compensation according to testing result, and the photolithographic parameters of compensation are sent to
Unappropriated any litho machine, in step S806 ', central control unit controls third transmission track via the first transmission track
The wafer after solidifying after gluing is sent to unappropriated and the balanced photolithographic parameters of tool photoetching with the 4th transmission track
Machine is exposed.In step S807, litho machine detects the wafer after exposure, and will test result and send central control to
Unit.In step S808, central control unit is measured in real time the operating status of multiple developing machines, when multiple developing machines all
In occupied state (i.e. in operation), then wafer waits developing machine to be disposed, meanwhile, central control unit continues to multiple
The operating status of developing machine implements real-time detection, until at least one developing machine be in unoccupied state (i.e. idle or to
Material).In step S809, the testing result that central control unit sends litho machine judges, when testing result is without departing from being
Second a reference value of system setting, then in step S811, central control unit controls the 5th transmission track via the first transmission track
The wafer after exposure is preferentially sent to after unappropriated any developing machine is exposed with the 6th transmission track and solidifies and shows
Shadow；When testing result exceeds the second a reference value of default, then in step S810, central control unit is set according to testing result
Determine photographic parameter compensation, and the photographic parameter of compensation is sent to unappropriated any developing machine, in step S811 ', center
Control unit controls the 5th transmission track and is sent to the wafer after exposure not via the first transmission track and the 6th transmission track
Occupied and the balanced photographic parameter of tool developing machine solidifies after being exposed and development.
Figure 11 is the composition schematic diagram of offline lithography system provided by one embodiment of the present invention.As shown, this implementation
The lithography system 200 of example, comprising: multiple glue spreaders 2021, at least one litho machine 2022, multiple developing machines 2023, from animal
Expect transport unit 207 and central control unit 208.Wherein, multiple glue spreaders 2021, litho machine 2022 and multiple developing machines
2023 are all set in same lithographic process compartment 202.Glue spreader 2021, to form photoresist layer on wafer, and extremely
Less including 20212 (not shown) of solidified portion after 20211 (not shown) of gluing portion and gluing；Litho machine 2022, to on wafer
Photoresist layer be exposed, and include at least 20221 (not shown) of exposure portion；Developing machine 2023, to the light on polycrystalline circle
Photoresist layer develops, and includes at least 20232 (not shown) of 20231 (not shown) of solidified portion and development section after exposure.Automatically
Material transport unit 207 includes: the first transmission track 2071, for the wafer transmission between compartment；Second transmission track 2072,
Three transmission tracks 2073, the 4th transmission track 2074 and the 5th transmission track 2075, for the wafer in lithographic process compartment 202
Transmission；Aerial transport carriage 2076, can travel above-mentioned each transmission track, for loading wafer and the transmission crystalline substance on each transmission track
Circle；Storage unit 2077 and storing goods shelf 2078 under track, for temporarily being deposited in the case where lithographic equipment can not be handled in time
Store up wafer.The communication of central control unit 208 is connected to multiple 2021 (not shown) of glue spreader, 2022 (not shown) of litho machine, more
A 2023 (not shown) of developing machine and automatic material transport unit 207；Central control unit 208 controls third transmission track
2073 are preferentially sent to wafer unappropriated any litho machine 2022；Central control unit controls the 4th transmission track 2074
Wafer is preferentially sent to unappropriated any developing machine 2023.Specifically, wafer preceding processing procedure compartment 201 processing after,
Aerial transport carriage 2076 loads wafer and along the first transmission track 2071 via transit point 2079, the second transmission track 2072 automatically
Wafer is sent to multiple glue spreaders 2021；Through treated the wafer of glue spreader 2021, by aerial transport carriage 2076, through third
Transmission track 2073 is sent to litho machine 2022；Through treated the wafer of litho machine 2022, by aerial transport carriage 2076, through
Four transmission tracks 2074 are sent to multiple developing machines 2023；Developed machine 2023 treated wafer, passes through aerial transport carriage
2076, time processing procedure compartment 203, track are sent to through the 5th transmission track 2075, transit point 2079 and the first transmission track 2071
Lower storage unit 2077 or storing goods shelf 2078.
Figure 12 is the composition schematic diagram for the offline lithography system that another embodiment of the present invention provides.The present embodiment is to be based on
The scheme of embodiment shown in Figure 11 and set up.As shown in figure 12, the first transmission track 3071 includes multiple points of transmission tracks
30711~30713, the second transmission track 3072 includes multiple points of transmission tracks 30721~30724, and similarly, third transmits rail
Road 3073, the 4th transmission track 3074 and the 5th transmission track 3075 also respectively include multiple points of transmission track (not shown).Its
In, multiple points of transmission tracks of third transmission track 3073 are corresponding more with multiple points of transmission tracks for being sent to wafer
Any one in a litho machine, multiple points of transmission tracks of the 4th transmission track 3074 are for wafer to be sent to and multiple points
Any one in the corresponding multiple developing machines of rotary track.It is directly to transmit wafer that the purpose for dividing transmission track, which is arranged,
To equipment corresponding with transmission track is divided, shorten the transmitting range of wafer.
Figure 13 is the composition schematic diagram for the offline lithography system that another embodiment of the present invention provides.As shown, this reality
Apply the lithography system 400 of example, comprising: multiple glue spreaders 4021, at least one litho machine 4022, multiple developing machines 4023, automatic
Material transport unit 407 and central control unit 408.Wherein, multiple glue spreaders 4021, litho machine 4022 and multiple developing machines
4023 are located in different lithographic process compartments 402,403,404.Automatic material transport unit 407 includes: the first transmission
Track 4071, for the wafer transmission between compartment；Second transmission track 4072 and third transmission track 4073, are all set to gluing
In lithographic process compartment 402 where machine 4021, the second transmission track 4072 is for receiving from the first transmission track 4071
Wafer is simultaneously sent to multiple glue spreaders 4021 by the wafer of transmission, and third transmission track 4073 is used for will be through multiple glue spreaders 4021
Treated, and wafer is sent to the first transmission track 4071；4th transmission track 4074 and the 5th transmission track 4075, are all arranged
In in the lithographic process compartment 403 where litho machine 4031, the 4th transmission track 4074 is for receiving from the first transmission rail
Wafer is simultaneously sent to litho machine 4031 by wafer that road 4071 transmits, and the 5th transmission track 4075 is at will be through litho machine 4031
Wafer after reason is sent to the first transmission track 4071；6th transmission track 4076 and the 7th transmission track 4077, are all set to
In lithographic process compartment 404 where developing machine 4041, the 6th transmission track 4076 is for receiving from the first transmission track
Wafer is simultaneously sent to multiple developing machines 4041 by the wafer of 4071 transmission, and the 7th transmission track 4077 is used for will be through multiple developing machines
4041 treated that wafer is sent to the first transmission track 4071；Aerial transport carriage 4078, can travel above-mentioned each transmission track,
For loading wafer and transmitting wafer on each transmission track；Storage unit 4079 and storing goods shelf 407A under track are used for
Lithographic equipment temporarily stores wafer in the case where can not handling in time.The communication of central control unit 408 is connected to multiple glue spreaders
4021 (not shown), 4022 (not shown) of litho machine, 4023 (not shown) of multiple developing machines and automatic material transport unit
407；Central control unit 408 controls the 4th transmission track 4074 and wafer is preferentially sent to unappropriated any litho machine
4031；Central control unit controls the 6th transmission track 4076 and wafer is preferentially sent to unappropriated any developing machine
4041.Specifically, wafer after the processing of preceding processing procedure compartment 401, automatically grabs through aerial transport carriage 4078 and along the first transmission
Track 4071 is sent to multiple glue spreaders 4021 via transit point 407B, the second transmission track 4072, handles through glue spreader 4021
Wafer afterwards is sent to litho machine via third transmission track 4073, the first transmission track 4071, the 4th transmission track 4074
4031；Rail is transmitted via the 5th transmission track 4075, the first transmission track the 4071, the 6th through treated the wafer of litho machine 4031
Road 4076 is sent to multiple developing machines 4041, and developed machine 4041 treated wafer is via the 7th transmission track 4077, switching
Point 407B and the first transmission track 4071 are sent to storage unit 4079 or storing goods shelf 407A under time processing procedure compartment 405, track.
Figure 14 is the composition schematic diagram for the offline lithography system that another embodiment of the invention provides.The present embodiment is to be based on
The scheme of embodiment illustrated in fig. 13 and set up.As shown in figure 14, the first transmission track 5071 includes multiple points of transmission tracks
50711~50713, the second transmission track 5072 includes multiple points of transmission tracks 50721~50724, and similarly, third transmits rail
Road 5073, the 4th transmission track 5074, the 5th transmission track 5075, the 6th transmission track 5076 and the 7th transmission track 5077
It respectively include multiple points of transmission track (not shown).Wherein, multiple points of transmission tracks of the 4th transmission track 5074 are for will be brilliant
Circle be sent in multiple litho machines corresponding with multiple points of transmission tracks any one, the 6th transmission track 5076 it is multiple
Any one for dividing transmission track to be used to be sent to wafer in multiple developing machines corresponding with multiple points of rotary tracks.
More than, embodiments of the present invention are illustrated with reference to specific embodiment.However, the present invention is not limited to this
A little specific embodiments.That is, those skilled in the art can carry out appropriately designed change to these specific embodiments, as long as having this
The feature of invention should be all included within the scope of the present invention.For example, each element that above-mentioned each specific embodiment has and its matching
Set, material, condition, shape, size etc. are not limited to the content illustrated, can also be suitably changed.Moreover, each reality above-mentioned
As long as each element that the mode of applying has technically allows, can it combine, as long as the mode after these combinations is comprising of the invention
Feature should be also included within the scope of the present invention.
Claims (13)
1. a kind of offline photolithography method characterized by comprising
Automatic material transport unit transmits wafer to multiple glue spreaders；
Multiple glue spreaders solidify after carrying out gluing and gluing to the wafer respectively；
According to the occupied situation of at least one litho machine, after being solidified after gluing by the automatic material transport unit
The wafer is preferentially sent to unappropriated any litho machine and is exposed；
It is by the automatic material transport unit that the wafer after exposure is excellent according to the occupied situation of multiple developing machines
It is first sent to after unappropriated any developing machine is exposed and solidifies and develop；And
The wafer after development is sent to time process apparatus, is temporarily stored into the automatic material by the automatic material transport unit
Storage unit or storing goods shelf under the track of transport unit.
2. offline photolithography method as described in claim 1, which is characterized in that further include:
Through the glue spreader, treated before the wafer is transmitted to the litho machine, central control unit real-time detection is more
Whether a litho machine is occupied, and when at least one of multiple litho machines are unoccupied, the center control is single
Member controls the automatic material transport unit and the wafer is preferentially sent to the unappropriated litho machine；
Through the litho machine, treated before the wafer is transmitted to the developing machine, the central control unit is examined in real time
Whether occupied survey multiple developing machines, when at least one of multiple developing machines are unoccupied, the center control
Unit processed controls the automatic material transport unit and the wafer is preferentially sent to the unappropriated developing machine.
3. offline photolithography method as claimed in claim 2, which is characterized in that when the glue spreader, the litho machine and described
Developing machine is set in same compartment and when the wafer has identical litho pattern, and the central control unit controls institute
The first transmission track for stating automatic material transport unit transmits the wafer to multiple glue spreaders via the second transmission track；
Whether the multiple litho machines of central control unit real-time detection are occupied, and control the automatic material transport unit
The wafer is preferentially sent to unappropriated any litho machine by third transmission track；The central control unit is real-time
Detect whether multiple developing machines are occupied, and controls the 4th transmission track of the automatic material transport unit for the crystalline substance
Circle is preferentially sent to unappropriated any developing machine；The central control unit controls the automatic material transport unit
The 5th transmission track the wafer be sent under the secondary process apparatus, the track via first transmission track deposit
Storage unit or the storing goods shelf.
4. offline photolithography method as claimed in claim 2, which is characterized in that when the glue spreader, the litho machine and described
Developing machine is set in same compartment and when the wafer has different litho patterns, the central control unit control
First transmission track of the automatic material transport unit transmits the wafer to multiple gluings via the second transmission track
Machine；Whether the central control unit real-time detection litho machine corresponding with the litho pattern of the wafer is occupied
With, and the wafer is preferentially sent to the institute with the wafer by the third transmission track for controlling the automatic material transport unit
State that litho pattern is corresponding and unappropriated any litho machine；The central control unit real-time detection and the crystalline substance
Whether the corresponding developing machine of the round litho pattern is occupied, and controls the 4th of the automatic material transport unit the
The wafer is preferentially sent to corresponding and unappropriated any with the litho pattern of the wafer by transmission track
The developing machine；The central control unit controls the 5th transmission track of the automatic material transport unit via described first
The wafer is sent to storage unit or the storing goods shelf under the secondary process apparatus, the track by transmission track.
5. offline photolithography method as claimed in claim 2, which is characterized in that when the glue spreader, the litho machine and described
Developing machine is respectively arranged in different compartments and when the wafer has identical litho pattern, the central control unit control
The first transmission track for making the automatic material transport unit transmits the wafer to multiple paintings via the second transmission track
Glue machine；Whether the multiple litho machines of central control unit real-time detection are occupied, and control the automatic material conveying
The third transmission track of unit via first transmission track and the 4th transmission track by the wafer be preferentially sent to not by
Any litho machine occupied；Whether the multiple developing machines of central control unit real-time detection are occupied, and control
5th transmission track of the automatic material transport unit is via first transmission track and the 6th transmission track by the crystalline substance
Circle is preferentially sent to unappropriated any developing machine；The central control unit controls the automatic material transport unit
The 7th transmission track the wafer be sent under the secondary process apparatus, the track via first transmission track deposit
Storage unit or the storing goods shelf.
6. offline photolithography method as claimed in claim 2, which is characterized in that when the glue spreader, the litho machine and described
Developing machine is respectively arranged in different compartments and when the wafer has different litho patterns, the central control unit
It controls the first transmission track of the automatic material transport unit and transmits the wafer to multiple described via the second transmission track
Glue spreader；Whether the central control unit real-time detection litho machine corresponding with the litho pattern of the wafer
It is occupied, and the third transmission track for controlling the automatic material transport unit is transmitted via first transmission track and the 4th
The wafer is preferentially sent to corresponding with the litho pattern of the wafer and unappropriated any described by track
Litho machine；Whether the central control unit real-time detection developing machine corresponding with the litho pattern of the wafer
It is occupied, and the 5th transmission track for controlling the automatic material transport unit is transmitted via first transmission track and the 6th
The wafer is preferentially sent to corresponding with the litho pattern of the wafer and unappropriated any described by track
Developing machine；The central control unit controls the 7th transmission track of the automatic material transport unit via first transmission
The wafer is sent to storage unit or the storing goods shelf under the secondary process apparatus, the track by track.
7. such as the described in any item offline photolithography methods of claim 3 to 6, which is characterized in that the glue spreader is to solid after gluing
The wafer after change is detected, and be will test result and sent the central control unit to, and the central control unit is sentenced
Whether the testing result of breaking exceeds first reference value, when the testing result exceeds the first reference value, the center control
Unit processed sets photolithographic parameters compensation according to the testing result, and the photolithographic parameters of compensation are sent to the photoetching
Machine, the litho machine carry out photoetching to the wafer under the photolithographic parameters of compensation；The litho machine is to the institute after exposure
It states wafer to be detected, and will test result and send the central control unit to；The central control unit judges the inspection
Survey whether result exceeds the second a reference value, when the testing result exceeds second a reference value, the central control unit root
It is sent to the developing machine according to testing result setting photographic parameter compensation, and by the photographic parameter of compensation, it is described aobvious
Shadow machine develops to the wafer under the photographic parameter of compensation.
8. a kind of offline lithography system characterized by comprising
Multiple glue spreaders, to form photoresist layer on wafer；
At least one litho machine, to be exposed to the photoresist layer；
Multiple developing machines, to develop to the photoresist layer；
Automatic material transport unit, including the first transmission track, the second transmission track, third transmission track, the 4th transmission track,
Storage unit and storing goods shelf under 5th transmission track, track；The first transmission track transmission wafer is via described second
Transmission track is to multiple glue spreaders, and the third transmission track transmission is through the glue spreader treated the wafer to institute
State litho machine, the 4th transmission track transmission is through the litho machine treated the wafer to multiple developing machines, institute
It states the transmission of the 5th transmission track and is set through the developing machine treated the wafer via first transmission track to secondary processing procedure
Storage unit or the storing goods shelf under the track that is standby, being temporarily stored into the automatic material transport unit；And
Central control unit, communication are connected to the glue spreader, the litho machine and the developing machine；The central control unit
It controls the third transmission track and the wafer is preferentially sent to unappropriated any litho machine；The center control
Unit controls the 4th transmission track and the wafer is preferentially sent to unappropriated any developing machine；
Wherein, multiple glue spreaders, the litho machine and multiple developing machines are set in same compartment.
9. offline lithography system as claimed in claim 8, which is characterized in that each transmission track respectively includes multiple points of biographies
Send track, wherein the third transmission track it is multiple it is described divide transmission track for by the wafer be sent to it is multiple described
Divide any one in the corresponding multiple litho machines of transmission track；Multiple described point of transmission of 4th transmission track
Track be used to for the wafer being sent to it is multiple it is described divide it is any one in the corresponding multiple developing machines of rotary track
It is a.
10. offline lithography system as claimed in claim 9, which is characterized in that it further include aerial transport carriage, the aerial conveying
Vehicle it is current in each transmission track and its it is described divide on transmission track, the central control unit communication is connected to described aerial
Transport carriage simultaneously controls the aerial transport carriage transmission wafer.
11. a kind of offline lithography system characterized by comprising
Multiple glue spreaders, to form photoresist layer on wafer；
At least one litho machine, to be exposed to the photoresist layer；
Multiple developing machines, to develop to the photoresist layer；
Automatic material transport unit, including the first transmission track, the second transmission track, third transmission track, the 4th transmission track,
Storage unit and storing goods shelf under 5th transmission track, the 6th transmission track, the 7th transmission track, track；Described first passes
Send track transmission wafer via second transmission track to multiple glue spreaders, the third transmission track transmits described in warp
Glue spreader treated the wafer via first transmission track and the 4th transmission track to the litho machine, it is described
The transmission of 5th transmission track is passed through the litho machine treated the wafer via first transmission track and the described 6th
Send track to multiple developing machines, the 7th transmission track transmission is through the developing machine treated the wafer via institute
State the first transmission track to secondary process apparatus, be temporarily stored into storage unit or institute under the track of the automatic material transport unit
State storing goods shelf；And
Central control unit, communication are connected to the glue spreader, the litho machine and the developing machine；The central control unit
It controls the 4th transmission track and the wafer is preferentially sent to unappropriated any litho machine；The center control
Unit controls the 6th transmission track and the wafer is preferentially sent to unappropriated any developing machine；
Wherein, multiple glue spreaders, the litho machine and multiple developing machines are respectively arranged in different compartments.
12. offline lithography system as claimed in claim 11, which is characterized in that each transmission track respectively includes multiple points
Transmission track, wherein the multiple of the 4th transmission track described divide transmission track for the wafer to be sent to and multiple institutes
Any one in the corresponding multiple litho machines of point transmission track is stated, multiple described points of the 6th transmission track pass
Send track for by the wafer be sent to it is multiple it is described divide it is any in the corresponding multiple developing machines of rotary track
One.
13. offline lithography system as claimed in claim 12, which is characterized in that it further include aerial transport carriage, it is described to remove in the air
Send vehicle current each transmission track and its it is described divide on transmission track, the central control unit communication is connected to the sky
Middle transport carriage simultaneously controls the aerial transport carriage transmission wafer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710909075.5A CN109581816A (en) | 2017-09-29 | 2017-09-29 | A kind of offline photolithography method and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710909075.5A CN109581816A (en) | 2017-09-29 | 2017-09-29 | A kind of offline photolithography method and system |
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| CN201710909075.5A Pending CN109581816A (en) | 2017-09-29 | 2017-09-29 | A kind of offline photolithography method and system |
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Application publication date: 20190405 |